KR20150071445A - Evaporation source and Deposition apparatus including the same - Google Patents

Abstract

The present invention relates to an evaporation source and a deposition apparatus including the same. According to the present invention, the evaporation source to provide evaporation materials for forming an organic thin film on a substrate comprises: a crucible to accept the evaporation materials; a nozzle part joined to the top of the crucible; and a heater part for covering the nozzle part to heat the nozzle part, wherein the heater part may comprise first and second heater blocks joined together to cover the nozzle part. The first and second heater blocks comprise: a housing; and a heating wire supported in the inner side of the housing, wherein a cooling passage may be formed on the outer wall of the housing.

Description

[0001] The present invention relates to an evaporation source and a deposition apparatus including the evaporation source,

The present invention relates to an evaporation source and a deposition apparatus including the evaporation source, and more particularly, to an evaporation source capable of preventing contamination of a vacuum chamber while improving the reproducibility of fabrication by facilitating the attachment of a heater unit surrounding the nozzle unit, and a deposition apparatus .

BACKGROUND ART Organic light emitting diodes (OLEDs) are self-light emitting devices that emit light by using an electroluminescent phenomenon that emits light when a current flows through a fluorescent organic compound. A backlight for applying light to a non- Therefore, a lightweight thin flat panel display device can be manufactured.

A flat panel display device using such an organic electroluminescent device has a fast response speed and a wide viewing angle, and is emerging as a next generation display device. Particularly, since the manufacturing process is simple, it is advantageous in that the production cost can be saved more than the conventional liquid crystal display device.

The organic electroluminescent device comprises an organic thin film such as a hole injecting layer, a hole transporting layer, a light emitting layer, an electron transporting layer, and an electron injecting layer which are the remaining constituent layers except for the anode and the cathode. / RTI >

In the vacuum thermal deposition method, a substrate is disposed in a vacuum chamber, a shadow mask having a predetermined pattern is aligned on a substrate, heat is applied to an evaporation source containing the evaporation material, Evaporation. The evaporation source is usually composed of a crucible and a nozzle part connected to the upper part thereof. In order to solve the problem that the evaporated particles which are heated and moved are deposited on the inner wall of the nozzle part and the thermal distribution problem in the nozzle part affecting the movement of the evaporated particles It is necessary to heat the nozzle portion.

Conventionally, a contact type heating method in which a coating type heater is attached to the outer surface of a nozzle portion has been used for this purpose. However, since the manufacturing reproducibility is low and magnesium oxide (MgO) is used as an electrical insulator, impurities are generated in the vacuum chamber There was a problem.

Korean Patent Publication No. 10-2006-0060074 (published on June 5, 2006)

SUMMARY OF THE INVENTION Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and it is an object of the present invention to provide an evaporation source capable of preventing contamination of a vacuum chamber while improving reproductivity, And to provide a deposition apparatus.

According to an aspect of the present invention, there is provided an evaporation source for supplying an evaporation material for forming an organic thin film on a substrate, the evaporation source comprising: a crucible accommodating the evaporation material; A nozzle unit coupled to an upper end of the crucible; And a heater unit surrounding the nozzle unit and heating the nozzle unit, wherein the heater unit includes a first heater block and a second heater block coupled to each other to surround the nozzle unit, and the first heater block and the second heater block A housing; And a heat line supported on the inner surface of the housing, and a cooling channel may be formed on the outer wall of the housing.

A support bar may be provided at a lower portion of the second heater block.

A coupling protrusion may protrude from a lower portion of the nozzle unit, and an inner wall of the second heater block may have a coupling groove into which the coupling protrusion is inserted.

The first heater block and the second heater block have a half pipe shape and both side portions can be fastened by a clamping device.

A plurality of reflection plates may be radially provided between the inner wall of the first heater block and the second heater block and the heat line.

According to another embodiment of the present invention, there is provided a deposition apparatus for forming an organic thin film on a substrate, the deposition apparatus comprising: a vacuum chamber in which the substrate is placed; And an evaporation source disposed inside the vacuum chamber to face the substrate, the evaporation source supplying evaporation material for forming the organic thin film.

According to the present invention, it is possible to easily combine the heater portion surrounding the nozzle portion to prevent contamination of the vacuum chamber while improving the reproducibility of fabrication.

Further, by forming the cooling passage in the outer wall of the heater portion, excessive heating of the heater portion by the radiant heat can be prevented.

