KR20150039390A - Substrate transferring tray of consecutive substrate processing system and method of transferring substrate - Google Patents

Substrate transferring tray of consecutive substrate processing system and method of transferring substrate Download PDF

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Publication number
KR20150039390A
KR20150039390A KR20130117902A KR20130117902A KR20150039390A KR 20150039390 A KR20150039390 A KR 20150039390A KR 20130117902 A KR20130117902 A KR 20130117902A KR 20130117902 A KR20130117902 A KR 20130117902A KR 20150039390 A KR20150039390 A KR 20150039390A
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KR
South Korea
Prior art keywords
substrate
tray
substrate transfer
deposition process
substrates
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Application number
KR20130117902A
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Korean (ko)
Inventor
안경준
권오대
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(주)에스엔텍
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Priority to KR20130117902A priority Critical patent/KR20150039390A/en
Publication of KR20150039390A publication Critical patent/KR20150039390A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67356—Closed carriers specially adapted for containing chips, dies or ICs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to a substrate transferring tray of a consecutive substrate processing system and a method for transferring a substrate. The substrate transferring tray of a consecutive substrate processing system is made of a plate-shaped member and is coated with an adhesive substance at least in part on one or more sides to allow a plurality of substrates to adhere to it. Therefore, the substrate transferring tray of a consecutive substrate processing system and the method for transferring a substrate enable the simultaneous processing of a plurality of substrates in a consecutive substrate processing system during a deposition process and pre and post-deposition processes, thereby significantly improving substrate processing efficiency and productivity.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a substrate transfer tray for a continuous substrate processing system,

The present invention relates to a substrate transfer tray and a substrate transfer method in a continuous substrate processing system, and more particularly, to a substrate transfer tray and a substrate transfer method in a continuous substrate processing system that can process a plurality of substrates simultaneously in a deposition process and a pre- And more particularly to a substrate transfer tray and a substrate transfer method of a continuous substrate processing system capable of remarkably improving the quality of a substrate.

A flat panel display (FPD) such as a semiconductor device, a solar cell, a plasma display panel (PDP), an organic light emitting diode (OLED), a touch screen panel, The substrate is subjected to a series of processing steps such as thin film deposition, exposure, development, etching, stripping, rinsing, cleaning, drying, and the like.

Continuous substrate processing systems in which such substrate processing processes consist of continuous processes exist in various forms using PVD or CVD deposition methods.

On the other hand, when the continuous substrate processing system processes a large area substrate, only one substrate is processed in each process. However, when processing a substrate having a small area, it is preferable to treat a plurality of substrates simultaneously in each process .

However, in the case of the conventional continuous substrate processing system, it was not possible to simultaneously process a plurality of small-area substrates in the front and back processes of the deposition process due to the characteristics of the deposition tray used in the deposition process for depositing the thin film on the substrate.

This is because the deposition tray used for positioning the substrate in the vacuum chamber in the deposition process is made of a large-area metal material capable of mounting a plurality of substrates. As an example of a conventional deposition tray, Korean Patent Laid-Open No. 10-2012-0136436 and the like exist.

As a result, the deposition tray of the deposition process can not be used in the front and back processes of the deposition process, for example, the substrate cleaning process, the substrate drying process and the post-process as the previous process, and the process using the substrate processing solution in the exposure process, the etching process, and the cleaning process.

Therefore, in the conventional continuous substrate processing system, the transfer mode of the substrates has to be as follows. Each of the substrates is individually subjected to pre-deposition processes such as a substrate cleaning process and a substrate drying process, and then moved to a deposition process so that a plurality of pretreated substrates are placed in a deposition tray of the deposition process so that a plurality of substrates are subjected to a deposition process do.

When the deposition process is completed, each of the substrates is separated from the deposition tray of the deposition process, and each substrate is subjected to an exposure process, an etching process, and a cleaning process as a post process.

Thus, even if a plurality of substrates are simultaneously processed in the deposition process, the process needs to be performed for each of the substrates before and after the deposition, so that the process speed of the entire continuous substrate processing system can not be improved, There is a problem that the limit is followed.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a substrate transfer tray and a substrate transfer apparatus in a continuous substrate processing system capable of simultaneously processing a plurality of substrates in a deposition process and a deposition process before and after deposition in a continuous substrate processing system, Thereby providing a transfer method.

According to the present invention, there is provided a substrate transfer tray of a continuous substrate processing system, comprising: a plurality of substrates provided on at least one side thereof, which are provided as hard or soft plate members, Characterized in that a substrate transfer tray of a continuous substrate processing system is provided.

Here, it is preferable that an adhesive material capable of adhering the substrates is at least partially coated on the at least one surface.

The substrate transfer tray has a plate-shaped tray member and a plurality of substrate adhered portions formed on at least one surface of the tray member in a number corresponding to the substrates and having a surface coated with an adhesive material.

In addition, it is preferable that the substrate transfer tray has a plate-like tray member coated with an adhesive on at least one side thereof, and a barrier sheet blocking an area where the substrates are not adhered to the tray member.

Wherein the continuous substrate processing system has at least one deposition process, at least one pre-process before the deposition process, and at least one post process after the deposition process; It is effective that a plurality of the substrate transfer trays are loaded on the deposition tray in the deposition process to perform the deposition process.

And the substrate transfer tray maintains the attachment state of the substrates in a deposition process at 25 ° C to 150 ° C.

On the other hand, this object is achieved according to a further aspect of the invention by a method of manufacturing a continuous substrate processing system having at least one deposition process, at least one pre-process before the deposition process, and at least one post process after the deposition process, A method of transferring a substrate, comprising: adhering the substrates to a substrate transfer tray on at least one side of which an adhesive material capable of adhering a plurality of substrates is at least partially applied; Transferring the substrate transfer tray to the previous process to perform the previous process; Performing a deposition process by loading a plurality of the substrate transfer trays on a deposition tray provided in the deposition process; And transferring the substrate transfer tray to the post-process by performing the deposition process to perform the post-process.

Here, the temperature of the deposition process is preferably 25 ° C to 150 ° C.

And, it is effective that the substrate transfer tray is the above-described substrate transfer tray.

According to the present invention, it is possible to simultaneously process a plurality of substrates in a deposition process and a deposition process before and after deposition in a continuous substrate processing system, so that substrate processing efficiency and productivity can be remarkably improved. Method is provided.

1 is a schematic view illustrating a process of transferring a substrate in a continuous substrate processing system according to the present invention;
Figure 2 is a schematic perspective view of the substrate transfer tray of Figure 1,
Figures 3 and 4 are schematic perspective views of a substrate transfer tray according to another aspect of the present invention.

FIG. 2 is a schematic perspective view of the substrate transfer tray of FIG. 1, and FIGS. 3 and 4 are cross-sectional views of a substrate transfer tray according to another embodiment of the present invention. Fig. 2 is a schematic perspective view of a substrate transfer tray. As shown in these drawings, the substrate transfer tray 10 of the continuous substrate processing system according to the present invention is subjected to the pre-deposition process 100 of the continuous substrate processing system 1 by loading a plurality of substrates S A plurality of transfer trays 10 having passed the pre-deposition process 100 are loaded on the large-area deposition tray 20 in the deposition process 200 to perform the deposition process 200. Each of the substrate transfer trays 10 is then subjected to a post-deposition process 300 to allow the plurality of substrates S to pass through the process in the pre-deposition process 100 of the continuous substrate process.

2, the substrate transfer tray 10 includes a tray member 11 having an area on which a plurality of substrates S can be stacked, a substrate S to be stacked on at least one side of the tray member 11, And a plurality of substrate adhered portions 13 formed in a number corresponding to the number of the substrates.

