KR20150106352A - Adhesive film - Google Patents

Abstract

The present invention relates to an adhesive film capable of improving magnetic permeability, reducing a loss of magnetic forces, and forming an insulation layer with excellent reliability on an insulating property. The adhesive film has a supporter and a resin composition layer installed on the supporter. The resin composition layer contains components of (A) a thermosetting resin, (B) a magnetic filler, and (C) an inorganic filler. A content of the component (B) is 10 volume% or more, based on 100 volume% of a nonvolatile component in a resin composition forming the resin composition layer. Moreover, a value obtained by dividing the content of the component (C) by the content of the component (B) is 0.3-3.0.

Description

Adhesive film {ADHESIVE FILM}

The present invention relates to an adhesive film, a wiring board and a manufacturing method of the wiring board.

A power inductor, an inductor for a high frequency band, and an inductor element called a common mode choke coil are mounted on many information terminals such as a cellular phone and a smart phone. At present, as a high frequency band inductor element having a frequency of 1 GHz or more, in particular 1 GHz to 3 GHz, of an operation signal, for example, there are a winding structure in which a coil is wound around a core member, a lamination structure in which a coil conductor is laminated on a core member, There is known a film structure in which a wiring layer constituting a part of a coil is formed in each of the layered insulating layers and an insulating layer in which wiring layers are formed is laminated so that the respective wiring layers are electrically connected to each other to form a coil within the thickness of the insulating portion.

In the inductor element for a high frequency band, a structure in which an air core coil, that is, a hollow core or a non-magnetic body is filled is generally adopted because a high Q value is required as a characteristic. However, since the inductor element for a high frequency band having such a structure is non-magnetic in the deep portion and it is impossible to increase the permeability (relative permeability) of the deep portion, if the inductor element is to be made more compact, There is a drawback that the inductance (L value) is lowered.

Patent Document 1 discloses that the use of a thermosetting magnetic slurry containing (A) an alicyclic olefin polymer having a carboxyl group, (B) a thermosetting agent, (C) a magnetic substance and (D) And an electric insulating layer excellent in characteristics such as electric insulation property, high frequency property and magnetic permeability can be formed.

International Publication No. 2004/29153

In recent years, in response to demands for further thinning and miniaturization of information terminals, thinner and smaller inductors for high frequency bands are also required.

It is necessary to reduce the number of turns of the coil and reduce the cross-sectional area of the wiring constituting the coil in order to make the inductor element for the high frequency band thinner and smaller. In order to reduce the number of turns of the coil and reduce the cross-sectional area of the wiring constituting the coil, the inductor element for the high frequency band of the film structure is advantageous. However, in the inductor element for a high frequency band of a film structure, the inductance is lowered simply by reducing the number of turns of the coil and reducing the cross-sectional area of the wiring constituting the coil. In the inductor device for a high frequency band of a film structure, if the magnetic permeability (μ ') of the insulating layer can be increased, the L value and the Q value of the inductor device for the high frequency band can be improved. Therefore, there is a demand for a material capable of increasing the magnetic permeability of the insulating layer and reducing the magnetic loss (magnetic loss).

However, when the inductor element of the film structure is formed by using the thermosetting magnetic slurry according to Patent Document 1, there is a possibility that the magnetic loss (μ '') becomes large particularly in the range of the frequency of 1 GHz to 3 GHz. Therefore, it is difficult to say that the material disclosed in Patent Document 1 is useful as a material for an insulating layer (insulating portion) of an inductor element for a high-frequency band.

DISCLOSURE OF THE INVENTION As a result of intensive investigations on a resin composition containing a magnetic filler in order to meet such a demand, the present inventors have found that when a resin composition contains a magnetic filler and an insulating layer is formed using such a resin composition, The magnetic loss is increased in the range of 1 GHz to 3 GHz, the Q value is lowered, and the reliability of the insulation is lowered.

The present invention has been made in view of the above problems. The present invention relates to an adhesive film using a resin composition capable of improving magnetic permeability in a frequency range of 1 GHz to 3 GHz and capable of reducing magnetic loss and capable of forming an insulating layer excellent in insulation reliability, And a method for manufacturing a wiring board and a wiring board using a film.

The present invention provides the following [1] to [20].

[1] An adhesive film having a support and a resin composition layer provided on the support,

Wherein the resin composition layer contains a thermosetting resin of component (A), a magnetic filler of component (B), and an inorganic filler of component (C)

Wherein the content of the component (B) is 10% by volume or more and the content of the component (C) is the content of the component (B) when the nonvolatile component in the resin composition constituting the resin composition layer is 100% And the value divided by the range of 0.3 to 3.0.

[2] The adhesive film according to [1], wherein the component (A) is an epoxy resin, and the resin composition further contains an epoxy resin curing agent selected from a phenol series curing agent and a naphthol series curing agent.

[3] The adhesive film according to [2], wherein the epoxy resin curing agent is selected from a triazine skeleton-containing cresol-based curing agent and a triazine skeleton-containing phenol-based curing agent.

[4] The adhesive film according to any one of [1] to [3], wherein the resin composition further contains a thermoplastic resin.

[5] The resin composition according to any one of [1] to [4], wherein the content of the component (B) is 10% by volume to 40% by volume and the content of the component (C) is 10% The adhesive film described in one.

[6] The adhesive film according to any one of [1] to [5], wherein the total content of the components (B) and (C) in the resin composition is 20% by volume to 75% by volume.

[7] The adhesive film according to any one of [1] to [6], wherein the content of the component (B) in the resin composition is 10% by volume to 25% by volume.

(8) The resin composition according to any one of (1) to (7), wherein the content of the component (B) is 20 to 25% by volume, the content of the component (C) is 10 to 25% by volume, Is 30 to 50% by volume based on the total amount of the thermoplastic resin (A) and the thermoplastic resin (B).

[9] The adhesive film according to any one of [1] to [8], wherein the average particle diameter of the component (B) in the resin composition is 0.3 μm to 10 μm.

[10] The adhesive film according to any one of [1] to [9], wherein the component (C) has an average particle diameter of 0.01 탆 to 5 탆.

[11] The adhesive film according to any one of [1] to [10], wherein an average particle diameter of the component (B) is larger than an average particle diameter of the component (C).

[12] The adhesive film according to any one of [1] to [11], wherein the component (C) is silica.

[13] The adhesive film according to any one of [1] to [12], wherein the component (C) is silica treated with a surface treatment agent.

[14] The adhesive film according to [13], wherein the surface treating agent is an aminosilane-based coupling agent.

[15] An adhesive according to any one of [1] to [14], wherein the magnetic loss when the frequency is 1 GHz to 3 GHz is 1.1 or more and the frequency is 1 GHz to 3 GHz is 0.5 or less, film.

[16] The adhesive according to any one of [1] to [15], wherein the magnetic loss when the frequency is 1 GHz to 3 GHz is 1.2 or more and the frequency is 1 GHz to 3 GHz is 0.3 or less, film.

[17] The adhesive film according to any one of [1] to [16], which is used for forming an insulating layer of a wiring board having an inductor element.

[18] An adhesive film according to any one of [1] to [16], which has an insulating layer which is a cured product of a resin composition layer and a coil-shaped conductive structure in which at least a part of the insulating layer is embedded,

And an inductor element extending in the thickness direction of the insulating layer and constituted by a part of the insulating layer surrounded by the coil-shaped electrically conductive structure.

[19] A wiring board according to [18], wherein the frequency at which the inductor element functions is 1 GHz or more.

[20] An insulating member comprising a first insulating layer and a second insulating layer, and a coil-shaped electroconductive structure in which at least a part of the insulating portion is embedded. The coil-shaped electroconductive structure is constituted by a part of the insulating portion The method comprising the steps of:

A step of preparing an adhesive film according to any one of [1] to [16] and a core substrate provided with a first wiring layer;

A step of laminating the resin composition layer of the adhesive film on the core substrate,

A step of thermally curing the resin composition layer to form a first insulating layer,

Forming a via hole in the first insulating layer;

A step of roughening the first insulating layer on which the via hole is formed,

A step of forming a second wiring layer in the first insulating layer and forming wiring in a via hole for electrically connecting the first wiring layer and the second wiring layer;

Laminating the adhesive film to the first insulating layer in which the second wiring layer and the wiring in the via hole are formed, and thermally curing the second insulating layer to form the second insulating layer;

A coil-shaped conductive structure including a portion of the first wiring layer, a portion of the second wiring layer, and the wiring in the via-hole; and a portion of the insulation portion extending in the thickness direction of the insulation portion and surrounded by the coil- The step of forming the inductor element including

Wherein the method comprises the steps of:

The use of the adhesive film of the present invention can provide an insulating layer that can improve the magnetic permeability particularly in the range of frequencies from 1 GHz to 3 GHz and can reduce the magnetic loss and is excellent in insulation reliability, A wiring board on which a high-performance inductor element for high frequency band including such an insulating layer is formed can be provided by a simple process.

[Figure 1] Figure 1 is a schematic plan view of the wiring board from one side of the thickness direction thereof.
[Figure 2] Figure 2 is a schematic diagram showing a cut end face of the wiring cut in the position shown by a chain line II-II (一點鎖線).
[ Fig. 3 ] Fig. 3 is a schematic plan view for explaining a configuration of a first wiring layer in a wiring board.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, each figure is merely a schematic representation of the shape, size, and arrangement of components so that the invention can be understood. The present invention is not limited by the following description, and each component can be appropriately changed within a range not departing from the gist of the present invention. In the drawings used in the following description, the same constituent elements are denoted by the same reference numerals, and redundant explanations may be omitted. Further, the configuration according to the embodiment of the present invention is not limited to being manufactured or used by the arrangement of the example shown in the drawings.

First, the resin composition used in the adhesive film of this embodiment will be described.

The resin composition is a resin composition containing a thermosetting resin (A), a magnetic filler (B), and an inorganic filler (C) as the component (A). When the nonvolatile component in the resin composition is 100 volume% ) Is 10 volume% or more, and the value obtained by dividing the content of the component (C) by the content of the component (B) is in the range of 0.3 to 3.0.

Hereinafter, the components that the resin composition can contain will be described in detail.

(Component (A))

The resin composition contains a thermosetting resin as the component (A). An example of the thermosetting resin is an epoxy resin.

- Epoxy resin -

Examples of the epoxy resin include bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, bisphenol AF epoxy resin, dicyclopentadiene epoxy resin, trisphenol epoxy resin, naphthol novolac epoxy resin , Phenol novolak type epoxy resin, tert-butyl-catechol type epoxy resin, naphthalene type epoxy resin, naphthol type epoxy resin, anthracene type epoxy resin, glycidylamine type epoxy resin, glycidyl ester type epoxy resin, An epoxy resin having a butadiene structure, an alicyclic epoxy resin, a heterocyclic epoxy resin, a spirocyclic epoxy resin, a cyclohexanedimethanol type epoxy resin, a naphthylene ether Type epoxy resin and trimethylol-type epoxy resin. The epoxy resin may be used singly or in combination of two or more kinds.

