KR20150118025A - heating apparatus for substrate - Google Patents

heating apparatus for substrate Download PDF

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Publication number
KR20150118025A
KR20150118025A KR1020150041658A KR20150041658A KR20150118025A KR 20150118025 A KR20150118025 A KR 20150118025A KR 1020150041658 A KR1020150041658 A KR 1020150041658A KR 20150041658 A KR20150041658 A KR 20150041658A KR 20150118025 A KR20150118025 A KR 20150118025A
Authority
KR
South Korea
Prior art keywords
hot plate
peripheral
supporting
heating apparatus
support portion
Prior art date
Application number
KR1020150041658A
Other languages
Korean (ko)
Inventor
정동준
이새봄
Original Assignee
주식회사 좋은기술
이새봄
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 좋은기술, 이새봄 filed Critical 주식회사 좋은기술
Priority to PCT/KR2015/003131 priority Critical patent/WO2015156529A1/en
Publication of KR20150118025A publication Critical patent/KR20150118025A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Abstract

Disclosed is a substrate heating apparatus. The substrate heating apparatus comprises: a hot plate; a table for supporting the hot plate; a central support unit for supporting a center part of the hot plate to the table; and a peripheral support unit for supporting a peripheral area of the hot plate according to the table being in a state of allowing heat expansion in the plane direction of the hot plate.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heating apparatus such as a wafer used in a semiconductor manufacturing process and the like, and more particularly to a heating apparatus including a hot plate.

In a conventional substrate heating apparatus, the hot plate includes a plate-shaped heat source and upper and lower plates. The plate member is made of metal such as aluminum, and the upper and lower plates are joined together by a bolt or the like with a heat source interposed therebetween. The hot plate is fixed with respect to the fixed table, and a wafer lifting finger is located at the center thereof, and is fixed by the fixing structure at its periphery.

In this way, in the heating apparatus, if the hot plate is heated to a high temperature by an internal heat source in a state where the edge is fixed to the fixing table, thermal expansion occurs. At this time, because the edge of the hot plate is fixed firmly by the fixing structure, the thermal expansion occurs in the vertical direction perpendicular to the plane of the heating surface of the hot plate, and at this time, This happens. According to this, the upper surface of the hot plate, especially the heating surface, rises most at the central portion, and the heating surface is distorted in the form of a Gaussian curve.

As a result, during the wafer process, the wafer in a high temperature state lying on the distorted heating surface (upper surface) of the hot plate is distorted and deformed, and is thus defective. If the wafer is placed on a distorted hot plate, the temperature imbalance is intensified and causes a process failure.

In this case, prior to the present invention, the cause of the problem of the wafer generated in the heating apparatus could not be understood, and thus it was impossible to prepare an alternative to the problem.

The present invention provides a substrate heating apparatus capable of effectively suppressing distortion of a heating surface due to thermal expansion of a hot plate.

A substrate heating apparatus according to the present invention comprises:

A hot plate;

A table for supporting the hot plate; A center support for supporting a central portion of the hot plate to the table; And

And a peripheral supporting portion for supporting a peripheral portion of the hot plate with respect to the table in a state allowing thermal expansion in the plane direction of the hot plate.

According to an embodiment of the present invention, the central support portion may fix the center portion of the hot plate to the table.

According to an embodiment of the present invention, the central support portion may be provided so that a center portion of the hot plate can be moved at a predetermined distance with respect to the plane direction of the table.

According to an embodiment of the present invention, one end of the peripheral supporting portion is fixed to the edge of the hot plate, and the other end of the peripheral supporting portion is positionably movable relative to the table.

According to a specific embodiment of the present invention, a rotating member that rolls on the surface of the table may be provided at a lower end of the peripheral supporting portion.

According to a specific embodiment of the present invention, the rotating member may be a ball or a roller.

According to a specific embodiment of the present invention, a slide member may be provided at a lower end of the support column, and a sliding groove to which the sliding member is inserted may be provided on the table.

 According to an embodiment of the present invention, at least one of the center support portion and the peripheral support portion may have a length adjustable structure.

In the state that the center of the hot plate is fixed to the table, the edge can expand and contract in the plane direction in accordance with the thermal expansion. Therefore, it is possible to fundamentally prevent the thermal expansion of the flat surface in the same manner as in the structure in which the edge is fixed to the table and the curvature of the heating surface. Thus, during the wafer process, defects of the wafer due to the abnormal heating surface distortion of the hot plate are prevented.

