KR20150044007A - Multifunctional acid anhydride, thermosetting resin composition, prepreg and cured article - Google Patents
Multifunctional acid anhydride, thermosetting resin composition, prepreg and cured article Download PDFInfo
- Publication number
- KR20150044007A KR20150044007A KR20140139111A KR20140139111A KR20150044007A KR 20150044007 A KR20150044007 A KR 20150044007A KR 20140139111 A KR20140139111 A KR 20140139111A KR 20140139111 A KR20140139111 A KR 20140139111A KR 20150044007 A KR20150044007 A KR 20150044007A
- Authority
- KR
- South Korea
- Prior art keywords
- anhydride
- group
- resin composition
- epoxy resin
- halide
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims abstract description 85
- 150000008065 acid anhydrides Chemical class 0.000 title claims abstract description 71
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 55
- -1 trimellitic acid halide anhydride Chemical class 0.000 claims abstract description 64
- 150000005846 sugar alcohols Polymers 0.000 claims abstract description 52
- ARCGXLSVLAOJQL-UHFFFAOYSA-N anhydrous trimellitic acid Natural products OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 claims abstract description 32
- 239000000203 mixture Substances 0.000 claims abstract description 31
- 150000001875 compounds Chemical class 0.000 claims abstract description 30
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 29
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 16
- 150000004292 cyclic ethers Chemical class 0.000 claims abstract description 15
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims abstract description 11
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 9
- 239000003822 epoxy resin Substances 0.000 claims description 48
- 229920000647 polyepoxide Polymers 0.000 claims description 48
- 150000004820 halides Chemical class 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 33
- 239000011521 glass Substances 0.000 claims description 29
- 239000000835 fiber Substances 0.000 claims description 26
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 25
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 claims description 22
- 239000004744 fabric Substances 0.000 claims description 21
- 239000003365 glass fiber Substances 0.000 claims description 15
- 125000003118 aryl group Chemical group 0.000 claims description 13
- 125000004432 carbon atom Chemical group C* 0.000 claims description 13
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims description 12
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 11
- 125000002768 hydroxyalkyl group Chemical group 0.000 claims description 11
- 239000004844 aliphatic epoxy resin Substances 0.000 claims description 10
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 7
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 claims description 6
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 4
- VBZYPJAXRLNOCG-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol;oxepan-2-one Chemical compound O=C1CCCCCO1.OCC(CO)(CO)COCC(CO)(CO)CO VBZYPJAXRLNOCG-UHFFFAOYSA-N 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- 150000008064 anhydrides Chemical class 0.000 claims description 3
- 239000010954 inorganic particle Substances 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 2
- 238000009987 spinning Methods 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 abstract description 18
- 239000000047 product Substances 0.000 description 53
- 238000001723 curing Methods 0.000 description 40
- 238000006243 chemical reaction Methods 0.000 description 35
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 32
- 239000002904 solvent Substances 0.000 description 31
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 27
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 14
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 13
- 239000003795 chemical substances by application Substances 0.000 description 13
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 13
- 239000000126 substance Substances 0.000 description 13
- 238000001035 drying Methods 0.000 description 12
- 239000007787 solid Substances 0.000 description 12
- 230000015572 biosynthetic process Effects 0.000 description 11
- 239000000243 solution Substances 0.000 description 11
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 239000003963 antioxidant agent Substances 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 238000003786 synthesis reaction Methods 0.000 description 10
- 238000004383 yellowing Methods 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 230000003078 antioxidant effect Effects 0.000 description 9
- 238000004040 coloring Methods 0.000 description 9
- 238000011156 evaluation Methods 0.000 description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000002966 varnish Substances 0.000 description 8
- 125000002723 alicyclic group Chemical group 0.000 description 7
- 239000000706 filtrate Substances 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 150000003839 salts Chemical class 0.000 description 7
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- WOWHHFRSBJGXCM-UHFFFAOYSA-M cetyltrimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCC[N+](C)(C)C WOWHHFRSBJGXCM-UHFFFAOYSA-M 0.000 description 6
- 239000012141 concentrate Substances 0.000 description 6
- 238000001914 filtration Methods 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- AOJFQRQNPXYVLM-UHFFFAOYSA-N pyridin-1-ium;chloride Chemical compound [Cl-].C1=CC=[NH+]C=C1 AOJFQRQNPXYVLM-UHFFFAOYSA-N 0.000 description 6
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 6
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 6
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 6
- HMUNWXXNJPVALC-UHFFFAOYSA-N 1-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C(CN1CC2=C(CC1)NN=N2)=O HMUNWXXNJPVALC-UHFFFAOYSA-N 0.000 description 5
- 238000005160 1H NMR spectroscopy Methods 0.000 description 5
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 5
- 125000004018 acid anhydride group Chemical group 0.000 description 5
- 125000001931 aliphatic group Chemical group 0.000 description 5
- 238000005227 gel permeation chromatography Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 4
- 239000012456 homogeneous solution Substances 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 238000010926 purge Methods 0.000 description 4
- 238000010992 reflux Methods 0.000 description 4
- 229930185605 Bisphenol Natural products 0.000 description 3
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 3
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 3
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
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- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 3
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- 125000004122 cyclic group Chemical group 0.000 description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 3
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- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 3
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- 239000004611 light stabiliser Substances 0.000 description 3
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- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
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- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
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- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- WMYINDVYGQKYMI-UHFFFAOYSA-N 2-[2,2-bis(hydroxymethyl)butoxymethyl]-2-ethylpropane-1,3-diol Chemical compound CCC(CO)(CO)COCC(CC)(CO)CO WMYINDVYGQKYMI-UHFFFAOYSA-N 0.000 description 2
- VMRIVYANZGSGRV-UHFFFAOYSA-N 4-phenyl-2h-triazin-5-one Chemical compound OC1=CN=NN=C1C1=CC=CC=C1 VMRIVYANZGSGRV-UHFFFAOYSA-N 0.000 description 2
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- 125000000217 alkyl group Chemical group 0.000 description 2
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- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
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- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- PWWSSIYVTQUJQQ-UHFFFAOYSA-N distearyl thiodipropionate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCCCCCC PWWSSIYVTQUJQQ-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- UNXHWFMMPAWVPI-ZXZARUISSA-N erythritol Chemical compound OC[C@H](O)[C@H](O)CO UNXHWFMMPAWVPI-ZXZARUISSA-N 0.000 description 1
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- 229940009714 erythritol Drugs 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
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- 238000005886 esterification reaction Methods 0.000 description 1
- AXCZRQHGMPTZPR-UHFFFAOYSA-N ethane-1,1,2,2-tetrol Chemical compound OC(O)C(O)O AXCZRQHGMPTZPR-UHFFFAOYSA-N 0.000 description 1
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- 239000010419 fine particle Substances 0.000 description 1
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- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- AMXRXGOSEWMPEF-UHFFFAOYSA-N hexane-1,2,5,6-tetrol Chemical compound OCC(O)CCC(O)CO AMXRXGOSEWMPEF-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- 229960001545 hydrotalcite Drugs 0.000 description 1
- 229910001701 hydrotalcite Inorganic materials 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 150000004694 iodide salts Chemical class 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- QLPMKRZYJPNIRP-UHFFFAOYSA-M methyl(trioctyl)azanium;bromide Chemical compound [Br-].CCCCCCCC[N+](C)(CCCCCCCC)CCCCCCCC QLPMKRZYJPNIRP-UHFFFAOYSA-M 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000003094 microcapsule Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- GXMIHVHJTLPVKL-UHFFFAOYSA-N n,n,2-trimethylpropanamide Chemical compound CC(C)C(=O)N(C)C GXMIHVHJTLPVKL-UHFFFAOYSA-N 0.000 description 1
- AJFDBNQQDYLMJN-UHFFFAOYSA-N n,n-diethylacetamide Chemical compound CCN(CC)C(C)=O AJFDBNQQDYLMJN-UHFFFAOYSA-N 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical class C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- 150000004780 naphthols Chemical class 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000004923 naphthylmethyl group Chemical group C1(=CC=CC2=CC=CC=C12)C* 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000012454 non-polar solvent Substances 0.000 description 1
- SJYNFBVQFBRSIB-UHFFFAOYSA-N norbornadiene Chemical compound C1=CC2C=CC1C2 SJYNFBVQFBRSIB-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- UHGIMQLJWRAPLT-UHFFFAOYSA-N octadecyl dihydrogen phosphate Chemical compound CCCCCCCCCCCCCCCCCCOP(O)(O)=O UHGIMQLJWRAPLT-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 150000007530 organic bases Chemical class 0.000 description 1
- 239000011146 organic particle Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 235000020232 peanut Nutrition 0.000 description 1
- MQYIQOANLHJLJN-UHFFFAOYSA-N pentane-1,1,5,5-tetrol Chemical compound OC(O)CCCC(O)O MQYIQOANLHJLJN-UHFFFAOYSA-N 0.000 description 1
- GYUPBLLGIHQRGT-UHFFFAOYSA-N pentane-2,4-dione;titanium Chemical compound [Ti].CC(=O)CC(C)=O GYUPBLLGIHQRGT-UHFFFAOYSA-N 0.000 description 1
- SGNLDVYVSFANHW-UHFFFAOYSA-N pentane-2,4-dione;zirconium Chemical compound [Zr].CC(=O)CC(C)=O SGNLDVYVSFANHW-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920006306 polyurethane fiber Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229960000380 propiolactone Drugs 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000031070 response to heat Effects 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- 235000019710 soybean protein Nutrition 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- JRMUNVKIHCOMHV-UHFFFAOYSA-M tetrabutylammonium bromide Chemical compound [Br-].CCCC[N+](CCCC)(CCCC)CCCC JRMUNVKIHCOMHV-UHFFFAOYSA-M 0.000 description 1
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 1
- LVEOKSIILWWVEO-UHFFFAOYSA-N tetradecyl 3-(3-oxo-3-tetradecoxypropyl)sulfanylpropanoate Chemical compound CCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCC LVEOKSIILWWVEO-UHFFFAOYSA-N 0.000 description 1
- BRKFQVAOMSWFDU-UHFFFAOYSA-M tetraphenylphosphanium;bromide Chemical compound [Br-].C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 BRKFQVAOMSWFDU-UHFFFAOYSA-M 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- SQBBHCOIQXKPHL-UHFFFAOYSA-N tributylalumane Chemical compound CCCC[Al](CCCC)CCCC SQBBHCOIQXKPHL-UHFFFAOYSA-N 0.000 description 1
- VLCLHFYFMCKBRP-UHFFFAOYSA-N tricalcium;diborate Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]B([O-])[O-].[O-]B([O-])[O-] VLCLHFYFMCKBRP-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical class OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- AISMNBXOJRHCIA-UHFFFAOYSA-N trimethylazanium;bromide Chemical compound Br.CN(C)C AISMNBXOJRHCIA-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- COIOYMYWGDAQPM-UHFFFAOYSA-N tris(2-methylphenyl)phosphane Chemical compound CC1=CC=CC=C1P(C=1C(=CC=CC=1)C)C1=CC=CC=C1C COIOYMYWGDAQPM-UHFFFAOYSA-N 0.000 description 1
- BSVBQGMMJUBVOD-UHFFFAOYSA-N trisodium borate Chemical compound [Na+].[Na+].[Na+].[O-]B([O-])[O-] BSVBQGMMJUBVOD-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
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-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D313/00—Heterocyclic compounds containing rings of more than six members having one oxygen atom as the only ring hetero atom
- C07D313/02—Seven-membered rings
- C07D313/04—Seven-membered rings not condensed with other rings
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D307/00—Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom
- C07D307/02—Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom not condensed with other rings
- C07D307/04—Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom not condensed with other rings having no double bonds between ring members or between ring members and non-ring members
- C07D307/06—Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom not condensed with other rings having no double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, directly attached to ring carbon atoms
- C07D307/08—Preparation of tetrahydrofuran
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
본 발명은, 다관능 산 무수물, 당해 다관능 산 무수물을 포함하는 열경화성 수지 조성물 및, 그의 경화물에 관한 것이다. 본 발명의 경화물은, 투명성, 내열성, 강인성, 내착색성이 우수한 특성을 갖는다. The present invention relates to a thermosetting resin composition comprising a polyfunctional acid anhydride, the polyfunctional acid anhydride, and a cured product thereof. The cured product of the present invention has properties that are excellent in transparency, heat resistance, toughness, and color proofness.
산 무수물은, 고열 안정성이나 투명성, 양호한 전기 특성 또는 내약품성 등과 함께, 축합체의 형성이나 반응성이 좋은 점 등, 가교제, 축합제 등으로서 우수한 성능을 구비하고 있어, 고분자 제조 원재료로서 널리 사용되고 있다. 또한 산 무수물은 에폭시 수지의 경화제로서도 사용할 수 있는 것이 알려져 있다. The acid anhydride has excellent performance as a crosslinking agent, a condensation agent and the like, such as high-temperature stability and transparency, good electrical properties or chemical resistance, and good formation of a condensate and reactivity, and is widely used as a raw material for producing a polymer. It is also known that the acid anhydride can also be used as a curing agent for an epoxy resin.
에폭시 수지를 함유하는 경화성 수지 조성물은, 내열성이 우수한 수지로서, 폭넓은 분야에서 이용되고 있다. 최근, 당해 조성물은 옵토일렉트로닉스 관련 분야에 있어서의 이용이 주목받고 있다. 특히 최근의 고도 정보화에 수반하여, 방대한 정보를 원활하게 전송, 처리하기 위해, 종래의 전기 배선에 의한 신호 전송으로 바뀌어, 광신호를 살린 기술이 개발되어 가는 가운데, 광도파로, 청색 LED 및, 광반도체 등의 광학 부품의 분야에 있어서는 투명성, 강인성 및 내열성이 우수한 경화물을 부여하는 수지 조성물의 개발이 요망되고 있다. A curable resin composition containing an epoxy resin is excellent in heat resistance and has been used in a wide range of fields. In recent years, the composition has been attracting attention for use in the field of optoelectronics. Particularly, along with recent high-level informationization, in order to smoothly transmit and process vast amount of information, signal transmission by a conventional electric wiring has been changed and technologies utilizing optical signals have been developed, and optical waveguides, blue LEDs, In the field of optical components such as semiconductors, development of a resin composition which gives a cured product excellent in transparency, toughness and heat resistance has been desired.
에폭시 수지를 함유하는 경화성 수지 조성물에 있어서의 산 무수물로서는, 방향족 산 무수물 및 지환식 산 무수물이 잘 알려져 있다. 방향족 산 무수물의 사용예로서는, 예를 들면, 특허문헌 1의 산 3무수물을 들 수 있다. 그러나, 이 화합물은 방향족 유래의 착색 및, 단파장의 광을 흡수하기 쉬워짐으로써, 투명성 및 내착색성이 충분하지 않다. 또한, 지환식 산 무수물의 사용예로서는, 예를 들면, 특허문헌 2의 메틸사이클로헥센디카본산 무수물, 특허문헌 3의 트리사이클로환을 갖는 테트라카본산 2무수물, 특허문헌 4의 에스테르기를 갖는 테트라카본산 2무수물을 들 수 있다. 이들 경화물은 높은 투명성을 부여하지만, 방향족 산 무수물과 비교하여 골격이 유연하고, 또한 2관능인 점에서 마찬가지로 내열성이 충분하지 않다. 또한, 특허문헌 5의 이소시아누레이트 화합물은 3관능이지만, 이소시아누레이트 유래의 착색에 의해 경화물의 투명성이 충분하지 않다. As the acid anhydrides in the curable resin composition containing an epoxy resin, aromatic acid anhydrides and alicyclic acid anhydrides are well known. An example of the use of an aromatic acid anhydride is an acid anhydride of Patent Document 1, for example. However, this compound is not sufficient in transparency and color resistance because it is easy to absorb coloration of aromatic origin and light of short wavelength. Examples of the use of the alicyclic acid anhydride include methylcyclohexene dicarboxylic anhydride of Patent Document 2, tetracarboxylic acid dianhydride having a tricyclo ring of Patent Document 3, tetracarboxylic acid having an ester group of Patent Document 4 2 anhydride. Although these cured products give high transparency, the heat resistance is not sufficient in view of flexibility of the skeleton and bifunctionality as compared with the aromatic acid anhydrides. Further, the isocyanurate compound of Patent Document 5 is trifunctional, but the transparency of the cured product is not sufficient due to the coloration derived from isocyanurate.
본 발명은, 강인성, 내열성, 투명성, 내착색성이 우수한 경화물을 부여하는 다관능 산 무수물, 및, 당해 다관능 산 무수물을 포함하는 열경화성 수지 조성물을 얻는 것을 과제로 한다. The object of the present invention is to obtain a thermosetting resin composition comprising a multifunctional acid anhydride and a multifunctional acid anhydride which give a cured product excellent in toughness, heat resistance, transparency and color resistance.
본 발명자들은, 적어도 1분자 중에 3개의 수산기를 갖는 다가 알코올과 핵수소 첨가 무수 트리멜리트산 할라이드 및 무수 트리멜리트산 할라이드의 혼합물 또는 핵수소 첨가 무수 트리멜리트산 할라이드와를 반응시켜 얻어지는 화합물이, 보다 높은 광학 특성을 유지하면서, 강인성이나 내열성, 내착색성을 갖는 경화물을 부여하는 것을 발견하여, 본 발명에 이르렀다. The present inventors have found that a compound obtained by reacting a mixture of a polyhydric alcohol having at least three hydroxyl groups in at least one molecule with a mixture of nuclear hydrogenated anhydrous trimellitic acid halide and anhydrous trimellitic acid halide or a nuclear hydrogenated anhydrous trimellitic acid halide The present inventors have found that a cured product having toughness, heat resistance, and color resistance is imparted while maintaining high optical characteristics, and thus the present invention has been accomplished.
즉, 본 발명은, 하기 일반식 (1):That is, the present invention provides a compound represented by the following general formula (1):
(식 중, R1, R2, R3, R4, R5, R6은 각각 독립적이고, R1, R3, R4, R5, R6은 수소 원자, 수산기, 탄소수 1∼11의 탄화수소기, 또는 탄소수 1∼4의 하이드록시알킬기를 나타내고, R2는 수산기, 또는 탄소수 1∼4의 하이드록시알킬기를 나타내고; l은 0∼11, m과 n은 각각 1∼11의 정수를 나타냄)로 나타나는 1분자 중에 적어도 3개의 수산기를 함유하는 다가 알코올 (A)와 핵수소 첨가 무수 트리멜리트산 할라이드 및 무수 트리멜리트산 할라이드의 혼합물 또는 핵수소 첨가 무수 트리멜리트산 할라이드와를 반응시켜 얻어지는 다관능 산 무수물에 관한 것이다. (Wherein, R 1, R 2, R 3, R 4, R 5, R 6 are independent, R 1, R 3, R 4, R 5, R 6 is a hydrogen atom, a hydroxyl group, having a carbon number of 1 to 11, respectively Or a hydroxyalkyl group having 1 to 4 carbon atoms; R 2 represents a hydroxyl group or a hydroxyalkyl group having 1 to 4 carbon atoms; l is 0 to 11; m and n each represent an integer of 1 to 11; (A) containing at least three hydroxyl groups in a molecule, a mixture of a nuclear hydrogenated anhydrous trimellitic acid halide and anhydrous trimellitic acid halide, or a mixture of a hydrogenated anhydrous trimellitic acid halide and a polyhydric alcohol Polyfunctional acid anhydride.