The epoxy resin preferably contains an epoxy resin having two or more epoxy groups in one molecule. When the nonvolatile component of the epoxy resin is 100 mass%, it is preferable that at least 50 mass% or more is an epoxy resin having two or more epoxy groups in one molecule. Among them, epoxy resins having two or more epoxy groups in one molecule and having a liquid phase at 20 占 폚 (hereinafter referred to as " liquid epoxy resin ") and three or more epoxy groups in one molecule, (Hereinafter referred to as " solid epoxy resin "). By using the epoxy resin in combination with the liquid epoxy resin and the solid epoxy resin, excellent flexibility can be given.

Examples of the liquid epoxy resin include a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a phenol novolak type epoxy resin, a bifunctional aliphatic epoxy resin and a naphthalene type epoxy resin. Examples of the liquid epoxy resin include a bisphenol A type epoxy resin, Bisphenol F type epoxy resin, or naphthalene type epoxy resin are preferable. Specific examples of the liquid epoxy resin include "HP4032", "HP4032D", "HP4032SS" (naphthalene type epoxy resin), "jER828EL" and "jER1007" (bisphenol A type epoxy resin manufactured by Mitsubishi Kagaku KK) (Phenol novolak type epoxy resin), "ZX1059" (manufactured by Shinnitetsu Kagaku Co., Ltd.) (bisphenol A type epoxy resin and bisphenol F type epoxy resin), "jER807" (bisphenol F type epoxy resin), "jER152" , And "YL7410" (bifunctional aliphatic epoxy resin). These may be used singly or in combination of two or more.

Examples of the solid epoxy resin include crystalline bifunctional epoxy resins, tetrafunctional naphthalene type epoxy resins, cresol novolak type epoxy resins, dicyclopentadiene type epoxy resins, trisphenol epoxy resins, naphthol novolak type epoxy resins, Biphenyl type epoxy resins, and naphthylene ether type epoxy resins. Specific examples of the solid epoxy resin include "HP-4700", "HP-4710" (tetrafunctional naphthalene type epoxy resin), "N-690" (cresol novolak type epoxy resin) EXA7311-G3 ", " HP-6000 " (naphthylene ether-type epoxy resin), Nippon Kosei Kogyo Co., NC3000H "," NC3000L "," NC3100 "(biphenyl type epoxy resin (trade name) manufactured by KAYAKU CO., LTD.)," EPPN-502H "(trisphenol epoxy resin)," NC7000L "(naphthol novolac epoxy resin) ESN475 "(naphthol novolak type epoxy resin)," ESN485 "(naphthol novolak type epoxy resin)," YX4000H "and" YL6121 "manufactured by Mitsubishi Kagaku Co., Phenyl type epoxy resin), and "YX4000HK" (biquilene type epoxy resin) which is a crystalline bifunctional epoxy resin.

When a liquid epoxy resin and a solid epoxy resin are used in combination as the epoxy resin, the amount ratio (liquid epoxy resin: solid epoxy resin) thereof is preferably in the range of 1: 0.1 to 1: 4 by mass ratio . By setting the ratio of the liquid epoxy resin and the solid epoxy resin within this range, it is possible to obtain a cured body having sufficient breaking strength and the like. (Liquid epoxy resin: solid epoxy resin) in a ratio of 1: 0.3 to 1: 3.5, more preferably in a range of 1: 0.6 to 1: 3.5, in terms of the weight ratio of the liquid epoxy resin and the solid epoxy resin, 3, more preferably in the range of 1: 0.8 to 1: 2.5.

The content of the epoxy resin in the resin composition in terms of the non-volatile component is preferably 20 vol.% To 60 vol.%, More preferably 22 vol.% To 55 vol.%, Further preferably 24 vol.% To 53 vol.% , And particularly preferably from 26 vol% to 49 vol%.

The epoxy equivalent of the epoxy resin is preferably in the range of 50 to 3,000, more preferably 80 to 2,000, and still more preferably 110 to 1,000. By setting this range, a cured product having sufficient crosslinking density can be obtained. The epoxy equivalent can be measured according to a method standardized as JIS K7236. Here, the epoxy equivalent is the mass of the epoxy resin containing one equivalent of an epoxy group.

(Component (B))

- Magnetic filler -

The resin composition contains a magnetic filler as the component (B). The material of the magnetic filler that can be used is not particularly limited and includes, for example, pure iron powder, Fe-Si alloy powder, Fe-Si-Al alloy powder, Fe-Ni alloy powder, Fe- Fe-Ni-Co alloy powder, Fe-Ni-Mo alloy powder, Fe-Ni-Co alloy powder, Fe-Ni-Co alloy powder, Fe- Based ferrite, Mn-Zn ferrite, Mn-Mg ferrite, Fe-based ferrite, Fe-based ferrite, Ba ferrite, Ba-Ni ferrite, Ba-Ni ferrite, Ba-Co ferrite, Ba-Zn ferrite, Ba-Zn ferrite, Hexagonal ferrite such as Ba-Ni-Co ferrite, and garnet type ferrite such as Y ferrite.

As the magnetic filler, commercially available magnetic fillers can be used. Specific examples of commercially available magnetic fillers that can be used include "PST-S" manufactured by Sanyo Electric Industries, Ltd., "AW2-08PF20F", "AW2-08PF10F", "AW2-08PF3F" LD-M "," LD-MH "," KNI-106 ", and" KNI-4MoPF20F "manufactured by JFE Kikuchi K.K.," Fe-3.5Si-4.5CrPF20F " KNS-415 "," BSF-547 ", and" BSF-029 "manufactured by TODA KOGYO Co., Ltd.," KNI-106GSM "," KNI-106GS "," KNI- BSN-714, BSN-828, S-1281, S-1641, S-1651, S-1470, S-1511, S-2430 manufactured by Nippon Denshi Kogyo Kogyo Co., Ltd., JR09P2 manufactured by Nippon Kogaku Kogyo Co., Ltd., Nanotek manufactured by CIK Nanotech Co., Ltd., JEMK-S manufactured by Kinesei Tech Co., Ltd., JEMK-H manufactured by ALDRICH Yttrium iron oxide. The magnetic filler may be used singly or in combination of two or more kinds.

The average particle diameter of the magnetic filler is 0.3 mu m to 10 mu m or less, preferably 0.3 mu m to 7 mu m, and more preferably 0.5 mu m to 5 mu m.

The content of the magnetic filler is preferably 10% by volume or more, more preferably 10% by volume to 40% by volume, more preferably 10% by volume to 35% by volume, based on 100% by volume of the nonvolatile component in the resin composition , Still more preferably from 15 volume% to 30 volume%, still more preferably from 15 volume% to 25 volume%.

(Component (C))

- inorganic filler -

The resin composition contains an inorganic filler as the component (C). The inorganic filler is usually used to reduce the thermal expansion rate when the resin composition is cured, to suppress the occurrence of defects such as cracks and circuit deformation due to the difference in thermal expansion rate, and to suppress excessive decrease in melt viscosity. In the case of using a magnetic filler, it is customary not to coexist with inorganic fillers from the viewpoint of giving priority to improvement of properties such as magnetic permeability. However, for the purpose of preventing aggregation of the magnetic filler in the resin composition or the cured product (insulating layer) formed by curing such a resin composition, and for improving the reliability of insulation when the resin composition is a cured product, Can be used.

Examples of the inorganic filler include inorganic fillers such as silica, alumina, barium sulfate, talc, clay, mica powder, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum borate, strontium titanate, Calcium, magnesium titanate, bismuth titanate, titanium oxide, barium zirconate, and calcium zirconate. Of these, silica such as amorphous silica, fused silica, crystalline silica, synthetic silica, hollow silica and the like is particularly suitable. As the silica, spherical silica is preferable. The inorganic fillers may be used singly or in combination of two or more kinds. Examples of commercially available spherical (fused) silica include SO-C1, SO-C2, SO-C4, SO-C5 and SO- .

When the average particle diameter of the inorganic filler is 6 m or more, the flowability and moldability of the resin composition deteriorate, and the magnetic permeability and the magnetic loss at the high frequency and the initial resistance value may be deteriorated when the cured product is used. From the viewpoint of enhancing the fluidity of the composition, it is preferably in the range of 0.01 탆 to 5 탆, more preferably in the range of 0.05 탆 to 5 탆, more preferably in the range of 0.05 탆 to 2.5 탆, more preferably in the range of 0.1 탆 to 1.5 탆 Still more preferably in the range of 0.3 탆 to 1.0 탆.

The average particle diameter of the inorganic filler can be measured by a laser diffraction / scattering method based on the Mie scattering theory. Specifically, the particle size distribution of the inorganic filler can be measured by using a laser diffraction scattering particle size distribution measuring apparatus, and the median diameter of the inorganic filler is determined as the average particle diameter. In this case, a measurement sample in which an inorganic filler is dispersed in water by ultrasonic waves can be preferably used. As the laser diffraction scattering type particle size distribution measuring device, "LA-500" manufactured by Horiba Seisakusho Co., Ltd. and the like can be used.

From the viewpoint of enhancing moisture resistance and dispersibility, the inorganic filler is preferably selected from the group consisting of amino silane coupling agents, epoxy silane coupling agents, mercaptosilane coupling agents, silane coupling agents, organosilazane compounds and titanate coupling agents It is preferable that the surface treatment agent is treated with at least one kind of surface treatment agent. As commercially available products of such a surface treatment agent, for example, KBM403 (3-glycidoxypropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., KBM803 (3-mercaptopropyltrimethoxysilane manufactured by Shin- (3-aminopropyltriethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., KBE903 (3-aminopropyltriethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., KBM573 Trimethoxysilane), "SZ-31" (hexamethyldisilazane) manufactured by Shin-Etsu Chemical Co., Ltd., and the like.

The inorganic filler surface-treated with the surface treatment agent can be subjected to cleaning treatment with a solvent (for example, methyl ethyl ketone (MEK)), and then the amount of carbon per unit surface area of the inorganic filler can be measured. Specifically, a sufficient amount of MEK as a solvent is added to the inorganic filler surface-treated with a surface treatment agent and ultrasonically cleaned at 25 占 폚 for 5 minutes. Subsequently, the supernatant liquid is removed and the nonvolatile component (solid content) is dried, and then the amount of carbon per unit surface area of the inorganic filler can be measured using a carbon analyzer. As the carbon analyzer, "EMIA-320V" manufactured by Horiba Seisakusho Co., Ltd. and the like can be used.

The amount of carbon per unit surface area of the inorganic filler is preferably 0.02 mg / m 2 or more, more preferably 0.1 mg / m 2 or more, and further preferably 0.2 mg / m 2 or more from the viewpoint of improving the dispersibility of the inorganic filler. On the other hand, from the viewpoint of suppressing an increase in melt viscosity, the amount of carbon per unit surface area of the inorganic filler is preferably 1 mg / m 2 or less, more preferably 0.8 mg / m 2 or less, and further preferably 0.5 mg / m 2 or less.

