KR20150109161A - Source Injection Apparatus and Thin Film Deposition Equipment Having the Same - Google Patents
Source Injection Apparatus and Thin Film Deposition Equipment Having the Same Download PDFInfo
- Publication number
- KR20150109161A KR20150109161A KR1020140032256A KR20140032256A KR20150109161A KR 20150109161 A KR20150109161 A KR 20150109161A KR 1020140032256 A KR1020140032256 A KR 1020140032256A KR 20140032256 A KR20140032256 A KR 20140032256A KR 20150109161 A KR20150109161 A KR 20150109161A
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- KR
- South Korea
- Prior art keywords
- source
- crucible
- distribution
- thin film
- neck
- Prior art date
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-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
The present invention relates to a device for spraying a source to deposit a thin film on a substrate and a thin film deposition apparatus including the same.
Generally, a process for manufacturing a semiconductor or a flat panel display (FPD) includes a thin film deposition process for depositing a thin film on a substrate. In the thin film deposition process, a chamber having an evaporation chamber capable of forming a vacuum atmosphere, a crucible assembly for evaporating a source (thin film material), evaporation from a crucible to a substrate carried in the evaporation chamber of the chamber, A source injector is used to provide the source to which the source is injected.
The crucible apparatus includes a crucible and a heating unit. The crucible contains a source therein, and the heating unit provides heat for evaporating the source contained in the crucible on the outer circumferential side of the crucible. The source evaporated by the action of the heating unit is supplied from the crucible to the source injector, then distributed by the source injector and injected toward the substrate side. The injected source is moved and deposited on the substrate to form a thin film.
The source supplied from the crucible to the source injector may not have uniform characteristics and thermal distribution depending on the source heating conditions of the crucible. Further, the source may be solidified during the process of being dispensed by the source injector or during the spraying process, and the characteristics may be changed from a uniform state to a non-uniform state.
In this case, a splash phenomenon occurs in which the source reaches the substrate, and the uniformity of the thin film is deteriorated. Accordingly, it is required to provide an improvement measure.
An embodiment of the present invention is directed to a source spray apparatus capable of spraying a source having a more uniform characteristic to a substrate and a thin film deposition apparatus including the source spray apparatus.
The problems to be solved by the present invention are not limited thereto, and other matters which are not mentioned can be understood by those skilled in the art from the following description.
According to an embodiment of the present invention, there is provided a vacuum cleaner comprising: a neck having an introduction flow path through which a vaporized source flows; A distribution pipe connected to the neck and having a plurality of distribution channels having a structure branched from the introduction channel and a source nozzle communicated with the distribution channel; And a distribution pipe heater composed of a plurality of linear heaters for heating a source moved along the distribution channel.
The plurality of linear heaters may be arranged on the outer circumference of the distribution pipe in the longitudinal direction of the distribution pipe and spaced apart from each other along the outer circumferential direction of the distribution pipe. At least one of the plurality of linear heaters may be disposed at a position adjacent to the source injection port.
A source spray apparatus according to an embodiment of the present invention includes a distribution pipe housing in which the distribution pipe is accommodated; And a reflection member disposed between the distribution pipe and the distribution pipe housing. The plurality of linear heaters may be positioned between the distribution pipe and the reflective member.
A guide portion may be provided between the introduction flow path and the plurality of distribution flow paths to naturally guide the flow of the source flowing out from the introduction flow path to each of the plurality of distribution flow paths. And the guide portion may be constituted by a guide channel which connects the introduction channel and the plurality of distribution channels respectively and is inclined from the introduction channel to the plurality of distribution channels.
The plurality of source injection openings may be provided in the distribution pipe at intervals along the longitudinal direction, and a nozzle may be coupled to each of the plurality of source injection openings.
The source spray apparatus according to the embodiment of the present invention may further include a neck heater composed of a plurality of linear heaters for heating a source moved along the introduction flow path.
According to an embodiment of the present invention, there is provided a vacuum cleaner comprising: a neck having an introduction flow path through which a vaporized source flows; A distribution pipe connected to the neck and having a plurality of distribution channels having a structure branched from the introduction channel and a source nozzle communicated with the distribution channel; A thin film evaporation source injection device including a neck heater composed of a plurality of linear heaters for heating a source moved along the introduction flow path may be provided.