1 is a schematic perspective view of a substrate heating apparatus according to an embodiment of the present invention.
2 is a side view of a substrate heating apparatus according to an embodiment of the present invention shown in FIG.
3 is a plan view of a substrate heating apparatus according to an embodiment of the present invention shown in FIG.
4 is a bottom view of the substrate heating apparatus according to an embodiment of the present invention shown in FIG.
FIGS. 5 and 6 are enlarged views of a portion "C" of FIG. 1 and a portion "D" of FIG. 2, respectively, as a lower end portion of a peripheral supporting portion applied to the substrate heating apparatus according to the embodiment of the present invention shown in FIG.
Fig. 7 shows the fixed state of the center support portion and the arrangement position of the peripheral support portion in a state where the hot plate HP is omitted in the substrate heating apparatus shown in Fig.
Fig. 8 is a side view of Fig. 7. Fig.
9 is a schematic perspective view of a substrate heating apparatus according to another embodiment of the present invention.
10 is an enlarged view of a portion A in Fig.
FIG. 11 is a fragmentary side view showing a state in which a hot plate, a table, and a peripheral support portion between the substrate and the substrate are engaged with each other in the substrate heating apparatus according to another embodiment of the present invention. FIG.

Hereinafter, a substrate heating apparatus according to embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Fig. 1 is a schematic perspective view of a substrate heating apparatus according to one embodiment of the present invention, Fig. 2 is a side view thereof, Fig. 3 is a plan view, and Fig. 4 is a bottom view thereof.

1 to 4, a hot plate (HP) is disposed between a heated top plate 10 and a bottom plate 30, and between a heated top plate 10 and a bottom plate 30, And a heater 20 interposed therebetween. The hot plate HP is fixed to the square table 40 by a support structure provided at the lower center and the periphery thereof. A power line 21 connected to the heater 20 and a sensor wire 22 for detecting temperature are exposed on the bottom surface of the hot plate HP.

A movable center support portion 50 for supporting or fixing the central portion of the hot plate HP to the table is provided at a lower portion of the hot plate HP as described above, A peripheral support 60 for supporting the lower edge is provided. The central support 50 fixes the central portion of the hot plate HP and at this time the central support 50 is moved in a planar direction of the hot plate HP Plane directional flow.

On the other hand, the peripheral supporting portion 60 supports the hot plate HP in a direction perpendicular to the upper surface of the table 40 while allowing the hot plate HP to thermally expand from its center by thermal expansion in the radial direction. According to an embodiment of the present invention, the upper end of the peripheral support portion 60 is fixed around the bottom surface of the hot plate HP, and the lower end portion thereof can slide or roll on the upper surface of the table 40.

Therefore, the hot plate HP is free from radial thermal expansion and contraction in the plane direction thereof in the state where the center is supported or fixed, thus preventing deformation in the direction perpendicular to the plane, that is, distortion of the upper surface of the hot plate. That is, the center support portion 50 firmly fixes or supports the hot plate HP to the table 40, and the peripheral support portion 60 of the hot plate HP is formed such that when the hot plate HP thermally expands, The other end (lower end) of the hot plate HP, in accordance with the expansion in the planar direction, rolls or slides relative to the table, that is, the upper surface of the table 40, This prevents the plane distortion of the hot plate (HP).

5 and 6 are enlarged views of a portion "C" in FIG. 1 and a portion "D" in FIG. 2, and the lower end of the peripheral supporting portion 60 is enlarged. As shown in the figure, a round or spherical protrusion 63 is provided at the lower end of the peripheral support portion 60. This is a ball sliding or rolling in contact with the upper surface of the table. In the case of a rolling ball, the ball 40 moves on the table 40 while rotating (rolling) at the lower end of the peripheral supporting portion 60. According to another embodiment of the present invention, the projecting portion 63 can be replaced with various components that can rotate, such as a roller, in addition to the ball.

As shown in FIGS. 1 to 6, the peripheral supporting portion 60 is composed of a plurality of parts, and has a structure capable of adjusting height or length according to an embodiment of the present invention. For example, the peripheral support portion 60 may include a column member 61 made of a heat insulating material or the like and a sleeve 62 threadedly engaged therewith, and the protrusion or the ball 63 may be provided at the lower end of the sleeve 62 have.

Fig. 7 shows a fixed state of the central support portion 50 and an arranged position of the peripheral support portion 60 with respect to the table 40 in a state in which the hot plate HP is omitted, and Fig. 8 is a side view thereof.

7 and 8, the table 40 has only the fixing portion 41 to which the central supporting portion 50 is fixed, and does not have a portion where the peripheral supporting portion 60 is fixed. That is, the table 40 fixes the hot plate HP via the central support portion 40 and the peripheral portion of the hot plate HP has a peripheral support portion 60 provided around the bottom surface of the hot plate HP, The protruding portion 63 is in contact with the protruding portion 63 of the protruding portion.

The central support portion 50 includes an upper fixing portion 52 fixed to the hot plate HP, a lower fixing portion 53 fixed to the fixing portion 41 of the table 40, And a columnar portion 51 made of a heat insulating material or the like provided between the lower fixing portions 53. [ At this time, the lower fixing portion 53 fixes the heat insulating column portion 51 so that the height of the front end portion of the upper fixing portion 52 can be adjusted.

