WO2015041435A1 - Vertical-type light-emitting device package - Google Patents

Abstract

One embodiment relates to a vertical-type light-emitting device package. The vertical-type light-emitting device package, according to one embodiment, comprises: a substrate; a vertical-type light-emitting device disposed on the substrate; a fluorescent substance plate disposed on the vertical-type light-emitting device and having a space formed along at least one side of a lower part thereof; and an adhesive material disposed between the vertical-type light-emitting device and the fluorescent substance plate and in the space of the fluorescent substance plate.

Description

Vertical LED Package

An embodiment relates to a vertical light emitting device package.

Generally a lamp is a device that supplies or regulates light for a specific purpose. As a light source of a lamp, an incandescent bulb, a fluorescent lamp, a neon lamp, or the like may be used. Recently, a light emitting diode (LED) has been used.

LED is a device that changes the electric signal to infrared or light by using the compound semiconductor characteristics, unlike fluorescent lamps do not use harmful substances such as mercury, so there is little cause of environmental pollution. In addition, LEDs have a longer life and consume less power than incandescent, fluorescent, and neon lights. In addition, the LED may have the advantage of excellent visibility and less glare due to the high color temperature.

Lamp units using LEDs are widely adopted by the above advantages, and are used, for example, in backlights, display devices, lighting lamps, or head lamps.

Lamp units using LEDs are suitable for use in vehicle lamps due to their excellent visibility and low glare. Because the vehicle can recognize the vehicle or the driving state of the vehicle from the outside by using the light emission of the lamp unit, if the visibility of the lamp unit is excellent and the glare is small, the driver or the pedestrian of another adjacent vehicle can recognize the vehicle or This is because the driving state can be clearly identified.

Such LEDs of a vehicle lamp are generally of the flip type or of the vertical type. The flip type light emitting device refers to a chip in which a bump is formed on the light emitting device without wire bonding and then the bump is contacted with the mounting substrate to connect the chip and the circuit of the substrate. The flip type light emitting device is advantageous in size and weight because the package size is the same as the size of the light emitting device, but the light emitting efficiency is not as good as that of the vertical light emitting device. On the other hand, the vertical light emitting device has a structure suitable for high output and good heat dissipation characteristics, but the yield is not high yet, in particular, there is a problem that the electrode is contaminated due to the adhesive used to adhere the plate to the light emitting device.

Embodiments provide a vertical light emitting device package in which the concentration of current is relaxed to improve reliability and reduce light emission unevenness.

In addition, the embodiment provides a vertical light emitting device package having low thermal resistance and improved luminous flux maintenance.

In addition, the embodiment provides a vertical light emitting device package with uniform color distribution.

In addition, the embodiment provides a vertical light emitting device package capable of preventing contamination of the light emitting device by the adhesive material.

In addition, the present invention provides a vertical light emitting package capable of protecting resin encapsulation and wire bonding.

In addition, the embodiment provides a vertical light emitting device package with low light loss and capable of alleviating stress applied to a wire neck portion.

In one embodiment, a vertical light emitting device package includes a substrate; A vertical light emitting device disposed on the substrate; A phosphor plate disposed on the vertical light emitting device and having a space formed along at least one side of a bottom portion thereof; And an adhesive disposed between the vertical light emitting device and the phosphor plate and disposed in a space of the phosphor plate.

Here, the space may be a recessed groove along the side of the bottom of the phosphor plate.

Here, the space may have a square cross section along the side of the bottom of the phosphor plate.

Here, the space may be a groove in which a cross section is concave in an arc shape along the side of the bottom of the phosphor plate.

Here, the space may have a right triangle along a side of the bottom of the phosphor plate.

Here, the space may be formed in plural, with a predetermined interval along the side of the bottom of the phosphor plate.

Here, the space may be formed with a predetermined width along the edge of the bottom portion.

Here, the bottom surface of the phosphor plate may have a smaller area than the top surface of the vertical light emitting device, and may have a larger area than the light emitting part of the vertical light emitting device.

Here, the phosphor plate may be a glass plate containing phosphor.

Herein, the substrate includes a first power supply lead and a second power supply lead electrically separated from each other, and the vertical light emitting device is formed on an upper portion of each of the first power supply lead and a pair of wires. A pair of first electrodes connected to each other, and a second electrode formed on the lower portion and directly connected to the second power supply lead.

Here, an antistatic treatment layer may be disposed on the surface of the phosphor plate.