At this time, in the process of using the solution in the continuous substrate processing system 1, the tray member 11 is made of a synthetic resin such as PET (Polyethylene terephthalate), PEN (Polyethylene naphthalate), PI (Polyimide) Or may be provided as a plate using various materials such as a polymer film or glass, and in some cases, it is possible to use a hard soft material. It is preferable that the substrate adhered portions 13 are provided in a form in which an adhesive material capable of adhering the substrate S to the surface thereof has an area corresponding to the area of the substrate S.

Preferably, the substrate transfer tray 10 may be configured such that the entire tray member 11 is formed of a polyethylene terephthalate (PET) sheet and the adhesive material 13 is coated with an adhesive material.

Or the substrate transfer tray 10 may be a substrate adhering portion 13 formed by a tray member 11 and an adhesive material applied on at least one entire surface of the tray member 11. [ In this case, as shown in FIG. 3 and FIG. 4, the substrate S may be further provided with a barrier sheet 15 for blocking exposed portions of the adhesive material in a state that the substrate S is adhered to the substrate adhered portion 13.

The form in which the adhesive material is applied only to the areas where the substrates S are adhered to each other and the barrier sheet 15 which is opposite to the adhesive material exposed area in the areas where the substrates S are not adhered, (200) or the like to prevent deterioration of the deposition quality due to outgausing due to exposure of the adhesive material.

The process of simultaneously processing a plurality of substrates S in each processing process of the continuous substrate processing system 1 using the substrate transfer tray 10 of the substrate (S) adhering type is briefly described with reference to FIG. 1 see.

Here, the process steps included in the continuous substrate processing system 1 include at least one deposition process 200 for depositing a thin film on the surface of the small area substrates S, Drying, exposure, development, and development of a substrate S as a pre-process 100 of at least one of processes such as cleaning, drying, exposure, development, etching, strip, and rinsing, (300) of at least one of the following processes: etching, stripping, rinsing, and the like, as well as processes of a continuous substrate processing system which are currently disclosed in various forms.

For convenience of description, all types of processes performed before the deposition process 200 on the basis of the deposition process 200 are collectively referred to as a front process 100, and after all the processes performed after the deposition process 200 Is referred to as a step (300).

The substrate S is adhered to each of the substrate adhering portions 13 of the substrate transfer tray 10 before the previous step 100 of the continuous substrate processing system 1. [ Then, a plurality of substrates S corresponding to the number of substrate adhering portions 13 are stacked on one substrate transfer tray 10 (S01).

The substrate transfer trays 10 on which the plurality of substrates S are stacked are sequentially supplied to the entire process 100 and are subjected to the entire process 100 such as cleaning, drying, exposure, development, etching, stripping, rinsing, (S02). At this time, even if the substrate transfer tray 10 is subjected to the process of using the substrate processing solution in the previous process 100, there is no need to worry about damage such as corrosion. As a result, a plurality of small-area substrates S are transported by one substrate transport tray 10 and pass through the entire process 100 at the same time. As a result, the processing efficiency of the pre-deposition process 100 is significantly increased. Here, the previous step 100 may be at least one of the above-described processes.

A plurality of substrate transfer trays 10 that have passed through the entire process 100 are loaded onto a relatively large-area deposition tray 20 in the deposition process 200. That is, a plurality of substrate transfer trays 10 on which a plurality of substrates S are stacked are loaded on the deposition tray 20 of the deposition process 200, so that in the deposition process 200, A deposition process 200 for thin film deposition can be performed (S03). As a result, the processing efficiency of the deposition process 200 is significantly increased.

At this time, it is preferable that the adhesive material of the substrate transfer tray 10 does not affect the deposition of the thin film without losing the adhesive force due to the temperature generated during the deposition process. For this purpose, the adhesive material may include silicone, butyl, Various types of pressure sensitive adhesive materials can be used including pressure sensitive adhesives, nitrile adhesives, chloroprene adhesives, polyamide adhesives, epoxy adhesives, and the like. The substrate transfer tray 10 according to the present invention is preferably applied to the low-temperature deposition process 200 at 25 ° C to 150 ° C in consideration of the high temperature deformation of the adhesive material. Here, the deposition process 200 may be performed by a single process or a plurality of sequential processes, or may be disposed in an additional process before or after the pre-process 100 and the post-process 300 described below.

When the deposition process 200 is completed, each of the substrate transfer trays 10 in the deposition tray 20 is separated and transferred to the post-process 300 continuously, whereby a plurality of substrates (S) are subjected to a post-process 300 such as cleaning, drying, exposure, developing, etching, stripping, rinsing, etc. (S04). At this time, even if the substrate transfer tray 10 is subjected to the process using the substrate processing solution in the post-process 300, there is no need to worry about damage such as corrosion. As a result, the plurality of small-area substrates S are transported by the single substrate transport tray 10 and simultaneously pass through the post-process 300, so that the process efficiency of the post-deposition process 300 is significantly increased. Here, the post-process 300 may be at least one of the processes described above.

As described above, according to the substrate transfer tray and the substrate transfer method of the continuous substrate processing system according to the present invention, a plurality of substrates are subjected to the pre-process and the post process simultaneously while being adhered to the substrate transfer tray, By simultaneously processing a plurality of substrate transfer trays in the deposition process, the process speed and substrate processing efficiency and productivity of the overall continuous substrate processing system are significantly improved.

10: substrate transfer tray 11: tray member
13: substrate adhering part 15:
20: Deposition tray

Claims (9)

In a substrate transfer tray of a continuous substrate processing system,
And a plurality of substrates are attached to at least one surface of the substrate and conveyed to perform the process of the continuous substrate processing system. The method according to claim 1,
Wherein at least one surface of the substrate transfer tray is at least partially coated with an adhesive material capable of adhering the substrates. 3. The method of claim 2,
The substrate transfer tray
A plate-shaped tray member,
And a plurality of substrate adhering portions formed on at least one surface of the tray member in a number corresponding to the substrates and having a surface coated with an adhesive material. 3. The method of claim 2,
The substrate transfer tray
A plate-shaped tray member on which at least one surface is coated with an adhesive material,
And a barrier sheet for blocking an area where the substrates are not adhered to the tray member. 5. The method according to any one of claims 1 to 4,
Wherein the continuous substrate processing system has at least one deposition process, at least one pre-process before the deposition process, and at least one post-process after the deposition process;
Wherein a plurality of the substrate transfer trays are loaded on the deposition tray in the deposition process to perform the deposition process. 6. The method of claim 5,
Wherein the substrate transfer tray maintains the attachment of the substrates in a deposition process at 25 < 0 > C to 150 < 0 > C. A substrate transfer method for a continuous substrate processing system having at least one deposition process, at least one pre-process before the deposition process, and at least one post process after the deposition process,
Adhering the substrates to a substrate transfer tray on at least one side of which at least partly an adhesive material capable of adhering a plurality of substrates is applied;
Transferring the substrate transfer tray to the previous process to perform the previous process;
Performing a deposition process by loading a plurality of the substrate transfer trays on a deposition tray provided in the deposition process;
And performing the post-processing by transferring the substrate transfer tray to the post-process after the deposition process is completed. 8. The method of claim 7,
Wherein the deposition process is performed at a temperature ranging from 25 ° C to 150 ° C. 8. The method of claim 7,
Wherein the substrate transfer tray is the substrate transfer tray according to any one of claims 1 to 4.
KR20130117902A 2013-10-02 2013-10-02 Substrate transferring tray of consecutive substrate processing system and method of transferring substrate KR20150039390A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101713783B1 (en) * 2015-11-18 2017-03-08 (주)에스엔텍 Method of detecting deposition status of device and system thereof
CN115285697A (en) * 2022-08-01 2022-11-04 深圳市灵动通科技有限公司 Working method of intelligent card production equipment and equipment thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101713783B1 (en) * 2015-11-18 2017-03-08 (주)에스엔텍 Method of detecting deposition status of device and system thereof
CN115285697A (en) * 2022-08-01 2022-11-04 深圳市灵动通科技有限公司 Working method of intelligent card production equipment and equipment thereof

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