Fig. 9 is a schematic perspective view of a substrate heating apparatus according to another embodiment of the present invention, and Fig. 10 is an enlarged view of a portion A in Fig.

As shown in FIG. 9, the hot plate HP is fixed on a rectangular table 40 by a columnar center support portion 50, and a peripheral support portion 60 is provided around the hot plate HP. At this time, the lower end of the peripheral supporting portion 60 is formed in the table 40 as shown in Fig. 10 in which the portion A of Fig. 9 is enlarged, unlike the above embodiment, And has a portion that fits in the guide groove 42. The guide groove 42 allows movement in one direction in a state where the sliding member 64 provided at the lower end of the support portion 60 is engaged. The moving direction of the sliding member 64 is the expansion and contraction direction of the hot plate HP in accordance with the thermal expansion, and thus the moving direction is directed to the radial direction toward the center support portion 50. On the sliding member 64, a guide bush 65 corresponding to the narrow neck portion 43 on the guide groove 42 may be provided.

11 is a partial excerpt side view showing a state in which the hot plate HP and the table 40 and the peripheral supporting portion 60 between them are engaged.

11, the upper end of the peripheral supporting portion 60 is fixed to the hot plate HP, and the lower end thereof is fitted into the guide groove 42 of the table 40. As shown in Fig. A sliding member 64 positioned in the guide groove 42 is positioned at the lower end of the peripheral support portion 60 and a sliding bush 65 corresponding to the neck portion 43 of the guide groove 42 is provided thereon .

A sleeve 62 having one or two length adjusting parts 62a and 62b is provided in the middle of the peripheral supporting part 60. [ These have the function of adjusting the overall length of the peripheral supporting portion 60. [

According to the substrate heating apparatus according to the present invention, which can be implemented as in the above-described embodiments, the thermal deformation of the hot plate thermally expanding to the internal heater can occur in a direction parallel to the surface. This allows the peripheral supporting portion of the hot plate to move in the plane direction of the hot plate, allowing thermal expansion in the plane direction of the hot plate, thereby preventing plane distortion of the hot plate.

In the conventional substrate heating apparatus, since the entire support structure of the hot plate is a completely fixed structure, the thermal expansion of the hot plate in the planar direction is suppressed, thereby distorting the plane of the hot plate and deforming the wafer. However, as described above, the present invention prevents the plane distortion of the hot plate, thereby preventing the wafer located on the hot plate from becoming defective.

While this invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Therefore, the true scope of protection of the present invention should be defined only by the appended claims.

Claims (7)

Hot plate;
A table for supporting the hot plate;
A center support for supporting a central portion of the hot plate to the table; And
And a peripheral supporting portion for supporting a peripheral portion of the hot plate with respect to the table in a state of allowing thermal expansion in a plane direction of the hot plate. The method according to claim 1,
Wherein the central support portion fixes the center portion of the hot plate to the table. The method according to claim 1,
Wherein the center support portion supports a central portion of the hot plate so that the central portion of the hot plate can move a predetermined distance with respect to the plane direction of the table. 4. The method according to any one of claims 1 to 3,
Wherein one end of the peripheral supporting portion is fixed to an edge of the hot plate, and the other end of the peripheral supporting portion is positionally movable relative to the table. 5. The method of claim 4,
And a rotating member which rolls on a surface of the table at a lower end of the peripheral supporting portion. 5. The method of claim 4,
Wherein a sliding member is provided at a lower end of the peripheral supporting portion, and a guide groove corresponding to the sliding member is provided on the table. 5. The method of claim 4,
Wherein at least one of the central support portion and the peripheral support portion has a length adjustable structure.
KR1020150041658A 2014-04-11 2015-03-25 heating apparatus for substrate KR20150118025A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/KR2015/003131 WO2015156529A1 (en) 2014-04-11 2015-03-31 Substrate heating device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20140043688 2014-04-11
KR1020140043688 2014-04-11

Publications (1)

Publication Number Publication Date
KR20150118025A true KR20150118025A (en) 2015-10-21

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KR1020150041658A KR20150118025A (en) 2014-04-11 2015-03-25 heating apparatus for substrate

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108346598A (en) * 2018-01-03 2018-07-31 佛山杰致信息科技有限公司 One kind being used for the cured heating device of Electronic Packaging
KR20220011897A (en) * 2020-07-22 2022-02-03 세메스 주식회사 Supporting apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108346598A (en) * 2018-01-03 2018-07-31 佛山杰致信息科技有限公司 One kind being used for the cured heating device of Electronic Packaging
KR20220011897A (en) * 2020-07-22 2022-02-03 세메스 주식회사 Supporting apparatus

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