KR102127775B1 - Multifunctional acid anhydride, thermosetting resin composition, prepreg and cured article - Google Patents
Multifunctional acid anhydride, thermosetting resin composition, prepreg and cured article Download PDFInfo
- Publication number
- KR102127775B1 KR102127775B1 KR1020140139111A KR20140139111A KR102127775B1 KR 102127775 B1 KR102127775 B1 KR 102127775B1 KR 1020140139111 A KR1020140139111 A KR 1020140139111A KR 20140139111 A KR20140139111 A KR 20140139111A KR 102127775 B1 KR102127775 B1 KR 102127775B1
- Authority
- KR
- South Korea
- Prior art keywords
- resin composition
- thermosetting resin
- anhydride
- acid anhydride
- polyhydric alcohol
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 94
- 150000008065 acid anhydrides Chemical class 0.000 title claims abstract description 73
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 63
- 150000005846 sugar alcohols Polymers 0.000 claims abstract description 59
- -1 cyclic ester Chemical class 0.000 claims abstract description 49
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 claims abstract description 48
- 150000001875 compounds Chemical class 0.000 claims abstract description 29
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 29
- 239000000203 mixture Substances 0.000 claims abstract description 26
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 16
- 150000004292 cyclic ethers Chemical class 0.000 claims abstract description 15
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 9
- 238000005984 hydrogenation reaction Methods 0.000 claims abstract description 7
- 150000008064 anhydrides Chemical class 0.000 claims abstract description 5
- 239000003822 epoxy resin Substances 0.000 claims description 51
- 229920000647 polyepoxide Polymers 0.000 claims description 51
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 27
- 239000000835 fiber Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 27
- 239000011521 glass Substances 0.000 claims description 25
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 claims description 23
- 150000004820 halides Chemical class 0.000 claims description 16
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 15
- 125000003118 aryl group Chemical group 0.000 claims description 15
- 125000004432 carbon atom Chemical group C* 0.000 claims description 15
- 239000003365 glass fiber Substances 0.000 claims description 15
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 15
- 239000001257 hydrogen Substances 0.000 claims description 15
- 229910052739 hydrogen Inorganic materials 0.000 claims description 15
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 12
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims description 11
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 claims description 9
- 239000004844 aliphatic epoxy resin Substances 0.000 claims description 8
- 125000002768 hydroxyalkyl group Chemical group 0.000 claims description 8
- 239000002253 acid Substances 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 7
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 7
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 6
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 claims description 6
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims description 5
- 125000004122 cyclic group Chemical group 0.000 claims description 5
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 4
- 239000010954 inorganic particle Substances 0.000 claims description 4
- VBZYPJAXRLNOCG-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol;oxepan-2-one Chemical compound O=C1CCCCCO1.OCC(CO)(CO)COCC(CO)(CO)CO VBZYPJAXRLNOCG-UHFFFAOYSA-N 0.000 claims description 3
- 238000009987 spinning Methods 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 1
- 230000003287 optical effect Effects 0.000 abstract description 21
- ARCGXLSVLAOJQL-UHFFFAOYSA-N anhydrous trimellitic acid Natural products OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 abstract description 4
- 239000000047 product Substances 0.000 description 42
- 238000006243 chemical reaction Methods 0.000 description 38
- 239000002904 solvent Substances 0.000 description 37
- 238000001723 curing Methods 0.000 description 35
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 29
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 24
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
- 239000000243 solution Substances 0.000 description 16
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 14
- 239000000463 material Substances 0.000 description 14
- 239000000126 substance Substances 0.000 description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 12
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 12
- 239000003795 chemical substances by application Substances 0.000 description 12
- 238000001035 drying Methods 0.000 description 12
- 239000007787 solid Substances 0.000 description 12
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 10
- 238000011156 evaluation Methods 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 238000003756 stirring Methods 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 239000004744 fabric Substances 0.000 description 9
- 238000003786 synthesis reaction Methods 0.000 description 9
- 239000003963 antioxidant agent Substances 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 8
- 239000002966 varnish Substances 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- 125000001931 aliphatic group Chemical group 0.000 description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 7
- 238000004040 coloring Methods 0.000 description 7
- 239000000706 filtrate Substances 0.000 description 7
- 238000002360 preparation method Methods 0.000 description 7
- 150000003839 salts Chemical class 0.000 description 7
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 125000002723 alicyclic group Chemical group 0.000 description 6
- WOWHHFRSBJGXCM-UHFFFAOYSA-M cetyltrimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCC[N+](C)(C)C WOWHHFRSBJGXCM-UHFFFAOYSA-M 0.000 description 6
- 239000012141 concentrate Substances 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- AOJFQRQNPXYVLM-UHFFFAOYSA-N pyridin-1-ium;chloride Chemical compound [Cl-].C1=CC=[NH+]C=C1 AOJFQRQNPXYVLM-UHFFFAOYSA-N 0.000 description 6
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 6
- HMUNWXXNJPVALC-UHFFFAOYSA-N 1-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C(CN1CC2=C(CC1)NN=N2)=O HMUNWXXNJPVALC-UHFFFAOYSA-N 0.000 description 5
- 238000005160 1H NMR spectroscopy Methods 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 5
- ZMXDDKWLCZADIW-UHFFFAOYSA-N Vilsmeier-Haack reagent Natural products CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 5
- 125000004018 acid anhydride group Chemical group 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 5
- 238000005227 gel permeation chromatography Methods 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- 238000010926 purge Methods 0.000 description 5
- 238000010992 reflux Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 4
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 4
- 230000003078 antioxidant effect Effects 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 4
- 239000012895 dilution Substances 0.000 description 4
- 238000010790 dilution Methods 0.000 description 4
- 238000001914 filtration Methods 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 4
- 150000002430 hydrocarbons Chemical group 0.000 description 4
- 239000004611 light stabiliser Substances 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 239000003973 paint Substances 0.000 description 4
- 150000002989 phenols Chemical class 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 239000011574 phosphorus Substances 0.000 description 4
- 238000000746 purification Methods 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 4
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 3
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 3
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 3
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 3
- 238000007865 diluting Methods 0.000 description 3
- 239000008393 encapsulating agent Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000004745 nonwoven fabric Substances 0.000 description 3
- 229920001778 nylon Polymers 0.000 description 3
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910052717 sulfur Inorganic materials 0.000 description 3
- 239000011593 sulfur Substances 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 239000008096 xylene Substances 0.000 description 3
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 3
- ARXKVVRQIIOZGF-UHFFFAOYSA-N 1,2,4-butanetriol Chemical compound OCCC(O)CO ARXKVVRQIIOZGF-UHFFFAOYSA-N 0.000 description 2
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- WMYINDVYGQKYMI-UHFFFAOYSA-N 2-[2,2-bis(hydroxymethyl)butoxymethyl]-2-ethylpropane-1,3-diol Chemical compound CCC(CO)(CO)COCC(CC)(CO)CO WMYINDVYGQKYMI-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- VMRIVYANZGSGRV-UHFFFAOYSA-N 4-phenyl-2h-triazin-5-one Chemical compound OC1=CN=NN=C1C1=CC=CC=C1 VMRIVYANZGSGRV-UHFFFAOYSA-N 0.000 description 2
- OZJPLYNZGCXSJM-UHFFFAOYSA-N 5-valerolactone Chemical compound O=C1CCCCO1 OZJPLYNZGCXSJM-UHFFFAOYSA-N 0.000 description 2
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-WFGJKAKNSA-N Dimethyl sulfoxide Chemical compound [2H]C([2H])([2H])S(=O)C([2H])([2H])[2H] IAZDPXIOMUYVGZ-WFGJKAKNSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 2
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 230000001588 bifunctional effect Effects 0.000 description 2
- 150000001721 carbon Chemical class 0.000 description 2
- 239000013522 chelant Substances 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 125000000753 cycloalkyl group Chemical group 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 2
- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 239000000976 ink Substances 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 150000002736 metal compounds Chemical class 0.000 description 2
- 239000003094 microcapsule Substances 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- 150000004714 phosphonium salts Chemical class 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 235000018102 proteins Nutrition 0.000 description 2
- 108090000623 proteins and genes Proteins 0.000 description 2
- 102000004169 proteins and genes Human genes 0.000 description 2
- 238000000425 proton nuclear magnetic resonance spectrum Methods 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 238000010526 radical polymerization reaction Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 238000001953 recrystallisation Methods 0.000 description 2
- 238000007142 ring opening reaction Methods 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- 238000004383 yellowing Methods 0.000 description 2
- 150000003751 zinc Chemical class 0.000 description 2
- OBETXYAYXDNJHR-SSDOTTSWSA-M (2r)-2-ethylhexanoate Chemical compound CCCC[C@@H](CC)C([O-])=O OBETXYAYXDNJHR-SSDOTTSWSA-M 0.000 description 1
- JRQJLSWAMYZFGP-UHFFFAOYSA-N 1,1'-biphenyl;phenol Chemical compound OC1=CC=CC=C1.C1=CC=CC=C1C1=CC=CC=C1 JRQJLSWAMYZFGP-UHFFFAOYSA-N 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- ZWVMLYRJXORSEP-UHFFFAOYSA-N 1,2,6-Hexanetriol Chemical compound OCCCCC(O)CO ZWVMLYRJXORSEP-UHFFFAOYSA-N 0.000 description 1
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 1
- LMMTVYUCEFJZLC-UHFFFAOYSA-N 1,3,5-pentanetriol Chemical compound OCCC(O)CCO LMMTVYUCEFJZLC-UHFFFAOYSA-N 0.000 description 1
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical group O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- FBHPRUXJQNWTEW-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=CN1CC1=CC=CC=C1 FBHPRUXJQNWTEW-UHFFFAOYSA-N 0.000 description 1
- XZKLXPPYISZJCV-UHFFFAOYSA-N 1-benzyl-2-phenylimidazole Chemical compound C1=CN=C(C=2C=CC=CC=2)N1CC1=CC=CC=C1 XZKLXPPYISZJCV-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- KWRSKZMCJVFUGU-UHFFFAOYSA-N 1h-inden-1-ol Chemical class C1=CC=C2C(O)C=CC2=C1 KWRSKZMCJVFUGU-UHFFFAOYSA-N 0.000 description 1
- BOKRKKCPFKUCIZ-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol;2-methyloxirane Chemical compound CC1CO1.OCC(CO)(CO)CO BOKRKKCPFKUCIZ-UHFFFAOYSA-N 0.000 description 1
- VFFFESPCCPXZOQ-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol;oxirane Chemical compound C1CO1.OCC(CO)(CO)CO VFFFESPCCPXZOQ-UHFFFAOYSA-N 0.000 description 1
- VFIQRPWNGAODRO-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol;oxolane Chemical compound C1CCOC1.OCC(CO)(CO)CO VFIQRPWNGAODRO-UHFFFAOYSA-N 0.000 description 1
- LDXJRKWFNNFDSA-UHFFFAOYSA-N 2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound C1CN(CC2=NNN=C21)CC(=O)N3CCN(CC3)C4=CN=C(N=C4)NCC5=CC(=CC=C5)OC(F)(F)F LDXJRKWFNNFDSA-UHFFFAOYSA-N 0.000 description 1
- VXHYVVAUHMGCEX-UHFFFAOYSA-N 2-(2-hydroxyphenoxy)phenol Chemical compound OC1=CC=CC=C1OC1=CC=CC=C1O VXHYVVAUHMGCEX-UHFFFAOYSA-N 0.000 description 1
- SZSSMFVYZRQGIM-UHFFFAOYSA-N 2-(hydroxymethyl)-2-propylpropane-1,3-diol Chemical compound CCCC(CO)(CO)CO SZSSMFVYZRQGIM-UHFFFAOYSA-N 0.000 description 1
- ZDAWZDFBPUUDAY-UHFFFAOYSA-N 2-Deoxy-D-ribitol Chemical compound OCCC(O)C(O)CO ZDAWZDFBPUUDAY-UHFFFAOYSA-N 0.000 description 1
- LUSCNZBJFBNVDT-UHFFFAOYSA-N 2-[[1-(oxiran-2-ylmethoxy)cyclohexyl]oxymethyl]oxirane Chemical compound C1OC1COC1(OCC2OC2)CCCCC1 LUSCNZBJFBNVDT-UHFFFAOYSA-N 0.000 description 1
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SNZYOYGFWBZAQY-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;2-methyloxirane Chemical compound CC1CO1.CCC(CO)(CO)CO SNZYOYGFWBZAQY-UHFFFAOYSA-N 0.000 description 1
- RSROEZYGRKHVMN-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;oxirane Chemical compound C1CO1.CCC(CO)(CO)CO RSROEZYGRKHVMN-UHFFFAOYSA-N 0.000 description 1
- LTEZFGUQABCALX-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;oxolane Chemical compound C1CCOC1.CCC(CO)(CO)CO LTEZFGUQABCALX-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- QXSNXUCNBZLVFM-UHFFFAOYSA-N 2-methyl-1h-imidazole;1,3,5-triazinane-2,4,6-trione Chemical compound CC1=NC=CN1.O=C1NC(=O)NC(=O)N1 QXSNXUCNBZLVFM-UHFFFAOYSA-N 0.000 description 1
- XYHGSPUTABMVOC-UHFFFAOYSA-N 2-methylbutane-1,2,4-triol Chemical compound OCC(O)(C)CCO XYHGSPUTABMVOC-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- BSKHPKMHTQYZBB-UHFFFAOYSA-N 2-methylpyridine Chemical compound CC1=CC=CC=N1 BSKHPKMHTQYZBB-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- RJIQELZAIWFNTQ-UHFFFAOYSA-N 2-phenyl-1h-imidazole;1,3,5-triazinane-2,4,6-trione Chemical compound O=C1NC(=O)NC(=O)N1.C1=CNC(C=2C=CC=CC=2)=N1 RJIQELZAIWFNTQ-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- SESYNEDUKZDRJL-UHFFFAOYSA-N 3-(2-methylimidazol-1-yl)propanenitrile Chemical compound CC1=NC=CN1CCC#N SESYNEDUKZDRJL-UHFFFAOYSA-N 0.000 description 1
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 description 1
- SZUPZARBRLCVCB-UHFFFAOYSA-N 3-(2-undecylimidazol-1-yl)propanenitrile Chemical compound CCCCCCCCCCCC1=NC=CN1CCC#N SZUPZARBRLCVCB-UHFFFAOYSA-N 0.000 description 1
- HORNXRXVQWOLPJ-UHFFFAOYSA-N 3-chlorophenol Chemical compound OC1=CC=CC(Cl)=C1 HORNXRXVQWOLPJ-UHFFFAOYSA-N 0.000 description 1
- VHDMXHLHMMROPO-UHFFFAOYSA-N 3-deoxypentitol Chemical compound OCC(O)CC(O)CO VHDMXHLHMMROPO-UHFFFAOYSA-N 0.000 description 1
- AHHQDHCTHYTBSV-UHFFFAOYSA-N 3-methylpentane-1,3,5-triol Chemical compound OCCC(O)(C)CCO AHHQDHCTHYTBSV-UHFFFAOYSA-N 0.000 description 1
- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 description 1
- YKCCXOHQOVXCIG-UHFFFAOYSA-N 5-(1-cyanoethyl)-2-(2-phenylethoxymethyl)imidazole-1,4-dicarbonitrile Chemical compound C(#N)C(C)C=1N(C(=NC=1C#N)COCCC1=CC=CC=C1)C#N YKCCXOHQOVXCIG-UHFFFAOYSA-N 0.000 description 1
- XBWHBPMCIGBGTA-UHFFFAOYSA-N 5-methyl-2-oxaspiro[3.5]non-5-ene-1,3-dione Chemical compound CC1=CCCCC11C(=O)OC1=O XBWHBPMCIGBGTA-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- HOSGXJWQVBHGLT-UHFFFAOYSA-N 6-hydroxy-3,4-dihydro-1h-quinolin-2-one Chemical group N1C(=O)CCC2=CC(O)=CC=C21 HOSGXJWQVBHGLT-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 235000017060 Arachis glabrata Nutrition 0.000 description 1
- 244000105624 Arachis hypogaea Species 0.000 description 1
- 235000010777 Arachis hypogaea Nutrition 0.000 description 1
- 235000018262 Arachis monticola Nutrition 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 235000021357 Behenic acid Nutrition 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- DDRHFMPLKPRDPQ-UHFFFAOYSA-N CCC[Zr](CCC)(CCC)CCC Chemical compound CCC[Zr](CCC)(CCC)CCC DDRHFMPLKPRDPQ-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229920003043 Cellulose fiber Polymers 0.000 description 1
- 229920002101 Chitin Polymers 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- ZPAKUZKMGJJMAA-UHFFFAOYSA-N Cyclohexane-1,2,4,5-tetracarboxylic acid Chemical compound OC(=O)C1CC(C(O)=O)C(C(O)=O)CC1C(O)=O ZPAKUZKMGJJMAA-UHFFFAOYSA-N 0.000 description 1
- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical compound CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 description 1
- 239000004386 Erythritol Substances 0.000 description 1
- UNXHWFMMPAWVPI-UHFFFAOYSA-N Erythritol Natural products OCC(O)C(O)CO UNXHWFMMPAWVPI-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical class OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 229920002821 Modacrylic Polymers 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 108010073771 Soybean Proteins Proteins 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- AWMVMTVKBNGEAK-UHFFFAOYSA-N Styrene oxide Chemical compound C1OC1C1=CC=CC=C1 AWMVMTVKBNGEAK-UHFFFAOYSA-N 0.000 description 1
- DHXVGJBLRPWPCS-UHFFFAOYSA-N Tetrahydropyran Chemical compound C1CCOCC1 DHXVGJBLRPWPCS-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- HEDRZPFGACZZDS-MICDWDOJSA-N Trichloro(2H)methane Chemical compound [2H]C(Cl)(Cl)Cl HEDRZPFGACZZDS-MICDWDOJSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 240000008042 Zea mays Species 0.000 description 1
- 235000005824 Zea mays ssp. parviglumis Nutrition 0.000 description 1
- 235000002017 Zea mays subsp mays Nutrition 0.000 description 1
- QOVXJSYFVADYJY-UHFFFAOYSA-N [2-[4-[4,6-bis(4-phenylphenyl)-1,3,5-triazin-2-yl]-3-hydroxyphenyl]-6-methylheptyl] propanoate Chemical compound CCC(=O)OCC(CCCC(C)C)c1ccc(c(O)c1)-c1nc(nc(n1)-c1ccc(cc1)-c1ccccc1)-c1ccc(cc1)-c1ccccc1 QOVXJSYFVADYJY-UHFFFAOYSA-N 0.000 description 1
- OAJHWYJGCSAOTQ-UHFFFAOYSA-N [Zr].CCCCCCCCO.CCCCCCCCO.CCCCCCCCO.CCCCCCCCO Chemical compound [Zr].CCCCCCCCO.CCCCCCCCO.CCCCCCCCO.CCCCCCCCO OAJHWYJGCSAOTQ-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000011354 acetal resin Substances 0.000 description 1
- YRRFBANPGRXQNJ-UHFFFAOYSA-M acetyl(trimethyl)azanium;bromide Chemical compound [Br-].CC(=O)[N+](C)(C)C YRRFBANPGRXQNJ-UHFFFAOYSA-M 0.000 description 1
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical class CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 238000012644 addition polymerization Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 235000010443 alginic acid Nutrition 0.000 description 1
- 229920000615 alginic acid Polymers 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- OBETXYAYXDNJHR-UHFFFAOYSA-N alpha-ethylcaproic acid Natural products CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- LFYJSSARVMHQJB-QIXNEVBVSA-N bakuchiol Chemical compound CC(C)=CCC[C@@](C)(C=C)\C=C\C1=CC=C(O)C=C1 LFYJSSARVMHQJB-QIXNEVBVSA-N 0.000 description 1
- QBLDFAIABQKINO-UHFFFAOYSA-N barium borate Chemical compound [Ba+2].[O-]B=O.[O-]B=O QBLDFAIABQKINO-UHFFFAOYSA-N 0.000 description 1
- 229940116226 behenic acid Drugs 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- VEZXCJBBBCKRPI-UHFFFAOYSA-N beta-propiolactone Chemical compound O=C1CCO1 VEZXCJBBBCKRPI-UHFFFAOYSA-N 0.000 description 1
- 229910021538 borax Inorganic materials 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229930188620 butyrolactone Natural products 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- GBAOBIBJACZTNA-UHFFFAOYSA-L calcium sulfite Chemical compound [Ca+2].[O-]S([O-])=O GBAOBIBJACZTNA-UHFFFAOYSA-L 0.000 description 1
- 235000010261 calcium sulphite Nutrition 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 239000005018 casein Substances 0.000 description 1
- BECPQYXYKAMYBN-UHFFFAOYSA-N casein, tech. Chemical compound NCCCCC(C(O)=O)N=C(O)C(CC(O)=O)N=C(O)C(CCC(O)=N)N=C(O)C(CC(C)C)N=C(O)C(CCC(O)=O)N=C(O)C(CC(O)=O)N=C(O)C(CCC(O)=O)N=C(O)C(C(C)O)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=O)N=C(O)C(CCC(O)=O)N=C(O)C(COP(O)(O)=O)N=C(O)C(CCC(O)=N)N=C(O)C(N)CC1=CC=CC=C1 BECPQYXYKAMYBN-UHFFFAOYSA-N 0.000 description 1
- 235000021240 caseins Nutrition 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 238000004440 column chromatography Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 235000005822 corn Nutrition 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 239000012043 crude product Substances 0.000 description 1
- 150000001934 cyclohexanes Chemical class 0.000 description 1
- RHINSRUDDXGHLV-UHFFFAOYSA-N decane-1,2,10-triol Chemical compound OCCCCCCCCC(O)CO RHINSRUDDXGHLV-UHFFFAOYSA-N 0.000 description 1
- DAFWFNCOQYVQDQ-UHFFFAOYSA-N decane-1,2,9,10-tetrol Chemical compound OCC(O)CCCCCCC(O)CO DAFWFNCOQYVQDQ-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- PWWSSIYVTQUJQQ-UHFFFAOYSA-N distearyl thiodipropionate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCCCCCC PWWSSIYVTQUJQQ-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- UNXHWFMMPAWVPI-ZXZARUISSA-N erythritol Chemical compound OC[C@H](O)[C@H](O)CO UNXHWFMMPAWVPI-ZXZARUISSA-N 0.000 description 1
- 235000019414 erythritol Nutrition 0.000 description 1
- 229940009714 erythritol Drugs 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- AXCZRQHGMPTZPR-UHFFFAOYSA-N ethane-1,1,2,2-tetrol Chemical compound OC(O)C(O)O AXCZRQHGMPTZPR-UHFFFAOYSA-N 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 229940015043 glyoxal Drugs 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- GNOIPBMMFNIUFM-UHFFFAOYSA-N hexamethylphosphoric triamide Chemical compound CN(C)P(=O)(N(C)C)N(C)C GNOIPBMMFNIUFM-UHFFFAOYSA-N 0.000 description 1
- AMXRXGOSEWMPEF-UHFFFAOYSA-N hexane-1,2,5,6-tetrol Chemical compound OCC(O)CCC(O)CO AMXRXGOSEWMPEF-UHFFFAOYSA-N 0.000 description 1
- 150000003840 hydrochlorides Chemical class 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 229960001545 hydrotalcite Drugs 0.000 description 1
- 229910001701 hydrotalcite Inorganic materials 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 description 1
- YAMHXTCMCPHKLN-UHFFFAOYSA-N imidazolidin-2-one Chemical compound O=C1NCCN1 YAMHXTCMCPHKLN-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- QLPMKRZYJPNIRP-UHFFFAOYSA-M methyl(trioctyl)azanium;bromide Chemical compound [Br-].CCCCCCCC[N+](C)(CCCCCCCC)CCCCCCCC QLPMKRZYJPNIRP-UHFFFAOYSA-M 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- GXMIHVHJTLPVKL-UHFFFAOYSA-N n,n,2-trimethylpropanamide Chemical compound CC(C)C(=O)N(C)C GXMIHVHJTLPVKL-UHFFFAOYSA-N 0.000 description 1
- AJFDBNQQDYLMJN-UHFFFAOYSA-N n,n-diethylacetamide Chemical compound CCN(CC)C(C)=O AJFDBNQQDYLMJN-UHFFFAOYSA-N 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical class C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- 150000004780 naphthols Chemical class 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000004923 naphthylmethyl group Chemical group C1(=CC=CC2=CC=CC=C12)C* 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000012454 non-polar solvent Substances 0.000 description 1
- CUUVVDHSUIKLPH-UHFFFAOYSA-N nonane-1,2,9-triol Chemical compound OCCCCCCCC(O)CO CUUVVDHSUIKLPH-UHFFFAOYSA-N 0.000 description 1
- SJYNFBVQFBRSIB-UHFFFAOYSA-N norbornadiene Chemical compound C1=CC2C=CC1C2 SJYNFBVQFBRSIB-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- UHGIMQLJWRAPLT-UHFFFAOYSA-N octadecyl dihydrogen phosphate Chemical compound CCCCCCCCCCCCCCCCCCOP(O)(O)=O UHGIMQLJWRAPLT-UHFFFAOYSA-N 0.000 description 1
- WRKCIHRWQZQBOL-UHFFFAOYSA-N octyl dihydrogen phosphate Chemical compound CCCCCCCCOP(O)(O)=O WRKCIHRWQZQBOL-UHFFFAOYSA-N 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 239000011146 organic particle Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 235000020232 peanut Nutrition 0.000 description 1
- MQYIQOANLHJLJN-UHFFFAOYSA-N pentane-1,1,5,5-tetrol Chemical compound OC(O)CCCC(O)O MQYIQOANLHJLJN-UHFFFAOYSA-N 0.000 description 1
- WEAYWASEBDOLRG-UHFFFAOYSA-N pentane-1,2,5-triol Chemical compound OCCCC(O)CO WEAYWASEBDOLRG-UHFFFAOYSA-N 0.000 description 1
- GYUPBLLGIHQRGT-UHFFFAOYSA-N pentane-2,4-dione;titanium Chemical compound [Ti].CC(=O)CC(C)=O GYUPBLLGIHQRGT-UHFFFAOYSA-N 0.000 description 1
- SGNLDVYVSFANHW-UHFFFAOYSA-N pentane-2,4-dione;zirconium Chemical compound [Zr].CC(=O)CC(C)=O SGNLDVYVSFANHW-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000002530 phenolic antioxidant Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- JHYGKRLFANBDIF-UHFFFAOYSA-N phosphane;triphenylphosphane Chemical compound P.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 JHYGKRLFANBDIF-UHFFFAOYSA-N 0.000 description 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920006306 polyurethane fiber Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229960000380 propiolactone Drugs 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000031070 response to heat Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- CBXWGGFGZDVPNV-UHFFFAOYSA-N so4-so4 Chemical class OS(O)(=O)=O.OS(O)(=O)=O CBXWGGFGZDVPNV-UHFFFAOYSA-N 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- 235000019710 soybean protein Nutrition 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-L sulfite Chemical class [O-]S([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-L 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- JRMUNVKIHCOMHV-UHFFFAOYSA-M tetrabutylammonium bromide Chemical compound [Br-].CCCC[N+](CCCC)(CCCC)CCCC JRMUNVKIHCOMHV-UHFFFAOYSA-M 0.000 description 1
- LVEOKSIILWWVEO-UHFFFAOYSA-N tetradecyl 3-(3-oxo-3-tetradecoxypropyl)sulfanylpropanoate Chemical compound CCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCC LVEOKSIILWWVEO-UHFFFAOYSA-N 0.000 description 1
- BRKFQVAOMSWFDU-UHFFFAOYSA-M tetraphenylphosphanium;bromide Chemical compound [Br-].C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 BRKFQVAOMSWFDU-UHFFFAOYSA-M 0.000 description 1
- USFPINLPPFWTJW-UHFFFAOYSA-N tetraphenylphosphonium Chemical compound C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 USFPINLPPFWTJW-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- SQBBHCOIQXKPHL-UHFFFAOYSA-N tributylalumane Chemical compound CCCC[Al](CCCC)CCCC SQBBHCOIQXKPHL-UHFFFAOYSA-N 0.000 description 1
- VLCLHFYFMCKBRP-UHFFFAOYSA-N tricalcium;diborate Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]B([O-])[O-].[O-]B([O-])[O-] VLCLHFYFMCKBRP-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- COIOYMYWGDAQPM-UHFFFAOYSA-N tris(2-methylphenyl)phosphane Chemical compound CC1=CC=CC=C1P(C=1C(=CC=CC=1)C)C1=CC=CC=C1C COIOYMYWGDAQPM-UHFFFAOYSA-N 0.000 description 1
- BSVBQGMMJUBVOD-UHFFFAOYSA-N trisodium borate Chemical compound [Na+].[Na+].[Na+].[O-]B([O-])[O-] BSVBQGMMJUBVOD-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D313/00—Heterocyclic compounds containing rings of more than six members having one oxygen atom as the only ring hetero atom
- C07D313/02—Seven-membered rings
- C07D313/04—Seven-membered rings not condensed with other rings
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D307/00—Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom
- C07D307/02—Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom not condensed with other rings
- C07D307/04—Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom not condensed with other rings having no double bonds between ring members or between ring members and non-ring members
- C07D307/06—Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom not condensed with other rings having no double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, directly attached to ring carbon atoms
- C07D307/08—Preparation of tetrahydrofuran
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
(과제) 투명성, 내열성, 강인성, 내착색성이 우수한 경화물을 부여하는 수지 조성물을 얻는 것, 특히 광학 부품에 적합한 특성을 갖는 것을 얻는 것이다.
(해결 수단) 1분자 중에 적어도 3개의 수산기를 함유하는 다가 알코올 (A)와 무수 트리멜리트산 할라이드 및 핵수소 첨가 무수 트리멜리트산 할라이드의 혼합물 또는 핵수소 첨가 무수 트리멜리트산 할라이드와를 반응시켜 얻어지는 다관능 산 무수물, 다가 알코올 (A)에 알킬렌옥사이드, 환상 에테르 및, 환상 에스테르로 이루어지는 군으로부터 선택되는 1개 이상을 반응시켜 얻어지는 다가 알코올 (B)와 무수 트리멜리트산 할라이드 및 핵수소 첨가 무수 트리멜리트산 할라이드와를 반응시켜 얻어지는 다관능 산 무수물 및, 그들 다관능 산 무수물과 1분자 중에 적어도 1개의 에폭시기를 갖는 화합물을 포함하는 열경화성 수지 조성물이다.(Task) It is to obtain a resin composition that provides a cured product excellent in transparency, heat resistance, toughness, and color resistance, and particularly those having properties suitable for optical parts.
(Solution) Obtained by reacting a mixture of polyhydric alcohol (A) containing at least three hydroxyl groups in one molecule with trimellitic anhydride and anhydrous trimellitic anhydride or nuclear hydrogenated trimellitic anhydride Polyfunctional acid anhydride, polyhydric alcohol (A), polyhydric alcohol (B) obtained by reacting at least one selected from the group consisting of alkylene oxide, cyclic ether, and cyclic ester, trimellitic anhydride, and nuclear hydrogenation anhydride It is a thermosetting resin composition containing a polyfunctional acid anhydride obtained by reacting a trimellitic acid halide with a compound having at least one epoxy group in one molecule with the polyfunctional acid anhydride.
Description
본 발명은, 다관능 산 무수물, 당해 다관능 산 무수물을 포함하는 열경화성 수지 조성물 및, 그의 경화물에 관한 것이다. 본 발명의 경화물은, 투명성, 내열성, 강인성, 내착색성이 우수한 특성을 갖는다. The present invention relates to a polyfunctional acid anhydride, a thermosetting resin composition containing the polyfunctional acid anhydride, and a cured product thereof. The cured product of the present invention has properties excellent in transparency, heat resistance, toughness, and color resistance.
산 무수물은, 고열 안정성이나 투명성, 양호한 전기 특성 또는 내약품성 등과 함께, 축합체의 형성이나 반응성이 좋은 점 등, 가교제, 축합제 등으로서 우수한 성능을 구비하고 있어, 고분자 제조 원재료로서 널리 사용되고 있다. 또한 산 무수물은 에폭시 수지의 경화제로서도 사용할 수 있는 것이 알려져 있다. The acid anhydride has excellent performance as a crosslinking agent, a condensing agent, etc., such as high thermal stability, transparency, good electrical properties, chemical resistance, etc., and has good condensation formation and reactivity, and is widely used as a raw material for polymer production. It is also known that acid anhydrides can also be used as curing agents for epoxy resins.
에폭시 수지를 함유하는 경화성 수지 조성물은, 내열성이 우수한 수지로서, 폭넓은 분야에서 이용되고 있다. 최근, 당해 조성물은 옵토일렉트로닉스 관련 분야에 있어서의 이용이 주목받고 있다. 특히 최근의 고도 정보화에 수반하여, 방대한 정보를 원활하게 전송, 처리하기 위해, 종래의 전기 배선에 의한 신호 전송으로 바뀌어, 광신호를 살린 기술이 개발되어 가는 가운데, 광도파로, 청색 LED 및, 광반도체 등의 광학 부품의 분야에 있어서는 투명성, 강인성 및 내열성이 우수한 경화물을 부여하는 수지 조성물의 개발이 요망되고 있다. The curable resin composition containing an epoxy resin is a resin excellent in heat resistance, and is used in a wide range of fields. Recently, the use of the composition in the field related to optoelectronics has attracted attention. In particular, with the recent advance in information technology, in order to smoothly transmit and process vast amounts of information, it has been converted to signal transmission by conventional electrical wiring, and optical technologies, optical waveguides, blue LEDs, and optical light are being developed while technologies utilizing optical signals are being developed. In the field of optical components such as semiconductors, it is desired to develop a resin composition that provides a cured product excellent in transparency, toughness, and heat resistance.
에폭시 수지를 함유하는 경화성 수지 조성물에 있어서의 산 무수물로서는, 방향족 산 무수물 및 지환식 산 무수물이 잘 알려져 있다. 방향족 산 무수물의 사용예로서는, 예를 들면, 특허문헌 1의 산 3무수물을 들 수 있다. 그러나, 이 화합물은 방향족 유래의 착색 및, 단파장의 광을 흡수하기 쉬워짐으로써, 투명성 및 내착색성이 충분하지 않다. 또한, 지환식 산 무수물의 사용예로서는, 예를 들면, 특허문헌 2의 메틸사이클로헥센디카본산 무수물, 특허문헌 3의 트리사이클로환을 갖는 테트라카본산 2무수물, 특허문헌 4의 에스테르기를 갖는 테트라카본산 2무수물을 들 수 있다. 이들 경화물은 높은 투명성을 부여하지만, 방향족 산 무수물과 비교하여 골격이 유연하고, 또한 2관능인 점에서 마찬가지로 내열성이 충분하지 않다. 또한, 특허문헌 5의 이소시아누레이트 화합물은 3관능이지만, 이소시아누레이트 유래의 착색에 의해 경화물의 투명성이 충분하지 않다. As the acid anhydride in the curable resin composition containing an epoxy resin, aromatic acid anhydrides and alicyclic acid anhydrides are well known. Examples of the use of the aromatic acid anhydride include, for example, acid 3 anhydride in Patent Document 1. However, this compound is not easily sufficient in transparency and color resistance because it is easy to absorb aromatic-derived coloring and short-wavelength light. In addition, examples of the use of the alicyclic acid anhydride include, for example, methylcyclohexene dicarboxylic acid anhydride in Patent Document 2, tetracarboxylic acid anhydride having a tricyclo ring in Patent Document 3, and tetracarboxylic acid having an ester group in Patent Document 4 2 Anhydride is mentioned. Although these hardened|cured materials provide high transparency, the heat resistance is not enough similarly because a skeleton is flexible and bifunctional compared with an aromatic acid anhydride. Moreover, although the isocyanurate compound of patent document 5 is trifunctional, transparency of the hardened|cured material is not sufficient by coloring derived from isocyanurate.
본 발명은, 강인성, 내열성, 투명성, 내착색성이 우수한 경화물을 부여하는 다관능 산 무수물, 및, 당해 다관능 산 무수물을 포함하는 열경화성 수지 조성물을 얻는 것을 과제로 한다. An object of the present invention is to obtain a polyfunctional acid anhydride that provides a cured product excellent in toughness, heat resistance, transparency, and color resistance, and a thermosetting resin composition containing the polyfunctional acid anhydride.
본 발명자들은, 적어도 1분자 중에 3개의 수산기를 갖는 다가 알코올과 핵수소 첨가 무수 트리멜리트산 할라이드 및 무수 트리멜리트산 할라이드의 혼합물 또는 핵수소 첨가 무수 트리멜리트산 할라이드와를 반응시켜 얻어지는 화합물이, 보다 높은 광학 특성을 유지하면서, 강인성이나 내열성, 내착색성을 갖는 경화물을 부여하는 것을 발견하여, 본 발명에 이르렀다. The present inventors are a compound obtained by reacting a mixture of a polyhydric alcohol having three hydroxyl groups in at least one molecule with a nuclear hydrogenated trimellitic anhydride and a trimellitic anhydride halide, or a nuclear hydrogenated trimellitic anhydride halide. It has been found that a cured product having toughness, heat resistance, and color resistance is provided while maintaining high optical properties, leading to the present invention.
즉, 본 발명은, 하기 일반식 (1):That is, the present invention, the following general formula (1):
(식 중, R1, R2, R3, R4, R5, R6은 각각 독립적이고, R1, R3, R4, R5, R6은 수소 원자, 수산기, 탄소수 1∼11의 탄화수소기, 또는 탄소수 1∼4의 하이드록시알킬기를 나타내고, R2는 수산기, 또는 탄소수 1∼4의 하이드록시알킬기를 나타내고; l은 0∼11, m과 n은 각각 1∼11의 정수를 나타냄)로 나타나는 1분자 중에 적어도 3개의 수산기를 함유하는 다가 알코올 (A)와 핵수소 첨가 무수 트리멜리트산 할라이드 및 무수 트리멜리트산 할라이드의 혼합물 또는 핵수소 첨가 무수 트리멜리트산 할라이드와를 반응시켜 얻어지는 다관능 산 무수물에 관한 것이다.(In the formula, R 1 , R 2 , R 3 , R 4 , R 5 , R 6 are each independently, and R 1 , R 3 , R 4 , R 5 , R 6 are hydrogen atoms, hydroxyl groups, and 1 to 11 carbon atoms. Represents a hydrocarbon group or a hydroxyalkyl group having 1 to 4 carbon atoms, R 2 represents a hydroxyl group, or a hydroxyalkyl group having 1 to 4 carbon atoms; l is 0 to 11, m and n are integers of 1 to 11, respectively. Obtained by reacting a mixture of a polyhydric alcohol (A) containing at least three hydroxyl groups with one nucleus anhydrous trimellitic anhydride and trimellitic anhydride, or a nuclear hydrogenated trimellitic anhydride It relates to polyfunctional acid anhydrides.
또한, 상기 다가 알코올 (A)에 알킬렌옥사이드, 환상 에테르 및, 환상 에스테르로 이루어지는 군으로부터 선택되는 1 이상을 반응시켜 얻어지는 다가 알코올 (B)와 핵수소 첨가 무수 트리멜리트산 할라이드 및 무수 트리멜리트산 할라이드의 혼합물 또는 핵수소 첨가 무수 트리멜리트산 할라이드와를 반응시켜 얻어지는 다관능 산 무수물에 관한 것이다.Further, the polyhydric alcohol (B) obtained by reacting the polyhydric alcohol (A) with at least one selected from the group consisting of alkylene oxide, cyclic ether, and cyclic ester, and trimellitic anhydride with nuclear hydrogenation and trimellitic anhydride The present invention relates to a polyfunctional acid anhydride obtained by reacting a mixture of halides or trimellitic anhydride added with nuclear hydrogen.
또한, 상기 다가 알코올 (A) 또는 (B)의 수산기의 전체 수의 10% 이상 75% 이하가 무수 트리멜리트산 할라이드와 반응하고, 나머지의 수산기와 핵수소 첨가 무수 트리멜리트산 할라이드가 반응하여 얻어지는 다관능 산 무수물에 관한 것이다.Further, 10% or more and 75% or less of the total number of hydroxyl groups of the polyhydric alcohol (A) or (B) is reacted with trimellitic anhydride, and the remaining hydroxyl group and trimellitic anhydride with nuclear hydrogen reaction are obtained. It relates to polyfunctional acid anhydrides.
또한, 일반식 (1)의 R1, R2, R3, R4, R5, R6이 탄소수 1∼4의 하이드록시알킬기인 상기 다가 알코올 (A) 또는 당해 다가 알코올 (A)에 알킬렌옥사이드, 환상 에테르 및, 환상 에스테르로 이루어지는 군으로부터 선택되는 1 이상을 반응시켜 얻어지는 다가 알코올 (B)와 핵수소 첨가 무수 트리멜리트산 할라이드 및 무수 트리멜리트산 할라이드의 혼합물 또는 핵수소 첨가 무수 트리멜리트산 할라이드와를 반응시켜 얻어지는 다관능 산 무수물에 관한 것이다.In addition, R 1 , R 2 , R 3 , R 4 , R 5 , and R 6 of the general formula (1) are alkyl groups of the polyhydric alcohol (A) or the polyhydric alcohol (A) having 1 to 4 carbon atoms. A mixture of polyhydric alcohol (B) obtained by reacting at least one selected from the group consisting of renoxide, cyclic ether, and cyclic ester with trimellitic anhydride and nuclear trimellitic anhydride, or trimellitic anhydride with nuclear hydrogen It relates to a polyfunctional acid anhydride obtained by reacting with a triacid halide.
또한, 상기 다가 알코올 (A) 또는 (B)가 3∼6가 알코올인 다관능 산 무수물에 관한 것이다.Moreover, it is related with the polyfunctional acid anhydride whose said polyhydric alcohol (A) or (B) is a 3-6 hexavalent alcohol.
또한, 상기 다가 알코올 (A)가 트리메틸올 또는 디펜타에리트리톨인 다관능 산 무수물에 관한 것이다.Moreover, the said polyhydric alcohol (A) is related to the polyfunctional acid anhydride which is trimethylol or dipentaerythritol.
또한, 상기 다가 알코올 (B)가 디펜타에리트리톨에틸렌옥사이드 부가물, 디펜타에리트리톨프로필렌옥사이드 부가물, 디펜타에리트리톨테트라하이드로푸란 부가물, 디펜타에리트리톨카프로락톤 부가물인 다관능 산 무수물에 관한 것이다.In addition, the polyhydric alcohol (B) is a dipentaerythritol ethylene oxide adduct, dipentaerythritol propylene oxide adduct, dipentaerythritol tetrahydrofuran adduct, dipentaerythritol caprolactone adduct, polyfunctional acid anhydride It is about.
또한, 상기 다가 알코올 (B)가 펜타에리트리톨 4몰 에틸렌옥사이드 부가물, 디펜타에리트리톨 6몰 에틸렌옥사이드 부가물, 디펜타에리트리톨 4몰 카프로락톤 부가물인 다관능 산 무수물에 관한 것이다.In addition, the polyhydric alcohol (B) relates to a polyfunctional acid anhydride which is a pentaerythritol 4 mol ethylene oxide adduct, a dipentaerythritol 6 mol ethylene oxide adduct, and a dipentaerythritol 4 mol caprolactone adduct.
또한, 1분자 중에 적어도 1개의 에폭시기를 갖는 화합물과 상기 다관능 산 무수물을 포함하는 열경화성 수지 조성물에 관한 것이다.Moreover, it is related with the thermosetting resin composition containing the compound which has at least 1 epoxy group in 1 molecule, and the said polyfunctional acid anhydride.
또한, 상기 1분자 중에 적어도 1개의 에폭시기를 갖는 화합물이 지방족형 에폭시 수지, 방향족형 에폭시 수지 및 공중합형 에폭시 수지로부터 선택되는 1종 이상인, 상기 다관능 산 무수물을 포함하는 열경화성 수지 조성물에 관한 것이다.Moreover, it is related with the thermosetting resin composition containing the said polyfunctional acid anhydride in which the compound which has at least 1 epoxy group in 1 molecule is 1 or more types chosen from aliphatic type epoxy resin, aromatic type epoxy resin, and copolymer type epoxy resin.
또한, 상기 1분자 중에 적어도 1개의 에폭시기를 갖는 화합물이 지방족형 에폭시 수지 및 방향족형 에폭시 수지로부터 선택되는 1종 이상인, 상기 다관능 산 무수물을 포함하는 열경화성 수지 조성물에 관한 것이다.Further, the present invention relates to a thermosetting resin composition comprising the polyfunctional acid anhydride, wherein at least one compound having at least one epoxy group in the molecule is selected from aliphatic epoxy resins and aromatic epoxy resins.
또한, 상기 지방족형 에폭시 수지가 지방족 환상 구조를 갖는 에폭시 수지인, 상기 다관능 산 무수물을 포함하는 열경화성 수지 조성물에 관한 것이다.Further, the present invention relates to a thermosetting resin composition containing the polyfunctional acid anhydride, wherein the aliphatic epoxy resin is an epoxy resin having an aliphatic cyclic structure.
또한, 상기 방향족형 에폭시 수지가 (4-(4-(1,1-비스(p-하이드록시페닐)-에틸)-α,α-디메틸벤질)페놀)형 에폭시 수지 및 비스페놀 A 에폭시 수지로부터 선택되는 1종 이상인, 상기 다관능 산 무수물을 포함하는 열경화성 수지 조성물에 관한 것이다.Also, the aromatic epoxy resin is selected from (4-(4-(1,1-bis(p-hydroxyphenyl)-ethyl)-α,α-dimethylbenzyl)phenol) type epoxy resin and bisphenol A epoxy resin. It relates to the thermosetting resin composition containing the said polyfunctional acid anhydride which is 1 or more types.
또한, 상기 1분자 중에 적어도 1개의 에폭시기를 갖는 화합물이 공중합형 에폭시 수지인, 상기 다관능 산 무수물을 포함하는 열경화성 수지 조성물에 관한 것이다.Moreover, it is related with the thermosetting resin composition containing the said polyfunctional acid anhydride in which the compound which has at least 1 epoxy group in the said 1 molecule is a copolymerized epoxy resin.
또한, 상기 다가 알코올 (A), 무수 트리멜리트산 할라이드 및 핵수소 첨가 무수 트리멜리트산 할라이드에 상용(相溶)되지 않는 입자 (C-1) 또는 섬유 (C-2)를 포함하는 열경화성 수지 조성물에 관한 것이다.In addition, a thermosetting resin composition comprising particles (C-1) or fibers (C-2) that are not compatible with the polyhydric alcohol (A), trimellitic anhydride, and trimellitic anhydride with nuclear hydrogenation It is about.
또한, 상기 입자 (C-1)이 무기 입자인 상기 열경화성 수지 조성물에 관한 것이다.Moreover, it is related with the said thermosetting resin composition in which the said particle (C-1) is an inorganic particle.
또한, 상기 섬유 (C-2)가 유리 섬유인 상기 열경화성 수지 조성물에 관한 것이다.Moreover, it is related with the said thermosetting resin composition in which the said fiber (C-2) is glass fiber.
또한, 상기 섬유 (C-2)가 유리 섬유를 방사(紡絲)하고, 추가로 직제(織製)하여 이루어지는 유리 크로스인 상기 열경화성 수지 조성물에 관한 것이다.Further, the fiber (C-2) relates to the thermosetting resin composition, which is a glass cross formed by spinning glass fibers and further woven.
또한, 상기 열경화성 수지 조성물을 반(半)경화 상태로 형상을 부여한 프리프레그에 관한 것이다.Further, it relates to a prepreg in which the thermosetting resin composition is given a shape in a semi-cured state.
또한, 상기 열경화성 수지 조성물에 용제를 첨가한 바니시에 관한 것이다.Moreover, it is related with the varnish which added a solvent to the said thermosetting resin composition.
또한, 상기 열경화성 수지 조성물을 경화시킨 경화물에 관한 것이다.Moreover, it is related with the hardened|cured material which hardened the said thermosetting resin composition.
또한, 경화 후의 열경화성 수지와 입자 (C-1) 또는 섬유 (C-2)의 광학적 굴절률의 차이가, 0.005 이하인 상기 열경화성 수지 경화물에 관한 것이다.Moreover, it is related with the said thermosetting resin hardened|cured material whose difference of the optical refractive index of a thermosetting resin after hardening and a particle (C-1) or a fiber (C-2) is 0.005 or less.
본 발명의 다관능 산 무수물은 에폭시 수지의 경화제로서 이용할 수 있다. 본 발명의 열경화성 수지 조성물은 안정성이 양호하고, 본 발명의 경화물은 투명성이나 강인성, 내열성, 내착색성이 우수하여, 토목 건축용의 도료나 FRP, 그리고, 프린트 배선판·반도체 분야 등에 있어서의 도료, 레지스트 잉크, 접착제, 시일제, 봉지제 등의 전기 전자 재료, 나아가서는 높은 투명성이 요구되는 LED 봉지제나 광도파로, 액정 디스플레이, 플라즈마 디스플레이, EL 디스플레이, 휴대 기기 등의 표시 장치나 태양 전지 등에 적합하다. The polyfunctional acid anhydride of the present invention can be used as a curing agent for epoxy resins. The thermosetting resin composition of the present invention has good stability, and the cured product of the present invention is excellent in transparency, toughness, heat resistance, and color resistance, and paints and FRPs for civil engineering construction, paints and resists in the field of printed wiring boards and semiconductors, etc. It is suitable for electrical and electronic materials such as ink, adhesives, sealants, and encapsulants, and furthermore, LED encapsulants or optical waveguides requiring high transparency, liquid crystal displays, plasma displays, EL displays, display devices such as portable devices, and solar cells.
도 1은 실시예 1-1에서 얻어진 다관능 산 무수물의, 1H-NMR 스펙트럼 차트이다.
도 2는 실시예 1-6에서 얻어진 다관능 산 무수물의, 1H-NMR 스펙트럼 차트이다. 1 is a 1 H-NMR spectrum chart of the polyfunctional acid anhydride obtained in Example 1-1.
2 is a 1 H-NMR spectrum chart of the polyfunctional acid anhydride obtained in Example 1-6.
(발명을 실시하기 위한 형태)(Form for carrying out the invention)
본 발명에 있어서 이용되는 다가 알코올 (A)란, 하기의 구조를 갖고, 적어도 1분자 중에 3개의 수산기를 갖는 화합물이다. The polyhydric alcohol (A) used in the present invention is a compound having the following structure and having three hydroxyl groups in at least one molecule.
하기 일반식 (1):The following general formula (1):
(식 중, R1, R2, R3, R4, R5, R6은 각각 독립적이고, R1, R3, R4, R5, R6은 수소 원자, 수산기, 탄소수 1∼11의 탄화수소기, 또는 탄소수 1∼4의 하이드록시알킬기를 나타내고, R2는 수산기, 또는 탄소수 1∼4의 하이드록시알킬기를 나타내고; l은 0∼11, m과 n은 1∼11의 정수를 나타냄).(In the formula, R 1 , R 2 , R 3 , R 4 , R 5 , R 6 are each independently, and R 1 , R 3 , R 4 , R 5 , R 6 are hydrogen atoms, hydroxyl groups, and 1 to 11 carbon atoms. Represents a hydrocarbon group or a hydroxyalkyl group having 1 to 4 carbon atoms, R 2 represents a hydroxyl group, or a hydroxyalkyl group having 1 to 4 carbon atoms; l represents 0 to 11, m and n represent integers of 1 to 11 ).
상기 일반식 (1)에 있어서, 1 또는 m이 2 이상인 경우, 복수 존재하게 되는 R1, R3, R4, R6은, 각각의 R1, R3, R4, R6이 상이한 치환기를 취해도 좋다. 예를 들면, 1=2인 경우, 4개 존재하는 R1은 4개가 동일한 치환기라도, 일부가 동일하고 그 외가 상이해도 좋고, 전부 상이한 치환기라도 좋다. R3, R4, R6에 대해서도 R1과 동일하다.In the general formula (1), one, or, R 1, R 3, that is the plurality, if m is 2 or more R 4, R 6 are, each R 1, R 3, R 4, R 6 are different substituents You may take For example, in the case of 1=2, four R 1 s may be four identical substituents, some of them may be the same, others may be different, or all different substituents. R 3 , R 4 and R 6 are the same as R 1 .
다가 알코올 (A)의 구체예로서는, 글리세린, 트리메틸올에탄, 트리메틸올프로판, 트리메틸올부탄, 1,2,4-부탄트리올, 2-하이드록시-2-메틸-1,4-부탄디올, 1,2,5-펜탄트리올, 1,3,5-펜탄트리올, 3-메틸펜탄-1,3,5-트리올, 1,2,6-헥산트리올, 1,2,8-옥탄트리올, 1,2,9-노난트리올, 1,2,10-데칸트리올 등의 트리올류, 1,1,2,2-에탄테트라올, 디트리메틸올프로판, 에리트리톨, 펜타에리트리톨, 1,2,3,5-펜탄테트라올, 1,2,4,5-펜탄테트라올, 1,1,5,5-펜탄테트라올, 1,2,5,6-헥산테트라올, 1,2,7,8-옥탄테트라올, 1,2,9,10-데칸테트라올 등의 테트라올류, 디펜타에리트리톨, 폴리글리세린 등의 폴리올 등을 들 수 있다. Specific examples of the polyhydric alcohol (A) include glycerin, trimethylolethane, trimethylolpropane, trimethylolbutane, 1,2,4-butanetriol, 2-hydroxy-2-methyl-1,4-butanediol, 1, 2,5-pentanetriol, 1,3,5-pentanetriol, 3-methylpentane-1,3,5-triol, 1,2,6-hexanetriol, 1,2,8-octanetriol Triols such as all, 1,2,9-nonanetriol, 1,2,10-decanetriol, 1,1,2,2-ethane tetraol, ditrimethylolpropane, erythritol, pentaerythritol, 1,2,3,5-pentanetetraol, 1,2,4,5-pentanetetraol, 1,1,5,5-pentanetetraol, 1,2,5,6-hexanetetraol, 1, And tetraols such as 2,7,8-octanetetraol and 1,2,9,10-decanetetraol, and polyols such as dipentaerythritol and polyglycerin.
이들 중, 1분자 중에 3∼6개의 수산기를 갖는 다가 알코올을 이용한 것이 경화제로서 우수하다. 특히 펜타에리트리톨, 디트리메틸올프로판, 디펜타에리트리톨이, 상기 경화제를 이용하여 경화한 경화물의 특성의 양호함, 재료의 입수의 용이함에서 바람직하다. Among them, a polyhydric alcohol having 3 to 6 hydroxyl groups in one molecule is excellent as a curing agent. In particular, pentaerythritol, ditrimethylolpropane, and dipentaerythritol are preferable in view of good properties of the cured product cured using the above curing agent and ease of material availability.
본 발명에 있어서 다가 알코올 (B)란, 다가 알코올 (A)에 알킬렌옥사이드, 환상 에테르, 및, 환상 에스테르로 이루어지는 군으로부터 선택되는 어느 1개 이상을 부가 중합시킨 화합물을 가리킨다. 또한, 다가 알코올 (B)는 반응성이나 경화물의 특성을 용도에 따라서 최적화할 수도 있다. In the present invention, polyhydric alcohol (B) refers to a compound obtained by addition polymerization of polyhydric alcohol (A) to any one or more selected from the group consisting of alkylene oxide, cyclic ether, and cyclic ester. In addition, the polyhydric alcohol (B) may be optimized for reactivity or properties of the cured product depending on the application.
다가 알코올 (B)의 구체예로서는, 트리메틸올프로판에틸렌옥사이드 부가물, 트리메틸올프로판프로필렌옥사이드 부가물, 트리메틸올프로판테트라하이드로푸란 부가물, 트리메틸올프로판카프로락톤 부가물, 펜타에리트리톨에틸렌옥사이드 부가물, 펜타에리트리톨프로필렌옥사이드 부가물, 펜타에리트리톨테트라하이드로푸란 부가물, 펜타에리트리톨카프로락톤 부가물, 디펜타에리트리톨에틸렌옥사이드 부가물, 디펜타에리트리톨프로필렌옥사이드 부가물, 디펜타에리트리톨테트라하이드로푸란 부가물, 디펜타에리트리톨카프로락톤 부가물 등을 들 수 있다.Specific examples of the polyhydric alcohol (B) include trimethylolpropane ethylene oxide adduct, trimethylolpropane propylene oxide adduct, trimethylolpropane tetrahydrofuran adduct, trimethylolpropanecaprolactone adduct, pentaerythritol ethylene oxide adduct, Pentaerythritol propylene oxide adduct, pentaerythritol tetrahydrofuran adduct, pentaerythritol caprolactone adduct, dipentaerythritol ethylene oxide adduct, dipentaerythritol propylene oxide adduct, dipentaerythritol tetrahydrofuran And adducts and dipentaerythritol caprolactone adducts.
R1, R3, R4, R5, R6에 있어서의 탄화수소기란 탄소 원자와 수소 원자만으로 구성되는 원자단을 가리킨다. The hydrocarbon group in R 1 , R 3 , R 4 , R 5 and R 6 refers to an atomic group composed of only carbon atoms and hydrogen atoms.
탄화수소기의 탄소수는 1∼11이 바람직하다. 구체예로서는, 메틸기, 에틸기, n-프로필기, i-프로필기, n-부틸기, i-부틸기, t-부틸기, 직쇄 또는 분지의 펜틸기, 직쇄 또는 분지의 헥실기, 직쇄 또는 분지의 헵틸기, 직쇄 또는 분지의 옥틸기 등의 지방족 탄화수소기나, 사이클로헥실기, 메틸사이클로헥실기, 에틸사이클로헥실기 등의 지환식 탄화수소기나, 페닐기, 톨릴기, 나프틸기, 메틸나프틸기 등의 방향족기, 벤질기, 나프틸메틸기 등의 방향족 치환 알킬기 등을 들 수 있다. 이 중 본 발명에 있어서는, 본 발명의 경화물의 투명성이 양호한 점에서 지방족 탄화수소기나 지환식 탄화수소기가 바람직하고, 메틸기와 에틸기가 강인성과 내열성이 양호한 본 발명의 경화물을 부여하는 점에서 보다 바람직하다. The hydrocarbon group preferably has 1 to 11 carbon atoms. As a specific example, a methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, i-butyl group, t-butyl group, linear or branched pentyl group, straight chain or branched hexyl group, straight chain or branched Aliphatic hydrocarbon groups such as heptyl group, straight chain or branched octyl group, alicyclic hydrocarbon groups such as cyclohexyl group, methylcyclohexyl group, and ethylcyclohexyl group; and aromatic groups such as phenyl group, tolyl group, naphthyl group and methylnaphthyl group. , Aromatic substituted alkyl groups such as a benzyl group and a naphthylmethyl group. Among them, in the present invention, an aliphatic hydrocarbon group or an alicyclic hydrocarbon group is preferable from the viewpoint of good transparency of the cured product of the present invention, and a methyl group and an ethyl group are more preferable from the viewpoint of providing the cured product of the present invention having good toughness and heat resistance.
R1, R2, R3, R4, R5, R6에 있어서의 하이드록시알킬기란, 직쇄상, 분기상 알킬기의 수소 원자 중 1개 이상이 수산기로 치환되어 있는 원자단을 가리킨다. The hydroxyalkyl group in R 1 , R 2 , R 3 , R 4 , R 5 and R 6 refers to an atomic group in which one or more hydrogen atoms of a straight-chain or branched alkyl group are substituted with hydroxyl groups.
하이드록시알킬기의 탄소수는 1∼4가 바람직하다. 구체예로서는, 메틸기, 에틸기, n-프로필기, 이소프로필기, n-부틸기 및 이소부틸기의 수소 원자 중 1개 또는 2개 이상이 수산기로 치환된 것을 들 수 있다. 이 중 본 발명에 있어서는, 반응이 용이한 점에서, 수산기가 말단 탄소에 1개 치환된 것이 바람직하다. 하이드록시메틸기, 하이드록시에틸기가 본 발명의 경화물의 강인성과 내열성이 양호한 점에서 보다 바람직하다. The hydroxyalkyl group preferably has 1 to 4 carbon atoms. As a specific example, what substituted one or two or more hydrogen atoms of a methyl group, an ethyl group, n-propyl group, isopropyl group, n-butyl group, and isobutyl group with a hydroxyl group is mentioned. Among them, in the present invention, it is preferable that one hydroxyl group is substituted on the terminal carbon from the viewpoint of easy reaction. The hydroxymethyl group and the hydroxyethyl group are more preferable from the viewpoint of good toughness and heat resistance of the cured product of the present invention.
본 발명에 있어서 이용되는 알킬렌옥사이드란, 3원환의 환상 에테르를 갖는 화합물을 가리킨다. The alkylene oxide used in the present invention refers to a compound having a 3-membered ring cyclic ether.
알킬렌옥사이드의 탄소수는 2∼8이 바람직하다. 예를 들면, 에틸렌옥사이드, 프로필렌옥사이드, 부틸렌옥사이드, 스티렌옥사이드 등을 들 수 있다. 이들 알킬렌옥사이드는 1종 또는 필요에 따라서 2종 이상을 혼합한 것이라도 좋다. 그 중에서도, 에틸렌옥사이드, 프로필렌옥사이드로부터 선택되는 적어도 1종이면, 입수하기 쉽고, 염가이기 때문에 본 발명에 있어서 바람직하다. The alkylene oxide preferably has 2 to 8 carbon atoms. Examples include ethylene oxide, propylene oxide, butylene oxide, and styrene oxide. These alkylene oxides may be used alone or in combination of two or more. Especially, if it is at least 1 sort(s) selected from ethylene oxide and propylene oxide, it is easy to obtain and is cheap, and it is preferable in this invention.
알킬렌옥사이드의 사용량은, 다가 알코올 (A)의 수산기 1당량에 대하여, 통상, 3원환의 환상 에테르 0.1∼6.0당량, 바람직하게는, 0.2∼2.0당량이다. 이 범위이면 얻어지는 경화물의 내열성 및 강인성이 양호하다. The amount of the alkylene oxide used is usually 0.1 to 6.0 equivalents, preferably 0.2 to 2.0 equivalents, of a 3-membered cyclic ether relative to 1 equivalent of the hydroxyl group of the polyhydric alcohol (A). If it is this range, heat resistance and toughness of the hardened|cured material obtained are favorable.
본 발명에 있어서 이용되는 환상 에테르란, 4원환 이상의 환상의 탄화수소 중 1개 이상의 탄소가 산소로 치환된 구조를 갖는 화합물이면 특별한 한정은 없다. The cyclic ether used in the present invention is not particularly limited as long as it is a compound having a structure in which at least one carbon is substituted with oxygen in a cyclic hydrocarbon having 4 or more rings.
환상 에테르는 4∼6원환이 바람직하고, 구체예로서는 옥세탄, 테트라하이드로푸란, 테트라하이드로피란 등을 들 수 있다. 이들 환상 에테르는 1종 또는 필요에 따라서 2종 이상을 혼합한 것이라도 좋다. 그 중에서도, 테트라하이드로푸란은 입수하기 쉽고, 염가이기 때문에 본 발명에 있어서 바람직하다. The cyclic ether is preferably a 4 to 6-membered ring, and specific examples thereof include oxetane, tetrahydrofuran, tetrahydropyran, and the like. These cyclic ethers may be used alone or in combination of two or more. Especially, since tetrahydrofuran is easy to obtain and cheap, it is preferable in this invention.
환상 에테르의 사용량은, 다가 알코올 (A)의 수산기 1당량에 대하여, 환상 에테르 0.1∼6.0당량, 바람직하게는, 0.2∼2.0당량이다. 이 범위이면 얻어지는 경화물의 내열성 및 강인성이 양호하다. The amount of cyclic ether used is 0.1 to 6.0 equivalents, preferably 0.2 to 2.0 equivalents, per 1 equivalent of the hydroxyl group of the polyhydric alcohol (A). If it is this range, heat resistance and toughness of the hardened|cured material obtained are favorable.
본 발명에 있어서 이용되는 환상 에스테르란, 환상의 탄화수소 중에 에스테르 결합을 포함하는 구조를 갖는 화합물이면 특별한 한정은 없다. The cyclic ester used in the present invention is not particularly limited as long as it is a compound having a structure containing an ester bond in a cyclic hydrocarbon.
환상 에스테르의 탄소수는 2∼6인 것이 바람직하다. 환상 에스테르의 구체예로서는 아세트락톤, 프로피오락톤, 부티로락톤, 발레로락톤, 카프로락톤 등을 들 수 있다. 이들 환상 에스테르는 1종 또는 필요에 따라서 2종 이상을 혼합한 것이라도 좋다. 그 중에서도, 카프로락톤은 입수하기 쉽고, 염가이기 때문에 본 발명에 있어서 바람직하다. It is preferable that carbon number of a cyclic ester is 2-6. Acetactone, propiolactone, butyrolactone, valerolactone, caprolactone, etc. are mentioned as a specific example of a cyclic ester. These cyclic esters may be used alone or in combination of two or more. Among them, caprolactone is preferred in the present invention because it is easy to obtain and inexpensive.
환상 에스테르의 사용량은, 다가 알코올 (A)의 수산기 1당량에 대하여, 환상 에스테르 0.1∼6.0당량, 바람직하게는, 0.2∼2.0당량이다. 이 범위이면 얻어지는 경화물의 내열성 및 강인성이 양호하다. The use amount of the cyclic ester is 0.1 to 6.0 equivalents, preferably 0.2 to 2.0 equivalents, of the cyclic ester with respect to 1 equivalent of the hydroxyl group of the polyhydric alcohol (A). If it is this range, heat resistance and toughness of the hardened|cured material obtained are favorable.
본 발명에 있어서 이용되는 무수 트리멜리트산 할라이드(1,2,4-벤젠트리카본산-1,2-무수물 할라이드)란, 다가 알코올에 산 무수물기를 도입하고, 다관능 산 무수물 화합물로 하기 위해 이용된다. 이에 따라, 산 무수물기의 개환 에스테르화를 수반하는 일 없이, 산 무수물기를 도입할 수 있다. 또한 방향족 유래의 강직한 골격으로부터 내열성이 우수하다. The trimellitic anhydride (1,2,4-benzenetricarboxylic acid-1,2-anhydride halide) used in the present invention is used to introduce an acid anhydride group into a polyhydric alcohol and to form a polyfunctional acid anhydride compound. do. Thereby, an acid anhydride group can be introduce|transduced without involving ring-opening esterification of an acid anhydride group. In addition, it is excellent in heat resistance from an aromatic derived rigid skeleton.
본 발명에 있어서 이용되는 핵수소 첨가 무수 트리멜리트산 할라이드(사이클로헥산-1,2,4-트리카본산-1,2-무수물 할라이드)란, 상기 무수 트리멜리트산 할라이드와 동일한 목적으로 이용된다. 또한 핵수소 첨가되어 있는 점에서, 내열, 내광하에 있어서도 착색이 적고, 그 경화물은 높은 광학 특성을 유지하면서, 강인성이 우수하다. The nuclear hydrogenated trimellitic anhydride (cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride halide) used in the present invention is used for the same purpose as the trimellitic anhydride. In addition, since nuclear hydrogen is added, coloring is low even under heat and light resistance, and the cured product is excellent in toughness while maintaining high optical properties.