The content of the inorganic filler (component (C)) / the content of the inorganic filler (hereinafter referred to as " inorganic filler (component (C)) / Magnetic filler (component (B)) ") is in the range of 0.3 to 3.0. The inorganic filler / magnetic filler is preferably in the range of 0.4 to 2.7, more preferably in the range of 0.5 to 2.5.

The total content of the component (B) as the magnetic filler and the component (C) as the inorganic filler in the resin composition is preferably 20% by volume to 75% by volume, more preferably 20% by volume to 65% , More preferably from 60 vol% to 60 vol%, still more preferably from 24 vol% to 57 vol%.

The content of the component (B) is 20% by volume to 25% by volume, the content of the component (C) is 10% by volume to 25% by volume, and the content of the component By volume, and the total content of the components (B) and (C) is preferably 30% by volume to 50% by volume.

The average particle diameter of the magnetic filler is preferably larger than the average particle diameter of the inorganic filler.

When the ratio of the content of the magnetic filler and the content of the inorganic filler is as described above and the average particle diameter of the magnetic filler is larger than the average particle diameter of the inorganic filler, the inorganic filler can be effectively arranged so as to surround the periphery of the magnetic filler particles. This prevents the magnetic filler particles from aggregating and coming into contact with each other, and allows the magnetic filler particles to be separated from each other, so that the magnetic filler can realize good insulation while increasing the magnetic permeability.

As a result, when the resin composition of the present embodiment is used as a cured product, the magnetic permeability at a frequency of 1 GHz to 3 GHz can be made to be 1.1 or more and 1.2 or more, and when the frequency is 1 GHz to 3 GHz, The loss can be 0.5 or less, and the loss can be made 0.3 or less.

(Other components)

The resin composition may contain a curing agent for curing the resin composition as other components and, if necessary, a component intended to adjust the properties of the resin composition or its cured body. Examples of the other components include thermoplastic resins, curing accelerators, flame retardants, and organic fillers. Organic metal compounds such as organic copper compounds, organic zinc compounds and organic cobalt compounds, and thickeners, defoaming agents, leveling agents, And a resin additive such as a coloring agent. Hereinafter, the curing agent, the thermoplastic resin, the curing accelerator, the flame retardant, and the organic filler will be described.

- hardener -

The curing agent is not particularly limited as long as it has a function of curing the component (A) which is a thermosetting resin. When the component (A) is an epoxy resin, the curing agent is an epoxy resin curing agent. Examples of the epoxy resin curing agent include phenol-based curing agents, naphthol-based curing agents, active ester-based curing agents, benzoxazine-based curing agents, and cyanate ester-based curing agents. The epoxy resin curing agent may be used singly or in combination of two or more kinds. From the viewpoint of reliability of insulation and heat resistance, the curing agent is preferably a phenol-based curing agent and a naphthol-based curing agent, more preferably a phenol-based curing agent.

Examples of the phenol-based curing agent and naphthol-based curing agent include phenol-based curing agents having a novolac structure, naphthol-based curing agents having a novolac structure, nitrogen-containing phenol-based curing agents, cresol-based curing agents containing a triazine skeleton, Based curing agent. From the viewpoints of the flame retardancy and the reactivity, as the phenol-based curing agent and the naphthol-based curing agent, a triazine skeleton-containing cresol-based curing agent and a triazine skeleton-containing phenol-based curing agent are preferable, and a triazine skeleton-containing phenol-based curing agent is preferable.

Specific examples of the phenol-based curing agent and naphthol-based curing agent include "MEH-7700", "MEH-7810", "MEH-7851" manufactured by Meiwa Chemical Industries, Ltd., "NHN "SN170", "SN180", "SN190", "SN475", "SN485", "SN495", "SN375", "SN395", "DIC", "CBN", "GPH", manufactured by Totogasayi LA7052 ", " LA7054 ", " LA3018 ", and the like.

The active ester-based curing agent is not particularly limited, but generally includes ester groups having high reactivity such as phenol esters, thiophenol esters, N-hydroxyamine esters, and esters of heterocyclic hydroxy compounds, Are preferably used. As the active ester-based curing agent, a curing agent obtained by a condensation reaction of a carboxylic acid compound and / or a thiocarboxylic acid compound with a hydroxy compound and / or a thiol compound is preferable. From the viewpoint of heat resistance improvement, an active ester type curing agent obtained from a carboxylic acid compound and a hydroxy compound is preferable, and an active ester type curing agent obtained from a carboxylic acid compound and a phenol compound and / or a naphthol compound is more preferable. Examples of the carboxylic acid compound include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid and pyromellitic acid. Examples of the phenol compound or naphthol compound include hydroquinone, resorcin, bisphenol A, bisphenol F, bisphenol S, phenolphthalein, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o- Cresol, catechol, alpha -naphthol, beta -naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, Trihydroxybenzophenone, tetrahydroxybenzophenone, fluoroglucine, benzene triol, dicyclopentadiene-type diphenol compounds, and phenol novolak.

Specific examples of the active ester curing agent include active ester compounds containing a dicyclopentadiene type diphenol condensation structure, active ester compounds containing a naphthalene structure, active ester compounds containing an acetylated phenol novolac, And an active ester compound containing a benzoyl moiety of boric acid.

EXB9451 "," EXB9460 "," EXB9460S "," HPC-8000 "(trade name, manufactured by DIC Corporation) as the active ester compound containing a dicyclopentadiene type diphenol condensation structure as a commercially available product of the active ester type curing agent, -65T "," EXB9416-70BK "manufactured by DIC Corporation as an active ester compound containing a naphthalene structure," DC808 "manufactured by Mitsubishi Chemical Corporation as an active ester compound containing acetolide of phenol novolak, And YLH1026 manufactured by Mitsubishi Kagaku Co., Ltd. as an active ester compound containing a benzoyl moiety of boric acid.

Specific examples of the benzoxazine-based curing agent include, for example, "HFB2006M" manufactured by Showa Kogyo Co., Ltd., "P-d" and "F-a" manufactured by Shikoku Kasei Corporation.

Examples of the cyanate ester curing agent include bisphenol A dicyanate, polyphenol cyanate (oligo (3-methylene-1,5-phenylene cyanate), 4,4'-methylene bis (2,6- Dimethylphenyl cyanate), 4,4'-ethylidenediphenyl dicyanate, hexafluorobisphenol A dicyanate, 2,2-bis (4-cyanate) phenylpropane, 1,1- Cyanate phenylmethane), bis (4-cyanate-3,5-dimethylphenyl) methane, 1,3-bis Bifunctional cyanate resins derived from phenolic novolacs and cresol novolacs such as bis (4-cyanophenyl) thioether and bis (4-cyanate phenyl) ether, and polyfunctional cyanate resins derived from these cyanate resins, Specific examples of the cyanate ester-based curing agent include " PT30 " and " PT60 " (all manufactured by Lone Japan Co., Phenol novolak type polyfunctional cyanate ester resin), "BA 230" (a prepolymer obtained by trimerization of a part or all of bisphenol A dicyanate to form a trimer), and the like.

The ratio of the amount of the epoxy resin to the epoxy resin curing agent is preferably in the range of 1: 0.2 to 1: 2, more preferably in the range of 1: 0.2 to 1: 2, 0.3 to 1: 1.5, more preferably in the range of 1: 0.4 to 1: 1. Here, the reactive group of the epoxy resin curing agent is an active hydroxyl group, an active ester group or the like, and it differs depending on the kind of the curing agent. The total number of epoxy groups in the epoxy resin refers to a value obtained by dividing the mass of the non-volatile component of each epoxy resin by the epoxy equivalent, in terms of all epoxy resins. The total number of reactors of the epoxy resin curing agent means, The value obtained by dividing the mass of the nonvolatile component of the curing agent by the equivalent of the reactor is the sum of all the epoxy resin curing agents. By setting the ratio of the epoxy resin and the epoxy resin curing agent within this range, the heat resistance when the cured product is formed is further improved.

Regarding the content of the epoxy resin curing agent, the ratio of the total number of epoxy groups of the epoxy resin to the total number of reactors of the epoxy resin curing agent is preferably in the range of 1: 0.2 to 1: 2, more preferably 1: 0.3 To 1: 1.5, and more preferably in the range of 1: 0.4 to 1: 1.

The resin composition preferably contains a mixture of a liquid epoxy resin and a solid epoxy resin (the mass ratio of the liquid epoxy resin to the solid epoxy resin is preferably in the range of 1: 0.1 to 1: 4, more preferably in the range of 1: 0.3 to 1: 3.5 More preferably in the range of 1: 0.6 to 1: 3, and particularly preferably in the range of 1: 0.8 to 1: 2.5) as the epoxy resin curing agent, a phenol type curing agent, a naphthol type curing agent, An ester-based curing agent and a cyanate ester-based curing agent (preferably at least one selected from the group consisting of a phenol-based curing agent and a naphthol-based curing agent, more preferably at least one selected from the group consisting of a phenol novolak containing a triazine skeleton, Resin, naphthol-based curing agent, and more preferably at least one selected from the group consisting of phenol novolak containing triazine skeleton The epoxy resin curing agent containing a) preferably contains, respectively.

- Thermoplastic resin -

Examples of the thermoplastic resin include a phenoxy resin, an acrylic resin, a polyvinyl acetal resin, a polyimide resin, a polyamideimide resin, a polyether sulfone resin, and a polysulfone resin. The thermoplastic resin may be used singly or in combination of two or more.

The weight average molecular weight of the thermoplastic resin in terms of polystyrene is preferably in the range of 8000 to 70000, more preferably in the range of 10,000 to 60,000, and still more preferably in the range of 20,000 to 60,000. The weight average molecular weight of the thermoplastic resin in terms of polystyrene is measured by a gel permeation chromatography (GPC) method. Specifically, the weight average molecular weight of the thermoplastic resin in terms of polystyrene was measured using "LC-9A / RID-6A" manufactured by Shimadzu Corporation as a measuring device and "Shodex K- 800P / K-804L / K-804L ", chloroform or the like is used as the mobile phase, the column temperature is measured at 40 ° C, and calibration curve of standard polystyrene is used.

Examples of the phenoxy resin include bisphenol A skeleton, bisphenol F skeleton, bisphenol S skeleton, bisphenol acetophenone skeleton, novolac skeleton, biphenyl skeleton, fluorene skeleton, dicyclopentadiene skeleton, norbornene skeleton, A phenoxy resin having at least one skeleton selected from the group consisting of a skeleton, an anthracene skeleton, an adamantane skeleton, a terpene skeleton, and a trimethyl cyclohexane skeleton. The terminal of the phenoxy resin may be any functional group such as a phenolic hydroxyl group or an epoxy group. The phenoxy resin may be used singly or in combination of two or more. Specific examples of the phenoxy resin include "1256" and "4250" (both phenol resins containing a bisphenol A skeleton), "YX8100" (phenoxy resin containing a bisphenol S skeleton), and "YX6954" (Phenoxy resin containing bisphenol acetophenone skeleton), and "FX280" and "FX293" manufactured by Totogassei Co., Ltd., "YL7553", "YL6794", "YL7213" manufactured by Mitsubishi Kagaku Co., , &Quot; YL7290 ", and " YL7482 ".