또한, 상기 다가 알코올 (A)에 알킬렌옥사이드, 환상 에테르 및, 환상 에스테르로 이루어지는 군으로부터 선택되는 1 이상을 반응시켜 얻어지는 다가 알코올 (B)와 핵수소 첨가 무수 트리멜리트산 할라이드 및 무수 트리멜리트산 할라이드의 혼합물 또는 핵수소 첨가 무수 트리멜리트산 할라이드와를 반응시켜 얻어지는 다관능 산 무수물에 관한 것이다.The polyhydric alcohol (B) obtained by reacting the polyhydric alcohol (A) with at least one selected from the group consisting of alkylene oxide, cyclic ether, and cyclic ester, a nuclease hydrogenated trimellitic acid halide and anhydrous trimellitic acid A halide-containing mixture or a nuclear hydrogenated anhydrous trimellitic acid halide.
또한, 상기 다가 알코올 (A) 또는 (B)의 수산기의 전체 수의 10% 이상 75% 이하가 무수 트리멜리트산 할라이드와 반응하고, 나머지의 수산기와 핵수소 첨가 무수 트리멜리트산 할라이드가 반응하여 얻어지는 다관능 산 무수물에 관한 것이다.Further, it is preferable that 10% to 75% of the total number of hydroxyl groups of the polyhydric alcohol (A) or (B) reacts with trimellitic anhydride halide and the remaining hydroxyl groups are reacted with the hydrogen peroxide-added trimellitic acid halide Polyfunctional acid anhydride.
또한, 일반식 (1)의 R1, R2, R3, R4, R5, R6이 탄소수 1∼4의 하이드록시알킬기인 상기 다가 알코올 (A) 또는 당해 다가 알코올 (A)에 알킬렌옥사이드, 환상 에테르 및, 환상 에스테르로 이루어지는 군으로부터 선택되는 1 이상을 반응시켜 얻어지는 다가 알코올 (B)와 핵수소 첨가 무수 트리멜리트산 할라이드 및 무수 트리멜리트산 할라이드의 혼합물 또는 핵수소 첨가 무수 트리멜리트산 할라이드와를 반응시켜 얻어지는 다관능 산 무수물에 관한 것이다.(A) wherein R 1 , R 2 , R 3 , R 4 , R 5 and R 6 in the general formula (1) are a hydroxyalkyl group having 1 to 4 carbon atoms or the alkyl group A mixture of a polyhydric alcohol (B) obtained by reacting at least one member selected from the group consisting of ethylene oxide, propylene oxide, isobutylene, ethylene oxide, propylene oxide, And a carboxylic acid anhydride.
또한, 상기 다가 알코올 (A) 또는 (B)가 3∼6가 알코올인 다관능 산 무수물에 관한 것이다.Further, the polyhydric alcohol (A) or (B) is a polyfunctional acid anhydride having 3 to 6 alcohols.
또한, 상기 다가 알코올 (A)가 트리메틸올 또는 디펜타에리트리톨인 다관능 산 무수물에 관한 것이다.Further, the present invention relates to a polyfunctional acid anhydride wherein the polyhydric alcohol (A) is trimethylol or dipentaerythritol.
또한, 상기 다가 알코올 (B)가 디펜타에리트리톨에틸렌옥사이드 부가물, 디펜타에리트리톨프로필렌옥사이드 부가물, 디펜타에리트리톨테트라하이드로푸란 부가물, 디펜타에리트리톨카프로락톤 부가물인 다관능 산 무수물에 관한 것이다.The polyhydric alcohol (B) may be added to the polyfunctional acid anhydride, which is a dipentaerythritol ethylene oxide adduct, dipentaerythritol propylene oxide adduct, dipentaerythritol tetrahydrofuran adduct, dipentaerythritol caprolactone adduct, .
또한, 상기 다가 알코올 (B)가 펜타에리트리톨 4몰 에틸렌옥사이드 부가물, 디펜타에리트리톨 6몰 에틸렌옥사이드 부가물, 디펜타에리트리톨 4몰 카프로락톤 부가물인 다관능 산 무수물에 관한 것이다.Further, the present invention relates to a polyfunctional acid anhydride wherein the polyhydric alcohol (B) is a pentaerythritol 4 mole ethylene oxide adduct, a dipentaerythritol 6 mole ethylene oxide adduct, or a dipentaerythritol 4 moles caprolactone adduct.
또한, 1분자 중에 적어도 1개의 에폭시기를 갖는 화합물과 상기 다관능 산 무수물을 포함하는 열경화성 수지 조성물에 관한 것이다.Further, the present invention relates to a thermosetting resin composition comprising a compound having at least one epoxy group in a molecule and the polyfunctional acid anhydride.
또한, 상기 1분자 중에 적어도 1개의 에폭시기를 갖는 화합물이 지방족형 에폭시 수지, 방향족형 에폭시 수지 및 공중합형 에폭시 수지로부터 선택되는 1종 이상인, 상기 다관능 산 무수물을 포함하는 열경화성 수지 조성물에 관한 것이다.The present invention also relates to a thermosetting resin composition comprising the polyfunctional acid anhydride, wherein the compound having at least one epoxy group in one molecule is at least one selected from an aliphatic epoxy resin, an aromatic epoxy resin and a copolymerizable epoxy resin.
또한, 상기 1분자 중에 적어도 1개의 에폭시기를 갖는 화합물이 지방족형 에폭시 수지 및 방향족형 에폭시 수지로부터 선택되는 1종 이상인, 상기 다관능 산 무수물을 포함하는 열경화성 수지 조성물에 관한 것이다.The present invention also relates to a thermosetting resin composition comprising the polyfunctional acid anhydride, wherein the compound having at least one epoxy group in one molecule is at least one selected from an aliphatic epoxy resin and an aromatic epoxy resin.
또한, 상기 지방족형 에폭시 수지가 지방족 환상 구조를 갖는 에폭시 수지인, 상기 다관능 산 무수물을 포함하는 열경화성 수지 조성물에 관한 것이다.Further, the present invention relates to a thermosetting resin composition comprising the polyfunctional acid anhydride, wherein the aliphatic epoxy resin is an epoxy resin having an aliphatic cyclic structure.
또한, 상기 방향족형 에폭시 수지가 (4-(4-(1,1-비스(p-하이드록시페닐)-에틸)-α,α-디메틸벤질)페놀)형 에폭시 수지 및 비스페놀 A 에폭시 수지로부터 선택되는 1종 이상인, 상기 다관능 산 무수물을 포함하는 열경화성 수지 조성물에 관한 것이다.Further, when the aromatic epoxy resin is selected from (4- (1,1-bis (p-hydroxyphenyl) -ethyl) -?,? - dimethylbenzyl) phenol type epoxy resin and bisphenol A epoxy resin Wherein the polyfunctional acid anhydride is at least one selected from the group consisting of polyfunctional acid anhydrides.
또한, 상기 1분자 중에 적어도 1개의 에폭시기를 갖는 화합물이 공중합형 에폭시 수지인, 상기 다관능 산 무수물을 포함하는 열경화성 수지 조성물에 관한 것이다.The present invention also relates to a thermosetting resin composition comprising the polyfunctional acid anhydride, wherein the compound having at least one epoxy group in one molecule is a copolymerizable epoxy resin.
또한, 상기 다가 알코올 (A), 무수 트리멜리트산 할라이드 및 핵수소 첨가 무수 트리멜리트산 할라이드에 상용(相溶)되지 않는 입자 (C-1) 또는 섬유 (C-2)를 포함하는 열경화성 수지 조성물에 관한 것이다.The thermosetting resin composition comprising the polyvalent alcohol (A), the trimellitic anhydride halide, and the particles (C-1) or the fibers (C-2) not compatible with the nucleus hydrogenated trimellitic acid halide .
또한, 상기 입자 (C-1)이 무기 입자인 상기 열경화성 수지 조성물에 관한 것이다.Further, the present invention relates to the thermosetting resin composition wherein the particles (C-1) are inorganic particles.
또한, 상기 섬유 (C-2)가 유리 섬유인 상기 열경화성 수지 조성물에 관한 것이다.Further, the present invention relates to the thermosetting resin composition wherein the fiber (C-2) is glass fiber.
또한, 상기 섬유 (C-2)가 유리 섬유를 방사(紡絲)하고, 추가로 직제(織製)하여 이루어지는 유리 크로스인 상기 열경화성 수지 조성물에 관한 것이다.Further, the present invention relates to the above-mentioned thermosetting resin composition, wherein the fiber (C-2) is a glass cloth made by spinning a glass fiber and further forming a woven fabric.
또한, 상기 열경화성 수지 조성물을 반(半)경화 상태로 형상을 부여한 프리프레그에 관한 것이다.The present invention also relates to a prepreg in which the shape of the thermosetting resin composition is given in a semi-cured state.
또한, 상기 열경화성 수지 조성물에 용제를 첨가한 바니시에 관한 것이다.Further, the present invention relates to a varnish obtained by adding a solvent to the thermosetting resin composition.
또한, 상기 열경화성 수지 조성물을 경화시킨 경화물에 관한 것이다.The present invention also relates to a cured product obtained by curing the thermosetting resin composition.
또한, 경화 후의 열경화성 수지와 입자 (C-1) 또는 섬유 (C-2)의 광학적 굴절률의 차이가, 0.005 이하인 상기 열경화성 수지 경화물에 관한 것이다.The present invention also relates to a thermosetting resin cured product in which the difference in optical refractive index between the thermosetting resin after curing and the particle (C-1) or the fiber (C-2) is 0.005 or less.
본 발명의 다관능 산 무수물은 에폭시 수지의 경화제로서 이용할 수 있다. 본 발명의 열경화성 수지 조성물은 안정성이 양호하고, 본 발명의 경화물은 투명성이나 강인성, 내열성, 내착색성이 우수하여, 토목 건축용의 도료나 FRP, 그리고, 프린트 배선판·반도체 분야 등에 있어서의 도료, 레지스트 잉크, 접착제, 시일제, 봉지제 등의 전기 전자 재료, 나아가서는 높은 투명성이 요구되는 LED 봉지제나 광도파로, 액정 디스플레이, 플라즈마 디스플레이, EL 디스플레이, 휴대 기기 등의 표시 장치나 태양 전지 등에 적합하다. The polyfunctional acid anhydride of the present invention can be used as a curing agent for an epoxy resin. The thermosetting resin composition of the present invention is excellent in stability and the cured product of the present invention is excellent in transparency, toughness, heat resistance, and coloring resistance, and can be applied to coatings for civil engineering construction, FRP, printed wiring boards, It is suitable for an electric and electronic material such as an ink, an adhesive, a sealant, a sealing agent and the like, and also for a display device such as an LED encapsulant, an optical waveguide, a liquid crystal display, a plasma display, an EL display,
도 1은 실시예 1-1에서 얻어진 다관능 산 무수물의, 1H-NMR 스펙트럼 차트이다.
도 2는 실시예 1-6에서 얻어진 다관능 산 무수물의, 1H-NMR 스펙트럼 차트이다. 1 is a 1 H-NMR spectrum chart of the polyfunctional acid anhydride obtained in Example 1-1.
2 is a 1 H-NMR spectrum chart of the polyfunctional acid anhydride obtained in Example 1-6.
(발명을 실시하기 위한 형태)(Mode for carrying out the invention)
본 발명에 있어서 이용되는 다가 알코올 (A)란, 하기의 구조를 갖고, 적어도 1분자 중에 3개의 수산기를 갖는 화합물이다. The polyhydric alcohol (A) used in the present invention is a compound having the following structure and having three hydroxyl groups in at least one molecule.
하기 일반식 (1):(1): < EMI ID =
(식 중, R1, R2, R3, R4, R5, R6은 각각 독립적이고, R1, R3, R4, R5, R6은 수소 원자, 수산기, 탄소수 1∼11의 탄화수소기, 또는 탄소수 1∼4의 하이드록시알킬기를 나타내고, R2는 수산기, 또는 탄소수 1∼4의 하이드록시알킬기를 나타내고; l은 0∼11, m과 n은 1∼11의 정수를 나타냄). (Wherein, R 1, R 2, R 3, R 4, R 5, R 6 are independent, R 1, R 3, R 4, R 5, R 6 is a hydrogen atom, a hydroxyl group, having a carbon number of 1 to 11, respectively Or a hydroxyalkyl group having 1 to 4 carbon atoms; R 2 represents a hydroxyl group or a hydroxyalkyl group having 1 to 4 carbon atoms; l is 0 to 11; m and n each represent an integer of 1 to 11; ).
상기 일반식 (1)에 있어서, 1 또는 m이 2 이상인 경우, 복수 존재하게 되는 R1, R3, R4, R6은, 각각의 R1, R3, R4, R6이 상이한 치환기를 취해도 좋다. 예를 들면, 1=2인 경우, 4개 존재하는 R1은 4개가 동일한 치환기라도, 일부가 동일하고 그 외가 상이해도 좋고, 전부 상이한 치환기라도 좋다. R3, R4, R6에 대해서도 R1과 동일하다.R 1 , R 3 , R 4 and R 6 which are plural exist in the general formula (1), when R 1 , R 3 , R 4 and R 6 are different from each other, . For example, when 1 = 2, four R 1 groups may be the same substituent, some of them may be the same or different, or all substituents may be different. R 3 , R 4 and R 6 are also the same as R 1 .
다가 알코올 (A)의 구체예로서는, 글리세린, 트리메틸올에탄, 트리메틸올프로판, 트리메틸올부탄, 1,2,4-부탄트리올, 2-하이드록시-2-메틸-1,4-부탄디올, 1,2,5-펜탄트리올, 1,3,5-펜탄트리올, 3-메틸펜탄-1,3,5-트리올, 1,2,6-헥산트리올, 1,2,8-옥탄트리올, 1,2,9-노난트리올, 1,2,10-데칸트리올 등의 트리올류, 1,1,2,2-에탄테트라올, 디트리메틸올프로판, 에리트리톨, 펜타에리트리톨, 1,2,3,5-펜탄테트라올, 1,2,4,5-펜탄테트라올, 1,1,5,5-펜탄테트라올, 1,2,5,6-헥산테트라올, 1,2,7,8-옥탄테트라올, 1,2,9,10-데칸테트라올 등의 테트라올류, 디펜타에리트리톨, 폴리글리세린 등의 폴리올 등을 들 수 있다. Specific examples of the polyhydric alcohol (A) include glycerin, trimethylolethane, trimethylolpropane, trimethylolbutane, 1,2,4-butanetriol, 2-hydroxy- 2,5-pentanetriol, 1,3,5-pentanetriol, 3-methylpentane-1,3,5-triol, 1,2,6-hexanetriol, 1,2,8- Triethanol, 1,1,2,2-ethanetetraol, ditrimethylol propane, erythritol, pentaerythritol, pentaerythritol, 1,2,3,5-pentanetetraol, 1,2,4,5-pentanetetraol, 1,1,5,5-pentanetetraol, 1,2,5,6-hexanetetraol, Tetraols such as 2,7,8-octanetetraol and 1,2,9,10-decanetetraol, polyols such as dipentaerythritol and polyglycerin, and the like.
이들 중, 1분자 중에 3∼6개의 수산기를 갖는 다가 알코올을 이용한 것이 경화제로서 우수하다. 특히 펜타에리트리톨, 디트리메틸올프로판, 디펜타에리트리톨이, 상기 경화제를 이용하여 경화한 경화물의 특성의 양호함, 재료의 입수의 용이함에서 바람직하다. Of these, use of a polyhydric alcohol having 3 to 6 hydroxyl groups in one molecule is excellent as a curing agent. Particularly preferred are pentaerythritol, ditrimethylol propane and dipentaerythritol because of good properties of the cured product cured using the above-mentioned curing agent and ease of obtaining the material.
본 발명에 있어서 다가 알코올 (B)란, 다가 알코올 (A)에 알킬렌옥사이드, 환상 에테르, 및, 환상 에스테르로 이루어지는 군으로부터 선택되는 어느 1개 이상을 부가 중합시킨 화합물을 가리킨다. 또한, 다가 알코올 (B)는 반응성이나 경화물의 특성을 용도에 따라서 최적화할 수도 있다. In the present invention, the polyhydric alcohol (B) refers to a compound obtained by addition polymerization of at least one member selected from the group consisting of alkylene oxide, cyclic ether, and cyclic ester to the polyhydric alcohol (A). In addition, the polyhydric alcohol (B) may be optimized for reactivity or the properties of the cured product depending on the application.
다가 알코올 (B)의 구체예로서는, 트리메틸올프로판에틸렌옥사이드 부가물, 트리메틸올프로판프로필렌옥사이드 부가물, 트리메틸올프로판테트라하이드로푸란 부가물, 트리메틸올프로판카프로락톤 부가물, 펜타에리트리톨에틸렌옥사이드 부가물, 펜타에리트리톨프로필렌옥사이드 부가물, 펜타에리트리톨테트라하이드로푸란 부가물, 펜타에리트리톨카프로락톤 부가물, 디펜타에리트리톨에틸렌옥사이드 부가물, 디펜타에리트리톨프로필렌옥사이드 부가물, 디펜타에리트리톨테트라하이드로푸란 부가물, 디펜타에리트리톨카프로락톤 부가물 등을 들 수 있다.Specific examples of the polyhydric alcohol (B) include trimethylolpropane ethylene oxide adduct, trimethylolpropane propylene oxide adduct, trimethylolpropane tetrahydrofuran adduct, trimethylolpropane caprolactone adduct, pentaerythritol ethylene oxide adduct, Pentaerythritol tetrafluoroethylene, pentaerythritol propylene oxide adduct, pentaerythritol tetrahydrofuran adduct, pentaerythritol caprolactone adduct, dipentaerythritol ethylene oxide adduct, dipentaerythritol propylene oxide adduct, dipentaerythritol tetrahydrofuran Adducts, dipentaerythritol caprolactone adducts, and the like.
R1, R3, R4, R5, R6에 있어서의 탄화수소기란 탄소 원자와 수소 원자만으로 구성되는 원자단을 가리킨다. The hydrocarbon group in R 1 , R 3 , R 4 , R 5 and R 6 is an atomic group composed of only carbon atoms and hydrogen atoms.
