KR20150032007A - Vertical led package and lighting deviece using the same - Google Patents

Abstract

An embodiment of the present invention relates to a vertical LED package and a lighting device using the same. The vertical LED package according to the embodiment of the present invention is a vertical LED package used for a headlight for a vehicle to emit light through a light emission part and includes: a substrate, at least one vertical LED which is arranged on the substrate, and a phosphor plate which is attached on the vertical LED. The area of the upper side of at least one vertical LED is larger than the area of the light emission part. The vertical LED package according to the embodiment of the present invention improves luminous efficiency by emitting the light through the whole light emission part.

Description

TECHNICAL FIELD [0001] The present invention relates to a vertical type light emitting device package and a lighting apparatus using the same.

An embodiment of the present invention relates to a vertical light emitting device package and a lighting apparatus using the same.

Generally, a lamp is a device that supplies or controls light for a specific purpose. As a light source of the lamp, an incandescent lamp, a fluorescent lamp, a neon lamp, or the like can be used. Recently, an LED (Light Emitting Diode) has been used.

LEDs are devices that change the electric signal to infrared rays or light by using the characteristics of compound semiconductors. Unlike fluorescent lamps, LEDs do not use harmful substances such as mercury and cause few environmental pollution causes. In addition, LEDs have longer lifespan and lower power consumption than incandescent bulbs, fluorescent lamps, and neon lights. In addition, the LED may have a good visibility due to a high color temperature and a low glare.

The lamp unit using the LED is widely adopted due to the above advantages and is used for a backlight, a display device, an illumination lamp or a head lamp, for example.

The lamp unit using the LED is suitable for use in a vehicle lamp because of its excellent visibility and low glare. This is because the vehicle recognizes the vehicle using the light emission of the lamp unit or can recognize the operation state of the vehicle from the outside so that the visibility of the lamp unit is excellent and the driver or pedestrian of the neighboring other vehicle can recognize the vehicle, This is because the operating status can be clearly identified.

The LED of such a lamp for a vehicle is generally a flip type or a vertical type. A flip-type light emitting device refers to a chip in which a bump is formed on a light emitting device without wire bonding, and the bump is brought into contact with a mounting substrate to connect the circuit of the chip and the substrate. The flip-type light emitting device is advantageous in size and weight because the size of the package is the same as the size of the light emitting device, but the light emitting efficiency is not as good as that of the vertical light emitting device. On the other hand, the vertical light emitting device has a structure suitable for a high output and has good heat radiation characteristics, but the mass production yield is not high yet, and there is a problem that an electrode is contaminated due to an adhesive used for bonding a plate to a light emitting device.

The embodiment provides a vertical light emitting device package in which reliability is improved and light emission unevenness is reduced by alleviating concentration of current.

Further, the embodiment provides a vertical type light emitting device package having a reduced heat resistance and an improved luminous flux retention.

In addition, the embodiment provides a vertical light emitting device package having a uniform color distribution.

Further, the embodiment provides a vertical light emitting device package capable of preventing the light emitting element from being contaminated by an adhesive.

Further, a vertical light emitting sofa package that can protect resin sealing property and wire bonding is provided.

Further, the embodiment provides a vertical type light emitting device package that has less light loss and can relieve stress applied to a wire neck portion.

The vertical type light emitting sofa package according to the embodiment is a vertical type light emitting device package used for a headlamp for a vehicle that emits light through a light emitting port and includes a substrate, at least one vertical light emitting element disposed on the substrate, And a phosphor plate attached on at least one vertical light emitting element, wherein an upper portion of the at least one vertical light emitting element has a larger area than the light output port. In the vertical light emitting device package according to this embodiment, light is emitted from the entire light output port, so that the light efficiency can be increased.

Here, the upper portion of each of the vertical light emitting elements may have a square shape, and the long side of the light output port standard may be approximately an integer multiple of the square side, and the short side of the light output port standard may be longer than the square side. In the vertical light emitting device package according to this embodiment, light is emitted from the entire light output port, so that the light efficiency can be increased.

Here, the upper portion of the vertical type light emitting device includes a first light emitting portion and a second light emitting portion, and the first light emitting portion corresponds to the light output port and emits light through the light output port, The plate may be attached to the first light emitting portion. In the vertical light emitting device package according to this embodiment, light is emitted from the entire light output port, so that the light efficiency can be increased.

Here, the phosphor plate may have a rectangular shape. The vertical type light emitting device package according to this embodiment does not require electrode processing or precise mounting for mounting the vertical type light emitting device, and the process is simple.

Here, the at least one vertical light emitting device may be four vertical light emitting devices. The vertical light emitting device package according to this embodiment can increase the light efficiency by reducing the non-light emitting portion.

And a light guide layer for guiding the light emitted from the second light emitting portion to be emitted through the light emission port. The vertical light emitting device package according to this embodiment also emits the light of the second light emitting portion together with the light of the first light emitting portion, so that the light efficiency can be further increased.

Here, the light guide layer may be disposed on the second light emitting portion. The vertical light emitting device package according to this embodiment can stably light the light from the second light emitting portion.

Here, the height of the phosphor plate may be 10 times the height of the inlet space. The vertical light emitting device package according to this embodiment is more effective in preventing the upper electrode of the light emitting device from being contaminated by the adhesive.

Here, the height of the phosphor plate is 0.8 mm, and the height of the inlet space may be 0.08 mm. The vertical light emitting device package according to this embodiment can improve the resin sealability and protect the wire bonding.

Here, the bottom of the phosphor plate is narrower than the upper portion of the vertical type light emitting device, and may have a larger area than the light emitting portion of the vertical type light emitting device. The vertical light emitting device package according to this embodiment can reduce non-light emitting portions and achieve uniform color distribution.

Here, the phosphor plate may be a glass plate containing a phosphor. The vertical light emitting device package according to this embodiment can improve the luminous flux retention ratio and display the desired color.

Here, the adhesive may include at least one of silicon, a fluororesin, and an inorganic paste. The vertical light emitting device package according to this embodiment can improve the reliability while improving the luminous flux retention rate.

Here, the substrate may include a first power supply lead electrically isolated from the first power supply lead and a second power supply lead, the vertical light emitting device may include a pair of the first electrodes, And the second electrode may be directly connected to the second power supply lead. The first power supply lead may be connected to the second power supply lead through a pair of wires. The vertical light emitting device package according to this embodiment can relieve the current concentration and improve the reliability and reduce the emission unevenness.

Here, the wire may include at least one of gold (Au), silver (Ag), copper (Cu), and aluminum (Al). The vertical light emitting device package according to this embodiment can improve the electrical conductivity while improving the light flux retention.

The vertical type light emitting device package according to the embodiment mitigates the concentration of current, thereby improving the reliability and reducing the emission unevenness.

Further, the heat resistance is small and the light flux retention ratio is improved.

Also, the color distribution is uniform.

Further, contamination of the light emitting element by the adhesive can be prevented.

Further, the resin encapsulation property and the wire bonding can be protected.

Further, the optical loss is small, and the stress applied to the wire neck portion can be relaxed.

1 is a perspective view of a vertical light emitting device package according to the first embodiment.
2 is a perspective view showing a light emitting device of the light emitting device package shown in FIG. 1 and a phosphor plate separated from each other.
3 is a table showing appearance and brightness distribution of a double-wire vertical light-emitting device, a single-wire vertical light-emitting device, and a flip-type light-emitting device.
4A and 4B are a side view and a plan view of the vertical light emitting device package shown in FIG.
FIG. 5A is a bottom perspective view of a phosphor plate of the vertical light emitting device package shown in FIG. 1, and FIGS. 5B to 5E show various embodiments of a receiving space capable of receiving an adhesive.
6A and 6B are a side view and a plan view of the phosphor plate shown in FIG. 5A.
FIG. 7A is a configuration diagram of a general illumination device, and FIG. 7B is a configuration diagram of a lighting device including a vertical light emitting device package according to the embodiment.
8 is a plan view showing a state after the test before the test of the vertical light emitting device package including the resin-type fluorescent substance.
9A and 9B are a perspective view and a side view of a vertical light emitting device package according to the second embodiment.
10A is a perspective view of a vertical light emitting device package used in a general lighting device, and FIGS. 10B and 10C are top views of the vertical light emitting device package of FIG. 10A.
FIG. 11A is a perspective view of a vertical light emitting device package according to a third embodiment used in the illumination device, and FIGS. 11B and 11C are plan views of the vertical light emitting device package of FIG.
FIG. 12A is a perspective view of a vertical light emitting device package according to a fourth embodiment used in the lighting apparatus, and FIGS. 12B and 12C are a plan view and a side view of the vertical light emitting device package of FIG.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of each component does not entirely reflect the actual size.

In the description of the embodiments according to the present invention, in the case where an element is described as being formed on "on or under" another element, the upper (upper) or lower (lower) (On or under) all include that the two elements are in direct contact with each other or that one or more other elements are indirectly formed between the two elements. Also, when expressed as "on or under", it may include not only an upward direction but also a downward direction with respect to one element.

Hereinafter, a light emitting module according to an embodiment will be described with reference to the accompanying drawings.

FIG. 1 is a perspective view of a vertical light emitting device package according to a first embodiment, and FIG. 2 is an exploded perspective view in which a light emitting device and a phosphor of the vertical light emitting device package shown in FIG. 1 are separated.

1 and 2, the vertical light emitting device package 10 according to the first embodiment may include a substrate 100, a vertical light emitting device 200, and a phosphor plate 300.

As shown in FIGS. 1 and 2, at least one vertical light emitting device 200 may be disposed on the substrate 100. The phosphor plate 300 may be attached to each light emitting element 200 by an adhesive 500.

The substrate 100 serves as a body of the light emitting device package 10 and may be various types such as a PCB (Printed Circuit Board), a silicon wafer, and a resin. Further, the substrate 100 may be classified into a plastic package, a ceramic package, a metal package, or the like depending on the material used.

An insulating layer (not shown) may be disposed on the substrate 100. The insulating layer serves to cut off the electrical connection between the substrate 100 and other components. However, when the substrate 100 is made of a nonconductive material, it is not necessary to dispose the insulating layer.

A first power supply lead 110 and a second power supply lead 120 may be disposed on the substrate 100. The first power supply lead 110 and the second power supply lead 120 are electrically separated from each other and electrically connected to the vertical light emitting device 200, respectively. The first power supply lead 110 and the second power supply lead 120 may be formed of one or more vertical light emitting devices 200 so that the vertical light emitting devices 200 are connected to each other .

The vertical light emitting device 200 may be disposed on the substrate 100. The vertical light emitting device 200 may be a light emitting diode (LED), but is not limited thereto. The light emitting diode may be a red, green, blue, or white light emitting diode that emits red, green, blue, or white light, respectively, but is not limited thereto.

Light emitting diodes are a type of solid element that converts electrical energy into light and typically includes an active layer of semiconductor material interposed between two opposing doping layers. When a bias is applied to both ends of the two doped layers, holes and electrons are injected into the active layer and then recombined to generate light. Light emitted from the active layer is emitted in all directions or in a specific direction, And is discharged outside.

The vertical light emitting device 200 may include an upper electrode 210 and a lower electrode 220. The upper electrode 210 of the vertical light emitting device 200 may be connected to the first power supply lead 110 and the lower electrode 220 may be connected to the second power supply lead 120. The upper electrode 210 may be connected to the second power supply lead 120 and the lower electrode 220 may be connected to the first power supply lead 120 although not shown in the drawing.

The upper electrode 210 of the vertical light emitting device 200 may be connected to the first power supply lead 110 by a wire 400 and the lower electrode 220 may be directly connected to the second power supply lead 120 .

The vertical type light emitting device 200 of the vertical type light emitting device package 10 according to the first embodiment has a structure in which the upper electrode 210 is connected to the first power supply lead 110 by two wires, Device. By using the double wire vertical light emitting element, it is possible to prevent the current from concentrating more than the single wire vertical light emitting element or the flip light emitting element. Thereby, there is an effect that the reliability is improved and the unevenness caused by the light emission can be reduced.

A double wire vertical light emitting device, a single wire vertical light emitting device, and a flip light emitting device will be described in detail. Table 1 and FIG. 3 show a comparison with a flip-type light emitting device, a single wire vertical light emitting device, and a double wire vertical light emitting device.

Vertical type light emitting element
(Double wire) Vertical type light emitting element
(Single wire) Flip-type light emitting element Plate Mounting X △ O Resistance O O X Current diffusion O X O

As can be seen from Table 1 and FIG. 3, the double-wire vertical type light emitting device is more uniformly distributed over the entire light emitting device than the single-wire vertical type light emitting device and the flip type light emitting device. Thus, there is an advantage that the reliability of light emission is enhanced and the color deviation is reduced. Further, the double-wire vertical type light emitting device has an excellent heat radiation property, a high luminous efficiency, and a good heat resistance. For example, the thermal resistance of the flip-type light emitting device is 2.3 占 폚 / W, while the thermal resistance of the vertical light emitting device 200 is 1.5 占 폚 / W. Therefore, the vertical type light emitting device 200 has an effect of improving the reliability as compared with the flip type light emitting device.

1 and 2, the upper electrode 210 of the vertical light emitting device 200 may be connected to the first power supply lead 110 through a wire 400. [ That is, the upper electrode 210 includes two electrodes 210a and 210b, and may be connected to the first power supply lead 110 and the two wires 400a and 400b.

The phosphor plate 300 is a plate containing a fluorescent material for dispersing light generated in the active layer of the vertical light emitting device 200 and is disposed on the upper portion of the vertical light emitting device 200. An adhesive 500 is applied to the lower part of the phosphor plate 300 and the phosphor plate 300 is disposed on the upper part of the vertical light emitting device 200 by the adhesive 500.

As shown in FIGS. 1 and 2, the phosphor plate 300 may be formed to cover the remaining portion of the upper portion of the vertical type light emitting device 200 except for the two upper electrodes 210a and 210b. The two upper electrodes 210a and 210b of the vertical light emitting device 200 may be formed at an edge close to the first power supply lead 110. [ When the two upper electrodes 210a and 210b are formed at the corners near the first power supply leads 110, the length of the wires connecting the first power supply leads 110 can be reduced. Two corners of the corners of the phosphor plate 300 that are close to the first power supply lead 110 may be formed so as not to cover the upper electrodes 210a and 210b.

4A and 4B are a side view and a plan view showing the specifications of the vertical light emitting device 200 and the phosphor plate 300 according to the first embodiment.

4A and 4B, the height of the vertical light emitting device 200 is 0.12, and the height of the phosphor plate 300 is 0.2 days, when the horizontal and vertical sizes of the vertical light emitting device 200 are 1, respectively. have. The phosphor plate 300 may have a square shape having a width of 0.98 and a width of about 0.98 so that the phosphor plate 300 has two corners so as not to cover the upper electrodes 210a and 210b. The concave recesses 310a and 310b may be formed toward the center of the concave portion 310a. In addition, the light emitting unit 240, which substantially emits light in the vertical light emitting device 200, may be formed such that two edges are concave toward the center of the light emitting unit 240 in a square having a width of 0.935 and a length of 0.935 .

4A and 4B, the sizes of the light emitting device 200, the phosphor plate 300, and the light emitting unit 240 may be the same as those of the light emitting device 200> the phosphor plate 300> the light emitting unit 240 However, the present invention is not limited to the above numerical values.

If the size of the light emitting element 200 is larger than the size of the phosphor plate 300 as in the first embodiment, the light emitting element 200 can stably support the phosphor plate 300. If the size of the phosphor plate 300 is larger than the size of the light emitting unit 240, the entire light generated in the active layer of the light emitting device 200 can be emitted through the phosphor plate 300. Therefore, according to the first embodiment, there is an effect that the uniformity of the color distribution can be achieved while attaining the stability of the entire structure. Therefore, the light emitting device package according to the first embodiment has high reliability and low color deviation. In addition, the light emitting device package according to the first embodiment can realize an LED light source having low thermal resistance.

The wire 400 can be selected in consideration of the reliability, productivity, cost, performance, and the like of the product. As the material of the wire 400, metals such as gold (Au), silver (Ag), copper (Cu), and aluminum (Al)

The adhesive 500 may be made of a heat-resistant or light-resistant material. For example, it may be silicon, fluorine resin, or inorganic (glass) paste.

When the adhesive 500 has a high heat resistance and a high light resistance, the reliability of the light emitting device package is improved, so that the light flux maintaining rate can be improved.

The phosphor plate 300 is adhered to the vertical light emitting device 200 by the adhesive 500 so that the light is emitted into the gap between the phosphor plate 300 and the vertical light emitting device 200 It can prevent leaking. The phosphor plate 300 is stuck to the vertical light emitting device 200 so that the phosphor plate 300 can steadily light the light of the vertical light emitting device 200. [

FIG. 5A is a bottom perspective view of the phosphor plate 300 according to the first embodiment, and FIGS. 6A and 6B are a side view and a plan view of the phosphor plate.

5A, 6A, and 6B, a space may be formed along the sides of the phosphor plate 300. As shown in FIG. When the phosphor plate 300 is applied by the adhesive agent 500, the adhesive agent 500 may be introduced into the space formed along the sides. According to the embodiment shown in FIG. 5A, a groove 310 as an insertion space for the adhesive material is formed on the adhesive surface of the phosphor plate 300 to which the adhesive 500 is applied. The grooves 310 are recessed along the sides of the bottom of the phosphor plate 300. The grooves 310 may receive the adhesive 500. The inlet space of the phosphor plate 300 according to the first embodiment is not limited to the shape of the groove 310 shown in FIG. 5A, and various types of structures capable of forming a space capable of accommodating the adhesive 500 . Figures 5B-5E illustrate various embodiments of the receiving space in which the adhesive can be received. 5B, the cross section of the inlet space has a square shape. Since the cross section is square, the efficiency of accommodating the adhesive relative to the area is high. As shown in Fig. 5C, the lead-in space has a shape whose cross section is arc-shaped. When the cross section is circular arc, there is no angular part, so there is little possibility of cracking. As shown in FIG. 5D, the entry space has a straight line shape whose cross section is sloped like a knife. That is, the cross section has a shape of a right triangle. Since the cross section of the inlet space is straight, processing is easy. 5E, a plurality of insertion spaces may be formed on the bottom sides of the phosphor plate 300 at regular or non-uniform intervals. Since the lead-in space may not be formed entirely on the bottom side, it is possible to contradict the efficiency deterioration due to the formation of the lead-in space and the effect of the acceptance of the adhesive.

The inlet space 310 may be formed along the rim of the bottom surface of the phosphor plate 300. In addition, the entry space 310 may be formed with a predetermined width, and the predetermined width may be a constant value. For example, when the width and height of the light emitting element 200 are assumed to be 1, the height, i.e. thickness, of the phosphor plate 300 is 0.2, the width and length are 0.98, the height of the entry space 310 is 0.02, 0.04. When the height of the entry space 310 is 0.01 and the width is 0.04, it is stable and efficient for receiving the adhesive. Since the thickness of the adhesive material 500 is about 0.003 mm to 0.006 mm, the height of the inlet space in which the adhesive material 500 is received is preferably 0.01 mm or more. The width of the lead-in space 1 may be 0.04 mm so as to be approximately equal to the excess amount of the adhesive 500 when the phosphor plate 300 is mounted.

However, the size of the phosphor plate 300 and the lead-in space 310 is not limited to the above-described numerical values, and may be varied depending on the size of the light emitting device 200 and the characteristics of the adhesive material 500.

The receiving space 310 according to the first embodiment may be formed to accommodate the adhesive 500. Before the wire 400 is bonded to the upper electrode 200 when the amount of the applied adhesive 500 is larger than the proper amount or the adhesive 500 is not properly applied, The adhesive 500 may contaminate the upper electrodes 210a and 210b of the vertical light emitting device 200 in the process of being disposed on the upper portion of the light emitting device 200. [ The entry space 310 can prevent the adhesive 500 from leaking to the outside of the phosphor plate 300 by receiving the adhesive 500 or the adequately unapplied adhesive 500 exceeding the proper amount. Accordingly, the upper electrodes 210a and 210b may be protected from the adhesive 500 applied to the plate 300. [ In addition, the wire bonding performance (W / B) is improved by preventing the electrodes of the vertical light emitting device 200 from being contaminated.

4A to 6B, the size of the light emitting unit 240, the size of the light emitting unit 240, the size of the light emitting unit 240, the size of the light emitting unit 240, ) ≪ the size of the vertical light emitting device 200 can be established. Therefore, the encapsulation of the resin is improved and the W / B performance is guaranteed.

On the other hand, the phosphor plate 300 according to the first embodiment may be a glass plate containing a phosphor. Accordingly, since the glass plate 300 contains the fluorescent material without dispersing the fluorescent material in the plate or using the encapsulant containing the fluorescent material, the luminous flux retention rate can be improved. Therefore, the reliability of the light emitting device package is improved.

FIG. 7A is a schematic view of a vehicle headlamp including a general vertical light emitting device package 1, and FIG. 7B is a schematic view of a headlamp including the vertical light emitting device package 10 according to the first embodiment.

7A, a vertical light emitting device package 1 used in a vehicle headlamp includes a light emitting device on a substrate, an AR (anti glare) glass on an upper part of the light emitting device package, The inside is filled with a phosphor resin.

However, referring to Fig. 7B, the phosphor plate 300 according to the first embodiment may have a thickness of 80 mu m or more, and may have a resin pouch having no permeability. Therefore, since the AR glass is not used, the cost can be reduced and the light emitting device 200 and the phosphor plate 300 are in intimate contact with each other, so that leakage of blue light can be prevented.

In addition, the glass surface of the phosphor plate 300 according to the first embodiment may be subjected to an antistatic treatment. The surface resistance value by the antistatic treatment may be 10 ¹⁰ Ω or less. For reference, the surface resistance value of general glass is 10 ¹⁰ ~ 10 ¹² Ω. Therefore, the phosphor plate 300 according to the first embodiment can prevent contaminants such as dust from adhering to the glass surface.

8 shows a resin-type phosphor used in a general light emitting device package.

(A) After the test for 1000 hours under the test conditions of the ambient temperature Ta = 85 캜, the junction temperature Tj = 150 캜, the humidity = 85%, and the forward current If = 1000 mA, the phosphor before the test (b) It can be seen that a crack is generated in the phosphor layer. However, the phosphor plate 300 according to the first embodiment may be a glass plate, not a resin. In this case, cracks do not occur in the phosphor layer, and reliability is improved.

Next, the second embodiment will be described.

≪ Second Embodiment >

The light emitting device package 11 according to the second embodiment may include a substrate 100, a vertical light emitting device 200, and a phosphor plate 300.

Since the substrate 100, the vertical light emitting device 200, and the phosphor plate 300 are the same as those described in the first embodiment, a detailed description thereof will be omitted.

9A and 9B are a perspective view and a side view of the light emitting device package 11 according to the second embodiment.

Referring to FIGS. 1, 2, 9A and 9B, a bump 230 for preventing the upper electrode 210 from being contaminated by the adhesive 500 is formed on the upper electrode 210 of the vertical light emitting device 200 .

Bumps 230a and 230b may be formed on the two upper electrodes 210a and 210b formed on the vertical light emitting device 200 as shown in FIGS. 1, 2, 9A and 9B. The phosphor plate 300 is disposed on the upper portion of the vertical type light emitting device 200 when the amount of the adhesive 500 applied to the bottom surface of the phosphor plate 300 is greater than the proper amount or the adhesive material 500 is not properly applied The adhesive 500 may contaminate the upper electrodes 210a and 210b of the vertical type light emitting device 200. [ The bump 230 can prevent the upper electrode 210 from being contaminated by the adhesive 500 by surrounding the upper electrode 210 to which the wire 400 is connected. The bump 230 may be formed to surround a part of the upper electrode 210 and the bump 230 may be formed to surround the entire upper electrode 210 in order to completely block the contamination by the adhesive 500 It is possible.

The vertical type light emitting device package according to the second embodiment is characterized in that the upper electrode 210 of the vertical type light emitting device 200 to which the wire 400 is connected before the phosphor plate 300 is attached to the vertical type light emitting device 200 Bumps 230 are formed to surround the bonding sites. Accordingly, the upper electrode 210 is prevented from being contaminated by the adhesive 500 during the process of attaching the phosphor plate 300 to the light emitting device 200. Further, since the electrodes of the vertical light emitting device 200 are prevented from being contaminated, the wire bonding performance (W / B) is improved.

The bumps 230 may be formed in various shapes. For example, it may be a spherical shape or a polygonal shape such as a hexahedron. The bump 230 may be formed by bump plating, but is not limited thereto. The bumps 230 may be made of metal. In particular, the bump 230 may be formed of gold having good oxidation resistance, but is not limited thereto.

Next, a description will be given of a third embodiment which is an illumination device including vertical light emitting elements according to the first and second embodiments.

≪ Third Embodiment >

10A to 10C show a vertical light emitting device package 1 used as a lamp for a vehicle.

As shown in Figs. 10A to 10C, the short side and the long side of the light output port of the vehicle lamp used as the headlamp are optically designed to be 1 mm and 4 to 6 mm, respectively, according to the vehicle. In the present specification, a description will be given of the case where the light output port has a short side of 1 mm and a long side of 5 mm.

On the other hand, since a vehicle lamp is driven at a high temperature, the inorganic material of the vertical type light emitting device package, in particular, the phosphor layer is becoming inorganic, and the size of the phosphor plate is also increasing.

Referring to FIGS. 10A to 10C, it can be seen that a general automotive lamp 1 may have five light emitting elements arranged in a line, each having a square of 1 mm in width and 1 mm in length. That is, the vertical light emitting device package 1 is mounted in accordance with the size of the light output port through which light is emitted from the vehicle lamp. However, in this case, light is not emitted from the upper electrodes 2a and 2b of the light emitting device. This can be seen from the luminance distribution diagram of the double-wire vertical light emitting device of Table 1 and FIG. That is, in the vertical light emitting device package 1 used for a general vehicle lamp, light emitted from the light emitting device is emitted from the upper electrodes 2a and 2b of the respective light emitting devices to which the wires are connected during the discharge of the light through the phosphors. It does not. Therefore, in the vertical light emitting device package 1 used for general vehicle lamps, light can not be emitted from the entire light output port. Further, in order to mount the phosphor plate, it is necessary to process the electrode of the vertical type light emitting element and to provide an accurate mounting apparatus.

11A to 11C show a vertical light emitting device package 10 according to the third embodiment.

11A to 11C, the vertical type light emitting device package 10 according to the third embodiment can mount a light emitting device having a larger size than the light emitting devices shown in FIGS. 10A to 10C in order to increase the light efficiency have. That is, the vertical light emitting device package according to the third embodiment may have a configuration in which four vertical light emitting devices are arranged.

11A to 11C, the upper portion of the vertical light emitting device 200 may be formed in a square shape. The upper portion of each of the vertical light emitting devices 200 according to the embodiment of the present invention may have a square shape and the long side of the light emitting hole standard may be approximately an integral multiple of the square side of the upper portion of the vertical light emitting device 200. In addition, the short side of the light exit aperture standard may be longer than the square side. The phosphor plate 300 is attached to the upper portion of the light emitting device 200. The light emitting unit 240 of the vertical light emitting device 200 is connected to the first light emitting unit 241 through which the light is emitted through the light emitting port of the vehicle lamp and the second light emitting unit 242 excluding the first light emitting unit 241, The phosphor plate 300 of the vertical type light emitting device package 10 according to the third embodiment may be formed only on the upper portion of the first light emitting portion 241 and thus electrode processing and precise mounting are not required.

11A to 11C, the second light emitting portion 242 is located between the first upper electrodes 210a and 210b, the first light emitting portion 241 is located between the second light emitting portion 242 and the first light emitting portion 241, And may have a rectangular shape except for the upper electrodes 210a and 210b. The light emitted from the entire area of the first light emitting portion 241 is emitted through the light output port because the light output port of the vehicle lamp according to the third embodiment is formed to fit the first light emitting portion 241. Therefore, . In the vertical type light emitting device package 1 shown in FIGS. 10A to 10C, since the number of the light emitting devices is five, the interval between the light emitting devices which are not light emitting portions is four. However, Since the package 10 has four light emitting elements, the spacing between the light emitting elements is reduced to four, and the light efficiency is further enhanced.

11A to 11C show an embodiment in which the vertical light emitting device 200 has a square shape, but it is not necessarily limited to a square shape. That is, as shown in FIGS. 11D and 11E, the vertical light emitting device 200 may have a rectangular shape. For example, as shown in Figs. 11D and 11E, the vertical light emitting device 200 may be a rectangle having a long side in the direction of the long side of the light output port or a rectangle having a long side in the short side direction. At this time, the number of light emitting elements may also be changed depending on the shape of the light emitting element. Further, as shown in FIG. 11F, the vertical type light emitting element of FIG. 11D and the vertical type light emitting element of FIG. 11E may be mixed and arranged.

≪ Fourth Embodiment &

12A to 12C show a vertical light emitting device package 10 in which a light guide layer is formed on a second light emitting portion 242 of the vertical light emitting device package 10 shown in FIGS. 11A to 11C. 11A to 11C, the light emitted from the first light emitting portion 241 of the phosphor plate 300 is emitted through the light exit port while the light of the second light emitting portion 242 is emitted It can not be released.

12A to 12C, the vertical light emitting device package 10 according to the fourth embodiment further includes a light guide layer 700 for guiding light of the second light emitting portion 242 through the light output port . The light guide layer 700 may be formed on the second light emitting portion 242. Accordingly, the light emitted from the second light emitting portion 242 is stably outputted by the light guide layer 700, which further enhances the light efficiency.

12A to 12C, the vertical light emitting device package 10 according to the fourth embodiment reflects light emitted to the side surfaces of the phosphor plate 300 or the light guide layer 700, And may further include a reflective layer and a wire protection layer 800 for protecting the wire 400.

12C, the vertical light emitting device package 10 includes a substrate 100, a vertical light emitting device 200 positioned on the substrate, a phosphor plate 300 formed on the vertical light emitting device 200, And the vertical light emitting device 200 may be connected to the first power supply lead 110 and the second power supply lead 120 formed on the substrate 100. An upper electrode 210 is formed on the upper electrode 200 and a wire 400 can connect the upper electrode 210 and the first power supply lead 110. Since the structure of the vertical light emitting device package 10 is as described above, a detailed description thereof will be omitted.

The light guide layer 700 may reflect or refract light emitted from the second light emitting portion 242 and send the light to the light output port. For example, the light guide layer 700 can totally reflect light incident from the second light emitting portion 242. [ Therefore, the refractive index of the light guide layer 700 is larger than the refractive index of the reflection and wire protection layer 800. For example, since the refractive index of the phosphor plate 300 is 1.4 and the refractive index of gallium nitride (GaN) constituting the reflection and wire protection layer 800 is 2.5, the refractive index of the light guide layer 700 is preferably 1.4 to 2.5 Do. The incident angle from the second light emitting portion 242 to the light guide layer 700 may be greater than a predetermined angle in accordance with the refractive index ratio of the light guide layer 700 and the reflection and wire protection layer 800.

In addition, the light guide layer 700 may be formed in an arc shape as shown in FIG. 12C, but it is not limited thereto. For example, the light guide layer 700 may be an arc shape or a sloped straight line having a slope in order to totally reflect light from the second light emitting portion 242 to the light exit aperture.

The light guide layer 700 of the vertical light emitting device package 10 according to the fourth embodiment may be formed with high ductility. Therefore, the stress applied to the wire 400 located in the light guide layer 700 can be reduced.

The light guide layer 700 of the vertical light emitting device package 10 according to the fourth embodiment may be formed of a soft material. For example, the light guide layer 700 may be made of at least one of high refractive index silicone gel and silicone rubber. The light guiding layer 700 made of a soft material may be formed on the upper electrode 210 and the second light emitting portion 242 to relieve the stress applied to the wire neck portion.

For example, the light guide layer 700 of the vertical light emitting device package 10 according to the fourth embodiment is formed by using a resin having a low hardness in order to prevent problems such as wire breakage due to stress that may occur in the wire . The hardness of the resin may vary depending on the constitution of the package, but it is preferable that the hardness of the resin is generally less than or equal to the shore hardness A50.

Generally, the wires for bonding with the upper electrodes 210a and 210b are weak to break, and in particular, the stress applied to the wire neck portion is the highest. Therefore, the vertical light emitting device package 10 according to the fourth embodiment can relieve the stress applied to the wire neck portion by increasing the ductility of the light guide layer 700. [ Therefore, there is an effect that the breakage of the wire is prevented and the life of the wire is increased.

On the other hand, the formation of the soft light guide layer 700 on the vertical light emitting device 200 is not necessarily applied to the vertical light emitting device. The light emitting element in which the light guide layer is formed can be applied to other types of light emitting elements other than the vertical light emitting element. That is, by adding a resin having a low hardness, the stress applied to the wire bonded to the electrode of the light emitting element can be relaxed.

For example, the light emitting device package may include a substrate including at least one power supply lead, a light emitting element disposed on the substrate and including at least one electrode connected to the at least one power supply lead through a wire, And a light guide layer disposed on the light emitting element and guiding light from the light emitting element and containing a resin having a low hardness.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that various variations and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

100: substrate
200: vertical type light emitting element
300: phosphor plate
400: wire
500: Adhesive
700: light guide layer
800: reflective layer and wire protection layer

Claims (15)

A vertical light emitting device package for use in a vehicle headlamp that emits light through a light output port,
Board;
At least one vertical light emitting device disposed on the substrate; And
A phosphor plate attached to the at least one vertical light emitting element;
Lt; / RTI >
Wherein the upper portion of the at least one vertical light emitting device has a larger area than the light output port,
Vertical type light emitting device package. The method according to claim 1,
Wherein the upper side of each of the vertical light emitting elements is a square shape, the long side of the light output port standard is approximately an integer multiple of the square side, the short side of the light output port standard is longer than the square side,
Vertical type light emitting device package. The method according to claim 1,
The upper portion of the vertical type light emitting device includes a first light emitting portion and a second light emitting portion,
Wherein the first light emitting portion emits light through the light output port so as to correspond to the light output port,
Wherein the phosphor plate is attached to the first light emitting portion,
Vertical type light emitting device package. The method of claim 3,
Wherein the phosphor plate has a rectangular shape,
Vertical type light emitting device package. The method according to claim 1,
Wherein the at least one vertical light emitting device is four vertical light emitting devices,
Vertical type light emitting device package. The method of claim 3,
And a light guide layer for guiding light emitted from the second light emitting portion to be emitted through the light emission port,
Vertical type light emitting device package. The method according to claim 6,
Wherein the light guide layer is disposed on the second light emitting portion,
Vertical type light emitting device package. The method according to claim 1,
Wherein the height of the phosphor plate is 10 times the height of the space,
Vertical type light emitting device package. 9. The method of claim 8,
Wherein the height of the phosphor plate is 0.8 mm, the height of the space is 0.08 mm,
Vertical type light emitting device package. The method according to claim 1,
The bottom of the phosphor plate is narrower than the upper portion of the vertical type light emitting device and has a larger area than the light emitting portion of the vertical type light emitting device,
Vertical type light emitting device package. The method according to claim 1,
Wherein the phosphor plate is a glass plate containing a phosphor,
Vertical type light emitting device package. The method according to claim 1,
The phosphor plate is attached to the vertical type light emitting device by an adhesive containing at least one of silicon, fluororesin, and inorganic paste
Vertical type light emitting device package. The method according to claim 1,
Wherein the substrate includes a first power supply lead and a second power supply lead electrically separated from each other,
The vertical light emitting device includes:
The first electrode is connected to the first power supply lead through a pair of wires and the second electrode is connected directly to the second power supply lead, ,
Vertical type light emitting device package. 14. The method of claim 13,
Wherein the wire comprises at least one of gold (Au), silver (Ag), copper (Cu), and aluminum (Al)
Vertical type light emitting device package. A lighting device comprising a vertical light emitting device package according to any one of claims 1 to 14.

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