The acrylic resin is preferably a functional group-containing acrylic resin and more preferably an epoxy group-containing acrylic resin having a glass transition temperature of 25 占 폚 or less from the viewpoint of further lowering the coefficient of thermal expansion and the modulus of elasticity.

The number average molecular weight (Mn) of the functional group-containing acrylic resin is preferably 10,000 to 1,000,000, more preferably 30,000 to 900,000.

The functional group equivalent of the functional group-containing acrylic resin is preferably 1000 to 50000, more preferably 2500 to 30000.

The epoxy group-containing acrylic resin having a glass transition temperature of 25 占 폚 or less is preferably an epoxy group-containing acrylic ester copolymer resin having a glass transition temperature of 25 占 폚 or less. Specific examples thereof include "SG-80H" Acrylic acid ester copolymer resin (number average molecular weight (Mn): 350000 g / mol, epoxy value: 0.07 eq / kg, glass transition temperature: 11 占 폚); "SG-P3" (epoxy group- (Number average molecular weight (Mn): 850000 g / mol, epoxy value: 0.21 eq / kg, glass transition temperature: 12 占 폚).

Specific examples of the polyvinyl acetal resin include DENKA BUTYRAL 4000-2, 5000-A, 6000-C, 6000-EP manufactured by Denki Kagaku Kogyo Co., KS series, BL series, BM series, such as S-LEC BH series, BX series, and KS-1 manufactured by K.K.

Specific examples of the polyimide resin include "Rika Coat SN20" and "Rika Coat PN20" manufactured by Shin-Nihon Rika K.K. Specific examples of the polyimide resin include a linear polyimide obtained by reacting a bifunctional hydroxyl-terminated polybutadiene, a diisocyanate compound and a tetrabasic acid anhydride (a polyimide described in JP-A-2006-37083 Resins), polysiloxane skeleton-containing polyimides (polyimide resins described in JP-A-2002-12667 and JP-A-2000-319386), and the like.

Specific examples of the polyamide-imide resin include "Viromax HR11NN" and "Viromax HR16NN" manufactured by Toyobo Co., Ltd. Specific examples of the polyamideimide resin include modified polyamideimides such as "KS9100" and "KS9300" manufactured by Hitachi Chemical Co., Ltd., which is a polysiloxane skeleton-containing polyamideimide.

Specific examples of the polyether sulfone resin include "PES 5003P" manufactured by Sumitomo Chemical Co., Ltd., and the like.

Specific examples of the polysulfone resin include "P1700" and "P3500" manufactured by Solvay Advanced Polymers Co., Ltd.

The content of the thermoplastic resin in the resin composition is preferably 0.1% by mass to 20% by mass. When the content of the thermoplastic resin is within this range, the viscosity of the resin composition becomes appropriate, and a resin composition layer having uniform thickness and bulk property can be formed.

- Curing accelerator -

Examples of the curing accelerator include phosphorus hardening accelerator, amine hardening accelerator, imidazole hardening accelerator, guanidine hardening accelerator and the like.

Examples of phosphorus hardening accelerators include triphenylphosphine, phosphonium borate compounds, tetraphenylphosphonium tetraphenylborate, n-butylphosphonium tetraphenylborate, tetrabutylphosphonium decanoate, (4-methylphenyl) triphenyl Phosphonium thiocyanate, tetraphenylphosphonium thiocyanate, butyltriphenylphosphonium thiocyanate, and the like.

Examples of the amine curing accelerator include trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine (DMAP), benzyldimethylamine, 2,4,6-tris (dimethylaminomethyl) 1,8-diazabicyclo (5,4,0) undecene, and the like.

Examples of the imidazole-based curing accelerator include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, Imidazole (2E4MZ), 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl- Imidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6- [ Methylimidazolyl- (1 ')] - ethyl-s-triazine, 2,4-diamino-6- [2'- undecylimidazolyl- (1')] (2 ') - ethyl-s-triazine, 2,4-diamino-6- [2'-methyl Imidazolyl- (1 ')] - ethyl-s-triazine, isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo [1,2 -a] benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline and 2-phenylimidazoline, and imidazole compounds such as imidazole compounds and epoxy resins And the duct body.

Examples of the guanidine curing accelerator include dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1- (o-tolyl) guanidine, dimethylguanidine, , Trimethylguanidine, tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo [4.4.0] deca-5-ene, 7-methyl-1,5,7-triazabicyclo [ 1-n-butylbiguanide, 1-n-octadecylbiguanide, 1,1-dimethylbiguanide, 1, Cyclohexylbiguanide, 1-allylbiguanide, 1-phenylbiguanide, 1- (o-tolyl) biguanide, and the like.

The curing accelerator may be used singly or in combination of two or more kinds. The content of the curing accelerator in the resin composition is preferably within a range of 0.05 mass% to 3 mass% when the total amount of the non-volatile component of the epoxy resin and the epoxy resin curing agent is 100 mass%.

- Flame retardant -

Examples of the flame retardant include an organic phosphorus flame retardant, an organic nitrogen-containing phosphorus compound, a nitrogen compound, a silicon-based flame retardant, a metal hydroxide, and the like. An example of the flame retardant which can be used is "HCA-HQ-HST" manufactured by Sanko Corporation. The flame retardant may be used alone, or two or more flame retardants may be used in combination. The content of the flame retardant in the resin composition layer is not particularly limited, but is preferably in the range of 0.5 to 10 mass%, more preferably in the range of 1 to 9 mass%, more preferably 1.5 to 8 mass% Is more preferable.

- Organic filler -

The resin composition preferably contains an organic filler from the viewpoint of improving the adhesion with the layer formed by the plating process. Examples of the organic filler include rubber particles. As the rubber particles as the organic filler, for example, rubber particles which are not dissolved in an organic solvent to be described later and which are not compatible with epoxy resins, curing agents and thermoplastic resins described later are used. These rubber particles are generally prepared by increasing the molecular weight of the components of the rubber particles to such an extent that they are insoluble in an organic solvent or a resin, thereby forming granules.

Examples of the rubber particles as the organic filler include core-shell type rubber particles, crosslinked acrylonitrile butadiene rubber particles, crosslinked styrene butadiene rubber particles, acrylic rubber particles and the like. The core-shell-type rubber particle is a rubber particle having a core layer and a shell layer, for example, a two-layer structure in which the shell layer of the outer layer is composed of a glassy polymer and the core layer of the inner layer is composed of a rubber- A three-layered rubber particle composed of a glassy polymer, an intermediate layer composed of a rubbery polymer and a core layer of an inner layer composed of a glassy polymer, and the like. The glass-like polymer layer is composed of, for example, a methyl methacrylate polymer and the like, and the rubber-like polymer layer is composed of, for example, a butyl acrylate polymer (butyl rubber). An example of the rubber particles that can be used is "STAPHYLLOID AC3816N" manufactured by GANZ CO., LTD. The rubber particles may be used singly or in combination of two or more kinds.

The average particle diameter of the rubber particles as the organic filler is preferably in the range of 0.005 탆 to 1 탆, more preferably in the range of 0.2 탆 to 0.6 탆. The average particle diameter of the rubber particles can be measured using a dynamic light scattering method. For example, rubber particles are uniformly dispersed in an appropriate organic solvent by ultrasonic waves or the like, and the particle size distribution of the rubber particles is measured on the basis of mass, using a dense particle diameter analyzer (FPAR-1000 manufactured by Otsuka Denshi Co., Ltd.) , And measuring the median diameter of the particles as the average particle diameter.

The resin composition of the present embodiment is excellent in fluidity at the time of forming the insulating layer, and is excellent in the sealing property of the wiring layer when the insulating layer (cured product) is used. Further, when the insulating layer formed by using the resin composition of the present invention is formed, the magnetic permeability can be suppressed while improving the magnetic permeability in the range of the high frequency band (gigahertz band), particularly 1 GHz to 3 GHz, where the frequency is 1 GHz or more .

The insulating layer formed using the resin composition of the present embodiment has excellent insulation reliability. The reliability of the insulating property can be evaluated with the lowering of the insulation resistance value after 100 hours of storage in the atmosphere of 130 DEG C and 85% relative humidity (after 100 hours of HAST) as an index. Specifically, when the insulation resistance value of the insulating layer after 100 hours of HAST exceeds 1.0 占⁰⁶ ?, It can be evaluated that the insulation reliability is excellent.

Therefore, the resin composition of the present embodiment can be suitably used as an insulating layer material of a wiring board having an inductor element of a so-called film structure in which a coil is formed within an insulating layer (an insulating portion in which a plurality of insulating layers are laminated) .

Next, an adhesive film using the resin composition of the present embodiment and a manufacturing process thereof will be described.

(Adhesive film)

The adhesive film includes an organic support and a resin composition layer provided on one main surface of the organic support.

(Organic support)

Examples of the material of the organic support include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), acrylics such as polycarbonate (PC) and polymethylmethacrylate (PMMA), cyclic polyolefins, Acetylcellulose (TAC), polyether sulfide (PES), polyether ketone, polyimide, and the like.

As the organic support, it is preferable to use an organic support having a high glass transition temperature (Tg). The glass transition temperature of the organic support is preferably 100 DEG C or higher.

Examples of the material of the organic support having a glass transition temperature of 100 deg. C or higher include polyesters such as polyethylene naphthalate (PEN), acrylics such as polycarbonate (PC) and polymethylmethacrylate (PMMA), cyclic polyolefins, Acetyl cellulose (TAC), polyether sulfide (PES), polyether ketone, polyether ether ketone, polyimide and the like. Of these, polyethylene naphthalate and polyimide are preferable from the viewpoint of heat resistance.

The organic support containing the above-mentioned materials may be subjected to a mat treatment or a corona treatment on the surface to be bonded to the resin composition layer described later.

As the organic support, a " organic support with a release layer " having a release layer on the side to which the resin composition layer is bonded, that is, the side to which the resin composition is applied (hereinafter, the organic support with a release layer is simply referred to as an organic support . As the release agent used for forming the release layer of the organic support having a release layer, there may be mentioned, for example, at least one release agent selected from the group consisting of an alkyd resin, a polyolefin resin, a urethane resin, and a silicone resin. The release layer can be formed, for example, by applying a solution containing a release agent to the surface of the organic support and drying the solution.

As the organic support having a release layer, a commercially available product may be used. For example, "SK-1", "AL-5", and "L-5", which are PET films having a release layer composed mainly of an alkyd resin- AL-7 " and the like.

The thickness of the organic support is not particularly limited, but is preferably in the range of 5 탆 to 75 탆, more preferably in the range of 10 탆 to 60 탆, and further preferably in the range of 12.5 탆 to 55 탆. When the organic support having a release layer is used, the total thickness of the organic support having the release layer preferably falls within the above range.

(Resin composition layer)

The thickness of the resin composition layer is not particularly limited. The resin composition layer preferably has a thickness of 0.5 탆 to 80 탆, more preferably 10 탆 to 60 탆.

