JP5452645B2 - LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE MANUFACTURING METHOD - Google Patents

Description

  The present invention relates to a light emitting device and a method for manufacturing the light emitting device. In particular, the present invention relates to a light-emitting device using a semiconductor light-emitting element such as a light-emitting diode (LED; Light Emitting Diode) as a light source.

  Up to now, a light source that emits blue light or near-ultraviolet light has been used, and a phosphor that is excited by the light and emits light of other wavelengths is used to change the light source light into light of a different color from white light or light source light. There have been many proposals of light emitting devices for conversion. As prior art using a blue LED as a light source, for example, there are those shown in Patent Documents 1 and 2.

JP 2003-110146 A Special table 2011-501865 gazette

  The light emitting device of Patent Document 1 has a configuration in which a plurality of recesses are provided in advance, and an LED substrate in which LEDs are mounted in the recesses and an optical member including a fluorescent member are provided. The optical member is supported. There exists a subject that manufacture of the LED board of such a structure is not easy. For example, instead of providing a recess on the LED substrate itself, the surface of the LED substrate may be a flat surface, and a recess (reflector) as a separate part may be provided around the LED mounted on the surface. However, in this case, not only the problem of cost increase due to an increase in the manufacturing process or the number of parts, but also technical measures such as measures against light leakage from the recess and the LED substrate, positioning of the recess, and fixing method Challenges arise.

  In the light emitting device of Patent Document 2, the illumination color is changed from blue to another color by covering a substrate on which a plurality of blue LEDs are mounted with a wavelength conversion member in which phosphors are mixed as a whole. In this light emitting device, in order to ensure the uniformity of the illumination color, it is necessary to increase the distance between the LED and the wavelength conversion member to some extent. For this reason, the light emitting device becomes thick, the multiple reflection components inside the device increase, and light loss tends to occur. Further, in this light emitting device, the color of the wavelength conversion material (phosphor) is considerably noticeable when the light is turned off.

  An object of the present invention is, for example, to suppress light leakage from between a substrate and a wavelength conversion member with a configuration that is easy to manufacture in a light emitting device.

A light emitting device according to one embodiment of the present invention includes:
A light emitting element that emits light;
A substrate on which the light emitting element is mounted;
A wavelength conversion member that converts the wavelength of light emitted from the light emitting element;
An interposition member formed of a soft material and installed between the substrate and the wavelength conversion member;
The wavelength conversion member is pressed in a direction approaching the substrate so that one end of the interposition member is in contact with the wavelength conversion member and the other end of the interposition member is in contact with the substrate, A fixing portion for fixing the position of the wavelength conversion member.

  In one embodiment of the present invention, in the light-emitting device, an interposition member formed of a soft material is installed between the substrate and the wavelength conversion member. Then, the fixed portion presses the wavelength conversion member in a direction approaching the substrate so that one end of the interposition member contacts the wavelength conversion member and the other end of the interposition member contacts the substrate, and the wavelength conversion member with respect to the substrate The position of is fixed. Therefore, according to one aspect of the present invention, in the light emitting device, light leakage from between the substrate and the wavelength conversion member can be suppressed with a configuration that is easy to manufacture.

FIG. 3 is a plan view of the light emitting unit according to Embodiment 1. FIG. 3 is a cross-sectional view of the light emitting unit according to Embodiment 1 taken along line AA. 2 is a partial cross-sectional view of the light emitting unit according to Embodiment 1. FIG. The figure which shows the state before attaching the wavelength conversion member of the light emission unit which concerns on Embodiment 1 to a light source substrate. 3 is a graph showing an example of an emission spectrum of the light emitting unit according to Embodiment 1. FIG. 6 is a plan view of a light emitting unit according to a modification of the first embodiment. The figure which shows the state before attaching the wavelength conversion member of the light emission unit which concerns on the modification of Embodiment 1 to a light source substrate. The figure which shows the state before attaching the wavelength conversion member of the light emission unit which concerns on the modification of Embodiment 1 to a light source substrate. The figure which shows the state before attaching the wavelength conversion member of the light emission unit which concerns on the modification of Embodiment 1 to a light source substrate. The figure which shows the state before attaching the wavelength conversion member of the light emission unit which concerns on the modification of Embodiment 1 to a light source substrate. The figure which shows the state before attaching the wavelength conversion member of the light emission unit which concerns on Embodiment 2 to a light source substrate. The figure which shows the state before attaching the wavelength conversion member of the light emission unit which concerns on Embodiment 3 to a light source substrate. FIG. 6 is a cross-sectional view of the light emitting unit according to Embodiment 4 along AA. The figure which shows the state before attaching the wavelength conversion member of the light emission unit which concerns on the comparative example of Embodiment 5 to a light source substrate. The figure which shows the state before attaching the wavelength conversion member of the light emission unit which concerns on Embodiment 5 to a light source substrate. FIG. 10 is a partial cross-sectional view of a light emitting unit according to Embodiment 6.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the description of each embodiment, the directions such as “up”, “down”, “left”, “right”, “front”, “back”, “front”, “back” are However, it is not intended to limit the arrangement or orientation of devices, instruments, parts, or the like.

Embodiment 1 FIG.
FIG. 1 is a plan view (a view seen from the light emitting direction) of a light emitting unit 10 (an example of a light emitting device) according to the present embodiment. FIG. 2 is a cross-sectional view of the light emitting unit 10 taken along the line AA (viewed along the longitudinal direction).

  The light emitting unit 10 includes a chip LED 11 (an example of a light emitting element), a light source substrate 12 (an example of a substrate), a wavelength conversion member 13, an interposition member 14, and a housing 15.

  The chip LED 11 emits blue light. The chip LED 11 may emit light of a color other than blue, such as near ultraviolet light. The chip LED 11 may be a light emitting element other than an LED, such as an organic EL (electroluminescence).

  On the light source substrate 12, two rows of chip LEDs 11 are mounted in a straight line, four in each row (that is, eight in total). Note that the number of mounted chip LEDs 11 can be appropriately changed to an arbitrary number of 1 or more according to the use of the light emitting unit 10 or the like (that is, it may not be 8). Moreover, arrangement | positioning of chip LED11 can be made into arbitrary arrangement | positioning, such as 1 line or 3 lines or more, and a ring shape in a linear form.