1 is a front view showing an evaporation source according to an embodiment of the present invention;
2 is a side view showing an evaporation source according to an embodiment of the present invention;
Figure 3 is a side view of a combined evaporation source in accordance with one embodiment of the present invention;
4 is a cross-sectional view illustrating the outer wall of the second heater block of the evaporation source in detail according to an embodiment of the present invention.
FIG. 5 is a schematic view showing a deposition apparatus according to an embodiment of the present invention. FIG.

While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail. It should be understood, however, that the invention is not intended to be limited to the particular embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Hereinafter, embodiments of an evaporation source and a deposition apparatus including the evaporation source according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a front view showing an evaporation source according to an embodiment of the present invention, FIG. 2 is a side view showing an evaporation source according to an embodiment of the present invention, and FIG. And FIG. 4 is a cross-sectional view showing the outer wall of the second heater block of the evaporation source according to an embodiment of the present invention in detail.

According to the present invention, an evaporation source according to the present invention comprises a crucible 10 in which an evaporation material is accommodated; A nozzle unit 20 coupled to an upper end of the crucible 10; And a heater unit (30,40) surrounding the nozzle unit (20) and heating the nozzle unit (20), wherein the heater unit (30,40) is coupled to the nozzle unit The first heater block 30 and the second heater block 40 may be provided. The first heater block 30 and the second heater block 40 include a housing 31, 41; And a heating line 47 supported on the inner surfaces of the housings 31 and 41. A cooling passage 46 may be accommodated in the outer walls of the housings 31 and 41. [

According to this configuration, the coated heater can be directly attached to the outer surface of the nozzle unit 20, and the first heater block 30 and the second heater block 40, which are separately manufactured in the form of a half pipe, The nozzle unit 20 can be heated only by merely positioning the nozzle unit 20 between the nozzle unit 20 and the nozzle unit 20 so that the productivity can be improved and the insulator 48 is not exposed to the outside, It is possible to suppress the phenomenon that impurities are generated within the semiconductor device 100.

The nozzle unit 20 is installed inside the vacuum chamber 100 and functions to provide evaporation particles for deposition on the substrate 110. The nozzle unit 20 includes a moving tube 21, a distribution tube 22, and an injection nozzle 23, ≪ / RTI >

The moving pipe 21 may be in the form of a tube and the lower end thereof may be coupled to be communicated with the open upper end of the crucible 10. The evaporated particles ejected from the crucible 10 are guided to the distribution pipe 22 through the moving pipe 21.

The distribution pipe 22 is in the form of a tube with both left and right ends clogged and is laterally coupled to the upper end of the moving pipe 21 to communicate with the moving pipe 21. The moving tube 21 and the distribution tube 22 coupled to each other have a substantially T shape. At the upper end of the distribution pipe 22, an injection nozzle 23 is formed in the longitudinal direction of the distribution pipe 22.

The injection nozzles 23 may be formed in a manner that a plurality of nozzle holes are spaced apart from each other in the longitudinal direction of the distribution pipe 22 or may be in the form of long slits formed in the longitudinal direction of the distribution pipe 22. In this embodiment, a plurality of nozzle holes are formed along the longitudinal direction of the distribution pipe 22 as the injection nozzle 23.

A coupling protrusion 24 protrudes from the bottom of the nozzle unit 20. A plurality of the coupling protrusions 24 may protrude from the lower portion of the nozzle unit 20. [ The coupling protrusion 24 is inserted into the coupling groove 44 formed in the inner wall of the second heater block 40 so that the nozzle unit 20 can be stably fixed to the second heater block 40.

As described above, when the nozzle unit 20 has a T shape as a whole, the heater units 30 and 40 also have a T shape. I have. More specifically, the first heater block 30 and the second heater block 40 having a half-pipe shape are coupled to each other to cover the T-shaped nozzle portion 20.

Meanwhile, the housings 31, 41 forming the outer surfaces of the first heater block 30 and the second heater block 40 can be made of tantalum (Ta) material. In this case, The inner surfaces of the first and second heat sinks 31 and 41 can also serve as a reflector for concentrating heat generated in the heat line 47 toward the nozzle unit 20. Holes (not shown) corresponding to the injection nozzles 23 of the nozzle unit 20 are formed in the housings 31 and 41 so that a path through which the evaporation particles can move toward the substrate 110 can be secured.

A support base 42 for supporting the heater units 30 and 40 may be provided under the second heater block 40. An engaging groove 44 is formed on the inner surface of the second heater block 40 to receive the engaging projection 24 as described above.

Referring to FIG. 3, the first heater block 30 and the second heater block 40 have a half pipe shape as described above, and both side portions can be fastened by the clamping device 32. The clamping device 32 may include a first heater block 30 and a second heater block 40 in the form of being hung on a protruding portion on both sides of the first heater block 30 or the second heater block 40, ).

Next, referring to FIG. 4, a cooling passage 46 may be formed in the outer wall of the housing 41. The cooling passage 46 is formed in the housing 41 of the second heater block 40. The present invention is not limited thereto and the cooling passage 46 may be formed in the housing 31 of the first heater block 30. [ May be formed. By forming the cooling passage 46 in the outer wall of the heater sections 30 and 40 in this manner, it is possible to prevent the heater sections 30 and 40 from being excessively heated by the radiant heat. A plurality of cooling passages 46 may be formed at predetermined intervals along the circumferential direction of the outer wall of the heater units 30 and 40.

Although the heat line 47 is not specifically shown in the drawing, the heat line 47 has a shape bent several times in a predetermined pattern, and heat can be generated in the heat line 47 by a power source applied through both ends of the heat line 47. At this time, patterns of the heat rays 47 provided in the first heater block 30 and the second heater block 40 may be different from each other. An insulator 48 may be provided on the outer side of the heat line 47.

A reflective plate 49 may be provided between the heat lines 47 and the inner walls of the first heater block 30 and the second heater block 40. The reflection plate 49 serves to concentrate the heat generated in the heating line 47 to the nozzle unit 20. A plurality of reflectors 49 may be radially arranged as shown in FIG.

Although the structure of the evaporation source according to the embodiment of the present invention has been described above, the evaporation source including the evaporation source will be described with reference to FIG. Since the structure and function of the evaporation source are the same as those already described above, the following description will focus on the remaining configuration.

Referring to FIG. 5, the apparatus for depositing an organic thin film on a substrate according to the present invention includes a vacuum chamber 100 in which the substrate 110 is placed; And an evaporation source disposed inside the vacuum chamber 100 so as to face the substrate 110 and supplying an evaporation material for forming the organic thin film.

The vacuum chamber 100 is a means for providing a reaction space in which a deposition process is performed in which an organic thin film is formed on the surface of the substrate 110. A vacuum atmosphere is maintained therein for evaporation of evaporation particles. The vacuum chamber 100 is provided with a seating portion 120 supported by a separate supporting means. The substrate 110 may be mounted on the lower portion of the seating portion 120 and supported.

A metal mask 130 having a predetermined pattern formed thereon is fixed to the bottom of the seating part 120 and the substrate 110 is fixed thereon via another fixing jig or the like. A separate magnet (not shown) is provided on the substrate 110 to closely contact the mask 130 and the substrate 110. Through this structure, only a part of the bottom surface of the substrate 110 is selectively exposed through the pattern formed on the mask 130.

The evaporation source 12, which is accommodated in the crucible 10, is heated to be transformed into evaporation particles, and then moved to a mask (not shown) 130 on the surface of the substrate 110.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. It belongs to the scope of right.

10: Crucible 12: Evaporation material
20: nozzle unit 21: moving tube
22: distribution pipe 23: injection nozzle
24: engaging projection 30: first heater block
31: housing 32: clamping device
40: second heater block 41: housing
42: Support base 44: Coupling groove
46: cooling channel 47: hot line
48: insulator 49: reflector
100: vacuum chamber 110: substrate
120: seat part 130: mask

Claims (6)

An evaporation source for supplying an evaporation material for forming an organic thin film on a substrate,
A crucible in which the evaporation material is accommodated;
A nozzle unit coupled to an upper end of the crucible; And
And a heater unit surrounding the nozzle unit and heating the nozzle unit,
Wherein the heater unit includes a first heater block and a second heater block coupled to each other to surround the nozzle unit,
The first heater block and the second heater block may include a first heater block,
housing; And
And a heating wire supported on the inner surface of the housing,
And a cooling channel is formed on the outer wall of the housing. The method according to claim 1,
And a support base is provided under the second heater block. The method according to claim 1,
Wherein an engaging protrusion is protruded from the lower portion of the nozzle portion, and an engaging groove is formed in the inner wall of the second heater block to receive the engaging protrusion. The method according to claim 1,
Wherein the first heater block and the second heater block have a half pipe shape and both side portions are fastened by a clamping device. The method according to claim 1,
Wherein a plurality of reflection plates are radially provided between the inner wall of the first heater block and the second heater block and between the heat lines. A deposition apparatus for forming an organic thin film on a substrate,
A vacuum chamber in which the substrate is seated; And
The evaporation apparatus according to any one of claims 1 to 5, which is disposed inside the vacuum chamber so as to face the substrate, and supplies evaporation material for forming the organic thin film.

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