(Process of forming an adhesive film)

The resin composition to be used for the resin composition layer may be prepared by appropriately mixing the above-described components and further mixing the components as necessary with a kneading means (three rolls, a ball mill, a bead mill, a sand mill or the like) A kneader, a stirrer, a stirrer, or the like).

A method for producing an adhesive film having a resin composition layer is not particularly limited and includes, for example, preparing a resin varnish in which a resin composition is dissolved in an organic solvent, applying the resin varnish to an organic support using a die coater or the like , And drying the coated film of the applied resin varnish.

Examples of the organic solvent used for preparing the resin varnish include ketones such as acetone, methyl ethyl ketone and cyclohexanone, ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate and carbitol acetate Carbohydrates such as acetic acid esters, cellosolve and butyl carbitol, aromatic hydrocarbons such as toluene and xylene, amide solvents such as dimethylformamide, dimethylacetamide and N-methylpyrrolidone, and the like . The organic solvent may be used singly or in combination of two or more kinds.

The drying treatment of the coating film composed of the resin varnish in the formation of the resin composition layer can be carried out by any suitable known drying method such as heating, hot air blowing and the like. By this drying treatment, the coating film becomes a resin composition layer.

The drying conditions for the drying treatment may be any suitable conditions in view of the boiling point of the organic solvent contained in the resin composition and the resin varnish. The drying conditions may be, for example, 80 to 150 占 폚 for 3 minutes to 15 minutes.

The step of forming the adhesive film is preferably carried out in a roll-to-roll manner using an elongated support, which is an organic support, and may be carried out in a batch mode.

The step of forming the adhesive film by the roll-to-roll method is carried out in such a manner that the adhesive film is exposed between the take-up roll and the take-up roll while continuously conveying the elongated organic support spanning at least two rolls including the take- A resin composition is applied to one main surface of a support to form a coating film, and the obtained coating film is successively subjected to a drying treatment to form a resin composition layer.

Thus, an adhesive film provided with a resin composition layer on the organic support can be prepared.

When the prepared adhesive film is once stored, it is preferable to additionally provide a protective film to be bonded to the exposed surface of the resin composition layer on the side not bonded to the organic support (that is, the surface opposite to the organic support). Such a protective film contributes to prevention of adhesion and scratches of dust or the like to the resin composition layer. As the protective film, for example, a polypropylene film, a polyethylene film, or the like can be used. Further, a film made of the same material as the material of the organic support may be used. The thickness of the protective film is not particularly limited, and is, for example, 1 占 퐉 to 40 占 퐉. The thickness of the protective film is preferably thinner than the thickness of the organic support.

The laminating of the protective film to the adhesive film can be carried out using a conventionally known laminator apparatus.

A wiring board according to the present embodiment, which is manufactured by using the above-described adhesive film, and a manufacturing method thereof will be described.

[Wiring board]

A configuration example of the wiring board will be described with reference to Figs. 1, 2, and 3. Fig. 1 is a schematic plan view of a wiring board viewed from one side in the thickness direction thereof. 2 is a schematic view showing a cut section of a wiring board cut at a position indicated by a II-II one-dot chain line. 3 is a schematic plan view for explaining the configuration of the first wiring layer in the wiring board.

The wiring board has an insulating layer which is a cured body of the resin composition (resin composition layer) and a coil-shaped conductive structure in which at least a part of the insulating layer is embedded. The coiled conductive structure, And an inductor element constituted by a part of the insulating layer surrounded by the coil-shaped conductive structure.

The frequency at which the inductor element included in the wiring board of this embodiment can function is assumed to be 1 GHz or more. The frequency at which such an inductor element can function is preferably 1 GHz to 3 GHz.

As shown in Figs. 1 and 2, the wiring board 10 is a build-up wiring board having a so-called build-up insulation layer. The wiring board 10 is provided with a core substrate 20. The core substrate 20 has a first major surface 20a and a second major surface 20b facing each other. The core substrate 20 is an insulating substrate. The core substrate 20 may be a so-called inner layer circuit board in which wiring or the like is formed in the thickness thereof.

Examples of the material of the core substrate 20 include insulating substrates such as a glass epoxy substrate, a metal substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, and a thermosetting polyphenylene ether substrate.

The core substrate 20 has a first wiring layer 42 provided on the first main surface 20a and an external terminal 24 provided on the second main surface 20b. The first wiring layer 42 and the second wiring layer 44 include a plurality of wirings. In the illustrated example, only the wiring constituting the coil-shaped conductive structure 40 of the inductor element is shown. The external terminal 24 is a terminal for electrically connecting to an external device or the like not shown. The external terminal 24 can be formed as a part of a wiring layer provided on the second main surface 20b.

Examples of the conductor material that can form the first wiring layer 42, the second wiring layer 44, the external terminal 24 and other wirings include gold, platinum, palladium, silver, copper, aluminum, cobalt, And at least one metal selected from the group consisting of chromium, zinc, nickel, titanium, tungsten, iron, tin and indium. The first wiring layer 42, the second wiring layer 44, the external terminal 24 and other wirings may be constituted by a single metal or an alloy. Examples of the alloy include the above- (For example, a nickel chromium alloy, a copper-nickel alloy, and a copper-titanium alloy). Among these, it is preferable to use chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper, or a nickel chromium alloy, a copper nickel alloy or a copper titanium alloy from the viewpoints of versatility, cost and ease of patterning And it is more preferable to use chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper, or nickel chromium alloy, more preferably copper.

The first wiring layer 42, the second wiring layer 44, the external terminal 24, and other wirings may have a single-layer structure or a multi-layer structure in which two or more single metal layers or alloy layers of different types of metals or alloys are stacked . In the case where the first wiring layer 42, the second wiring layer 44, the external terminal 24 and other wirings have a multi-layer structure, the layer in contact with the insulating layer may be a single metal layer of chromium, zinc or titanium, Alloy layer.

The thickness of the first wiring layer 42, the second wiring layer 44, the external terminals 24 and other wirings varies depending on the design of the desired multilayer printed wiring board, but is generally 3 탆 to 35 탆, preferably 5 탆 To 30 mu m.

The thickness of the first wiring layer 42 and the external terminal 24 of the core substrate 20 is not particularly limited. The thickness of the first wiring layer 42 and the external terminal 24 is preferably 70 占 퐉 or less, more preferably 60 占 퐉 or less, further preferably 50 占 퐉 or less, still more preferably 50 占 퐉 or less Is not more than 40 mu m, particularly preferably not more than 30 mu m, not more than 20 mu m, not more than 15 mu m, or not more than 10 mu m. The lower limit of the thickness of the external terminal 24 is not particularly limited, but is preferably 1 占 퐉 or more, more preferably 3 占 퐉 or more, and further preferably 5 占 퐉 or more.

The ratio of line (L) / space (S) of the first wiring layer 42 and the external terminal 24 is not particularly limited. However, from the viewpoint of obtaining an insulating layer excellent in smoothness by reducing surface irregularities, , It is 900/900 μm or smaller, preferably 700/700 μm or smaller, more preferably 500/500 μm or smaller, still more preferably 300/300 μm or smaller, still more preferably 200/200 μm or smaller. The lower limit of the line / space ratio is not particularly limited, but is preferably 1/1 占 퐉 or more from the viewpoint of improving the filling of the resin composition into the space.

As the core substrate 20, for example, a wiring board in which a copper foil epoxy resin double-sided copper clad laminate "R1515A" manufactured by Panasonic Corporation is used and a copper layer is patterned is used as a wiring layer.

The core substrate 20 has a plurality of through holes 22 penetrating the core substrate 20 so as to reach the second main surface 20b from the first main surface 20a. The through-hole wiring 22a is provided in the through-hole 22. The wiring 22a in the through hole electrically connects the first wiring layer 42 and the external terminal 24. [

3, the first wiring layer 42 has a spiral-shaped wiring portion for constituting the coil-shaped conductive structure 40, and a rectangular land 42a electrically connected to the wiring 22a in the through- ). In the illustrated example, the wiring portion on the spiral includes a bent portion bent at a right angle to the upper portion of the straight line and a detour portion bypassing the land 42a. In the illustrated example, the spiral wiring portion of the first wiring layer 42 has a substantially rectangular shape as a whole, and has a shape that is wound in a counterclockwise direction from the center toward the outside thereof.

The first main surface 20a of the core substrate 20 on which the first wiring layer 42 is provided is provided with a first main surface 20a covering the first main surface 20a exposed from the first wiring layer 42 and the first wiring layer 42, An insulating layer 32 is provided.

Since the first insulating layer 32 is a layer derived from the above-described adhesive film, the sealing property of the first wiring layer 42 is excellent. Further, since the first insulating layer 32 is formed by using the adhesive film, the magnetic permeability in the range of the high frequency band (gigahertz band), particularly 1 GHz to 3 GHz in which the frequency is 1 GHz or more is improved, Is suppressed.

A via hole 36 is formed in the first insulating layer 32 to penetrate the first insulating layer 32 in the thickness direction thereof.

The first insulating layer 32 is provided with a second wiring layer 44. The second wiring layer 44 includes a spiral wiring portion for constituting the coil-shaped conductive structure 40. In the illustrated example, the wiring portion on the spiral includes a bent portion bent at a right angle with the upper portion of the straight line. In the illustrated example, the spiral wiring portion of the second wiring layer 44 has a substantially rectangular outline as a whole, and has a shape that is wound clockwise as viewed from the center toward the outside thereof.

A wiring 36a in the via-hole is provided in the via-hole 36. One end on the center side of the spiral-shaped wiring portion of the second wiring layer 44 is electrically connected to one end of the central portion of the spiral-shaped wiring portion of the first wiring layer 42 by the via-hole wiring 36a. The other end of the outer peripheral side of the spiral wirings of the second wiring layer 44 is electrically connected to the land 42a of the first wiring layer 42 by the wiring 36a in the via hole. The other end of the outer peripheral side of the spiral wirings of the second wiring layer 44 is electrically connected to the external terminal 24 via the wiring 36a in the via hole, the land 42a, and the wiring 22a in the through hole have.

The coil-shaped conductive structure 40 includes a spiral wiring portion which is a part of the first wiring layer 42, a spiral wiring portion which is a part of the second wiring layer 44, a spiral wiring portion of the first wiring layer 42, Hole wiring 36a that electrically connects the wiring portion on the spiral of the first wiring layer 44 to the second wiring portion 36a.

A second insulating layer 34 is formed on the first insulating layer 32 provided with the second wiring layer 44 so as to cover the first insulating layer 32 exposed from the second wiring layer 44 and the second wiring layer 44 Is installed.

The second insulating layer 34 is a layer derived from the adhesive film as described above, such as the first insulating layer 32. Since the resin composition layer of the adhesive film has excellent fluidity at the time of forming the insulating layer, the second wiring layer 44 ) Is excellent. Further, since the second insulating layer 34 is formed using the above adhesive film, the magnetic permeability is improved and the magnetic permeability is suppressed in a high-frequency band having a frequency of 1 GHz or more, particularly in the range of 1 GHz to 3 GHz.

The first insulating layer 32 and the second insulating layer 34 constitute an insulating portion 30 that can be viewed as an integral insulating layer. Therefore, the coil-shaped conductive structure 40 is provided so that at least a portion thereof is embedded in the insulating portion 30. [ That is, in the wiring board 10 of the present embodiment, the inductor element has the coil-shaped conductive structure 40, the insulating portion 30 extending in the thickness direction of the insulating portion 30 and surrounded by the coil-shaped conductive structure 40 30).

Although the present embodiment has described an example in which the coil-shaped conductive structural body 40 includes two wiring layers of the first wiring layer 42 and the second wiring layer 44, the wiring layer of three or more layers Up insulating layer) may be used to constitute the coin-cell conductive structure 40. In this case, the spiral-shaped wiring portion of the wiring layer (not shown) interposed between the wiring layer of the uppermost layer and the wiring layer of the lowermost layer is formed on one of the spiral- And the other end thereof is electrically connected to either end of the wiring portion on the spiral of the wiring layer disposed immediately adjacent to the lowermost layer side.

According to the circuit board of the present embodiment, since the insulating layer is formed by the adhesive film, the magnetic permeability of the insulating layer to be formed can be increased, and as a result, the L value and the Q value of the inductor element, Can be improved.

[Manufacturing method of wiring board]

Hereinafter, a method of manufacturing a wiring board according to the present embodiment will be described with reference to FIG.

The method for manufacturing a wiring board according to the present embodiment includes an insulating portion including a first insulating layer and a second insulating layer and a coil-shaped conductive structure in which at least a part of the insulating portion is buried, A step of preparing a core substrate provided with an adhesive film and a first wiring layer according to the present embodiment; a step of laminating a resin composition layer of an adhesive film on the core substrate; A step of thermally curing the resin composition layer to form a first insulating layer; a step of forming a via hole in the first insulating layer; a step of roughening the first insulating layer in which the via hole is formed; A step of forming a second wiring layer in the first insulating layer and forming a wiring in a via hole for electrically connecting the first wiring layer and the second wiring layer; A step of laminating an adhesive film according to the present embodiment and thermally curing the second insulating layer to the first insulating layer on which the wirings are formed and a step of forming a part of the first wiring layer and a part of the second wiring layer, And a step of forming an inductor element extending in the thickness direction of the insulating portion and including a portion of the insulating portion surrounded by the coil-shaped conductive structure.

The first wiring layer 42 provided on the first main surface 20a, the external terminal 24 provided on the second main surface 20b, the through hole 22, the through- A core substrate (inner layer circuit board) 20 provided with the inner wiring 22a and an adhesive film are prepared.

(Step of forming first insulation layer)

Next, a first insulating layer 32 is formed. A lamination step of laminating the resin composition layer of the adhesive film so as to be in contact with the first wiring layer 42 of the core base is performed.

The conditions of the lamination process are not particularly limited, and known conditions used in forming an insulating layer (build-up insulating layer) using an adhesive film can be adopted. For example, it can be carried out by pressing a metal plate such as a heated stainless steel plate from the side of the organic support of the adhesive film. In this case, it is preferable that the pressing is carried out through an elastic member made of heat-resistant rubber or the like so that the adhesive film sufficiently follows the unevenness of the surface of the core substrate 20 without directly pressing the metal plate. The press temperature is preferably in the range of 70 占 폚 to 140 占 폚, the press pressure is preferably in the range of 1 kgf / cm2 to 11 kgf / cm2 (0.098 MPa to 1.079 MPa), the press time is preferably 5 seconds to 3 Minute.

Further, the lamination process is preferably carried out under a reduced pressure of 20 mmHg (26.7 hPa) or less. The lamination process can be carried out using a commercially available vacuum laminator. As a commercially available vacuum laminator, for example, a vacuum pressure laminator manufactured by Meikishesakusho Co., Ltd., a vacuum applicator manufactured by Nichigo Morton Co., Ltd., and the like can be given.

After completion of the lamination process, a smoothing process may be performed in which the adhesive film laminated on the core substrate 20 is heated and pressurized.

The smoothing step is generally performed by heating and pressing the adhesive film laminated on the core substrate 20 by a heated metal plate or metal roll under atmospheric pressure (atmospheric pressure). Conditions for the heating and pressurizing treatment may be the same as those for the lamination step.

The lamination process and smoothing process may be continuously performed using the same vacuum laminator.

Further, a step of peeling off the organic support derived from the adhesive film is performed at an arbitrary timing after the laminating process or the smoothing process. The step of peeling the organic support can be performed mechanically, for example, by a commercially available automatic peeling apparatus.

Then, the thermosetting step of thermally curing the resin composition layer laminated on the core substrate 20 to form an insulating layer (build-up insulating layer) is performed.

The conditions of the thermosetting step are not particularly limited, and conditions that are generally employed when forming the insulating layer of the multilayer printed wiring board can be applied.

The conditions of the thermosetting step may be any suitable condition depending on the composition of the resin composition used in the resin composition layer and the like. The conditions of the heat curing process are set, for example, at a curing temperature in the range of 120 占 폚 to 240 占 폚 (preferably in the range of 150 占 폚 to 210 占 폚, more preferably in the range of 170 占 폚 to 190 占 폚) For 5 minutes to 90 minutes (preferably 10 minutes to 75 minutes, more preferably 15 minutes to 60 minutes).

The step of preheating the resin composition layer at a temperature lower than the curing temperature may be performed before the thermosetting step. Prior to the execution of the heat curing step, the resin composition layer is cured for at least 5 minutes or more at a temperature of, for example, 50 ° C or more and less than 120 ° C (preferably 60 ° C or more and 110 ° C or less, more preferably 70 ° C or more and 100 ° C or less) (Preferably for 5 minutes to 150 minutes, more preferably for 15 minutes to 120 minutes). Preheating is preferably carried out under atmospheric pressure (atmospheric pressure).

The first insulating layer 32 provided on the core substrate 20 can be formed by the above process. The lamination process, the thermosetting process, and the wiring layer forming process, which will be described later, are further repeated one or more times with respect to the core substrate 20 on which the insulating layer is formed, A layer 34, and an insulating portion 30 including an insulating layer that is further laminated.

The step of forming the first insulating layer 32 on the core substrate 20 can also be carried out using a general vacuum hot press. For example, it can be carried out by pressing from a side of an organic support using a metal plate such as a heated SUS plate. The pressing condition is such that the reduced pressure is usually 1 x ^10-2 MPa or less, preferably 1 x ^10-3 MPa or less. The heating and pressurization can be carried out in one step, but it is preferable to carry out two or more steps from the viewpoint of controlling the exudation of the resin and changing the pressing conditions respectively. For example, the first-stage press condition is set at a temperature of 70 to 150 ° C, a pressure of 1 kgf / cm 2 to 15 kgf / cm 2, a second-stage press condition at a temperature of 150 to 200 Deg.] C and a pressure in the range of 1 to 40 kgf / cm < 2 >. The time for each step is preferably 30 minutes to 120 minutes. As a commercially available vacuum hot press, for example, "MNPC-V-750-5-200" manufactured by Meikishesakusho Co., Ltd., "VH1-1603" manufactured by Kitagawa Seiki Co., Ltd. and the like can be mentioned.

(Via hole forming process)

A via hole 36 is formed in the first insulation layer 32 formed. The via hole 36 serves as a path for electrically connecting the first wiring layer 42 and the second wiring layer 44. The via hole 36 can be formed by a known method using a drill, laser, plasma or the like in consideration of the characteristics of the first insulating layer 32. For example, when the protective film remains at this point, the via hole 36 may be formed by irradiating the first insulating layer 32 with a laser beam via a protective film.

Examples of the laser light source used for forming the via-hole 36 include a carbon dioxide gas laser, a YAG laser, and an excimer laser. Of these, a carbon dioxide gas laser is preferable from the viewpoints of processing speed and cost.

The via holes 36 can be formed using commercially available laser devices. Examples of commercially available carbon dioxide gas laser devices include "LC-2E21B / 1C" manufactured by Hitachi Biomechanics Co., Ltd., "ML605GTWII" manufactured by Mitsubishi Denki K.K., a substrate drilling manufactured by Matsushita Yotsetsu System Co., And a laser processing machine.

(Blending process)

Next, a coarsening process is performed to the first insulation layer 32 on which the via-hole 36 is formed. The order and conditions of the roughening process are not particularly limited, and well-known procedures and conditions commonly used in the method for producing a multilayer printed wiring board can be adopted. As the roughening process, for example, the first insulating layer 32 can be roughened by performing swelling treatment with a swelling liquid, roughening treatment with an oxidizing agent, and neutralizing treatment with a neutralizing liquid in this order.

The swelling liquid that can be used in the coarsening process is not particularly limited, but examples thereof include an alkali solution and a surfactant solution, and preferably an alkali solution. As the alkaline solution which is a swelling liquid, sodium hydroxide solution and potassium hydroxide solution are more preferable. Examples of commercially available swelling liquids include Swelling Dip Sicergans P, Swelling Dip Sicureganus SBU, etc., manufactured by Atotech Japan Co., Ltd., and the like.

The swelling treatment by the swelling liquid is not particularly limited, and is carried out, for example, by immersing the core substrate 20 provided with the first insulating layer 32 in a swelling liquid at 30 캜 to 90 캜 for 1 minute to 20 minutes . It is preferable to immerse the first insulating layer 32 in the swelling liquid at 40 占 폚 to 80 占 폚 for 5 minutes to 15 minutes from the viewpoint of suppressing the swelling of the resin constituting the first insulating layer 32 to an appropriate level.

The oxidizing agent used in the coarsening treatment with an oxidizing agent is not particularly limited, and for example, an alkaline permanganic acid solution obtained by dissolving potassium permanganate or sodium permanganate in an aqueous solution of sodium hydroxide can be mentioned. The roughening treatment with an oxidizing agent such as an alkaline permanganic acid solution is preferably carried out by immersing the first insulating layer 32 in a solution of an oxidizing agent heated to 60 占 폚 to 80 占 폚 for 10 minutes to 30 minutes. The concentration of the permanganate in the alkaline permanganic acid solution is preferably 5% by mass to 10% by mass. Examples of commercially available oxidizing agents include alkaline permanganic acid solutions such as Concentrate Compact P manufactured by Atotech Japan Co., Ltd., and Dozing Solution · Sucuregan P, and the like.

As a neutralizing solution used for the neutralization treatment, an acidic aqueous solution is preferable, and commercially available products include, for example, " Reduction Solution · Sucuregan P " manufactured by Atotech Japan Co., The neutralization treatment by the neutralization liquid can be carried out by immersing the treated surface subjected to the roughening treatment with the oxidizing agent solution in a neutralizing solution at 30 ° C to 80 ° C for 5 minutes to 30 minutes. It is preferable to immerse the first insulating layer 32 subjected to the roughening treatment with the oxidizing agent solution in a neutralizing solution at 40 캜 to 70 캜 for 5 minutes to 20 minutes in terms of workability and the like.

The above-described coarsening step may also serve as a so-called desmearing step for removing the smear of the via-hole 36 formed in the first insulating layer 32.

Further, the via hole 36 may be subjected to a desmear process separately from the above-described roughening process. The desmearing step may be a wet desmearing step or a dry desmearing step.

The specific process of the desmear process is not particularly limited, and for example, known processes and conditions commonly used in forming the insulating layer of the multilayered printed circuit board can be employed. Examples of the dry desmear process include a plasma process. Examples of the wet desmear process include a swelling process using a swelling solution, a treatment with an oxidizing agent, and a treatment with a neutralizing solution in the same manner as the above-mentioned coarsening step .

(Formation of second wiring layer)

Next, the second wiring layer 44 is formed on the first insulation layer 32 subjected to the coarsening process (and the demi-mering process).

The second wiring layer 44 can be formed by plating. The second wiring layer 44 is formed by a conventionally known technique such as an electroless plating process, a mask pattern forming process, an electrolytic plating process, a semi-stationary process including a flash etching process, a pull- So that it can be formed as a wiring layer containing a desired wiring pattern. In addition, via-hole wiring 36a is formed in the via hole 36 by the step of forming the second wiring layer 44 as well.

In the case where the first insulation layer 32 is a build-up insulation layer and the second wiring layer 44 is a build-up wiring layer, in the case of the wiring board according to the present embodiment, The series of steps from the step of forming the first insulating layer 32 to the step of forming the second wiring layer 44 may be repeated one or more times.

(Formation of Second Insulating Layer)

Next, the second insulating layer 34 is formed on the first insulating layer 32 in which the second wiring layer 44 and the via-hole wiring 36a are formed. The second insulating layer 34 may be formed by the same process using the same material as the process of forming the first insulating layer 32 including the lamination process, the smoothing process, and the heat curing process of the adhesive film already described.

The above-described process has a coil-shaped conductive structure 40 in which at least a part is embedded in the insulating portion 30 and a portion of the first wiring layer 42, a portion of the second wiring layer 44, 36a and an inductor element extending in the thickness direction of the insulating portion 30 and including a portion of the insulating portion 30 surrounded by the coil-shaped conductive structure 40. The coil- The wiring board 10 can be manufactured.

By using the adhesive film of the present invention, it is possible to improve the magnetic permeability particularly in the range of 1 GHz to 3 GHz frequency, to reduce the magnetic loss, and to form the insulating layer excellent in insulation reliability, It is possible to provide a wiring board in which a higher performance high-frequency band inductor element including a core portion constituted by a part of the insulating layer is not formed, in a simpler process.

[Usage of wiring board]

The wiring board according to the present embodiment can be used as a wiring board for mounting electronic components such as semiconductor chips. In addition, various types of semiconductor devices can be manufactured by using such a wiring board. The semiconductor device including such a wiring board can be suitably used for electrical products (such as a computer, a mobile phone, a digital camera and a television) and a vehicle (for example, a motorcycle, an automobile, a tanker, .

[Example]

Hereinafter, the present invention will be described more specifically based on examples and comparative examples, but the present invention is not limited to the following examples. In the following description, " part " means " part by mass ".

≪ Example 1 >

20 parts of liquid bisphenol A type epoxy resin (epoxy equivalent 190, specific gravity 1.2 g / cm3, "jER828EL" manufactured by Mitsubishi Kagaku KK), 20 parts of biphenyl type epoxy resin (epoxy equivalent 291, specific gravity 1.2 g / , 65 parts of a phenoxy resin (weight average molecular weight of 38000, specific gravity of 1.2 g / cm3, "YX6954" manufactured by Mitsubishi Kagaku Co., Ltd. and methyl ethyl ketone of 30 mass% MEK ") and cyclohexanone (1: 1 solution)) was dissolved by heating in 22.5 parts of MEK and 22.5 parts of cyclohexanone with stirring. A MEK solution of 60% of a non-volatile component of phenol novolak type curing agent ("LA-7054" (phenol type curing agent containing triazine skeleton) manufactured by DIC Corporation, phenolic hydroxyl equivalent 124, specific gravity 1.2 g / (Average particle diameter: 0.5 mu m, specific gravity: 2.2 g / cm < 3 >, manufactured by Adomex Co., Ltd.), 0.1 part of a curing accelerator (" 2E4MZ ", manufactured by Shikoku Chemical Industry Co., 50 parts of a magnetic filler ("AW2-08PF3F" manufactured by Epson Atomics Co., Ltd., Fe-Cr (trade name, manufactured by Epson Corp.) -Si-based alloy (amorphous), an average particle diameter of 3.0 mu m, and a specific gravity of 7.0 g / cm < 3 >) were mixed and uniformly dispersed by a high-speed rotary mixer to prepare a resin varnish. Next, this resin varnish was coated on a polyethylene terephthalate (hereinafter referred to as " PET ") film (thickness 38 mu m) as a support by a die coater so that the thickness of the resin composition layer after drying became 50 mu m, And dried at 120 캜 (average 100 캜) for 7 minutes so that the residual solvent amount in the resin composition layer was about 0.4% by mass. Then, a polypropylene film having a thickness of 15 mu m was stuck on the surface of the resin composition layer and rolled up into a rolled film to form an adhesive film on the roll. The obtained roll-like adhesive film was cut so that its length in the longitudinal direction was 507 mm, and a 507 mm x 336 mm sheet-like adhesive film was obtained.

≪ Example 2 >

In the same manner as in Example 1 except that an inorganic filler (average particle diameter 0.5 탆, specific gravity 2.2 g / cm 3, "SO-C2" manufactured by Adomatex KK was replaced with an amino silane coupling agent "KBM573 (Shinetsu Kagaku Kogyo Co., Except that the amount of the magnetic filler ("AW2-08PF3F" manufactured by Epson Atomics Co., Ltd., average particle size 3.0 μm, specific gravity 7.0 g / cm 3) was changed to 350 parts, , An adhesive film was obtained in the same manner as in Example 1.

≪ Example 3 >

In the same manner as in Example 1 except that an inorganic filler (average particle diameter 0.5 탆, specific gravity 2.2 g / cm 3, "SO-C2" manufactured by Adomatex KK was replaced with an amino silane coupling agent "KBM573 (Shinetsu Kagaku Kogyo Co., ) Was changed to 90 parts, and 290 parts of a magnetic filler ("AW2-08PF3F" manufactured by Epson Atomics Co., Ltd., average particle diameter 3.0 탆, specific gravity 7.0 g / cm 3) An adhesive film was obtained in the same manner as in Example 1.

<Example 4>

In the same manner as in Example 1 except that an inorganic filler (average particle diameter 0.5 탆, specific gravity 2.2 g / cm 3, "SO-C2" manufactured by Adomatex KK was replaced with an amino silane coupling agent "KBM573 (Shinetsu Kagaku Kogyo Co., Except that the amount of the magnetic filler ("AW2-08PF3F" manufactured by Epson Atomics Co., Ltd., average particle diameter: 3.0 μm, specific gravity: 7.0 g / cm 3) was changed to 240 parts , An adhesive film was obtained in the same manner as in Example 1.

&Lt; Example 5 >

In the same manner as in Example 1 except that an inorganic filler (average particle diameter 0.5 탆, specific gravity 2.2 g / cm 3, "SO-C2" manufactured by Adomatex KK was replaced with an amino silane coupling agent "KBM573 (Shinetsu Kagaku Kogyo Co., Except that the amount of the magnetic filler ("AW2-08PF3F" manufactured by Epson Atomics, average particle diameter: 3.0 μm, specific gravity: 7.0 g / cm 3) was changed to 150 parts , An adhesive film was obtained in the same manner as in Example 1.

&Lt; Example 6 >

In the same manner as in Example 1 except that an inorganic filler (average particle diameter 0.5 탆, specific gravity 2.2 g / cm 3, "SO-C2" manufactured by Adomatex KK was replaced with an amino silane coupling agent "KBM573 (Shinetsu Kagaku Kogyo Co., Except that the amount of the magnetic filler (average particle diameter 3.0 占 퐉, "AW2-08PF3F" manufactured by Epson Atomics Co., Ltd., specific gravity 7.0 g / cm3) was changed to 130 parts, , An adhesive film was obtained in the same manner as in Example 1.

&Lt; Example 7 >

In the same manner as in Example 1 except that an inorganic filler (average particle diameter 0.5 탆, specific gravity 2.2 g / cm 3, "SO-C2" manufactured by Adomatex KK was replaced with an amino silane coupling agent "KBM573 (Shinetsu Kagaku Kogyo Co., 35 parts, and the amount of the magnetic filler ("AW2-08PF3F" manufactured by Epson Atomics, average particle diameter 3.0 탆, specific gravity 7.0 g / cm 3) was changed to 110 parts. An adhesive film was obtained in the same manner as in Example 1.

&Lt; Example 8 >

(Epoxy equivalent: 190, specific gravity: 1.2 g / cm 3, &quot; jER828EL &quot;, manufactured by Mitsubishi Kagaku K.K.) and 14 parts of a biphenyl type epoxy resin (epoxy equivalent: 291, specific gravity: 1.2 g / 14 parts of a phenoxy resin (weight average molecular weight: 38000, specific gravity: 1.2 g / cm3, "YX6954" manufactured by Mitsubishi Kagaku Co., Ltd., MEK having a nonvolatile component of 30 mass% and cyclohexanone 1: 1 solution) were dissolved by heating in 5 parts of MEK and 5 parts of cyclohexanone with stirring. A MEK solution of 60% of a non-volatile component of phenol novolak type curing agent ("LA-7054" (phenol type curing agent containing triazine skeleton) manufactured by DIC Corporation, phenolic hydroxyl equivalent 124, specific gravity 1.2 g / (Average particle diameter: 0.5 mu m, specific gravity: 2.2 g / cm &lt; 3 &gt;, manufactured by Adomex Co., Ltd.), 30 parts of a curing accelerator (&quot; 2E4MZ &quot;, manufactured by Shikoku Chemical Industry Co., Ltd., specific gravity: 1.1 g / 150 parts of a magnetic filler ("AW2-08PF3F" manufactured by Epson Atomics Co., Ltd., Fe-Cr (trade name, manufactured by Epson Corp.) , 360 parts of an amorphous silicon-based alloy (amorphous), an average particle diameter of 3.0 탆, and a specific gravity of 7.0 g / cm 3) were mixed and uniformly dispersed with a high-speed rotary mixer to prepare a resin varnish. Respectively.

&Lt; Example 9 >

The inorganic filler was obtained in the same manner as in Example 8, except that the inorganic filler was changed to an aminosilane-based coupling agent (manufactured by Shinetsu Kagaku Kogyo Co., Ltd.) with an average particle diameter of 1 탆, a specific gravity of 2.2 g / Quot; KBM573 &quot;)) was used in place of 150 parts of the polyimide resin.

&Lt; Example 10 >

The inorganic filler was obtained in the same manner as in Example 8, except that the inorganic filler was changed to an aminosilane-based coupling agent (manufactured by Shinetsu Kagaku Kogyo Co., Ltd., &quot;Quot; KBM573 &quot;)) was used in place of 150 parts of the polyimide resin.

&Lt; Comparative Example 1 &

(Having an average particle diameter of 0.5 탆 and a specific gravity of 2.2) was obtained in the same manner as in Example 1, except that a magnetic filler ("AW2-08PF3F" manufactured by Epson Atomics, average particle diameter of 3.0 탆, specific gravity of 7.0 g / (silica treated with an amino silane coupling agent "KBM573" manufactured by Shin-Etsu Chemical Co., Ltd.) ("SO-C2" manufactured by Adomex Co., Ltd.) was changed to 70 parts An adhesive film was obtained in the same manner as in Example 1.

&Lt; Comparative Example 2 &

Except that the amount of the magnetic filler (average particle diameter 3.0 탆, "AW2-08PF3F" manufactured by Epson Atomics Co., Ltd., specific gravity: 7.0 g / cm 3) was changed to 700 parts in Example 1, A film was obtained.

&Lt; Comparative Example 3 &

Except that the inorganic filler was not used and 210 parts of the magnetic filler (average particle diameter 3.0 탆, "AW2-08PF3F" manufactured by Epson Atomics Co., Ltd., specific gravity 7.0 g / ㎤) was used in Example 1 1, an adhesive film was obtained.

&Lt; Comparative Example 4 &

In the same manner as in Example 1 except that an inorganic filler (average particle diameter 0.5 탆, specific gravity 2.2 g / cm 3, "SO-C2" manufactured by Adomatex KK was replaced with an amino silane coupling agent "KBM573 (Shinetsu Kagaku Kogyo Co., Except that the amount of the magnetic filler (average particle diameter 3.0 占 퐉, "AW2-08PF3F" manufactured by Epson Atomics Co., Ltd., specific gravity 7.0 g / cm3) was changed to 290 parts , An adhesive film was obtained in the same manner as in Example 1.

In each of Examples 1 to 7 and Comparative Examples 1 to 4, the composition in terms of the amount of the nonvolatile component of such a resin varnish is shown in Table 1 below. The compositions of these resin varnishes in terms of the nonvolatile component amounts in Examples 8 to 10 are shown in Table 2 below.

&Lt; Measurement method of permeability >

Except that a PET film (&quot; Fluoro RL50KSE &quot;, manufactured by Mitsubishi Jushi Co., Ltd.) subjected to a fluororesin-based releasing agent (ETFE) treatment was used as a support in each of Examples 1 to 8 and Comparative Examples 1 to 4, An adhesive film having the same resin composition layers as in each of the Examples and Comparative Examples was obtained. The obtained adhesive film was heated at 180 캜 for 90 minutes to thermally cure the resin composition layer, and the support was peeled off to obtain a sheet-form cured body. The obtained cured product was cut into test pieces having a width of 5 mm and a length of 18 mm to obtain evaluation samples. Using this evaluation sample, "HP8362B" (trade name) manufactured by Agilent Technologies was used, and the measurement frequency was set in the range of 100 MHz to 10 GHz by short-circuit strip line method, and the permeability (μ ' And investment loss (μ ''). The investment loss when the measurement frequencies are 1 GHz and 3 GHz and the investment loss when the measurement frequencies are 1 GHz and 3 GHz are shown in Tables 3 and 4 below.

&Lt; Evaluation of insulation property &

Each of the adhesive films obtained in Examples 1 to 8 and Comparative Examples 1 to 4 was laminated by using a batch vacuum pressure laminator "MVLP-500" (trade name) manufactured by Meikisha Sakusho Co., Ltd., Was laminated on the side of the wiring pattern of a polyimide film having a thickness of 38 mu m and a comb-shaped wiring pattern having a thickness of 8 mu m was formed, with L (line) / S (space) = 15 mu m / 15 mu m . The PET film was peeled off from the adhesive film formed by the laminate and heat-cured by heating at 180 DEG C for 90 minutes to form an insulating layer. The obtained laminated structure was used as an evaluation sample.

First, a voltage of 3.3 V was applied to the obtained evaluation sample to measure the initial resistance value. Further, while a voltage of 3.3 V was applied to the sample for evaluation, the sample was allowed to stand in an atmosphere at 130 캜 and a relative humidity of 85% for 100 hours. The survival rate of the test piece was calculated by letting the survival of the sample not lowering the insulation resistance value after 100 hours of storage (after 100 hours of HAST). In the calculation of the specimen survival rate, the case where the insulation resistance value of the insulation layer after 100 hours of operation exceeds 1.0 x 10 &lt; ⁶ &gt; is evaluated as &quot; 10 ⁶ Ω or less was evaluated as "non-viable". The results are shown in Tables 3 and 4 below. Also, the adhesive film according to Comparative Example 4 had a problem in moldability, so that the test piece survival rate could not be tested, and in Comparative Example 4, the initial resistance value was also impossible to test.

&Lt; Evaluation of lamination property &

Each of the adhesive films obtained in Examples 1 to 8 and Comparative Examples 1 to 4 was laminated on both sides of a wiring board using a batch vacuum pressure laminator &quot; MVLP-500 &quot; (trade name) manufactured by Meikisha Sakusho Co., . The laminate was decompressed for 30 seconds to set the atmospheric pressure to 13 hPa or less, and then press at 100 DEG C for 30 seconds with a pressing force of 0.74 MPa. The evaluation was carried out by examining the appearance of the obtained laminated structure according to the following evaluation criteria. The results are shown in Tables 3 and 4 below.

Evaluation standard

?: There is no void in the circuit portion of the wiring board, and the resin composition derived from the adhesive film sufficiently flows.

X: voids are generated in the circuit part of the wiring board, and the fluidity of the resin composition derived from the adhesive film during lamination is insufficient.

It was found that the resin composition having the above composition according to the embodiment of the present invention is excellent in fluidity at the time of forming the insulating layer and excellent in the sealing property of the wiring layer when the insulating layer (cured body) is used. In addition, the insulating layer formed by using the adhesive film having the resin composition layer containing such a resin composition has improved magnetic permeability in a high frequency band (gigahertz band) with a frequency of 1 GHz or more, particularly 1 GHz to 3 GHz, It was also found that the magnetic loss was suppressed. Further, as is clear from the results of the test piece survival rate, it was found that the insulating layer formed of the resin composition having the above composition had excellent insulation reliability. Therefore, by using the adhesive film of the present invention, it is possible to provide a wiring board on which a higher-performance inductor element for a high-frequency band is formed by a simple process.

10 wiring board
20 core substrate (inner layer circuit board)
20a first main surface
20b Second main surface
22 Through Hole
22a Through-hole wiring
24 external terminal
30 insulation part
32 first insulation layer
34 second insulating layer
36 via hole
36a wiring in via hole
40 Coil-type conductive structure
42 First wiring layer
42a land
44 Second wiring layer

Claims (20)

As an adhesive film having a support and a resin composition layer provided on the support,
Wherein the resin composition layer contains a thermosetting resin of component (A), a magnetic filler of component (B), and an inorganic filler of component (C)
Wherein the content of the component (B) is 10% by volume or more and the content of the component (C) is the content of the component (B) when the nonvolatile component in the resin composition constituting the resin composition layer is 100% And the value divided by the range of 0.3 to 3.0. The adhesive film according to claim 1, wherein the component (A) is an epoxy resin, and the resin composition further comprises an epoxy resin curing agent selected from a phenol-based curing agent and a naphthol-based curing agent. The adhesive film according to claim 2, wherein the epoxy resin curing agent is selected from triazine skeleton-containing cresol-based curing agents and triazine skeleton-containing phenol-based curing agents. The adhesive film according to claim 1, wherein the resin composition further contains a thermoplastic resin. The adhesive film according to claim 1, wherein the content of the component (B) in the resin composition is 10% by volume to 40% by volume and the content of the component (C) is 10% by volume to 50% by volume. The adhesive film according to claim 1, wherein the total content of the component (B) and the component (C) in the resin composition is 20% by volume to 75% by volume. The adhesive film according to claim 1, wherein the content of the component (B) in the resin composition is 10% by volume to 25% by volume. The resin composition according to claim 1, wherein the content of the component (B) in the resin composition is 20 to 25% by volume, the content of the component (C) is 10 to 25% by volume, (C) is 30% by volume to 50% by volume. The adhesive film according to claim 1, wherein an average particle diameter of the component (B) in the resin composition is from 0.3 탆 to 10 탆. The adhesive film according to claim 1, wherein the component (C) has an average particle diameter of 0.01 탆 to 5 탆. The adhesive film according to claim 1, wherein an average particle diameter of the component (B) is larger than an average particle diameter of the component (C). The adhesive film according to claim 1, wherein component (C) is silica. The adhesive film according to claim 1, wherein the component (C) is silica treated with a surface treatment agent. 14. The adhesive film according to claim 13, wherein the surface treating agent is an aminosilane-based coupling agent. The magnetic recording medium according to claim 1, which has a magnetic permeability (magnetic permeability) of 1.1 or more when the frequency is 1 GHz to 3 GHz and a magnetic loss (magnetic loss) of 0.5 or less when the frequency is 1 GHz to 3 GHz, . The adhesive film according to claim 1, wherein the cured product has a magnetic permeability of 1.2 or more at a frequency of 1 GHz to 3 GHz and a magnetic loss of 0.3 or less at a frequency of 1 GHz to 3 GHz. The adhesive film according to claim 1, which is used for forming an insulating layer of a wiring board having an inductor element. An insulating layer which is a cured body of the resin composition layer of the adhesive film according to any one of claims 1 to 16 and a coil-shaped conductive structure in which at least a part of the insulating layer is embedded,
And an inductor element extending in the thickness direction of the insulating layer and constituted by a part of the insulating layer surrounded by the coil-shaped electrically conductive structure. 19. The circuit board according to claim 18, wherein a frequency at which the inductor element functions is 1 GHz or more. An insulating portion including a first insulating layer and a second insulating layer, and a coil-shaped conductive structure in which at least a part of the insulating portion is embedded, wherein the coil-shaped conductive structure and an inductor element A method for manufacturing a wiring board,
A method for manufacturing a semiconductor device, comprising the steps of: preparing the adhesive film according to any one of claims 1 to 16 and a core substrate provided with a first wiring layer;
A step of laminating the resin composition layer of the adhesive film on the core substrate,
A step of thermally curing the resin composition layer to form a first insulating layer,
Forming a via hole in the first insulating layer;
A step of roughening the first insulating layer on which the via hole is formed,
A step of forming a second wiring layer in the first insulating layer and forming wiring in a via hole for electrically connecting the first wiring layer and the second wiring layer;
Laminating the adhesive film to the first insulating layer in which the second wiring layer and the wiring in the via hole are formed, and thermally curing the second insulating layer to form the second insulating layer;
A coil-shaped conductive structure including a portion of the first wiring layer, a portion of the second wiring layer, and the wiring in the via-hole; and a portion of the insulation portion extending in the thickness direction of the insulation portion and surrounded by the coil- Forming the inductor element including the step
And a step of forming the wiring board.

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