무수 트리멜리트산 할라이드 및 핵수소 첨가 무수 트리멜리트산 할라이드로서는, 예를 들면, 불소화물, 염소화물, 브롬화물 및 요오드화물 등을 들 수 있고, 그 중에서도 반응의 용이함에서 염소화물이 바람직하다. Examples of the trimellitic anhydride and the trimellitic anhydride added with nuclear hydrogen include fluoride, chloride, bromide and iodide, and among them, chloride is preferred for ease of reaction.
본 발명에 있어서 무수 트리멜리트산 할라이드 및 핵수소 첨가 무수 트리멜리트산 할라이드의 혼합물의 사용 몰비율은 총 몰수를 100으로 하면, 1:99∼99:1, 바람직하게는 30:70∼70:30이다. 다가 알코올 (A) 또는 (B)의 수산기와 무수 트리멜리트산 할라이드 및 핵수소 첨가 무수 트리멜리트산 할라이드의 혼합물과의 반응 비율은 대략, 무수 트리멜리트산 할라이드와 핵수소 첨가 무수 트리멜리트산 할라이드의 몰비율에 일치한다. 본 발명의 다관능 산 무수물로서는, 상기 다가 알코올 (A) 또는 (B)의 수산기의 전체 수의 5% 이상 95% 이하가 무수 트리멜리트산 할라이드와 반응하고, 나머지의 수산기와 핵수소 첨가 무수 트리멜리트산 할라이드가 반응한 것이며, 바람직하게는 상기 다가 알코올 (A) 또는 (B)의 수산기의 전체 수의 10% 이상 75% 이하가 무수 트리멜리트산 할라이드와 반응하고, 나머지의 수산기와 핵수소 첨가 무수 트리멜리트산 할라이드가 반응한 것이다. In the present invention, the used molar ratio of the mixture of trimellitic anhydride and trimellitic anhydride added with nuclear hydrogen is 1:99 to 99:1, preferably 30:70 to 70:30 when the total number of moles is 100. to be. The reaction ratio of the hydroxyl group of the polyhydric alcohol (A) or (B) with a mixture of trimellitic anhydride and trimellitic anhydride with nuclear hydrogen is approximately, of trimellitic anhydride and trimellitic anhydride with nuclear hydrogen. Matches the molar ratio. As the polyfunctional acid anhydride of the present invention, 5% or more and 95% or less of the total number of hydroxyl groups of the polyhydric alcohol (A) or (B) react with trimellitic anhydride anhydride, and the remaining hydroxyl groups and anhydrous tris with nuclear hydrogenation Melitic acid halide is reacted, preferably 10% or more and 75% or less of the total number of hydroxyl groups of the polyhydric alcohol (A) or (B) react with anhydrous trimellitic acid halide, and the remaining hydroxyl groups and nuclear hydrogen are added This is a reaction of trimellitic anhydride halide.
본 발명의 다관능 산 무수물의 합성은, 공지의 수법에 의해 행할 수 있다. 다가 알코올 (A) 또는 (B)와 무수 트리멜리트산 할라이드 및 핵수소 첨가 무수 트리멜리트산 할라이드의 혼합물 또는 핵수소 첨가 무수 트리멜리트산 할라이드(이하 「할라이드류」라고 함)와의 반응에 있어서의 각 화합물의 첨가법에는 특별히 제한이 없으며, 임의의 첨가법을 채용할 수 있다. 예를 들면, 다가 알코올 (A) 또는 (B)와 염기성 물질을 용매에 용해하고, 여기에 용매에 용해한 상기의 할라이드류를 천천히 적하하는 방법, 혹은, 역으로 필요에 따라서 용매에 용해한 상기의 할라이드류 중에 다가 알코올 (A) 또는 (B)와 염기성 물질의 혼합 용액을 적하하는 방법, 할라이드류와 다가 알코올 (A) 또는 (B)의 혼합 용액 중으로 염기성 물질을 적하하는 방법, 나아가서는, 다가 알코올 (A) 또는 (B)의 용액 중에 할라이드류의 용액과 염기성 물질의 용액을 동시에 적하하는 방법 등이 채용 가능하다. The polyfunctional acid anhydride of the present invention can be synthesized by a known method. Each of the reaction of polyhydric alcohol (A) or (B) with a mixture of trimellitic anhydride and trimellitic anhydride with nuclear hydrogen or trimellitic anhydride with nuclear hydrogen (hereinafter referred to as "halides") There is no restriction|limiting in particular in the addition method of a compound, and arbitrary addition method can be employ|adopted. For example, the above-mentioned halide dissolved in a solvent if the polyhydric alcohol (A) or (B) and a basic substance are dissolved in a solvent, and the above halides dissolved in the solvent are slowly added dropwise thereto, or vice versa. A method of dropping a mixed solution of a polyhydric alcohol (A) or (B) with a basic substance in a stream, a method of dropping a basic substance into a mixed solution of a halide and a polyhydric alcohol (A) or (B), furthermore, a polyhydric alcohol A method of dropping a halide solution and a basic substance solution simultaneously in the solution of (A) or (B) may be employed.
염기성 물질 존재하의 다가 알코올 (A) 또는 (B)와 할라이드류와의 반응에서는, 반응의 진행과 동시에 염기성 물질이 중화되어 생성된 염산염이 발생한다. 이 염산염을 여과하여 제거한 후, 여과액을 농축함으로써, 본 발명의 다관능 산 무수물의 조(粗)생성물이 고수율로 얻어진다. 이것을, 적당한 용매에 용해하고, 물세정 후 농축하고 나서 감압 건조하면 순도가 높은 다관능 산 무수물이 얻어진다. 또한 필요에 따라서 적당한 용매로 재결정을 행함으로써, 보다 순도가 높은 다관능 산 무수물이 얻어진다. In the reaction of the polyhydric alcohol (A) or (B) in the presence of a basic substance with halides, the basic substance is neutralized and hydrochloride produced by the reaction proceeds. After removing this hydrochloride by filtration, the filtrate is concentrated to obtain a crude product of the polyfunctional acid anhydride of the present invention in high yield. This was dissolved in a suitable solvent, concentrated after washing with water, and then dried under reduced pressure to obtain a polyfunctional acid anhydride having high purity. Moreover, polyfunctional acid anhydride with higher purity is obtained by recrystallization with a suitable solvent as needed.
다가 알코올 (A) 또는 (B)의 사용량은 통상 수산기 당량으로, 무수 트리멜리트산 할라이드 및 핵수소 첨가 무수 트리멜리트산 할라이드의 혼합물의 수산기 당량의 합을 1.0으로 했을 때, 또는 핵수소 첨가 무수 트리멜리트산 할라이드의 수산기 당량을 1.0으로 했을 때에, 0.6∼1.0, 바람직하게는, 0.8∼1.0이다. 이 범위이면 다가 알코올 (A) 또는 (B)의 수산기는 모두 에스테르화되어, 무수 트리멜리트산 할라이드, 핵수소 첨가 무수 트리멜리트산 할라이드가 계 내에 남는 일은 없다. The amount of the polyhydric alcohol (A) or (B) is usually used as the hydroxyl group equivalent, when the sum of the hydroxyl group equivalents of the mixture of trimellitic anhydride and trimellitic anhydride anhydride is set to 1.0, or anhydrous trihydric anhydride When the hydroxyl group equivalent of melitic acid halide is set to 1.0, it is 0.6 to 1.0, preferably 0.8 to 1.0. In this range, the hydroxyl groups of the polyhydric alcohol (A) or (B) are all esterified, so that no trimellitic anhydride and anhydrous trimellitic anhydride hydride remain in the system.
할라이드류와 다가 알코올 (A) 또는 (B)의 반응에 있어서 사용 가능한 용매는 원료에 대하여 불활성이면 특별히 한정되지 않지만, 테트라하이드로푸란, 1,4-디옥산, 1,2-디메톡시에탄-비스(2-메톡시에틸)에테르 등의 에테르 용매, 피콜린, 피리딘 등의 방향족 아민 용매, 아세톤, 메틸에틸케톤, 메틸이소부틸케톤 등과 같은 케톤계 용매, 톨루엔, 자일렌 등과 같은 방향족 탄화수소 용매, 디클로로메탄, 클로로포름, 1,2-디클로로에탄 등과 같은 할로겐 함유 용매, N-메틸-2-피롤리돈, N,N-디메틸아세트아미드, N,N-디에틸아세트아미드, N,N-디메틸포름아미드 등과 같은 아미드계 용매, 헥사메틸포스포르아미드 등과 같은 인 함유 용매, 디메틸술포옥사이드 등과 같은 황 함유 용매, γ-부티로락톤, 아세트산 에틸, 아세트산 부틸 등과 같은 에스테르계 용매, 1,3-디메틸-2-이미다졸리디논 등과 같은 질소 함유 용매, 페놀, o-크레졸, m-크레졸, p-크레졸, o-클로로페놀, m-클로로페놀, p-클로로페놀 등의 수산기를 갖는 방향족계 용매 등을 들 수 있다. 이들 용매는 단독으로도, 2종류 이상 혼합하여 이용해도 좋다. The solvent usable in the reaction of the halide with the polyhydric alcohol (A) or (B) is not particularly limited as long as it is inert with respect to the raw material, but tetrahydrofuran, 1,4-dioxane, 1,2-dimethoxyethane-bis Ether solvents such as (2-methoxyethyl) ether, aromatic amine solvents such as picoline and pyridine, ketone-based solvents such as acetone, methyl ethyl ketone and methyl isobutyl ketone, aromatic hydrocarbon solvents such as toluene and xylene, dichloro Halogen-containing solvents such as methane, chloroform, 1,2-dichloroethane, N-methyl-2-pyrrolidone, N,N-dimethylacetamide, N,N-diethylacetamide, and N,N-dimethylformamide Amide-based solvents such as, phosphorus-containing solvents such as hexamethylphosphoramide, sulfur-containing solvents such as dimethyl sulfoxide, etc., ester-based solvents such as γ-butyrolactone, ethyl acetate, and butyl acetate, 1,3-dimethyl-2 And nitrogen-containing solvents such as imidazolidinone, aromatic solvents having hydroxyl groups such as phenol, o-cresol, m-cresol, p-cresol, o-chlorophenol, m-chlorophenol, and p-chlorophenol. Can. These solvents may be used alone or in combination of two or more.
다가 알코올 (A)에 할라이드류를 반응시킬 때는, 반응 온도는 -10℃∼80℃, 바람직하게는 0℃∼70℃, 보다 바람직하게는 10℃∼60℃이다. 여기에서 든 용매에는 다가 알코올 (A)로부터 다가 알코올 (B)를 제조할 때에 이용되는 환상 에테르나 환상 에스테르가 포함되어 있는데, 반응 온도가 80℃보다도 높으면 다가 알코올 (A)에 환상 에테르나 환상 에스테르가 반응하여, 다가 알코올 (B)가 얻어져, 다가 알코올 (A)와 할라이드류의 반응률이 저하된다. 반응 시간은, 특별히 제한은 없지만 통상 10분∼48시간, 바람직하게는 30분∼24시간이다. 반응은 통상, 상압에서 행해지지만, 필요에 따라서 가압하, 또는 감압하에서도 실시할 수 있다. When the halide is reacted with the polyhydric alcohol (A), the reaction temperature is -10°C to 80°C, preferably 0°C to 70°C, more preferably 10°C to 60°C. The solvents contained herein include cyclic ethers or cyclic esters used when preparing polyhydric alcohols (B) from polyhydric alcohols (A). When the reaction temperature is higher than 80°C, cyclic ethers or cyclic esters are used for polyhydric alcohols (A). By reacting, polyhydric alcohol (B) is obtained, and the reaction rate between polyhydric alcohol (A) and halide decreases. The reaction time is not particularly limited, but is usually 10 minutes to 48 hours, preferably 30 minutes to 24 hours. The reaction is usually carried out at normal pressure, but can also be carried out under pressure or under reduced pressure if necessary.
다가 알코올 (A)에 환상 에테르나 환상 에스테르를 반응시켜 다가 알코올 (B)를 제조할 때는, 반응 온도는 80℃∼250℃, 바람직하게는 90℃∼220℃, 보다 바람직하게는 100℃∼200℃이다. 반응 시간은, 특별히 제한은 없지만 통상 10분∼48시간, 바람직하게는 30분∼24시간이다. 반응은 통상, 상압에서 행해지지만, 필요에 따라서 가압하, 또는 감압하에서도 실시할 수 있다. When polyhydric alcohol (A) is reacted with cyclic ether or cyclic ester to produce polyhydric alcohol (B), the reaction temperature is 80°C to 250°C, preferably 90°C to 220°C, more preferably 100°C to 200 ℃. The reaction time is not particularly limited, but is usually 10 minutes to 48 hours, preferably 30 minutes to 24 hours. The reaction is usually carried out at normal pressure, but can also be carried out under pressure or under reduced pressure if necessary.
다관능 산 무수물을 얻는 반응에 있어서의 용매 중의 용질의 농도는, 통상 5질량%∼50질량%, 부반응의 제어, 침전의 여과 공정을 고려하면 바람직하게는 10질량%∼40질량%이다. 본 반응은 용질이 용매 중, 10질량% 이상 40질량% 이하의 범위가 보다 바람직하다. The concentration of the solute in the solvent in the reaction for obtaining a polyfunctional acid anhydride is usually 5% by mass to 50% by mass, preferably 10% by mass to 40% by mass in consideration of the side reaction control and filtration steps of precipitation. In this reaction, the solute is more preferably 10% by mass or more and 40% by mass or less in a solvent.
통상, 반응 분위기는, 질소하에서 행한다. 반응 용기는 밀폐형 반응 용기라도 개방형 반응 용기라도 좋지만, 반응계를 불활성 분위기로 유지하기 위해, 개방형의 경우에는 불활성 가스로 실링할 수 있는 것을 이용한다. Usually, the reaction atmosphere is performed under nitrogen. The reaction vessel may be either a closed-type reaction vessel or an open-type reaction vessel, but in order to keep the reaction system in an inert atmosphere, in the case of an open-type, one that can be sealed with an inert gas is used.
염기성 물질은, 반응의 진행과 함께 발생하는 염화수소를 중화하기 위해 이용한다. 이때 사용되는 염기성 물질의 종류로서는 특별히 한정되지 않지만, 피리딘, 트리에틸아민, N,N-디메틸아닐린 등의 유기 3급 아민류, 탄산 칼륨, 수산화 나트륨 등의 무기의 염기성 물질을 이용할 수 있다. 피리딘이나, 트리에틸아민은 염가로 입수할 수 있는 점이나 액체에서 용해성이 풍부하기 때문에 반응 조작이 용이해진다는 점에서 바람직하다. 또한, 무기의 염기성 물질은 염가로 입수할 수 있는 점에서 바람직하다. The basic substance is used to neutralize the hydrogen chloride that occurs as the reaction proceeds. The type of the basic substance used at this time is not particularly limited, and organic tertiary amines such as pyridine, triethylamine, N,N-dimethylaniline, and inorganic basic substances such as potassium carbonate and sodium hydroxide can be used. Pyridine and triethylamine are preferable in that they are available at low cost or because the solubility in liquid is abundant, so that the reaction operation becomes easy. Moreover, an inorganic basic substance is preferable at the point which can be obtained at low cost.
사용되는 염기성 물질의 양은 특별히 제한은 없지만, 과잉하게 사용하면 생성물에 혼입되거나, 정제 부하가 커지거나 하기 때문에, 할라이드류의 총 몰수를 1.0으로 한 경우에 대하여 통상 1.0몰배∼30몰배, 바람직하게는 1.2몰배∼20몰배, 더욱 바람직하게는 1.5몰배∼10몰배가 이용된다. The amount of the basic substance to be used is not particularly limited, but if it is excessively used, it may be incorporated into the product or the purification load may be increased. Therefore, the total mole number of halides is 1.0 to 30 mole times, preferably 1.2 to 20 mole times, more preferably 1.5 to 10 mole times are used.
물세정 조작시, 다관능 산 무수물은 일부 가수분해를 받아, 다가 카본산으로 변화하지만, 감압하에서 가열 처리를 함으로써, 생성된 다가 카본산을 용이하게 다관능 산 무수물로 되돌릴 수 있다. 이 감압하에서의 가열 처리의 온도는 80℃∼200℃, 바람직하게는 100℃∼180℃이며, 감압도는, 50K㎩ 이하, 바람직하게는 10K㎩ 이하이며, 가열 시간의 상한은 특별히 제한은 없지만, 통상은 10분∼48시간, 바람직하게는 30분∼24시간이다. During the water washing operation, the polyfunctional acid anhydride undergoes some hydrolysis and changes to a polyvalent carbon acid, but by heating under reduced pressure, the resulting polyvalent carbon acid can be easily returned to the polyfunctional acid anhydride. The temperature of the heat treatment under reduced pressure is 80°C to 200°C, preferably 100°C to 180°C, and the degree of reduced pressure is 50 KPa or less, preferably 10 KPa or less, and the upper limit of the heating time is not particularly limited. Usually, it is 10 minutes-48 hours, Preferably it is 30 minutes-24 hours.
이렇게 하여 얻어진 본 발명의 다관능 산 무수물을 추가로 정제하는 것도 가능하다. 그 경우의 정제 방법으로서는, 재결정, 승화, 세정, 활성탄 처리, 칼럼 크로마토그래피 등 임의로 행할 수 있다. 또한 이들 정제법을 반복해도 좋고, 조합하여 실시하는 것도 가능하다. 이렇게 하여 얻어지는 본 발명의 다관능 산 무수물의 순도는 예를 들면 겔 투과 크로마토그래피(이하, 「GPC」라고 함) 등의 분석으로 얻어지는 피크의 면적비(比)로서, 통상 90% 이상, 바람직하게는 95% 이상, 더욱 바람직하게는 98% 이상이다. It is also possible to further purify the polyfunctional acid anhydride of the present invention thus obtained. As a purification method in that case, recrystallization, sublimation, washing, activated carbon treatment, column chromatography, and the like can be optionally performed. Further, these purification methods may be repeated, or may be performed in combination. The purity of the polyfunctional acid anhydride of the present invention thus obtained is, for example, an area ratio of a peak obtained by an analysis such as gel permeation chromatography (hereinafter referred to as "GPC"), usually 90% or more, preferably 95% or more, and more preferably 98% or more.
다관능 산 무수물의 보존은, 가수분해에 의한 산 무수물환의 개환을 막기 위해 고습을 피한 저온하에서 보존으로 하는 것이 바람직하다. 구체적으로는,시일성이 좋은 용기로 냉장고에서 보관하면 장기간의 보존에 견딘다. 또한, 다관능 산 무수물에 관해서는 흡습을 막기 위해 정제 후 바로 다음의 중합 반응에 사용해도 좋다. 그때의 보존 기간은, 통상 100시간 이내, 바람직하게는 50시간 이내, 더욱 바람직하게는 24시간 이내이다. It is preferable to preserve|save the polyfunctional acid anhydride at the low temperature which avoided high humidity in order to prevent the ring opening of an acid anhydride ring by hydrolysis. Specifically, when stored in a refrigerator in a container with good sealability, it withstands long-term storage. In addition, regarding the polyfunctional acid anhydride, it may be used in the next polymerization reaction immediately after purification to prevent moisture absorption. The storage period at that time is usually within 100 hours, preferably within 50 hours, and more preferably within 24 hours.
본 발명의 다관능 산 무수물과 경화 반응하는 화합물을 조합하여, 열경화성 수지 조성물을 구성할 수도 있다. 이때, 산 무수물기와 열에 의해 반응 가능한 관능기를 갖는 화합물이면 특별히 한정은 없지만, 특히 에폭시기를 갖는 화합물이 적합하게 이용된다. The thermosetting resin composition can also be constituted by combining the polyfunctional acid anhydride of the present invention with a compound that undergoes curing reaction. At this time, the compound having an acid anhydride group and a functional group capable of reacting by heat is not particularly limited, but a compound having an epoxy group is particularly preferably used.
이때, 적합한 열경화성 조성물을 얻기 위해, 산 무수물기와 반응 가능한 관능기는, 1분자 중에 적어도 2개 포함되는 화합물을 이용하는 것이 적합하다. At this time, in order to obtain a suitable thermosetting composition, it is preferable to use a compound containing at least two of the functional groups capable of reacting with an acid anhydride group.
본 발명에 있어서 나타내는 에폭시기를 갖는 화합물이란, 1분자 중에 적어도 1개의 에폭시기를 갖는 화합물이면 어느 것을 이용해도 좋다. 이하에 본 발명에 있어서 적합하게 이용되는 1분자 중에 적어도 1개의 에폭시기를 갖는 화합물로서 방향족형 에폭시 수지, 지방족형 에폭시 수지, 공중합체형 에폭시 수지에 대해서 설명한다. Any compound having at least one epoxy group in one molecule may be used as the compound having an epoxy group represented in the present invention. Hereinafter, an aromatic epoxy resin, an aliphatic epoxy resin, and a copolymer epoxy resin as a compound having at least one epoxy group in one molecule suitably used in the present invention will be described.
방향족형 에폭시 수지로서는, 크레졸 노볼락형 에폭시 수지, 페놀 노볼락형 에폭시 수지, 비페닐-페놀형 에폭시 수지, 나프톨형 에폭시 수지 등의 노볼락형 에폭시 수지, 비스페놀 A형 에폭시 수지, 비스페놀 F형 에폭시 수지, 비스페놀 S형 에폭시 수지 등의 비스페놀형 에폭시 수지, 트리스페놀메탄형 에폭시 수지, 글리옥살형 에폭시 수지, (4-(4-(1,1-비스(p-하이드록시페닐)-에틸)-α,α-디메틸벤질)페놀)형 에폭시 수지 등을 들 수 있다. 이들 중 본 발명에 있어서는, 내열성, 내착색성을 고려하면, 비스페놀 A형 에폭시 수지, (4-(4-(1,1-비스(p-하이드록시페닐)-에틸)-α,α-디메틸벤질)페놀)형 에폭시 수지가 바람직하다. Examples of the aromatic epoxy resin include cresol novolac type epoxy resins, phenol novolac type epoxy resins, biphenyl-phenol type epoxy resins, and novolac type epoxy resins such as naphthol type epoxy resins, bisphenol A type epoxy resins, and bisphenol F type epoxy Bisphenol type epoxy resin, such as resin, bisphenol S type epoxy resin, trisphenolmethane type epoxy resin, glyoxal type epoxy resin, (4-(4-(1,1-bis(p-hydroxyphenyl)-ethyl)- and α,α-dimethylbenzyl)phenol)-type epoxy resins. Among these, in the present invention, considering heat resistance and color resistance, bisphenol A type epoxy resin, (4-(4-(1,1-bis(p-hydroxyphenyl)-ethyl)-α,α-dimethylbenzyl )Phenol) type epoxy resin is preferred.
