KR20150041748A - Circuit connecting material, connection structure of circuit member, and method for manufacturing connection structure of circuit member - Google Patents

Abstract

The purpose of the present invention is to provide a circuit connection material which offers sufficiently low connection resistance and good connection reliability even in low-pressure connection. The present invention provides: a circuit connecting material for bonding a first terminal and a second terminal to connect electrically, wherein a first circuit material with the first terminal formed on a first board and a second circuit material with the second terminal formed on a second board are used; at least one of the first or second circuit material represents IC chip, and the circuit connecting material contains (a) thermoplastic resin, (b) radical polymerized compound, (c) radical polymerization initiator, (d) and inorganic substance filler which is scale-shaped.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a circuit connecting material, a circuit member connecting structure, and a circuit member connecting structure,

The present invention relates to a circuit connecting material, a circuit member connecting structure, and a circuit member connecting structure.

BACKGROUND ART [0002] Various adhesive materials have been used to fix electronic components and perform circuit connection in the fields of semiconductors and liquid crystal displays.

For example, the connection of the liquid crystal display and the tape carrier package (TCP), the connection of the flexible printed circuit (FPC) and the TCP, and the connection of the FPC and the printed wiring board are more securely performed An anisotropic conductive adhesive in which conductive particles are dispersed in an adhesive is used (see, for example, Patent Documents 1 to 4). Also, when a semiconductor silicon chip is mounted on a substrate, a so-called chip-on-glass (COG) mounting in which a semiconductor silicon chip is directly mounted on a substrate is performed instead of a conventional wire bond. An anisotropic conductive adhesive has been applied.

As an example of such an anisotropic conductive adhesive, Patent Document 5 discloses a resin composition comprising a radical polymerizable resin (A), an organic peroxide (B), a thermoplastic elastomer (C), a predetermined phosphate ester (D), a predetermined epoxy silane coupling agent (E) An anisotropic conductive adhesive characterized by using urethane acrylate as a radical polymerizable resin in an anisotropic conductive adhesive containing conductive particles in an adhesive resin composition containing an anisotropic conductive adhesive. Further, for example, Patent Document 6 discloses a conductive anisotropic adhesive comprising an insulating adhesive, conductive particles, and a silane coupling agent, which conducts in the thickness direction and does not conduct in the surface direction.

Japanese Patent Application Laid-Open No. 59-120436 Japanese Patent Laid-Open Publication No. 60-191228 Japanese Patent Laid-Open No. 1-251787 Japanese Patent Application Laid-Open No. 7-90237 Japanese Patent No. 3503740 Japanese Patent Laid-Open Publication No. 62-62874 Japanese Patent Application Laid-Open No. 2000-40418

Recently, in the field of precision electronic devices, the circuit is being made flexible, and a semiconductor silicon chip is mounted on a plastic substrate such as polyimide (PI), polyethylene terephthalate (PET) or the like with a circuit member Chip-on-Plastic (COP) packaging for mounting directly on a flexible circuit board or the like has started to be implemented. However, in the circuit connecting material and the connecting conditions used in the conventional COG mounting, there are problems such as short circuit on the flexible circuit board, deformation of the plastic substrate upon thermocompression bonding, and lack of adhesion to the plastic substrate. In order to solve these problems, a connection at a low temperature (for example, 100 to 160 占 폚), a low pressure (for example, 10 to 30 MPa per bump area on a chip), a short time (for example, within 10 seconds) There is a demand for a circuit connecting material capable of curing at low temperature and low speed. In addition, in either COP packaging or COG packaging, high precision circuits are required, and the area per one connection terminal on the IC chip is reduced. That is, since the pressure applied to one connecting terminal at the time of connection is increased, pressure is locally applied to the substrate. Therefore, particularly in the case of COP packaging, the low-pressure packaging technique becomes particularly important from the viewpoint of reducing the damage to the plastic substrate.

Conventional adhesives for circuit connection using an epoxy resin system are required to use a latent curing agent having high activity for achieving high adhesive strength and for low temperature curing, and it has been difficult to achieve compatibility with storage stability. Further, in order to achieve connection at a low pressure, it is essential that the resin composition has sufficient fluidity. However, in the case of a circuit-connecting adhesive using a conventional epoxy resin system, fluidity is insufficient.

In the case of using the radical polymerization of an unsaturated compound as an adhesive material for COP mounting, for example, as in Patent Documents 5 and 6, low-temperature fast curing becomes possible, and the fluidity of the resin composition is improved by the conventional epoxy resin system . However, the flowability of the resin composition is still insufficient, and connection at a low pressure (for example, 10 to 30 MPa per bump area on the chip) is very difficult.

Further, for example, a connecting material containing an inorganic filler such as Patent Document 7 has an effect of improving the connection reliability by reducing the internal stress at the time of connection, but the fluidity of the connecting material is lowered by the inorganic filler Therefore, connection at a low pressure (for example, 10 to 30 MPa per bump area on the chip) is very difficult.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems of the prior art and provides a circuit connecting material capable of achieving both a sufficiently low connection resistance and a good connection reliability even in connection at low pressure . Another object of the present invention is to provide a circuit member connection structure using the circuit connecting material and a manufacturing method thereof.

The inventors of the present invention have found that a circuit connecting material containing an inorganic filler having a specific shape electrically connects a connection terminal of a circuit member to a connection terminal of an IC chip, and has completed the present invention.

According to the present invention, there is provided a semiconductor device comprising: a first circuit member having a first connection terminal formed on a first substrate; and a second circuit member having a second connection terminal formed on the second substrate, Wherein at least one of the first circuit member and the second circuit member is an IC chip, and (a) a thermoplastic resin, (b) a radical polymerizing compound, and (c) a radical polymerization initiator And (d) an inorganic filler, and (d) the shape of the inorganic filler is scaly.

The circuit connecting material according to the present invention has a sufficiently low connection resistance when the circuit member and the IC chip are connected at a low pressure and shows a good connection resistance even after the acceleration test at, for example, 85 캜 and 85% RH , And the connection reliability is excellent. The circuit connecting material according to the present invention can be suitably used both in the case where the substrate of one circuit member is plastic or in the case of glass, but it exhibits particularly excellent effects in the case of a plastic requiring low-temperature low-pressure fast curing.

Since the circuit connecting material contains (a) a thermoplastic resin, (b) a radically polymerizable compound, and (c) a radical polymerization initiator, even when connecting at a low temperature, the curing proceeds sufficiently, , It is possible to maintain a good connection resistance even after the acceleration test at 85% RH.

In addition, since the circuit connecting material (d) contains an inorganic filler and the shape of the inorganic filler is flaky, even when connecting at a low pressure, the circuit connecting material has sufficient fluidity and promotes resin exclusion between the circuit member and the IC chip , The connection resistance becomes sufficiently low. Further, since the elasticity of the circuit connecting material after the curing is increased by containing the inorganic filler, the adhesive force between the circuit member and the IC chip is maintained even at the acceleration test at 85 DEG C and 85% RH, for example, Can be obtained.

The inorganic filler (d) is not particularly limited as long as it is flaky in shape, but it preferably contains at least one of alumina and boron nitride from the viewpoint of dispersibility in the circuit connecting material. By using these as inorganic fillers, the resin exclusion between the connection terminal of the circuit member at the time of connection and the connection terminal of the IC chip can be promoted, and stable connection reliability can be obtained.

The amount of the inorganic filler (d) is preferably 1 to 20% by mass with respect to the entire circuit connecting material. With this amount, resin exclusion between the connection terminal of the circuit member at the time of connection and the connection terminal of the IC chip can be promoted, and stable connection reliability can be obtained.

The circuit connecting material according to the present invention preferably comprises (a) an acrylic resin having a weight average molecular weight of 1,000 to 5,000. By including such an acrylic resin, the fluidity of the circuit connecting material is further improved, the resin exclusion between the connection terminal of the circuit member at the time of connection and the connection terminal of the IC chip can be further promoted, and stable connection reliability can be maintained do.

The circuit connecting material according to the present invention may further contain an aluminum complex (e) represented by the following formula (1).

In formula (1), L ¹ , L ² and L ³ each independently represent a conjugated anion of an alkoxy anion, a conjugated anion of β-diketone or a β-keto ester, and L ¹ , L ² and L ³ Quot; may be the same or different "

By containing the aluminum complex, a sufficient adhesive strength can be obtained.

The circuit connecting material according to the present invention may further contain (f) a silane coupling agent.

The silane coupling agent preferably contains at least one alkoxysilyl group and a radically polymerizable double bond in the molecule. As a result, the adhesive force is further improved.

The circuit connecting material may further include (g) conductive particles. By including the conductive particles, it is possible to increase the connection reliability of the electrodes (between the connection terminals and the like) to be connected, and reduce the connection resistance.

The present invention relates to a resin composition comprising (a) a thermoplastic resin, (b) a radically polymerizable compound, (c) a radical polymerization initiator, (d) an inorganic filler, (e) an aluminum complex, (B) a radical polymerizing compound, (c) a radical polymerization initiator, (d) an inorganic filler, (e) an aluminum complex formed on one side of the conductive adhesive layer, And (f) a silane coupling agent, and (g) an insulating adhesive layer containing no conductive particles.

Use of a circuit connecting material having such a conductive adhesive layer and an insulating adhesive layer facilitates the handling, so that the connecting operation can be performed more easily.

The circuit connecting material may be formed of gold plating, indium tin oxide (ITO), SiN _x (silicon nitride), SiO ₂ (silicon nitride), or the like as a connection terminal on a plastic substrate formed of a thermoplastic resin such as polyethylene terephthalate, polycarbonate, (Silicon dioxide) and the like are electrically connected to the IC chip. Therefore, it is suitably used for chip-on-plastic mounting.

The present invention also provides a semiconductor device comprising: a first circuit member having a first connection terminal formed on a first substrate; a second circuit member having a second connection terminal formed on the second substrate; and a second circuit member provided between the first and second circuit members, And a circuit connecting member for connecting the first circuit member and the second circuit member with the first connection terminal and the second connection terminal opposed to each other, wherein the first substrate is a plastic substrate, the second circuit member is an IC chip, Wherein the circuit connecting member includes a cured product of the circuit connecting material, and the first connecting terminal and the second connecting terminal are electrically connected to each other.

According to the circuit member connection structure of the present invention, since the circuit connection material is used, the first circuit member and the second circuit member are bonded with high adhesive force, and the connection resistance between the circuit members is kept low. As a result, the connection structure of the circuit member according to the present invention is excellent in connection reliability.

In the present invention, the circuit connecting material is disposed between a first circuit member having a first connecting terminal formed on a substrate and a second circuit member having a second connecting terminal formed on the second substrate, and the first circuit member and the second circuit member The circuit member is heated and pressed to harden the circuit connecting material to connect the first circuit member and the second circuit member and to electrically connect the first connection terminal and the second connection terminal. ≪ / RTI >

According to this method of manufacturing a circuit member connection structure, since the circuit connecting material is used, when the circuit member is made of a plastic substrate on one side, the connection resistance between the circuit members is sufficiently low , And a connection structure of a circuit member adhered with sufficient adhesive force can be obtained.

INDUSTRIAL APPLICABILITY According to the circuit connecting material of the present invention, when used for connection between circuit members, particularly when one circuit member is used for connecting a circuit member composed of a plastic substrate, Reliability can be achieved at the same time.

Further, the circuit connecting material of the present invention is suitable for bonding a circuit member made of a plastic substrate to an IC chip such as a semiconductor element or a liquid crystal display element, and is excellent in connection resistance and connection reliability. Particularly, according to the method for manufacturing a connection structure of a circuit member using the circuit connecting material, adverse effects on the circuit member can be sufficiently suppressed since low-temperature low-speed speed curing becomes possible.

1 is a schematic cross-sectional view showing an embodiment of a circuit connecting material.
2 is a schematic cross-sectional view showing an embodiment of a connection structure of a circuit member.
3 is a schematic cross-sectional view showing an embodiment of a connection structure of a circuit member.
4 (a) to 4 (c) are a series of process drawings for manufacturing the connection structure of the circuit member of Fig.
5 (a) to 5 (c) are a series of process drawings for manufacturing the connection structure of the circuit member of Fig.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In the drawings, the same or equivalent elements are denoted by the same reference numerals, and redundant description is omitted. In the present specification, "(meth) acrylic acid" means acrylic acid and methacrylic acid corresponding thereto, and the same applies to other similar expressions such as (meth) acrylate.

In the present specification, the weight average molecular weight (Mw) means a value measured using a calibration curve of standard polystyrene rather than a gel permeation chromatograph (GPC) according to the following conditions.

A-160-S + GL-A150 manufactured by Hitachi Kasei Kabushiki Kaisha Sample concentration: 120 mg / m < 2 > 3 mL Solvent: tetrahydrofuran Injection amount: 60 μL Pressure: 30 kgf / cm 2 Flow rate: 1.00 mL / min

In the present specification, the glass transition temperature (Tg) means a value measured by differential scanning calorimetry (DSC) according to the following conditions.

(Measurement conditions) Apparatus: DSC7 made by Perkin Elmer Sample weight: 0.01 g

Measuring method: In a nitrogen atmosphere (flow rate: 50 ml / min) Temperature range: -80 to 200 ° C Heating rate: 10 ° C / min Determination method: The straight line around the terminal point of the obtained endothermic curve is extended, And the endothermic curve intersect with each other is referred to as a glass transition temperature.

In the present specification, the average plane width means a value measured by a scanning electron microscope (SEM) according to the following conditions.

Measuring method: 200 randomly oriented particles oriented in the plane direction were randomly extracted, and the long diameter portion of the particles was measured. The average value of the particles was calculated to obtain an average Plane width.

(C) a radical polymerization initiator; and (d) an inorganic filler, wherein (d) the shape of the inorganic filler It is stipulated that this is a sculpture.

(Thermoplastic resin)

(a) The thermoplastic resin is in a liquid state having a high viscosity by heating and is deformed freely by an external force. When the thermoplastic resin is cooled and the external force is removed, the thermoplastic resin becomes hardened while maintaining its shape. (High molecular weight). The thermoplastic resin (a) may also be a resin (polymer) having a reactive functional group having the above-mentioned properties.

In the circuit connecting material according to the present embodiment, it is preferable to include an acrylic resin having a specific weight average molecular weight as one component of the thermoplastic resin. By including an acrylic resin having a weight average molecular weight of 1000 to 5000 as one component of the thermoplastic resin, the circuit connecting material according to the present embodiment can have higher fluidity and connection reliability.

The weight average molecular weight of the acrylic resin is preferably from 1,000 to 5,000 from the viewpoint of both fluidity and connection reliability. However, from the viewpoint of enhancing the film formability of the circuit connecting material, 1200 to 4000 is more preferable, 3000 is more preferable.

The glass transition temperature (Tg) of the acrylic resin is preferably less than 70 占 폚, more preferably less than 30 占 폚, and even more preferably less than 0 占 폚, from the viewpoint of sufficiently improving the fluidity of the circuit connecting material. The lower limit of the glass transition temperature (Tg) of the acrylic resin is not particularly limited, but may be -80 캜 or higher, for example.

The acrylic resin is preferably a " no-condensation type " having no polar or reactive functional groups such as a hydroxyl group, a carboxyl group and a glycidyl group in the side chain. By including the acrylic resin of the " no-compatibility type ", the interaction with other components is suppressed, and as a result, the fluidity of the circuit connecting material can be further improved.

The content of the acrylic resin in the circuit connecting material is preferably 1% by mass or more and 15% by mass or less based on the total mass of the thermoplastic resin and the radical polymerizable compound from the viewpoint of both fluidity and connection reliability, More preferably not less than 12% by mass, and further preferably not less than 4% by mass and not more than 10% by mass.

The acrylic resin according to the present embodiment may be a commercially available product having the above properties, or may be a synthetic product obtained by using a known synthesis method such as radical polymerization.

The acrylic resin according to the present embodiment is obtained by radical polymerization using any one or more of, for example, acrylic monomers and oligomers having crosslinkability, other acrylic monomers, and monomers copolymerizable with acrylic monomers, and a radical polymerization initiator .

Examples of the acrylic monomers and oligomers having crosslinking properties include polytetramethylene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, 1,9-nonanediol di (meth) (Meth) acrylate derivatives such as dimethyloltricyclodecane diacrylate and 2-hydroxy-1-acryloxy-3-methacryloxypropane di (meth) acrylate, ethylene glycol di (meth) Polypropylene glycol di (meth) acrylate such as polyethylene glycol di (meth) acrylate and propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, 1,3-butylene glycol di Bis [4- (methacryloxypolyethoxy) phenyl] propane di (meth) acrylate such as 2,2-bis [4- (methacryloethoxy) (Meth) acrylate, 2,2-hydrogenated bis [4- (acryl (Meth) acrylate, and 2,2-bis [4- (acryloxyethoxypolypropoxy) phenyl] propane di (meth) acrylate. But it is preferable that it does not have a polar or reactive functional group such as a hydroxyl group, a carboxyl group and a glycidyl group in the side chain.

Examples of other acrylic monomers include methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, stearyl (Meth) acrylate derivatives such as trifluoroethyl (meth) acrylate, pentafluoropropyl (meth) acrylate and cyclohexyl (meth) acrylate, trimethylolpropane tri (meth) acrylate, (Meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, pentaerythritol tetra (Meth) acrylate, dipentaerythritol hexa (meth) acrylate, and the like. All of them can be suitably used. However, It is preferable that it does not have a polar or reactive functional group such as a hydroxyl group, a carboxyl group and a glycidyl group.

Examples of the monomer copolymerizable with the acrylic monomer include styrene derivatives such as styrene,? -Methylstyrene, p-methylstyrene, p-chlorostyrene and chloromethylstyrene, vinyl esters such as vinyl chloride, vinyl acetate and vinyl propionate, Unsaturated nitriles such as acrylonitrile and the like, and conjugated dienes such as butadiene and isoprene. All of them can be suitably used, and polar or reactive functional groups such as a hydroxyl group, a carboxyl group and a glycidyl group, .

(Thermoplastic resin other than acrylic resin)

As the circuit connecting material according to the present embodiment, a thermoplastic resin other than acrylic resin can also be suitably used. Examples of the thermoplastic resin other than the acrylic resin include phenoxy resin, polyurethane resin, polyester urethane resin, butyral resin (for example, polyvinyl butyral resin), polyimide resin, polyamide resin, And a copolymer (vinyl acetate copolymer, for example, ethylene-vinyl acetate copolymer) having a structural unit. These may be used singly or in combination of two or more. The thermoplastic resin may contain a siloxane bond or a fluorine substituent. These are preferably in a state in which the resins to be mixed are completely miscible with each other or in a state in which they are clouded by micro-phase separation.

The glass transition temperature (Tg) of the thermoplastic resin other than the acrylic resin is preferably from -30 占 폚 to 190 占 폚, and more preferably from -25 占 폚 to 170 占 폚, from the viewpoint of both the fluidity of the circuit connecting material and the reliability of connection More preferably from -20 占 폚 to 150 占 폚.

When the circuit connecting material is molded into a film and used, the film forming property can be easily obtained as the Mw of the thermoplastic resin is larger, and the melt viscosity affecting the fluidity as a circuit connecting material on the film can be set broadly have.

The Mw of the thermoplastic resin other than the acrylic resin according to the present embodiment is preferably 5000 or more, more preferably 7000 or more, and further preferably 10000 or more. If the Mw of the thermoplastic resin is 5000 or more, good film formability tends to be obtained.

The Mw of the thermoplastic resin other than the acrylic resin according to the present embodiment is preferably 150,000 or less, more preferably 100,000 or less, and even more preferably 80,000 or less. If the Mw of the thermoplastic resin is 150000 or less, good compatibility with other components tends to be obtained.

The amount of the thermoplastic resin other than the acrylic resin according to the present embodiment in the circuit connecting material is preferably 5% by mass or more, more preferably 15% by mass or more based on the total mass of the thermoplastic resin and the radical polymerizable compound More preferable. When the blending amount of the thermoplastic resin is 5 mass% or more, good film formability tends to be obtained when the circuit connecting material is molded into a film. The blending amount of the thermoplastic resin other than the acrylic resin is preferably 80 mass% or less, more preferably 70 mass% or less, based on the total mass of the components other than the conductive particles in the circuit connecting material. When the blending amount of the thermoplastic resin is 80 mass% or less, good fluidity tends to be obtained.

(Radical Polymerizable Compound)

(b) Radical polymerizable compound is a substance having a functional group which is polymerized by a radical. Examples of the radical polymerizable compound include (meth) acrylate compounds, maleimide compounds, styrene derivatives and the like. These may be used singly or in combination of two or more. The radical polymerizable compound may be used in any state of monomers or oligomers, or may be a mixture of monomers and oligomers.

Examples of the (meth) acrylate compound include methyl (meth) acrylate, ethyl (meth) acrylate, isopropyl (meth) acrylate, isobutyl (meth) acrylate, ethylene glycol di Diethylene glycol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, tetramethylene glycol di (meth) acrylate, 2-hydroxy-1,3-diacryloxypropane, 2,2- (Meth) acrylate tricyclodecanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyl (meth) acrylate, (Acryloxyethyl) isocyanurate, urethane (meth) acrylate, and isocyanuric acid ethylene oxide-modified diacrylate. These may be used singly or in combination of two or more.

The maleimide compound is, for example, a compound having at least one maleimide group. Examples of the maleimide compounds include phenylmaleimide, 1-methyl-2,4-bismaleimidebenzene, N, N'-m-phenylenebismaleimide, N, N'- , N, N'-4,4-biphenylene bismaleimide, N, N'-4,4- (3,3-dimethylbiphenylene) bismaleimide, N, N'- 3,3-dimethyldiphenylmethane) bismaleimide, N, N'-4,4- (3,3-diethyldiphenylmethane) bismaleimide, N, N'- Maleimide, N, N'-4,4-diphenylpropane bismaleimide, N, N'-4,4-diphenyl ether bismaleimide, N, N'- Propane, 2,2-bis (3-s-butyl-3,4- (4-maleimidophenoxy) phenyl) propane, , 4-cyclohexylidene-bis (1- (4-maleimidophenoxy) phenoxy) -2-cyclohexylbenzene , 2,2-bis (4- (4-maleimidophenoxy) phenyl) hexafluoropropane, and the like. These may be used singly or in combination of two or more.

The styrene derivative is a compound in which a hydrogen atom in the? -Position of styrene or an aromatic ring is substituted with a substituent.

The blending amount of the radically polymerizable compound is preferably 10 to 95% by mass, more preferably 30 to 80% by mass, and more preferably 40 to 60% by mass, based on the total mass of the thermoplastic resin and the radical polymerizable compound. Is more preferable. By setting the blending amount, the heat resistance after curing is sufficient, and a circuit connecting material having good film formability tends to be easily obtained.

(Radical polymerization initiator)

(c) Radical polymerization initiators include, for example, peroxide compounds and azo compounds which are decomposed by heating to generate free radicals. From the viewpoints of reactivity and storage stability, it is preferable to use organic peroxides or azo compounds having a half-life temperature of 10 hours and a half-life temperature of 180 占 폚 or less of 40 占 폚 or more and 1 minute and 180 占 폚 or less, More preferably an organic peroxide or an azo compound having a 10-hour half-life temperature of 60 ° C or higher and a 1-minute half-life temperature of 170 ° C or lower.

When the connection time is 10 seconds or less, the blending amount of the radical polymerization initiator is preferably 0.1 to 30 parts by mass based on 100 parts by mass of the total mass of the thermoplastic resin and the radical polymerizable compound in order to obtain a sufficient reaction rate, And more preferably 0.5 to 20 parts by mass. When the blending amount of the radical polymerization initiator is 0.1 parts by mass or more, a circuit connecting material having a good bonding strength and a low connecting resistance is easily obtained while maintaining a sufficient reaction rate. On the other hand, by reducing the amount of the radical polymerization initiator to 30 parts by mass or less, it is easy to suppress the lowering of the fluidity of the circuit connecting material, the increase of the connection resistance, and the decrease of the storage stability.

Specific examples of the radical polymerization initiator include diacyl peroxide, peroxydicarbonate, peroxy ester, peroxyketal, dialkyl peroxide, hydroperoxide, and silyl peroxide. Further, in order to suppress the corrosion of the connection terminals of the circuit member, it is preferable that the chlorine ion and the organic acid contained in the radical polymerization initiator be 5000 ppm or less. Of these, peroxyesters, peroxyketals, dialkyl peroxides, hydroperoxides or silyl peroxides are preferred, and peroxyesters or peroxyketals with high reactivity are more preferred. These may be used singly or in combination of two or more.

Examples of the diacyl peroxide include isobutyryl peroxide, 2,4-dichlorobenzoyl peroxide, 3,5,5-trimethylhexanoyl peroxide, octanoyl peroxide, lauroyl peroxide, Peroxides, succinic peroxides, benzoyl peroxytoluenes, benzoyl peroxides, and the like.

Examples of the peroxydicarbonate include di-n-propyl peroxydicarbonate, diisopropyl peroxydicarbonate, bis (4-t-butylcyclohexyl) peroxydicarbonate, di- Di (3-methyl-3-methoxybutylperoxy) dicarbonate, di (2-ethylhexylperoxy) dicarbonate, dimethoxybutyl peroxydicarbonate and di .

Examples of peroxy esters include cumyl peroxyneodecanoate, 1,1,3,3-tetramethyl butyl peroxyneodecanoate, 1-cyclohexyl-1-methyl ethyl peroxyneodecanoate, t-hexyl peroxyneodecanoate, t-butyl peroxypivalate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, 2,5-dimethyl- (2-ethylhexanoylperoxy) hexane, 1-cyclohexyl-1-methylethylperoxy-2-ethylhexanoate, t-hexylperoxy-2-ethylhexanoate, t- T-butylperoxyisobutyrate, 1,1-bis (t-butylperoxy) cyclohexane, t-hexylperoxyisopropyl monocarbonate, t-butylperoxy-3,5 Butyl peroxylaurate, 2,5-dimethyl-2,5-di (m-toluoylperoxy) hexane, t-butylperoxyisopropyl monocarbonate, t -Butyl peroxy-2-ethylhexyl monocarbonate, t-hexyl peroxide When the like benzoate, t- butyl peroxy acetate.

Examples of peroxyketals include 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane, 1,1-bis (t-hexylperoxy) cyclohexane, Bis (t-butylperoxy) decane, 2,2-bis (t-butylperoxy) decane and the like can be used. .

Examples of the dialkyl peroxide include?,? "-Bis (t-butylperoxy) diisopropylbenzene, dicumyl peroxide, 2,5-dimethyl-2,5-di (t- Hexane, t-butylcumyl peroxide, and the like.

Examples of the hydroperoxide include diisopropylbenzene hydroperoxide, cumene hydroperoxide and the like.

Examples of the silyl peroxide include t-butyl trimethyl silyl peroxide, bis (t-butyl) dimethyl silyl peroxide, t-butyl trivinyl silyl peroxide, bis (t- t-butyl) vinylsilyl peroxide, t-butyltriallylsilyl peroxide, bis (t-butyl) diallylsilyl peroxide and tris (t-butyl) allylsilyl peroxide.

As the radical polymerization initiator which generates free radicals by these heating, a decomposition accelerator, an inhibitor and the like may be further mixed and used. In addition, it is preferable to coat these radical polymerization initiators with a polyurethane or polyester-based polymer material or the like and microencapsulate them because the pot life is prolonged.

(Inorganic filler)

The circuit connecting material according to the present embodiment contains (d) an inorganic filler, and the shape of the inorganic filler is defined as scaly. The flakes mean flakes or irregular shapes of flakes like scales, and those having a shape in a planar direction and a thickness in a direction perpendicular to the plane direction. In addition, the scales are not strictly limited to scales of fish, but include scales in the form of plates, circles, ellipses and polygons, as well as scales in the narrow sense.

The reason why the connection resistance between the connection terminals is lowered by using the scaly inorganic filler is not necessarily clear, but the inventors of the present invention have found that the circuit connecting material according to the present embodiment is interposed between the first circuit member and the second circuit member The pressure is applied selectively in the planar direction of the inorganic filler when pressure is applied from either one direction or both directions of the first circuit member and the second circuit member and even if the applied pressure is low, It is thought that the resin exclusion of the circuit connecting material interposed between the two connection terminals is promoted.

Further, it is considered that the reason why the connection reliability is improved is because the elastic modulus of the cured product of the circuit connecting material is improved. By improving the elastic modulus of the cured product of the circuit connecting material, it is possible to maintain a low connection resistance even after the 85 rpm humidity resistance test, for example.

In the adherend of the circuit connecting material according to the present embodiment, at least one of the first circuit member and the second circuit member is an IC chip such as a semiconductor element or a liquid crystal display element. In the case where the IC chip is mounted on the circuit member, the circuit connecting material according to the present embodiment, which enables connection at a low pressure, is particularly useful because a pressure is locally applied to the circuit terminal portion of the IC chip.

The average plane width of the inorganic filler is preferably 0.5 to 20 占 퐉, more preferably 1 to 15 占 퐉, and even more preferably 1 to 10 占 퐉. The average thickness of the inorganic filler is preferably 0.001 to 1 占 퐉, more preferably 0.002 to 0.8 占 퐉, and still more preferably 0.005 to 0.5 占 퐉. When the average plane width is 0.5 占 퐉 or more, resin exudation between the connection terminal of the IC chip and the connection terminal of the circuit member during the circuit connection is promoted, which is preferable. In addition, when the average plane width is 20 탆 or less, the dispersibility of the inorganic filler in the circuit connecting material becomes favorable.

The inorganic filler is not particularly limited as long as it has the above-described scaly particle shape, but it preferably contains at least one of alumina and boron nitride. By using these, the dispersibility of the inorganic filler in the circuit connecting material can be improved, and the resin exclusion between the connection terminal of the circuit member and the connection terminal of the IC chip at the time of connection can be promoted.

Examples of the type of boron nitride include amorphous boron nitride (a-BN), hexagonal boron nitride (h-BN) and cubic boron nitride (c-BN), but from the viewpoint of high lubricity and heat resistance, It is preferable to use boron (h-BN).

When the circuit connecting material according to the present embodiment contains conductive particles (g) to be described later, it is preferable that the inorganic filler is present in a state that it is not mixed (or integrated with) the conductive particles.

The blending amount of the inorganic filler is preferably from 1 to 20 mass%, more preferably from 1.2 to 15 mass%, and particularly preferably from 1.5 to 10 mass% with respect to the total mass of the circuit connecting material. In the case of 1 to 20% by mass, the resin exclusion between the connection terminal of the circuit member and the connection terminal of the IC chip at the time of connection is promoted and the elastic modulus of the cured product of the circuit connecting material according to the present embodiment is improved. Reliability can be maintained.

The circuit connecting material according to the present embodiment may further contain (e) an aluminum complex.

The aluminum complex is a molecule in which a ligand containing an organic group is bonded to aluminum. The ligand may be a single-seated ligand having only one coordination site or may be a multiple ligand having two or more coordination sites. The bond between aluminum and the ligand may be either a hydrogen bond or a coordination bond. Examples of the organic group include groups composed of a carbon atom, a hydrogen atom and an oxygen atom, and they may further contain a sulfur atom, a nitrogen atom, and the like.

The aluminum complex is preferably represented by the following chemical formula (2).

Formula (2): L ^1, L ² and L ³ are, each independently, an alkoxy anion, a β- diketone represents a conjugate anion of a conjugate anion or β- keto ester, L ^1, L ² and L ³ is , May be the same or different]

Specific examples of the aluminum complex represented by the formula (2) include aluminum tris (acetylacetonate), aluminum tris (ethylacetoacetate), aluminum monoacetylacetonate bis (ethylacetoacetate), aluminum monoacetylacetonate bis (Oleyl acetoacetate), diisopropoxy aluminum ethylacetoacetate, diisopropoxy aluminum alkyl acetoacetate, and the like.

These may be used singly or in combination of two or more.

The compounding amount of the aluminum complex in the circuit connecting material is not particularly limited. For example, it may be 0.1 to 20 parts by mass when the total mass of the thermoplastic resin and the radical polymerizing compound is 100 parts by mass. From the viewpoint of physical properties of the cured product, the amount is preferably 0.5 to 15 parts by mass, more preferably 1 to 10 parts by mass.

The circuit connecting material according to the present embodiment may further contain (f) a silane coupling agent.

The silane coupling agent is a compound having an alkoxysilyl group (Si-OR) in its molecule. The silane coupling agent is not particularly limited, and for example, compounds represented by the following formulas (6) to (8) having at least one alkoxysilyl group (Si-OR) in the molecule can be used.

Wherein R ²¹ represents an alkylene group having 1 to 6 carbon atoms and R ²² and R ²³ each independently represent a linear or branched alkyl group having 1 to 12 carbon atoms or a cycloalkyl group , A phenyl group or a substituted phenyl group, and X represents a ureide group, a 3,4-epoxycyclohexyl group, a glycidyloxy group, an isocyanate group, a vinyl group, a methacryloxy group, an acryloxy group or a mercapto group,

Also, as X in the formulas (6) to (8), it is preferable to include a group having a radically polymerizable double bond such as a (meth) acryloxy group. As a result, the adhesive force is further improved.

Specific examples of the silane coupling agent include 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyl Triethoxysilane, 3-acryloxypropyltrimethoxysilane, and the like.

These may be used singly or in combination of two or more.

The content of the silane coupling agent in the circuit connecting material is not particularly limited, but may be 0.1 to 30 parts by mass, for example, when the total mass of the thermoplastic resin and the radical polymerizable compound is 100 parts by mass. From the viewpoint of adhesion, the content is preferably 1 to 20 parts by mass, more preferably 2 to 10 parts by mass.

The circuit connecting material according to the present embodiment may further include (g) conductive particles.

Examples of the conductive particles include metal particles such as Au, Ag, Ni, Cu, and solder, and conductive materials such as carbon. In order to obtain sufficient storage stability, the surface layer is preferably a precious metal such as Au or Ag, and more preferably Au. The surface of transition metals such as Ni and Cu may be coated with a precious metal such as Au or Ag. It is also possible to use a coating layer formed of the conductive material on the surface of non-conductive glass, ceramic, plastic or the like. In this case, the coating layer is preferably formed of precious metal.

When the non-conductive plastic or the like coated with a conductive material or the heat-fused metal particles is used as the conductive particles, the conductive particles are deformed by heating and pressing, so that the area of contact with the electrodes at the time of connection increases, It tends to absorb the thickness variation of the electrode in the circuit member.

The thickness of the covering layer of the precious metal is preferably 10 nm or more from the viewpoint of obtaining a good resistance. However, when a noble metal layer is formed on transition metals such as Ni and Cu, free radicals are generated due to oxidation-reduction action caused by deficiency of the noble metal layer and the like, and the storage stability tends to decrease. It is preferable that the thickness of the coating layer is 30 nm or more. The upper limit of the thickness of the coating layer is not particularly limited, but the effect obtained is saturated.

The average particle diameter of the conductive particles can be obtained by SEM observation. The average particle diameter of the conductive particles is preferably 1 to 18 mu m from the viewpoint of good dispersibility and conductivity. The blending amount of the conductive particles is preferably from 0.1 to 60 parts by weight per 100 parts by weight of the component other than the conductive particles in the circuit connecting material. Within this range, it is preferable to appropriately adjust the amount depending on the use. From the viewpoint of preventing the short circuit of the adjacent circuit due to the excessive presence of the conductive particles, the blending amount is more preferably 0.1 to 30 parts.

(Stabilizer)

In the circuit connecting material according to the present embodiment, a stabilizer may be added in order to further improve the control of the curing rate and the storage stability. Examples of such stabilizers include known quinone derivatives such as benzoquinone and hydroquinone; phenol derivatives such as 4-methoxyphenol and 4-t-butylcatechol; Aminoxyl derivatives such as 6,6-tetramethylpiperidine-1-oxyl and 4-hydroxy-2,2,6,6-tetramethylpiperidine-1-oxyl, tetramethylpiperidyl methacrylate And the like. The stabilizers may be used alone or in combination of two or more.

The blending amount of the stabilizer is preferably 0.005 mass% or more, more preferably 0.01 mass% or more, and still more preferably 0.02 mass% or more, based on the total mass of components other than the conductive particles in the circuit connecting material. When the blending amount is 0.005 mass% or more, the curing rate tends to be easily controlled and the storage stability tends to be improved. The blending amount of the stabilizer is preferably 10 mass% or less, more preferably 8 mass% or less, and most preferably 5 mass% or less, based on the total mass of components other than the conductive particles in the circuit connecting material. When the blending amount is 10 mass% or less, it tends to be compatible with other components.

(Other components)

The circuit connecting material according to the present embodiment may further contain a softening agent, an antioxidant, a flame retarding agent, a coloring matter, a thixotropic agent, a phenol resin, a melamine resin, an isocyanate and the like.

(One form of circuit connecting material)

The circuit connecting material according to the present embodiment can be molded into a film and used. 1 is a schematic cross-sectional view showing an embodiment of a circuit connecting material. The circuit connecting material (1) comprises a first circuit member having a first connecting terminal formed on a first substrate and a second circuit member having a second connecting terminal formed on the second substrate, wherein the first connecting terminal and the second connecting terminal , A circuit connecting material for bonding to be electrically connected.

The circuit connecting material according to the present embodiment may have a multi-layer structure (not shown) including two or more layers. For example, in the case of a two-layer film-like circuit-connecting material, a conductive adhesive layer containing conductive particles and an insulating insulating adhesive layer formed on one side of the conductive adhesive layer are provided, and both of the conductive adhesive layer and the insulating adhesive layer are thermoplastic A resin, a radical polymerizing compound, a radical polymerization initiator, an inorganic filler, an aluminum complex and a silane coupling agent. In the conductive adhesive layer, it is preferable that the inorganic filler exists in a state that it is not compounded (or integrated) with the conductive particles. The thermoplastic resin, the radical polymerizing compound, the radical polymerization initiator, the inorganic filler, the aluminum complex and the silane coupling agent contained in the conductive adhesive layer and the insulating adhesive layer may be the same or different from each other. The inorganic filler having a scaly shape defined in the present invention may be contained in at least one of the layers.

When the circuit connecting material according to the present embodiment is a film having a multilayer structure, for example, the multilayer film circuit connecting material can be manufactured by separately forming each layer and then joining the respective layers. For example, in the case of a two-layer film-like circuit connecting material composed of a conductive adhesive layer containing conductive particles and an insulating insulating adhesive layer formed on one side of the conductive adhesive layer, the composition of the conductive adhesive layer is dissolved in a solvent Is coated on a support (PET (polyethylene terephthalate) film or the like) using a coating apparatus, and hot-air drying is performed at a temperature at which the composition is not cured for a predetermined time, thereby forming a conductive adhesive layer. Similarly, an insulating adhesive layer can be produced. Next, a two-layer film-like circuit-connecting material can be manufactured by bonding the conductive adhesive layer and the insulating adhesive layer using, for example, a hot roll laminator. The thickness of the conductive adhesive layer may be, for example, 1 to 10 占 퐉, and the thickness of the insulating adhesive layer may be, for example, 5 to 40 占 퐉. The total thickness of the two- For example, 6 to 50 mu m.

(Circuit member connection structure)

2 is a schematic cross-sectional view showing an embodiment of a connection structure of a circuit member. 2, the connection structure of the circuit member of this embodiment includes a first circuit member 20 composed of a substrate 21 opposed to each other, and a second circuit member 30 composed of a substrate 31 And a circuit connecting member 10 for connecting the first circuit member 20 and the second circuit member 30 is provided between the first circuit member 20 and the second circuit member 30. [

The first circuit member 20 composed of the substrate 21 includes a substrate 21 (first substrate) and a connection terminal (first connection terminal) 22 formed on the main surface 21a of the substrate 21 Respectively. An insulating layer (not shown) may be formed on the main surface 21a of the substrate 21 as the case may be.

The first circuit member 20 is not particularly limited as long as an electrode requiring electrical connection is formed, for example. Specifically, the connection terminal may be a circuit member composed of a substrate on which electrodes are formed by ITO used in a liquid crystal display. This substrate is formed of a plastic such as polyimide (PI) resin, polyethylene terephthalate (PET) resin, polycarbonate (PC) resin, methacrylic resin, and cyclic olefin resin. In this embodiment, the metal or ITO (indium tinoxide) of gold, copper, aluminum or the like, a silicon nitride (SiN _X), silicon dioxide (SiO ₂₎ that at least a portion of the surface of a material containing an inorganic material such as forming , A circuit member having various surface states can be used.

On the other hand, the second circuit member 30 includes a substrate (second substrate) 31 and connection terminals (second connection terminals) 32 formed on the main surface 31a of the substrate 31. An insulating layer (not shown) may be formed on the main surface 31a of the substrate 31 as the case may be. The second circuit member 30 is an IC chip such as a semiconductor device or a liquid crystal display device.

The circuit connecting member (10) contains an insulating material (11) and conductive particles (7). The conductive particles 7 are arranged not only between the opposing connection terminals 22 and the connection terminals 32 but also between the main surface 21a and the main surface 31a. In the circuit member connection structure, the connection terminal 22 and the connection terminal 32 are electrically connected through the conductive particles 7. [

In the connection structure of this circuit member, as described above, the opposing connection terminals 22 and the connection terminals 32 are electrically connected through the conductive particles 7. [ As a result, the connection resistance between the connection terminal 22 and the connection terminal 32 is sufficiently reduced. Therefore, the current flow between the connection terminal 22 and the connection terminal 32 can be smoothly performed, and the function of the circuit can be sufficiently exhibited.

3 is a schematic cross-sectional view showing another embodiment of a connection structure of a circuit member. The circuit member connecting structure shown in Fig. 3 is the same as the circuit member connecting structure according to the above-described embodiment except that the circuit connecting member 10 does not contain the conductive particles 7. [ In the connection structure of the circuit member shown in Fig. 3, the connection terminal 22 and the connection terminal 32 are electrically connected without passing through the conductive particles.

The circuit connecting member 10 is composed of the first circuit member 20 constituted by the substrate 21 and the substrate 31 composed of the circuit board 31 in that the circuit connecting member 10 is constituted by the cured product of the circuit connecting material The adhesive strength of the circuit connecting member 10 to the two circuit members 30 is sufficiently high. Further, stable bonding strength can be obtained even under a high temperature and high humidity environment of, for example, 85 DEG C and 85RH%. Further, in the connection structure of the circuit member, the state in which the adhesive strength is sufficiently high continues for a long period of time. This makes it possible to sufficiently prevent a change in the distance between the connection terminal 22 and the connection terminal 32 over time so that the long term reliability of the electrical characteristics between the connection terminal 22 and the connection terminal 32 can be sufficiently increased.

The circuit connecting member 10 may also be constituted by a cured product of the circuit connecting material of the multilayer film structure described above. For example, a conductive adhesive layer containing conductive particles and an insulating insulating adhesive layer formed on one side of the conductive adhesive layer are provided, and both the conductive adhesive layer and the insulating adhesive layer are provided with a thermoplastic resin, a radical polymerizable compound, And may be constituted by a cured product of a circuit connecting material containing at least an initiator, an aluminum complex, and a silane coupling agent. In this case, the height of at least one of the first connection terminal 22 and the second connection terminal 32 is 3.0 m or less, and the conductive adhesive layer in the circuit connecting material 1 has a height of 3.0 m or less And is preferably disposed on the connection terminal side.

(Manufacturing Method of Connection Structure of Circuit Member)

Next, a manufacturing method of the above-described circuit member connection structure will be described. Fig. 4 and Fig. 5 are a series of process steps for manufacturing the connection structure of the circuit member.

First, the above-described first circuit member 20 and the circuit connecting material 40 are prepared (see FIG. 4 (a) and FIG. 5 (a)). The circuit connecting material 40 may contain only the component 5 other than the conductive particles and the conductive particles 7 and the component 5 other than the conductive particles.

The thickness of the circuit connecting material 40 is preferably 10 to 50 mu m. If the thickness of the circuit connecting material 40 is 10 탆 or more, the circuit connecting material is sufficiently filled between the connection terminal 22 and the connection terminal 32, which is preferable. On the other hand, if it is 50 탆 or less, it is preferable because the circuit connection material between the connection terminal 22 and the connection terminal 32 can be both excreted and charged, and conduction and connection reliability can be ensured.

Then, the circuit connecting material 40 is placed on the surface on which the connection terminals 22 of the first circuit member 20 are formed. When the circuit connecting material 40 is attached on a support (not shown), the side of the circuit connecting material 40 is directed toward the first circuit member 20, I put it. Since the circuit connecting material 40 is in a film form, the circuit connecting material 40 can be easily interposed between the first circuit member 20 and the second circuit member 30, The connection work of the first circuit member 20 and the second circuit member 30 can be easily performed.

The circuit connecting material 40 is pressed in the directions of arrows A and B in Figs. 4A and 5A to connect the circuit connecting material 40 to the first circuit member 20 (See Fig. 4 (b) and Fig. 5 (b)). At this time, it may be pressurized while heating. However, the heating temperature is set to be lower than the temperature at which the radical polymerization initiator in the circuit connecting material 40 generates radicals.

Subsequently, as shown in Figs. 4C and 5C, the second circuit member 30 is disposed such that the second connection terminal 32 faces the first circuit member 20 (That is, the first connection terminal 22 and the second connection terminal 32 are arranged to be opposed to each other). When the circuit connecting material 40 is attached on a support (not shown), the second circuit member 30 is placed on the circuit connecting material 40 after the supporting body is peeled off.

The circuit connecting material 40 is heated while being pressed through the first circuit member 20 and the second circuit member 30 in the directions of arrows A and B in Figs. 4C and 5C, do. The heating temperature at this time is a temperature at which the radical polymerization initiator can generate radicals. As a result, radicals are generated in the radical polymerization initiator and polymerization of the radical polymerizable compound is initiated. Thus, the circuit connecting material 40 is cured, and the main connection is performed to obtain a circuit member connection structure as shown in Figs. 2 and 3. Fig.

The heating temperature is, for example, 90 to 200 DEG C, the pressure is, for example, 5 to 80 MPa, and the connection time is, for example, 1 second to 10 minutes. These conditions may be appropriately selected by the circuit connecting material and the circuit member, and post-curing may be performed if necessary. For example, when a radical polymerizing compound and a radical polymerization initiator are used as in the present embodiment, the heating temperature is set to 100 to 160 ° C, the pressing pressure is set to 10 to 30 MPa, the connection time is set to 10 seconds or less , And may be cured at low temperature and low pressure.

The production of the connection structure of the circuit member can sufficiently reduce the connection resistance between the connection terminal 22 and the connection terminal 32 in the obtained connection structure of the circuit member.

By heating the circuit connecting material 40, the component 5 other than the conductive particles is hardened in a state where the distance between the connection terminal 22 and the connection terminal 32 is sufficiently small, And the first circuit member 20 and the second circuit member 30 are firmly connected to each other through the circuit connecting member 10. That is, in the resulting connection structure of the circuit member, the circuit connecting member 10 is formed by the cured product of the circuit connecting material, and the first circuit member 20 or the second circuit member 30 The bonding strength of the circuit connecting member 10 is sufficiently high, and the bonding strength is sufficiently high especially under high temperature and high humidity conditions. Further, in the connection structure of the circuit member, the state in which the adhesive strength is sufficiently high continues for a long period of time. Therefore, the resulting connection structure of the circuit member can sufficiently prevent a change in the distance between the connection terminal 22 and the connection terminal 32 with a lapse of time, Is excellent.

In the above embodiment, the circuit connecting material 40 includes a radical polymerization initiator that generates radicals at least by heating. Instead of this radical polymerization initiator, a radical polymerization initiator May be used. In this case, light irradiation may be performed instead of heating at the time of curing treatment of the circuit connecting material 40. In addition, a radical polymerization initiator that generates radicals by ultrasonic waves, electromagnetic waves or the like may be used as needed. In addition, an epoxy resin and a latent curing agent may be used as the curable component.

In place of the conductive particles 7, other conductive materials may be used. Examples of other conductive materials include carbon particles in the form of particles or staple fibers, and metal wire rods such as Au-plated Ni wires.

Hereinafter, the present invention will be described concretely with reference to examples, but the present invention is not limited thereto.

(Preparation of inorganic filler)

As the inorganic filler, flaky boron nitride particles (trade name: DENKABORON NITRIDE HGP, manufactured by Denki Kagaku Kogyo K.K.), scaly alumina particles (trade name: SERAF 02025, manufactured by Kasei Tatec Co., Ltd.), spherical silica particles (Trade name: Aerosil R805, manufactured by Nippon Aerosil Co., Ltd.).

(Synthesis Example 1: Synthesis of acrylic resin AR-1)

To a flask equipped with a stirrer, a thermometer, a condenser and a dropping funnel, 1 kg of isopropyl alcohol (hereinafter IPA) was charged and heated to 70 캜. Separately, 335 g of nonanediol diacrylate (Sigma-Aldrich), 210 g of n-butyl acrylate (manufactured by Sigma-Aldrich), 4 g of azobisisobutyronitrile (hereinafter AIBN, manufactured by Sigma-Aldrich) and 400 g of IPA And the mixture was continuously added dropwise from the dropping funnel over a period of 5 hours to carry out polymerization. After the dropwise addition, 4 g of AIBN was further added and aged at 80 DEG C for 4 hours.

After completion of the polymerization, volatile components such as unreacted monomers and solvents were removed from the reaction solution under reduced pressure to obtain liquid AR-1. The weight average molecular weight of AR-1 was 1600 and the glass transition temperature was -70 占 폚.

(Synthesis Example 2: Synthesis of acrylic resin AR-2)

To a flask equipped with a stirrer, a thermometer, a condenser and a dropping funnel, 1 kg of isopropyl alcohol (hereinafter IPA) was charged and heated to 70 캜. Separately, a mixed solution containing 420 g of dicyclopentenyloxyethyl methacrylate (manufactured by Sigma-Aldrich), 210 g of n-butyl acrylate (manufactured by Sigma-Aldrich), 4 g of AIBN and 400 g of IPA was prepared, The mixture was continuously added dropwise to the flask over 5 hours to carry out polymerization. After the dropwise addition, 4 g of AIBN was further added and aged at 80 DEG C for 4 hours.

After completion of the polymerization, volatile components such as unreacted monomers and solvents were removed from the reaction mixture under reduced pressure to obtain liquid AR-2. The weight average molecular weight of AR-2 was 1700 and the glass transition temperature was -51 ° C.

(Synthesis Example 3: Synthesis of acrylic resin AR-3)

To a flask equipped with a stirrer, a thermometer, a condenser and a dropping funnel, 1 kg of isopropyl alcohol (hereinafter IPA) was charged and heated to 70 캜. Separately, a mixed solution containing 800 g of n-butyl acrylate (manufactured by Sigma-Aldrich), 4 g of AIBN and 400 g of IPA was prepared and continuously added dropwise into the flask over 5 hours by the dropping funnel. After the dropwise addition, 4 g of AIBN was further added and aged at 80 DEG C for 4 hours.

After completion of the polymerization, volatile components such as unreacted monomers and solvents were removed from the reaction mixture under reduced pressure to obtain liquid AR-3. The weight average molecular weight of AR-3 was 1800 and the glass transition temperature was -70 占 폚.

(Synthesis Example 4: Synthesis of urethane acrylate UA-1)

To the reaction vessel equipped with a stirrer, a thermometer, a reflux condenser equipped with a calcium chloride drying tube, and a nitrogen gas introducing tube was added a polycaprolactone diol having a number average molecular weight of 2000 (aliphatic polyester diol, trade name: Fracel 220EB, 2000 parts by mass (1.00 mol) of dibutyltin dilaurate (manufactured by Sigma-Aldrich Co., Ltd.), 5.53 parts by mass were introduced. After sufficiently introducing nitrogen gas, the mixture was heated to 70 to 75 占 폚 and 688 parts (3.10 moles) of isophorone diisocyanate (aliphatic isocyanate, manufactured by Sigma-Aldrich) was uniformly added dropwise over 3 hours to react. After completion of the dropwise addition, the reaction was continued for about 10 hours. 238 parts by mass (2.05 mole) of 2-hydroxyethyl acrylate (manufactured by Sigma-Aldrich) and 0.53 part by mass of hydroquinone monomethyl ether (Sigma-Aldrich) were added and reacted again for 10 hours. And the reaction was terminated to obtain urethane acrylate (UA-1). The weight average molecular weight of the obtained urethane acrylate was 10,000. The obtained UA-1 was dissolved in methyl ethyl ketone so that the solid content became 40% by mass.

(Synthesis Example 5: Synthesis of polyester urethane resin PEU-1)

Propylene glycol (manufactured by Sigma-Aldrich) and neopentyl glycol (manufactured by Sigma-Aldrich) as diols and 4,4'-diphenylmethane diisocyanate (Sigma-Aldrich) as diisocyanate as terephthalic acid (manufactured by Sigma- Manufactured by Aldrich) was used.

(Procedure 1: Synthesis of polyester polyol)

First, terephthalic acid / propylene glycol / neopentyl glycol was mixed at a mass ratio of 59/21/3 and charged into a stainless steel autoclave equipped with a heater equipped with a stirrer, a thermometer, a condenser, a vacuum generator and a nitrogen gas inlet tube did. Antimony trioxide was added as a catalyst in an amount of 0.003 mol per 100 mol of the terephthalic acid, and choline hydroxide was added as a surfactant in an amount of 4 mol per 100 mol of the terephthalic acid. Subsequently, the temperature was raised to 250 DEG C over 2.5 hours under a nitrogen pressure of 0.35 MPa, and the mixture was stirred at 250 DEG C for 1 hour. Thereafter, the pressure was reduced to atmospheric pressure (0.1 MPa) at 4.0 × 10 ^-3 MPa / min, and the mixture was directly stirred at 250 ° C. for 3 hours. After cooling to 25 캜, the white precipitate was taken out, washed with water, and vacuum-dried to obtain a polyester polyol.

(Procedure 2: Synthesis of polyester urethane PEU-1)

The polyester polyol obtained in Procedure 1 was thoroughly dried, dissolved in toluene, and charged into a four-necked flask equipped with a stirrer, a dropping funnel, a reflux condenser, and a nitrogen gas introducing tube. As a catalyst, dibutyltin laurate was added in a proportion of 0.02 parts by mass based on 100 parts by mass of the polyester polyol. On the other hand, 4,4'-diphenylmethane diisocyanate was prepared in an amount of 17 parts by mass based on 59 parts by mass of terephthalic acid, dissolved in toluene, and charged into the dropping funnel as described above. After the inside of the reaction system was replaced with dry nitrogen, heating was started. When reflux was started, half of the 4,4'-diphenylmethane diisocyanate solution in the dropping funnel was added at once and vigorously stirred. The other half of the solution was added dropwise over 3 hours, and the mixture was stirred for another one hour. The precipitate obtained by cooling to 25 占 폚 was dissolved in dimethylformamide, methanol equivalent to that of dimethylformamide was added, and the solution was allowed to stand overnight in a refrigerator (5 占 폚). After allowing to stand, the obtained precipitate was taken out and vacuum-dried to obtain PEU-1. The polyester urethane resin thus obtained had a weight average molecular weight of 45,000 and a glass transition temperature of 106 캜. The resulting polyester urethane resin was dissolved in a 1: 1 solvent of methyl ethyl ketone and toluene so that the solid content became 32% by mass.

(YP-70: preparation of phenoxy resin)

As a thermoplastic resin, a phenoxy resin (trade name: YP-70, manufactured by Shin-Nittetsu Chemical Co., Ltd.) dissolved in methyl ethyl ketone so as to have a solid content of 40% by mass was prepared.

(M313: preparation of urethane acrylate)

As a radical polymerizable compound, a polyfunctional urethane acrylate (M313, manufactured by Shin Nakamura Chemical Industries, Ltd.) dissolved in methyl ethyl ketone so as to have a solid content of 80% by mass was prepared.

(INI: preparation of dilauryl peroxide)

As a radical polymerization initiator, deiruyl peroxide (manufactured by Wako Pure Chemical Industries, Ltd., symbol: INI) dissolved in toluene so as to have a solid content of 20% by mass was prepared.