According to an embodiment of the present invention, there is provided a plasma processing apparatus comprising: a deposition chamber having a gate; A source spray device accommodated in the deposition chamber and spraying a vaporized source onto a surface (deposition surface) of the substrate; A source chamber having a gate facing the gate of the deposition chamber; A crucible accommodated in the source chamber; And a crucible moving device for moving the crucible device so that the crucible device is detachable from the source spray device through the opposite gate, wherein the source spray device is connected to the crucible device, A neck having an introduction flow path through which the source flows; A distribution pipe connected to the neck and having a plurality of distribution channels having a structure branched from the introduction channel and a source nozzle communicated with the distribution channel; And a heater composed of a plurality of linear heaters for heating a source moved along at least one of the introduction channel and the distribution channel. Specifically, the crucible may be installed in the source chamber so as to be movable in a direction away from and approaching the opposing gate, and may be detachably attached to the source injector according to the direction of movement of the crucible moving device.
In the thin film deposition apparatus according to an embodiment of the present invention, the crucible includes: a crucible having a source storage chamber containing a source for thin film deposition and a source outlet through which the evaporated source is discharged from the source storage chamber; And a heating unit for providing heat to the crucible to evaporate the source. A radiating direction switching unit may be provided between the source housing chamber and the source outlet to guide the moving direction of the radiant heat emitted to the inside of the crucible to at least one of the source accommodation chamber side and the source outlet side.
Wherein the radiation direction switching means comprises: a first inclined portion whose periphery is reduced toward the source outlet side from the source accommodation chamber side and whose inside is directed toward the source accommodation chamber side; And a second inclined portion which is disposed so as to have the first inclined portion between the source accommodating chamber and the source accommodating chamber and whose periphery is reduced from the source exit side toward the source accommodating chamber side and whose inside is directed toward the source exit side and is connected to the first inclined portion can do.
The crucible may be provided with a plurality of ribs spaced along the circumferential direction in grooves between the first inclined portion and the second inclined portion on the outer circumference.
The crucible may have a heat transfer column protruding from the bottom of the source chamber to the center. The heat transfer column may have a cross-section of a radial structure and be formed to have a pointed end.
The thin film deposition apparatus according to an embodiment of the present invention may further include a buffer for absorbing an impact generated when the crucible is coupled to the source injection apparatus.
In the thin film deposition apparatus according to an embodiment of the present invention, the crucible moving apparatus includes an operating member connected to the crucible apparatus and moved together with the crucible apparatus; And driving means for moving the operation member. Further, the shock absorber may be disposed between the crucible apparatus and the operating member.
Wherein said buffering device comprises: a movable member movably installed in said crucible device in a direction away from and approaching said crucible device; And a shock absorbing member provided between the crucible device and the movable member.
According to an embodiment of the present invention, there is provided a plasma processing apparatus comprising: a deposition chamber having a gate; A source injector accommodated in the deposition chamber and injecting a vaporized source to the substrate; A source chamber having a gate facing the gate of the deposition chamber; A crucible accommodated in the source chamber; And a crucible moving device for moving the crucible device so that the crucible device is detachable from the source spray device through the opposite gate, wherein the source spray device is connected to the crucible device, A neck having an introduction flow path through which the source flows; A distribution pipe connected to the neck and having a plurality of distribution channels having a structure branched from the introduction channel and a source nozzle communicated with the distribution channel; And a heater composed of a plurality of linear heaters for heating a source moved along at least one of the introduction channel and the distribution channel, wherein the crucible device comprises: a source chamber in which a source for thin film deposition is contained; A crucible having a source outlet through which a vaporized source is emitted; And a heating unit for supplying heat to the crucible to evaporate the source, and a heating unit for heating the source in the crucible, and a heating unit for heating the source in the crucible, Wherein a neck portion of the necked structure is provided between the source chamber and the outlet of the source, and the periphery of the neck portion is reduced from the source chamber to the source outlet side, And the radiation direction switching means may be provided with the thin film deposition equipment including the inclined portion.
According to an embodiment of the present invention, there is provided a plasma processing apparatus comprising: a deposition chamber having a gate; A source injector accommodated in the deposition chamber and injecting a vaporized source to the substrate; A source chamber having a gate facing the gate of the deposition chamber; A crucible accommodated in the source chamber; And a crucible moving device for moving the crucible device so that the crucible device is detachable from the source spray device through the opposite gate, wherein the source spray device is connected to the crucible device, A neck having an introduction flow path through which the source flows; A distribution pipe connected to the neck and having a plurality of distribution channels having a structure branched from the introduction channel and a source nozzle communicated with the distribution channel; And a heater composed of a plurality of linear heaters for heating a source moved along at least one of the introduction channel and the distribution channel, wherein the crucible device comprises: a source chamber in which a source for thin film deposition is contained; A crucible having a source outlet through which a vaporized source is emitted; And a heating unit for supplying heat to the crucible to evaporate the source, wherein the crucible is provided with a thin film deposition apparatus having an electric heater protruding from a bottom of the source chamber to a central portion to transfer heat to the source .
Means for solving the problems will be more specifically and clarified through the embodiments, drawings, and the like described below. In addition, various solution means other than the above-mentioned solution means may be further proposed.
According to the embodiment of the present invention, since the source supplied to the source spray device is continuously heated by the neck heater and the distribution pipe heater in the course of spraying, the source can have more uniform characteristics and thermal distribution, Thus, the uniformity of the thin film can be improved.
1 and 2 are cross-sectional views illustrating a thin film deposition apparatus according to an embodiment of the present invention.
Fig. 3 is a cross-sectional view taken along line AA of Fig. 1, which shows a source injector.
4 is an enlarged view of a portion B in Fig.
5 is a perspective view showing part C of Fig.
Fig. 6 is a cross-sectional view showing a modified example of the source injection device shown in Figs. 1 and 2. Fig.
Fig. 7 is a sectional view showing the crucible shown in Figs. 1 and 2. Fig.
8 is a cross-sectional view showing the crucible shown in Fig.
9 is a sectional view taken along line DD of Fig.
10 is a perspective view showing the radiant heat transfer member shown in Figs. 7 and 8. Fig.
Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. For the sake of convenience, it is to be understood that the present invention is not limited to the above embodiments, and various changes and modifications may be made without departing from the scope of the present invention. Further, the terms used to describe the embodiments of the present invention are mainly defined in consideration of the functions of the present invention, and thus may be changed depending on the intentions and customs of the user and the operator. Therefore, the terminology should be interpreted based on the contents of the present specification throughout.
Embodiments of the present invention can be mainly used for manufacturing semiconductors, flat panel displays (FPD), solar cells, and the like. In particular, as a kind of flat panel display, it can be more suitable for manufacturing organic light emitting diodes (OLED), which are attracting attention as a next generation display due to high quality and simple manufacturing process.
1 and 2 are cross-sectional views illustrating a thin film deposition apparatus according to an embodiment of the present invention.
1 and 2, a thin film deposition apparatus according to an embodiment of the present invention includes a
The
When the
The
When the source is exhausted, the
FIG. 3 is a cross-sectional view taken along the line AA in FIG. 1, FIG. 4 is an enlarged view of a portion B in FIG. 1, FIG. 5 is a perspective view showing a portion C in FIG. .
3 to 5, the
The connecting
The
The
The
The branching direction of the
A flow of the source flowing out through the
A plurality of
A
The
For reference, the linear heater constituting the
The plurality of linear heaters constituting the
The plurality of linear heaters constituting the
3, at least one of the plurality of linear heaters constituting the
5, one or both ends of the plurality of linear heaters constituting the
The heat from the
The vaporized source from the
Therefore, even if the source supplied from the
6 is a cross-sectional view showing a modified example of the
According to the guide portion 515-1 as described above, the modification of Fig. 6 is constituted by a flow path which is inclined as a whole between the
Fig. 7 is a sectional view showing the
7, the
The
The
The
Although not specifically shown, the cooling
8 is a cross-sectional view showing the
The
8, the
The
The
The crucible
A radiating
9 is a sectional view taken along the line A-A in Fig. 8 (a cross-sectional view).