  The wavelength conversion member 13 converts the wavelength of light emitted from the chip LED 11. In the present embodiment, the wavelength conversion member 13 includes a translucent plate 16 and a wavelength conversion material 17 for each chip LED 11. The wavelength conversion material 17 is attached to a position corresponding to the chip LED 11 of the translucent plate 16. The wavelength conversion material 17 includes a phosphor that emits yellow light when excited by blue light, and converts the blue light emitted from the corresponding chip LED 11 into white light using the phosphor. In addition, if the fluorescent substance contained in the wavelength conversion material 17 emits light of a wavelength different from the light emitted from the chip LED 11, it corresponds to the emission color of the chip LED 11, the desired illumination color of the light emitting unit 10, and the like. Any phosphor can be appropriately changed. The translucent plate 16 is a rectangular flat plate that transmits white light from the wavelength conversion material 17 and radiates it to the outside of the light emitting unit 10. The light emitted from the translucent plate 16 becomes the illumination light of the light emitting unit 10.

  The interposition member 14 is formed of a soft material (details will be described later), and is disposed between the light source substrate 12 and the wavelength conversion member 13. In the present embodiment, the interposition member 14 is provided for each chip LED 11 (that is, for each wavelength conversion material 17) and is disposed so as to surround the corresponding chip LED 11 (that is, the corresponding wavelength conversion material 17). Specifically, the interposition member 14 is formed in a ring shape and surrounds the chip LED 11 with its inner peripheral surface. The inner peripheral surface (that is, the surface surrounding the chip LED 11) is made of a material having high reflectivity, and reflects light emitted from the chip LED 11. That is, in the present embodiment, the interposed member 14 also functions as a reflector.

  In the present embodiment, the same phosphor as the wavelength conversion material 17 is included in the interposition member 14. That is, the interposition member 14 includes a phosphor that emits light having a wavelength different from that of the light emitted from the chip LED 11 therein. Therefore, the wavelength conversion efficiency of the light source light in the light emitting unit 10 is improved. In addition, the same fluorescent substance may be contained in the surface of the interposed member 14.

  The housing 15 accommodates the light source substrate 12 on which the chip LED 11 is mounted, the wavelength conversion member 13, and the interposition member 14. The casing 15 has one claw-shaped fixing portion 15a for each side of the translucent plate 16 of the wavelength conversion member 13 (that is, a total of four). In addition, the shape, arrangement | positioning, and number of the fixing | fixed part 15a can be changed suitably. The fixing portion 15a is configured such that the wavelength conversion member 13 approaches the light source substrate 12 so that one end 14a of the interposition member 14 contacts the wavelength conversion member 13 and the other end 14b of the interposition member 14 contacts the light source substrate 12. To fix the position of the wavelength conversion member 13 with respect to the light source substrate 12.

  In the present embodiment, one end 14 a of the interposed member 14 is fixed to the wavelength conversion member 13. The wavelength conversion member 13 is detachable from the light source substrate 12. When the wavelength conversion member 13 is attached to the light source substrate 12, the wavelength conversion member 13 is attached to the light source substrate 12 together with the interposition member 14 and fixed by the fixing portion 15 a of the housing 15. At this time, the wavelength conversion member 13 is pressed by the fixing portion 15 a of the housing 15, whereby the other end 14 b of the interposed member 14 is pressed against the light source substrate 12. Thereby, there is no gap between the light source substrate 12 and the wavelength conversion member 13, and light leakage from between the light source substrate 12 and the wavelength conversion member 13 can be suppressed (or prevented). When the wavelength conversion member 13 is removed from the light source substrate 12, the wavelength conversion member 13 is removed from the housing 15 together with, for example, the interposed member 14 and the light source substrate 12, and then removed from the light source substrate 12 together with the interposed member 14.

  As described above, in the present embodiment, the interposition member 14 formed of a soft material is installed between the light source substrate 12 and the wavelength conversion member 13. Then, the fixing portion 15a of the housing 15 causes the wavelength conversion member 13 to be a light source so that one end 14a of the interposition member 14 contacts the wavelength conversion member 13 and the other end 14b of the interposition member 14 contacts the light source substrate 12. The position of the wavelength conversion member 13 relative to the light source substrate 12 is fixed by pressing in the direction approaching the substrate 12. Therefore, according to this Embodiment, in the light emission unit 10, the light leakage from between the light source board | substrate 12 and the wavelength conversion member 13 can be suppressed with a structure with easy manufacture.

  FIG. 3 is a partial cross-sectional view of the light emitting unit 10, specifically showing the chip LED 11 and the light source substrate 12.

  The light source substrate 12 has a configuration in which a conductive path is formed on the base substrate 18 and a highly reflective resist material 20 is applied to the conductive path other than the region of the conductive portion 19 required for mounting the chip LED 11. Yes. A glass epoxy material, a glass composite material or the like is used for the base substrate 18. Note that a metal material or the like may be used for the base substrate 18 in order to improve heat dissipation. The conductive portion 19 is manufactured as a thin pattern of copper or the like, and is subjected to silver plating or gold plating treatment thereon via a metal thin film for base treatment. The highly reflective resist material 20 is formed using a white resin such as acrylic, epoxy, or silicone so that the thickness is substantially uniform.

  Chip LED11 used as the light emission source of the light emission unit 10 is fixed to the electroconductive part 19 previously patterned using the die-bonding material 21. FIG. Note that the chip LED 11 may be fixed to the conductive portion 19 using solder. Further, the chip LED 11 is electrically connected to another conductive portion 19 using a wire 22. In the present embodiment, the chip LED 11 is a blue LED having a light emission peak in the vicinity of 440 to 475 nm (nanometer). The chip LED 11 is covered with a sealing resin 23 (an example of a translucent material) that is a transparent resin such as silicone for the purpose of increasing the amount of light extracted from the chip LED 11 and protecting the chip LED 11. . The sealing resin 23 is a transparent resin such as silicone, and is formed in a substantially circular shape when viewed from above the light source substrate 12.

  As described above, in the present embodiment, the light source substrate 12 does not include a reflector having a light distribution control function (for example, the concave portion of Patent Document 1) between the sealing resins 23 of the adjacent chip LEDs 11. The configuration is simple. Therefore, the low cost light emitting unit 10 can be provided. Moreover, if an inexpensive glass epoxy material is used for the base substrate 18, the light emitting unit 10 can be provided at a lower cost.

  FIG. 4 is a diagram illustrating a state before the wavelength conversion member 13 of the light emitting unit 10 is attached to the light source substrate 12.

  As described above, the wavelength conversion member 13 is disposed in the light emitting direction of the chip LED 11 mounted on the light source substrate 12, and converts the blue light emitted from the chip LED 11 into light of another wavelength region. The wavelength conversion member 13 includes a wavelength conversion material 17 on the side of the translucent plate 16 that faces the chip LED 11. The wavelength conversion material 17 is formed in a circular shape that is equal to or slightly larger in diameter than the sealing resin 23 in accordance with the shape of the sealing resin 23 of the chip LED 11. An interposition member 14 is attached to the wavelength conversion member 13 so as to surround each wavelength conversion material 17.

  The translucent plate 16 is made of a material such as acrylic, PET (polyethylene terephthalate), polycarbonate, silicone, glass, or the like. The wavelength conversion material 17 is made of a phosphor that is excited by blue light and emits light in other wavelength regions (for example, yellow) mixed with a base binding material (transparent resin or the like). The wavelength conversion material 17 is configured by coating, printing, spraying, or pasting a previously formed sheet shape on the translucent plate 16. For example, if a phosphor that emits yellow light is used as the wavelength conversion material 17, the amount of phosphor mixed is adjusted so that the blue light of the chip LED 11 and the partially converted yellow light are substantially white. Of light.

  Note that the surface of the translucent plate 16 may be formed as a rough surface by blasting or embossing. Further, the light-transmitting plate 16 may be such that a light diffusing material is mixed therein and itself has a diffusing function. In any case, the coloring of the wavelength conversion material 17 at the time of extinguishing can be alleviated (the color of the wavelength conversion material 17 can be converted to low saturation). Moreover, when the wavelength conversion material 17 is discretely arranged, the color contrast by it can be suppressed. In the present embodiment, the wavelength conversion material 17 is discretely arranged in accordance with the position of the chip LED 11 in order to efficiently use the phosphor and to make the coloring due to the phosphor at the time of extinction inconspicuous. However, the translucent plate 16 and the wavelength conversion material 17 may be integrally formed.

  FIG. 5 is a graph showing an example of the emission spectrum of the light emitting unit 10.

  In FIG. 5, the dotted line indicates the spectrum of blue light emitted from the chip LED 11 and transmitted through the sealing resin 23. In the solid line, part of the blue light is absorbed by the wavelength conversion material 17 of the wavelength conversion member 13, excites the phosphor and is converted into yellow light (wavelength conversion light). The spectrum of the illumination light (unit radiated light) of the substantially white light-emitting unit 10 obtained by mixing with blue light that has not been absorbed is shown. As described above, as the phosphor, depending on the desired light quality (color temperature, chromaticity, color rendering, etc.) of the light emitting unit 10, other than yellow (for example, green, red, etc.) or a plurality of types are mixed. Fluorescent material) can be used. For example, a YAG (yttrium, aluminum, garnet) phosphor can be used for yellow, a silicate phosphor for green to orange, and a nitride phosphor for red.

  The interposition member 14 provided in the wavelength conversion member 13 has a role of stably arranging the wavelength conversion member 13 on the light source substrate 12. In the present embodiment, the light emission performance of the light emitting unit 10 can be maintained high at the same time. Is.

  In general, the wavelength conversion itself is possible even in a configuration in which the wavelength conversion member is arranged without providing a partition between the light sources in the light emission direction of a plurality of blue LED light sources as in the light emitting device of Patent Document 2, The space (volume) between the light source and the wavelength conversion member becomes wider, and the multiple light reflection loss in that region increases accordingly.

  Therefore, in the present embodiment, at least the surface of the interposition member 14 is configured using a highly reflective resin material so as to cover the periphery of each wavelength conversion material 17. Thereby, when the light source substrate 12 and the wavelength conversion member 13 are combined, the interposition member 14 also functions as a reflector, so that the light of each chip LED 11 can be efficiently irradiated onto the surface of the wavelength conversion material 17. Therefore, high light emission efficiency can be realized while suppressing light loss between the light source substrate 12 and the wavelength conversion member 13.

  In the present embodiment, since the wavelength conversion material 17 is provided only on the inner side of the interposition member 14 (region surrounded by the interposition member 14), the entire wavelength conversion member as in the light emitting device of Patent Document 2. Therefore, a relatively low cost apparatus can be realized with respect to the configuration including the phosphor. In the present embodiment, the wavelength conversion material 17 of the wavelength conversion member 13 can be disposed at a distance that contacts the LED light source part (sealing resin 23) regardless of the reflectance of the interposition member 14. In terms of structure, the thin light emitting unit 10 can be provided.

  For example, in the present embodiment, it is assumed that instead of the interposition member 14, a reflection frame made of a hard resin separately formed on the light source substrate 12 is provided, and the wavelength conversion member 13 is disposed thereon. In this case, since a component for fixing the reflection frame to the light source substrate 12 side is required, there arises a problem that the number of components is increased as compared with the present embodiment. In addition, technical problems such as positional accuracy when the reflection frame is attached to the light source substrate 12 and a mechanism for preventing a gap from being formed between the reflection frame and the light source substrate 12 arise. On the other hand, according to this Embodiment, since the interposition member 14 is comprised with the soft material, such a subject does not arise.

  If the interposition member 14 is formed of a hard resin, when the interposition member 14 is disposed on the light source substrate 12, a part of the interposition member 14 may be lifted from the light source substrate 12, and light from the chip LED 11 may leak from that portion. On the other hand, if the interposed member 14 is formed of a soft resin as in the present embodiment, a slight pressure is applied from the outside by the fixing portion 15a of the housing 15 when the interposed member 14 is disposed on the light source substrate 12. As a result, the other end 14 b (tip) of the interposition member 14 that touches the light source substrate 12 is deformed and comes into close contact with the light source substrate 12. Therefore, there is no gap (light exit) between the surface of the light source substrate 12 and the interposition member 14, and the light of the chip LED 11 can be efficiently radiated to the wavelength conversion material 17, which causes light leakage. Thus, the uneven color of the light emitting unit 10 does not occur.

