KR20150041092A - 멀티―코어 프로세서들에 대한 튜닝 가능한 멀티―티어드 stt―mram 캐시 - Google Patents
멀티―코어 프로세서들에 대한 튜닝 가능한 멀티―티어드 stt―mram 캐시 Download PDFInfo
- Publication number
- KR20150041092A KR20150041092A KR20157005965A KR20157005965A KR20150041092A KR 20150041092 A KR20150041092 A KR 20150041092A KR 20157005965 A KR20157005965 A KR 20157005965A KR 20157005965 A KR20157005965 A KR 20157005965A KR 20150041092 A KR20150041092 A KR 20150041092A
- Authority
- KR
- South Korea
- Prior art keywords
- core processor
- stt
- cache
- mram
- core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F12/00—Accessing, addressing or allocating within memory systems or architectures
- G06F12/02—Addressing or allocation; Relocation
- G06F12/08—Addressing or allocation; Relocation in hierarchically structured memory systems, e.g. virtual memory systems
- G06F12/0802—Addressing of a memory level in which the access to the desired data or data block requires associative addressing means, e.g. caches
- G06F12/0893—Caches characterised by their organisation or structure
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F12/00—Accessing, addressing or allocating within memory systems or architectures
- G06F12/02—Addressing or allocation; Relocation
- G06F12/08—Addressing or allocation; Relocation in hierarchically structured memory systems, e.g. virtual memory systems
- G06F12/0802—Addressing of a memory level in which the access to the desired data or data block requires associative addressing means, e.g. caches
- G06F12/0806—Multiuser, multiprocessor or multiprocessing cache systems
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F12/00—Accessing, addressing or allocating within memory systems or architectures
- G06F12/02—Addressing or allocation; Relocation
- G06F12/08—Addressing or allocation; Relocation in hierarchically structured memory systems, e.g. virtual memory systems
- G06F12/0802—Addressing of a memory level in which the access to the desired data or data block requires associative addressing means, e.g. caches
- G06F12/0806—Multiuser, multiprocessor or multiprocessing cache systems
- G06F12/0811—Multiuser, multiprocessor or multiprocessing cache systems with multilevel cache hierarchies
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F15/00—Digital computers in general; Data processing equipment in general
- G06F15/76—Architectures of general purpose stored program computers
- G06F15/78—Architectures of general purpose stored program computers comprising a single central processing unit
- G06F15/7807—System on chip, i.e. computer system on a single chip; System in package, i.e. computer system on one or more chips in a single package
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2212/00—Indexing scheme relating to accessing, addressing or allocation within memory systems or architectures
- G06F2212/22—Employing cache memory using specific memory technology
- G06F2212/222—Non-volatile memory
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Computing Systems (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Memory System Of A Hierarchy Structure (AREA)
- Mram Or Spin Memory Techniques (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/571,426 US9244853B2 (en) | 2012-08-10 | 2012-08-10 | Tunable multi-tiered STT-MRAM cache for multi-core processors |
| US13/571,426 | 2012-08-10 | ||
| PCT/US2013/054004 WO2014025920A1 (en) | 2012-08-10 | 2013-08-07 | Tunable multi-tiered stt-mram cache for multi-core processors |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20150041092A true KR20150041092A (ko) | 2015-04-15 |
Family
ID=49004012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR20157005965A Withdrawn KR20150041092A (ko) | 2012-08-10 | 2013-08-07 | 멀티―코어 프로세서들에 대한 튜닝 가능한 멀티―티어드 stt―mram 캐시 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9244853B2 (enExample) |
| EP (1) | EP2883151B1 (enExample) |
| JP (1) | JP6196305B2 (enExample) |
| KR (1) | KR20150041092A (enExample) |
| CN (1) | CN104520838B (enExample) |
| IN (1) | IN2015MN00076A (enExample) |
| WO (1) | WO2014025920A1 (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20170086390A (ko) * | 2016-01-15 | 2017-07-26 | 한양대학교 산학협력단 | Stt-mram을 포함하는 메모리 시스템 및 그 구축 방법 |
| US12308072B2 (en) | 2021-03-10 | 2025-05-20 | Invention And Collaboration Laboratory Pte. Ltd. | Integrated scaling and stretching platform for optimizing monolithic integration and/or heterogeneous integration in a single semiconductor die |