8 and 9, the crucible
The
When the wall and bottom of the crucible
It is preferable that the
According to such a crucible
10 is a perspective view showing the radiant
Referring to Figs. 8 and 10, the radiant
The neck portion has a first
According to the neck portion, the radiant heat-
The radiant heat emitted from the first
Since the inside of the second
The first
The radiation
The plurality of
According to the plurality of
1, 2 and 7, the
The operating
7, a
The
The operating member (71) is coupled to the movable member (81). The
The embodiment of the present invention as described has a
Therefore, it is possible to prevent a relatively large amount of the source from remaining in the center portion side of the
Since the source supplied from the
On the other hand, unlike the above description, the
A
While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention.
For example, in the above, the radiation direction switching means 614 is constituted by the first
The
5: substrate 10: deposition chamber
20: source chamber 30: gate valve
40: Vacuum device 50: Source injection device
51: connection neck 52: minute piping
53: neck housing 54: distribution pipe housing
55: Neck heater 56: Distribution pipe heater
57:
60: Crucible device 61: Crucible
61A: Crucible
61C: Radiation heat transfer member 62: Heating unit
63: crucible housing 64: cooling unit
70: Crucible moving device 511:
515: Guide part 521: Distribution channel
525: Source nozzle
Claims (11)
A distribution pipe connected to the neck and having a plurality of distribution channels having a structure branched from the introduction channel and a source nozzle communicated with the distribution channel;
And a plurality of linear heaters for heating a source moved along the distribution channel.
Thin film evaporation source injection device.
Wherein the plurality of linear heaters are arranged on the outer circumference of the distribution pipe in the longitudinal direction of the distribution pipe and spaced apart along the circumferential direction of the distribution pipe,
Thin film evaporation source injection device.
Wherein at least one of the plurality of linear heaters is disposed at a position close to the source-
Thin film evaporation source injection device.
The source spray device includes a distribution pipe housing in which the distribution pipe is accommodated; And a reflecting member disposed between the distribution pipe and the distribution pipe housing,
Wherein the plurality of linear heaters are disposed between the distribution pipe and the reflective member,
Thin film evaporation source injection device.
And a guide portion for guiding a flow of a source flowing out from the introduction flow path to the plurality of distribution flow paths is provided between the introduction flow path and the plurality of distribution flow paths,
Thin film evaporation source injection device.
Wherein the guide portion comprises a guide path connecting the introduction path and the plurality of distribution paths respectively and inclined from the introduction path to the plurality of distribution paths,
Thin film evaporation source injection device.
Wherein the plurality of source injection openings are provided in the distributing pipe at intervals along the longitudinal direction,
Thin film evaporation source injection device.
Further comprising a neck heater composed of a plurality of linear heaters for heating a source moved along said introduction flow path,
Thin film evaporation source injection device.
A distribution pipe connected to the neck and having a plurality of distribution channels having a structure branched from the introduction channel and a source nozzle communicated with the distribution channel;
And a neck heater configured by a plurality of linear heaters for heating a source moved along the introduction flow path.
Thin film evaporation source injection device.
Wherein the source-
A neck coupled to the crucible apparatus and having an introduction flow path through which the evaporated source from the crucible apparatus flows;
A distribution pipe connected to the neck and having a plurality of distribution channels having a structure branched from the introduction channel and a source nozzle communicated with the distribution channel;
And a heater composed of a plurality of linear heaters for heating a source moved along at least one of the introduction channel and the distribution channel,
Thin Film Deposition Equipment.
Further comprising a shock absorber for absorbing an impact generated when the crucible is coupled to the source sprayer,
Thin Film Deposition Equipment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020140032256A KR20150109161A (en) | 2014-03-19 | 2014-03-19 | Source Injection Apparatus and Thin Film Deposition Equipment Having the Same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020140032256A KR20150109161A (en) | 2014-03-19 | 2014-03-19 | Source Injection Apparatus and Thin Film Deposition Equipment Having the Same |
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KR20150109161A true KR20150109161A (en) | 2015-10-01 |
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KR1020140032256A KR20150109161A (en) | 2014-03-19 | 2014-03-19 | Source Injection Apparatus and Thin Film Deposition Equipment Having the Same |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202015009545U1 (en) | 2014-10-31 | 2018-03-19 | Lg Electronics Inc. | Backlight unit and display device with backlight unit |
-
2014
- 2014-03-19 KR KR1020140032256A patent/KR20150109161A/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202015009545U1 (en) | 2014-10-31 | 2018-03-19 | Lg Electronics Inc. | Backlight unit and display device with backlight unit |
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