  Here, the height of the chip LED 11 is about several tens to several hundreds of micrometers (micrometers), and the height of the sealing resin 23 covering it (the height from the light source substrate 12 to the top of the sealing resin 23) is It can be as low as several millimeters (millimeters). That is, the sealing resin 23 can be formed thin. Moreover, even if the thickness of the wavelength conversion material 17 of the wavelength conversion member 13 is about several hundred μm, a desired color conversion effect can be obtained. Therefore, even if the height of the interposition member 14 is about 2 mm, for example, the thickness of the light emitting unit 10 can be considerably reduced.

  FIG. 6 is a plan view of the light emitting unit 10 according to a modification of the present embodiment.

  Compared with the light emitting unit 10 shown in FIG. 1, the wavelength conversion member 13 is divided into two in the light emitting unit 10 shown in FIG. Each wavelength conversion member 13 corresponds to a row of chip LEDs 11, has a translucent plate 16, and has a wavelength conversion material 17 for each chip LED 11. The casing 15 has four fixing portions 15 a for each wavelength conversion member 13.

  In the present embodiment and its modification, the fixing portion 15 a for fixing the wavelength conversion member 13 is provided in the housing 15, but the fixing portion may be provided in a place other than the housing 15. For example, the fixing portion may be provided on the light source substrate 12 or the wavelength conversion member 13 itself. The fixing part is not required to eliminate the gap between the light source substrate 12 and the wavelength conversion member 13 and to cause an extreme decrease in the light emission efficiency of the light emitting unit 10.

  In the present embodiment, since the wavelength conversion member 13 is fixed by applying a slight pressure to the wavelength conversion member 13 at the fixing portion 15a of the housing 15, the interposition member 14 is made of a soft material, so that the wavelength conversion is performed by the interposition member 14. While absorbing the warp of the member 13 and the light source substrate 12, the light source substrate 12, the wavelength conversion member 13, and the interposition member 14 can be integrated by eliminating the gap between the light source substrate 12 and the wavelength conversion member 13. Therefore, extreme fluctuations in the vertical position of the wavelength conversion member 13 can be prevented as much as possible, and stable light quality illumination light can be obtained. Further, the light emitted from the chip LED 11 does not escape from the gap, and the light of the chip LED 11 can be efficiently applied to the wavelength conversion material 17, and the light emitting unit 10 with high light emission efficiency can be obtained.

  In the present embodiment, the other end 14b of the interposition member 14 can be bonded to the light source substrate 12 via an adhesive or the like, but if not bonded, the wavelength conversion member 13 is attached together with the interposition member 14. Detachable. Therefore, the light source substrate 12 is not changed, and only the wavelength conversion member 13 having a different configuration (shape, size, aspect of the wavelength conversion material 17, particularly the content rate and type of the phosphor, etc.) is exchanged to obtain various light colors. The illumination light may be selectively obtained.

  Hereinafter, the soft material used for the interposed member 14 will be described.

  As described above, the material that makes it possible to attach the interposition member 14 so as to absorb the warp of the wavelength conversion member 13 and the light source substrate 12 so that there is no gap between the light source substrate 12 and the like, for example, in the operating temperature range A resin having an elastomeric elastic modulus is preferable. The appropriate elastic modulus varies depending on the shape of the interposition member 14 and the rigidity of the wavelength conversion member 13, but, for example, if the elastic modulus is 1000 MPa (megapascal) or less, it can absorb the warp of the normal substrate and Fixing without gaps is possible. Further, the light emitted from the chip LED 11 is used to reduce the loss due to the light emitted from the chip LED 11 being absorbed by the material of the interposition member 14 and the amount of light leakage to the region where the wavelength conversion material 17 is not formed. The diffuse reflectance of the material of the interposed member 14 in the wavelength region is preferably 70% or more.

  Specifically, as the soft material used for the interposition member 14, a soft resin such as urethane rubber, silicone rubber, fluorine rubber, butadiene rubber, acrylic rubber, butyl rubber, nitrile rubber, or synthetic resin can be used. Further, the elastic modulus may be adjusted by foaming these soft resins. In order to improve the reflectance, it is preferable to include a white filler such as titanium oxide, calcium carbonate, talc, clay, magnesia, or silica in these soft resins.

  Hereinafter, a method for manufacturing the light emitting unit 10 (particularly, the interposed member 14) will be described.

  For example, it is possible to fix the interposition member 14 to the wavelength conversion member 13 by forming the soft resin constituting the interposition member 14 on the wavelength conversion member 13 by various printing methods. Applicable printing methods include flexographic printing, intaglio printing, offset printing, stencil printing, and the like. Further, for example, it is possible to fix the interposition member 14 to the wavelength conversion member 13 by punching a flexible resin sheet constituting the interposition member 14 into a predetermined shape and disposing it on the wavelength conversion member 13 via an adhesive. It is. Further, for example, it is possible to fix the interposed member 14 to the wavelength converting member 13 by forming a flexible resin constituting the interposed member 14 on the wavelength converting member 13 by insert molding.

  In order to keep the distance between the wavelength conversion material 17 and the sealing resin 23 (or the chip LED 11) constant, to obtain a uniform amount of light, and to efficiently exhibit the reflection function of the interposed member 14 as a reflector. In addition, it is necessary to suppress variation in the shape of the interposition members 14 fixed to the wavelength conversion member 13. For this purpose, it is particularly preferable to fix the interposition member 14 to the wavelength conversion member 13 by forming a soft resin by intaglio printing, disposing a punched soft resin sheet, or forming a soft resin by insert molding.

  Hereinafter, a method for forming a flexible resin on the wavelength conversion member 13 by intaglio printing will be specifically described.

  First, an ultraviolet curable soft resin is placed in a mold in which the shape of the interposition member 14 is formed in a concave shape. Next, the translucent plate 16 is disposed thereon, and an extra ultraviolet curable soft resin between the wavelength conversion member 13 and the mold is extruded by a pressing tool such as a roller. Thereafter, the soft resin is cured by irradiating with ultraviolet rays, and the interposing member 14 is removed as the integrated wavelength conversion member 13. Thereby, the interposition member 14 with high shape accuracy and capable of keeping the distance between the wavelength conversion member 13 and the chip LED 11 constant can be formed. In this method, the interposition member 14 having a shape that can be removed from the mold can be formed. For example, in addition to the one shown in FIG. 4, the interposition member 14 having a shape as shown in FIG. 7 can be formed. In the example of FIG. 7, the inner peripheral surface of the interposition member 14 is flat, and the width on the one end 14a side of the interposition member 14 (the length between the inner periphery and the outer periphery in the radial direction) is the other end 14b. It is larger than the width of the side. That is, the opening area of the interposition member 14 is narrowed from the light source substrate 12 side toward the wavelength conversion member 13 side.

  When a soft resin containing a white filler is used to improve the reflectivity, it may be difficult to irradiate predetermined ultraviolet rays to the inside. In that case, if an ultraviolet curable soft resin that can be used in combination with moisture curing is used, even a soft resin having high reflectivity can be cured to the inside thereof. Therefore, the interposition member 14 having a large outer dimension can be formed, and the interposition member 14 having a height higher than that of the sealing resin 23 can be easily formed.

  In order to facilitate removal from the mold (demolding) and to completely transfer the soft resin to the wavelength conversion member 13, it is preferable to use a mold made of a material that transmits ultraviolet rays. In this case, it is possible to easily remove the mold by irradiating ultraviolet light through the mold, and it becomes easy to completely transfer the soft resin, and the interposition member 14 having a stable shape can be formed. Further, in order to completely transfer the soft resin, for example, polycarbonate is used for the mold, and PET is used for the light-transmitting plate 16 of the wavelength conversion member 13. It is preferable to make a sufficient difference in the adhesion to the translucent plate 16.

  Hereinafter, a method for arranging the punched flexible resin sheet on the wavelength conversion member 13 will be specifically described.

  The flexible resin sheet can be punched with a Thomson blade or a mold. Alternatively, the flexible resin sheet can be punched out by laser processing. By such a technique, one or a plurality of punching processes are performed on the flexible resin sheet, and the flexible resin sheet is attached to the wavelength conversion member 13 via an adhesive or an adhesive. If the adhesive or the pressure-sensitive adhesive is previously formed on the soft resin sheet before punching, productivity is improved. Further, when the punched flexible resin sheet is attached to a sheet in which a plurality of wavelength conversion members 13 are integrated, the product is cut into a predetermined shape and the wavelength conversion member 13 in which the interposition member 14 is integrated is productivity. Will improve. The material of the flexible resin sheet may be the aforementioned elastomer or synthetic rubber. The adhesive and the pressure-sensitive adhesive may be appropriately selected as long as the adhesive force between the flexible resin sheet and the wavelength conversion member 13 can be secured.

  As described above, in this method, the soft material is punched to remove a portion having the predetermined shape so that a space having a predetermined shape is formed between the chip LED 11 and the wavelength conversion member 13. The member 14 is formed. When this method is used, it is possible to form the interposition member 14 having a shape as shown in FIGS. 8 and 9, which is difficult to realize by the above-described method of forming a soft resin by intaglio printing. In the example of FIGS. 8 and 9, the width of the interposed member 14 on the one end 14 a side (the length between the inner periphery and the outer periphery in the radial direction) is smaller than the width on the other end 14 b side. That is, the opening area of the interposition member 14 is widened from the light source substrate 12 side toward the wavelength conversion member 13 side. In the example of FIG. 8, one end 14 a of the interposition member 14 is fixed to the light-transmitting plate 16 of the wavelength conversion member 13, but in the example of FIG. 9, the one end 14 a of the interposition member 14 is the wavelength conversion of the wavelength conversion member 13. It is fixed to the material 17. That is, the interposition member 14 is formed on the wavelength conversion material 17. In the example of FIGS. 8 and 9, the shape of the interposed member 14 is such that the blue light from the light source substrate 12 side can be easily controlled to the wavelength conversion material 17 side, so that the interposed member 14 is viewed as a reflector. Desirable shape. Therefore, by using this method, it is possible to provide an inexpensive and thin light-emitting unit 10 with higher luminous efficiency.

  Hereinafter, a method for forming a flexible resin on the wavelength conversion member 13 by insert molding will be specifically described.

  As the molding material, it is possible to use a crosslinkable rubber, a thermoplastic resin, a silicone resin, or the like among the above-described elastomers and synthetic rubbers. By forming runners and gates in the region where the wavelength conversion material 17 of the wavelength conversion member 13 is not formed, the interposed member 14 having a constant height can be formed by insert molding.

  In addition, although a manufacturing method is not ask | required, the interposed member 14 of a shape as shown in FIG. 10 can also be formed, for example. In the example of FIG. 10, the translucent plate 16 and the support 24 of the interposition member 14 are integrally formed of the same material, and only the surface portion of the interposition member 14 is formed of a soft resin. Even in such a configuration, as in the other configurations described above, a gap cannot be formed between the light source substrate 12 and the interposition member 14, and thus high light emission efficiency can be obtained.

  As described above, a phosphor is mixed in the material of the intervening member 14, or a translucent resin mixed with a phosphor is applied to the inner surface (inner peripheral surface) of the intervening member 14 to intervene. The member 14 may have a wavelength conversion function. There is a considerable amount of primary blue light that irradiates the interposition member 14 from the chip LED 11 through the sealing resin 23. However, by providing the interposition member 14 with a wavelength conversion function, it is possible to directly convert the wavelength of the primary blue light. it can. Therefore, the efficiency of wavelength conversion is increased, and color unevenness (for example, the contrast between the blue light of the chip LED 11 and the yellow light of the phosphor) generated in the region surrounded by the wavelength conversion material 17 and the interposition member 14 is reduced. . As the phosphor used for the interposing member 14, it is desirable to use the same phosphor as that used for the wavelength conversion material 17 in order to improve the uniformity of the radiated light passing through the translucent plate 16.

  As described above, in the present embodiment, the light emitting unit 10 includes the light source substrate 12 having a simple configuration that does not have a recess around the mounting location of the chip LED 11, and the wavelength conversion member 13 disposed on the light source substrate 12. Is provided. The wavelength conversion member 13 includes wavelength conversion materials 17 that are discretely provided at positions corresponding to the sealing resin 23 of each chip LED 11 on the light source substrate 12. The wavelength converting member 13 is provided with a highly reflective intervening member 14 made of a soft material surrounding the wavelength converting material 17 and surrounding the sealing resin 23 of each chip LED 11 on the light source substrate 12. The light source substrate 12 and the interposition member 14 are combined so as to be in contact with no gap. Accordingly, the light source substrate 12 can be manufactured at low cost, and the wavelength conversion member 13 can be easily and easily attached to the light source substrate 12 via the interposition member 14 having the same thickness as the sealing resin 23. In this case, it is possible to prevent light leakage from between the wavelength conversion member 13 and the light source substrate 12. Therefore, it is possible to provide a light-emitting unit 10 that has high luminous efficiency, is thin, and is inexpensive.

Embodiment 2. FIG.
In the present embodiment, differences from the first embodiment will be mainly described.

  FIG. 11 is a diagram illustrating a state before the wavelength conversion member 13 of the light emitting unit 10 according to the present embodiment is attached to the light source substrate 12.

  In the present embodiment, the interposed member 14 includes a first portion 14 c on the one end 14 a side fixed to the wavelength conversion member 13 and a second portion 14 d on the other end 14 b side fixed to the light source substrate 12. . Other configurations are the same as those in the first embodiment.

  The wavelength conversion member 13 can be attached to and detached from the light source substrate 12. When the wavelength conversion member 13 is attached to the light source substrate 12, the wavelength conversion member 13 is attached to the light source substrate 12 together with the first portion 14 c of the interposition member 14. (Although not shown in FIG. 11, the same as in the first embodiment). At this time, when the wavelength conversion member 13 is pressed by the fixing portion 15a of the housing 15, the tip 14e of the first portion 14c and the tip 14e of the second portion 14d of the interposition member 14 are in close contact with each other. That is, when the wavelength conversion member 13 is pressed by the fixing portion 15a of the housing 15, the first portion 14c of the interposition member 14 is pressed against the second portion 14d. Thereby, there is no gap between the light source substrate 12 and the wavelength conversion member 13, and light leakage from between the light source substrate 12 and the wavelength conversion member 13 can be suppressed (or prevented). When the wavelength conversion member 13 is removed from the light source substrate 12, the wavelength conversion member 13 is removed from the light source substrate 12 together with the first portion 14c of the interposition member 14, for example, after being removed from the housing 15 together with the interposition member 14, the light source substrate 12, and the like. .

  In the present embodiment, the light source substrate 12 and the wavelength conversion member 13 are compared with the first embodiment because the interposed member 14 (second portion 14d) formed of a soft material is also provided on the light source substrate 12 side. The gap between the two can be eliminated more reliably.

  11, in the periphery of the sealing resin 23 of the light source substrate 12, a tip 14e of the first portion 14c of the interposition member 14 is formed in a circular ring shape in accordance with a continuous shape (here, a cylindrical shape) and dimensions. A second portion 14d of the interposed member 14 is provided. Similarly to the first portion 14c of the interposed member 14, the second portion 14d of the interposed member 14 is made of the above-described soft resin such as elastomer or synthetic rubber, and receives the first portion 14c of the interposed member 14. The second portion 14d of the interposition member 14 can be formed on the light source substrate 12 by the same method as the formation method of the interposition member 14 in the first embodiment.

  As described above, in the present embodiment, the first portion 14c and the second portion 14d of the flexible interposing member 14 are brought into close contact with each other over a wide area, whereby the light source substrate 12 and the wavelength conversion member 13 are connected. Light leakage from the space can be reliably eliminated, and the light emitting unit 10 having high light emission efficiency can be provided.

Embodiment 3 FIG.
In the present embodiment, differences from the first embodiment will be mainly described.

  FIG. 12 is a diagram illustrating a state before the wavelength conversion member 13 of the light emitting unit 10 according to the present embodiment is attached to the light source substrate 12.

  In the present embodiment, the surface 23a facing the wavelength conversion member 13 of the sealing resin 23 covering the chip LED 11 is flat. Other configurations are the same as those in the first embodiment.

  In Embodiment 1, as shown in FIG. 4, the sealing resin 23 has an elliptical shape, but when this is combined with the wavelength conversion member 13, the surface of the wavelength conversion material 17 and the surface of the sealing resin 23 There may be an air layer between the two. Around the air layer, the air layer (refractive index is 1.0) and the surrounding material (the refractive index of the binding resin of the sealing resin 23 and the wavelength conversion material 17 is about 1.4 to 1.6) Therefore, there is a case where the optical loss due to the multiple reflection of light increases in accordance with the light transmission / reflection law at the interface. In contrast, in the present embodiment, since at least the uppermost surface of the sealing resin 23 is formed flat, the surface of the wavelength conversion material 17 and the surface of the sealing resin 23 are in contact with each other in substantially the entire region. Therefore, the refractive index difference at the interface can be reduced, and light loss is reduced. That is, according to the present embodiment, high luminous efficiency can be obtained by reducing the area of the air layer.

Embodiment 4 FIG.
In the present embodiment, differences from the first embodiment will be mainly described.

  FIG. 13 is a cross-sectional view of the light emitting unit 10 according to the present embodiment, taken along the line AA.

  In the present embodiment, a translucent resin 25 is filled in a space formed between the sealing resin 23 covering the chip LED 11, the wavelength conversion member 13, and the interposition member 14. Other configurations are the same as those in the first embodiment.

  In the present embodiment, the air layer formed between the light source substrate 12 and the interposition member 14 has a light-transmitting resin 25 (for example, the same material as the sealing resin 23 or the same material and having the same refractive index). Is used). Therefore, as in the third embodiment, the difference in refractive index at the interface can be reduced, and the optical loss is reduced. That is, according to the present embodiment, high luminous efficiency can be obtained by reducing the area of the air layer.

  For example, the orientation is adjusted so that the wavelength conversion member 13 is located below the light source substrate 12, and the translucent resin 25 is injected into the space formed by the wavelength conversion member 13 and the interposition member 14, and the light source substrate is formed thereon. The above-described configuration can be realized by the method of installing 12. At this time, even if there is an overflowing resin, it goes out of the intervening member 14 where there is no light source, so it does not affect the light quality. As the resin to be injected, a thermosetting resin may be used, or a gel-like resin that cures to some extent at room temperature may be used.

Embodiment 5 FIG.
In the present embodiment, differences from the first embodiment will be mainly described.

  In the first embodiment, the interposition member 14 is formed on the wavelength conversion member 13 in which the wavelength conversion material 17 is attached to the translucent plate 16. The interposition member 14 may be formed on the translucent plate 16 as shown in FIG. 4 or the like, or may be formed on the wavelength conversion material 17 as shown in FIG. When the interposition member 14 is formed on the translucent plate 16, the wavelength conversion material 17 may be attached to the translucent plate 16 before the interposition member 14 is formed, or after the interposition member 14 is formed. It may be attached to the light plate 16. If the wavelength conversion material 17 is attached after the interposition member 14 is formed, care may be required so that the thickness uniformity of the wavelength conversion material 17 is not impaired depending on the method.

  FIG. 14 is a diagram illustrating a state before the wavelength conversion member 13 of the light emitting unit 10 according to the comparative example of the present embodiment is attached to the light source substrate 12.

  When the wavelength conversion material 17 is formed in a film shape on the translucent plate 16 by potting after the formation of the interposition member 14, as shown in FIG. 14, near the boundary between the wavelength conversion material 17 and one end 14a of the interposition member 14. There is a possibility that a portion 30 in which the thickness of the wavelength conversion material 17 is increased is formed. In an extreme case, it affects the light characteristics of the light emitting unit 10 and may cause uneven color, uneven brightness, and the like.

  FIG. 15 is a diagram illustrating a state before the wavelength conversion member 13 of the light emitting unit 10 according to the present embodiment is attached to the light source substrate 12.

  In the present embodiment, as shown in FIG. 15, the wavelength conversion member 13 includes a translucent plate 16, and includes a wavelength conversion material 17 and a wall member 31 for each chip LED 11. The translucent plate 16 and the wavelength conversion material 17 are the same as those in the first embodiment. The wall member 31 is attached to the translucent plate 16 so as to surround the wavelength conversion material 17. One end 14 a of the interposed member 14 is fixed to the wall member 31 of the wavelength conversion member 13.

  The wall member 31 is previously formed on the translucent plate 16 so as to have a thickness close to the thickness of the target wavelength conversion material 17 (preferably the same as or slightly thicker than the wavelength conversion material 17). Thereafter, a liquid resin containing a phosphor (for example, a mixture of a phosphor with a thermosetting resin such as a silicone resin or an epoxy-modified silicone resin) is injected into (injected into) the space surrounded by the wall member 31 and leveled. Above, the liquid resin is cured. Thereby, the wavelength conversion material 17 is formed in the space surrounded by the wall member 31 on the translucent plate 16. After the wavelength conversion material 17 is formed, the interposition member 14 is formed so as to overlap the wall member 31. The interposition member 14 has a thickness equal to or greater than the thickness of the sealing resin 23 that covers the chip LED 11.

  In the present embodiment, since the wavelength conversion material 17 and the interposition member 14 are formed by the procedure as described above, the liquid resin containing the phosphor (the wavelength conversion material 17 before curing) is used as the inner periphery of the interposition member 14 during leveling. There is no scooping up of the surface (see FIG. 14). Therefore, the thickness of the wavelength conversion material 17 can be made uniform easily and reliably, and the occurrence of color unevenness (color temperature variation), brightness unevenness, and the like can be suppressed.

  The wall member 31 may be formed of the same material as any of the intervening member 14, the translucent plate material 16, and the wavelength conversion material 17, or may be formed of a material different from any of them, It is desirable to form with materials having substantially the same coefficient of thermal expansion. If the material of the wall member 31 is a material having a thermal expansion coefficient comparable to that of the translucent plate 16, the material warpage is suppressed when the liquid resin containing the phosphor (the wavelength conversion material 17 before curing) is cured. Therefore, a layer (film) of the wavelength conversion material 17 having a more uniform thickness can be obtained, and the occurrence of color unevenness (color temperature variation), brightness unevenness, and the like can be more reliably suppressed. In addition, when a soft resin such as a silicone resin or a urethane resin containing a white pigment such as silica is used as the material of the wall member 31, the interposition member 14 (rejector) is brought into contact with the light source substrate 12. ) Can be absorbed, and the effect of suppressing light leakage to the outside of the interposed member 14 can also be obtained. Furthermore, there is an advantage that warpage of the light source substrate 12 and the wavelength conversion member 13 can be suppressed.

  The wall member 31 is formed, for example, by adhering sheet-like resin (preliminarily molded thin resin) around a region where the wavelength conversion material 17 of the translucent plate 16 is disposed. Alternatively, for example, it is formed by screen-printing a resin around a region where the wavelength conversion material 17 of the translucent plate 16 is disposed. By forming the wall member 31 by such a method, the thickness of the wall member 31 can be kept substantially constant, so that the light due to the difference in height when the interposition member 14 and the light source substrate 12 are combined. Leakage, light unevenness, color unevenness and the like can be eliminated. When the wall member 31 is formed by screen printing, the wavelength conversion material 17 may be simultaneously formed by screen printing. In this case, it is easy to make the thickness of the wall member 31 and the wavelength conversion material 17 uniform.

Embodiment 6 FIG.
In the present embodiment, differences from the first embodiment will be mainly described.

  FIG. 16 is a partial cross-sectional view of the light emitting unit 10 according to the present embodiment.

  In the first embodiment, the chip LED 11 is covered with the transparent sealing resin 23. In the present embodiment, as shown in FIG. 16, the chip LED 11 is covered with the phosphor-containing resin 23b. The phosphor-containing resin 23 b is a material that includes a different type of phosphor from the phosphor contained in the wavelength conversion material 17.

  Arbitrary fluorescent substance can be used as fluorescent substance contained in fluorescent substance containing resin 23b. For example, if the chip LED 11 emits blue light and the phosphor-containing resin 23b includes a phosphor that emits yellow light when excited by the blue light (for example, a YAG phosphor or a silicate phosphor), the chip LED 11 and the fluorescence The light emitting part made of the body-containing resin 23b exhibits substantially white light. When a phosphor (for example, a nitride phosphor) containing a red light-emitting component excited by at least one wavelength region of blue to yellow light-emitting components is applied to the wavelength conversion material 17 for the light-emitting portion having such a configuration, light emission occurs. The color rendering property of the illumination light of the unit 10 is improved.

  In this way, by applying phosphors having different light characteristics (excitation, absorption, emission spectrum, etc.) to the phosphor-containing resin 23b of the light-emitting portion and the wavelength conversion material 17 of the wavelength conversion member 13, a light-emitting unit is obtained. Ten illumination lights can be converted into desired light. For example, if the phosphor of the wavelength conversion material 17 is a substance having a redness (long wavelength component) stronger than that of the phosphor of the phosphor-containing resin 23b, the light color of the light emitting part having a relatively high color temperature such as daylight color, daylight white, and white. Can be converted into a light color with a low color temperature such as warm white or light bulb color. Further, the light color can be easily changed by replacing (detaching) the wavelength conversion member 13 as necessary. That is, according to the present embodiment, when the light emitting unit 10 is used as a lighting device, the range of application development can be widened due to the effect.

  As mentioned above, although embodiment of this invention was described, you may implement in combination of 2 or more among these embodiment. Alternatively, one of these embodiments may be partially implemented. Alternatively, two or more of these embodiments may be partially combined. In addition, this invention is not limited to these embodiment, A various change is possible as needed.

  DESCRIPTION OF SYMBOLS 10 Light emitting unit, 11 chip LED, 12 Light source board, 13 Wavelength conversion member, 14 Interposition member, 14a One end, 14b Other end, 14c 1st part, 14d 2nd part, 14e Tip, 15 Case, 15a Fixing part, 16 Translucent plate material, 17 wavelength conversion material, 18 base substrate, 19 conductive portion, 20 highly reflective resist material, 21 die bond material, 22 wire, 23 sealing resin, 23a surface, 23b phosphor-containing resin, 24 struts, 25 transparent Photoresin, 30 thickened part, 31 wall member.

Claims (14)

A light emitting element that emits light;
A substrate on which the light emitting element is mounted;
A wavelength conversion member that converts the wavelength of light emitted from the light emitting element;
An intermediate member formed of a soft material and installed between the substrate and the wavelength conversion member so as to surround the light emitting element ;
The wavelength conversion member is pressed in a direction approaching the substrate so that one end of the interposition member is in contact with the wavelength conversion member and the other end of the interposition member is in contact with the substrate, A light emitting device comprising: a fixing portion that fixes a position of the wavelength conversion member. The interposed member, prior SL-emitting device according to claim 1 in which the surface surrounding the light-emitting element is characterized by reflecting the light emitted from the light emitting element.   3. The interposition member, wherein the one end is fixed to the wavelength conversion member, and the other end is pressed against the substrate by pressing the wavelength conversion member by the fixing portion. Light-emitting device.   The interposition member includes a first portion on the one end side fixed to the wavelength conversion member and a second portion on the other end side fixed to the substrate, and the wavelength conversion member is pressed by the fixing portion. The light emitting device according to claim 1, wherein the first portion is pressed against the second portion. The light emitting device includes a plurality of the light emitting elements,
The wavelength conversion member has a light-transmitting plate material that transmits light, and is attached to each light-emitting element at a position corresponding to the light-emitting element of the light-transmitting plate material, and is excited by light emitted from the light-emitting element. A wavelength converting material comprising a phosphor that emits light of different wavelengths,
5. The light emitting device according to claim 1, wherein the interposition member is installed so as to surround the wavelength conversion material for each of the wavelength conversion materials.   The said interposition member contains the fluorescent substance which emits the light of a different wavelength by being excited by the light emitted from the said light emitting element in at least any one of the inside and the surface. Light emitting device.   The light-emitting element is sealed on the substrate by a light-transmitting material that transmits light, and a surface of the light-transmitting material that faces the wavelength conversion member is flat. Any light emitting device.   The light emitting element is sealed to the substrate by a light transmissive material that transmits light, and a space formed between the light transmissive material, the wavelength conversion member, and the interposition member is filled with a light transmissive resin. The light emitting device according to claim 1, wherein the light emitting device is a light emitting device.   Forming the interposition member by punching out the flexible material and removing the portion of the predetermined shape so that a space of a predetermined shape is formed between the light emitting element and the wavelength conversion member. The method for manufacturing a light emitting device according to claim 1, The wavelength conversion member is attached to a light-transmitting plate material that transmits light and a position corresponding to the light-emitting element of the light-transmitting plate material, and is excited by light emitted from the light-emitting element to emit light of different wavelengths. A wavelength conversion material including a phosphor, and a wall member attached to the translucent plate so as to surround the wavelength conversion material,
The light emitting device according to claim 1, wherein the one end of the interposition member is fixed to the wall member. It said wall member, the light emitting apparatus according to claim 10, characterized in that it is formed of a material having the translucent plate and the same thermal expansion coefficient. After the wall member is attached to the translucent plate, the wavelength conversion material is formed by injecting a liquid resin containing the phosphor into a space surrounded by the wall member and curing the injected liquid resin. And
The method of manufacturing a light emitting device according to claim 10 or 11, wherein after the wavelength converting material is formed, the interposition member is overlaid on the wall member.   The light emitting device according to claim 10 or 11, wherein the wall member is formed by adhering a sheet-like resin to the translucent plate material or screen-printing the resin on the translucent plate material. Production method. The wavelength conversion member includes a phosphor that emits light of different wavelengths when excited by light emitted from the light emitting element,
5. The light emitting device according to claim 1, wherein the light emitting element is covered with a material containing a phosphor of a different type from the phosphor.

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