지방족형 에폭시 수지로서는, 지방족 환상 구조를 갖는 에폭시 수지와 지방족 환상 구조를 갖지 않는 에폭시 수지를 들 수 있다. 지방족 환상 구조를 갖는 에폭시 수지는 1분자 중에 적어도 1개의 환상 지방족 구조를 갖는 것을 특징으로 한다. 예를 들면 테르펜디페놀이나, 페놀류(페놀, 알킬 치환 페놀, 나프톨, 알킬 치환 나프톨, 디하이드록시벤젠, 디하이드록시나프탈렌 등)와 지방족 환구조 디엔(디사이클로펜타디엔이나 노르보르나디엔, 헥사하이드록시인덴 등)과의 중축합물 및 이들의 변성물로부터 유도되는 글리시딜에테르화물, 수소 첨가 비스페놀(비스페놀 A, 비스페놀 F)형 에폭시 수지, 지환식 에폭시 수지 등, 분자 내에 사이클로헥실 구조를 갖는 에폭시 수지, 디사이클로펜타디엔 구조를 갖는 에폭시 수지, 트리글리시딜이소시아누레이트 구조를 갖는 에폭시 수지 등을 들 수 있다. 구체적으로는 예를 들면, 사이클로헥산디올디글리시딜에테르, 3,4-에폭시사이클로헥세닐메틸-3', 4'-에폭시사이클로헥센카복실레이트, 2,2-비스(하이드록시알킬)-1-부탄올의 1,2-에폭시-4-(2-옥시라닐)사이클로헥산 부가물 등을 들 수 있다. Examples of the aliphatic epoxy resin include an epoxy resin having an aliphatic cyclic structure and an epoxy resin not having an aliphatic cyclic structure. The epoxy resin having an aliphatic cyclic structure is characterized by having at least one cyclic aliphatic structure in one molecule. For example, terpendiphenol, phenols (phenol, alkyl-substituted phenol, naphthol, alkyl-substituted naphthol, dihydroxybenzene, dihydroxynaphthalene, etc.) and aliphatic cyclic dienes (dicyclopentadiene, norbornadiene, hexa) Cyclohexyl structures in the molecule, such as polycondensates with hydroxyindenes) and glycidyl ethers derived from modified products thereof, hydrogenated bisphenol (bisphenol A, bisphenol F) type epoxy resins, alicyclic epoxy resins, etc. The epoxy resin which has, the epoxy resin which has a dicyclopentadiene structure, the epoxy resin which has a triglycidyl isocyanurate structure, etc. are mentioned. Specifically, for example, cyclohexanediol diglycidyl ether, 3,4-epoxycyclohexenylmethyl-3', 4'-epoxycyclohexene carboxylate, 2,2-bis(hydroxyalkyl)-1 And 1,2-epoxy-4-(2-oxyranyl)cyclohexane adducts of -butanol.
지방족 환상 구조를 갖지 않는 1분자 중에 적어도 1개의 에폭시기를 갖는 화합물 등으로서는, 헥산디글리시딜에테르 등의 직쇄 또는 분기 알코올로부터 유도되는 글리시딜에테르류를 들 수 있다. As a compound etc. which have at least 1 epoxy group in 1 molecule which does not have an aliphatic cyclic structure, glycidyl ethers derived from linear or branched alcohols, such as hexane diglycidyl ether, are mentioned.
공중합형 에폭시 수지로서는, 불포화 이중 결합과 에폭시기를 겸비하는 단량체, 예를 들면 글리시딜(메타)아크릴레이트, 하이드록시에틸(메타)아크릴레이트글리시딜에테르, 하이드록시부틸(메타)아크릴레이트글리시딜에테르 등과 같은 단량체와 그 외의 중합 가능한 불포화기를 갖는 단량체를 공중합시킨 것이다. 그 외의 단량체로서는 특별히 한정은 없고, 상기의 불포화 이중 결합과 에폭시기를 겸비하는 단량체와 공중합이 가능한 것이면 모두 사용할 수 있다. 예를 들면 에틸렌, 프로필렌, 스티렌, 아세트산 비닐, 염화 비닐 등의 비닐 화합물류, 메틸(메타)아크릴레이트, 에틸(메타)아크릴레이트, 부틸(메타)아크릴레이트, 헥실(메타)아크릴레이트, 옥틸(메타)아크릴레이트, 라우릴(메타)아크릴레이트, 스테아릴(메타)아크릴레이트 등의 알킬(메타)아크릴레이트류, 하이드록시에틸(메타)아크릴레이트, 하이드록시부틸(메타)아크릴레이트 등의 글리콜에테르모노(메타)아크릴레이트류, 에틸렌글리콜메틸에테르(메타)아크릴레이트, 폴리에틸렌글리콜모노메틸에테르(메타)아크릴레이트, 폴리에틸렌글리콜모노에틸에테르(메타)아크릴레이트, 폴리프로필렌글리콜모노메틸에테르(메타)아크릴레이트 등의 글리콜에테르모노알킬에테르(메타)아크릴레이트류 등을 들 수 있다. As the copolymerized epoxy resin, a monomer having an unsaturated double bond and an epoxy group, for example, glycidyl (meth)acrylate, hydroxyethyl (meth)acrylate glycidyl ether, hydroxybutyl (meth)acrylate glycol It is a copolymer of a monomer, such as a cidyl ether, and other monomers having a polymerizable unsaturated group. The other monomers are not particularly limited, and any monomers having both the above-mentioned unsaturated double bonds and epoxy groups can be used as long as they can be copolymerized. For example, vinyl compounds such as ethylene, propylene, styrene, vinyl acetate, and vinyl chloride, methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, hexyl (meth)acrylate, octyl ( Glycols such as alkyl (meth)acrylates such as meth)acrylate, lauryl (meth)acrylate, and stearyl (meth)acrylate, hydroxyethyl (meth)acrylate, and hydroxybutyl (meth)acrylate Ether mono(meth)acrylates, ethylene glycol methyl ether (meth)acrylate, polyethylene glycol monomethyl ether (meth)acrylate, polyethylene glycol monoethyl ether (meth)acrylate, polypropylene glycol monomethyl ether (meth) And glycol ether monoalkyl ether (meth)acrylates such as acrylates.
본 발명의 수지 조성물에 이용하는 입자 (C-1)은, 예를 들면, 유기 입자로서는, 폴리메틸메타크릴레이트, 폴리스티렌, 나일론 등을, 무기 입자로서는, 탈크, 소성 클레이, 미(未)소성 클레이, 마이카 및 유리 등의 규산염, 산화 티탄, 알루미나, 실리카 및 용융 실리카 등의 산화물, 탄산 칼슘, 탄산 마그네슘 및 하이드로탈사이트 등의 탄산염, 수산화 알루미늄, 수산화 마그네슘 및 수산화 칼슘 등의 수산화물, 황산 바륨, 황산 칼슘 및 아황산 칼슘 등의 황산염 또는 아황산염, 붕산 아연, 메타붕산 바륨, 붕산 알루미늄, 붕산 칼슘 및 붕산 나트륨 등의 붕산염, 질화 알루미늄, 질화 붕소 및 질화 규소 등의 질화물 등, 불화 마그네슘, 불화 칼슘 등의 불화물을 들 수 있고, 분산 용매를 함유하지 않는 미분말이나 용매에 분산시킨 콜로이드 용액으로서 시장으로부터 입수하여 이용할 수 있다. 또한, 이들을 1종 또는 2종 이상을 혼합하여 이용할 수 있다. 분산 용매는 메틸에틸케톤, 메틸이소부틸케톤, 사이클로헥산온, 디메틸디메틸아세트아미드 등의 케톤류, 아세트산 에틸, 아세트산 부틸 등의 에스테르류, 톨루엔, 자일렌 등의 비극성 용매 등, 본 발명의 열경화성 수지 조성물의 각 성분이 용해하는 것을 선정하여 이용하면 좋다. 또한, 치수 안정성의 관점에서 무기 입자가 바람직하다. 특히, 범용성이나 염가인 점에서 알루미나, 실리카가 바람직하다. The particles (C-1) used in the resin composition of the present invention include, for example, polymethyl methacrylate, polystyrene, and nylon as organic particles, and talc, fired clay, and unfired clay as inorganic particles. , Silicates such as mica and glass, oxides such as titanium oxide, alumina, silica and fused silica, carbonates such as calcium carbonate, magnesium carbonate and hydrotalcite, hydroxides such as aluminum hydroxide, magnesium hydroxide and calcium hydroxide, barium sulfate, and sulfuric acid Sulfates or sulfites such as calcium and calcium sulfite, borates such as zinc borate, barium metaborate, aluminum borate, calcium borate and sodium borate, nitrides such as aluminum nitride, boron nitride and silicon nitride, fluorides such as magnesium fluoride and calcium fluoride And colloidal solutions dispersed in a fine powder or a solvent containing no dispersing solvent, which can be obtained from the market and used. In addition, these may be used alone or in combination of two or more. Dispersing solvents include methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, ketones such as dimethyl dimethylacetamide, esters such as ethyl acetate and butyl acetate, and non-polar solvents such as toluene and xylene, and the thermosetting resin composition of the present invention It is good to select and use what is dissolved in each component of. In addition, inorganic particles are preferred from the viewpoint of dimensional stability. In particular, alumina and silica are preferred from the viewpoint of versatility and low cost.
본 발명의 수지 조성물에 이용하는 섬유 (C-2)는, 탄소 섬유, 유리 섬유, 카제인 섬유, 땅콩 단백 섬유, 옥수수 단백 섬유, 대두 단백 섬유, 알긴 섬유, 키틴 섬유, 만난 섬유, 고무 섬유, 셀룰로오스 섬유, 나일론 섬유, 폴리 염화 비닐리덴 섬유, 폴리 염화 비닐 섬유, 폴리에스테르 섬유, 폴리아크릴로니트릴 섬유, 모다크릴 섬유, 폴리에틸렌 섬유, 폴리프로필렌 섬유, 폴리스티렌 섬유, 폴리에테르에스테르 섬유, 폴리우레탄 섬유 등을 들 수 있다. 이들을 1종 또는 2종 이상을 혼합하여 이용할 수 있다. 그 중에서도, 범용성의 관점에서 유리 섬유가 바람직하다. 또한, 유리 섬유에는 그를 이용한 직포, 부직포, 편물 등 여러 가지 것이 있으며, 본 발명에 있어서 그 종류에 특별히 제한은 없지만, 본 발명의 열경화성 수지 조성물을 함침시켜 경화했을 때에 치수 안정성이 우수한 경화물을 얻기 위해서는, 유리 크로스가 적합하다. 본 발명의 열경화성 수지 조성물과의 밀착성을 고려하면, 유리 섬유는 실란 커플링제에 의해 처리되어 있는 것이 바람직하다. The fiber (C-2) used in the resin composition of the present invention is carbon fiber, glass fiber, casein fiber, peanut protein fiber, corn protein fiber, soybean protein fiber, algin fiber, chitin fiber, met fiber, rubber fiber, cellulose fiber , Nylon fiber, polyvinylidene chloride fiber, polyvinyl chloride fiber, polyester fiber, polyacrylonitrile fiber, modacrylic fiber, polyethylene fiber, polypropylene fiber, polystyrene fiber, polyetherester fiber, polyurethane fiber, etc. Can. These may be used alone or in combination of two or more. Among them, glass fibers are preferred from the viewpoint of versatility. In addition, there are various types of glass fibers, such as woven fabrics, nonwoven fabrics, and knitted fabrics, and there are no particular limitations on the type in the present invention, but a cured product having excellent dimensional stability when cured by impregnating the thermosetting resin composition of the present invention is obtained. In order, a glass cross is suitable. In consideration of adhesion to the thermosetting resin composition of the present invention, it is preferable that the glass fibers are treated with a silane coupling agent.
입자 (C-1) 및 섬유 (C-2)는 구해지는 성능에 따라서, 어느 한쪽만 사용해도, 양방을 사용해도 좋다. Particles (C-1) and fibers (C-2) may be used either alone or in combination depending on the obtained performance.
본 발명의 수지 조성물에는, 기타 성분을 포함해도 좋다. 이들 기타 성분으로서는 무기 필러, 산화 방지제, 광안정제, 자외선 흡수제 등을 들 수 있다. Other components may be included in the resin composition of the present invention. Examples of these other components include inorganic fillers, antioxidants, light stabilizers, and ultraviolet absorbers.
본 발명의 수지 조성물에 이용될 수 있는 산화 방지제로서는, 페놀계, 황계, 인계 산화 방지제 등 공지 일반의 것이면 제한은 없다. 그러나, 본 발명의 특징을 감안하면, 무색이고, 또한, 경화시의 열이나, 봉지 후의 회로 기판으로서 장기간 사용한 경우라도 착색되기 어려운 것을 선택하는 것이 바람직하다. The antioxidant that can be used in the resin composition of the present invention is not limited as long as it is a known general substance such as a phenol-based, sulfur-based, or phosphorus-based antioxidant. However, considering the features of the present invention, it is preferable to select one that is colorless and hard to be colored even when used for a long time as a heat during curing or as a circuit board after sealing.
페놀계 산화 방지제로서는 모노페놀류, 비스페놀류 및, 고분자형 페놀류 등을 들 수 있다. Examples of phenolic antioxidants include monophenols, bisphenols, and high molecular weight phenols.
황계 산화 방지제의 구체예로서, 디라우릴-3,3'-티오디프로피오네이트, 디미리스틸-3,3'-티오디프로피오네이트, 디스테아릴-3,3'-티오디프로피오네이트 등을 들 수 있다. As specific examples of the sulfur-based antioxidant, dilauryl-3,3'-thiodipropionate, dimyristyl-3,3'-thiodipropionate, distearyl-3,3'-thiodipropionate Nate etc. are mentioned.
인계 산화 방지제로서는, 포스파이트류, 옥사포스파페난트렌옥사이드류 등을 들 수 있다. Examples of phosphorus-based antioxidants include phosphites and oxaphosphaphenanthrene oxides.
이들 산화 방지제는 각각 단독으로 사용할 수 있지만, 2종 이상을 조합하여 병용해도 좋다. 산화 방지제의 사용량은, 본 발명의 수지 조성물 100질량부에 대하여, 통상 0.008∼1질량부, 바람직하게는 0.01∼0.5질량부이다. 또한, 본 발명에 있어서는 인계의 산화 방지제가 바람직하다. These antioxidants may be used alone, but two or more of them may be used in combination. The amount of the antioxidant used is usually 0.008 to 1 part by mass, preferably 0.01 to 0.5 part by mass, relative to 100 parts by mass of the resin composition of the present invention. Further, in the present invention, phosphorus-based antioxidants are preferred.
본 발명의 수지 조성물에 이용될 수 있는 광안정제로서는 공지 일반의 것을 사용할 수 있고, 특별히 한정은 없다. 그러나, 본 발명의 특징을 감안하면, 무색이고, 또한, 경화시의 열이나, 장기간 사용한 경우라도 착색되기 어려운 재료를 선택하는 것이 바람직하다. 이들의 대표적인 예로서, 힌더드아민류 등을 들 수 있다. As the light stabilizer which can be used for the resin composition of the present invention, a known general one can be used, and there is no particular limitation. However, in view of the features of the present invention, it is preferable to select a material that is colorless and hard to be colored even when used for a long time or heat during curing. Hindered amines etc. are mentioned as a typical example of these.
본 발명의 수지 조성물에 이용될 수 있는 자외선 흡수제로서는 공지 일반의 것을 사용할 수 있고, 특별히 한정은 없다. 자외선 흡수제로서는, 벤조트리아졸계, 하이드록시페닐트리아진계 등을 들 수 있고, 상기 광안정제와 병용하는 것도 가능하다. As the ultraviolet absorber that can be used in the resin composition of the present invention, a known general one can be used, and there is no particular limitation. As an ultraviolet absorber, a benzotriazole type, a hydroxyphenyl triazine type, etc. are mentioned, It is also possible to use together with the said light stabilizer.
본 발명에 있어서는, 경시적인 착색성이 낮은 자외선 흡수제를 이용하는 것이 바람직하다. 예를 들면, 프로판산-2-[4-[4,6-비스([1,1'-비페닐]-4-일)-1,3,5-트리아진-2-일]-3-하이드록시페닐]-이소옥틸에스테르(예를 들면 티누빈(TINUVIN)479, 치바·재팬(주) 제조) 등을 들 수 있다. In the present invention, it is preferable to use an ultraviolet absorber with low colorability over time. For example, propanoic acid-2-[4-[4,6-bis([1,1'-biphenyl]-4-yl)-1,3,5-triazin-2-yl]-3- Hydroxyphenyl]-isooctyl ester (for example, TINUVIN 479, manufactured by Chiba Japan Co., Ltd.) and the like.
본 발명의 내착색성을 향상시킬 때는, 하이드록시페닐트리아진계 자외선 흡수제와 힌더드아민계 광안정제를 함께 이용한다. When improving the color resistance of the present invention, a hydroxyphenyltriazine-based ultraviolet absorber and a hindered amine-based light stabilizer are used together.
본 발명의 수지 조성물에는, 투명성이나 경도 등의 특성을 손상시키지 않는 범위에서 부티랄계 수지, 아세탈계 수지, 아크릴계 수지, 에폭시-나일론계 수지, NBR-페놀계 수지, 에폭시-NBR계 수지, 폴리아미드계 수지, 폴리이미드계 수지, 실리콘계 수지 등의 수지 성분을 필요에 따라서 첨가할 수도 있다. In the resin composition of the present invention, butyral resin, acetal resin, acrylic resin, epoxy-nylon resin, NBR-phenol resin, epoxy-NBR resin, polyamide Resin components, such as a system resin, a polyimide resin, and a silicone resin, can also be added as needed.
본 발명의 수지 조성물에는 실란 커플링제, 이형(離型)제, 레벨링제, 계면활성제, 염료, 안료, 유기의 광확산 필러 등도 첨가할 수 있다. Silane coupling agents, release agents, leveling agents, surfactants, dyes, pigments, organic light-diffusing fillers and the like can also be added to the resin composition of the present invention.
본 발명의 수지 조성물에는 내열성, 내광특성을 개량하는 목적으로 공지 일반의 금속염을 첨가할 수도 있다. 예를 들면 카본산 금속염(2-에틸헥산산, 스테아르산, 베헨산, 미리스틴산 등의 아연염, 주석염, 지르코늄염)이나 인산 에스테르 금속(옥틸 인산, 스테아릴 인산 등의 아연염), 알콕시 금속염(트리부틸알루미늄, 테트라프로필지르코늄 등), 아세틸아세톤염(아세틸아세톤지르코늄킬레이트, 아세틸아세톤티탄킬레이트 등) 등의 금속 화합물 등을 들 수 있다. 이들은 단독 혹은 2종 이상을 이용해도 좋다. 금속염의 첨가에 의해, 본 발명의 내열성, 내착색성을 향상시킬 수 있다. A well-known general metal salt can also be added to the resin composition of the present invention for the purpose of improving heat resistance and light resistance. For example, metal salts of carbonic acid (zinc salts such as 2-ethylhexanoic acid, stearic acid, behenic acid, myristic acid, tin salts, zirconium salts) or phosphoric acid ester metals (zinc salts such as octyl phosphoric acid and stearyl phosphoric acid), And metal compounds such as alkoxy metal salts (tributylaluminum, tetrapropylzirconium, etc.) and acetylacetone salts (acetylacetone zirconium chelate, acetylacetone titanium chelate, etc.). These may be used alone or in combination of two or more. By adding a metal salt, the heat resistance and color resistance of the present invention can be improved.
본 발명의 수지 조성물에 있어서, 열에 의한 반응을 촉진시키기 위해, 열에 감응하여 반응을 촉진시키거나, 또는 경화 온도를 조정하기 위해, 경화 촉매를 첨가하는 것도 일반적으로 행해진다. 이들은, 상기 경화 반응을 촉진시키는 효능을 갖는 것이면, 공지 일반의 것을 사용할 수 있다. In the resin composition of the present invention, it is also generally performed to add a curing catalyst to accelerate the reaction by heat, to accelerate the reaction in response to heat, or to adjust the curing temperature. As long as they have the effect of accelerating the curing reaction, well-known general ones can be used.
경화 촉매로서는 예를 들면, 2-메틸이미다졸, 2-페닐이미다졸, 2-운데실이미다졸, 2-헵타데실이미다졸, 2-페닐-4-메틸이미다졸, 1-벤질-2-페닐이미다졸, 1-벤질-2-메틸이미다졸, 1-시아노에틸-2-메틸이미다졸, 1-시아노에틸-2-페닐이미다졸, 1-시아노에틸-2-운데실이미다졸, 2,4-디아미노-6-(2'-메틸이미다졸(1'))에틸-s-트리아진, 2,4-디아미노-6-(2'-운데실이미다졸(1'))에틸-s-트리아진, 2,4-디아미노-6-(2'-에틸-4-메틸이미다졸(1'))에틸-s-트리아진, 2,4-디아미노-6-(2'-메틸이미다졸(1'))에틸-s-트리아진·이소시아누르산 부가물, 2-메틸이미다졸이소시아누르산의 2:3 부가물, 2-페닐이미다졸이소시아누르산 부가물, 2-페닐-3,5-디하이드록시알킬이미다졸, 2-페닐-4-하이드록시알킬-5-메틸이미다졸, 1-시아노에틸-2-페닐-3,5-디시아노에톡시메틸이미다졸의 각종 이미다졸류, 및, 그들 이미다졸류와 프탈산, 이소프탈산, 테레프탈산, 트리멜리트산, 피로멜리트산, 나프탈렌디카본산, 말레산, 옥살산 등의 다가 카본산과의 염류, 디시안디아미드 등의 아미드류, 1,8-디아자-바이사이클로(5,4,0)운데센-7 등의 디아자 화합물 및 그들의 테트라페닐보레이트, 페놀 노볼락 등의 염류, 상기 다가 카본산류, 또는 포스핀산류와의 염류, 테트라부틸암모늄브로마이드, 아세틸트리메틸암모늄브로마이드, 트리옥틸메틸암모늄브로마이드 등의 암모늄염류, 트리페닐포스핀, 트리(톨루일)포스핀, 테트라페닐포스포늄브로마이드, 테트라페닐포스포늄테트라페닐보레이트, 헥사플루오로스티빈포스포늄염 등의 포스핀류나 포스포늄 화합물류, 2,4,6-트리스아미노메틸페놀 등의 페놀류, 옥틸산 주석, 옥틸산 코발트, 옥틸산 아연, 옥틸산 지르코늄, 옥틸산 니켈, 나프텐산코발트 등의 유기 금속 화합물 등을 들 수 있다. 또한, 경화촉진제를 마이크로 캡슐로 한 마이크로 캡슐형 경화 촉매 등을 들 수 있다. As the curing catalyst, for example, 2-methylimidazole, 2-phenylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-phenyl-4-methylimidazole, 1- Benzyl-2-phenylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyano Ethyl-2-undecylimidazole, 2,4-diamino-6-(2'-methylimidazole(1'))ethyl-s-triazine, 2,4-diamino-6-(2 '-Undecylimidazole(1'))ethyl-s-triazine, 2,4-diamino-6-(2'-ethyl-4-methylimidazole(1'))ethyl-s-tri Azine, 2,4-diamino-6-(2'-methylimidazole(1'))ethyl-s-triazine-isocyanuric acid adduct, 2-methylimidazole isocyanuric acid 2 :3 adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-3,5-dihydroxyalkylimidazole, 2-phenyl-4-hydroxyalkyl-5-methylimidazole , Various imidazoles of 1-cyanoethyl-2-phenyl-3,5-dicyanoethoxymethylimidazole, and these imidazoles and phthalic acid, isophthalic acid, terephthalic acid, trimellitic acid, pyromellitic acid , Salts with polyvalent carbon acids such as naphthalenedicarboxylic acid, maleic acid and oxalic acid, amides such as dicyandiamide, and diaza compounds such as 1,8-diaza-bicyclo(5,4,0)undecene-7 And salts such as tetraphenyl borate and phenol novolac, salts with the above polyvalent carbon acids, or phosphinic acids, ammonium salts such as tetrabutylammonium bromide, acetyltrimethylammonium bromide, trioctylmethylammonium bromide, and triphenylphosphine Phosphine or phosphonium compounds, such as tri(toluyl)phosphine, tetraphenylphosphonium bromide, tetraphenylphosphonium tetraphenyl borate, hexafluorostibin phosphonium salt, 2,4,6-trisaminomethyl And organic metal compounds such as phenols such as phenol, tin octylate, cobalt octylate, zinc octylate, zirconium octylate, nickel octylate, and cobalt naphthenate. Moreover, the microcapsule type curing catalyst which used a hardening accelerator as a microcapsule is mentioned.
이들 경화 촉매 중 어느 것을 이용할지는, 요구되는 특성에 따라 적절하게 선택되어야 할 것이다. 경화 촉매는, 본 발명의 수지 조성물 중의, 전체 수지 100질량부에 대하여 통상 0.001∼15질량부의 범위에서 사용된다. Which of these curing catalysts to use should be appropriately selected according to the required properties. The curing catalyst is usually used in the range of 0.001 to 15 parts by mass based on 100 parts by mass of the total resin in the resin composition of the present invention.
본 발명의 열경화성 수지 조성물은, 각 성분을, 종래 알려져 있는 방법과 동일한 방법으로, 균일하게 혼합하여, 그 경화물로 할 수 있다. 예를 들면, 에폭시 수지와 산 무수물 경화제 그리고 필요에 따라 경화촉진제, 그 외의 성분을, 필요에 따라서 압출기, 니더, 롤 등을 이용하여 균일하게 될 때까지 충분히 혼합하여 본 발명의 열경화성 수지 조성물을 얻는다. 본 발명의 열경화성 수지 조성물은 상온에서 고체이기 때문에, 용융 후, 주형(注型), 혹은 트랜스퍼 성형기 등을 이용하여 성형하고, 추가로 가열에 의해 경화하는 것과 같은 수법을 들 수 있다. The thermosetting resin composition of this invention can mix each component uniformly by the method similar to a conventionally well-known method, and can be set as the hardened|cured material. For example, an epoxy resin, an acid anhydride curing agent, and a curing accelerator, and other components, if necessary, are thoroughly mixed until necessary to obtain uniformity using an extruder, kneader, roll, or the like to obtain a thermosetting resin composition of the present invention. . Since the thermosetting resin composition of the present invention is a solid at room temperature, after melting, it is molded using a mold or transfer molding machine, and further, a method such as curing by heating is exemplified.
또한, 본 발명의 열경화성 수지 조성물은, 톨루엔, 자일렌, 아세톤, 메틸에틸케톤, 메틸이소부틸케톤, 사이클로헥산온, 사이클로펜탄온, 디메틸포름아미드, 디메틸아세트아미드, N-메틸피롤리돈, 아세트산 에틸, 아세트산 부틸, 프로필렌글리콜모노메틸에테르, 프로필렌글리콜모노메틸에테르아세테이트 등의 용제에 희석하여 바니시로서 사용할 수 있다. 본 발명의 열경화성 수지 조성물은 통상, 상온에서 고체이기 때문에, 용제에 희석하여 사용하는 편이 취급하기 쉽고, 보다 바람직하다. 특히 유리 크로스에 함침시켜 이용하는 경우는 용제에 의한 희석을 행한다. In addition, the thermosetting resin composition of the present invention, toluene, xylene, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, cyclopentanone, dimethylformamide, dimethylacetamide, N-methylpyrrolidone, acetic acid It can be used as a varnish by diluting with solvents such as ethyl, butyl acetate, propylene glycol monomethyl ether, and propylene glycol monomethyl ether acetate. Since the thermosetting resin composition of the present invention is usually solid at room temperature, it is easier to handle by diluting with a solvent and more preferable. In particular, when using by impregnating a glass cloth, dilution with a solvent is performed.
용제는, 본 발명의 열경화성 수지 조성물을 사용할 때의 점도나 건조 속도 등을 고려하여, 1종 혹은 2종 이상의 혼합 용제로서 이용할 수 있다. 용제의 사용 비율은 사용시의 작업성이나 건조 속도에 따르지만, 본 발명의 열경화성 수지 조성물 100질량부에 대하여, 통상 10∼200질량부, 바람직하게는 15∼100질량부이다. The solvent can be used as one kind or a mixture of two or more kinds of solvents in consideration of viscosity and drying speed when using the thermosetting resin composition of the present invention. The use ratio of the solvent depends on the workability and drying speed at the time of use, but is usually 10 to 200 parts by mass, preferably 15 to 100 parts by mass, relative to 100 parts by mass of the thermosetting resin composition of the present invention.
용제로 희석한 본 발명의 열경화성 수지 조성물을 얻는 경우도, 각 성분을 상법에 따라 혼합 용해함으로써 조제할 수 있다. 예를 들면, 교반 장치, 온도계가 있는 둥근바닥 플라스크에 각 성분을 넣고, 40∼80℃에서 0.5∼6시간 교반함으로써 열경화성 수지 조성물의 바니시를 얻을 수 있다. 이때에, 에폭시 수지의 바니시와, 산 무수물 경화제+경화 촉매나 첨가제의 바니시를 따로따로 조정해 두고, 사용시에 혼합하는 방법은 특히 바람직하다. 앞서 기재한 바와 같이, 미립자를 첨가하는 경우에는, 호모 믹서, 샌드밀 등 고속 교반기나 마이크로플루이다이저, 3축 롤 등, 일반적으로 공지의 분산 방법으로 처리를 행할 수도 있다. In the case of obtaining the thermosetting resin composition of the present invention diluted with a solvent, it can also be prepared by mixing and dissolving each component according to the conventional method. For example, the varnish of the thermosetting resin composition can be obtained by adding each component to a round bottom flask with a stirring device and a thermometer and stirring at 40 to 80°C for 0.5 to 6 hours. At this time, the varnish of the epoxy resin, and the varnish of the acid anhydride curing agent + curing catalyst or additive are adjusted separately, and the method of mixing in use is particularly preferable. As described above, when the fine particles are added, treatment may be performed by a generally known dispersing method, such as a high-speed stirrer such as a homo mixer or a sand mill, a microfluidizer, or a triaxial roll.
이와 같이 하여 얻어진 본 발명의 열경화성 수지 조성물의 바니시는, 공지의 방법으로 성형하고, 건조한 후, 추가로 가열함으로써 경화시킨다. 예를 들면, 금형에 흘려 넣어, 가열 건조 후, 경화시키는 방법이나, 바 코터, 에어 나이프 코터, 다이 코터, 그라비아 코터, 오프셋 인쇄, 플렉소 인쇄, 스크린 인쇄 등, 그 자체 공지의 방법으로 금형의 대신이 되는 금속판이나 이형 필름 등에 도포하고, 가열 건조 후, 경화시키는 방법, 유리 크로스에 함침시켜, 가열 건조 후, 경화시키는 방법, 또한 유리나 투명 플라스틱 기재에 도포하고, 가열 건조 후, 경화시켜 기재와 함께 사용하는 코팅제로서의 사용 방법 등도 들 수 있다. 본 발명의 열경화성 수지 조성물은, 경화시에 경화제가 휘발되어 막의 성분비가 바뀌어 굴절률이 변화하는 일이 없기 때문에, 안정된 투명한 막을 얻을 수 있다. 이 때문에, 광학 시트의 제조에도 적합하다. 또한, 경화제의 휘발에 의해 경화막의 표면이 거칠어지거나, 경화막의 물성이 바뀌어 버리거나 하는 일도 없어, 평활하고 경도가 우수한 막을 얻을 수 있다. The varnish of the thermosetting resin composition of the present invention thus obtained is molded by a known method, dried, and then cured by further heating. For example, it can be poured into a mold, heated and dried, and then cured, or a bar coater, air knife coater, die coater, gravure coater, offset printing, flexo printing, screen printing, etc. It is applied to an alternative metal plate or release film, and after heating and drying, the method of curing is impregnated with a glass cloth, followed by heating and drying, and then applied to a glass or transparent plastic substrate. And a method of use as a coating agent used together. In the thermosetting resin composition of the present invention, since the curing agent volatilizes during curing, the composition ratio of the film does not change and the refractive index does not change, so that a stable transparent film can be obtained. For this reason, it is suitable also for manufacture of an optical sheet. Moreover, the surface of the cured film does not become rough or the physical properties of the cured film change due to the volatilization of the curing agent, so that a smooth and excellent hardness film can be obtained.
본 발명의 열경화성 수지 조성물의 바니시의 건조 온도는, 사용하는 용제나 풍량에도 따르지만 통상은 60∼200℃가 바람직하다. 유리 크로스 등의 유리 섬유 시트 형상 기재에 상기 바니시를 함침시키고, 용제를 건조할 때에, 본 발명의 열경화성 수지 조성물을 반경화 상태로 함으로써, 프리프레그를 얻는 것도 가능하다. 이때의 건조 조건은 특별히 한정은 되지 않지만, 온도 100∼180℃, 시간은 1∼30분이 바람직하다. The drying temperature of the varnish of the thermosetting resin composition of the present invention depends on the solvent and the air volume used, but is usually preferably 60 to 200°C. It is also possible to obtain a prepreg by impregnating the varnish with a glass fiber sheet-like substrate such as a glass cloth and drying the solvent to make the thermosetting resin composition of the present invention semi-cured. The drying conditions at this time are not particularly limited, but the temperature is preferably 100 to 180°C, and the time is preferably 1 to 30 minutes.
본 발명의 열경화성 수지 조성물을 반경화 상태로 형상을 부여한 프리프레그도 본 발명에 포함된다. The prepreg provided with the thermosetting resin composition of the present invention in a semi-cured state is also included in the present invention.
본 발명의 열경화성 수지 조성물을 경화하여 얻어지는 경화물도 본 발명에 포함된다. 본 발명의 열경화성 수지 조성물을 섬유에 함침시킨 프리프레그를 제작한 후, 건조, 경화하여 얻어지는 경화물도 동일하게 본 발명에 포함된다. 전술한 바와 같이, 본 발명의 열경화성 수지 조성물은 경화시에 경화제가 휘발되는 것에 의한 굴절률의 변화가 없기 때문에, 광학 시트의 제조에 적합하다. 또한, 본 발명의 열경화성 수지 조성물의 경화 온도, 시간으로서는 80∼200℃에서 2∼200시간이다. 경화 방법으로서는 고온에서 단번에 경화시킬 수도 있지만, 150℃ 이하의 저온에서 장시간 경화시켜도 좋다. 80∼150℃의 사이에 초기 경화를 행하고, 100℃∼200℃의 사이에 후경화를 행하는 등, 스텝 와이즈에 승온하여 경화 반응을 진행시켜도 좋다. The cured product obtained by curing the thermosetting resin composition of the present invention is also included in the present invention. A cured product obtained by drying and curing the prepreg in which the thermosetting resin composition of the present invention is impregnated into fibers is also included in the present invention. As described above, the thermosetting resin composition of the present invention is suitable for the production of an optical sheet because there is no change in refractive index due to volatilization of the curing agent during curing. Moreover, as a curing temperature and time of the thermosetting resin composition of this invention, it is 2 to 200 hours at 80-200 degreeC. As a curing method, although it can be hardened at once at high temperature, you may harden for a long time at low temperature of 150 degreeC or less. The curing reaction may be performed by raising the temperature in stepwise, such as initial curing between 80°C and 150°C and post-curing between 100°C and 200°C.
상기 프리프레그를 제작하기 위한 유리 크로스는, 공지인 시판의 것을 이용할 수 있다. 그 중에서도 일반적으로 수지 강화용으로서 이용되는 E 유리는, 알칼리 금속 산화물이 적고, 무알칼리 유리로서 본 발명의 용도에는 적절하다. 시판의 유리 크로스에는, 유리 섬유를 이용한 직포, 부직포, 편물 등 여러 가지 것이 있으며, 본 발명에 있어서 그 종류에 특별히 제한은 없지만, 본 발명의 열경화성 수지 조성물을 함침시켜 경화했을 때에 평활한 경화물을 얻기 위해서는, 유리 크로스의 표면의 요철이 작은 것이 적합하다. 프리프레그를 제작할 때의 건조, 반경화의 조건을 고려하면 유리 크로스의 두께는 통상 100㎛ 이하이며, 바람직하게는 50㎛ 이하이다. 25㎛ 정도나 그 이하의 두께인 것을 이용하여 프리프레그를 제작하고, 경화시에 2매∼수 매를 서로 겹쳐 일체화하여 본 발명의 광학 시트로 해도 좋다. 유리 크로스에 이용하는 유리 섬유의 지름은, 투명성 등을 고려하면 작은 편이 좋고 10㎛ 이하가 바람직하다. 또한 본 발명의 열경화성 수지 조성물과의 밀착성을 고려하면, 유리 섬유는 실란 커플링제에 의해 처리되어 있는 것이 바람직하다. 굴절률은 1.51∼1.57이며, 일반적으로 입수 가능한 것으로서 1.55∼1.57이 보다 바람직하다. As the glass cross for producing the prepreg, a known commercially available one can be used. Among them, E glass, which is generally used for resin strengthening, has few alkali metal oxides and is suitable for use in the present invention as an alkali free glass. There are various commercially available glass cloths, such as woven fabrics, nonwoven fabrics, and knitted fabrics using glass fibers, and the type of the present invention is not particularly limited, but the cured product is smooth when impregnated and cured by impregnating the thermosetting resin composition of the present invention. In order to obtain, it is suitable that the irregularities of the surface of the glass cross are small. When considering the conditions of drying and semi-hardening when producing the prepreg, the thickness of the glass cross is usually 100 µm or less, preferably 50 µm or less. A prepreg may be produced using a thickness of about 25 µm or less, and two to several sheets may be overlapped and integrated with each other during curing to form an optical sheet of the present invention. The diameter of the glass fiber used for the glass cloth is preferably small, considering transparency and the like, and preferably 10 µm or less. Further, in consideration of adhesion to the thermosetting resin composition of the present invention, it is preferable that the glass fibers are treated with a silane coupling agent. The refractive index is 1.51 to 1.57, and is generally available, and 1.55 to 1.57 are more preferable.
본 발명에 있어서, 본 발명의 경화물의 굴절률은, 이용하는 유리 섬유의 굴절률과의 차이가 적은 것이 바람직하다. 구체적으로는 당해 유리 섬유의 굴절률과의 차이가 ±0.01이 되는 것이 바람직하고, 차이가 ±0.005가 되는 것이 더욱 바람직하다. 본 발명의 경화물의 굴절률이 이 범위이면, 투명성, 평활성, 경도가 우수한 광학 시트가 얻어진다. 이들 광학 시트 상에, 추가로 본 발명의 열경화성 수지 조성물을 도포, 건조, 경화함으로써, 투명성, 평활성이 보다 우수한 광학 시트를 얻는 것도 가능하다. In this invention, it is preferable that the refractive index of the hardened|cured material of this invention is small from the refractive index of the glass fiber used. Specifically, the difference from the refractive index of the glass fiber is preferably ±0.01, more preferably the difference is ±0.005. When the refractive index of the cured product of the present invention is within this range, an optical sheet excellent in transparency, smoothness and hardness is obtained. By further applying, drying, and curing the thermosetting resin composition of the present invention on these optical sheets, it is also possible to obtain an optical sheet having better transparency and smoothness.
본 발명의 열경화성 수지 경화물은, 액정 디스플레이, 플라즈마 디스플레이, EL 디스플레이, 휴대 기기 등의 표시 장치나 태양 전지 등에 이용되는 유리의 대체품으로서 이용 가능하다. 그 외에도, 도광판, 프리즘 시트, 편광판, 위상차판, 시야각 보정 필름, 접착제, 편광자 보호 필름 등의 액정용 필름 등의 액정 표시 장치 주변 재료나, 반사 방지 필름, 터치 패널용 전면판, 광학 보정 필름 등에도 사용할 수 있다. The thermosetting resin cured product of the present invention can be used as a substitute for glass used in display devices such as liquid crystal displays, plasma displays, EL displays, portable devices, and solar cells. In addition, liquid crystal display device peripheral materials such as light guide plates, prism sheets, polarizing plates, retardation plates, viewing angle correction films, adhesives, polarizer protective films, and the like, antireflection films, front panels for touch panels, optical correction films, etc. You can also use
(실시예)(Example)
다음으로, 실시예에 의해 본 발명을 더욱 상세하게 설명한다. 또한, 본 발명은 이하의 실시예에 의해 전혀 한정되는 것은 아니다. 화합물의 합성에 있어서는, 겔 투과 크로마토그래피(이하, 「GPC」라고 함)에 의해 원료 알코올류의 소실을 확인한 시점에서 반응 종료로 했다. 또한, 실시예에 있어서 TMAC는 무수 트리멜리트산 클로라이드를, HTAC는 핵수소 첨가 무수 트리멜리트산 클로라이드를, THF는 테트라하이드로푸란을, TMP는 트리메틸올프로판을, DPE는 디펜타에리트리톨을, PE4EO는 펜타에리트리톨 4몰 에틸렌옥사이드 부가물을, DE6EO는 디펜타에리트리톨 6몰 에틸렌옥사이드 부가물을, DPE4C는 디펜타에리트리톨 4몰 카프로락톤 부가물을, MEK는 메틸에틸케톤을, 각각 나타낸다. Next, the present invention will be described in more detail by examples. In addition, this invention is not limited at all by the following Example. In the synthesis of the compound, the reaction was terminated when the disappearance of the raw alcohols was confirmed by gel permeation chromatography (hereinafter referred to as "GPC"). In addition, in the examples, TMAC is trimellitic anhydride, HTAC is trimellitic anhydride with nuclear hydrogenation, THF is tetrahydrofuran, TMP is trimethylolpropane, DPE is dipentaerythritol, PE4EO Denotes a pentaerythritol 4 mol ethylene oxide adduct, DE6EO a dipentaerythritol 6 mol ethylene oxide adduct, DPE4C a dipentaerythritol 4 mol caprolactone adduct, MEK represents methyl ethyl ketone, respectively.
합성예 1: 디펜타에리트리톨 4몰 카프로락톤 부가물(DPE4C)의 합성Synthesis Example 1: Synthesis of dipentaerythritol 4-mol caprolactone adduct (DPE4C)
교반기, 환류 냉각관, 교반 장치를 구비한 플라스크에, 질소 퍼지를 행하면서, 디펜타에리트리톨 25.43g(100m㏖)에 카프로락톤 45.66g(400m㏖)을 첨가하고, 180℃ 12시간 교반하여, 디펜타에리트리톨 4몰 카프로락톤 부가물 71.09g을 얻었다. To a flask equipped with a stirrer, a reflux cooling tube, and a stirrer, while purging nitrogen, 45.66 g (400 mmol) of caprolactone was added to 25.43 g (100 mmol) of dipentaerythritol and stirred at 180° C. for 12 hours, 71.09 g of dipentaerythritol 4-mol caprolactone adduct was obtained.
합성예 2: 공중합형 에폭시 수지의 조제Synthesis Example 2: Preparation of copolymerized epoxy resin
교반기, 환류 냉각관, 교반 장치를 구비한 플라스크에, 질소 퍼지를 행하면서, 글리시딜메타아크릴레이트 30g, 메틸메타아크릴레이트 30g, 부틸메타아크릴레이트 40g, 용매로서 메틸에틸케톤 200g, 반응 개시제로서 아조비스이소부티로니트릴 1g을 첨가하여, 80℃, 5시간 중합 반응을 행했다. 30 g of glycidyl methacrylate, 30 g of methyl methacrylate, 40 g of butyl methacrylate, 200 g of methyl ethyl ketone as a solvent, as a reaction initiator, while nitrogen purging is carried out in a flask equipped with a stirrer, a reflux cooling tube, and a stirring device 1 g of azobisisobutyronitrile was added, and polymerization was performed at 80°C for 5 hours.
반응 종료 후, 90℃로 가열, 감압하에 있어서 용매를 증류제거하여 공중합체형 에폭시 수지를 얻었다. 얻어진 공중합체형 에폭시 수지의 분자량을 GPC에 의한 폴리스티렌 환산 수평균 분자량 15,000, 동(同)중량 평균 분자량 30,000, 에폭시 당량 470g/eq였다. After completion of the reaction, the solvent was distilled off under heating and reduced pressure to 90°C to obtain a copolymer-type epoxy resin. The molecular weight of the obtained copolymer-type epoxy resin was a polystyrene equivalent number average molecular weight of 15,000 by GPC, the same weight average molecular weight of 30,000, and an epoxy equivalent of 470 g/eq.
실시예 1-1: 다관능 산 무수물의 합성Example 1-1: Synthesis of polyfunctional acid anhydride
교반기, 환류 냉각관, 교반 장치를 구비한 플라스크에, 질소 퍼지를 행하면서, HTAC 23.34g(108m㏖)에, THF를 36g 첨가하여 균일 용액으로 했다. 이 용액을 교반하면서 5℃까지 냉각 후, TMP 4.44g(33m㏖)에 피리딘 10.08g(127.5m㏖)과 THF 54g을 첨가하여 균일하게 한 용액을, 액온(液溫)을 10℃ 이하로 유지하면서 서서히 적하했다. 적하 종료 후, 실온에서 1시간 교반하고, 이어서 50℃까지 승온하여, 반응을 8시간 계속했다. 계속해서, 반응액을 20℃까지 냉각하고, 불용해분인 피리딘 염산염을 여과제거한 후, 여과액을 농축했다. 농축물을 아세트산 에틸 120ml에 용해시키고, 30ml의 물로 3회 세정한 후, 무수 황산 마그네슘으로 건조했다. 무수 황산 마그네슘을 여과제거한 후, 여과액을 농축하여, 얻어진 농축물을 15ml의 아세트산 에틸에 녹이고, 톨루엔으로 재결정하여, 생성물을 16.7g(수율 75.2%) 얻었다. 36 g of THF was added to 23.34 g (108 mmol) of HTAC while purging nitrogen in a flask equipped with a stirrer, a reflux cooling tube, and a stirring device to obtain a uniform solution. After stirring this solution to 5°C while stirring, 10.08 g (127.5 mmol) of pyridine and 54 g of THF were added to 4.44 g (33 mmol) of TMP to maintain a uniform solution, and the liquid temperature was maintained at 10°C or lower. While dropping slowly. After completion of the dropwise addition, the mixture was stirred at room temperature for 1 hour, then heated to 50°C, and the reaction was continued for 8 hours. Subsequently, the reaction solution was cooled to 20°C, and the insoluble portion of pyridine hydrochloride was filtered off, and then the filtrate was concentrated. The concentrate was dissolved in 120 ml of ethyl acetate, washed three times with 30 ml of water, and dried over anhydrous magnesium sulfate. After removing the anhydrous magnesium sulfate by filtration, the filtrate was concentrated, the resulting concentrate was dissolved in 15 ml of ethyl acetate, and recrystallized from toluene to obtain 16.7 g (yield 75.2%) of the product.
이 생성물은, 1H-NMR로부터 목적의 화합물인 것을 확인했다. It was confirmed that this product was the desired compound from 1 H-NMR.
1H-NMR(클로로포름-d1, δppm): 0.90-0.92(m, 3H), 1.48-2.49(m, 23H), 3.11-3.41(m, 6H), 4.04(s, 6H) 1 H-NMR (chloroform-d1, δppm): 0.90-0.92 (m, 3H), 1.48-2.49 (m, 23H), 3.11-3.41 (m, 6H), 4.04 (s, 6H)
실시예 1-2: 다관능 산 무수물의 합성Example 1-2: Synthesis of polyfunctional acid anhydride
교반기, 환류 냉각관, 교반 장치를 구비한 플라스크에, 질소 퍼지를 행하면서, HTAC 7.78g(36m㏖)에, THF를 12g 첨가하여 균일 용액으로 했다. 이 용액을 교반하면서 5℃까지 냉각 후, DPE 1.40g(5.5m㏖)에 피리딘 3.36g(47.5m㏖)과 아세톤 18g을 첨가하여 균일하게 한 용액을, 액온을 10℃ 이하로 유지하면서 서서히 적하했다. 적하 종료 후, 실온에서 1시간 교반하고, 이어서 50℃까지 승온하여, 반응을 8시간 계속했다. 계속해서, 반응액을 20℃까지 냉각하고, 불용해분인 피리딘 염산염을 여과제거한 후, 여과액을 농축했다. 농축물을 아세트산 에틸 40ml에 용해시키고, 10ml의 물로 3회 세정한 후, 무수 황산 마그네슘으로 건조했다. 무수 황산 마그네슘을 여과제거한 후, 여과액을 농축하여, 얻어진 농축물을 5ml의 아세트산 에틸에 녹이고, 톨루엔으로 재결정하여, 생성물을 5.24g(수율 71.3%) 얻었다. 12 g of THF was added to 7.78 g (36 mmol) of HTAC while nitrogen purging was carried out in a flask equipped with a stirrer, a reflux cooling tube, and a stirring device to obtain a uniform solution. After the solution was cooled to 5° C. while stirring, the solution uniformly added by adding 3.36 g (47.5 mmol) of pyridine and 18 g of acetone to 1.40 g (5.5 mmol) of DPE was slowly added dropwise while maintaining the liquid temperature at 10° C. or lower. did. After completion of the dropwise addition, the mixture was stirred at room temperature for 1 hour, then heated to 50°C, and the reaction was continued for 8 hours. Subsequently, the reaction solution was cooled to 20°C, and the insoluble portion of pyridine hydrochloride was filtered off, and then the filtrate was concentrated. The concentrate was dissolved in 40 ml of ethyl acetate, washed three times with 10 ml of water, and dried over anhydrous magnesium sulfate. After removing the anhydrous magnesium sulfate by filtration, the filtrate was concentrated, the resulting concentrate was dissolved in 5 ml of ethyl acetate, and recrystallized with toluene to obtain 5.24 g (yield 71.3%) of the product.
실시예 1-3∼1-4Examples 1-3 to 1-4
실시예 1-2에 있어서 다가 알코올을 표 1 기재로 한 외에는 동일하게 하여 다관능 산 무수물을 합성했다. In Example 1-2, a polyfunctional acid anhydride was synthesized in the same manner except that the polyhydric alcohol was used in Table 1.
실시예 1-5: 다관능 산 무수물의 합성Example 1-5: Synthesis of polyfunctional acid anhydride
교반기, 환류 냉각관, 교반 장치를 구비한 플라스크에, 질소 퍼지를 행하면서, HTAC 78.6g(363m㏖)에, THF를 120g 첨가하여 균일 용액으로 했다. 이 용액을 교반하면서 5℃까지 냉각 후, PE4EO 28.5g(55m㏖)에 피리딘 33.6g(475m㏖)과 THF 180g을 첨가하여 균일하게 한 용액을, 액온을 10℃ 이하로 유지하면서 서서히 적하했다. 적하 종료 후, 실온에서 1시간 교반하고, 이어서 50℃까지 승온하여, 반응을 8시간 계속했다. 계속해서, 반응액을 20℃까지 냉각하고, 불용해분인 피리딘 염산염을 여과제거한 후, 여과액을 농축했다. 얻어진 농축물을 아세트산 에틸 400ml에 용해시켜, 100ml의 물로 3회 세정한 후, 무수 황산 마그네슘으로 건조했다. 무수 황산 마그네슘을 여과제거한 후, 여과액을 농축하여, 얻어진 농축물을 40ml의 아세트산 에틸에 녹이고, 톨루엔으로 재결정하여, 생성물을 74.7g(수율 77.1%) 얻었다. 120 g of THF was added to 78.6 g (363 mmol) of HTAC while purging nitrogen to a flask equipped with a stirrer, a reflux cooling tube, and a stirring device to obtain a uniform solution. After the solution was cooled to 5°C while stirring, 33.6g (475mmol) of pyridine and 180g of THF were added to 28.5g (55mmol) of PE4EO, and a uniform solution was slowly added dropwise while maintaining the liquid temperature at 10°C or lower. After completion of the dropwise addition, the mixture was stirred at room temperature for 1 hour, then heated to 50°C, and the reaction was continued for 8 hours. Subsequently, the reaction solution was cooled to 20°C, and the insoluble portion of pyridine hydrochloride was filtered off, and then the filtrate was concentrated. The obtained concentrate was dissolved in 400 ml of ethyl acetate, washed three times with 100 ml of water, and dried over anhydrous magnesium sulfate. After the anhydrous magnesium sulfate was filtered off, the filtrate was concentrated, the resulting concentrate was dissolved in 40 ml of ethyl acetate, and recrystallized from toluene to obtain 74.7 g (yield 77.1%) of the product.
실시예 1-6∼1-14, 비교예 1-1Examples 1-6 to 1-14, Comparative Examples 1-1
실시예 1-5에 있어서 HTAC를 TMAC와 HTAC의 혼합물로 하고, 및 다가 알코올을 표 2 기재로 한 외에는 동일하게 하여 다관능 산 무수물을 합성했다. In Example 1-5, polyfunctional acid anhydride was synthesized in the same manner except that HTAC was used as a mixture of TMAC and HTAC, and polyhydric alcohol was described in Table 2.
실시예 1-6의 다관능 산 무수물은, 1H-NMR로부터 목적의 화합물인 것을 확인했다. 도 2에 1H-NMR의 차트를 나타낸다. It was confirmed from 1 H-NMR that the polyfunctional acid anhydride of Example 1-6 was the desired compound. 2 shows a chart of 1 H-NMR.
1H-NMR(디메틸술폭사이드-d6, δppm): 0.79-1.00(m, 3H), 1.20-2.73(m, 15.5H), 3.05-3.57(m, 3H), 3.93-4.58(m, 6H), 8.13-8.53(m, 4.5H) 1 H-NMR (dimethylsulfoxide-d6, δppm): 0.79-1.00 (m, 3H), 1.20-2.73 (m, 15.5H), 3.05-3.57 (m, 3H), 3.93-4.58 (m, 6H) , 8.13-8.53 (m, 4.5H)
실시예 2-1: 수지 조성물의 조제Example 2-1: Preparation of resin composition
실시예 1-1에서 얻은 지환식 다관능 산 무수물을 35g, 지방족형 에폭시 수지 EHPE-3150((주) 다이셀 제조, 에폭시 당량 181)을 10g, 방향족형 에폭시 수지 NC-6300(닛폰카야쿠(주) 제조: (4-(4-(1,1-비스(p-하이드록시페닐)-에틸)-α,α-디메틸벤질)페놀)형 에폭시 수지, 에폭시 당량 206, 전체 염소량 550ppm)을 27g, 마찬가지로 RE-310S(닛폰카야쿠(주) 제조: 액상 비스페놀 A 에폭시 수지, 에폭시 당량 185, 전체 염소량 500ppm)를 23g, 그 외의 성분으로서 옥틸산 아연을 0.3g, 희석 용제인 메틸에틸케톤을 41g 합한 것을 70℃로 가온, 혼합하여, 고형분이 70질량%인 수지 조성물을 얻었다. 35 g of the alicyclic polyfunctional acid anhydride obtained in Example 1-1, 10 g of an aliphatic epoxy resin EHPE-3150 (manufactured by Daicel, Epoxy equivalent 181), aromatic epoxy resin NC-6300 (Nippon Kayaku ( Note) Preparation: 27 g of (4-(4-(1,1-bis(p-hydroxyphenyl)-ethyl)-α,α-dimethylbenzyl)phenol) type epoxy resin, epoxy equivalent 206, total chlorine 550 ppm) Similarly, 23 g of RE-310S (manufactured by Nippon Kayaku Co., Ltd.: liquid bisphenol A epoxy resin, epoxy equivalent 185, total chlorine content 500 ppm), 0.3 g of zinc octylate as other components, and 41 g of methyl ethyl ketone as a dilution solvent The combined ones were heated to 70°C and mixed to obtain a resin composition having a solid content of 70% by mass.
주) EHPE-3150: 2,2-비스(하이드록시메틸)-1-부탄올의 1,2-에폭시-4-(2-옥시라닐)사이클로헥산 부가물 Note) EHPE-3150: 1,2-epoxy-4-(2-oxyranyl)cyclohexane adduct of 2,2-bis(hydroxymethyl)-1-butanol
실시예 2-2∼2-14, 비교예 2-1∼2-2Examples 2-2 to 2-14, Comparative Examples 2-1 to 2-2
실시예 2-1에 있어서 다관능 산 무수물 및 MEK를 표 3 기재로 한 외에는 동일하게 하여 고형분이 70질량%인 수지 조성물을 조제했다. A resin composition having a solid content of 70% by mass was prepared in the same manner as in Example 2-1 except that the polyfunctional acid anhydride and MEK were listed in Table 3.
실시예 2-15: 수지 조성물의 조제Example 2-15: Preparation of resin composition
실시예 1-3에서 얻은 다관능 산 무수물 10g, 합성예 2의 글리시딜메타아크릴레이트 공중합체 50g, 경화 촉매로서 트리페닐포스핀 1g, 용제로서 메틸에틸케톤 40g을 합한 것을 50℃로 가온, 혼합하여, 고형분이 60질량%인 수지 조성물을 얻었다. 10 g of the polyfunctional acid anhydride obtained in Example 1-3, 50 g of the glycidyl methacrylate copolymer of Synthesis Example 2, 1 g of triphenylphosphine as a curing catalyst, and 40 g of methyl ethyl ketone as a solvent were heated to 50° C., By mixing, a resin composition having a solid content of 60% by mass was obtained.
실시예 2-16: 수지 조성물의 조제Example 2-16: Preparation of resin composition
실시예 1-1에서 얻은 다관능 산 무수물을 35g, 희석 용제인 MEK를 41g으로 한 외에는 실시예 2-1과 동일하게 하고, 추가로 콜로이달 실리카의 메틸에틸케톤 분산액(고형분 30질량%, 닛산카가쿠코교(주) 제조 오르가노실리카졸(ORGANOSILICASOL) MEK-ST; 이하 MEK-ST)을 137g 첨가하여, 고형분이 59질량%인 본 발명의 수지 조성물의 희석 조성물을 얻었다. The same procedure as in Example 2-1 was carried out except that 35 g of the polyfunctional acid anhydride obtained in Example 1-1 and MEK as a diluting solvent was 41 g, and further a methyl ethyl ketone dispersion of colloidal silica (30% by mass solid content, Nissan) 137 g of organosilica sol (ORGANOSILICASOL) MEK-ST; hereinafter MEK-ST) manufactured by Kagaku Kogyo Co., Ltd. was added to obtain a dilute composition of the resin composition of the present invention having a solid content of 59% by mass.
비교예 2-3: 수지 조성물의 조제Comparative Example 2-3: Preparation of resin composition
1,2,4,5-사이클로헥산테트라카본산 2무수물을 17g, RE-310S(닛폰카야쿠(주) 제조: 액상 비스페놀 A 에폭시 수지, 에폭시 당량 185, 전체 염소량 500ppm)를 23g, 그 외의 성분으로서 옥틸산 아연을 0.3g, 희석 용제인 아세톤을 33g으로 한 외에는 실시예 2-1과 동일하게 하여, 고형분이 70질량%인 수지 조성물 희석 조성물을 얻었다. 17g for 1,2,4,5-cyclohexanetetracarboxylic acid anhydride, 23g for RE-310S (manufactured by Nippon Kayaku Co., Ltd.: liquid bisphenol A epoxy resin, epoxy equivalent 185, total chlorine amount 500ppm), and other components As a result, a resin composition dilution composition having a solid content of 70% by mass was obtained in the same manner as in Example 2-1, except that 0.3 g of zinc octylate and 33 g of acetone as a dilution solvent were used.
비교예 2-4: 수지 조성물의 조제Comparative Example 2-4: Preparation of resin composition
수소 첨가 트리멜리트산 무수물을 10g, 합성예 2의 글리시딜메타아크릴레이트 공중합체 50g, 경화 촉매로서 트리페닐포스핀 1g, 용제로서 MEK 40g을 합한 것을 50℃로 가온, 혼합하여, 고형분이 60질량%인 수지 조성물을 얻었다. 10 g of hydrogenated trimellitic anhydride, 50 g of glycidyl methacrylate copolymer of Synthesis Example 2, 1 g of triphenylphosphine as a curing catalyst, and 40 g of MEK as a solvent were heated to 50°C and mixed to obtain a solid content of 60. A resin composition having a mass% was obtained.
실시예 3-1∼3-5, 비교예 3-1∼3-2Examples 3-1 to 3-5, Comparative Examples 3-1 to 3-2
유리 기판 상에 내열 이형 테이프로 40㎜×25㎜×1㎜의 형태를 제작하고, 실시예 2 및 비교예 2의 열경화성 수지 조성물을 각각 두께 약 800㎛로까지 주형하여, 80℃에서 50분간 건조했다. 건조 도중에 진공 탈포를 1회 행하여, 거품을 제거했다. 그 후 실온까지 냉각하여, 상태를 확인한 결과, 본 발명의 열경화성 수지 조성물은 실온에서 고체였다. A 40 mm×25 mm×1 mm shape was produced with a heat-resistant release tape on a glass substrate, and the thermosetting resin compositions of Example 2 and Comparative Example 2 were molded to a thickness of about 800 μm, respectively, and dried at 80° C. for 50 minutes. . Vacuum defoaming was performed once during drying to remove bubbles. Thereafter, the mixture was cooled to room temperature and the state was confirmed. As a result, the thermosetting resin composition of the present invention was solid at room temperature.
계속해서 140℃ 건조기에서 3시간 경화하여, 본 발명의 경화물을 얻었다. 얻어진 경화물에 대해서 각각 유리 전이점, 강인성, 내착색성을 측정하여, 표 4에 기재했다. Subsequently, it cured in a 140 degreeC dryer for 3 hours, and obtained the hardened|cured material of this invention. The glass transition points, toughness, and color resistance were measured for the obtained cured products, respectively, and are listed in Table 4.
평가 방법 및 평가 기준Evaluation method and evaluation standard
(1) 유리 전이 온도(Tg): 경화한 수지 조성물의 Tg점을 점탄성 측정 시스템(DMS-6000: 세이코덴시코교(주) 제조)에 있어서, 인장 모드, 주파수 1Hz로 측정했다. (1) Glass transition temperature (Tg): The Tg point of the cured resin composition was measured in a viscoelasticity measurement system (DMS-6000: manufactured by Seiko Denshi Kogyo Co., Ltd.) at a tensile mode and a frequency of 1 Hz.
(2) 강인성: 경화한 수지 조성물의 경화막의 양단을 손으로 고정하고, 중앙부를 눌렀을 때의 경화막 상태를 관찰했다. 판정 기준은 이하와 같다. (2) Toughness: Both ends of the cured film of the cured resin composition were fixed by hand, and the state of the cured film when the central portion was pressed was observed. The judgment criteria are as follows.
◎: 강하게 눌러도 금이 가지 않고, 갈라지지 않는다. ◎: Even if it is pressed strongly, it does not crack and does not crack.
○: 약하게 눌러도 금이 가지 않고, 갈라지지 않지만, 강하게 누르면 금이 간다. ○: The gold does not crack and does not crack even when lightly pressed, but cracks when pressed strongly.
△: 약하게 누르면 금이 가고, 강하게 누르면 갈라진다. (Triangle|delta): When it presses weakly, it cracks, and when it presses hard, it cracks.
×: 약하게 누르면 갈라진다. ×: It is cracked when pressed lightly.
(3) 투명성: 수지 조성물의 경화막의 외관을 육안으로 관찰했다. (3) Transparency: The appearance of the cured film of the resin composition was visually observed.
이상의 결과로부터 명백한 바와 같이 본 발명의 경화물은, 내열성, 강인성, 투명성이 우수하다. 실시예 3-1∼3-5의 경화물에 이용된 본 발명의 다관능 산 무수물은 3관능 이상의 산 무수물을 갖고, 모(母)격이 되는 알코올이 지방족이고 분자량도 큰 점에서, 내열성과 강인성이 우수하다고 생각할 수 있다. 이에 대하여, 비교예 3-1의 경화물에 이용된 다관능 산 무수물은 2관능이고, 저분자인 점에서 내열성과 강인성이 뒤떨어져 있다고 생각할 수 있다. 비교예 3-2의 경화물은 산 무수물이 1관능이고, 저분자인 점에서 내열성과 강인성이 뒤떨어져 있다고 생각할 수 있다. As apparent from the above results, the cured product of the present invention is excellent in heat resistance, toughness, and transparency. The polyfunctional acid anhydride of the present invention used in the cured products of Examples 3-1 to 3-5 has an acid anhydride of trifunctional or higher, and the alcohol having a parental structure is aliphatic and has a large molecular weight, thereby providing heat resistance and It can be considered that the toughness is excellent. On the other hand, it can be considered that the polyfunctional acid anhydride used in the cured product of Comparative Example 3-1 is bifunctional and has low molecular weight, which is inferior in heat resistance and toughness. The cured product of Comparative Example 3-2 is considered to be inferior in heat resistance and toughness in that the acid anhydride is monofunctional and low molecular weight.
실시예 3-6∼3-14, 비교예 3-3Examples 3-6 to 3-14, Comparative Examples 3-3
실시예 3-1과 동일하게 하여, 본 발명의 경화물을 얻었다. 얻어진 경화물에 대해서 각각 유리 전이점, 강인성, 내착색성을 측정하여, 표 5에 기재했다. 강인성의 평가는 실시예 3-1과 동일하다. The cured product of this invention was obtained like Example 3-1. The glass transition points, toughness, and color resistance were measured for the obtained cured products, respectively, and are listed in Table 5. Evaluation of toughness is the same as in Example 3-1.
평가 방법 및 평가 기준Evaluation method and evaluation standard
(1) 유리 전이 온도(Tg): 경화한 수지 조성물의 Tg점을 점탄성 측정 시스템(DMS-6000: 세이코덴시코교(주) 제조)에 있어서, 인장 모드, 주파수 1Hz로 측정했다. 판정 기준은 이하와 같다. (1) Glass transition temperature (Tg): The Tg point of the cured resin composition was measured in a viscoelasticity measurement system (DMS-6000: manufactured by Seiko Denshi Kogyo Co., Ltd.) at a tensile mode and a frequency of 1 Hz. The judgment criteria are as follows.
◎: Tg가 200℃ 이상◎: Tg is 200°C or higher
○: Tg가 190℃ 이상 199℃ 이하○: Tg is 190°C or more and 199°C or less
△: Tg가 185℃ 이상 189℃ 이하△: Tg is 185°C or higher and 189°C or lower
×: Tg가 184℃ 이하×: Tg is 184° C. or less
(2) 황변도: 경화한 수지 조성물의 경화막의 초기의 황색도(YI)와 230℃에서 20분간 방치 후의 황색도(YI)를 분광 광도계(U-3900H: (주) 히타치하이테크놀로지즈 제조(황색도는 JIS K7105/JIS K7373)로 측정하여, 그 차(황변도: ΔYI)를 구했다. 판정 기준은 이하와 같다. (2) Yellowness: The initial yellowness (YI) of the cured film of the cured resin composition and the yellowness (YI) after standing at 230° C. for 20 minutes are measured by a spectrophotometer (U-3900H: Hitachi High Technologies Co., Ltd. ( The yellowness was measured by JIS K7105/JIS K7373, and the difference (yellowness: ΔYI) was determined.