The vertical light emitting device package according to the embodiment can improve the reliability and reduce the light emission unevenness by relaxing the concentration of the current.

In addition, the thermal resistance is low, and the luminous flux maintenance rate can be improved.

In addition, the color distribution may be uniform.

In addition, it is possible to prevent contamination of the light emitting device by the adhesive material.

In addition, resin encapsulation and wire bonding can be protected.

In addition, the optical loss is small, and the stress applied to the wire neck portion can be alleviated.

1 is a perspective view of a vertical light emitting device package according to the first embodiment.

FIG. 2 is a perspective view of a light emitting device and a phosphor plate of the light emitting device package shown in FIG. 1.

3 is a table showing the appearance and luminance distribution of the double wire vertical light emitting device, the single wire vertical light emitting device, and the flip type light emitting device.

4A and 4B are side and plan views of the vertical light emitting device package shown in FIG. 1.

5A is a bottom perspective view of the phosphor plate of the vertical light emitting device package shown in FIG. 1, and FIGS. 5B to 5E illustrate various embodiments of a drawing space capable of accommodating an adhesive.

6A and 6B are side and top views of the phosphor plate shown in FIG. 5A.

7A is a block diagram of a general lighting device, and FIG. 7B is a block diagram of a lighting device including a vertical light emitting device package according to an embodiment.

8 is a plan view showing a state after the test before the test of the vertical light emitting device package including the resin-type phosphor.

9A and 9B are a perspective view and a side view of a vertical light emitting device package according to the second embodiment.

10A is a perspective view of a vertical light emitting device package used in a general general vehicle lamp, and FIGS. 10B and 10C are plan views of the vertical light emitting device package of FIG. 10A.

FIG. 11A is a perspective view of a vertical light emitting device package according to a third embodiment used for an illumination device, and FIGS. 11B and 11C are plan views of the vertical light emitting device package of FIG. 11A.

12A is a perspective view of a vertical light emitting device package according to a fourth embodiment used for an illumination device, and FIGS. 12B and 12C are plan and side views of the vertical light emitting device package of FIG. 11A.

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size of each component does not necessarily reflect the actual size.

In the description of the embodiment according to the present invention, when one element is described as being formed 'on or under' of another element, it is either upper or lower. (On or under) includes both two elements are directly in contact with each other (directly) or one or more other elements are formed indirectly between the two elements (indirectly). In addition, when expressed as 'on or under', it may include the meaning of the downward direction as well as the upward direction based on one element.

Hereinafter, a vertical light emitting device package according to an embodiment will be described with reference to the accompanying drawings.

<1st embodiment>

1 is a perspective view of a vertical light emitting device package according to a first embodiment, and FIG. 2 is an exploded perspective view of a light emitting device and a phosphor separated from the vertical light emitting device package shown in FIG. 1.

1 and 2, the vertical light emitting device package 10 according to the first embodiment may include a substrate 100, a vertical light emitting device 200, and a phosphor plate 300.

As illustrated in FIGS. 1 and 2, at least one vertical light emitting device 200 may be disposed on the substrate 100. The phosphor plate 300 may be attached to the light emitting device 200 by the adhesive material 500.

The substrate 100 serves as a body of the light emitting device package 10 and may be various kinds such as a printed circuit board (PCB), a silicon wafer, and a resin. In addition, depending on the material used as the substrate 100 may be classified into a plastic package, a ceramic package, a metal package.

An insulating layer (not shown) may be disposed on the substrate 100. The insulating layer serves to block electrical connections between the substrate 100 and other components. However, when the substrate 100 is made of a nonconductive material, the insulating layer may not be disposed.

The first power supply lead 110 and the second power supply lead 120 may be disposed on the substrate 100. The first power supply lead 110 and the second power supply lead 120 are electrically separated from each other and electrically connected to the vertical light emitting device 200, respectively. Since at least one vertical light emitting device 200 is present, the first power supply lead 110 and the second power supply lead 120 may also be formed in one or more so that each vertical light emitting device 200 is connected. have.

At least one vertical light emitting device 200 may be disposed on the substrate 100. The vertical light emitting device 200 may be a light emitting diode (LED), but is not limited thereto. The light emitting diode may be a red, green, blue, or white light emitting diode emitting red, green, blue, or white light, respectively, but is not limited thereto.

Light emitting diodes are a type of solid state device that converts electrical energy into light and generally comprise an active layer of semiconductor material sandwiched between two opposing doped layers. When a bias is applied across the two doped layers, holes and electrons are injected into the active layer and then recombined therein to generate light, and the light generated in the active layer is emitted in all directions or in specific directions to emit light through the exposed surface. Will be released out.

The vertical light emitting device 200 may include an upper electrode 210 and a lower electrode (not shown). The upper electrode 210 of the vertical light emitting device 200 may be connected to the first power supply lead 110, and the lower electrode (not shown) may be connected to the second power supply lead 120. On the contrary, although not shown in the drawing, the upper electrode 210 may be connected to the second power supply lead 120, and the lower electrode (not shown) may be connected to the first power supply lead 120.

The upper electrode 210 of the vertical light emitting device 200 may be connected to the first power supply lead 110 by a wire 400, and the lower electrode (not shown) may be directly connected to the second power supply lead 120. have.

In the vertical light emitting device 200 of the vertical light emitting device package 10 according to the first embodiment, two upper electrodes 210a and 210b may include a first power supply lead 110 and two wires 400a and 400b. It may be a double wire vertical light emitting device connected to). By using the double wire vertical light emitting device, it is possible to prevent current from being concentrated than the single wire vertical light emitting device or the flip type light emitting device. This improves the reliability and has the effect of reducing unevenness caused by light emission.

The double wire vertical light emitting device, the single wire vertical light emitting device, and the flip type light emitting device will be described in detail. Table 1 and Figure 3 shows a flip-type light emitting device, a single wire vertical light emitting device, a double wire vertical light emitting device.

Table 1

	Vertical light emitting device (double wire)	Vertical light emitting device (single wire)	Flip type light emitting element
Plate mounting	X	△	O
Resistance	O	O	X
Current diffusion	O	X	O

As can be seen from Table 1 and Figure 3, the double-wire vertical light emitting device can be seen that the luminance distribution is evenly distributed throughout the light emitting device than the single-wire vertical light emitting device and flip-type light emitting device. Therefore, there is an advantage that the light emission reliability is increased and the color deviation is reduced. In addition, the double-wire vertical light emitting device has excellent heat dissipation, light emission efficiency, and good heat resistance. For example, the thermal resistance of the flip type light emitting device is 2.3 ° C./W, whereas the thermal resistance of the vertical type light emitting device 200 is 1.5 ° C./W. Therefore, the vertical light emitting device 200 has an effect of improving reliability compared to the flip light emitting device.

As illustrated in FIGS. 1 and 2, the upper electrode 210 of the vertical light emitting device 200 may be connected to the first power supply lead 110 and the wire 400. That is, the upper electrode 210 may include two electrodes 210a and 210b and may be connected to the first power supply lead 110 and two wires 400a and 400b.

The phosphor plate 300 is a plate containing a phosphor for dispersing light generated in the active layer of the vertical light emitting device 200, and is disposed above the vertical light emitting device 200. The adhesive 500 is applied to the lower portion of the phosphor plate 300, and the phosphor plate 300 is disposed on the vertical light emitting device 200 by the adhesive 500.

As illustrated in FIGS. 1 and 2, the phosphor plate 300 may be disposed to cover the remaining portions except for the two upper electrodes 210a and 210b of the upper portion of the vertical light emitting device 200. Two upper electrodes 210a and 210b of the vertical light emitting device 200 may be formed at corners close to the first power supply lead 110. When the two upper electrodes 210a and 210b are formed at edges close to the first power supply lead 110, the length of the wire connecting the first power supply lead 110 may be reduced. Two corners close to the first power supply lead 110 among the corners of the phosphor plate 300 may be formed so as not to cover the upper electrodes 210a and 210b.

4A and 4B are a side view and a plan view showing the standards of the vertical light emitting device 200 and the phosphor plate 300 according to the first embodiment.

4A and 4B, when the horizontal and vertical sizes of the vertical light emitting device 200 are 1, respectively, the height of the vertical light emitting device 200 is 0.12 and the height of the phosphor plate 300 may be 0.2. have. In addition, the light emitting device 200 may have a square shape, and the phosphor plate 300 may basically have a square shape having a width and length of 0.98, but two edges thereof may not cover the upper electrodes 210a and 210b. Concave recesses 320a and 320b may be formed toward the center of the recess. In addition, the light emitting unit 240 that emits substantially the light from the vertical light emitting device 200 may also be formed to concave toward the center of the light emitting unit 240 at two corners in a square having a vertical width of 0.935. .

As shown in FIGS. 4A and 4B, the size of the light emitting device 200, the phosphor plate 300, and the light emitting unit 240 may be the light emitting device 200> the phosphor plate 300> the light emitting unit 240. However, it is not necessarily limited to the above numerical values.

As in the first embodiment, when the size of the vertical light emitting device 200 is larger than the size of the phosphor plate 300, the vertical light emitting device 200 can stably support the phosphor plate 300. In addition, when the size of the phosphor plate 300 is larger than the size of the light emitter 240, the entire light generated in the active layer of the vertical light emitting device 200 may be emitted through the phosphor plate 300. Therefore, according to 1st Embodiment, there exists an effect which can achieve uniformity of color distribution, aiming at stability of the whole structure. Therefore, the light emitting device package according to the first embodiment has high reliability and small color deviation. In addition, the light emitting device package according to the first embodiment may implement an LED light source having low thermal resistance.

Again, referring to FIGS. 1 and 2, the wire 400 may be selected in consideration of product reliability, productivity, cost, performance, and the like. The material of the wire 400 may be a metal such as gold (Au), silver (Ag), copper (Cu), aluminum (Al), or the like.

The adhesive material 500 may use a heat resistant and light resistant material. For example, it may be silicon, a fluororesin, and an inorganic (glass) paste.

When the adhesive 500 is heat resistant and light resistant, the reliability of the light emitting device package may be improved, and thus the luminous flux maintenance rate may be improved.

When the phosphor plate 300 is bonded to the vertical light emitting device 200 by the adhesive 500, the phosphor plate 300 is lighted by a gap between the phosphor plate 300 and the vertical light emitting device 200. Can prevent leakage. When the phosphor plate 300 is adhered to the vertical light emitting device 200, the phosphor plate 300 may stably guide the light of the vertical light emitting device 200.

5A is a bottom perspective view of the phosphor plate 300 according to the first embodiment, and FIGS. 6A and 6B are side views and a plan view of the phosphor plate 300.

5A, 6A, and 6B, the phosphor plate 300 may have a space 310 formed along at least one side of the phosphor plate 300. When the phosphor plate 300 is applied by the adhesive 500, the adhesive 500 may be introduced into the space 310. According to the embodiment shown in FIG. 5A, the groove 310 serving as an insertion space of the adhesive material is processed on the adhesive surface of the phosphor plate 300 to which the adhesive material 500 is applied. The groove 310 is formed to be concave along at least one or more sides of the bottom of the phosphor plate 300. The adhesive material 500 may be accommodated in the groove 310. The drawing space 310 of the phosphor plate 300 according to the first embodiment is not limited to the shape of the groove 310 shown in FIG. 5A, and may have various shapes that may form a space for accommodating the adhesive material 500. It includes the structure of.

Specifically, FIGS. 5B to 5E illustrate various embodiments 300 ', 300', 300 ', 300' and 300 'of an entrance space capable of accommodating an adhesive. As shown in FIG. 5B, the cross section of the retraction space 310 ′ has a square shape. Since the cross section is square, the storage efficiency of adhesive material is high. As shown in FIG. 5C, the inlet space 310 ′ ′ has an arc shape in cross section. Since the cross section is arc-shaped, there is no risk of cracking because there is no angled portion. As shown in FIG. 5D, the inlet space 310 ′ ′ ′ has a straight line shape inclined in cross section, such as by cutting with a knife. That is, the cross section has the shape of a right triangle. Since the cross section of the retraction space 310 '' is straight, processing is easy. As illustrated in FIG. 5E, a plurality of lead spaces 310 ′ ′ ′ ′ ′ may be formed in at least one side of the bottom of the phosphor plate 300 ′ ′ ′ ′ at regular or non-uniform intervals. Since the pulling space is not formed on at least one side of the bottom as a whole, it is possible to design a conflict between the efficiency reduction and the effect of receiving the adhesive due to the formation of the pulling space (310 '' '').

5A, 6A, and 6B, the inlet space 310 may be formed along the edge of the bottom surface of the phosphor plate 300. In addition, the retraction space 310 may be formed to have a predetermined width, and the predetermined width may be a constant value. For example, when the width and length of the vertical light emitting device 200 are 1, the height of the phosphor plate 300, that is, the thickness is 0.2, the width and length is 0.98, and the height of the inlet space 310 is 0.02. The width may be 0.04. When the height of the inlet space 310 is 0.02 and the width is 0.04, it is stable and efficient for accommodating the adhesive material. For example, since the thickness of the adhesive 500 is about 0.003 mm to 0.006 mm, the height of the drawing space 310 in which the adhesive 500 is accommodated is preferably 0.01 mm or more. The width of the inlet space 310 may be 0.04 mm so as to be approximately equal to the amount of the adhesive 500 exceeded when the phosphor plate 300 is mounted. However, the size of the phosphor plate 300 and the lead-in space 310 is not limited to the above-described numerical values, but may vary depending on the size of the light emitting device 200 and the characteristics of the adhesive 500.

The drawing space 310 according to the first embodiment may be formed to accommodate the adhesive 500. If the amount of the applied adhesive 500 is greater than an appropriate amount or the adhesive 500 is not properly applied, before bonding the wire 400 to the upper electrodes 210a and 210b shown in FIG. 2, While the phosphor plate 300 is disposed on the vertical light emitting device 200, the adhesive 500 may contaminate the upper electrodes 210a and 210b of the vertical light emitting device 200. The retraction space 310 may accommodate the adhesive 500 exceeding an appropriate amount or the adhesive 500 that is not properly applied to prevent the adhesive 500 from leaking to the outside of the phosphor plate 300. Accordingly, the upper electrodes 210a and 210b may be protected from the adhesive 500 applied to the plate 300. In addition, by preventing contamination of the upper electrodes 210a and 210b of the vertical light emitting device 200, the bonding performance (W / B) of the wires 400a and 400b is improved.

On the other hand, as shown in Figures 4a to 6b, between the size of the vertical light emitting device 200, the size of the phosphor plate 300 and the size of the light emitting unit 240 the size of the light emitting unit 240 <phosphor plate 300 ) &Lt; size of the vertical light emitting device 200 can be established. Therefore, the sealing property of resin is improved and W / B performance is ensured.

On the other hand, the phosphor plate 300 according to the first embodiment may be a glass plate containing the phosphor. Therefore, since the glass plate 300 contains the phosphor without dispersing the phosphor in the plate or using an encapsulant including the phosphor, the luminous flux maintenance rate can be improved. Therefore, the reliability of the light emitting device package is improved.

FIG. 7A is a schematic view of a lighting device including a general vertical light emitting device package 1, and FIG. 7B is a schematic view of a lighting device including a vertical light emitting device package 10 according to the first embodiment.

Referring to FIG. 7A, in the vertical light emitting device package 1 used in the lighting apparatus, a light emitting device package 1 is disposed on a substrate MCPCB, and an AR glass is formed on the light emitting device package 1. Is disposed, and the inside of the light emitting device package 1 is filled with a resin containing a phosphor).

However, referring to FIG. 7B, the phosphor plate 300 according to the first embodiment may have a thickness of 80 μm or more, and may have a resin bag having no permeability. Therefore, since the AR glass does not need to be used, the cost can be reduced, and since the vertical light emitting device 200 and the phosphor plate 300 are in close contact, there is an effect of preventing the leakage of blue light.

In addition, an antistatic layer having an antistatic treatment may be disposed on the surface of the phosphor plate 300 according to the first embodiment. The surface resistance of the phosphor plate 300 may be 1010 Ω or less by the antistatic treatment. For reference, the surface resistance of general glass is 1010 to 1012 Ω. Therefore, the phosphor plate 300 according to the first embodiment can prevent contaminants such as dust from adhering to the glass surface.

8 illustrates a resin type phosphor layer used in a general light emitting device package. Specifically, FIG. 8A is an actual photograph of the phosphor layer before the predetermined test, and FIG. 8B is an actual photograph of the phosphor layer after the predetermined test.

After a predetermined test for 1000 hours under test conditions of ambient temperature Ta = 85 ° C., junction temperature Tj = 150 ° C., humidity = 85%, forward current If = 1000 mA, the phosphor before test (a) was tested after ( As can be seen in the phosphor layer of b), it can be seen that cracks occur in the phosphor layer. However, since the phosphor plate 300 according to the first embodiment is not a resin but a glass plate, cracks do not occur and thus the reliability is improved.

Next, 2nd Embodiment is described.

<2nd embodiment>

The light emitting device package 11 according to the second embodiment may include a substrate 100, a vertical light emitting device 200, and a phosphor plate 300.

Since the substrate 100, the vertical light emitting device 200, and the phosphor plate 300 are as described in the first embodiment, detailed description thereof will be omitted.

9A and 9B are a perspective view and a side view of the light emitting device package 11 according to the second embodiment.