탄화수소기의 탄소수는 1∼11이 바람직하다. 구체예로서는, 메틸기, 에틸기, n-프로필기, i-프로필기, n-부틸기, i-부틸기, t-부틸기, 직쇄 또는 분지의 펜틸기, 직쇄 또는 분지의 헥실기, 직쇄 또는 분지의 헵틸기, 직쇄 또는 분지의 옥틸기 등의 지방족 탄화수소기나, 사이클로헥실기, 메틸사이클로헥실기, 에틸사이클로헥실기 등의 지환식 탄화수소기나, 페닐기, 톨릴기, 나프틸기, 메틸나프틸기 등의 방향족기, 벤질기, 나프틸메틸기 등의 방향족 치환 알킬기 등을 들 수 있다. 이 중 본 발명에 있어서는, 본 발명의 경화물의 투명성이 양호한 점에서 지방족 탄화수소기나 지환식 탄화수소기가 바람직하고, 메틸기와 에틸기가 강인성과 내열성이 양호한 본 발명의 경화물을 부여하는 점에서 보다 바람직하다. The number of carbon atoms of the hydrocarbon group is preferably 1 to 11. Specific examples include a methyl group, an ethyl group, an n-propyl group, an i-propyl group, an n-butyl group, an i-butyl group, a t-butyl group, a linear or branched pentyl group, A cyclohexyl group, an ethyl cyclohexyl group, or an alicyclic hydrocarbon group such as a phenyl group, a tolyl group, a naphthyl group or a methyl naphthyl group, or an aliphatic hydrocarbon group such as a methyl group, , Benzyl group, naphthylmethyl group, and other aromatic substituted alkyl groups. Among them, an aliphatic hydrocarbon group or an alicyclic hydrocarbon group is preferable in view of good transparency of the cured product of the present invention, and the methyl group and the ethyl group are more preferable in terms of giving the cured product of the present invention having good toughness and heat resistance.
R1, R2, R3, R4, R5, R6에 있어서의 하이드록시알킬기란, 직쇄상, 분기상 알킬기의 수소 원자 중 1개 이상이 수산기로 치환되어 있는 원자단을 가리킨다. The hydroxyalkyl group in R 1 , R 2 , R 3 , R 4 , R 5 and R 6 means an atomic group in which at least one hydrogen atom of a linear or branched alkyl group is substituted with a hydroxyl group.
하이드록시알킬기의 탄소수는 1∼4가 바람직하다. 구체예로서는, 메틸기, 에틸기, n-프로필기, 이소프로필기, n-부틸기 및 이소부틸기의 수소 원자 중 1개 또는 2개 이상이 수산기로 치환된 것을 들 수 있다. 이 중 본 발명에 있어서는, 반응이 용이한 점에서, 수산기가 말단 탄소에 1개 치환된 것이 바람직하다. 하이드록시메틸기, 하이드록시에틸기가 본 발명의 경화물의 강인성과 내열성이 양호한 점에서 보다 바람직하다. The number of carbon atoms of the hydroxyalkyl group is preferably 1 to 4. Specific examples thereof include those in which one or two or more hydrogen atoms of a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group and an isobutyl group are substituted with a hydroxyl group. Among them, in the present invention, it is preferable that one hydroxyl group is substituted for the terminal carbon in view of easy reaction. A hydroxymethyl group and a hydroxyethyl group are more preferred because the hardenability and the heat resistance of the cured product of the present invention are good.
본 발명에 있어서 이용되는 알킬렌옥사이드란, 3원환의 환상 에테르를 갖는 화합물을 가리킨다. The alkylene oxide used in the present invention refers to a compound having a cyclic ether of a three-membered ring.
알킬렌옥사이드의 탄소수는 2∼8이 바람직하다. 예를 들면, 에틸렌옥사이드, 프로필렌옥사이드, 부틸렌옥사이드, 스티렌옥사이드 등을 들 수 있다. 이들 알킬렌옥사이드는 1종 또는 필요에 따라서 2종 이상을 혼합한 것이라도 좋다. 그 중에서도, 에틸렌옥사이드, 프로필렌옥사이드로부터 선택되는 적어도 1종이면, 입수하기 쉽고, 염가이기 때문에 본 발명에 있어서 바람직하다. The alkylene oxide preferably has 2 to 8 carbon atoms. Examples thereof include ethylene oxide, propylene oxide, butylene oxide, styrene oxide and the like. These alkylene oxides may be one kind or a mixture of two or more kinds as required. Of these, at least one kind selected from ethylene oxide and propylene oxide is preferable in the present invention since it is easily available and inexpensive.
알킬렌옥사이드의 사용량은, 다가 알코올 (A)의 수산기 1당량에 대하여, 통상, 3원환의 환상 에테르 0.1∼6.0당량, 바람직하게는, 0.2∼2.0당량이다. 이 범위이면 얻어지는 경화물의 내열성 및 강인성이 양호하다. The amount of the alkylene oxide to be used is generally 0.1 to 6.0 equivalents, preferably 0.2 to 2.0 equivalents of a cyclic ether of a 3-membered ring, per 1 equivalent of the hydroxyl group of the polyhydric alcohol (A). Within this range, the resulting cured product has good heat resistance and toughness.
본 발명에 있어서 이용되는 환상 에테르란, 4원환 이상의 환상의 탄화수소 중 1개 이상의 탄소가 산소로 치환된 구조를 갖는 화합물이면 특별한 한정은 없다. The cyclic ether used in the present invention is not particularly limited as long as it is a compound having a structure in which at least one carbon among cyclic hydrocarbons having 4 or more rings is substituted with oxygen.
환상 에테르는 4∼6원환이 바람직하고, 구체예로서는 옥세탄, 테트라하이드로푸란, 테트라하이드로피란 등을 들 수 있다. 이들 환상 에테르는 1종 또는 필요에 따라서 2종 이상을 혼합한 것이라도 좋다. 그 중에서도, 테트라하이드로푸란은 입수하기 쉽고, 염가이기 때문에 본 발명에 있어서 바람직하다. The cyclic ether is preferably a 4- to 6-membered ring, and specific examples thereof include oxetane, tetrahydrofuran and tetrahydropyran. These cyclic ethers may be one kind or a mixture of two or more kinds as required. Among them, tetrahydrofuran is preferable in the present invention because it is easily available and inexpensive.
환상 에테르의 사용량은, 다가 알코올 (A)의 수산기 1당량에 대하여, 환상 에테르 0.1∼6.0당량, 바람직하게는, 0.2∼2.0당량이다. 이 범위이면 얻어지는 경화물의 내열성 및 강인성이 양호하다. The amount of the cyclic ether to be used is 0.1 to 6.0 equivalents, preferably 0.2 to 2.0 equivalents, of a cyclic ether to 1 equivalent of the hydroxyl group of the polyhydric alcohol (A). Within this range, the resulting cured product has good heat resistance and toughness.
본 발명에 있어서 이용되는 환상 에스테르란, 환상의 탄화수소 중에 에스테르 결합을 포함하는 구조를 갖는 화합물이면 특별한 한정은 없다. The cyclic ester used in the present invention is not particularly limited as long as it is a compound having a structure containing an ester bond in cyclic hydrocarbons.
환상 에스테르의 탄소수는 2∼6인 것이 바람직하다. 환상 에스테르의 구체예로서는 아세트락톤, 프로피오락톤, 부티로락톤, 발레로락톤, 카프로락톤 등을 들 수 있다. 이들 환상 에스테르는 1종 또는 필요에 따라서 2종 이상을 혼합한 것이라도 좋다. 그 중에서도, 카프로락톤은 입수하기 쉽고, 염가이기 때문에 본 발명에 있어서 바람직하다. The cyclic ester preferably has 2 to 6 carbon atoms. Specific examples of cyclic esters include acetolactone, propiolactone, butyrolactone, valerolactone and caprolactone. These cyclic esters may be one kind or a mixture of two or more kinds as required. Among them, caprolactone is preferable in the present invention because it is easily available and inexpensive.
환상 에스테르의 사용량은, 다가 알코올 (A)의 수산기 1당량에 대하여, 환상 에스테르 0.1∼6.0당량, 바람직하게는, 0.2∼2.0당량이다. 이 범위이면 얻어지는 경화물의 내열성 및 강인성이 양호하다. The cyclic ester is used in an amount of 0.1 to 6.0 equivalents, preferably 0.2 to 2.0 equivalents, per 1 equivalent of the hydroxyl group of the polyhydric alcohol (A). Within this range, the resulting cured product has good heat resistance and toughness.
본 발명에 있어서 이용되는 무수 트리멜리트산 할라이드(1,2,4-벤젠트리카본산-1,2-무수물 할라이드)란, 다가 알코올에 산 무수물기를 도입하고, 다관능 산 무수물 화합물로 하기 위해 이용된다. 이에 따라, 산 무수물기의 개환 에스테르화를 수반하는 일 없이, 산 무수물기를 도입할 수 있다. 또한 방향족 유래의 강직한 골격으로부터 내열성이 우수하다. The anhydrous trimellitic acid halide (1,2,4-benzenetricarboxylic acid-1,2-anhydride halide) used in the present invention is used for introducing an acid anhydride group into a polyhydric alcohol and converting it into a polyfunctional acid anhydride compound do. Accordingly, the acid anhydride group can be introduced without carrying out the ring-opening esterification of the acid anhydride group. It is also excellent in heat resistance from a rigid skeleton derived from an aromatic.
본 발명에 있어서 이용되는 핵수소 첨가 무수 트리멜리트산 할라이드(사이클로헥산-1,2,4-트리카본산-1,2-무수물 할라이드)란, 상기 무수 트리멜리트산 할라이드와 동일한 목적으로 이용된다. 또한 핵수소 첨가되어 있는 점에서, 내열, 내광하에 있어서도 착색이 적고, 그 경화물은 높은 광학 특성을 유지하면서, 강인성이 우수하다. Nucleus hydrogenated anhydrous trimellitic acid halide (cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride halide) used in the present invention is used for the same purpose as the anhydrous trimellitic acid halide. In addition, since it is added with nuclear hydrogen, it is less discolored even in heat resistance and light resistance, and the cured product is excellent in toughness while maintaining high optical characteristics.
무수 트리멜리트산 할라이드 및 핵수소 첨가 무수 트리멜리트산 할라이드로서는, 예를 들면, 불소화물, 염소화물, 브롬화물 및 요오드화물 등을 들 수 있고, 그 중에서도 반응의 용이함에서 염소화물이 바람직하다. Examples of the trimellitic anhydride halide and the hydrogenated trimellitic anhydride halide include fluorides, chlorides, bromides and iodides. Of these, chlorides are preferred for ease of reaction.
본 발명에 있어서 무수 트리멜리트산 할라이드 및 핵수소 첨가 무수 트리멜리트산 할라이드의 혼합물의 사용 몰비율은 총 몰수를 100으로 하면, 1:99∼99:1, 바람직하게는 30:70∼70:30이다. 다가 알코올 (A) 또는 (B)의 수산기와 무수 트리멜리트산 할라이드 및 핵수소 첨가 무수 트리멜리트산 할라이드의 혼합물과의 반응 비율은 대략, 무수 트리멜리트산 할라이드와 핵수소 첨가 무수 트리멜리트산 할라이드의 몰비율에 일치한다. 본 발명의 다관능 산 무수물로서는, 상기 다가 알코올 (A) 또는 (B)의 수산기의 전체 수의 5% 이상 95% 이하가 무수 트리멜리트산 할라이드와 반응하고, 나머지의 수산기와 핵수소 첨가 무수 트리멜리트산 할라이드가 반응한 것이며, 바람직하게는 상기 다가 알코올 (A) 또는 (B)의 수산기의 전체 수의 10% 이상 75% 이하가 무수 트리멜리트산 할라이드와 반응하고, 나머지의 수산기와 핵수소 첨가 무수 트리멜리트산 할라이드가 반응한 것이다. In the present invention, the molar ratio of the used trimellitic anhydride halide and the hydrogenated trimellitic anhydride halide is 1: 99 to 99: 1, preferably 30: 70 to 70: 30, to be. The reaction ratio of the hydroxyl group of the polyhydric alcohol (A) or (B) with the mixture of the trimellitic acid anhydride halide and the nucleus hydrogenated trimellitic acid halide is approximately the ratio of the trimellitic anhydride halide to the nuclease hydrogenated trimellitic acid halide Molar ratio. As the polyfunctional acid anhydride of the present invention, at least 5 to 95% of the total number of hydroxyl groups of the polyhydric alcohol (A) or (B) reacts with anhydrous trimellitic acid halide, and the remaining hydroxyl groups and N- Preferably at least 10% but not more than 75% of the total number of hydroxyl groups of the polyhydric alcohol (A) or (B) is reacted with anhydrous trimellitic acid halide, and the remaining hydroxyl groups and nuclear hydrogen addition And anhydrous trimellitic acid halide.
본 발명의 다관능 산 무수물의 합성은, 공지의 수법에 의해 행할 수 있다. 다가 알코올 (A) 또는 (B)와 무수 트리멜리트산 할라이드 및 핵수소 첨가 무수 트리멜리트산 할라이드의 혼합물 또는 핵수소 첨가 무수 트리멜리트산 할라이드(이하 「할라이드류」라고 함)와의 반응에 있어서의 각 화합물의 첨가법에는 특별히 제한이 없으며, 임의의 첨가법을 채용할 수 있다. 예를 들면, 다가 알코올 (A) 또는 (B)와 염기성 물질을 용매에 용해하고, 여기에 용매에 용해한 상기의 할라이드류를 천천히 적하하는 방법, 혹은, 역으로 필요에 따라서 용매에 용해한 상기의 할라이드류 중에 다가 알코올 (A) 또는 (B)와 염기성 물질의 혼합 용액을 적하하는 방법, 할라이드류와 다가 알코올 (A) 또는 (B)의 혼합 용액 중으로 염기성 물질을 적하하는 방법, 나아가서는, 다가 알코올 (A) 또는 (B)의 용액 중에 할라이드류의 용액과 염기성 물질의 용액을 동시에 적하하는 방법 등이 채용 가능하다. The synthesis of the polyfunctional acid anhydride of the present invention can be carried out by a known method. In the reaction of the polyhydric alcohol (A) or (B) with a mixture of anhydrous trimellitic acid halide and nuclear hydrogenated anhydrous trimellitic acid halide or with a hydrogenated anhydrous trimellitic acid halide (hereinafter referred to as "halide") The method of adding the compound is not particularly limited, and any addition method may be employed. For example, a method of dissolving a polyhydric alcohol (A) or (B) and a basic substance in a solvent and then slowly adding the halide in the solvent, or conversely, the above-mentioned halide A method in which a mixed solution of a polyhydric alcohol (A) or a basic substance (B) and a basic substance is dropped in a stream, a method in which a basic substance is dropped into a mixed solution of a halide and a polyhydric alcohol (A) or (B) A method in which a solution of a halide and a solution of a basic substance are simultaneously dripped into the solution of (A) or (B).
염기성 물질 존재하의 다가 알코올 (A) 또는 (B)와 할라이드류와의 반응에서는, 반응의 진행과 동시에 염기성 물질이 중화되어 생성된 염산염이 발생한다. 이 염산염을 여과하여 제거한 후, 여과액을 농축함으로써, 본 발명의 다관능 산 무수물의 조(粗)생성물이 고수율로 얻어진다. 이것을, 적당한 용매에 용해하고, 물세정 후 농축하고 나서 감압 건조하면 순도가 높은 다관능 산 무수물이 얻어진다. 또한 필요에 따라서 적당한 용매로 재결정을 행함으로써, 보다 순도가 높은 다관능 산 무수물이 얻어진다. In the reaction of a polyhydric alcohol (A) or (B) in the presence of a basic substance with a halide, a basic substance is neutralized at the same time as the reaction progresses, thereby generating a hydrochloride. The hydrochloride is removed by filtration, and the filtrate is concentrated to obtain a crude product of the polyfunctional acid anhydride of the present invention at a high yield. This is dissolved in an appropriate solvent, washed with water, concentrated, and then dried under reduced pressure to obtain a polyfunctional acid anhydride having a high purity. If necessary, recrystallization is carried out with a suitable solvent to obtain a polyfunctional acid anhydride having a higher purity.
다가 알코올 (A) 또는 (B)의 사용량은 통상 수산기 당량으로, 무수 트리멜리트산 할라이드 및 핵수소 첨가 무수 트리멜리트산 할라이드의 혼합물의 수산기 당량의 합을 1.0으로 했을 때, 또는 핵수소 첨가 무수 트리멜리트산 할라이드의 수산기 당량을 1.0으로 했을 때에, 0.6∼1.0, 바람직하게는, 0.8∼1.0이다. 이 범위이면 다가 알코올 (A) 또는 (B)의 수산기는 모두 에스테르화되어, 무수 트리멜리트산 할라이드, 핵수소 첨가 무수 트리멜리트산 할라이드가 계 내에 남는 일은 없다. The amount of the polyhydric alcohol (A) or (B) to be used is usually the hydroxyl group equivalent, and when the sum of the hydroxyl equivalent of the mixture of the trimellitic anhydride halide and the hydrogenated anhydrous trimellitic acid halide is 1.0, When the hydroxyl group equivalent of the melitic acid halide is 1.0, it is 0.6 to 1.0, preferably 0.8 to 1.0. Within this range, the hydroxyl groups of the polyhydric alcohol (A) or (B) are all esterified, and the anhydrous trimellitic acid halide and the hydrogenated anhydrous trimellitic acid halide are not left in the system.
할라이드류와 다가 알코올 (A) 또는 (B)의 반응에 있어서 사용 가능한 용매는 원료에 대하여 불활성이면 특별히 한정되지 않지만, 테트라하이드로푸란, 1,4-디옥산, 1,2-디메톡시에탄-비스(2-메톡시에틸)에테르 등의 에테르 용매, 피콜린, 피리딘 등의 방향족 아민 용매, 아세톤, 메틸에틸케톤, 메틸이소부틸케톤 등과 같은 케톤계 용매, 톨루엔, 자일렌 등과 같은 방향족 탄화수소 용매, 디클로로메탄, 클로로포름, 1,2-디클로로에탄 등과 같은 할로겐 함유 용매, N-메틸-2-피롤리돈, N,N-디메틸아세트아미드, N,N-디에틸아세트아미드, N,N-디메틸포름아미드 등과 같은 아미드계 용매, 헥사메틸포스포르아미드 등과 같은 인 함유 용매, 디메틸술포옥사이드 등과 같은 황 함유 용매, γ-부티로락톤, 아세트산 에틸, 아세트산 부틸 등과 같은 에스테르계 용매, 1,3-디메틸-2-이미다졸리디논 등과 같은 질소 함유 용매, 페놀, o-크레졸, m-크레졸, p-크레졸, o-클로로페놀, m-클로로페놀, p-클로로페놀 등의 수산기를 갖는 방향족계 용매 등을 들 수 있다. 이들 용매는 단독으로도, 2종류 이상 혼합하여 이용해도 좋다. The solvent that can be used in the reaction of the halide and the polyhydric alcohol (A) or (B) is not particularly limited as long as it is inert with respect to the raw material, but tetrahydrofuran, 1,4-dioxane, 1,2-dimethoxyethane- (2-methoxyethyl) ether, aromatic amine solvents such as picoline and pyridine, ketone solvents such as acetone, methyl ethyl ketone and methyl isobutyl ketone, aromatic hydrocarbon solvents such as toluene and xylene, Halogen-containing solvents such as methane, chloroform, 1,2-dichloroethane and the like, organic solvents such as N-methyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-diethylacetamide, And the like; ester-based solvents such as γ-butyrolactone, ethyl acetate, butyl acetate and the like; esters such as 1,3-dimethyl- An aromatic solvent having a hydroxyl group such as phenol, o-cresol, m-cresol, p-cresol, o-chlorophenol, m-chlorophenol, p- . These solvents may be used alone or in combination of two or more.
다가 알코올 (A)에 할라이드류를 반응시킬 때는, 반응 온도는 -10℃∼80℃, 바람직하게는 0℃∼70℃, 보다 바람직하게는 10℃∼60℃이다. 여기에서 든 용매에는 다가 알코올 (A)로부터 다가 알코올 (B)를 제조할 때에 이용되는 환상 에테르나 환상 에스테르가 포함되어 있는데, 반응 온도가 80℃보다도 높으면 다가 알코올 (A)에 환상 에테르나 환상 에스테르가 반응하여, 다가 알코올 (B)가 얻어져, 다가 알코올 (A)와 할라이드류의 반응률이 저하된다. 반응 시간은, 특별히 제한은 없지만 통상 10분∼48시간, 바람직하게는 30분∼24시간이다. 반응은 통상, 상압에서 행해지지만, 필요에 따라서 가압하, 또는 감압하에서도 실시할 수 있다. When the polyhydric alcohol (A) is reacted with the halide, the reaction temperature is -10 ° C to 80 ° C, preferably 0 ° C to 70 ° C, and more preferably 10 ° C to 60 ° C. Examples of the solvent include cyclic ethers and cyclic esters used in producing the polyhydric alcohol (B) from the polyhydric alcohol (A). When the reaction temperature is higher than 80 ° C, the polyhydric alcohol (A) The polyhydric alcohol (B) is obtained, and the reaction rate of the polyhydric alcohol (A) and the halide is lowered. The reaction time is not particularly limited, but is generally from 10 minutes to 48 hours, preferably from 30 minutes to 24 hours. The reaction is usually carried out at normal pressure, but may be carried out under pressure or under reduced pressure, if necessary.
다가 알코올 (A)에 환상 에테르나 환상 에스테르를 반응시켜 다가 알코올 (B)를 제조할 때는, 반응 온도는 80℃∼250℃, 바람직하게는 90℃∼220℃, 보다 바람직하게는 100℃∼200℃이다. 반응 시간은, 특별히 제한은 없지만 통상 10분∼48시간, 바람직하게는 30분∼24시간이다. 반응은 통상, 상압에서 행해지지만, 필요에 따라서 가압하, 또는 감압하에서도 실시할 수 있다. When the polyhydric alcohol (A) is reacted with the cyclic ether or the cyclic ester to produce the polyhydric alcohol (B), the reaction temperature is 80 to 250 캜, preferably 90 to 220 캜, more preferably 100 to 200 캜 / RTI > The reaction time is not particularly limited, but is generally from 10 minutes to 48 hours, preferably from 30 minutes to 24 hours. The reaction is usually carried out at normal pressure, but may be carried out under pressure or under reduced pressure, if necessary.
다관능 산 무수물을 얻는 반응에 있어서의 용매 중의 용질의 농도는, 통상 5질량%∼50질량%, 부반응의 제어, 침전의 여과 공정을 고려하면 바람직하게는 10질량%∼40질량%이다. 본 반응은 용질이 용매 중, 10질량% 이상 40질량% 이하의 범위가 보다 바람직하다. The concentration of the solute in the solvent in the reaction for obtaining the polyfunctional acid anhydride is usually from 5% by mass to 50% by mass, preferably from 10% by mass to 40% by mass, from the viewpoint of controlling the side reaction and filtering the precipitate. In the present reaction, the solute is more preferably in a range of 10 mass% or more and 40 mass% or less in the solvent.
통상, 반응 분위기는, 질소하에서 행한다. 반응 용기는 밀폐형 반응 용기라도 개방형 반응 용기라도 좋지만, 반응계를 불활성 분위기로 유지하기 위해, 개방형의 경우에는 불활성 가스로 실링할 수 있는 것을 이용한다. Usually, the reaction atmosphere is performed under nitrogen. The reaction vessel may be either a closed reaction vessel or an open type reaction vessel. However, in order to maintain the reaction system in an inert atmosphere, an open vessel that can be sealed with an inert gas is used.
염기성 물질은, 반응의 진행과 함께 발생하는 염화수소를 중화하기 위해 이용한다. 이때 사용되는 염기성 물질의 종류로서는 특별히 한정되지 않지만, 피리딘, 트리에틸아민, N,N-디메틸아닐린 등의 유기 3급 아민류, 탄산 칼륨, 수산화 나트륨 등의 무기의 염기성 물질을 이용할 수 있다. 피리딘이나, 트리에틸아민은 염가로 입수할 수 있는 점이나 액체에서 용해성이 풍부하기 때문에 반응 조작이 용이해진다는 점에서 바람직하다. 또한, 무기의 염기성 물질은 염가로 입수할 수 있는 점에서 바람직하다. The basic substance is used to neutralize the hydrogen chloride generated with the progress of the reaction. The kind of the basic substance to be used is not particularly limited, but organic tertiary amines such as pyridine, triethylamine and N, N-dimethylaniline, and inorganic basic substances such as potassium carbonate and sodium hydroxide can be used. Pyridine and triethylamine are preferable because they are available at low cost and because they are rich in solubility in a liquid, thereby facilitating the reaction operation. Inorganic basic materials are also preferable because they can be obtained at low cost.
사용되는 염기성 물질의 양은 특별히 제한은 없지만, 과잉하게 사용하면 생성물에 혼입되거나, 정제 부하가 커지거나 하기 때문에, 할라이드류의 총 몰수를 1.0으로 한 경우에 대하여 통상 1.0몰배∼30몰배, 바람직하게는 1.2몰배∼20몰배, 더욱 바람직하게는 1.5몰배∼10몰배가 이용된다. Although the amount of the basic substance to be used is not particularly limited, it is usually 1.0 to 30 moles per mole of the total molar amount of the halides, when the total number of moles of the halides is 1.0, 1.2 molar equivalents to 20 molar equivalents, and more preferably 1.5 molar equivalents to 10 molar equivalents.
물세정 조작시, 다관능 산 무수물은 일부 가수분해를 받아, 다가 카본산으로 변화하지만, 감압하에서 가열 처리를 함으로써, 생성된 다가 카본산을 용이하게 다관능 산 무수물로 되돌릴 수 있다. 이 감압하에서의 가열 처리의 온도는 80℃∼200℃, 바람직하게는 100℃∼180℃이며, 감압도는, 50K㎩ 이하, 바람직하게는 10K㎩ 이하이며, 가열 시간의 상한은 특별히 제한은 없지만, 통상은 10분∼48시간, 바람직하게는 30분∼24시간이다. In the water washing operation, the polyfunctional acid anhydride undergoes partial hydrolysis to change into polyvalent carboxylic acid, but the polyvalent carboxylic acid thus produced can be easily returned to the polyfunctional acid anhydride by heat treatment under reduced pressure. The temperature of the heat treatment under this reduced pressure is 80 to 200 占 폚, preferably 100 to 180 占 폚, the degree of vacuum is 50 KPa or less, preferably 10 Kpa or less, and the upper limit of the heating time is not particularly limited, But is usually from 10 minutes to 48 hours, preferably from 30 minutes to 24 hours.
이렇게 하여 얻어진 본 발명의 다관능 산 무수물을 추가로 정제하는 것도 가능하다. 그 경우의 정제 방법으로서는, 재결정, 승화, 세정, 활성탄 처리, 칼럼 크로마토그래피 등 임의로 행할 수 있다. 또한 이들 정제법을 반복해도 좋고, 조합하여 실시하는 것도 가능하다. 이렇게 하여 얻어지는 본 발명의 다관능 산 무수물의 순도는 예를 들면 겔 투과 크로마토그래피(이하, 「GPC」라고 함) 등의 분석으로 얻어지는 피크의 면적비(比)로서, 통상 90% 이상, 바람직하게는 95% 이상, 더욱 바람직하게는 98% 이상이다. The polyfunctional acid anhydride of the present invention thus obtained can be further purified. As the purification method in this case, it can be arbitrarily carried out by recrystallization, sublimation, washing, activated carbon treatment, column chromatography or the like. These purification methods may be repeated or combined. The purity of the polyfunctional acid anhydride of the present invention thus obtained is, for example, an area ratio (ratio) of a peak obtained by an analysis of gel permeation chromatography (hereinafter referred to as "GPC") or the like, 95% or more, and more preferably 98% or more.
다관능 산 무수물의 보존은, 가수분해에 의한 산 무수물환의 개환을 막기 위해 고습을 피한 저온하에서 보존으로 하는 것이 바람직하다. 구체적으로는,시일성이 좋은 용기로 냉장고에서 보관하면 장기간의 보존에 견딘다. 또한, 다관능 산 무수물에 관해서는 흡습을 막기 위해 정제 후 바로 다음의 중합 반응에 사용해도 좋다. 그때의 보존 기간은, 통상 100시간 이내, 바람직하게는 50시간 이내, 더욱 바람직하게는 24시간 이내이다. Preservation of the polyfunctional acid anhydride is preferably carried out at a low temperature avoiding high humidity in order to prevent the opening of the acid anhydride ring by hydrolysis. Specifically, when the container is stored in a refrigerator in a container having good sealability, it is resistant to long-term storage. The polyfunctional acid anhydride may be used in the subsequent polymerization reaction immediately after the purification to prevent moisture absorption. The storage period at that time is usually within 100 hours, preferably within 50 hours, more preferably within 24 hours.
본 발명의 다관능 산 무수물과 경화 반응하는 화합물을 조합하여, 열경화성 수지 조성물을 구성할 수도 있다. 이때, 산 무수물기와 열에 의해 반응 가능한 관능기를 갖는 화합물이면 특별히 한정은 없지만, 특히 에폭시기를 갖는 화합물이 적합하게 이용된다. The multifunctional acid anhydride of the present invention and a compound capable of undergoing curing reaction may be combined to form a thermosetting resin composition. In this case, the compound having an acid anhydride group and a functional group capable of reacting with heat is not particularly limited, but a compound having an epoxy group is preferably used.
이때, 적합한 열경화성 조성물을 얻기 위해, 산 무수물기와 반응 가능한 관능기는, 1분자 중에 적어도 2개 포함되는 화합물을 이용하는 것이 적합하다. At this time, in order to obtain a suitable thermosetting composition, it is preferable to use a compound containing at least two functional groups capable of reacting with the acid anhydride group in one molecule.
본 발명에 있어서 나타내는 에폭시기를 갖는 화합물이란, 1분자 중에 적어도 1개의 에폭시기를 갖는 화합물이면 어느 것을 이용해도 좋다. 이하에 본 발명에 있어서 적합하게 이용되는 1분자 중에 적어도 1개의 에폭시기를 갖는 화합물로서 방향족형 에폭시 수지, 지방족형 에폭시 수지, 공중합체형 에폭시 수지에 대해서 설명한다. The compound having an epoxy group represented by the present invention may be any compound having at least one epoxy group in one molecule. The aromatic epoxy resin, the aliphatic epoxy resin and the copolymer epoxy resin as the compound having at least one epoxy group in a molecule suitably used in the present invention will be described below.
방향족형 에폭시 수지로서는, 크레졸 노볼락형 에폭시 수지, 페놀 노볼락형 에폭시 수지, 비페닐-페놀형 에폭시 수지, 나프톨형 에폭시 수지 등의 노볼락형 에폭시 수지, 비스페놀 A형 에폭시 수지, 비스페놀 F형 에폭시 수지, 비스페놀 S형 에폭시 수지 등의 비스페놀형 에폭시 수지, 트리스페놀메탄형 에폭시 수지, 글리옥살형 에폭시 수지, (4-(4-(1,1-비스(p-하이드록시페닐)-에틸)-α,α-디메틸벤질)페놀)형 에폭시 수지 등을 들 수 있다. 이들 중 본 발명에 있어서는, 내열성, 내착색성을 고려하면, 비스페놀 A형 에폭시 수지, (4-(4-(1,1-비스(p-하이드록시페닐)-에틸)-α,α-디메틸벤질)페놀)형 에폭시 수지가 바람직하다. Examples of the aromatic epoxy resin include novolak type epoxy resins such as cresol novolak type epoxy resin, phenol novolak type epoxy resin, biphenyl-phenol type epoxy resin and naphthol type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy Bisphenol S type epoxy resin, bisphenol type epoxy resin such as bisphenol type epoxy resin, trisphenol methane type epoxy resin, glyoxyl type epoxy resin, (4- (4- (1,1-bis (p- ?,? - dimethylbenzyl) phenol) type epoxy resins. Among them, in the present invention, in consideration of heat resistance and coloring resistance, a bisphenol A type epoxy resin, (4- (4- (1,1-bis (p- hydroxyphenyl) -ethyl) -α, ) Phenol) type epoxy resin is preferable.
지방족형 에폭시 수지로서는, 지방족 환상 구조를 갖는 에폭시 수지와 지방족 환상 구조를 갖지 않는 에폭시 수지를 들 수 있다. 지방족 환상 구조를 갖는 에폭시 수지는 1분자 중에 적어도 1개의 환상 지방족 구조를 갖는 것을 특징으로 한다. 예를 들면 테르펜디페놀이나, 페놀류(페놀, 알킬 치환 페놀, 나프톨, 알킬 치환 나프톨, 디하이드록시벤젠, 디하이드록시나프탈렌 등)와 지방족 환구조 디엔(디사이클로펜타디엔이나 노르보르나디엔, 헥사하이드록시인덴 등)과의 중축합물 및 이들의 변성물로부터 유도되는 글리시딜에테르화물, 수소 첨가 비스페놀(비스페놀 A, 비스페놀 F)형 에폭시 수지, 지환식 에폭시 수지 등, 분자 내에 사이클로헥실 구조를 갖는 에폭시 수지, 디사이클로펜타디엔 구조를 갖는 에폭시 수지, 트리글리시딜이소시아누레이트 구조를 갖는 에폭시 수지 등을 들 수 있다. 구체적으로는 예를 들면, 사이클로헥산디올디글리시딜에테르, 3,4-에폭시사이클로헥세닐메틸-3', 4'-에폭시사이클로헥센카복실레이트, 2,2-비스(하이드록시알킬)-1-부탄올의 1,2-에폭시-4-(2-옥시라닐)사이클로헥산 부가물 등을 들 수 있다. Examples of the aliphatic epoxy resin include an epoxy resin having an alicyclic structure and an epoxy resin having no aliphatic cyclic structure. The epoxy resin having an aliphatic cyclic structure is characterized by having at least one cyclic aliphatic structure in one molecule. (Phenol, alkyl-substituted phenol, naphthol, alkyl-substituted naphthol, dihydroxybenzene, dihydroxynaphthalene, etc.) and an aliphatic cyclic diene (dicyclopentadiene, norbornadiene, (Bisphenol A, bisphenol F) -type epoxy resin, alicyclic epoxy resin, etc., which are derived from a polycondensation product of a polycondensation product of a polycondensate and a modified product thereof, , An epoxy resin having a dicyclopentadiene structure, and an epoxy resin having a triglycidyl isocyanurate structure. Specific examples thereof include cyclohexanediol diglycidyl ether, 3,4-epoxycyclohexenylmethyl-3 ', 4'-epoxycyclohexene carboxylate, 2,2-bis (hydroxyalkyl) -1 -Butane-1,2-epoxy-4- (2-oxiranyl) cyclohexane adducts of butanol.
지방족 환상 구조를 갖지 않는 1분자 중에 적어도 1개의 에폭시기를 갖는 화합물 등으로서는, 헥산디글리시딜에테르 등의 직쇄 또는 분기 알코올로부터 유도되는 글리시딜에테르류를 들 수 있다. Examples of the compound having at least one epoxy group in a molecule not having an aliphatic cyclic structure include glycidyl ethers derived from a straight-chain or branched alcohol such as hexane diglycidyl ether.
공중합형 에폭시 수지로서는, 불포화 이중 결합과 에폭시기를 겸비하는 단량체, 예를 들면 글리시딜(메타)아크릴레이트, 하이드록시에틸(메타)아크릴레이트글리시딜에테르, 하이드록시부틸(메타)아크릴레이트글리시딜에테르 등과 같은 단량체와 그 외의 중합 가능한 불포화기를 갖는 단량체를 공중합시킨 것이다. 그 외의 단량체로서는 특별히 한정은 없고, 상기의 불포화 이중 결합과 에폭시기를 겸비하는 단량체와 공중합이 가능한 것이면 모두 사용할 수 있다. 예를 들면 에틸렌, 프로필렌, 스티렌, 아세트산 비닐, 염화 비닐 등의 비닐 화합물류, 메틸(메타)아크릴레이트, 에틸(메타)아크릴레이트, 부틸(메타)아크릴레이트, 헥실(메타)아크릴레이트, 옥틸(메타)아크릴레이트, 라우릴(메타)아크릴레이트, 스테아릴(메타)아크릴레이트 등의 알킬(메타)아크릴레이트류, 하이드록시에틸(메타)아크릴레이트, 하이드록시부틸(메타)아크릴레이트 등의 글리콜에테르모노(메타)아크릴레이트류, 에틸렌글리콜메틸에테르(메타)아크릴레이트, 폴리에틸렌글리콜모노메틸에테르(메타)아크릴레이트, 폴리에틸렌글리콜모노에틸에테르(메타)아크릴레이트, 폴리프로필렌글리콜모노메틸에테르(메타)아크릴레이트 등의 글리콜에테르모노알킬에테르(메타)아크릴레이트류 등을 들 수 있다. Examples of the copolymerizable epoxy resin include monomers having an unsaturated double bond and an epoxy group such as glycidyl (meth) acrylate, hydroxyethyl (meth) acrylate glycidyl ether, hydroxybutyl (meth) And a monomer having another polymerizable unsaturated group are copolymerized with each other. The other monomer is not particularly limited, and any monomer can be used as far as it can copolymerize with a monomer having both unsaturated double bonds and an epoxy group. (Meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, hexyl (meth) acrylate, octyl (meth) acrylate and the like. Examples of the vinyl monomer include vinyl compounds such as ethylene, propylene, styrene, vinyl acetate and vinyl chloride; (Meth) acrylates such as hydroxyethyl (meth) acrylate, lauryl (meth) acrylate and stearyl (meth) acrylate, (Meth) acrylate, polyethylene glycol monomethyl ether (meth) acrylate, polyethylene glycol monoethyl ether (meth) acrylate, polypropylene glycol monomethyl ether (meth) acrylate, And glycol ether monoalkyl ether (meth) acrylates such as acrylate.
본 발명의 수지 조성물에 이용하는 입자 (C-1)은, 예를 들면, 유기 입자로서는, 폴리메틸메타크릴레이트, 폴리스티렌, 나일론 등을, 무기 입자로서는, 탈크, 소성 클레이, 미(未)소성 클레이, 마이카 및 유리 등의 규산염, 산화 티탄, 알루미나, 실리카 및 용융 실리카 등의 산화물, 탄산 칼슘, 탄산 마그네슘 및 하이드로탈사이트 등의 탄산염, 수산화 알루미늄, 수산화 마그네슘 및 수산화 칼슘 등의 수산화물, 황산 바륨, 황산 칼슘 및 아황산 칼슘 등의 황산염 또는 아황산염, 붕산 아연, 메타붕산 바륨, 붕산 알루미늄, 붕산 칼슘 및 붕산 나트륨 등의 붕산염, 질화 알루미늄, 질화 붕소 및 질화 규소 등의 질화물 등, 불화 마그네슘, 불화 칼슘 등의 불화물을 들 수 있고, 분산 용매를 함유하지 않는 미분말이나 용매에 분산시킨 콜로이드 용액으로서 시장으로부터 입수하여 이용할 수 있다. 또한, 이들을 1종 또는 2종 이상을 혼합하여 이용할 수 있다. 분산 용매는 메틸에틸케톤, 메틸이소부틸케톤, 사이클로헥산온, 디메틸디메틸아세트아미드 등의 케톤류, 아세트산 에틸, 아세트산 부틸 등의 에스테르류, 톨루엔, 자일렌 등의 비극성 용매 등, 본 발명의 열경화성 수지 조성물의 각 성분이 용해하는 것을 선정하여 이용하면 좋다. 또한, 치수 안정성의 관점에서 무기 입자가 바람직하다. 특히, 범용성이나 염가인 점에서 알루미나, 실리카가 바람직하다. Examples of the particles (C-1) used in the resin composition of the present invention include polymethyl methacrylate, polystyrene and nylon as the organic particles, and talc, calcined clay, , Mica and glass, oxides such as titanium oxide, alumina, silica and fused silica, carbonates such as calcium carbonate, magnesium carbonate and hydrotalcite, hydroxides such as aluminum hydroxide, magnesium hydroxide and calcium hydroxide, barium sulfate, sulfuric acid Calcium sulfate and calcium sulfite, borates such as zinc borate, barium metaborate, aluminum borate, calcium borate and sodium borate, nitrides such as aluminum nitride, boron nitride and silicon nitride, fluorides such as magnesium fluoride and calcium fluoride As a colloidal solution in which fine powder containing no dispersing solvent or a solvent is dispersed into the market Emitter can be used to get. These may be used alone or in combination of two or more. Examples of the dispersion solvent include ketones such as methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone and dimethyl dimethylacetamide, esters such as ethyl acetate and butyl acetate, and nonpolar solvents such as toluene and xylene. The thermosetting resin composition May be selected and used. Further, inorganic particles are preferable from the viewpoint of dimensional stability. Particularly, alumina and silica are preferable in view of versatility and low cost.
본 발명의 수지 조성물에 이용하는 섬유 (C-2)는, 탄소 섬유, 유리 섬유, 카제인 섬유, 땅콩 단백 섬유, 옥수수 단백 섬유, 대두 단백 섬유, 알긴 섬유, 키틴 섬유, 만난 섬유, 고무 섬유, 셀룰로오스 섬유, 나일론 섬유, 폴리 염화 비닐리덴 섬유, 폴리 염화 비닐 섬유, 폴리에스테르 섬유, 폴리아크릴로니트릴 섬유, 모다크릴 섬유, 폴리에틸렌 섬유, 폴리프로필렌 섬유, 폴리스티렌 섬유, 폴리에테르에스테르 섬유, 폴리우레탄 섬유 등을 들 수 있다. 이들을 1종 또는 2종 이상을 혼합하여 이용할 수 있다. 그 중에서도, 범용성의 관점에서 유리 섬유가 바람직하다. 또한, 유리 섬유에는 그를 이용한 직포, 부직포, 편물 등 여러 가지 것이 있으며, 본 발명에 있어서 그 종류에 특별히 제한은 없지만, 본 발명의 열경화성 수지 조성물을 함침시켜 경화했을 때에 치수 안정성이 우수한 경화물을 얻기 위해서는, 유리 크로스가 적합하다. 본 발명의 열경화성 수지 조성물과의 밀착성을 고려하면, 유리 섬유는 실란 커플링제에 의해 처리되어 있는 것이 바람직하다. The fiber (C-2) used in the resin composition of the present invention may be any of carbon fiber, glass fiber, casein fiber, peanut protein fiber, corn protein fiber, soybean protein fiber, algin fiber, chitin fiber, mannan fiber, , Nylon fibers, polyvinylidene chloride fibers, polyvinyl chloride fibers, polyester fibers, polyacrylonitrile fibers, modacrylic fibers, polyethylene fibers, polypropylene fibers, polystyrene fibers, polyetherester fibers and polyurethane fibers. . These may be used alone or in combination of two or more. Of these, glass fibers are preferable from the viewpoint of versatility. There are no particular limitations on the kind of the glass fibers used in the present invention. Examples of the glass fibers include, but are not limited to, those obtained by impregnating the thermosetting resin composition of the present invention and obtaining a cured product excellent in dimensional stability In order to achieve this, a glass cloth is suitable. In consideration of adhesion with the thermosetting resin composition of the present invention, the glass fiber is preferably treated with a silane coupling agent.
입자 (C-1) 및 섬유 (C-2)는 구해지는 성능에 따라서, 어느 한쪽만 사용해도, 양방을 사용해도 좋다. The particles (C-1) and the fibers (C-2) may be either one or both of them depending on the performance to be obtained.
본 발명의 수지 조성물에는, 기타 성분을 포함해도 좋다. 이들 기타 성분으로서는 무기 필러, 산화 방지제, 광안정제, 자외선 흡수제 등을 들 수 있다. The resin composition of the present invention may contain other components. Examples of the other components include an inorganic filler, an antioxidant, a light stabilizer, and an ultraviolet absorber.
본 발명의 수지 조성물에 이용될 수 있는 산화 방지제로서는, 페놀계, 황계, 인계 산화 방지제 등 공지 일반의 것이면 제한은 없다. 그러나, 본 발명의 특징을 감안하면, 무색이고, 또한, 경화시의 열이나, 봉지 후의 회로 기판으로서 장기간 사용한 경우라도 착색되기 어려운 것을 선택하는 것이 바람직하다. The antioxidant that can be used in the resin composition of the present invention is not particularly limited as long as it is a known antioxidant such as phenol-based, sulfur-based, phosphorus-based antioxidant. However, in view of the characteristics of the present invention, it is preferable to select colorless, heat at the time of curing, and those which are difficult to be colored even when they are used for a long time as a circuit board after sealing.
페놀계 산화 방지제로서는 모노페놀류, 비스페놀류 및, 고분자형 페놀류 등을 들 수 있다. Examples of the phenol-based antioxidant include monophenols, bisphenols, and polymeric phenols.
황계 산화 방지제의 구체예로서, 디라우릴-3,3'-티오디프로피오네이트, 디미리스틸-3,3'-티오디프로피오네이트, 디스테아릴-3,3'-티오디프로피오네이트 등을 들 수 있다. Specific examples of the sulfur-based antioxidant include dilauryl-3,3'-thiodipropionate, dimyristyl-3,3'-thiodipropionate, distearyl-3,3'-thiodipropionate Nate and so on.
인계 산화 방지제로서는, 포스파이트류, 옥사포스파페난트렌옥사이드류 등을 들 수 있다. Examples of the phosphorus antioxidant include phosphites, oxaphosphphenanthrene oxides and the like.
이들 산화 방지제는 각각 단독으로 사용할 수 있지만, 2종 이상을 조합하여 병용해도 좋다. 산화 방지제의 사용량은, 본 발명의 수지 조성물 100질량부에 대하여, 통상 0.008∼1질량부, 바람직하게는 0.01∼0.5질량부이다. 또한, 본 발명에 있어서는 인계의 산화 방지제가 바람직하다. These antioxidants may be used alone or in combination of two or more. The amount of the antioxidant to be used is usually 0.008 to 1 part by mass, preferably 0.01 to 0.5 part by mass based on 100 parts by mass of the resin composition of the present invention. In the present invention, a phosphorus-based antioxidant is preferable.
본 발명의 수지 조성물에 이용될 수 있는 광안정제로서는 공지 일반의 것을 사용할 수 있고, 특별히 한정은 없다. 그러나, 본 발명의 특징을 감안하면, 무색이고, 또한, 경화시의 열이나, 장기간 사용한 경우라도 착색되기 어려운 재료를 선택하는 것이 바람직하다. 이들의 대표적인 예로서, 힌더드아민류 등을 들 수 있다. As the photostabilizer that can be used in the resin composition of the present invention, a known photostabilizer can be used, and there is no particular limitation. However, in view of the features of the present invention, it is preferable to select a material that is colorless, heat at the time of curing, or a material that is hardly colored even when used for a long period of time. Representative examples thereof include hindered amines and the like.
본 발명의 수지 조성물에 이용될 수 있는 자외선 흡수제로서는 공지 일반의 것을 사용할 수 있고, 특별히 한정은 없다. 자외선 흡수제로서는, 벤조트리아졸계, 하이드록시페닐트리아진계 등을 들 수 있고, 상기 광안정제와 병용하는 것도 가능하다. As the ultraviolet absorber that can be used in the resin composition of the present invention, a known ultraviolet absorber can be used, and there is no particular limitation. Examples of the ultraviolet absorber include benzotriazole-based, hydroxyphenyltriazine-based, and the like, and they can be used in combination with the light stabilizer.
본 발명에 있어서는, 경시적인 착색성이 낮은 자외선 흡수제를 이용하는 것이 바람직하다. 예를 들면, 프로판산-2-[4-[4,6-비스([1,1'-비페닐]-4-일)-1,3,5-트리아진-2-일]-3-하이드록시페닐]-이소옥틸에스테르(예를 들면 티누빈(TINUVIN)479, 치바·재팬(주) 제조) 등을 들 수 있다. In the present invention, it is preferable to use an ultraviolet absorber having a low coloring ability over time. For example, there may be mentioned propanoic acid-2- [4- [4,6-bis ([1,1'-biphenyl] -4- Hydroxyphenyl] -isooctyl ester (for example, TINUVIN 479, manufactured by Chiba Japan K.K.).
본 발명의 내착색성을 향상시킬 때는, 하이드록시페닐트리아진계 자외선 흡수제와 힌더드아민계 광안정제를 함께 이용한다. In order to improve the intrinsic coloring property of the present invention, a hydroxyphenyltriazine-based ultraviolet absorber and a hindered amine light stabilizer are used together.
본 발명의 수지 조성물에는, 투명성이나 경도 등의 특성을 손상시키지 않는 범위에서 부티랄계 수지, 아세탈계 수지, 아크릴계 수지, 에폭시-나일론계 수지, NBR-페놀계 수지, 에폭시-NBR계 수지, 폴리아미드계 수지, 폴리이미드계 수지, 실리콘계 수지 등의 수지 성분을 필요에 따라서 첨가할 수도 있다. The resin composition of the present invention may contain various additives such as a butyral resin, an acetal resin, an acrylic resin, an epoxy-nylon resin, an NBR-phenol resin, an epoxy-NBR resin, Based resin, a silicon-based resin, and the like may be added as needed.
본 발명의 수지 조성물에는 실란 커플링제, 이형(離型)제, 레벨링제, 계면활성제, 염료, 안료, 유기의 광확산 필러 등도 첨가할 수 있다. A silane coupling agent, a releasing agent, a leveling agent, a surfactant, a dye, a pigment, and an organic light diffusion filler may be added to the resin composition of the present invention.
본 발명의 수지 조성물에는 내열성, 내광특성을 개량하는 목적으로 공지 일반의 금속염을 첨가할 수도 있다. 예를 들면 카본산 금속염(2-에틸헥산산, 스테아르산, 베헨산, 미리스틴산 등의 아연염, 주석염, 지르코늄염)이나 인산 에스테르 금속(옥틸 인산, 스테아릴 인산 등의 아연염), 알콕시 금속염(트리부틸알루미늄, 테트라프로필지르코늄 등), 아세틸아세톤염(아세틸아세톤지르코늄킬레이트, 아세틸아세톤티탄킬레이트 등) 등의 금속 화합물 등을 들 수 있다. 이들은 단독 혹은 2종 이상을 이용해도 좋다. 금속염의 첨가에 의해, 본 발명의 내열성, 내착색성을 향상시킬 수 있다. For the purpose of improving the heat resistance and the light resistance property, a known general metal salt may be added to the resin composition of the present invention. (Zinc salts such as stearic acid, behenic acid and myristic acid, tin salts and zirconium salts), phosphoric acid ester metal (zinc salts such as octylphosphoric acid and stearylphosphoric acid) Metal compounds such as alkoxy metal salts (tributyl aluminum, tetrapropyl zirconium and the like), acetylacetone salts (acetylacetone zirconium chelate, acetylacetone titanium chelate and the like) and the like. These may be used alone or in combination of two or more. By adding the metal salt, the heat resistance and coloring resistance of the present invention can be improved.
본 발명의 수지 조성물에 있어서, 열에 의한 반응을 촉진시키기 위해, 열에 감응하여 반응을 촉진시키거나, 또는 경화 온도를 조정하기 위해, 경화 촉매를 첨가하는 것도 일반적으로 행해진다. 이들은, 상기 경화 반응을 촉진시키는 효능을 갖는 것이면, 공지 일반의 것을 사용할 수 있다. In the resin composition of the present invention, in order to accelerate the reaction by heat, a curing catalyst is generally added in order to accelerate the reaction in response to heat or adjust the curing temperature. Any of those known in the art may be used as far as they have the effect of accelerating the curing reaction.
경화 촉매로서는 예를 들면, 2-메틸이미다졸, 2-페닐이미다졸, 2-운데실이미다졸, 2-헵타데실이미다졸, 2-페닐-4-메틸이미다졸, 1-벤질-2-페닐이미다졸, 1-벤질-2-메틸이미다졸, 1-시아노에틸-2-메틸이미다졸, 1-시아노에틸-2-페닐이미다졸, 1-시아노에틸-2-운데실이미다졸, 2,4-디아미노-6-(2'-메틸이미다졸(1'))에틸-s-트리아진, 2,4-디아미노-6-(2'-운데실이미다졸(1'))에틸-s-트리아진, 2,4-디아미노-6-(2'-에틸-4-메틸이미다졸(1'))에틸-s-트리아진, 2,4-디아미노-6-(2'-메틸이미다졸(1'))에틸-s-트리아진·이소시아누르산 부가물, 2-메틸이미다졸이소시아누르산의 2:3 부가물, 2-페닐이미다졸이소시아누르산 부가물, 2-페닐-3,5-디하이드록시알킬이미다졸, 2-페닐-4-하이드록시알킬-5-메틸이미다졸, 1-시아노에틸-2-페닐-3,5-디시아노에톡시메틸이미다졸의 각종 이미다졸류, 및, 그들 이미다졸류와 프탈산, 이소프탈산, 테레프탈산, 트리멜리트산, 피로멜리트산, 나프탈렌디카본산, 말레산, 옥살산 등의 다가 카본산과의 염류, 디시안디아미드 등의 아미드류, 1,8-디아자-바이사이클로(5,4,0)운데센-7 등의 디아자 화합물 및 그들의 테트라페닐보레이트, 페놀 노볼락 등의 염류, 상기 다가 카본산류, 또는 포스핀산류와의 염류, 테트라부틸암모늄브로마이드, 아세틸트리메틸암모늄브로마이드, 트리옥틸메틸암모늄브로마이드 등의 암모늄염류, 트리페닐포스핀, 트리(톨루일)포스핀, 테트라페닐포스포늄브로마이드, 테트라페닐포스포늄테트라페닐보레이트, 헥사플루오로스티빈포스포늄염 등의 포스핀류나 포스포늄 화합물류, 2,4,6-트리스아미노메틸페놀 등의 페놀류, 옥틸산 주석, 옥틸산 코발트, 옥틸산 아연, 옥틸산 지르코늄, 옥틸산 니켈, 나프텐산코발트 등의 유기 금속 화합물 등을 들 수 있다. 또한, 경화촉진제를 마이크로 캡슐로 한 마이크로 캡슐형 경화 촉매 등을 들 수 있다. Examples of the curing catalyst include 2-methylimidazole, 2-phenylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2- Benzyl-2-phenylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl- Ethyl-2-undecylimidazole, 2,4-diamino-6- (2'-methylimidazole (1 ')) ethyl- (1 ')) ethyl-s-triazine, 2,4-diamino-6- (2'-ethyl-4-methylimidazole Azine, 2,4-diamino-6- (2'-methylimidazole (1 ')) ethyl-s-triazine isocyanuric acid adduct, 2-methylimidazole isocyanuric acid 2 : 3 adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-3,5-dihydroxyalkylimidazole, 2-phenyl-4-hydroxyalkyl-5-methylimidazole , Various imidazoles of 1-cyanoethyl-2-phenyl-3,5-dicyanoethoxymethylimidazole, Imidazoles and salts with polyvalent carboxylic acids such as phthalic acid, isophthalic acid, terephthalic acid, trimellitic acid, pyromellitic acid, naphthalenedicarboxylic acid, maleic acid and oxalic acid, amides such as dicyandiamide, Diacid compounds such as bicyclo (5,4,0) undecene-7, salts thereof such as tetraphenylborate and phenol novolac, salts with polyvalent carboxylic acids or phosphines, tetrabutylammonium bromide, acetyl Ammonium salts such as trimethylammonium bromide and trioctylmethylammonium bromide; organic bases such as triphenylphosphine, tri (toluyl) phosphine, tetraphenylphosphonium bromide, tetraphenylphosphonium tetraphenylborate, hexafluorostinophosphonium salt and the like Phosphines, phosphonium compounds, 2,4,6-trisaminomethylphenol and other phenols, tin octylate, cobalt octylate, zinc octylate, zirconium octylate, There may be mentioned organometallic compounds such as cobalt naphthenate. Further, a microcapsule-type curing catalyst in which a curing accelerator is microcapsules can be given.
이들 경화 촉매 중 어느 것을 이용할지는, 요구되는 특성에 따라 적절하게 선택되어야 할 것이다. 경화 촉매는, 본 발명의 수지 조성물 중의, 전체 수지 100질량부에 대하여 통상 0.001∼15질량부의 범위에서 사용된다. Which of these curing catalysts to be used should be appropriately selected depending on the required characteristics. The curing catalyst is used in an amount of usually 0.001 to 15 parts by mass based on 100 parts by mass of the total resin in the resin composition of the present invention.
본 발명의 열경화성 수지 조성물은, 각 성분을, 종래 알려져 있는 방법과 동일한 방법으로, 균일하게 혼합하여, 그 경화물로 할 수 있다. 예를 들면, 에폭시 수지와 산 무수물 경화제 그리고 필요에 따라 경화촉진제, 그 외의 성분을, 필요에 따라서 압출기, 니더, 롤 등을 이용하여 균일하게 될 때까지 충분히 혼합하여 본 발명의 열경화성 수지 조성물을 얻는다. 본 발명의 열경화성 수지 조성물은 상온에서 고체이기 때문에, 용융 후, 주형(注型), 혹은 트랜스퍼 성형기 등을 이용하여 성형하고, 추가로 가열에 의해 경화하는 것과 같은 수법을 들 수 있다. The thermosetting resin composition of the present invention can be uniformly mixed with each component in the same manner as the conventionally known method to obtain the cured product. For example, the thermosetting resin composition of the present invention is obtained by thoroughly mixing the epoxy resin and the acid anhydride curing agent and, if necessary, the curing accelerator and other components, as necessary, using an extruder, a kneader, a roll or the like until they become uniform . Since the thermosetting resin composition of the present invention is a solid at room temperature, it is possible to use a method such as molding after melting, molding using a casting mold or a transfer molding machine, and further curing by heating.
또한, 본 발명의 열경화성 수지 조성물은, 톨루엔, 자일렌, 아세톤, 메틸에틸케톤, 메틸이소부틸케톤, 사이클로헥산온, 사이클로펜탄온, 디메틸포름아미드, 디메틸아세트아미드, N-메틸피롤리돈, 아세트산 에틸, 아세트산 부틸, 프로필렌글리콜모노메틸에테르, 프로필렌글리콜모노메틸에테르아세테이트 등의 용제에 희석하여 바니시로서 사용할 수 있다. 본 발명의 열경화성 수지 조성물은 통상, 상온에서 고체이기 때문에, 용제에 희석하여 사용하는 편이 취급하기 쉽고, 보다 바람직하다. 특히 유리 크로스에 함침시켜 이용하는 경우는 용제에 의한 희석을 행한다. In addition, the thermosetting resin composition of the present invention is preferably a thermosetting resin composition containing at least one selected from the group consisting of toluene, xylene, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, cyclopentanone, dimethylformamide, dimethylacetamide, It may be diluted with a solvent such as ethyl acetate, butyl acetate, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate and the like and used as a varnish. Since the thermosetting resin composition of the present invention is usually solid at room temperature, it is more preferable that the thermosetting resin composition is diluted with a solvent and used. Particularly, when the glass cloth is impregnated with the glass cloth, dilution with a solvent is performed.
용제는, 본 발명의 열경화성 수지 조성물을 사용할 때의 점도나 건조 속도 등을 고려하여, 1종 혹은 2종 이상의 혼합 용제로서 이용할 수 있다. 용제의 사용 비율은 사용시의 작업성이나 건조 속도에 따르지만, 본 발명의 열경화성 수지 조성물 100질량부에 대하여, 통상 10∼200질량부, 바람직하게는 15∼100질량부이다. The solvent can be used as one or more mixed solvents in consideration of the viscosity and the drying speed when the thermosetting resin composition of the present invention is used. The solvent is used in an amount of usually 10 to 200 parts by mass, preferably 15 to 100 parts by mass, per 100 parts by mass of the thermosetting resin composition of the present invention, depending on workability at the time of use and drying speed.
용제로 희석한 본 발명의 열경화성 수지 조성물을 얻는 경우도, 각 성분을 상법에 따라 혼합 용해함으로써 조제할 수 있다. 예를 들면, 교반 장치, 온도계가 있는 둥근바닥 플라스크에 각 성분을 넣고, 40∼80℃에서 0.5∼6시간 교반함으로써 열경화성 수지 조성물의 바니시를 얻을 수 있다. 이때에, 에폭시 수지의 바니시와, 산 무수물 경화제+경화 촉매나 첨가제의 바니시를 따로따로 조정해 두고, 사용시에 혼합하는 방법은 특히 바람직하다. 앞서 기재한 바와 같이, 미립자를 첨가하는 경우에는, 호모 믹서, 샌드밀 등 고속 교반기나 마이크로플루이다이저, 3축 롤 등, 일반적으로 공지의 분산 방법으로 처리를 행할 수도 있다. In the case of obtaining the thermosetting resin composition of the present invention which is diluted with a solvent, the components can be prepared by mixing and dissolving them in accordance with a conventional method. For example, each component is put into a round bottom flask equipped with a stirrer and a thermometer, and stirred at 40 to 80 DEG C for 0.5 to 6 hours to obtain a varnish of a thermosetting resin composition. At this time, a method of adjusting the varnish of the epoxy resin, the acid anhydride curing agent + the curing catalyst and the varnish of the additive separately and mixing them at the time of use is particularly preferable. As described above, in the case of adding fine particles, the treatment may be carried out by a generally known dispersing method such as a homomixer, a sand mill, a high-speed stirrer, a microfluidizer, or a three-axis roll.
이와 같이 하여 얻어진 본 발명의 열경화성 수지 조성물의 바니시는, 공지의 방법으로 성형하고, 건조한 후, 추가로 가열함으로써 경화시킨다. 예를 들면, 금형에 흘려 넣어, 가열 건조 후, 경화시키는 방법이나, 바 코터, 에어 나이프 코터, 다이 코터, 그라비아 코터, 오프셋 인쇄, 플렉소 인쇄, 스크린 인쇄 등, 그 자체 공지의 방법으로 금형의 대신이 되는 금속판이나 이형 필름 등에 도포하고, 가열 건조 후, 경화시키는 방법, 유리 크로스에 함침시켜, 가열 건조 후, 경화시키는 방법, 또한 유리나 투명 플라스틱 기재에 도포하고, 가열 건조 후, 경화시켜 기재와 함께 사용하는 코팅제로서의 사용 방법 등도 들 수 있다. 본 발명의 열경화성 수지 조성물은, 경화시에 경화제가 휘발되어 막의 성분비가 바뀌어 굴절률이 변화하는 일이 없기 때문에, 안정된 투명한 막을 얻을 수 있다. 이 때문에, 광학 시트의 제조에도 적합하다. 또한, 경화제의 휘발에 의해 경화막의 표면이 거칠어지거나, 경화막의 물성이 바뀌어 버리거나 하는 일도 없어, 평활하고 경도가 우수한 막을 얻을 수 있다. The varnish of the thermosetting resin composition of the present invention thus obtained is molded by a known method, dried and further cured by heating. For example, a method of pouring the resin into a mold, followed by heating and drying, followed by curing, or by a known method such as a bar coater, an air knife coater, a die coater, a gravure coater, offset printing, flexo printing, A method in which the composition is coated on a metal plate or a release film or the like and heated and dried, followed by curing, a method in which the composition is impregnated with a glass cloth, followed by heating and drying and then curing; A method for use as a coating agent used together, and the like. In the thermosetting resin composition of the present invention, since the curing agent volatilizes at the time of curing, the composition ratio of the film is changed and the refractive index is not changed, so that a stable transparent film can be obtained. Therefore, it is suitable for the production of an optical sheet. In addition, since the surface of the cured film is not roughened due to the volatilization of the curing agent, or the physical properties of the cured film are not changed, a smooth and excellent hardness film can be obtained.
본 발명의 열경화성 수지 조성물의 바니시의 건조 온도는, 사용하는 용제나 풍량에도 따르지만 통상은 60∼200℃가 바람직하다. 유리 크로스 등의 유리 섬유 시트 형상 기재에 상기 바니시를 함침시키고, 용제를 건조할 때에, 본 발명의 열경화성 수지 조성물을 반경화 상태로 함으로써, 프리프레그를 얻는 것도 가능하다. 이때의 건조 조건은 특별히 한정은 되지 않지만, 온도 100∼180℃, 시간은 1∼30분이 바람직하다. The drying temperature of the varnish of the thermosetting resin composition of the present invention is usually from 60 to 200 캜 although it depends on the solvent and air volume to be used. It is also possible to obtain a prepreg by impregnating the glassy sheet-like base material such as a glass cloth with the varnish and drying the solvent so that the thermosetting resin composition of the present invention is semi-cured. The drying conditions at this time are not particularly limited, but the temperature is preferably 100 to 180 DEG C and the time is preferably 1 to 30 minutes.
본 발명의 열경화성 수지 조성물을 반경화 상태로 형상을 부여한 프리프레그도 본 발명에 포함된다. The present invention also includes a prepreg in which the thermosetting resin composition of the present invention is shaped in a semi-cured state.
본 발명의 열경화성 수지 조성물을 경화하여 얻어지는 경화물도 본 발명에 포함된다. 본 발명의 열경화성 수지 조성물을 섬유에 함침시킨 프리프레그를 제작한 후, 건조, 경화하여 얻어지는 경화물도 동일하게 본 발명에 포함된다. 전술한 바와 같이, 본 발명의 열경화성 수지 조성물은 경화시에 경화제가 휘발되는 것에 의한 굴절률의 변화가 없기 때문에, 광학 시트의 제조에 적합하다. 또한, 본 발명의 열경화성 수지 조성물의 경화 온도, 시간으로서는 80∼200℃에서 2∼200시간이다. 경화 방법으로서는 고온에서 단번에 경화시킬 수도 있지만, 150℃ 이하의 저온에서 장시간 경화시켜도 좋다. 80∼150℃의 사이에 초기 경화를 행하고, 100℃∼200℃의 사이에 후경화를 행하는 등, 스텝 와이즈에 승온하여 경화 반응을 진행시켜도 좋다. The cured product obtained by curing the thermosetting resin composition of the present invention is also included in the present invention. The present invention also includes a cured product obtained by preparing a prepreg impregnated with a thermosetting resin composition of the present invention in a fiber, followed by drying and curing. As described above, the thermosetting resin composition of the present invention is suitable for the production of an optical sheet because there is no change in the refractive index caused by volatilization of the curing agent during curing. The curing temperature and time of the thermosetting resin composition of the present invention are from 80 to 200 占 폚 for 2 to 200 hours. As the curing method, it is possible to cure at one time at a high temperature, but it may be cured at a low temperature of 150 DEG C or less for a long time. The initial curing may be performed at 80 to 150 占 폚, and post-curing may be performed at 100 占 폚 to 200 占 폚.
상기 프리프레그를 제작하기 위한 유리 크로스는, 공지인 시판의 것을 이용할 수 있다. 그 중에서도 일반적으로 수지 강화용으로서 이용되는 E 유리는, 알칼리 금속 산화물이 적고, 무알칼리 유리로서 본 발명의 용도에는 적절하다. 시판의 유리 크로스에는, 유리 섬유를 이용한 직포, 부직포, 편물 등 여러 가지 것이 있으며, 본 발명에 있어서 그 종류에 특별히 제한은 없지만, 본 발명의 열경화성 수지 조성물을 함침시켜 경화했을 때에 평활한 경화물을 얻기 위해서는, 유리 크로스의 표면의 요철이 작은 것이 적합하다. 프리프레그를 제작할 때의 건조, 반경화의 조건을 고려하면 유리 크로스의 두께는 통상 100㎛ 이하이며, 바람직하게는 50㎛ 이하이다. 25㎛ 정도나 그 이하의 두께인 것을 이용하여 프리프레그를 제작하고, 경화시에 2매∼수 매를 서로 겹쳐 일체화하여 본 발명의 광학 시트로 해도 좋다. 유리 크로스에 이용하는 유리 섬유의 지름은, 투명성 등을 고려하면 작은 편이 좋고 10㎛ 이하가 바람직하다. 또한 본 발명의 열경화성 수지 조성물과의 밀착성을 고려하면, 유리 섬유는 실란 커플링제에 의해 처리되어 있는 것이 바람직하다. 굴절률은 1.51∼1.57이며, 일반적으로 입수 가능한 것으로서 1.55∼1.57이 보다 바람직하다. As the glass cloth for preparing the prepreg, a known commercially available glass cloth can be used. Among them, E glass which is generally used for resin reinforcement is less alkali metal oxide and is suitable as an alkali-free glass for the use of the present invention. There are no particular restrictions on the type of glass cloth used in the present invention. Examples of the commercially available glass cloth include a woven fabric using glass fiber, a nonwoven fabric, a knitted fabric, etc. In the present invention, In order to obtain this, it is preferable that the surface roughness of the glass cloth is small. Considering the conditions of drying and semi-curing at the time of preparing the prepreg, the thickness of the glass cloth is usually 100 占 퐉 or less, preferably 50 占 퐉 or less. A prepreg may be prepared using a material having a thickness of about 25 mu m or less and two or more sheets may be superimposed upon each other at the time of curing to form an optical sheet of the present invention. The diameter of the glass fiber used for the glass cloth is preferably as small as possible in consideration of transparency and the like and is preferably 10 占 퐉 or less. In consideration of adhesion with the thermosetting resin composition of the present invention, the glass fiber is preferably treated with a silane coupling agent. The refractive index is 1.51 to 1.57, which is generally available, more preferably 1.55 to 1.57.
본 발명에 있어서, 본 발명의 경화물의 굴절률은, 이용하는 유리 섬유의 굴절률과의 차이가 적은 것이 바람직하다. 구체적으로는 당해 유리 섬유의 굴절률과의 차이가 ±0.01이 되는 것이 바람직하고, 차이가 ±0.005가 되는 것이 더욱 바람직하다. 본 발명의 경화물의 굴절률이 이 범위이면, 투명성, 평활성, 경도가 우수한 광학 시트가 얻어진다. 이들 광학 시트 상에, 추가로 본 발명의 열경화성 수지 조성물을 도포, 건조, 경화함으로써, 투명성, 평활성이 보다 우수한 광학 시트를 얻는 것도 가능하다. In the present invention, it is preferable that the refractive index of the cured product of the present invention is smaller than the refractive index of the glass fiber used. Specifically, it is preferable that the difference from the refractive index of the glass fiber is ± 0.01, and it is more preferable that the difference is ± 0.005. When the refractive index of the cured product of the present invention is within this range, an optical sheet excellent in transparency, smoothness and hardness can be obtained. It is also possible to obtain an optical sheet having superior transparency and smoothness by applying, drying and curing the thermosetting resin composition of the present invention on these optical sheets.
본 발명의 열경화성 수지 경화물은, 액정 디스플레이, 플라즈마 디스플레이, EL 디스플레이, 휴대 기기 등의 표시 장치나 태양 전지 등에 이용되는 유리의 대체품으로서 이용 가능하다. 그 외에도, 도광판, 프리즘 시트, 편광판, 위상차판, 시야각 보정 필름, 접착제, 편광자 보호 필름 등의 액정용 필름 등의 액정 표시 장치 주변 재료나, 반사 방지 필름, 터치 패널용 전면판, 광학 보정 필름 등에도 사용할 수 있다. The thermosetting resin cured product of the present invention can be used as a substitute for glass used for a display device such as a liquid crystal display, a plasma display, an EL display, a portable device, or a solar cell. In addition, materials surrounding the liquid crystal display such as a light guide plate, a prism sheet, a polarizing plate, a retardation plate, a viewing angle correcting film, an adhesive, and a polarizer protective film, Can also be used.
(실시예)(Example)
다음으로, 실시예에 의해 본 발명을 더욱 상세하게 설명한다. 또한, 본 발명은 이하의 실시예에 의해 전혀 한정되는 것은 아니다. 화합물의 합성에 있어서는, 겔 투과 크로마토그래피(이하, 「GPC」라고 함)에 의해 원료 알코올류의 소실을 확인한 시점에서 반응 종료로 했다. 또한, 실시예에 있어서 TMAC는 무수 트리멜리트산 클로라이드를, HTAC는 핵수소 첨가 무수 트리멜리트산 클로라이드를, THF는 테트라하이드로푸란을, TMP는 트리메틸올프로판을, DPE는 디펜타에리트리톨을, PE4EO는 펜타에리트리톨 4몰 에틸렌옥사이드 부가물을, DE6EO는 디펜타에리트리톨 6몰 에틸렌옥사이드 부가물을, DPE4C는 디펜타에리트리톨 4몰 카프로락톤 부가물을, MEK는 메틸에틸케톤을, 각각 나타낸다. Next, the present invention will be described in more detail with reference to Examples. The present invention is not limited at all by the following examples. In the synthesis of the compound, the reaction was terminated at the time when disappearance of the starting alcohol was confirmed by gel permeation chromatography (hereinafter referred to as "GPC"). In the examples, TMAC is anhydrous trimellitic chloride, HTAC is nuclear hydrogenated anhydrous trimellitic chloride, THF is tetrahydrofuran, TMP is trimethylolpropane, DPE is dipentaerythritol, PE4EO , DE6EO represents a dipentaerythritol 6 mole ethylene oxide adduct, DPE4C represents a dipentaerythritol 4 mole caprolactone adduct, and MEK represents methyl ethyl ketone.
합성예 1: 디펜타에리트리톨 4몰 카프로락톤 부가물(DPE4C)의 합성Synthesis Example 1: Synthesis of dipentaerythritol 4-mol caprolactone adduct (DPE4C)
교반기, 환류 냉각관, 교반 장치를 구비한 플라스크에, 질소 퍼지를 행하면서, 디펜타에리트리톨 25.43g(100m㏖)에 카프로락톤 45.66g(400m㏖)을 첨가하고, 180℃ 12시간 교반하여, 디펜타에리트리톨 4몰 카프로락톤 부가물 71.09g을 얻었다. 45.66 g (400 mmol) of caprolactone was added to 25.43 g (100 mmol) of dipentaerythritol while nitrogen purge was carried out, and the mixture was stirred at 180 ° C for 12 hours, To obtain 71.09 g of dipentaerythritol 4-mol caprolactone adduct.
합성예 2: 공중합형 에폭시 수지의 조제Synthesis Example 2: Preparation of copolymerizable epoxy resin
교반기, 환류 냉각관, 교반 장치를 구비한 플라스크에, 질소 퍼지를 행하면서, 글리시딜메타아크릴레이트 30g, 메틸메타아크릴레이트 30g, 부틸메타아크릴레이트 40g, 용매로서 메틸에틸케톤 200g, 반응 개시제로서 아조비스이소부티로니트릴 1g을 첨가하여, 80℃, 5시간 중합 반응을 행했다. 30 g of glycidyl methacrylate, 30 g of methyl methacrylate, 40 g of butyl methacrylate, 200 g of methyl ethyl ketone as a solvent, and 200 g of methyl ethyl ketone as a reaction initiator were added to a flask equipped with a stirrer, a reflux condenser, 1 g of azobisisobutyronitrile was added, and polymerization reaction was carried out at 80 DEG C for 5 hours.
반응 종료 후, 90℃로 가열, 감압하에 있어서 용매를 증류제거하여 공중합체형 에폭시 수지를 얻었다. 얻어진 공중합체형 에폭시 수지의 분자량을 GPC에 의한 폴리스티렌 환산 수평균 분자량 15,000, 동(同)중량 평균 분자량 30,000, 에폭시 당량 470g/eq였다. After completion of the reaction, the reaction mixture was heated to 90 占 폚 and the solvent was distilled off under reduced pressure to obtain a copolymer type epoxy resin. The resulting copolymer-type epoxy resin had a number average molecular weight of 15,000 in terms of polystyrene by GPC, a weight average molecular weight of 30,000, and an epoxy equivalent of 470 g / eq.
실시예 1-1: 다관능 산 무수물의 합성Example 1-1: Synthesis of polyfunctional acid anhydride
교반기, 환류 냉각관, 교반 장치를 구비한 플라스크에, 질소 퍼지를 행하면서, HTAC 23.34g(108m㏖)에, THF를 36g 첨가하여 균일 용액으로 했다. 이 용액을 교반하면서 5℃까지 냉각 후, TMP 4.44g(33m㏖)에 피리딘 10.08g(127.5m㏖)과 THF 54g을 첨가하여 균일하게 한 용액을, 액온(液溫)을 10℃ 이하로 유지하면서 서서히 적하했다. 적하 종료 후, 실온에서 1시간 교반하고, 이어서 50℃까지 승온하여, 반응을 8시간 계속했다. 계속해서, 반응액을 20℃까지 냉각하고, 불용해분인 피리딘 염산염을 여과제거한 후, 여과액을 농축했다. 농축물을 아세트산 에틸 120ml에 용해시키고, 30ml의 물로 3회 세정한 후, 무수 황산 마그네슘으로 건조했다. 무수 황산 마그네슘을 여과제거한 후, 여과액을 농축하여, 얻어진 농축물을 15ml의 아세트산 에틸에 녹이고, 톨루엔으로 재결정하여, 생성물을 16.7g(수율 75.2%) 얻었다. A flask equipped with a stirrer, a reflux condenser and an agitator was added with 36 g of THF to 23.34 g (108 mmol) of HTAC while purging with nitrogen to obtain a homogeneous solution. The solution was cooled to 5 ° C while stirring, and 10.08 g (127.5 mmol) of pyridine and 54 g of THF were added to 4.44 g (33 mmol) of TMP to uniformly maintain the liquid temperature at 10 ° C. or lower While slowly dropping. After completion of dropwise addition, the mixture was stirred at room temperature for 1 hour, then heated to 50 DEG C, and the reaction was continued for 8 hours. Subsequently, the reaction solution was cooled to 20 占 폚, and the insoluble pyridine hydrochloride was removed by filtration, and then the filtrate was concentrated. The concentrate was dissolved in 120 ml of ethyl acetate, washed with 30 ml of water three times, and then dried over anhydrous magnesium sulfate. The anhydrous magnesium sulfate was filtered off, and the filtrate was concentrated. The resulting concentrate was dissolved in 15 ml of ethyl acetate and recrystallized with toluene to obtain 16.7 g (yield: 75.2%) of the product.
이 생성물은, 1H-NMR로부터 목적의 화합물인 것을 확인했다. This product was confirmed to be the desired compound by 1 H-NMR.
1H-NMR(클로로포름-d1, δppm): 0.90-0.92(m, 3H), 1.48-2.49(m, 23H), 3.11-3.41(m, 6H), 4.04(s, 6H) 1 H-NMR (chloroform-d 1,? Ppm): 0.90-0.92 (m, 3H), 1.48-2.49 (m, 23H), 3.11-3.41
실시예 1-2: 다관능 산 무수물의 합성Example 1-2: Synthesis of polyfunctional acid anhydride
교반기, 환류 냉각관, 교반 장치를 구비한 플라스크에, 질소 퍼지를 행하면서, HTAC 7.78g(36m㏖)에, THF를 12g 첨가하여 균일 용액으로 했다. 이 용액을 교반하면서 5℃까지 냉각 후, DPE 1.40g(5.5m㏖)에 피리딘 3.36g(47.5m㏖)과 아세톤 18g을 첨가하여 균일하게 한 용액을, 액온을 10℃ 이하로 유지하면서 서서히 적하했다. 적하 종료 후, 실온에서 1시간 교반하고, 이어서 50℃까지 승온하여, 반응을 8시간 계속했다. 계속해서, 반응액을 20℃까지 냉각하고, 불용해분인 피리딘 염산염을 여과제거한 후, 여과액을 농축했다. 농축물을 아세트산 에틸 40ml에 용해시키고, 10ml의 물로 3회 세정한 후, 무수 황산 마그네슘으로 건조했다. 무수 황산 마그네슘을 여과제거한 후, 여과액을 농축하여, 얻어진 농축물을 5ml의 아세트산 에틸에 녹이고, 톨루엔으로 재결정하여, 생성물을 5.24g(수율 71.3%) 얻었다. A flask equipped with a stirrer, a reflux condenser and an agitator was added with 7.8 g (36 mmol) of HTAC and 12 g of THF while nitrogen purge was carried out to obtain a homogeneous solution. This solution was cooled to 5 ° C while stirring, and 3.36 g (47.5 mmol) of pyridine and 18 g of acetone were added to 1.40 g (5.5 mmol) of DPE to obtain a homogeneous solution, which was gradually added dropwise did. After completion of dropwise addition, the mixture was stirred at room temperature for 1 hour, then heated to 50 DEG C, and the reaction was continued for 8 hours. Subsequently, the reaction solution was cooled to 20 占 폚, and the insoluble pyridine hydrochloride was removed by filtration, and then the filtrate was concentrated. The concentrate was dissolved in 40 ml of ethyl acetate, washed three times with 10 ml of water, and then dried over anhydrous magnesium sulfate. The anhydrous magnesium sulfate was filtered off, and the filtrate was concentrated. The resulting concentrate was dissolved in 5 ml of ethyl acetate and recrystallized from toluene to obtain 5.24 g (yield: 71.3%) of the product.
실시예 1-3∼1-4Examples 1-3 to 1-4
실시예 1-2에 있어서 다가 알코올을 표 1 기재로 한 외에는 동일하게 하여 다관능 산 무수물을 합성했다. A polyfunctional acid anhydride was synthesized in the same manner as in Example 1-2 except that the polyhydric alcohol was changed to Table 1.
실시예 1-5: 다관능 산 무수물의 합성Example 1-5: Synthesis of polyfunctional acid anhydride
교반기, 환류 냉각관, 교반 장치를 구비한 플라스크에, 질소 퍼지를 행하면서, HTAC 78.6g(363m㏖)에, THF를 120g 첨가하여 균일 용액으로 했다. 이 용액을 교반하면서 5℃까지 냉각 후, PE4EO 28.5g(55m㏖)에 피리딘 33.6g(475m㏖)과 THF 180g을 첨가하여 균일하게 한 용액을, 액온을 10℃ 이하로 유지하면서 서서히 적하했다. 적하 종료 후, 실온에서 1시간 교반하고, 이어서 50℃까지 승온하여, 반응을 8시간 계속했다. 계속해서, 반응액을 20℃까지 냉각하고, 불용해분인 피리딘 염산염을 여과제거한 후, 여과액을 농축했다. 얻어진 농축물을 아세트산 에틸 400ml에 용해시켜, 100ml의 물로 3회 세정한 후, 무수 황산 마그네슘으로 건조했다. 무수 황산 마그네슘을 여과제거한 후, 여과액을 농축하여, 얻어진 농축물을 40ml의 아세트산 에틸에 녹이고, 톨루엔으로 재결정하여, 생성물을 74.7g(수율 77.1%) 얻었다. A flask equipped with a stirrer, a reflux condenser and a stirrer was charged with 78.6 g (363 mmol) of HTAC and 120 g of THF while purging with nitrogen, to obtain a homogeneous solution. This solution was cooled to 5 占 폚 while stirring, and 33.6 g (475 mmol) of pyridine and 180 g of THF were added to 28.5 g (55 mmol) of PE4EO, and the resulting solution was slowly added dropwise while maintaining the liquid temperature at 10 占 폚 or lower. After completion of dropwise addition, the mixture was stirred at room temperature for 1 hour, then heated to 50 DEG C, and the reaction was continued for 8 hours. Subsequently, the reaction solution was cooled to 20 占 폚, and the insoluble pyridine hydrochloride was removed by filtration, and then the filtrate was concentrated. The resulting concentrate was dissolved in 400 ml of ethyl acetate, washed with 100 ml of water three times, and then dried over anhydrous magnesium sulfate. The anhydrous magnesium sulfate was removed by filtration, and the filtrate was concentrated. The resulting concentrate was dissolved in 40 ml of ethyl acetate and recrystallized with toluene to obtain 74.7 g (yield: 77.1%) of the product.
실시예 1-6∼1-14, 비교예 1-1Examples 1-6 to 1-14, Comparative Example 1-1
실시예 1-5에 있어서 HTAC를 TMAC와 HTAC의 혼합물로 하고, 및 다가 알코올을 표 2 기재로 한 외에는 동일하게 하여 다관능 산 무수물을 합성했다. A polyfunctional acid anhydride was synthesized in the same manner as in Example 1-5 except that HTAC was a mixture of TMAC and HTAC, and polyhydric alcohol was used in Table 2.
실시예 1-6의 다관능 산 무수물은, 1H-NMR로부터 목적의 화합물인 것을 확인했다. 도 2에 1H-NMR의 차트를 나타낸다. The polyfunctional acid anhydride of Example 1-6 was confirmed to be the target compound by 1 H-NMR. FIG. 2 shows a chart of 1 H-NMR.
1H-NMR(디메틸술폭사이드-d6, δppm): 0.79-1.00(m, 3H), 1.20-2.73(m, 15.5H), 3.05-3.57(m, 3H), 3.93-4.58(m, 6H), 8.13-8.53(m, 4.5H) 1 H-NMR (dimethyl sulfoxide -d6, δppm): 0.79-1.00 (m , 3H), 1.20-2.73 (m, 15.5H), 3.05-3.57 (m, 3H), 3.93-4.58 (m, 6H) , 8.13-8.53 (m, 4.5H)
실시예 2-1: 수지 조성물의 조제Example 2-1: Preparation of resin composition
실시예 1-1에서 얻은 지환식 다관능 산 무수물을 35g, 지방족형 에폭시 수지 EHPE-3150((주) 다이셀 제조, 에폭시 당량 181)을 10g, 방향족형 에폭시 수지 NC-6300(닛폰카야쿠(주) 제조: (4-(4-(1,1-비스(p-하이드록시페닐)-에틸)-α,α-디메틸벤질)페놀)형 에폭시 수지, 에폭시 당량 206, 전체 염소량 550ppm)을 27g, 마찬가지로 RE-310S(닛폰카야쿠(주) 제조: 액상 비스페놀 A 에폭시 수지, 에폭시 당량 185, 전체 염소량 500ppm)를 23g, 그 외의 성분으로서 옥틸산 아연을 0.3g, 희석 용제인 메틸에틸케톤을 41g 합한 것을 70℃로 가온, 혼합하여, 고형분이 70질량%인 수지 조성물을 얻었다. 35 g of the alicyclic polyfunctional acid anhydride obtained in Example 1-1, 10 g of an aliphatic epoxy resin EHPE-3150 (manufactured by Daicel Co., Ltd., epoxy equivalent 181), 10 g of an aromatic epoxy resin NC-6300 (manufactured by Nippon Kayaku (Epoxy equivalent: 206, total chlorine content: 550 ppm) was added in an amount of 27 g (manufactured by NIPPON KOGYO KABUSHIKI KOGYO KABUSHIKI KOGYO KABUSHIKI KAISHA) , 23 g of RE-310S (liquid bisphenol A epoxy resin, epoxy equivalent 185, total chlorine amount 500 ppm) manufactured by Nippon Kayaku Co., Ltd., 0.3 g of zinc octyl as other components, 41 g of methyl ethyl ketone as a diluting solvent The resulting mixture was heated to 70 캜 and mixed to obtain a resin composition having a solid content of 70% by mass.
주) EHPE-3150: 2,2-비스(하이드록시메틸)-1-부탄올의 1,2-에폭시-4-(2-옥시라닐)사이클로헥산 부가물 EHPE-3150: 1,2-epoxy-4- (2-oxiranyl) cyclohexane adduct of 2,2-bis (hydroxymethyl)
실시예 2-2∼2-14, 비교예 2-1∼2-2Examples 2-2 to 2-14 and Comparative Examples 2-1 to 2-2
실시예 2-1에 있어서 다관능 산 무수물 및 MEK를 표 3 기재로 한 외에는 동일하게 하여 고형분이 70질량%인 수지 조성물을 조제했다. A resin composition having a solid content of 70% by mass was prepared in the same manner as in Example 2-1, except that polyfunctional acid anhydride and MEK were changed to those shown in Table 3.
실시예 2-15: 수지 조성물의 조제Example 2-15: Preparation of resin composition
실시예 1-3에서 얻은 다관능 산 무수물 10g, 합성예 2의 글리시딜메타아크릴레이트 공중합체 50g, 경화 촉매로서 트리페닐포스핀 1g, 용제로서 메틸에틸케톤 40g을 합한 것을 50℃로 가온, 혼합하여, 고형분이 60질량%인 수지 조성물을 얻었다. 10 g of the polyfunctional acid anhydride obtained in Example 1-3, 50 g of the glycidyl methacrylate copolymer of Synthesis Example 2, 1 g of triphenylphosphine as a curing catalyst and 40 g of methyl ethyl ketone as a solvent were added and heated to 50 캜, To obtain a resin composition having a solid content of 60% by mass.
실시예 2-16: 수지 조성물의 조제Example 2-16: Preparation of resin composition
실시예 1-1에서 얻은 다관능 산 무수물을 35g, 희석 용제인 MEK를 41g으로 한 외에는 실시예 2-1과 동일하게 하고, 추가로 콜로이달 실리카의 메틸에틸케톤 분산액(고형분 30질량%, 닛산카가쿠코교(주) 제조 오르가노실리카졸(ORGANOSILICASOL) MEK-ST; 이하 MEK-ST)을 137g 첨가하여, 고형분이 59질량%인 본 발명의 수지 조성물의 희석 조성물을 얻었다. Except that 35 g of the polyfunctional acid anhydride obtained in Example 1-1 and 41 g of MEK as a diluting solvent were used in place of the methyl ethyl ketone dispersion of colloidal silica (solid content: 30 mass%, Nissan 137 g of ORGANOSILICASOL MEK-ST (hereinafter referred to as MEK-ST, manufactured by Kagaku Kogyo Co., Ltd.) was added to obtain a diluted composition of the resin composition of the present invention having a solid content of 59 mass%.
비교예 2-3: 수지 조성물의 조제Comparative Example 2-3: Preparation of resin composition
1,2,4,5-사이클로헥산테트라카본산 2무수물을 17g, RE-310S(닛폰카야쿠(주) 제조: 액상 비스페놀 A 에폭시 수지, 에폭시 당량 185, 전체 염소량 500ppm)를 23g, 그 외의 성분으로서 옥틸산 아연을 0.3g, 희석 용제인 아세톤을 33g으로 한 외에는 실시예 2-1과 동일하게 하여, 고형분이 70질량%인 수지 조성물 희석 조성물을 얻었다. 17 g of 1,2,4,5-cyclohexanetetracarboxylic dianhydride, 23 g of RE-310S (liquid bisphenol A epoxy resin, epoxy equivalent 185, total chlorine content 500 ppm) manufactured by Nippon Kayaku Co., Ltd., , 0.3 g of zinc octylate, and 33 g of acetone as a diluting solvent, to obtain a resin composition diluted composition having a solid content of 70% by mass.
비교예 2-4: 수지 조성물의 조제Comparative Example 2-4: Preparation of resin composition
수소 첨가 트리멜리트산 무수물을 10g, 합성예 2의 글리시딜메타아크릴레이트 공중합체 50g, 경화 촉매로서 트리페닐포스핀 1g, 용제로서 MEK 40g을 합한 것을 50℃로 가온, 혼합하여, 고형분이 60질량%인 수지 조성물을 얻었다. 10 g of hydrogenated trimellitic anhydride, 50 g of the glycidyl methacrylate copolymer of Synthesis Example 2, 1 g of triphenylphosphine as a curing catalyst and 40 g of MEK as a solvent were mixed and heated to 50 캜 and mixed to obtain a solid content of 60 Mass%.
실시예 3-1∼3-5, 비교예 3-1∼3-2Examples 3-1 to 3-5 and Comparative Examples 3-1 to 3-2
유리 기판 상에 내열 이형 테이프로 40㎜×25㎜×1㎜의 형태를 제작하고, 실시예 2 및 비교예 2의 열경화성 수지 조성물을 각각 두께 약 800㎛로까지 주형하여, 80℃에서 50분간 건조했다. 건조 도중에 진공 탈포를 1회 행하여, 거품을 제거했다. 그 후 실온까지 냉각하여, 상태를 확인한 결과, 본 발명의 열경화성 수지 조성물은 실온에서 고체였다. A shape of 40 mm x 25 mm x 1 mm was formed on a glass substrate with a heat resistant release tape and the thermosetting resin compositions of Example 2 and Comparative Example 2 were each molded to a thickness of about 800 mu m and dried at 80 DEG C for 50 minutes . Vacuum defoaming was performed once during drying to remove the bubbles. Thereafter, the mixture was cooled to room temperature, and the state was confirmed. As a result, the thermosetting resin composition of the present invention was solid at room temperature.
계속해서 140℃ 건조기에서 3시간 경화하여, 본 발명의 경화물을 얻었다. 얻어진 경화물에 대해서 각각 유리 전이점, 강인성, 내착색성을 측정하여, 표 4에 기재했다. And then cured in a drier at 140 캜 for 3 hours to obtain a cured product of the present invention. The obtained cured product was measured for glass transition point, toughness and color resistance, and is shown in Table 4.
평가 방법 및 평가 기준Evaluation method and evaluation standard
(1) 유리 전이 온도(Tg): 경화한 수지 조성물의 Tg점을 점탄성 측정 시스템(DMS-6000: 세이코덴시코교(주) 제조)에 있어서, 인장 모드, 주파수 1Hz로 측정했다. (1) Glass transition temperature (Tg): The Tg point of the cured resin composition was measured in a tensile mode at a frequency of 1 Hz in a viscoelasticity measuring system (DMS-6000: Seiko Denshi Kyo Co., Ltd.).
(2) 강인성: 경화한 수지 조성물의 경화막의 양단을 손으로 고정하고, 중앙부를 눌렀을 때의 경화막 상태를 관찰했다. 판정 기준은 이하와 같다. (2) Toughness: Both ends of the cured film of the cured resin composition were fixed by hand, and the state of the cured film when the center was pressed was observed. The criteria are as follows.
◎: 강하게 눌러도 금이 가지 않고, 갈라지지 않는다. ◎: It does not crack and does not crack even when pressed strongly.
○: 약하게 눌러도 금이 가지 않고, 갈라지지 않지만, 강하게 누르면 금이 간다. ○: Even if pressed lightly, it does not crack, it does not crack, but when pressed strongly, it cracks.
△: 약하게 누르면 금이 가고, 강하게 누르면 갈라진다. △: When pressed lightly, it cracks, and when pressed hardly, it cracks.
×: 약하게 누르면 갈라진다. X: Press slightly to divide.
(3) 투명성: 수지 조성물의 경화막의 외관을 육안으로 관찰했다. (3) Transparency: The appearance of the cured film of the resin composition was visually observed.
이상의 결과로부터 명백한 바와 같이 본 발명의 경화물은, 내열성, 강인성, 투명성이 우수하다. 실시예 3-1∼3-5의 경화물에 이용된 본 발명의 다관능 산 무수물은 3관능 이상의 산 무수물을 갖고, 모(母)격이 되는 알코올이 지방족이고 분자량도 큰 점에서, 내열성과 강인성이 우수하다고 생각할 수 있다. 이에 대하여, 비교예 3-1의 경화물에 이용된 다관능 산 무수물은 2관능이고, 저분자인 점에서 내열성과 강인성이 뒤떨어져 있다고 생각할 수 있다. 비교예 3-2의 경화물은 산 무수물이 1관능이고, 저분자인 점에서 내열성과 강인성이 뒤떨어져 있다고 생각할 수 있다. As apparent from the above results, the cured product of the present invention is excellent in heat resistance, toughness and transparency. The polyfunctional acid anhydrides of the present invention used in the cured products of Examples 3-1 to 3-5 have an acid anhydride having three or more functional groups and are alcohol aliphatic and have a large molecular weight, It can be considered that the toughness is excellent. On the contrary, the polyfunctional acid anhydride used in the cured product of Comparative Example 3-1 is bifunctional and may be considered to be inferior in heat resistance and toughness in that it is a low molecular weight. The cured product of Comparative Example 3-2 is considered to be inferior in heat resistance and toughness in that the acid anhydride is a monofunctional and low-molecular substance.
실시예 3-6∼3-14, 비교예 3-3Examples 3-6 to 3-14 and Comparative Example 3-3
실시예 3-1과 동일하게 하여, 본 발명의 경화물을 얻었다. 얻어진 경화물에 대해서 각각 유리 전이점, 강인성, 내착색성을 측정하여, 표 5에 기재했다. 강인성의 평가는 실시예 3-1과 동일하다. A cured product of the present invention was obtained in the same manner as in Example 3-1. The obtained cured product was measured for glass transition point, toughness and color resistance, and is shown in Table 5. Evaluation of toughness is the same as in Example 3-1.
평가 방법 및 평가 기준Evaluation method and evaluation standard
(1) 유리 전이 온도(Tg): 경화한 수지 조성물의 Tg점을 점탄성 측정 시스템(DMS-6000: 세이코덴시코교(주) 제조)에 있어서, 인장 모드, 주파수 1Hz로 측정했다. 판정 기준은 이하와 같다. (1) Glass transition temperature (Tg): The Tg point of the cured resin composition was measured in a tensile mode at a frequency of 1 Hz in a viscoelasticity measuring system (DMS-6000: Seiko Denshi Kyo Co., Ltd.). The criteria are as follows.
◎: Tg가 200℃ 이상?: Tg of 200 占 폚 or more
○: Tg가 190℃ 이상 199℃ 이하?: Tg of 190 占 폚 or more and 199 占 폚 or less
△: Tg가 185℃ 이상 189℃ 이하DELTA: Tg of 185 DEG C or higher and 189 DEG C or lower
×: Tg가 184℃ 이하X: Tg is 184 DEG C or lower
(2) 황변도: 경화한 수지 조성물의 경화막의 초기의 황색도(YI)와 230℃에서 20분간 방치 후의 황색도(YI)를 분광 광도계(U-3900H: (주) 히타치하이테크놀로지즈 제조(황색도는 JIS K7105/JIS K7373)로 측정하여, 그 차(황변도: ΔYI)를 구했다. 판정 기준은 이하와 같다. (2) Yellowing degree: The initial yellowing degree (YI) of the cured film of the cured resin composition and the yellowing degree (YI) after being left at 230 캜 for 20 minutes were measured with a spectrophotometer (U-3900H, manufactured by Hitachi High- (Yellowing degree: JIS K7105 / JIS K7373), and the difference (yellowing degree:? YI) was determined.
◎: ΔYI가 0.4 이하?:? YI is 0.4 or less
○: ΔYI가 0.5 이상 0.7 이하?:? YI is not less than 0.5 and not more than 0.7
△: ΔYI가 0.8 이상 1.0 이하DELTA: DELTA YI is not less than 0.8 and not more than 1.0
×: ΔYI가 1.1 이상X: YI of 1.1 or more
이상의 결과로부터 명백한 바와 같이 본 발명의 경화물은, 내열성, 강인성, 황변도(내착색성)가 우수하다. 실시예 3-6∼3-14의 경화물에 이용된 본 발명의 다관능 산 무수물은 3관능 이상의 산 무수물을 갖고, 모격이 되는 알코올이 지방족이고 분자량도 큰 점에서, 내열성과 강인성이 우수하다. 또한, 방향환을 골격에 가짐에도 불구하고, 지방족환도 갖고 있는 점에서 내착색성도 우수하다. 이에 대하여, 비교예 3-3의 경화물에 이용된 다관능 산 무수물은 방향환 만을 갖기 때문에 황변도가 높고, 내착색성이 불충분하다. As apparent from the above results, the cured product of the present invention is excellent in heat resistance, toughness and yellowing (coloring resistance). The polyfunctional acid anhydrides of the present invention used in the cured products of Examples 3-6 to 3-14 are superior in heat resistance and toughness in that they have trifunctional or higher acid anhydrides and alcohols as algae are aliphatic and have a large molecular weight . In addition, even though the aromatic ring has a skeleton, it also has excellent color resistance because it has an aliphatic ring. On the other hand, the polyfunctional acid anhydride used in the cured product of Comparative Example 3-3 has high yellowing degree and insufficient coloring resistance because it has aromatic rings only.
실시예 3-15∼3-20, 비교예 3-4∼3-5 Examples 3-15 to 3-20, Comparative Examples 3-4 to 3-5
실시예 2-1, 2-3∼2-5, 2-16 및 비교예 2-1∼2-2의 수지 조성물에 MEK를 첨가하여 고형분 50질량%로 조정하고, 시판의 유리 크로스(E 유리 크로스: 유니치카(주) 제조 IPC106 타입: 약 30㎛ 두께, 평직, 광학적 굴절률 1.561) 또는 유리 섬유 부직포(E 유리: 약 750㎛ 두께, 광학적 굴절률 1.560)을 넣고, 함침시켰다. 유리 크로스를 인상한 후, 120℃에서 7분 건조했다. 건조 후의 시트는 고형의 필름이었다. 그것을 추가로 이형 처리한 PET 필름에 끼워 프레스하면서 150℃에서 10분 처리하고, 반경화시켜 프리프레그를 얻었다. 그 후 150℃ 건조기에서 3시간 경화하여, 본 발명의 경화물을 얻었다. 또한, 실시예 2-16의 수지 조성물을 실시예 3-1과 동일하게 하여, 본 발명의 경화물을 얻었다. 이들 얻어진 경화물에 대해서 각각 내열성, 강인성, 황변도, 치수 안정성을 측정하여, 결과를 표 6에 기재했다. 내열성 및 황변도의 평가는 실시예 3-6과 동일하다. 강인성의 평가는 실시예 3-1과 동일하다. MEK was added to the resin compositions of Examples 2-1, 2-3 to 2-5, and 2-16 and Comparative Examples 2-1 to 2-2 to adjust the solid content to 50% by mass, and a commercially available glass cloth (E glass (E glass: about 750 占 퐉 thickness, optical refractive index: 1.560) was impregnated into the glass cloth, and the impregnated glass cloth was impregnated with a glass fiber nonwoven fabric (trade name: IPC106 type: about 30 占 퐉 thickness; plain weave; optical refractive index: 1.561). After raising the glass cloth, it was dried at 120 DEG C for 7 minutes. The sheet after drying was a solid film. It was inserted into a PET film which had been further subjected to releasing treatment, treated at 150 DEG C for 10 minutes while being pressed, and semi-cured to obtain a prepreg. Thereafter, it was cured in a dryer at 150 캜 for 3 hours to obtain a cured product of the present invention. Further, the resin composition of Example 2-16 was obtained in the same manner as in Example 3-1 to obtain a cured product of the present invention. Heat resistance, toughness, yellowing degree and dimensional stability were measured for each of the obtained cured products, and the results are shown in Table 6. The evaluation of heat resistance and yellowing degree is the same as in Example 3-6. Evaluation of toughness is the same as in Example 3-1.
평가 방법 및 평가 기준Evaluation method and evaluation standard
(1) 치수 안정성: 경화한 수지 조성물의 선팽창 계수(CTE)를 점탄성 측정 시스템(DMA/SS-6000: 세이코덴시코교(주) 제조)에 있어서, 200℃/10분으로 측정했다. 판정 기준은 이하와 같다. (1) Dimensional stability: The coefficient of linear expansion (CTE) of the cured resin composition was measured at 200 占 폚 / 10 minutes in a viscoelasticity measuring system (DMA / SS-6000: Seiko Denshi Kyo Co., Ltd.). The criteria are as follows.
◎: CTE가 25ppm/K 이하?: CTE of 25 ppm / K or less
○: CTE가 26ppm/K 이상 35ppm/K 이하?: CTE of 26 ppm / K or more and 35 ppm / K or less
△: CTE가 36ppm/K 이상 45ppm/K 이하?: CTE of 36 ppm / K or more and 45 ppm / K or less
×: CTE가 46ppm/K 이상X: CTE of 46 ppm / K or more
이상의 결과로부터 명백한 바와 같이 본 발명의 경화물은, 내열성, 강인성, 내착색성, 치수 안정성이 우수하다. 실시예 3-15∼3-20의 경화물에 이용된 본 발명의 다관능 산 무수물은 3관능 이상의 산 무수물을 갖고, 또한 모격이 되는 알코올이 지방족이고 분자량도 큰 점에서, 내열성과 강인성이 우수하다고 생각할 수 있다. 또한, 포화 지환도 많이 갖고 있는 점에서 내착색성이, 유리 크로스 등을 포함하는 본 발명의 경화물에서는 치수 안정성도 우수하다. 이에 대하여, 비교예 3-4에서는 포화 지환을 갖지 않기 때문에 황변도가 높고, 내착색성이 불충분하다. 또한, 비교예 3-5에서는 이용된 저분자의 산 무수물인 점에서 내열성과 강인성이 뒤떨어져 있다고 생각할 수 있다. As apparent from the above results, the cured product of the present invention is excellent in heat resistance, toughness, color proofness and dimensional stability. The multifunctional acid anhydrides of the present invention used in the cured products of Examples 3-15 to 3-20 have trifunctional or higher acid anhydrides and the aliphatic alcohol is aliphatic and has a large molecular weight and is excellent in heat resistance and toughness . In addition, the cured product of the present invention, which contains a large amount of saturated alicyclic rings, has excellent color resistance, glass cross and the like, and is also excellent in dimensional stability. On the other hand, in Comparative Example 3-4, since it does not have a saturated alicyclic ring, the yellowing degree is high and the coloring resistance is insufficient. In addition, the low-molecular acid anhydride used in Comparative Example 3-5 is considered to be inferior in heat resistance and toughness.
실시예 4Example 4
실시예 3-15 및 3-17의 경화물의 투명성을 평가했다. 투명성의 평가는 육안으로 착색을 확인하여, 표 7에 결과를 기재했다.The transparency of the cured products of Examples 3-15 and 3-17 was evaluated. The transparency was evaluated visually, and the results are shown in Table 7.
주)week)
유리 크로스 a(유니치카(주) 제조 IPC106 타입: 약 30㎛ 두께, 평직, 광학적 굴절률 1.561)Glass cloth a (IPC106 type, manufactured by Uni-Chika Co., Ltd., thickness: about 30 占 퐉, plain weave, optical refractive index: 1.561)
유리 크로스 b(닛토보우세키(주) 제조 IPC3313 타입; 약 75㎛ 두께, 평직, 광학적 굴절률 1.554)Glass cross b (IPC3313 type, thickness: about 75 mu m, plain weave, optical refractive index: 1.554, manufactured by Nitto Boseki Co., Ltd.)
이상의 결과로부터 명백한 바와 같이, 본 발명의 열경화성 수지 조성물의 굴절률을 유리 크로스의 굴절률을 기준으로 하여 조정함으로써, 착색도 없고, 투명성이 우수한 경화물을 부여했다. As apparent from the above results, the refractive index of the thermosetting resin composition of the present invention was adjusted based on the refractive index of the glass cloth, thereby giving a cured product excellent in transparency without coloring.
본 발명의 다관능 산 무수물 및, 그의 열경화성 수지 조성물은, 토목 건축용의 도료나 FRP, 그리고, 프린트 배선판·반도체 분야 등에 있어서의 도료, 레지스트 잉크, 접착제, 시일제, 봉지제 등의 전기 전자 재료, 주로, 액정 디스플레이, 플라즈마 디스플레이, EL 디스플레이, 휴대 기기 등의 표시 장치나 태양 전지 등에 이용하는 경화물에 적합하다. The multifunctional acid anhydride and the thermosetting resin composition of the present invention can be used as a coating material for civil engineering construction, an electric and electronic material such as a paint in a FRP, a printed wiring board or a semiconductor field, a resist ink, an adhesive, a sealant, It is mainly suitable for a cured product used for a display device such as a liquid crystal display, a plasma display, an EL display, a portable device, or a solar cell.
Claims (19)
(식 중, R1, R2, R3, R4, R5, R6은 각각 독립적이고, R1, R3, R4, R5, R6은 수소 원자, 수산기, 탄소수 1∼11의 탄화수소기, 또는 탄소수 1∼4의 하이드록시알킬기를 나타내고, R2는 수산기, 또는 탄소수 1∼4의 하이드록시알킬기를 나타내고; l은 0∼11, m과 n은 1∼11의 정수를 나타냄)로 나타나는 1분자 중에 적어도 3개의 수산기를 함유하는 다가 알코올 (A)와
무수 트리멜리트산 할라이드 및 핵수소 첨가 무수 트리멜리트산 할라이드의 혼합물 또는 핵수소 첨가 무수 트리멜리트산 할라이드와를 반응시켜 얻어지는 다관능 산 무수물.The following formula (1)
(Wherein, R 1, R 2, R 3, R 4, R 5, R 6 are independent, R 1, R 3, R 4, R 5, R 6 is a hydrogen atom, a hydroxyl group, having a carbon number of 1 to 11, respectively Or a hydroxyalkyl group having 1 to 4 carbon atoms; R 2 represents a hydroxyl group or a hydroxyalkyl group having 1 to 4 carbon atoms; l is 0 to 11; m and n each represent an integer of 1 to 11; (A) containing at least three hydroxyl groups in one molecule and
A polyfunctional acid anhydride obtained by reacting a mixture of trimellitic anhydride halide and nuclear hydrogenated trimellitic acid halide or nuclear hydrogenated trimellitic anhydride halide.
무수 트리멜리트산 할라이드 및 핵수소 첨가 무수 트리멜리트산 할라이드의 혼합물 또는 핵수소 첨가 무수 트리멜리트산 할라이드와를 반응시켜 얻어지는 다관능 산 무수물.A polyhydric alcohol (B) obtained by reacting the polyhydric alcohol (A) according to claim 1 with at least one selected from the group consisting of an alkylene oxide, a cyclic ether and a cyclic ester;
A polyfunctional acid anhydride obtained by reacting a mixture of trimellitic anhydride halide and nuclear hydrogenated trimellitic acid halide or nuclear hydrogenated trimellitic anhydride halide.
다가 알코올 (A)가 트리메틸올 또는 디펜타에리트리톨인 다관능 산 무수물.The method according to claim 1,
A polyfunctional acid anhydride in which the polyhydric alcohol (A) is trimethylol or dipentaerythritol.
다가 알코올 (B)가 디펜타에리트리톨에틸렌옥사이드 부가물, 디펜타에리트리톨프로필렌옥사이드 부가물, 디펜타에리트리톨테트라하이드로푸란 부가물, 디펜타에리트리톨카프로락톤 부가물인 다관능 산 무수물.3. The method of claim 2,
Wherein the polyhydric alcohol (B) is a dipentaerythritol ethylene oxide adduct, a dipentaerythritol propylene oxide adduct, a dipentaerythritol tetrahydrofuran adduct, and a dipentaerythritol caprolactone adduct.
다가 알코올 (B)가 펜타에리트리톨 4몰 에틸렌옥사이드 부가물, 디펜타에리트리톨 6몰 에틸렌옥사이드 부가물, 디펜타에리트리톨 4몰 카프로락톤 부가물인 다관능 산 무수물. 3. The method of claim 2,
Polyfunctional acid anhydride wherein the polyhydric alcohol (B) is a pentaerythritol 4 mole ethylene oxide adduct, dipentaerythritol 6 mole ethylene oxide adduct, dipentaerythritol 4 moles caprolactone adduct.
1분자 중에 적어도 1개의 에폭시기를 갖는 화합물이 지방족형 에폭시 수지, 방향족형 에폭시 수지 및 공중합형 에폭시 수지로부터 선택되는 1종 이상인 열경화성 수지 조성물.9. The method of claim 8,
Wherein the compound having at least one epoxy group in one molecule is at least one selected from an aliphatic epoxy resin, an aromatic epoxy resin and a copolymerizable epoxy resin.
1분자 중에 적어도 1개의 에폭시기를 갖는 화합물이 지방족형 에폭시 수지 및 방향족형 에폭시 수지로부터 선택되는 1종 이상인 열경화성 수지 조성물.10. The method of claim 9,
Wherein the compound having at least one epoxy group in one molecule is at least one selected from an aliphatic epoxy resin and an aromatic epoxy resin.
지방족형 에폭시 수지가 지방족 환상 구조를 갖는 에폭시 수지인 열경화성 수지 조성물.10. The method of claim 9,
Wherein the aliphatic epoxy resin is an epoxy resin having an aliphatic cyclic structure.
지방족형 에폭시 수지가 (4-(4-(1,1-비스(p-하이드록시페닐)-에틸)-α,α-디메틸벤질)페놀)형 에폭시 수지 및 비스페놀 A 에폭시 수지로부터 선택되는 1종 이상인 열경화성 수지 조성물.10. The method of claim 9,
When the aliphatic epoxy resin is one kind selected from (4- (1,1-bis (p-hydroxyphenyl) -ethyl) -α, α-dimethylbenzyl) phenol type epoxy resin and bisphenol A epoxy resin Lt; / RTI >
1분자 중에 적어도 1개의 에폭시기를 갖는 화합물이 공중합형 에폭시 수지인 열경화성 수지 조성물.9. The method of claim 8,
Wherein the compound having at least one epoxy group in one molecule is a copolymerizable epoxy resin.
다가 알코올 (A), 무수 트리멜리트산 할라이드 및 핵수소 첨가 무수 트리멜리트산 할라이드에 상용되지 않는 입자 (C-1) 또는 섬유 (C-2)를 추가로 포함하는 열경화성 수지 조성물.9. The method of claim 8,
A thermosetting resin composition further comprising a particle (C-1) or a fiber (C-2) which is not compatible with the polyhydric alcohol (A), trimellitic anhydride halide and nuclear hydrogenated trimellitic acid halide.
입자 (C-1)이 무기 입자인 열경화성 수지 조성물.15. The method of claim 14,
Wherein the particles (C-1) are inorganic particles.
섬유 (C-2)가 유리 섬유인 열경화성 수지 조성물.15. The method of claim 14,
And the fiber (C-2) is a glass fiber.
섬유 (C-2)가 유리 섬유를 방사하고, 추가로 직제하여 이루어지는 유리 크로스인 열경화성 수지 조성물.17. The method of claim 16,
Wherein the fiber (C-2) is a glass cloth produced by spinning a glass fiber and further adding it.
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JP2007246830A (en) * | 2006-03-17 | 2007-09-27 | Stanley Electric Co Ltd | Thermo-setting resin composition, light transmitting cured product obtained by thermosetting the same, and light emitting diode sealed with the cured product |
JP2007314435A (en) * | 2006-05-23 | 2007-12-06 | Mitsubishi Chemicals Corp | Tetracarboxylic acids or polyesterimide derived from the same and method for producing polyesterimide |
JP2012025670A (en) | 2010-07-20 | 2012-02-09 | Shikoku Chem Corp | Isocyanurate compound |
Also Published As
Publication number | Publication date |
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TW201514170A (en) | 2015-04-16 |
KR102127775B1 (en) | 2020-06-29 |
CN104558544A (en) | 2015-04-29 |
TWI617558B (en) | 2018-03-11 |
CN104558544B (en) | 2018-06-29 |
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