(AC-1: preparation of aluminum complex)

Bis (ethylacetoacetate) (2,4-pentanedionato) aluminum (manufactured by Wako Pure Chemical Industries, Ltd., symbol: AC-1) dissolved in methyl ethyl ketone so as to have a solid content of 80% by mass was prepared as an aluminum complex .

(SC-1: preparation of silane coupling agent)

3-methacryloxypropyltrimethoxysilane (manufactured by Wako Pure Chemical Industries, Ltd., symbol: SC-1) was prepared as a silane coupling agent.

(CP-1: preparation of conductive particles)

(Symbol: CP-1) having an average particle diameter of 3 占 퐉 and a specific gravity of 2.5 obtained by forming a nickel layer having a thickness of 0.2 占 퐉 on the surface of particles made of polystyrene as nuclei and forming a gold layer having a thickness of 0.02 占 퐉 on the outside of the nickel layer, Were prepared and prepared.

[Examples 1 to 10, Comparative Examples 1 to 4] (Production of circuit connecting material)

Each of the components was blended at the blending ratios shown in Table 1, applied to a 40 占 퐉 -thick PET resin film using a coating apparatus, and dried in hot air at 70 占 폚 for 5 minutes to give a thickness of 20 占 퐉. The circuit connecting materials of Comparative Examples 1 to 4 were obtained.

Except for the conductive particles in Table 1, each value represents a mass part in terms of solid content. The numerical value of the conductive particles indicates the total amount of each component other than the conductive particles and 100 parts of the subcutaneous skin.

(Evaluation of connection resistance)

Circuit connecting materials of Examples 1 to 10 and Comparative Examples 1 to 4 were laminated on a polyimide (PI) substrate (outer shape: 38 mm x 28 mm, thickness: 0.125 mm, an ITO wiring pattern (pattern width: (Having a pattern width of 50 mu m and a pitch of 50 mu m) on a surface of a polyethylene terephthalate (PET) substrate (outer shape: 38 mm x 28 mm, thickness: 0.125 mm, Having a size of 2 mm x 20 mm from a PET resin film. (Bump area converted: 30 MPa, bump area = 50 mu m, bump height: 15 mu m) at 140 DEG C for 5 seconds, Was applied and heated and pressed. The resistance value (average value during measurement of 14 terminals) between adjacent circuits of the obtained connection structure was measured using a multimeter. The resistance value was measured immediately after connection (indicated as " before test " in Table 2) and 48 hours after high temperature and humidity test (85 DEG C, 85% RH) Respectively.

The resistance values when the circuit connecting materials of Examples 1 to 10 were used were sufficiently low as compared with Comparative Examples 1 to 4 immediately after connection (before high temperature and high humidity test). Further, after the high temperature and high humidity test, the resistance values were sufficiently lower than those of Comparative Examples 1 and 2, and the circuit member connecting structure using the circuit connecting materials of Examples 1 to 10 exhibited good connection reliability.

[Examples 11 to 16, Comparative Examples 5 to 8] (Production of circuit connection material: 2-layer film-type circuit connection material)

(Production of conductive adhesive layer)

A thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator, an aluminum complex, a silane coupling agent, and conductive particles were blended with a PET resin film having a thickness of 40 탆 in a coating ratio shown in Table 3 at a coating temperature of 70 캜 , And dried for 5 minutes in hot air to prepare a conductive adhesive layer having a thickness of 6 m.

(Preparation of insulating adhesive layer)

A thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator, an aluminum complex and a silane coupling agent were blended in a formulation ratio shown in Table 4 and applied to a PET resin film having a thickness of 40 탆 by using a coating apparatus. To thereby form an insulating adhesive layer having a thickness of 14 mu m as an adhesive layer.

(Fabrication of a two-layer film-like circuit-connecting material)

The conductive adhesive layer and the insulating adhesive layer were bonded to each other using a hot roll laminator to obtain a two-layer film-like circuit connecting material of Examples 11 to 16 and Comparative Examples 5 to 8.

In Tables 3 and 4, except for the conductive particles, each value represents a mass part in terms of solid content. The numerical value of the conductive particles indicates the total amount of each component other than the conductive particles and 100 parts of the subcutaneous skin.

(Evaluation of connection resistance)

The two-layer film circuit-connecting material of Examples 11 to 16 and Comparative Examples 5 to 8 was laminated on a polyimide (PI) substrate (outer shape: 38 mm x 28 mm, thickness: 0.125 mm, ITO wiring pattern (Pattern width: 50 mu m, pitch: 50 mu m, pitch: 50 mu m), or (B) a polyethylene terephthalate (PET) substrate (outer shape: 38 mm x 28 mm; thickness: 0.125 mm; 50 占 퐉) having a thickness of 2 mm x 20 mm, the conductive adhesive layer was placed so as to be in contact with the respective substrates, and was transferred from a PET resin film. (Bump area converted: 30 MPa, bump area = 50 mu m, bump height: 15 mu m) at 140 DEG C for 5 seconds, Was applied and heated and pressed. The resistance value (average value during measurement of 14 terminals) between adjacent circuits of the obtained connection structure was measured using a multimeter. The resistance value was measured immediately after connection (indicated as " before test " in Table 5) and 48 hours after the high temperature and humidity test (85 DEG C, 85% RH) Respectively.

The resistance values when using the circuit connecting materials of Examples 11 to 16 were sufficiently lower than those of Comparative Examples 5 to 8 immediately after the connection (before the high temperature and high humidity test). Further, after the high temperature and high humidity test, the resistance value was sufficiently low as compared with Comparative Examples 5 to 8, and the connection structure of the circuit connecting member using the circuit connecting materials of Examples 11 to 16 exhibited good connection reliability.

1, 40 circuit connection material
5 Components other than conductive particles
7 conductive particles
10 circuit connecting member
11 Insulation material
20 first circuit member
21 substrate (first substrate)
21a main surface
22 Connection terminal (first connection terminal)
30 second circuit member
31 substrate (second substrate)
31a
32 connection terminal (second connection terminal)

Claims (9)

A first circuit member on which a first connection terminal is formed on a first substrate and a second circuit member on which a second connection terminal is formed on a second substrate are bonded to each other such that the first connection terminal and the second connection terminal are electrically connected, As a circuit connecting material for use,
At least one of the first circuit member and the second circuit member is an IC chip,
wherein the inorganic filler (a) has a shape of an inorganic filler, the thermoplastic resin, (b) a radical polymerizing compound, (c) a radical polymerization initiator, and (d) an inorganic filler. The circuit connecting material according to claim 1, wherein (d) the inorganic filler comprises at least one of alumina and boron nitride. The circuit connecting material according to claim 1 or 2, wherein the amount of the inorganic filler (d) is 1 to 20 mass% with respect to the total mass of the circuit connecting material. The circuit connecting material according to any one of claims 1 to 3, further comprising (g) conductive particles. The circuit connecting material according to claim 4, wherein the inorganic filler (d) is present in a state in which the inorganic filler is not combined with the conductive particles (g). The circuit connecting material according to any one of claims 1 to 5, which is a film. The circuit connecting material according to any one of claims 1 to 6, which is for chip on plastic mounting. A first circuit member having a first connection terminal formed on a first substrate,
A second circuit member having a second connection terminal formed on a second substrate,
And a circuit connecting member which is provided between the first circuit member and the second circuit member and connects the first circuit member and the second circuit member in a state in which the first connection terminal and the second connection terminal are opposed to each other, And,
Wherein the first substrate is a plastic substrate,
The second circuit member is an IC chip,
Wherein the circuit connecting member comprises a cured product of the circuit connecting material according to any one of claims 1 to 7 and the first connecting terminal and the second connecting terminal are electrically connected to each other, Structure. A method of manufacturing a connection structure of a circuit member according to claim 8,
The circuit connecting material according to any one of claims 1 to 7, between a first circuit member having a first connecting terminal formed on the first substrate and a second circuit member having a second connecting terminal formed on the second substrate, And the circuit connecting material is cured by heating and pressing through the first circuit member and the second circuit member to adhere the first circuit member and the second circuit member to each other, And the second connection terminals are electrically connected to each other.

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