1, 2, 9A, and 9B, bumps 230 may be formed on the upper electrodes 210 of the vertical light emitting device 200 to prevent contamination of the upper electrodes 210 by the adhesive 500. Can be deployed.

1, 2, 9A, and 9B, bumps 230a and 230b may be disposed on the two upper electrodes 210a and 210b formed on the vertical light emitting device 200. When the amount of the adhesive 500 applied to the bottom of the phosphor plate 300 is greater than an appropriate amount or the adhesive 500 is not properly applied, the phosphor plate 300 is disposed on the upper portion of the vertical light emitting device 200. In the process, the adhesive 500 may contaminate the upper electrodes 210a and 210b of the vertical light emitting device 200. The bump 230 may surround the upper electrode 210 to which the wire 400 is connected, thereby preventing the upper electrode 210 from being contaminated by the adhesive 500. The bumps 230 may be formed to surround a part of the upper electrode 210, and the bumps 230 may be formed to surround the entire upper electrode 210 to completely block the contamination by the adhesive 500. It may be.

The vertical light emitting device package according to the second embodiment is connected to the upper electrode 210 of the vertical light emitting device 200 to which the wire 400 is connected before attaching the phosphor plate 300 to the vertical light emitting device 200. A bump 230 is formed to surround the bonding portion. Therefore, the upper electrode 210 is prevented from being contaminated by the adhesive 500 in the process of attaching the phosphor plate 300 to the vertical light emitting device 200. In addition, since the contamination of the electrode of the vertical light emitting device 200 is prevented, there is an effect that the wire bonding performance (W / B) is improved.

The bumps 230 may be formed in various shapes. For example, bump 230 may be spherical or polyhedral. For example, the bumps may be spherical or regular polyhedral structures with regular polygons in cross section. The bump 230 may be formed by bump plating, but is not necessarily limited thereto. The bump 230 may be made of metal. In particular, the bump 230 may be formed of gold having good oxidation resistance, but is not necessarily limited thereto.

Next, a third embodiment, which is an illumination device including the vertical light emitting device according to the first and second embodiments, will be described.

Third Embodiment

10A to 10C illustrate a vertical light emitting device package 1 used in a general vehicle lamp.

10A to 10C, the short side of the light exit port of the vehicle lamp used as the headlamp in the optical design is 1mm, the long side is suitable 4 ~ 6mm, the size is determined according to the vehicle. In the present specification, a case where the light exit port has a short side of 1 mm and a long side of 5 mm will be described.

On the other hand, since the vehicle lamp is driven at a high temperature, inorganic materialization of the vertical light emitting device package, in particular, the phosphor layer is inorganicized, and the size of the phosphor plate is increasing.

10A to 10C, it can be seen that a general vertical light emitting device package 1 may have a shape in which five square light emitting devices each having a width and a length of 1 mm are arranged in a line. That is, the vertical light emitting device package 1 is mounted in accordance with the size of the light exit port of the vehicle lamp. In this case, however, light is not emitted from the upper electrodes 2a and 2b of the light emitting element. This can be seen in the luminance distribution diagram of the double wire vertical light emitting device of Table 1 and FIG. That is, in the vertical light emitting device package 1 used for a general vehicle lamp, light is emitted from the upper electrodes 2a and 2b of each light emitting device to which wires are connected while light generated by the light emitting device is emitted through the phosphor. I can't. Therefore, the vertical light emitting device package 1 used for a general vehicle lamp does not emit light from the entire light exit port. In addition, the electrode processing and the precision mounting device of the vertical light emitting device is required for mounting the phosphor plate.

11A to 11C show a vertical light emitting device package 10 according to the third embodiment.

The vertical light emitting device package 10 according to the third embodiment may mount a light emitting device having a larger size than the light emitting device shown in FIGS. 10A to 10C, as shown in FIGS. 11A to 11C to increase light efficiency. have. That is, the vertical light emitting device package according to the third embodiment may have a form in which four vertical light emitting devices are arranged.

11A to 11C, an upper portion of the vertical light emitting device 200 may be formed in a square. An upper portion of each of the vertical light emitting devices 200 according to the embodiment of the present invention may have a square shape, and the long side of the light exiting device specification may be approximately an integer multiple of one side of the square of the upper portion of the vertical light emitting device 200. In addition, the short side of the light exit port specification may be longer than one side of the square. The phosphor plate 300 is attached to the upper portion of the vertical light emitting device 200. The second light emitter 242 except for the first light emitter 241 and the first light emitter 241, through which the light emitter 240 of the vertical light emitting device 200 emits light through the light exit port of the vehicle lamp. In this case, since the phosphor plate 300 of the vertical light emitting device package 10 according to the third embodiment may be formed only on the upper portion of the first light emitting portion 241, the electrode processing and precision mounting are not necessary.

11A to 11C, the second light emitting unit 242 is disposed between the first and second upper electrodes 210a and 210b, and the first light emitting unit 241 is the second light emitting unit 242. ) And the first and second upper electrodes 210a and 210b may have a rectangular shape. Since the light exit port of the vehicle lamp according to the third embodiment is formed to fit the first light emitting part 241, light emitted from the entire area of the first light emitting part 241 is emitted through the light exit port, so that the light efficiency is high. There is. In addition, since the vertical light emitting device package 1 of FIGS. 10A to 10C has five light emitting devices, there are four intervals between the light emitting devices, which are portions in which light is not emitted. Since the package 10 has four light emitting devices, the spacing between the light emitting devices is also reduced to four, so that the light efficiency is higher.

11A to 11C illustrate an embodiment in which the vertical light emitting device 200 has a square shape, but is not necessarily limited to the square shape. That is, as illustrated in FIGS. 11D and 11E, the vertical light emitting device 200 may have a rectangular shape. For example, as illustrated in FIGS. 11D and 11E, the vertical light emitting device 200 may be a rectangle having a long side in the long side direction of the light exit port or a rectangle having a long side in the short side direction. In this case, the number of light emitting devices may also vary according to the shape of the light emitting devices. In addition, as illustrated in FIG. 11F, the vertical light emitting device of FIG. 11D and the vertical light emitting device of FIG. 11E may be mixed and disposed.

Fourth Embodiment

12A to 12C illustrate a vertical light emitting device package 10 in which a light guide layer 700 is formed on the second light emitting unit 242 of the vertical light emitting device package 10 shown in FIGS. 11A to 11C. In the vertical light emitting device package 10 according to FIGS. 11A to 11C, the light of the first light emitting part 241 of the phosphor plate 300 is emitted through the light exit port, but the light of the second light emitting part 242 is It cannot be released.

On the other hand, the vertical light emitting device package 10 according to the fourth embodiment may be a fluorescent layer 300 for dispersing light on the light emitting device 200, it is not necessarily limited to a plate.

12A to 12C, the vertical light emitting device package 10 according to the fourth embodiment may further include a light guide layer 700 that guides the light of the second light emitting part 242 through the light exit port. It may include. The light guide layer 700 may be disposed above the second light emitting part 242. Therefore, since the light emitted from the second light emitting part 242 is stably emitted by the light guide layer 700, the light efficiency is further increased.

12A to 12C, the vertical light emitting device package 10 according to the fourth embodiment is disposed on the substrate 100, and has a side surface of the phosphor plate 300 and a light guide layer 700. ) And a reflection and wire protection layer 800 surrounding the wire 400. The reflective and wire protective layer 800 may reflect at least a portion of the light emitted from the phosphor plate 300 or the light guide layer 700, and may protect the wire 400.

As shown in FIG. 12C, the vertical light emitting device package 10 includes a substrate 100, a vertical light emitting device 200 positioned on the substrate, and a phosphor plate 300 formed on the vertical light emitting device 200. The vertical light emitting device 200 may be connected to the first power supply lead 110 and the second power supply lead 120 formed on the substrate 100. The upper electrode 210 is formed on the vertical light emitting device 200, and the wire 400 may connect the upper electrode 210 and the first power supply lead 110. Since the structure of the vertical light emitting device package 10 is as described above, a detailed description thereof will be omitted.

The light guide layer 700 may reflect or refract the light emitted from the second light emitter 242 to the light exit port. The phosphor plate 300 may include gallium nitride (GaN). Therefore, when the refractive index of the light guide layer 700 is greater than the refractive index of the reflection and wire protection layer 800, the light guide layer 700 may totally reflect the light incident from the second light emitting part 242. For example, since the refractive index of the phosphor plate 300 is 1.4 and the refractive index of gallium nitride (GaN) constituting the reflection and wire protection layer 800 is 2.5, the refractive index range of the light guide layer 700 is 1.4 or more and 2.5 or less. desirable. The incident angle from the second light emitting part 242 to the light guide layer 700 may be greater than or equal to a predetermined angle according to the refractive index ratio between the light guide layer 700 and the reflection and wire protection layer 800.

In addition, the light guide layer 700 may be formed in an arc shape, as shown in FIG. 12C, but is not necessarily limited thereto. For example, the light guide layer 700 may be an inclined straight line having an inclined cross section because the light from the second light emitting part 242 needs to be totally reflected to the light exit port.

The light guide layer 700 of the vertical light emitting device package 10 according to the fourth embodiment may be formed to have high ductility. Therefore, the stress applied to the wire 400 positioned in the light guide layer 700 can be reduced.

The light guide layer 700 of the vertical light emitting device package 10 according to the fourth embodiment may be formed of a flexible material. For example, the light guide layer 700 may be formed of at least one of a high refractive index silicone gel and a silicone rubber. The flexible light guide layer 700 may be formed on the upper electrode 210 and the second light emitting part 242 to relieve stress applied to the wire neck part.

For example, the light guide layer 700 of the vertical light emitting device package 10 according to the fourth embodiment has a low hardness in order to prevent problems such as disconnection of the wire due to stress that may occur in the wire 400. It is preferable to use a resin. The hardness of the resin may vary depending on the configuration of the package, but is generally preferred to be less than shore hardness A50.

In general, the wire 400 for bonding with the upper electrodes 210a and 210b is susceptible to breaking, and in particular, the stress applied to the wire neck portion is highest. Therefore, in the vertical light emitting device package 10 according to the fourth embodiment, the ductility of the light guide layer 700 may be increased, thereby reducing the stress applied to the wire neck portion. Therefore, the breakage of the wire 400 is prevented, thereby increasing the life of the wire 400.

On the other hand, forming the flexible light guide layer 700 on the vertical light emitting device 200 is not necessarily applied to the vertical light emitting device, but a light emitting device in which the light guide layer is formed has a different shape than the vertical light emitting device. It can be applied to a light emitting device. That is, by adding a resin of low hardness, the stress applied to the wire bonded to the upper electrode of the light emitting element can be alleviated.

For example, the light emitting device package may include a substrate including at least one power supply lead, a light emitting device disposed on the substrate and at least one electrode connected to the at least one power supply lead through a wire, and It may include a light guide layer disposed on the light emitting device to guide the light from the light emitting device, and comprises a low hardness resin.

Although the above has been described with reference to the embodiments, these are merely examples and are not intended to limit the present invention, and those skilled in the art to which the present invention pertains are not illustrated above in the range without departing from the essential characteristics of the present embodiment. It will be understood that various modifications and applications are possible. For example, each component specifically shown in embodiment can be modified and implemented. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

Claims (11)

1. Board;

   A vertical light emitting device disposed on the substrate;

   A phosphor plate disposed on the vertical light emitting device and having a space formed along at least one side of a bottom portion thereof; And

   And an adhesive disposed between the vertical light emitting device and the phosphor plate and disposed in a space of the phosphor plate.
2. The method of claim 1,

   And the space is a recessed groove along the side of the bottom of the phosphor plate.
3. The method of claim 1,

   The space is a vertical light emitting device package, the cross-section is square along the side of the bottom of the phosphor plate.
4. The method of claim 1,

   The space is a vertical light emitting device package, the cross-section along the side of the bottom of the phosphor plate is a groove concave arcuate.
5. The method of claim 1,

   The space is a vertical light emitting device package, the cross-section is a right triangle along the side of the bottom of the phosphor plate.
6. The method of claim 1,

   And a plurality of spaces are formed along a side of the bottom of the phosphor plate at predetermined intervals.
7. The method of claim 1,

   The space is a vertical light emitting device package formed with a predetermined width along the edge of the bottom.
8. The method of claim 1,

   The bottom surface of the phosphor plate is narrower than the upper surface of the vertical light emitting device, the area of the vertical light emitting device is larger than the light emitting portion of the vertical light emitting device package.
9. The method of claim 1,

   The phosphor plate is a glass plate containing a phosphor, the vertical light emitting device package.
10. The method of claim 1,

    The substrate includes a first power supply lead and a second power supply lead electrically separated from each other,

    The vertical light emitting device,

    A vertical electrode including a pair of first electrodes formed on the upper side and respectively connected to the first power supply lead through a pair of wires, and a second electrode formed on the lower side and directly connected to the second power supply lead. Light emitting device package.
11. The method of claim 1,

    An antistatic treatment layer is disposed on the surface of the phosphor plate, the vertical light emitting device package.

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