KR20150000148A - Chuck Table And Manufacturing Method Of The Same - Google Patents

Chuck Table And Manufacturing Method Of The Same Download PDF

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Publication number
KR20150000148A
KR20150000148A KR20130072185A KR20130072185A KR20150000148A KR 20150000148 A KR20150000148 A KR 20150000148A KR 20130072185 A KR20130072185 A KR 20130072185A KR 20130072185 A KR20130072185 A KR 20130072185A KR 20150000148 A KR20150000148 A KR 20150000148A
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KR
South Korea
Prior art keywords
adsorption pad
main body
pad
chuck table
recessed portion
Prior art date
Application number
KR20130072185A
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Korean (ko)
Inventor
임재영
김도진
Original Assignee
한미반도체 주식회사
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Application filed by 한미반도체 주식회사 filed Critical 한미반도체 주식회사
Priority to KR20130072185A priority Critical patent/KR20150000148A/en
Publication of KR20150000148A publication Critical patent/KR20150000148A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to a chuck table and a chuck table manufacturing method capable of preventing shrinkage of a suction pad on a chuck table of a semiconductor equipment and a positional error that may be caused thereby.

Description

Technical Field [0001] The present invention relates to a chuck table and a chuck table,

The present invention relates to a chuck table and a chuck table manufacturing method of a semiconductor cutting apparatus. More particularly, the present invention relates to a chuck table and a chuck table manufacturing method capable of preventing shrinkage of a suction pad on a chuck table of a semiconductor equipment and a positional error that may be caused thereby.

The cutting process in the semiconductor manufacturing process is generally a process of separating a semiconductor strip (semiconductor material) that has undergone a predetermined semiconductor manufacturing process into individual semiconductor units (for example, individual semiconductor chips or semiconductor packages). Such a semiconductor cutting process can be performed by cutting the semiconductor strip (semiconductor material) into individual semiconductor units by using a cutting blade as a cutting device in a state of being adsorbed and mounted on the chuck table 1 'by air pressure.

Fig. 1 shows a plan view of a general chuck table 1 ', and Figs. 2 and 3 show a cross-sectional view and a shot image of the chuck table 1' in which a problem occurs in the adsorption pad 200 '.

The chuck table 1 'shown in FIG. 1 includes a main body 100' of a metal material having a connection hole 110 'formed therein for performing a semiconductor cutting process and a suction pad 200' '). A suction hole 210 'and a blade relief groove 230' through which the cutting blade can pass may be formed on the adsorption pad 200 '.

2 and 3) is formed on the upper surface of the main body 100 'constituting the chuck table 1' so that the suction pad 200 'can be seated thereon, A method of adhering the adsorption pad 200 'to the accommodation portion with an adhesive or the like and then forming a suction hole 210' or a blade relief groove or the like at a precise position measured by using a vision unit or the like on the adsorption pad 200 ' The chuck table 1 'can be manufactured.

The chuck table 1 'can be contracted or inflated over time, and when the shrinkage of the chuck table 1' is repeated, the chuck table 1 ' The body 100 'of the adsorption pad may be separated from the adhesion site of the adsorption pad, or a crack may be generated in a specific site.

2 shows a cross-sectional view and an image pickup plane image of the chuck table 1 'in which a part of the side-direction adhesion surface of the main body 100' is separated from the adsorption pad 200 'constituting the chuck table 1'.

2 (a) is a cross-sectional view of the chuck table 1 'with the adsorption pad 200' and the main body 100 'separated. FIG. 2 (b) And the main body 100 'are separated from each other.

As shown in FIG. 2 (a), the adsorption pad 200 'constituting the chuck table 1' can be adhered in a state of being seated in a receiving portion formed in a metal body 100 '. A connection hole 110 'is formed on the bottom surface of the receiving portion so that air can be selectively applied thereto. The connection hole 110' is communicated with a suction hole 210 'formed on the suction pad 200' have. The upper surface of the suction pad 200 'may be provided with a blade relief groove 230' for preventing interference during cutting or cutting of the cutting blade.

Since the absorbent pad 200 'bonded to the main body 100' is formed in the shape of a large plate of rubber material, the receiving portion (not shown) in which the lower portion of the absorbent pad 200 ' The region may be configured to be recessed to have a step.