| US12400949B2 (en) | 2021-03-10 | 2025-08-26 | Invention And Collaboration Laboratory Pte. Ltd. | Interconnection structure and manufacture method thereof |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9858111B2 (en) * | 2014-06-18 | 2018-01-02 | Empire Technologies Development Llc | Heterogeneous magnetic memory architecture |
| CN105740164B (zh) | 2014-12-10 | 2020-03-17 | 阿里巴巴集团控股有限公司 | 支持缓存一致性的多核处理器、读写方法、装置及设备 |
| JP2016170729A (ja) * | 2015-03-13 | 2016-09-23 | 株式会社東芝 | メモリシステム |
| JP6039772B1 (ja) | 2015-09-16 | 2016-12-07 | 株式会社東芝 | メモリシステム |
| JP5992592B1 (ja) * | 2015-09-16 | 2016-09-14 | 株式会社東芝 | キャッシュメモリシステム |
| US11138125B2 (en) * | 2017-07-21 | 2021-10-05 | Taiwan Semiconductor Manufacturing Company Limited | Hybrid cache memory and method for reducing latency in the same |
| CN108932206B (zh) * | 2018-05-21 | 2023-07-21 | 南京航空航天大学 | 一种三维多核处理器混合缓存架构及方法 |
| US11216387B2 (en) * | 2019-09-16 | 2022-01-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Hybrid cache memory and method for controlling the same |
| CN119493532B (zh) * | 2025-01-17 | 2025-04-29 | 山东浪潮科学研究院有限公司 | 一种混合缓存架构及缓存数据管理方法、系统 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4341355B2 (ja) * | 2003-09-24 | 2009-10-07 | ソニー株式会社 | 磁気記憶装置、磁気記憶装置の書き込み方法および磁気記憶装置の製造方法 |
| US20050071564A1 (en) * | 2003-09-25 | 2005-03-31 | International Business Machines Corporation | Reduction of cache miss rates using shared private caches |
| TWI285893B (en) | 2004-11-12 | 2007-08-21 | Ind Tech Res Inst | Hybrid MRAM memory array architecture |
| JP5243746B2 (ja) * | 2007-08-07 | 2013-07-24 | ルネサスエレクトロニクス株式会社 | 磁気記憶装置の製造方法および磁気記憶装置 |
| JP5488833B2 (ja) * | 2008-03-07 | 2014-05-14 | 日本電気株式会社 | Mram混載システム |
| US8564079B2 (en) * | 2008-04-21 | 2013-10-22 | Qualcomm Incorporated | STT MRAM magnetic tunnel junction architecture and integration |
| US9159910B2 (en) * | 2008-04-21 | 2015-10-13 | Qualcomm Incorporated | One-mask MTJ integration for STT MRAM |
| KR100979351B1 (ko) * | 2008-07-25 | 2010-08-31 | 주식회사 하이닉스반도체 | 멀티 스택 stt-mram 장치 및 그 제조 방법 |
| US8719610B2 (en) * | 2008-09-23 | 2014-05-06 | Qualcomm Incorporated | Low power electronic system architecture using non-volatile magnetic memory |
| US8966181B2 (en) | 2008-12-11 | 2015-02-24 | Seagate Technology Llc | Memory hierarchy with non-volatile filter and victim caches |
| US8914568B2 (en) | 2009-12-23 | 2014-12-16 | Intel Corporation | Hybrid memory architectures |
| US8315081B2 (en) * | 2010-03-22 | 2012-11-20 | Qualcomm Incorporated | Memory cell that includes multiple non-volatile memories |
| JP2012014787A (ja) * | 2010-06-30 | 2012-01-19 | Sony Corp | 記憶装置 |
| US8456883B1 (en) * | 2012-05-29 | 2013-06-04 | Headway Technologies, Inc. | Method of spin torque MRAM process integration |
-
2012
- 2012-08-10 US US13/571,426 patent/US9244853B2/en active Active
-
2013
- 2013-08-07 IN IN76MUN2015 patent/IN2015MN00076A/en unknown
- 2013-08-07 EP EP13751006.1A patent/EP2883151B1/en active Active
- 2013-08-07 JP JP2015526678A patent/JP6196305B2/ja not_active Expired - Fee Related
- 2013-08-07 WO PCT/US2013/054004 patent/WO2014025920A1/en not_active Ceased
- 2013-08-07 KR KR20157005965A patent/KR20150041092A/ko not_active Withdrawn
- 2013-08-07 CN CN201380042021.3A patent/CN104520838B/zh active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20170086390A (ko) * | 2016-01-15 | 2017-07-26 | 한양대학교 산학협력단 | Stt-mram을 포함하는 메모리 시스템 및 그 구축 방법 |
| US12308072B2 (en) | 2021-03-10 | 2025-05-20 | Invention And Collaboration Laboratory Pte. Ltd. | Integrated scaling and stretching platform for optimizing monolithic integration and/or heterogeneous integration in a single semiconductor die |
| US12400949B2 (en) | 2021-03-10 | 2025-08-26 | Invention And Collaboration Laboratory Pte. Ltd. | Interconnection structure and manufacture method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| IN2015MN00076A (enExample) | 2015-10-16 |
| WO2014025920A1 (en) | 2014-02-13 |
| US9244853B2 (en) | 2016-01-26 |
| EP2883151A1 (en) | 2015-06-17 |
| CN104520838A (zh) | 2015-04-15 |
| CN104520838B (zh) | 2018-01-16 |
| US20140047184A1 (en) | 2014-02-13 |
| EP2883151B1 (en) | 2022-06-22 |
| JP6196305B2 (ja) | 2017-09-13 |
| JP2015528601A (ja) | 2015-09-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20150306 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| PC1203 | Withdrawal of no request for examination | ||
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |