KR20150024556A - A LED Package and A LED Package Manufacturing Method - Google Patents

Abstract

The present invention relates to an LED package and a method of manufacturing the LED package. The method includes a first step of bonding an LED chip to a substrate, a first step of applying a transparent resin over the assembly assembled in the first step, A third step of applying a resin of a transparent material containing a fluorescent material to the upper part of the assembly in the second step and a fourth step of curing the resin to fix the resin to the assembly .

Description

[0001] The present invention relates to an LED package,

The present invention relates to an LED package and a method of manufacturing the same, and more particularly, to an LED package capable of easily manufacturing an LED package having high durability and a method of manufacturing the same.

Currently, the application area of LED package is continuously expanding. An LED device, particularly a white LED device, is used not only for a backlight device of a display device and an electric device such as a fluorescent lamp but also for many kinds of signal devices.

The white LED device is a device for converting white light into blue light or ultraviolet LED chip by converting the light emitted from the blue or ultraviolet LED chip into a longer wavelength by the fluorescent material. That is, the light emitted from the LED device is converted into a long wavelength by the fluorescent material, and the wavelength is combined with the remaining unchanged light, resulting in the generation of white light.

Various methods have been proposed so far as a method of manufacturing a white LED package. The most common method is to apply the fluorescent pigment layer 4 on the upper surface of the solid epoxy resin layer 2 in a space above the LED chip 1 as shown in Fig.

However, the above-described conventional techniques have the following problems.

The fluorescent material layer is applied above the epoxy resin layer and the inside heat is not released to the outside due to the shielding of the fluorescent material layer.

Further, there is a problem that the epoxy resin is filled, the epoxy resin is cured, and the fluorescent material layer is applied to prolong the working process.

Further, there is a problem that after the epoxy resin is filled and cured, the fluorescent material layer is coated and the fluorescent material layer is cured to cause a peeling phenomenon between the epoxy resin layer and the fluorescent material layer.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an LED package and a method of manufacturing the LED package, which can reliably discharge heat generated from the LED chip to the outside even when the fluorescent material is applied .

Another object of the present invention is to provide an LED package and a method of manufacturing the LED package which can cure the resin layer and the phosphor layer simultaneously after filling and coating the same.

It is still another object of the present invention to provide an LED package in which the resin layer and the fluorescent material layer are not separated from each other, and a manufacturing method thereof.

According to an aspect of the present invention, there is provided a method of manufacturing an LED package, the method including: a first step of bonding an LED chip to a substrate; A third step of applying a resin of a transparent material containing a fluorescent material to the upper part of the assembly in the second step and a fourth step of curing the resin so as to fix the resin to the assembly, .

And the resin of the second step and the resin of the third step have different viscosities.

And the resin of the second step and the resin of the third step are the same resin.

An LED package, which is another embodiment of the present invention, is manufactured by the above-described method.

The LED package and the manufacturing method thereof according to the present invention have the following effects.

Since the fluorescent material does not shield the upper surface of the LED package, the heat generated from the LED chip can be smoothly discharged to the outside, thereby enhancing the durability of the LED package. .

In addition, since the resin in which the fluorescent material is dispersed and the resin in the LED package can be simultaneously coated and cured, the manufacturing process can be simplified and the overall operation time and cost can be reduced.

In addition, since the resin in which the fluorescent material is dispersed and the resin for filling the inside of the LED package are made of the same material, they are not separated from each other, and the durability of the LED package is increased.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional view showing a state of an LED package according to a related art; FIG.
2 is a sectional view showing a preferred embodiment of an LED package according to the present invention.
3 is a sectional view showing another preferred embodiment of the LED package according to the present invention.
4 is a flowchart showing a manufacturing process of an LED package according to the present invention.

Hereinafter, preferred embodiments of a method of manufacturing an LED package according to the present invention will be described in detail with reference to the accompanying drawings.

2, 3 and 4, a method of manufacturing an LED package according to the present invention includes a first step of bonding an LED chip 10 to a substrate 12, A second step (S20) of applying a transparent resin material (20) above the assembly assembled in the first step (S10), and a second step (S20) A third step S30 of applying a transparent resin 30 containing the substance 32 and a fourth step S40 of curing the resin 20 and 30 to fix the resin to the assembly .

First, as shown in FIGS. 2 and 4, a first step of bonding an LED chip 10 to a substrate 12 is performed in a method of manufacturing an LED package according to the present invention (S10). The LED chip 10 emits light from the active layer when an electric current is applied from the outside.

In addition, the substrate 12 serves to support the LED chip 10 from below. A lead frame, or a printed circuit board.

In addition, the LED package further includes a reflective portion 14. [ The reflector 14 reflects the light emitted from the LED chip 10 so as to be concentrated in one direction without being radiated in various directions.

In particular, the LED chip 10 serves to concentrate the light emitted from the active layer and emitted to the side toward the front side. Of course, the reflective portion 14 may not be required as in the case where light is emitted upward from the LED chip 10.

Next, a second step of applying a transparent resin 20 onto the assembly assembled in the first step is performed. 2 and 3, the space formed by the substrate 12 and the reflective portion 14 is filled with the resin 20. [

At this time, the resin 20 is preferably made of a transparent material so that light generated from the LED chip 10 can be emitted to the outside. For example, an epoxy resin, a silicone resin, or the like.

Next, a third step of applying a transparent resin 30 containing the fluorescent material 32 to the upper part of the assembly in the second step is performed (S30). As shown in FIGS. 2 and 3, a transparent resin 30 in which a fluorescent material 32 is dispersed is applied above the LED package coated with the transparent resin 20.

The transparent resin 30 in which the fluorescent material 32 is dispersed may be applied by two methods. First, as shown in Fig. 2, a transparent resin 30 having a relatively low viscosity can be applied to the transparent resin 20 applied in the second step.

Then, as shown in FIG. 2, the resin 30 having a high viscosity is placed on the lower layer and the resin 30 having a low viscosity is placed on the upper layer, so that the resin 30 is cured without changing the position of the resin 30.

3, a transparent resin 300 having a relatively high viscosity may be applied to the transparent resin 200 applied in the second step.

Then, as shown in FIG. 3, the resin 300 having a high viscosity is lowered and hardened. At this time, the position of the lowering of the resin 300 can be adjusted by controlling the viscosity of the resin 300 in the third step according to the purpose of the operator.

Next, a fourth step of curing the resin (20, 30) to be fixed to the assembly in the third step proceeds (S40). At this time, the resins 20 and 30 in the second step and the third step are hardened at the same time, thereby shortening the working time.

If the resin 20 in the second step and the resin 30 in the third step are made of different materials, the layers may be separated after curing. In order to prevent this, the resin 20 in the second step and the resin 30 in the third step may be made of the same material.

For example, when the resin 20 in the second step is used as a silicone resin, the fluorescent material is dispersed in the silicone resin 30 in the third step and is then coated on the second-stage resin 20, .

As described above, when they are coated with the same resin, they are made of the same material, and the phenomenon that the respective layers are separated is prevented.

It is to be understood that the invention is not limited to the disclosed embodiment, but is capable of many modifications and variations within the scope of the appended claims. It is self-evident.

10: LED chip 12: substrate
14: reflection part 20: resin
30: Resin 32: Fluorescent material
200: Resin 300: Resin
320: Fluorescent material

Claims (4)

A first step of bonding an LED chip to a substrate;
A second step of applying a transparent resin over the assembly assembled in the first step;
A third step of applying a transparent resin containing a fluorescent material to the upper part of the assembly in the second step; And
And curing the resin to be fixed to the assembly. The method according to claim 1,
Wherein the resin of the second step and the resin of the third step have different viscosities. The method according to claim 1,
Wherein the resin of the second step and the resin of the third step are made of the same material. An LED package produced by the method of claim 1.

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