◎: ΔYI가 0.4 이하◎: ΔYI is 0.4 or less
○: ΔYI가 0.5 이상 0.7 이하○: ΔYI is 0.5 or more and 0.7 or less
△: ΔYI가 0.8 이상 1.0 이하Δ: ΔYI is 0.8 or more and 1.0 or less
×: ΔYI가 1.1 이상×: ΔYI is 1.1 or more
이상의 결과로부터 명백한 바와 같이 본 발명의 경화물은, 내열성, 강인성, 황변도(내착색성)가 우수하다. 실시예 3-6∼3-14의 경화물에 이용된 본 발명의 다관능 산 무수물은 3관능 이상의 산 무수물을 갖고, 모격이 되는 알코올이 지방족이고 분자량도 큰 점에서, 내열성과 강인성이 우수하다. 또한, 방향환을 골격에 가짐에도 불구하고, 지방족환도 갖고 있는 점에서 내착색성도 우수하다. 이에 대하여, 비교예 3-3의 경화물에 이용된 다관능 산 무수물은 방향환 만을 갖기 때문에 황변도가 높고, 내착색성이 불충분하다. As apparent from the above results, the cured product of the present invention is excellent in heat resistance, toughness, and yellowness (color resistance). The polyfunctional acid anhydride of the present invention used in the cured products of Examples 3-6 to 3-14 has an acid anhydride of trifunctional or higher, and is excellent in heat resistance and toughness in that the alcohol to be the parent is aliphatic and has a large molecular weight. . Further, despite having an aromatic ring on the skeleton, it also has excellent coloring resistance in that it also has an aliphatic ring. On the other hand, since the polyfunctional acid anhydride used in the cured product of Comparative Example 3-3 has only an aromatic ring, yellowing degree is high and coloring resistance is insufficient.
실시예 3-15∼3-20, 비교예 3-4∼3-5 Examples 3-15 to 3-20, Comparative Examples 3-4 to 3-5
실시예 2-1, 2-3∼2-5, 2-16 및 비교예 2-1∼2-2의 수지 조성물에 MEK를 첨가하여 고형분 50질량%로 조정하고, 시판의 유리 크로스(E 유리 크로스: 유니치카(주) 제조 IPC106 타입: 약 30㎛ 두께, 평직, 광학적 굴절률 1.561) 또는 유리 섬유 부직포(E 유리: 약 750㎛ 두께, 광학적 굴절률 1.560)을 넣고, 함침시켰다. 유리 크로스를 인상한 후, 120℃에서 7분 건조했다. 건조 후의 시트는 고형의 필름이었다. 그것을 추가로 이형 처리한 PET 필름에 끼워 프레스하면서 150℃에서 10분 처리하고, 반경화시켜 프리프레그를 얻었다. 그 후 150℃ 건조기에서 3시간 경화하여, 본 발명의 경화물을 얻었다. 또한, 실시예 2-16의 수지 조성물을 실시예 3-1과 동일하게 하여, 본 발명의 경화물을 얻었다. 이들 얻어진 경화물에 대해서 각각 내열성, 강인성, 황변도, 치수 안정성을 측정하여, 결과를 표 6에 기재했다. 내열성 및 황변도의 평가는 실시예 3-6과 동일하다. 강인성의 평가는 실시예 3-1과 동일하다. MEK was added to the resin compositions of Examples 2-1, 2-3 to 2-5, 2-16 and Comparative Examples 2-1 to 2-2 to adjust the solid content to 50% by mass, and commercially available glass cross (E glass Cross: IPC106, manufactured by Unichika Co., Ltd. Type: about 30 μm thick, plain weave, optical refractive index 1.561) or glass fiber nonwoven fabric (E glass: about 750 μm thick, optical refractive index 1.560) was added and impregnated. After pulling up the glass cross, it was dried at 120°C for 7 minutes. The sheet after drying was a solid film. It was further sandwiched between mold release PET films and pressed at 150°C for 10 minutes, semi-cured to obtain a prepreg. Thereafter, the mixture was cured in a 150°C dryer for 3 hours to obtain a cured product of the present invention. Moreover, the resin composition of Example 2-16 was made like Example 3-1, and the hardened|cured material of this invention was obtained. Heat resistance, toughness, yellowness, and dimensional stability of each of these cured products were measured, and the results are shown in Table 6. Evaluation of heat resistance and yellowness was the same as in Example 3-6. Evaluation of toughness is the same as in Example 3-1.
평가 방법 및 평가 기준Evaluation method and evaluation standard
(1) 치수 안정성: 경화한 수지 조성물의 선팽창 계수(CTE)를 점탄성 측정 시스템(DMA/SS-6000: 세이코덴시코교(주) 제조)에 있어서, 200℃/10분으로 측정했다. 판정 기준은 이하와 같다. (1) Dimensional stability: The coefficient of linear expansion (CTE) of the cured resin composition was measured at 200°C/10 minutes in a viscoelasticity measurement system (DMA/SS-6000: manufactured by Seiko Denshi Kogyo Co., Ltd.). The judgment criteria are as follows.
◎: CTE가 25ppm/K 이하◎: CTE is less than 25ppm/K
○: CTE가 26ppm/K 이상 35ppm/K 이하○: CTE is 26ppm/K or more and 35ppm/K or less
△: CTE가 36ppm/K 이상 45ppm/K 이하△: CTE is 36ppm/K or more and 45ppm/K or less
×: CTE가 46ppm/K 이상×: CTE is 46 ppm/K or more
이상의 결과로부터 명백한 바와 같이 본 발명의 경화물은, 내열성, 강인성, 내착색성, 치수 안정성이 우수하다. 실시예 3-15∼3-20의 경화물에 이용된 본 발명의 다관능 산 무수물은 3관능 이상의 산 무수물을 갖고, 또한 모격이 되는 알코올이 지방족이고 분자량도 큰 점에서, 내열성과 강인성이 우수하다고 생각할 수 있다. 또한, 포화 지환도 많이 갖고 있는 점에서 내착색성이, 유리 크로스 등을 포함하는 본 발명의 경화물에서는 치수 안정성도 우수하다. 이에 대하여, 비교예 3-4에서는 포화 지환을 갖지 않기 때문에 황변도가 높고, 내착색성이 불충분하다. 또한, 비교예 3-5에서는 이용된 저분자의 산 무수물인 점에서 내열성과 강인성이 뒤떨어져 있다고 생각할 수 있다. As apparent from the above results, the cured product of the present invention is excellent in heat resistance, toughness, color resistance, and dimensional stability. The polyfunctional acid anhydride of the present invention used in the cured product of Examples 3-15 to 3-20 has an acid anhydride of trifunctional or higher, and is also excellent in heat resistance and toughness in that the alcohol to be modeled is aliphatic and has a large molecular weight. You can think of. In addition, since it has a large number of saturated alicyclics, the color resistance is also excellent in the dimensional stability in the cured product of the present invention including a glass cloth and the like. On the other hand, in Comparative Example 3-4, since it does not have a saturated alicyclic, the yellowing degree is high, and the coloring resistance is insufficient. In addition, in Comparative Example 3-5, since it is an acid anhydride of a low molecular weight used, it can be considered that heat resistance and toughness are inferior.
실시예 4Example 4
실시예 3-15 및 3-17의 경화물의 투명성을 평가했다. 투명성의 평가는 육안으로 착색을 확인하여, 표 7에 결과를 기재했다.The transparency of the cured products of Examples 3-15 and 3-17 was evaluated. Evaluation of transparency confirmed the coloring visually, and the results are listed in Table 7.
주)week)
유리 크로스 a(유니치카(주) 제조 IPC106 타입: 약 30㎛ 두께, 평직, 광학적 굴절률 1.561)Glass cloth a (IPC106 type manufactured by Unichika Co., Ltd.: about 30㎛ thick, plain weave, optical refractive index 1.561)
유리 크로스 b(닛토보우세키(주) 제조 IPC3313 타입; 약 75㎛ 두께, 평직, 광학적 굴절률 1.554)Glass cross b (IPC3313 type manufactured by Nitto Boseki Co., Ltd.; approximately 75 µm thick, plain weave, optical refractive index of 1.554)
이상의 결과로부터 명백한 바와 같이, 본 발명의 열경화성 수지 조성물의 굴절률을 유리 크로스의 굴절률을 기준으로 하여 조정함으로써, 착색도 없고, 투명성이 우수한 경화물을 부여했다. As apparent from the above results, by adjusting the refractive index of the thermosetting resin composition of the present invention based on the refractive index of the glass cloth, a cured product having no transparency and excellent transparency was provided.
본 발명의 다관능 산 무수물 및, 그의 열경화성 수지 조성물은, 토목 건축용의 도료나 FRP, 그리고, 프린트 배선판·반도체 분야 등에 있어서의 도료, 레지스트 잉크, 접착제, 시일제, 봉지제 등의 전기 전자 재료, 주로, 액정 디스플레이, 플라즈마 디스플레이, EL 디스플레이, 휴대 기기 등의 표시 장치나 태양 전지 등에 이용하는 경화물에 적합하다. The polyfunctional acid anhydride of the present invention and its thermosetting resin composition include electrical and electronic materials such as paints for civil construction and FRP, and paints in the field of printed wiring boards and semiconductors, resist ink, adhesives, sealants, and encapsulants, Mainly, it is suitable for a display device such as a liquid crystal display, a plasma display, an EL display, a portable device, or a cured product used in a solar cell.
Claims (19)
(식 중, R1, R2, R3, R4, R5, R6은 각각 독립적이고, R1, R3, R4, R5, R6은 수소 원자, 수산기, 탄소수 1∼11의 탄화수소기, 또는 탄소수 1∼4의 하이드록시알킬기를 나타내고, R2는 수산기, 또는 탄소수 1∼4의 하이드록시알킬기를 나타내고; l은 0∼11, m과 n은 1∼11의 정수를 나타냄)로 나타나는 1분자 중에 적어도 3개의 수산기를 함유하는 다가 알코올 (A)와
무수 트리멜리트산 할라이드 및 핵수소 첨가 무수 트리멜리트산 할라이드의 혼합물 또는 핵수소 첨가 무수 트리멜리트산 할라이드와를 반응시켜 얻어지는 다관능 산 무수물.Formula (1):
(In the formula, R 1 , R 2 , R 3 , R 4 , R 5 , R 6 are each independently, and R 1 , R 3 , R 4 , R 5 , R 6 are hydrogen atoms, hydroxyl groups, and 1 to 11 carbon atoms. Represents a hydrocarbon group or a hydroxyalkyl group having 1 to 4 carbon atoms, R 2 represents a hydroxyl group, or a hydroxyalkyl group having 1 to 4 carbon atoms; l represents 0 to 11, m and n represent integers of 1 to 11 Polyhydric alcohol (A) containing at least three hydroxyl groups in one molecule represented by)
A polyfunctional acid anhydride obtained by reacting a mixture of trimellitic anhydride and trimellitic anhydride added with nuclear hydrogen or trimellitic anhydride added with nuclear hydrogen.
무수 트리멜리트산 할라이드 및 핵수소 첨가 무수 트리멜리트산 할라이드의 혼합물 또는 핵수소 첨가 무수 트리멜리트산 할라이드와를 반응시켜 얻어지는 다관능 산 무수물.The polyhydric alcohol (B) obtained by reacting the polyhydric alcohol (A) according to claim 1 with at least one selected from the group consisting of alkylene oxides, cyclic ethers, and cyclic esters.
A polyfunctional acid anhydride obtained by reacting a mixture of trimellitic anhydride and trimellitic anhydride added with nuclear hydrogen or trimellitic anhydride added with nuclear hydrogen.
다가 알코올 (A)가 트리메틸올 또는 디펜타에리트리톨인 다관능 산 무수물.According to claim 1,
Polyfunctional acid anhydride wherein the polyhydric alcohol (A) is trimethylol or dipentaerythritol.
다가 알코올 (B)가 디펜타에리트리톨에틸렌옥사이드 부가물, 디펜타에리트리톨프로필렌옥사이드 부가물, 디펜타에리트리톨테트라하이드로푸란 부가물, 또는 디펜타에리트리톨카프로락톤 부가물인 다관능 산 무수물.According to claim 2,
Polyfunctional acid anhydride wherein the polyhydric alcohol (B) is a dipentaerythritol ethylene oxide adduct, dipentaerythritol propylene oxide adduct, dipentaerythritol tetrahydrofuran adduct, or dipentaerythritolcaprolactone adduct.
다가 알코올 (B)가 펜타에리트리톨 4몰 에틸렌옥사이드 부가물, 디펜타에리트리톨 6몰 에틸렌옥사이드 부가물, 또는 디펜타에리트리톨 4몰 카프로락톤 부가물인 다관능 산 무수물. According to claim 2,
A polyfunctional acid anhydride wherein the polyhydric alcohol (B) is a pentaerythritol 4 mole ethylene oxide adduct, dipentaerythritol 6 mole ethylene oxide adduct, or dipentaerythritol 4 mole caprolactone adduct.
1분자 중에 적어도 1개의 에폭시기를 갖는 화합물이 지방족형 에폭시 수지, 방향족형 에폭시 수지 및 공중합형 에폭시 수지로부터 선택되는 1종 이상인 열경화성 수지 조성물.The method of claim 8,
A compound having at least one epoxy group in one molecule is at least one thermosetting resin composition selected from aliphatic epoxy resins, aromatic epoxy resins, and copolymerized epoxy resins.
1분자 중에 적어도 1개의 에폭시기를 갖는 화합물이 지방족형 에폭시 수지 및 방향족형 에폭시 수지로부터 선택되는 1종 이상인 열경화성 수지 조성물.The method of claim 9,
A compound having at least one epoxy group in one molecule, at least one thermosetting resin composition selected from aliphatic epoxy resins and aromatic epoxy resins.
지방족형 에폭시 수지가 지방족 환상 구조를 갖는 에폭시 수지인 열경화성 수지 조성물.The method of claim 9,
A thermosetting resin composition in which the aliphatic epoxy resin is an epoxy resin having an aliphatic cyclic structure.
방향족형 에폭시 수지가 (4-(4-(1,1-비스(p-하이드록시페닐)-에틸)-α,α-디메틸벤질)페놀)형 에폭시 수지 및 비스페놀 A 에폭시 수지로부터 선택되는 1종 이상인 열경화성 수지 조성물.The method of claim 9,
Aromatic epoxy resin is selected from (4-(4-(1,1-bis(p-hydroxyphenyl)-ethyl)-α,α-dimethylbenzyl)phenol) type epoxy resin and bisphenol A epoxy resin Ideal thermosetting resin composition.
1분자 중에 적어도 1개의 에폭시기를 갖는 화합물이 공중합형 에폭시 수지인 열경화성 수지 조성물.The method of claim 8,
A thermosetting resin composition in which a compound having at least one epoxy group in one molecule is a copolymerized epoxy resin.
다가 알코올 (A), 무수 트리멜리트산 할라이드 및 핵수소 첨가 무수 트리멜리트산 할라이드에 상용되지 않는 입자 (C-1) 또는 섬유 (C-2)를 추가로 포함하는 열경화성 수지 조성물.The method of claim 8,
A thermosetting resin composition further comprising particles (C-1) or fibers (C-2) which are not compatible with polyhydric alcohol (A), trimellitic anhydride and trimellitic anhydride with nuclear hydrogenation.
입자 (C-1)이 무기 입자인 열경화성 수지 조성물.The method of claim 14,
A thermosetting resin composition wherein the particles (C-1) are inorganic particles.
섬유 (C-2)가 유리 섬유인 열경화성 수지 조성물.The method of claim 14,
A thermosetting resin composition in which the fibers (C-2) are glass fibers.
섬유 (C-2)가 유리 섬유를 방사하고, 추가로 직제하여 이루어지는 유리 크로스인 열경화성 수지 조성물.The method of claim 16,
A thermosetting resin composition in which fibers (C-2) are glass crosses formed by spinning glass fibers and further woven.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2013-214988 | 2013-10-15 | ||
JP2013214988 | 2013-10-15 | ||
JP2014099793 | 2014-05-13 | ||
JPJP-P-2014-099793 | 2014-05-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20150044007A KR20150044007A (en) | 2015-04-23 |
KR102127775B1 true KR102127775B1 (en) | 2020-06-29 |
Family
ID=53036374
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020140139111A KR102127775B1 (en) | 2013-10-15 | 2014-10-15 | Multifunctional acid anhydride, thermosetting resin composition, prepreg and cured article |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR102127775B1 (en) |
CN (1) | CN104558544B (en) |
TW (1) | TWI617558B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105085870A (en) * | 2014-05-13 | 2015-11-25 | 日本化药株式会社 | Sealing material and prepreg |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002249543A (en) | 2001-02-26 | 2002-09-06 | Sumitomo Bakelite Co Ltd | One-pack type epoxy resin composition |
JP2007246830A (en) * | 2006-03-17 | 2007-09-27 | Stanley Electric Co Ltd | Thermo-setting resin composition, light transmitting cured product obtained by thermosetting the same, and light emitting diode sealed with the cured product |
JP2007284414A (en) | 2005-06-01 | 2007-11-01 | Mitsubishi Chemicals Corp | Tetracarboxylic acid or polyesterimide thereof, and method for production of the same |
JP2007314435A (en) | 2006-05-23 | 2007-12-06 | Mitsubishi Chemicals Corp | Tetracarboxylic acids or polyesterimide derived from the same and method for producing polyesterimide |
JP2012025670A (en) | 2010-07-20 | 2012-02-09 | Shikoku Chem Corp | Isocyanurate compound |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5851955B2 (en) | 1978-09-07 | 1983-11-19 | 大日本インキ化学工業株式会社 | 5-(2,5-dioxotetrahydro-3-furanyl)-3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride |
JP2785357B2 (en) | 1989-07-27 | 1998-08-13 | 日立化成工業株式会社 | Process for producing polyimide isoindoloquinazolinedione and its precursor |
JP2605453B2 (en) * | 1990-05-25 | 1997-04-30 | 日立化成工業株式会社 | Method for producing polyester acid anhydride |
US20040106769A1 (en) * | 2000-07-11 | 2004-06-03 | Hatton Kevin Brian | High functional polymers |
JP2003041182A (en) * | 2001-07-27 | 2003-02-13 | New Japan Chem Co Ltd | Epoxy resin powder coating composition |
JP4739689B2 (en) | 2004-05-06 | 2011-08-03 | Jx日鉱日石エネルギー株式会社 | Epoxy resin curing agent and epoxy resin composition |
-
2014
- 2014-10-15 CN CN201410543445.4A patent/CN104558544B/en not_active Expired - Fee Related
- 2014-10-15 KR KR1020140139111A patent/KR102127775B1/en active IP Right Grant
- 2014-10-15 TW TW103135601A patent/TWI617558B/en active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002249543A (en) | 2001-02-26 | 2002-09-06 | Sumitomo Bakelite Co Ltd | One-pack type epoxy resin composition |
JP2007284414A (en) | 2005-06-01 | 2007-11-01 | Mitsubishi Chemicals Corp | Tetracarboxylic acid or polyesterimide thereof, and method for production of the same |
JP2007246830A (en) * | 2006-03-17 | 2007-09-27 | Stanley Electric Co Ltd | Thermo-setting resin composition, light transmitting cured product obtained by thermosetting the same, and light emitting diode sealed with the cured product |
JP2007314435A (en) | 2006-05-23 | 2007-12-06 | Mitsubishi Chemicals Corp | Tetracarboxylic acids or polyesterimide derived from the same and method for producing polyesterimide |
JP2012025670A (en) | 2010-07-20 | 2012-02-09 | Shikoku Chem Corp | Isocyanurate compound |
Also Published As
Publication number | Publication date |
---|---|
TW201514170A (en) | 2015-04-16 |
CN104558544A (en) | 2015-04-29 |
TWI617558B (en) | 2018-03-11 |
KR20150044007A (en) | 2015-04-23 |
CN104558544B (en) | 2018-06-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9493631B2 (en) | Epoxy resin composition for transparent sheets and cured product thereof | |
TWI444415B (en) | Glass fiber composite silsesquioxane molded article and manufacturing method thereof | |
CN101426827B (en) | Adamantyl group-containing epoxy-modified (meth) acrylate and resin composition containing the same | |
CN102498161B (en) | Process for production of cured molded article, and cured molded article | |
JP5296298B2 (en) | Crystalline resin composition and method for producing the same | |
TW201040203A (en) | Olefin resin, epoxy resin, curable resin composition, and material resulting from curing same | |
CN108219691A (en) | Photocurable resin composition and electronic component-use sealant | |
JPWO2006077862A1 (en) | Epoxy resin composition and optical material using the same | |
KR102127775B1 (en) | Multifunctional acid anhydride, thermosetting resin composition, prepreg and cured article | |
WO2007010784A1 (en) | Fluoroadamantane derivative, resin composition containing the same, and optical electron member using the resin composition | |
TWI734042B (en) | Epoxy oxetane compound, its synthesis method and utilization of the compound | |
WO2020175338A1 (en) | Polyorganosilsesquioxane and hard coat layer-forming composition | |
JP6399650B2 (en) | Alicyclic polyfunctional acid anhydride and thermosetting resin composition | |
JP6465706B2 (en) | Polyfunctional acid anhydride, thermosetting resin composition using the same, and cured product thereof | |
WO2020080292A1 (en) | Curable resin composition, cured product, and sheet-form molded article | |
CN102333768A (en) | Diolefin compound, epoxy resin and composition thereof | |
JPWO2018034175A1 (en) | Acid anhydride, thermosetting resin composition using the same, cured product thereof and method for producing acid anhydride | |
CN105085870A (en) | Sealing material and prepreg | |
KR20080013902A (en) | Epoxy resin, method for producing same and use thereof | |
JP6890452B2 (en) | Transparent flame retardant sheet | |
JP6608735B2 (en) | Sealing material | |
JP2017193706A (en) | Particle-containing thermosetting resin composition | |
JP2006036900A (en) | Resin composition for protective coat and colorless and transparent protective film | |
JP2014208798A (en) | Curable resin composition and cured product including glass fiber | |
KR20130093473A (en) | Diolefin compound, epoxy resin, curable resin composition, and cured article |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant |