KR20150002468A - Organic light emitting display device and manufacturing method of the same - Google Patents

Abstract

The present invention relates to an organic light emitting display capable of improving the reliability. The organic light emitting display includes: a plurality of pixel areas, in which each pixel area has emission and non-emission areas; a first electrode corresponding to the emission area of each pixel area; a bus electrode corresponding to at least a portion of the non-emission areas of the pixel areas; an adherent pattern on a portion of the bus electrode; a separation pattern configured to cover at least a portion of the adherent pattern and having an inverse-tapered cross section; organic layers formed at a remaining portion of the bus electrode except for a gap area around the adherent pattern covered by the separation pattern, formed on the first electrode and the separation pattern, respectively, and including a light emitting layer; and a second electrode formed on the organic layer and connected with the bus electrode through the gap area.

Description

TECHNICAL FIELD [0001] The present invention relates to an organic light emitting diode (OLED) display device,

The present invention relates to an organic light emitting display device capable of improving reliability and a method of manufacturing the same.

As the era of informationization becomes full-scale, the display field for visually displaying electrical information signals is rapidly developing. Accordingly, studies have been continuing to develop performance such as thinning, lightening, and low power consumption for various flat display devices.

Typical examples of such flat panel display devices include a liquid crystal display device (LCD), a plasma display panel (PDP), a field emission display (FED) An electroluminescence display device (ELD), an electro-wetting display device (EWD), and an organic light emitting display device (OLED).

Such flat panel display devices commonly include flat panel display panels for realizing images. A flat panel display panel has a structure in which a pair of substrates sandwiching an intrinsic light emitting material or a polarizing material are face-to-face bonded, and includes a display area on which a display area and a non-display area outside the display area are defined. The display region is defined as a plurality of pixel regions.

Among them, the organic light emitting display OLED displays an image by using an organic light emitting element which is a self light emitting type element. That is, the organic light emitting display includes a plurality of organic light emitting elements corresponding to a plurality of pixel regions.

The organic light emitting device is formed of organic materials between first and second electrodes facing each other and between the first and second electrodes and generates an electroluminescence based on a driving current between the first and second electrodes Lt; / RTI >

One of the first and second electrodes (hereinafter referred to as "first electrode") is formed to correspond to each pixel region, and the other one (hereinafter, As shown in FIG.

In other words, unlike the first electrode corresponding to each pixel region, the second electrode has a higher resistance than the first electrode, corresponding to the entire plurality of pixel regions. In particular, in the case where the organic light emitting display device emits light in a path through which the second electrode passes, in order to increase light emission efficiency, i.e., brightness, of each pixel region, the second electrode is formed of a transparent conductive material . As a result, the resistance of the second electrode becomes higher.

As described above, the higher the resistance of the second electrode, the greater the voltage drop (IR drop) occurs. Therefore, the brightness of each pixel region may vary depending on the distance from the power source. That is, there is a problem that the uniformity of the luminance of each pixel region is lowered due to the high resistance of the second electrode.

Further, in spite of the voltage drop due to the high resistance of the second electrode, the power consumption of the organic light emitting display device is increased in order to secure a luminance of more than a critical value.

Particularly, the larger the area of the organic light emitting display device, the lower the luminance uniformity and the higher the power consumption due to the high resistance of the second electrode, and thus, there is a problem that the size of the organic light emitting display device is limited.

In order to solve this problem, a general organic light emitting display device may further include a bus electrode formed of a material having a resistance lower than that of the second electrode and connected to the second electrode in order to lower the resistance of the second electrode.

At this time, the bus electrode is formed so as to face the second electrode with the organic layer therebetween. Accordingly, in order to electrically connect the bus electrode and the second electrode, at least a part of the bus electrode must be exposed between the organic layers.

For example, in order to expose at least a portion of the bus electrode, the organic layer may be selectively etched so that not only the organic layer is entirely damaged by the etching process, but also the etched organic material may remain as an impurity , There is a problem that the reliability of the organic light emitting display device is lowered.

The present invention provides an organic light emitting display device and a method of manufacturing the same, which can improve the reliability by connecting the bus electrode and the second electrode without selectively removing the organic layer through the etching process.

According to an aspect of the present invention, there is provided a liquid crystal display comprising: a plurality of pixel regions each including a light emitting region and a non-light emitting region; A first electrode corresponding to a light emitting region of each pixel region; A bus electrode corresponding to at least a part of non-emission regions of the plurality of pixel regions; An adhesion pattern formed on a part of the bus electrode; A separation pattern formed to cover at least a part of the adhesion pattern and having an inverted tapered cross section; An organic layer formed on each of the first electrode and the separation pattern except for a gap region around the adhesion pattern covered by the separation pattern among the bus electrodes, the organic layer including a light emitting layer; And a second electrode formed on the organic layer and connected to the bus electrode through the gap region.

The method includes forming a plurality of thin film transistors corresponding to a plurality of pixel regions; Forming a first electrode corresponding to a light emitting region of each of the pixel regions and a bus electrode corresponding to at least a part of the non-light emitting regions of the plurality of pixel regions, on the overcoat layer covering the plurality of thin film transistors; Forming an adhesion pattern on at least a part of the bus electrode; Forming a separation pattern covering at least a part of the adhesion pattern and having a reverse tapered cross section; Forming an organic layer on each of the first electrode and the separation pattern except a gap region around the adhesion pattern covered by the separation pattern among the bus electrodes; And forming a second electrode connected to the bus electrode through the gap region on the organic layer.

The organic light emitting display according to one embodiment of the present invention includes a bus electrode connected to a second electrode formed on the front surface of the organic light emitting display device. Accordingly, the resistance of the second electrode can be lowered, An increase in power can be prevented.

The bus electrode and the second electrode can be electrically connected to each other through the gap region formed by the separation pattern. Thus, since the etching process of the organic layer for electrical connection between the bus electrode and the second electrode is unnecessary, damage of the organic layer is prevented, and the reliability of the device can be improved.

Further, the separation pattern is formed so as to cover the upper portion of the adhesion pattern formed on at least a part of the bus electrode. Therefore, it is possible to prevent the separation of the separation pattern easily, and it is possible to prevent a smear phenomenon and deterioration of the image quality. Further, the width of the gap region can be limited within a predetermined range, and the uniformity of the gap region can be improved, so that the reliability of the organic light emitting display device can be further improved.

In addition, according to the method of manufacturing an organic light emitting diode display according to an embodiment of the present invention, since an adhesive pattern is formed together with the bank, no additional process is added, thereby preventing an increase in process time and process cost.

1 is an equivalent circuit diagram illustrating an organic light emitting display according to an embodiment of the present invention.
2 is a cross-sectional view showing each pixel region in Fig.
FIGS. 3A and 3B are views showing the bus electrode, the adhesion pattern, and the separation pattern of FIG. 2 in detail.
4 is a cross-sectional view of the common pad of Fig.
5 is a flowchart illustrating a method of manufacturing an OLED display according to an embodiment of the present invention.
6 is a flowchart showing "a step of forming a separation pattern"
Figs. 7A to 7I are process drawings showing the steps of Figs. 5 and 6. Fig.

Hereinafter, an organic light emitting diode display and a method of manufacturing the same according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

First, an organic light emitting display according to an embodiment of the present invention will be described with reference to FIGS. 1 to 4. FIG.

1 is an equivalent circuit diagram illustrating an organic light emitting display according to an embodiment of the present invention. 2 is a cross-sectional view showing each pixel region in Fig. FIGS. 3A and 3B are views showing the bus electrode, the adhesion pattern, and the separation pattern of FIG. 2 in detail. 4 is a cross-sectional view of the common pad shown in Fig.

1, an OLED display 100 according to an exemplary embodiment of the present invention includes a gate line GL and a data line DL, which are formed so as to cross each other to define a plurality of pixel regions PA, A plurality of thin film transistors (TFT) corresponding to the plurality of pixel regions PA and a plurality of organic light emitting elements ED corresponding to the plurality of pixel regions PA.

The organic light emitting diode display 100 further includes a common pad (CPD) commonly connected to a plurality of organic light emitting devices ED and connected to an external circuit.

Each organic light emitting element ED is connected to a thin film transistor (TFT). The organic light emitting device ED emits light based on a driving current corresponding to a potential difference between the thin film transistor TFT and the common pad CPD.

As shown in FIG. 2, each pixel region PA includes a light emitting region EA in which light is substantially emitted, and a non-light emitting region NEA that is a remaining portion excluding the light emitting region EA.

The OLED display 100 includes a substrate 111, a protective layer 113 covering the thin film transistor TFT and a thin film transistor TFT formed on the substrate 111, and a protective layer 113 formed on the protective layer 113 Gt; 114 < / RTI >

The thin film transistor TFT is formed on a substrate 111 and is formed on a gate electrode GE connected to a gate line (GL in Fig. 1), a gate insulating film 112 covering the gate electrode GE, And the source electrode SE and the drain electrode DE which are in contact with and spaced from each other on both sides of the active layer ACT. One of the source electrode SE and the drain electrode DE (for example, the source electrode SE) is connected to the data line (DL in FIG. 1), and the other one (for example, (DE) is connected to the organic light emitting device ED.

It should be noted that FIG. 2 only shows an example of a thin film transistor (TFT), and it is needless to say that the thin film transistor (TFT) according to one embodiment of the present invention may have a sectional structure different from that of FIG.

The organic light emitting diode display 100 includes a first electrode 121 corresponding to the light emitting region EA of each pixel region PA and a second electrode 121 corresponding to at least a part of the non- A bank 123 covering the rim of the first electrode 121, an adhesion pattern 124 formed on at least a part of the bus electrode 122, at least a part of the adhesion pattern 124, And a second electrode 127 formed on the organic layer 126. The organic layer 126 is formed on the organic layer 126. The organic layer 126 is formed on the organic layer 126. The organic layer 126 is formed on the organic layer 126,

At least a part of the periphery of the adhesion pattern 124 of the bus electrode 122 is a gap region which is shielded by the separation pattern 125 to prevent the formation of the organic layer 126. That is, the organic layer 126 is formed on the remaining surface except for the entire surface area including the first electrode 121, the bus electrode 122, the bank 123, the adhesion pattern 124, and the separation pattern 125. The organic layer 126 is formed not only on the first electrode 121, the bank 123 and the separation pattern 125 but also on the rest of the bus electrode 122 except for the gap region.

The second electrode 127 is formed on the organic layer 126 and is also formed in the gap region of the bus electrode 122 where the organic layer 126 is not formed and is electrically connected to the bus electrode 122.

The first electrode 121 corresponds to the light emitting region EA of each pixel region PA and is formed on the overcoat layer 114. [ The first electrode 121 is electrically connected to the thin film transistor (TFT) through the contact hole CT that penetrates the overcoat layer 114 and the protective layer 113 to expose a part of the drain electrode DE of the thin film transistor TFT).

The bus electrode 122 corresponds to at least a part of the non-emission regions NEA of the plurality of pixel regions PA and is formed on the overcoat layer 114. [ The bus electrode 122 is spaced from the first electrode 121 so as to be insulated from the first electrode 121. These bus electrodes are connected to a common pad (CPD in FIG. 1).

The first electrode 121 and the bus electrode 122 are formed of a conductive material.

The first electrode 121 and the bus electrode 122 are formed of a transparent conductive material having a work function similar to that of the organic layer 126. In the case where the organic light emitting display 100 is a backlight, For example, the first electrode 121 and the bus electrode 122 may be formed of a single layer or multilayer made of ITO.

Alternatively, when the OLED display 100 is a front emission type, the first electrode 121 and the bus electrode 122 may include a reflective conductive material. For example, the first electrode 121 and the bus electrode 122 may include a first layer formed of any one of Al and Ag or an alloy thereof, and a second layer formed of a material having a work function similar to that of the organic layer 126 . ≪ / RTI > At this time, the second layer may be ITO.

In this way, the first electrode 121 and the bus electrode 122 can be simultaneously formed with the same material and structure through one exposure process. However, it should be understood that the present embodiment is not limited to this, and that the first electrode 121 and the bus electrode 122 may be formed of materials and structures different from each other through two exposure processes.

Although not shown in detail in FIG. 2, the bus electrode 122 may be patterned in any form within a range insulated from the first electrode 121. For example, the bus electrode 122 is spaced apart from the first electrode 121 by a predetermined distance, and the bus electrode 122 is connected to at least one of the gate line (GL in FIG. 1) and the data line (DL in FIG. 1) And may be arranged in the same direction. Alternatively, the bus electrode 122 may be formed in a mesh shape.

A bank 123 is formed on the overcoat layer 114. The banks 123 may be formed to cover the rims of the first electrodes 121 and the bus electrodes 122, respectively.

The bank 123 is formed of an organic material in consideration of the adhesive force with the organic layer 126. Illustratively, the bank 123 may be formed of a polyimide-based material or photo acryl.

The bank 123 may have a trapezoidal (constant tapered) cross section.

Since the stepped regions of the first electrode 121 and the bus electrode 122 are obscured by the banks 123, rapid deterioration of the organic layer 126 due to the stepped regions can be prevented.

The adhesion pattern 124 is formed on at least a part of the bus electrode 122. [

This adhesion pattern 124 may be formed together with the bank 123. [ That is, the bank 123 and the adhesion pattern 124 can be formed at the same time by patterning the organic material material on the overcoat layer 114 through the same exposure process.

The adhesive pattern 124 is formed of the same material as the bank 123 on the same layer as the bank 123 and can have a constant tapered cross section like the bank 123. [

As shown in Figs. 2 and 3A, the separation pattern 125 is formed in a reverse tapered shape covering the upper portion of the adhesion pattern 124. As shown in Fig. That is, the separation pattern 125 is formed so as to cover only a part of the thickness from the upper surface of the adhesion pattern 124. Thus, at least a part of the thickness of the adhesive pattern 124 including the upper surface thereof is covered with the separation pattern 125. At this time, the separation pattern 125 is formed to contact only the upper portion of the adhesion pattern 124, and is separated from the bus electrode 122.

Alternatively, as shown in FIG. 3B, the separation pattern 125 may be formed so as to completely cover the adhesion pattern 124 and be in contact with the bus electrode 122.

Since the separation pattern 125 is formed to have a predetermined thickness on the adhesion pattern 124, the height of the upper surface of the separation pattern 125 with respect to the overcoat layer 114 is the same as that of the bank 123 and the adhesion pattern 124 It is higher than the top surface height.

The separation pattern 125 covers the upper portion of the adhesion pattern 124 and has a width larger than that of the adhesion pattern 124 and has a reverse tapered cross section so that when the organic layer 126 is formed, Which is a part of the periphery of the adhesion pattern 124 among the bus electrodes 122 to prevent the formation of the organic layer 126.

3A, the separation pattern 125 having an inverted tapered cross section has an upper corner 125a and an upper edge 125b extending from the upper edge 125a along the adhesion pattern 124 toward the bus electrode 122, And inclined left and right edges to the other two or more slopes A1 and A2. The separation pattern 125 may be symmetrical.

Illustratively, at least one side of both sides of the cross section of the separation pattern 125 has a first side 125b tangent to the upper edge 125a and inclined to the first tilt A1, and a second side 125b tangent to the first side 125b from the first side 125b. And a second side 125c extending toward the second slope 124 and inclined to a second slope A2 which is gentler than the first slope A1.

The first inclination A1 may be in a range of 45 degrees or more and 90 degrees or less (45 degrees? A1? 90 degrees), and the second inclination A2 may be in a range of 0 degrees or more and less than the first inclination A1 0 < / = A2 < / = A1).

As described above, the separation pattern 125 has a top surface having a wider width than the adhesion pattern 124 and a reverse tapered cross section that is inclined at first and second slopes A1 and A2, . The second inclination A2 of the second side 125c adjacent to the bus electrode 122 on at least one side of both sides of the separation pattern 125 is greater than the second inclination A2 of the first side 125b contacting the upper edge 125a A part of the periphery of the adhesion pattern 124 of the bus electrode 122 becomes a gap region 125d covered by the separation pattern 125 in the vertical direction since it is smaller than the inclination A1.

The width W_CV of the gap region 125d may be wider than the thickness of the separation pattern 125 as the second inclination A2 is closer to 0 deg. This has the advantage that the function of the separating pattern 125 is further enhanced.

The width W_CV of the gap region 125d is set to be smaller than the width W_CV of the adhesive pattern 124 at the contact points of the first and second sides 125b and 125c since the separation pattern 125 is formed on at least the upper portion of the adhesion pattern 124. [ . As a result, the uniformity with respect to the width 125d of the gap region 125d can be improved.

In addition, the separation pattern 125 may be formed of any material that can be patterned in an inverted tapered shape having a side inclined at two or more slopes. Illustratively, the separation pattern 125 may be formed by initiation and development of a negative photo resist material. For example, the separation pattern 125 may be formed of any one of a novolak series, a polyimide series, and a polyacryl series.

If the adhesion pattern 124 is not provided between the separation pattern 125 and the bus electrode 122 and the separation pattern 125 is formed directly on the bus electrode 122 made of inorganic material, And the bus electrode 122, the separation pattern 125 can be easily peeled off. As a result, a smear phenomenon occurs to deteriorate the image quality, and the reliability of the OLED display is deteriorated.

According to one embodiment of the present invention, however, since the adhesive pattern 124 made of an organic material having a high adhesive force with the separation pattern 125 is formed on the bus electrode 122 than the inorganic material, The peeling of the separation pattern 125 can be prevented as the portion is secured by the area in contact with the adhesion pattern 124. [ Therefore, deterioration in image quality due to a smear phenomenon can be prevented, and reliability of the organic light emitting display can be improved.

Since it is not necessary to increase the size of the separation pattern 125, that is, the cross-sectional area of the upper and lower surfaces, in order to improve reliability of the separation pattern 125, the size of the separation pattern 125 can be reduced , And consequently can be advantageous in increasing the aperture ratio.

The gap region 125d generated between the second side 125c of the separation pattern 125 and the bus electrode 122 has the width W_CV within the critical range due to the adhesive pattern 124, The uniformity of the width W_CV of the gap region 125d can be improved and the reliability of the electrical connection between the bus electrode 122 and the second electrode 127 through the gap region 125d can be improved .

2, the organic layer 126 is formed on the first electrode 121, the bus electrode 122, the bank 123, and the separation pattern 125, and a light emitting layer (not shown) made of an organic light emitting material ).

At this time, since the organic layer 126 is formed by an anisotropic deposition method, it is not formed on a part of the bus electrode 122 corresponding to the gap region 125d by the separation pattern 125. [ That is, a part of the bus electrode 122 corresponding to the gap region 125d is covered with the separation pattern 125, so that the organic layer 126 is not formed and is exposed.

In addition, although not shown in detail in FIG. 2, the organic layer 126 may include a light emitting layer, and may have a multi-layer structure composed of organic materials having different components or compositions. For example, the organic layer 126 may have a multilayer structure including an electron injection layer, an electron transport layer, a light emitting layer, a hole transport layer, and a hole injection layer.

The second electrode 127 is formed on the organic layer 126. Since the second electrode 127 is formed by an isotropic deposition method such as ALD (Atomic Layer Deposition) and sputtering, the second electrode 127 is also formed on the exposed part of the bus electrode 122 corresponding to the gap region 125d do. The bus electrode 122 and the second electrode 127 are electrically connected to each other through the gap region 125d generated by the separation pattern 125. [

Thereby, the organic light emitting element ED including the first and second electrodes 121 and 127 and the organic layer 126 interposed therebetween is formed in the light emitting region of each pixel region PA .

As shown in Fig. 4, the common pad CPD is formed in the non-display area NA which is the outside of the display area. The common pad CPD includes a first pad layer CPD1 formed with at least one of the gate line GL and the data line DL and a second pad layer CPD1 formed on the overcoat layer 114 CPD2). At this time, the second pad layer CPD2 may be formed together with the first electrode 121 and the bus electrode 122. The first and second pad layers CPD1 and CPD2 are interconnected through a contact hole passing through the overcoat layer 114, the protective layer 113, and the gate insulating layer 112. [

The second pad layer CPD2 of the common pad CPD is formed to be continuous with the bus electrode 122 so that the common pad CPD and the bus electrode 122 are interconnected.

Next, with reference to FIGS. 5, 6 and 7A to 7I, a method of manufacturing an OLED display according to an embodiment of the present invention will be described. FIG.

FIG. 5 is a flowchart illustrating a method of manufacturing an organic light emitting display according to an embodiment of the present invention, and FIG. 6 is a flowchart illustrating a step of forming a separation pattern in FIG. 7A to 7I are process drawings showing the steps of Figs. 5 and 6. Fig.

As shown in FIG. 5, a method of manufacturing an organic light emitting display according to an embodiment of the present invention includes forming a plurality of thin film transistors corresponding to a plurality of pixel regions (S110), forming a plurality of thin film transistors (S120) forming a first electrode corresponding to a light emitting region of each pixel region and a bus electrode corresponding to at least a part of the non-light emitting regions of the plurality of pixel regions on the layer, Forming a bank covering the rim and forming an adhesion pattern on at least a part of the bus electrode (S130), forming a separation pattern having a reverse tapered cross section covering at least a part of the adhesion pattern (S140) (S150) forming an organic layer on each of the first electrode and the separation pattern except the gap region of the electrode, and forming a second electrode on the organic layer through the gap region, the second electrode being connected to the bus electrode S160).

6, the step of forming the separation pattern includes a step (S141) of forming a material layer covering the first electrode, the bus electrode, the bank, and the adhesion pattern on the overcoat layer, Selectively activating (S142), and developing the activated material layer to form a separation pattern (S143).

A plurality of thin film transistors (TFTs) corresponding to a plurality of pixel regions PA are formed on a substrate 111 and a substrate 111, as shown in Fig. 7A. (S110)

Illustratively, the step of forming a thin film transistor (TFT) S110 includes forming a gate line (GL in FIG. 1) and a gate electrode (GE) connected to the gate line GL on a substrate 111, A step of forming a gate insulating film 112 covering the gate line GL and the gate electrode GE and a step of forming an active layer ACT overlapping the gate electrode GE on the gate insulating film 112, A data line DL crossing the gate line GL on the gate electrode 112 and a source electrode SE and a drain electrode DE which are in contact with and spaced from each other on both sides of the active layer ACT, A step of forming a protective layer 113 covering the data line DL, the source electrode SE and the drain electrode DE on the entire surface of the insulating film 112 and the step of forming a flat overcoat layer 114 on the protective layer 113, To form a second layer. At this time, either the source electrode SE or the drain electrode DE (for example, the source electrode SE) is connected to the data line (DL in FIG. 1).

A step S110 of forming the thin film transistor TFT is performed after forming the overcoat layer 114 and after the formation of the overcoat layer 114, the other one of the source electrode SE and the drain electrode DE, which is not connected to the data line DL, Forming a contact hole CT through the protective layer 113 and the overcoat layer 114 so as to expose a part of the source electrode (e.g., the drain electrode DE).

Although not shown separately, in the step of forming the gate electrode GE or the step of forming the source electrode SE and the drain electrode DE in the step S110 of forming the thin film transistor TFT, The first pad layer CPD1 of the pad CPD1 may be further formed and the protective layer 113 and the second protective layer CP2 may be formed to expose at least a part of the first pad layer CPD1 in the step of forming the contact hole CT. The contact hole passing through the overcoat layer 114 can be further formed.

The first electrode 121 corresponding to the light emitting region EA of each pixel region PA and the non-emitting region NEA (not shown) of the plurality of pixel regions PA are formed on the overcoat layer 114, The bus electrodes 121 and 122 corresponding to at least a part of the bus electrodes 121 and 122 are formed. (S120)

A step S120 of forming the first electrode and the bus electrodes 121 and 122 may be performed by forming a conductive material film (not shown) on the entire surface of the overcoat layer 114 and then patterning a conductive material film (not shown) A first electrode 121 and a bus electrode 122 which are mutually insulated are formed.

The first electrode 121 is electrically connected to the thin film transistor TFT through the contact hole CT.

The bus electrode 122 may be in the form of a mesh (MESH) spaced apart from the first electrode 121 by a predetermined distance.

The first electrode 121 and the bus electrode 122 may be formed of a transparent conductive material. Or a front emission type organic light emitting display, the first electrode 121 and the bus electrode 122 may be formed as a multilayer including a reflective conductive material. For example, the first electrode 121 and the bus electrode 122 may include a first layer formed of any one of Al and Ag or an alloy thereof, and a second layer formed of a material having a work function similar to that of the organic layer 126 Layer structure. At this time, the second layer may be ITO.

The first pad 121 and the bus electrode 122 are formed through a contact hole penetrating at least the passivation layer 113 and the overcoat layer 114 in the step S120 of forming the first electrode 121 and the bus electrode 122, And a second pad layer CPD2 in contact with the first electrode pad CPD1.

A bank 123 covering the rim of each of the first electrode 121 and the bus electrode 122 is formed on the overcoat layer 114 and at the same time at least a portion of the bus electrode 122 An adhesive pattern 124 is formed on a part of the substrate. (S130)

The step of forming the bank 123 and the adhesion pattern 124 may include forming an organic insulating film (not shown) covering the first electrode 121 and the bus electrode 122 on the entire surface of the overcoat layer 114 , And patterning an organic insulating film (not shown) to form the bank 123 and the adhesion pattern 124.

At this time, the organic insulating layer (not shown), that is, the bank 123 and the adhesion pattern 124 may be selected from a polyimide-based material or a photo acryl.

Since the bank 123 and the adhesion pattern 124 are formed through the same exposure process, they include the upper surface of the same height based on the overcoat layer 114. The bank 123 and the adhesion pattern 124 may be formed in a regular taper shape by utilizing the material characteristics of an organic insulating film (not shown).

Next, as shown in Fig. 7D, a material layer 130 is formed on the entire surface. (S141). At this time, the material layer 130 may be selected from any insulating material that can be formed in a reverse tapered shape including inclined sides inclined at two or more different slopes through activation and development.

Illustratively, the material layer 130 may be a negative photoresist material. That is, the material layer 130 may be formed of any one of novolak-based, polyimide-based, and polyacryl-based materials.

7E, light LIGHT is irradiated to the material layer 130 side in a state where the mask 200 is aligned on the material layer 130, and a part 131 of the material layer 130 is irradiated with light Selectively activating by a certain thickness TH_I. (S142)

The mask 200 includes an opening 201 corresponding to a portion around the adhesion pattern 124 of the bus electrode 122 and a blocking portion 202 outside the opening 201.

The portion 131 that is activated by light LIGHT in the material layer 130 according to the process time for irradiating the material layer 130 with light in the step S142 of activating the material layer 130, The thickness TH_I of the material layer 130 is less than the total thickness TH_A of the material layer 130.

The thickness TH_I of the part 131 to be activated in the material layer 130 may be smaller than the total thickness TH_A 'of the material layer 130 stacked on the adhesion pattern 124. That is, the activated material layer 131 is spaced from the adhesion pattern 124.

Activating only the portion 131 of the material layer 130 corresponding to the opening 201 of the mask 200 by the thickness TH_I that is less than the total thickness TH_A of the material layer 130 is the same as the separation pattern 125 are inclined at two or more different tilt angles. That is, when the part 131 of the material layer 130 corresponding to the opening 201 of the mask 200 is activated by the entire thickness TH_A, the tapered shape including the inclined side surface with only one inclination This is because the pattern 125 is formed.

Next, the activated material layer (131 in Fig. 7E) is developed to form a separation pattern 125. [ (S143)

Illustratively, as shown in FIG. 7F, when activating a portion of the material layer 130 and then developing it with heat, the activated material layer (131 in FIG. 7E) do. At this time, the polymerized material layer 132 is polymerized by heat, and at least a part of the polymerized material layer 132 flows toward the adhesion pattern 124 side.

Thereafter, the remainder of the material layer (130 in FIG. 7F) is removed except for the polymerized material layer (132 in FIG. 7F).

Thus, as shown in Fig. 7G, a reverse tapered separation pattern 125 covering the upper portion of the adhesive pattern 124 is formed.

The separation pattern 125 covers at least a part of the thickness including the upper surface of the adhesion pattern 124 and is formed on the upper surface of the wider width than the adhesion pattern 124 and the side surface inclined at two or more different slopes (A1, And has a reversed tapered cross section including a tapered cross section.

Illustratively, at least one side of both sides of the cross section of the separation pattern 125 has a first side 125b tangent to the upper edge 125a and inclined to the first tilt A1, and a second side 125b tangent to the first side 125b from the first side 125b. And a second side 125c extending toward the second slope 124 and inclined to a second slope A2 which is gentler than the first slope A1.

The first inclination A1 may be in a range of 45 degrees or more and 90 degrees or less (45 degrees? A1? 90 degrees), and the second inclination A2 may be in a range of 0 degrees or more and less than the first inclination A1 0 < / = A2 < / = A1).

At this time, the first and second slopes A1 and A2 correspond to the process time of the step of activating the material layer 130 (S141) and the process time of the step of developing the activated material layer 131 (S142) .

As described above, the separation pattern 125 covers the upper portion of the adhesion pattern 124 and has a width larger than that of the adhesion pattern 124, and first and second slopes A1 and A2 ) Of the tapered shape. Therefore, a portion of the bus electrode 122 around the adhesion pattern 124 becomes a gap region 125d covered by the separation pattern 125 in the vertical direction.

7H, the organic layer 126 is formed on the entire surface including the first electrode 121, the bus electrode 122, the bank 123, and the separation pattern 125. Next, as shown in FIG. (S150)

The organic layer 126 is not formed on the gap region 125d of the bus electrode 122 by the separation pattern 125 because the organic layer 126 is formed by anisotropic deposition. That is, the gap region 125d of the bus electrode 122 is covered by the separation pattern 125, so that the organic layer 126 is not formed and is exposed.

Although not shown in detail in FIG. 7H, the organic layer 126 may be a multi-layer structure including a light emitting layer. Illustratively, the organic layer 126 may be a multi-layer structure including an electron injection layer, an electron transport layer, a light emitting layer, a hole transport layer, and a hole injection layer made of an organic material having a different component or composition.

As shown in FIG. 7I, a conductive material is laminated on the organic layer 126 to form the second electrode 127. (S160)

At this time, the step of forming the second electrode 127 (S160) is performed by an isotropic deposition method such as ALD (Atomic Layer Deposition) and sputtering, And the second electrode 127 is also formed on the exposed part of the phase. As a result, the second electrode 127 is electrically connected to the bus electrode 122 through the gap region 125d.

As described above, the organic light emitting display according to one embodiment of the present invention includes the bus electrode 122 for lowering the resistance of the second electrode 127 formed on the front surface, 125d are used to electrically connect the bus electrode 122 and the second electrode 127 to each other. That is, the bus electrode 122 and the second electrode 127 can be connected without patterning the organic layer 126. Since the second electrode 127 is connected to the bus electrode 122 and the resistance of the second electrode 127 can be reduced, the luminance of the second electrode 127 is lowered, Can be prevented.

The separation pattern 125 is formed to cover the upper portion of the adhesion pattern 124 formed on at least a part of the bus electrode 122. That is, since the separation pattern 125 is not fixed to the bus electrode 122 but is fixed to the upper portion of the adhesion pattern 124, the width of the adhesion surface of the separation pattern 125 can be secured. As a result, the separation pattern 125 can be prevented from easily separating, thereby preventing smearing and deterioration in image quality.

The width W_CV of the gap region 125d by the separation pattern 125 can be limited to within the predetermined range by the adhesion pattern 124 and the uniformity of the gap region 125d can be improved . Therefore, the reliability of the connection between the bus electrode 122 and the second electrode 127 can be improved, and as a result, the reliability of the organic light emitting display can be improved.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Will be clear to those who have knowledge of.

100: organic light emitting display GL: gate line
DL: Data line TFT: Thin film transistor
ED: organic light-emitting device CPD: common pad
PA: pixel area
EA: light emitting region NEA: non-emitting region
111: substrate 112: gate insulating film
113: protective layer 114: overcoat layer
121: first electrode 122: bus electrode
123: bank 124: adhesive pattern
125: separation pattern 125d:
126: organic layer 127: second electrode
W_CV: Width of gap area
CPD1, CPD2: first and second pad layers of a common pad

Claims (13)

A plurality of pixel regions each including a light emitting region and a non-light emitting region;
A first electrode corresponding to a light emitting region of each pixel region;
A bus electrode corresponding to at least a part of non-emission regions of the plurality of pixel regions;
An adhesion pattern formed on a part of the bus electrode;
A separation pattern formed to cover at least a part of the adhesion pattern and having an inverted tapered cross section;
An organic layer formed on each of the first electrode and the separation pattern except for a gap region around the adhesion pattern covered by the separation pattern among the bus electrodes, the organic layer including a light emitting layer; And
And a second electrode formed on the organic layer and connected to the bus electrode through the gap region. The method according to claim 1,
Further comprising a bank covering the rim of the first electrode,
Wherein the adhesion pattern is formed in the same layer as the bank and has the same tapered shape as the material of the bank. The method according to claim 1,
Wherein the separation pattern is formed of a negative photoresist material. The method according to claim 1,
Wherein the separation pattern is formed to completely cover the adhesion pattern. The method according to claim 1,
Wherein at least one side of the cross section of the separation pattern includes a first side contacting the upper edge and inclined at a first inclination and a second side extending from the first side and inclined at a second inclination that is gentler than the first inclination ,
The first inclination is in a range of 45 degrees or more and 90 degrees or less,
Wherein the second inclination is in a range of 0 DEG or more and less than the first inclination. The method according to claim 1,
Wherein the bus electrode is formed on the same layer as the first electrode so as to be insulated from the first electrode with the same material as the first electrode. Forming a plurality of thin film transistors corresponding to a plurality of pixel regions;
Forming a first electrode corresponding to a light emitting region of each of the pixel regions and a bus electrode corresponding to at least a part of the non-light emitting regions of the plurality of pixel regions, on the overcoat layer covering the plurality of thin film transistors;
Forming an adhesion pattern on at least a part of the bus electrode;
Forming a separation pattern covering at least a part of the adhesion pattern and having a reverse tapered cross section;
Forming an organic layer on each of the first electrode and the separation pattern except a gap region around the adhesion pattern covered by the separation pattern among the bus electrodes; And
And forming a second electrode connected to the bus electrode through the gap region on the organic layer. 8. The method of claim 7,
A step of forming a bank covering the rim of the first electrode on the overcoat layer in the step of forming the adhesion pattern,
Wherein the adhesive pattern and the bank are formed to have a regular tapered cross section. 9. The method of claim 8,
The forming of the separation pattern may include:
Forming a material layer covering the first electrode, the bus electrode, the bank, and the adhesion pattern on the entire surface of the overcoat layer;
Selectively activating the material layer by a portion of the thickness of the bus electrode using a mask corresponding to at least a portion around the adhesion pattern; And
And developing the activated material layer to form the separation pattern. 10. The method of claim 9,
After activating the material layer, the thickness of the activated material layer is less than the total thickness of the material layer,
In the step of developing the activated material layer, the activated material layer flows during development to form a separation pattern covering the top of the adhesion pattern,
Wherein at least one side of the cross section of the separation pattern includes a first side contacting the upper edge and inclined at a first inclination and a second side extending from the first side and inclined at a second inclination that is gentler than the first inclination ,
The first inclination is in a range of 45 degrees or more and 90 degrees or less,
Wherein the second inclination is in a range of 0 DEG or more and less than the first inclination. 10. The method of claim 9,
In the step of forming the material layer,
Wherein the material layer is formed of a negative photoresist material. 10. The method of claim 9,
Wherein in the step of activating the material layer, the activated material layer is spaced from the adhesion pattern. 8. The method of claim 7,
In the step of forming the organic layer, the organic layer is formed using an anisotropic deposition method,
Wherein the second electrode is formed using an isotropic deposition method in the step of forming the second electrode.

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