KR20150037617A - Semiconductor wafer dicing film and dicing die bonding film - Google Patents

Abstract

The present invention relates to a dicing film. The dicing film includes a base film and a bonding layer which is formed on at least one side of the base film. The tear force of the base film measured by an ASTM D624 Trouser method at a velocity of 300mm/min is 200gf or less.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dicing film and a dicing die bonding film,

The present invention relates to a dicing film capable of minimizing burrs that may occur during a dicing process of a semiconductor wafer to prevent contamination of the semiconductor chip and improve reliability and lifetime of the semiconductor chip, And a dicing method of a semiconductor wafer using the dicing die bonding film.

Generally, the manufacturing process of a semiconductor chip includes a process of forming a fine pattern on a wafer and a process of polishing and packaging the wafer according to the specification of the final device.

The packaging process includes a wafer inspection process for inspecting defective semiconductor chips; A dicing step of cutting the wafer into individual chips; A die bonding step of attaching the separated chip to a circuit board or a mount plate of a lead frame; A wire bonding process for connecting a chip pattern provided on a semiconductor chip and a circuit pattern of a circuit film or a lead frame by an electrical connecting means such as a wire; A molding process for encapsulating the exterior with an encapsulant to protect the internal circuitry of the semiconductor chip and other components; A trimming process for cutting the dam bars connecting the leads and the leads; A foaming step of bending the lead in a desired shape; And a finished product inspection process for inspecting the finished package for defects.

Through the dicing process, individual chips separated from each other are produced from a semiconductor wafer on which a plurality of chips are formed. An optically dicing process is a process of manufacturing a plurality of individual chips separated from each other by grinding the back surface of a semiconductor wafer and cutting the semiconductor wafer along a dicing line between the chips.

On the other hand, sawing is performed in order to make the semiconductor wafers completed with the circuit wiring into individual chips, and not only the wafers but also the base film of the dicing film are cut off by the blades used in these processes. Burrs are generated by the cutting of the base film to contaminate the semiconductor chip, thereby affecting the reliability and lifetime of the semiconductor chip. In addition, since the dicing process speed is getting faster in recent years in order to improve the productivity, it has been necessary to study a technique for minimizing the generation of burrs.

The present invention provides a dicing film which minimizes burrs that may occur during a dicing process of a semiconductor wafer to thereby prevent contamination of the semiconductor chip and improve reliability and lifetime of the semiconductor chip.

The present invention also provides a dicing die-bonding film capable of minimizing burrs that may occur during a dicing process of a semiconductor wafer to thereby prevent contamination of the semiconductor chip and improve reliability and lifetime of the semiconductor chip. will be.

The present invention also provides a dicing method of a semiconductor wafer using the dicing die-bonding film.

In the present specification, a crosslinked product of an ethylene-alkyl (meth) acrylic acid ester copolymer; And an ethylene- (meth) acrylic acid-alkyl (meth) acrylate ester ionomer; and an adhesive layer formed on at least one side of the base film, wherein the adhesive layer is ASTM The tear force of the base film measured at a speed of 300 mm / min by the D624 Trouser method is 200 gf or less.

Further, in the present specification, the dicing film; And an adhesive layer formed on at least one side of the dicing film.

Further, in the present specification, the dicing die-bonding film; And a wafer stacked on at least one side of the dicing die-bonding film, the pretreating step partially dividing or partially dividing the semiconductor wafer; Exposing the semiconductor wafer after the preprocessing step; And irradiating ultraviolet rays onto the base film of the expanded semiconductor wafer and picking up individual chips separated by the division of the semiconductor wafer.

The dicing film, the dicing die bonding film and the dicing method of the semiconductor wafer according to the specific embodiment of the invention will be described in more detail below.

In the present specification, '(meth) acrylate' is meant to include both methacrylate and acrylate.

As described above, according to one embodiment of the present invention, a crosslinked product of an ethylene-alkyl (meth) acrylic acid ester copolymer; And an ethylene- (meth) acrylic acid-alkyl (meth) acrylate ester ionomer; and an adhesive layer formed on at least one side of the base film, wherein the adhesive layer is ASTM The tearing force of the base film measured at a speed of 300 mm / min by the D624 Trouser method may be 200 gf or less.

Since the base film of the dicing film as well as the wafer is partially cut by the blades used in the sawing process in the conventional dicing process, a burr is generated to contaminate the semiconductor chip, There were problems affecting the life span.

Accordingly, the present inventors have found that when the tear force of a substrate film containing a predetermined polymer is 200 gf or less, or 30 gf to 180 gf, as measured at a speed of 300 mm / min by the ASTM D624 Trouser method, The burr phenomenon that may occur during the dicing process of the semiconductor chip can be minimized to prevent contamination of the semiconductor chip and improve the reliability and life of the semiconductor chip.

As described above, the tear strength of the base film can be measured at a rate of 300 mm / min according to the ASTM D624 Trouser method. Under the measurement conditions, the base film has a tear force of 200 gf or less, or 30 gf To 180 gf, it is easy to cut the film, so that even when the dicing film is partially cut by the blade blade during the dicing process, the generation of cuts can be easily reduced and the occurrence of burrs can be reduced.

The base film may be a crosslinked product of an ethylene-alkyl (meth) acrylic acid ester copolymer; And an ethylene- (meth) acrylic acid-alkyl (meth) acrylate ester ionomer.

The crosslinked product of the ethylene-alkyl (meth) acrylic acid ester copolymer and the ethylene- (meth) acrylic acid-alkyl (meth) acrylate ester ionomer have a large tensile modulus due to their chemical structural characteristics, In the cutting process such as the chipping process, the important tear force is small, so that the dicing film to which the base film containing the base film is applied can reduce burrs in the dicing process.

Specifically, the crosslinked product of the ethylene-alkyl (meth) acrylic acid ester copolymer is an ethylene repeat unit; And an ethylene repeating unit bonded with an alkyl (meth) acrylate having 1 to 10 carbon atoms.

Also, the ethylene repeat unit; And an ethylene repeating unit bonded with an alkyl (meth) acrylate having 1 to 10 carbon atoms is crosslinked by the cross-linking of the copolymers through the alkyl (meth) acrylate ester in the presence of a peroxide It can be a polymer.

The ethylene- (meth) acrylic acid-alkyl (meth) acrylate ester ionomer may be prepared by reacting an ethylene (meth) acrylic acid repeating unit and an alkyl (meth) Means a polymer or copolymer containing a metal ion.

Specifically, the ethylene- (meth) acrylate-alkyl (meth) acrylate ester ionomer comprises an ethylene repeating unit, a (meth) acrylic acid repeating unit and a (meth) acrylic acid ester repeating unit, , At least one metal selected from the group consisting of calcium, barium, sodium (Na), and magnesium (Mg), or an ion-mediated polymer or copolymer thereof.

The base film may be a crosslinked product of an ethylene-alkyl (meth) acrylic acid ester copolymer; And an ethylene- (meth) acrylic acid-alkyl (meth) acrylate ester ionomer. The polymer may further include other polymers. Specific examples of the polymer that can be added to the base film in this manner include low density polyethylene, linear polyethylene, medium density polyethylene, high density polyethylene, ultra low density polyethylene, random copolymer of polypropylene, block copolymer of polypropylene, homopolypropylene, But are not limited to, polymethylpentene, ethylene-vinyl acetate copolymer, ethylene-methacrylic acid copolymer, ethylene-methyl methacrylate copolymer, ethylene-ionomer copolymer, ethylene-vinyl alcohol copolymer, And the like. When such a polymer is included in the base film, the content thereof may be 50% by weight or less, or 30% by weight or less.

The term "base film comprising two or more kinds of polymers" as used herein means a film having a structure in which two or more films each containing the above-mentioned polymers are laminated or a single layer film containing two or more of the above-mentioned polymers.

If necessary, the base film may be subjected to conventional physical or chemical treatments such as a mat treatment, a corona discharge treatment, a primer treatment or a crosslinking treatment.

The thickness of the base film may be 50 [mu] m to 150 [mu] m, or 70 [mu] m to 110 [mu] m. This is because if the thickness of the base film is too thin, the tensile force of the base film can not be sufficiently exhibited, and the dicing film may be cut in the dicing step.

The elongation at break of the base film measured at a speed of 100 mm / min according to ASTM D-638 standard may be 400% to 1000%. If the fracture toughness ratio of the base film is too small, the handling property in the manufacturing process is deteriorated and the film can be easily broken when the film is stretched. In addition, if the fracture toughness ratio of the base film is too large, sufficient chip spacing can not be ensured when stretching after dicing, and pickup properties may be deteriorated.

Meanwhile, the adhesive layer may include an ultraviolet curable pressure sensitive adhesive or a thermosetting pressure sensitive adhesive. When an ultraviolet curing type pressure-sensitive adhesive is used, ultraviolet rays are irradiated from the base film side to increase the cohesive force and the glass transition temperature of the pressure-sensitive adhesive to lower the adhesive strength, and in the case of the thermosetting type pressure-

In addition, the ultraviolet curable pressure sensitive adhesive may include a (meth) acrylate resin, an ultraviolet curable compound, a photoinitiator, and a crosslinking agent.

The (meth) acrylate resin may have a weight average molecular weight of 100,000 to 1,500,000, preferably 200,000 to 100,000. If the weight average molecular weight is less than 100,000, the coating property or the cohesive force is lowered, and there is a fear that a residue is left on the adherend upon peeling, or the adhesive is broken. On the other hand, if the weight average molecular weight exceeds 1.5 million, the base resin may interfere with the reaction of the ultraviolet curable compound and the peeling force may not be effectively reduced.

Such a (meth) acrylate resin may be, for example, a copolymer of a (meth) acrylic acid ester monomer and a monomer having a crosslinkable functional group. Examples of the (meth) acrylate monomer include alkyl (meth) acrylate, more specifically monomers having an alkyl group having 1 to 12 carbon atoms such as pentyl (meth) acrylate, n-butyl (Meth) acrylate, ethyl (meth) acrylate, methyl (meth) acrylate, hexyl (meth) acrylate, n-octyl Acrylate, dodecyl (meth) acrylate or decyl (meth) acrylate. The use of a monomer having a large number of alkyl carbon atoms lowers the glass transition temperature of the final copolymer, so that a suitable monomer may be selected according to the desired glass transition temperature. Examples of the monomer having a crosslinkable functional group include a hydroxy group-containing monomer, a carboxyl group-containing monomer or a nitrogen-containing monomer, or a mixture of two or more kinds thereof. Examples of the hydroxyl group-containing compound include 2-hydroxyethyl (meth) acrylate and 2-hydroxypropyl (meth) acrylate, and examples of the carboxyl group-containing compound include (meth) acrylic acid , And examples of the nitrogen-containing monomer include (meth) acrylonitrile, N-vinylpyrrolidone, N-vinylcaprolactam, and the like, but are not limited thereto. The (meth) acrylate resin may further include a low molecular weight compound containing vinyl acetate, styrene or acrylonitrile carbon-carbon double bond from the viewpoint of improvement of other functions such as compatibility and the like.

The type of the ultraviolet curable compound is not particularly limited, and for example, a compound having a polyfunctional compound having a weight average molecular weight of about 500 to 300,000 (e.g., a polyfunctional urethane acrylate, a polyfunctional acrylate monomer or an oligomer) . The average person skilled in the art can easily select the appropriate compound according to the intended use. The content of the UV curable compound may be 5 parts by weight to 400 parts by weight, preferably 10 parts by weight to 200 parts by weight, based on 100 parts by weight of the base resin. If the content of the ultraviolet curable compound is less than 5 parts by weight, the adhesiveness after curing is not sufficiently lowered, which may result in poor pickability. If the content exceeds 400 parts by weight, the cohesive force of the adhesive before ultraviolet irradiation is insufficient, There is a fear that it will not be easily done.

The type of the photoinitiator is not particularly limited, and a conventional initiator known in the art can be used, and the content thereof can be 0.05 part by weight to 20 parts by weight based on 100 parts by weight of the ultraviolet curable compound. If the content of the photoinitiator is less than 0.05 part by weight, the curing reaction may be insufficient due to the irradiation of ultraviolet rays, which may lower the pick-up property. If the content exceeds 20 parts by weight, Resulting in residue on the surface of the adherend, or the peeling force after curing becomes too low, which may lower the pickupability.

The type of the cross-linking agent for imparting the adhesive force and the cohesive force contained in the adhesive portion is also not particularly limited, and typical compounds such as an isocyanate compound, an aziridine compound, an epoxy compound or a metal chelate compound can be used. The crosslinking agent may be included in an amount of 2 to 40 parts by weight, preferably 2 to 20 parts by weight based on 100 parts by weight of the base resin. If the content is less than 2 parts by weight, the cohesive force of the pressure-sensitive adhesive may be insufficient. If the content is more than 20 parts by weight, the adhesive strength before ultraviolet ray irradiation may be insufficient and chip scattering may occur.

The adhesive layer may further include a tackifier such as rosin resin, terpene resin, phenol resin, styrene resin, aliphatic petroleum resin, aromatic petroleum resin or aliphatic aromatic copolymerized petroleum resin.

The method for forming the pressure-sensitive adhesive layer on the base film is not particularly limited. For example, the pressure-sensitive adhesive composition of the present invention is directly applied onto a base film to form a pressure-sensitive adhesive layer, A method in which a pressure-sensitive adhesive composition is once applied to a pressure-sensitive adhesive layer to prepare a pressure-sensitive adhesive layer, and the pressure-sensitive adhesive layer is transferred onto the base film using the releasable base material.

The method for applying and drying the pressure-sensitive adhesive composition is not particularly limited. For example, the composition containing each of the above components may be directly or diluted with an appropriate organic solvent and applied to a comma coater, a gravure coater, a die coater or a reverse coater And drying the solvent at a temperature of 60 ° C to 200 ° C for 10 seconds to 30 minutes may be used. In addition, an aging process for advancing a sufficient cross-linking reaction of the pressure-sensitive adhesive may be further performed.

According to another embodiment of the present invention, the dicing film; And an adhesive layer formed on at least one side of the dicing film.

Wherein the adhesive layer is an epoxy resin, a low elastic high molecular weight resin. And a curing agent. The epoxy resin may include an epoxy resin for general adhesives known in the art. For example, an epoxy resin containing two or more epoxy groups in a molecule and having a weight average molecular weight of 100 to 5,000 may be used.

The epoxy resin forms a hard crosslinked structure through a curing process, and can exhibit excellent adhesiveness, heat resistance and mechanical strength.

More specifically, as the epoxy resin, it is particularly preferable to use an epoxy resin having an average epoxy equivalent of 100 to 1,000. If the epoxy equivalent of the epoxy resin is less than 100, the crosslinking density becomes excessively high, and the adhesive film may exhibit overall rigid properties. If the epoxy equivalent of the epoxy resin exceeds 1,000, there is a fear that the heat resistance is lowered.

Examples of the epoxy resin include bifunctional epoxy resins such as bisphenol A epoxy resin and bisphenol F epoxy resin; Or a cresol novolac epoxy resin, a phenol novolak epoxy resin, a tetrafunctional epoxy resin, a biphenyl type epoxy resin, a triphenolmethane type epoxy resin, an alkyl modified triphenolmethane type epoxy resin, a naphthalene type epoxy resin, Type epoxy resin or a dicyclopentadiene-modified phenol-type epoxy resin, and the like, but is not limited thereto.

As the epoxy resin, it is preferable to use a mixed resin of a difunctional epoxy resin and a polyfunctional epoxy resin.

The above "polyfunctional epoxy resin" means an epoxy resin having three or more functional groups. That is, generally, the bifunctional epoxy resin is excellent in flexibility and flowability at a high temperature, but has a low heat resistance and a hardening rate, whereas a multifunctional epoxy resin having three or more functional groups has excellent curing speed and excellent crosslinking density Heat resistance is exhibited but flexibility and flowability are poor. Therefore, it is possible to suppress scattering of chips and generation of burrs in the dicing step while controlling the elastic modulus and tack characteristics of the adhesive layer by properly mixing and using the two kinds of resins.

The low elastic high molecular weight resin may serve as a soft segment in an adhesive to impart stress relaxation characteristics at high temperatures. As the high-molecular-weight resin, any resin component may be used as long as it is blended with the epoxy resin to cause no cracking during film formation, exhibits viscoelasticity after formation of the crosslinked structure, and has excellent compatibility with other components and storage stability. .

The specific kind of the low elastic high molecular weight resin is not particularly limited as long as the above-mentioned characteristics are satisfied, and examples thereof include polyimide, polyetherimide, polyesterimide, polyamide, polyether sulfone, polyether ketone, polyolefin , Polyvinyl chloride, phenoxy, reactive acrylonitrile-butadiene rubber, or (meth) acrylate-based resin, or the like, or a mixture of two or more thereof.

Specific examples of the (meth) acrylate resin include acrylic copolymers including (meth) acrylic acid and derivatives thereof. Examples of the (meth) acrylic acid and derivatives thereof include (meth) acrylic acid; Alkyl (meth) acrylates containing an alkyl group having 1 to 12 carbon atoms such as methyl (meth) acrylate or ethyl (meth) acrylate; (Meth) acrylonitrile or (meth) acrylamide; And other copolymerizable monomers.

The (meth) acrylate resin may further include one or more kinds of functional groups such as a glycidyl group, a hydroxyl group, a carboxyl group and an amine group. Such functional groups include glycidyl (meth) acrylate, hydroxy (Meth) acrylate, hydroxyethyl (meth) acrylate or carboxy (meth) acrylate.

The curing agent that can be included in the adhesive composition is not particularly limited as long as it can react with the epoxy resin and / or the low elastic high molecular weight resin to form a crosslinked structure. For example, a curing agent capable of reacting simultaneously with the two components to form a crosslinked structure can be used. Such a curing agent forms a crosslinked structure with the soft segment and the hard segment in the adhesive to improve the heat resistance, and at the same time, It is possible to improve the reliability of the semiconductor package by acting as a cross-linking agent for the two segments.

According to another embodiment of the present invention, the dicing die-bonding film; And a wafer stacked on at least one side of the dicing die-bonding film, the pretreating step partially dividing or partially dividing the semiconductor wafer; Exposing the semiconductor wafer after the preprocessing step; And irradiating ultraviolet rays onto the base film of the expanded semiconductor wafer, and picking up individual chips separated by the division of the semiconductor wafer.

The above-mentioned contents regarding the dicing film and the dicing film are all included.

Except for the detailed steps of the dicing method, a device, a method, and the like used in a dicing method of a commonly known semiconductor wafer can be used without limitation.

By using the dicing die-bonding film including the dicing film, the burr phenomenon that may occur during the dicing process of the semiconductor wafer is minimized to prevent contamination of the semiconductor chip and improve the reliability and life of the semiconductor chip. .

According to the present invention, there is provided a semiconductor device comprising: a dicing film that minimizes burrs that may occur during a dicing process of a semiconductor wafer to thereby prevent contamination of the semiconductor chip and improve reliability and life of the semiconductor chip; A dicing die bonding film including the dicing die bonding film, and a dicing method of a semiconductor wafer using the dicing die bonding film.

The invention will be described in more detail in the following examples. However, the following examples are illustrative of the present invention, and the present invention is not limited by the following examples.

< Example  1 to 4 and Comparative Example  1 to 3: Dicing  Film and Dicing Die bonding  Production of Film>

Example  1 to 4

(One) Dicing  Production of film

Ethylhexyl methacrylate, 10 g of 2-ethylhexyl methacrylate and 15 g of 2-hydroxyethyl acrylate were copolymerized under 300 g of ethyl acrylate solvent to obtain a copolymer having a weight average molecular weight of 850,000, 10 g of an acrylic isocyanate compound as a photo-curable material was added to obtain a reaction product. Thereafter, 10 parts by weight of the polyfunctional isocyanate oligomer and 1 g of Darocker TPO as a photoinitiator were mixed to prepare an ultraviolet-curable pressure-sensitive adhesive composition C. The pressure-sensitive adhesive composition C was analyzed by DSC and the Tg was measured at -47 캜.

The ultraviolet-curing pressure-sensitive adhesive composition was coated on a release-treated polyester film having a thickness of 38 mu to a thickness of 10 mu m after drying and dried at 110 DEG C for 3 minutes. The dried adhesive layer was laminated to each of the base films described in Table 1 below to prepare a dicing film.

(2) Die bonding  Production of film

, 90 parts by weight of a high molecular weight aliphatic epoxy resin (SA-71, available from LG Chemical Co., Tg 20 ° C, weight average molecular weight 850,000), 30 parts by weight of an aliphatic epoxy resin (novolak type epoxy resin, softening point 94 ° C.) 20 parts by weight of a phenol resin (phenol novolac resin, softening point 94 占 폚), 0.1 part by weight of a mid-temperature onset hardening accelerator (2-methylimidazole), 0.5 parts by weight of a hot- A composition consisting of 20 parts by weight of silica (fused silica, average particle size of 75 mm) as a filler and methyl ethyl ketone were mixed with stirring to prepare a varnish. The varnish was applied to a base film (SKC, RS-216) having a thickness of 38 mu m and dried at 110 DEG C for 5 minutes to prepare a die-bonding film D having a coating film thickness of 20 mu m.

(3) Dicing Die bonding  Production of film

The dicing film and the die bonding film were laminated using a pole laminator (Fujishoko Co., Ltd.) at 30 DEG C under the condition of 5 kgf / cm &lt; ² &gt; and cut into a circular shape to produce a dicing die bonding film.

Comparative Example  1 to 3

A dicing film, a die bonding film and a dicing die bonding film were produced in the same manner as in Example 1, except that the base films described in Table 1 were used.

The composition of the base film The base film
Film thickness (um) Example 1 Ethylene-methacrylic acid-octyl acrylic ester Zn ionomer 100 Example 2 Ethylene-methacrylic acid-hexyl acrylic ester Zn ionomer 100 Example 3 A crosslinked product of an ethylene-dodecyl acrylate copolymer 110 Example 4 A crosslinked product of an ethylene-butyl acrylate copolymer 70 Comparative Example 1 Ethylene-alpha-octyl olefin copolymer 100 Comparative Example 2 Ethylene-vinyl acetate copolymer 100 Comparative Example 3 Ethylene-methacrylic acid Na ionomer 100

[ Experimental Example : Substrate film and Dicing Die bonding  Measurement of physical properties of film]

Experimental Example  One: tear force  Measure

Tear Strength - ASTM D624 Plastic Test Standard. "Specifically, the base film was cut into pieces each having a length of 150 mm and a width of 20 mm to prepare a specimen, and the lengthwise left end portion After cutting the 50 mm portion, the cut ends of the divided pieces were pulled 180 degrees using a texture analyzer to measure the force required to tear the film.

Experimental Example 2 : Break Elongation  Measure

After each specimen was manufactured according to ASTM D-638, the specimen was stretched at a rate of 100 mm / min using a universal testing machine (UTM, model name: Zwick Z010) until the specimen was broken, And the elongation at break was calculated.

Elongation at break (%) Tear force [gf] Example 1 560 132 Example 2 510 68 Example 3 900 45 Example 4 480 151 Comparative Example 1 1600 680 Comparative Example 2 1100 350 Comparative Example 3 380 61

As shown in Table 2, it was confirmed that the base film of the dicing film of Example had a breaking elongation of 480 to 900% and a tear strength of 45 to 151 gf. On the other hand, the base films of the dicing films of Comparative Examples 1 and 2 have an excessively high elongation at break and tear strength, so that the film is easily stretched during the expansion process for picking up the chips after dicing, Thus, the pickup efficiency is lowered and the tear strength is too high during the process of dicing the wafer, so that the wafer can not be cut cleanly, resulting in excessive burrs, such as cuts. In addition, the comparative example 3 has a fracture elongation of merely 380%, which tends to be torn easily during the film production process, and can be torn easily during the expansion process for picking up the diced chip.

Experimental Example  3: Burr  Characterization

An 8 inch 80 um thick mirror wafer and wafer ring were attached to a dicing die bonding film manufactured between 60 ° C using a mounter. The cut depth (the thickness of the uncut portion of the substrate film) at rpm 45,000, feeding speed 70 mm / sec, and chip size 8 mm x 8 mm using the dicing machine (DFD-650) And 85 mm for Comparative Examples 1 to 3, 95 mm for Example 3, and 55 mm for Example 4, and then the surface of the die was observed with a microscope to confirm the number of burrs. If the number of detected burrs is more than 5% and 10% or more, it is evaluated as bad.

Experimental Example  4 : Expending  And pick-up characteristic measurement

The diced wafer attached die-bonding film was irradiated with UV at a dose of 200 mJ / cm ² using a UV irradiation equipment. Thereafter, using a pickup device (Shinkawa, SPA-400), the expanse height was 5 mm to check whether the film was damaged. After that, the pin height was set to 0.3 mm to confirm the pickup success rate. It was rated excellent when the pickup success rate was 95% or more, bad when it was 85% or more and less than 95%, and poor when it was less than 85%.

division Burr characteristics Film Damage Pick-up characteristics Example 1 Great radish Great Example 2 Great radish Great Example 3 Great radish Great Example 4 Great radish Great Comparative Example 1 usually radish Bad Comparative Example 2 Bad radish Bad Comparative Example 3 Prize Yu (tearing) Great

As shown in Table 3, the examples showed excellent characteristics in terms of the burr characteristics, the film damage and the pickup characteristics, but the comparative examples show that the burr characteristics are poor, the film is damaged, and the pickup characteristics are poor I could.

Claims (11)

A crosslinked product of an ethylene-alkyl (meth) acrylic acid ester copolymer; And an ethylene- (meth) acrylic acid-alkyl (meth) acrylate ester ionomer; and an adhesive layer formed on at least one side of the substrate film,
Wherein the base film has a tear force of 200 gf or less, measured at a speed of 300 mm / min according to ASTM D624 Trouser method.
The method according to claim 1,
The tearing force of the base film measured at a speed of 300 mm / min by the ASTM D624 Trouser method is 30 gf to 180 gf.
The method according to claim 1,
The crosslinked product of the ethylene-alkyl (meth) acrylic acid ester copolymer is an ethylene repeat unit; And an ethylene repeating unit bonded with an alkyl (meth) acrylate ester having 1 to 10 carbon atoms.
The method according to claim 1,
Said ethylene repeat unit; And an ethylene repeating unit in which an alkyl (meth) acrylate ester having a carbon number of 1 to 10 is bonded, is obtained by copolymerizing the copolymer in the presence of a peroxide with an alkyl (meth) acrylate ester having 1 to 10 carbon atoms Wherein the polymer is a polymer formed by cross-linking.
The method according to claim 1,
The ethylene- (meth) acrylic acid-alkyl (meth) acrylate ester ionomer is one or more metals selected from the group consisting of zinc (Zn), calcium, barium, sodium (Na), and magnesium (Mg) And a dicing film.
The method according to claim 1,
Wherein the base film has a thickness of 50 占 퐉 to 150 占 퐉.
The method according to claim 1,
The elongation at break elongation of the base film measured at a speed of 100 mm / min according to ASTM D-638 standard is 400% to 1000%.
The method according to claim 1,
Wherein the adhesive layer comprises an ultraviolet curable pressure-sensitive adhesive or a thermosetting pressure-sensitive adhesive.
9. The method of claim 8,
The ultraviolet curable pressure-sensitive adhesive comprises a (meth) acrylate resin, an ultraviolet curable compound, a photoinitiator, and a crosslinking agent.
The dicing film of claim 1; And an adhesive layer formed on at least one side of the dicing film.
A dicing die-bonding film according to claim 10; And a wafer stacked on at least one side of the dicing die-bonding film, the pretreating step partially dividing or partially dividing the semiconductor wafer;
Exposing the semiconductor wafer after the preprocessing step; And
Irradiating the base film of the expanded semiconductor wafer with ultraviolet light, and picking up individual chips separated by the division of the semiconductor wafer.