The adsorption pad 200 'may be adhered to the receiving portion of the main body 100' by applying an adhesive.

Since the adsorption pad 200 'is made of a rubber material, when the temperature or other environment change occurs, the adsorption pad 200' can be contracted in the horizontal direction.

Therefore, as shown in the enlarged view of FIG. 2 (a) and FIG. 2 (b), the side surface of the adsorption pad 200 'and the side surface of the main body 100' The bonding area of the inner side surface 101 'of the receiving portion can be separated (S) without maintaining the bonding state.

Particularly, since the adsorption pad 200 'is made of a rubber material in the form of a thin plate, the amount of shrinkage in the vertical direction is not so large. However, separation of the adsorption area of the adsorption pad 200' and the main body 100 ' May cause a positional error of the semiconductor strip to be mounted on the adsorption pad 200 ', resulting in defective product.

The separation phenomenon of such an adhesive region may be generated locally only in a part of the inner side surface 101 'of the receiving portion of the main body 100', as shown in Fig. 2 (b).

3 shows a cross-sectional view and an imaging plane image in which a crack C is generated in the adsorption pad 200 'bonded to the main body 100' constituting the chuck table 1 '. 3 (a) is a cross-sectional view of a state in which a crack C is generated in the adsorption pad 200 'of the chuck table 1', and FIG. 3 (b) Shows an imaging plane image in a state where a crack C is generated.

Horizontal contraction of the adsorption pad 200 'may cause a crack in the vicinity of the adhesion region in addition to separation of the adhesion region. Even in the case where the adhesive force of the adhesive pad 200 'and the body 100' by the adhesive is sufficient and the adhesive area is not separated, the horizontal contraction of the suction pad 200 'may cause cracks C of the rubber material in the vicinity of the adhesive area, Can be generated.

Such a crack may be caused to adhere to the adsorption pad 200 'to cause a positional error of the semiconductor strip to be cut, and eventually to cause a defect in the cut product.

The separation S of the adhesion region between the adsorption pad 200 'and the main body 100' caused by the contraction of the adsorption pad 200 'or the generation of the crack C of the adsorption pad 200' An error is generated in the position of the blade relief groove 230 'formed in the adsorption pad 200' after the adhesion, which may cause defective products or lower the durability of the product.

The present invention relates to a chuck table and a chuck table capable of separating a bonding site of a rubber material adsorption pad of a chuck table and a main body of a chuck table from each other or preventing a crack from occurring in the adsorption pad, And a method for providing the same.

According to an aspect of the present invention, there is provided a chuck table of a semiconductor cutting apparatus, comprising: a rubber-made adsorption pad having a plurality of protruding engaging portions on a side surface thereof and having an adsorption hole penetrating the semiconductor material in the up- A chuck table including a main body made of a metal material and having a receiving portion accommodating the adsorption pad and having a shape corresponding to the engaging portion of the adsorption pad, and a connection hole formed to communicate with the adsorption hole.

In this case, the recessed portion may be formed so that the cross-sectional area of the recessed portion is reduced along a direction of an entrance of the recessed portion formed from the certain inner side of the recessed portion to the receiving portion side so that the engagement state of the engagement portion of the suction pad and the recessed portion can be maintained have.

The width of the concave portion may be changed in a plane direction defined by the upper surface of the main body or a depth direction of the receiving portion.

Here, the cross-sectional area of the concave portion may be minimum at the entrance of the concave portion formed on the side of the receiving portion.

In addition, the recessed portion and the engaging portion may be formed at a position exposed to the upper surface of the main body and the adsorption pad.

Here, the recessed portion and the engaging portion may be provided at positions that are not exposed to the upper surface of the main body and the adsorption pad.

In this case, the absorption pad may be adhered to the receiving portion of the main body in a state in which the molten rubber is filled in the receiving portion of the main body and the latch portion is formed or the latch portion is formed.

The protruding portions may be formed at regular intervals on the bottom surface of the receiving portion.

Here, the protrusion may be formed in the form of a partition or a column.

Further, the surface of the receiving portion and the protruding portion may be subjected to the unevenness treatment.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising the steps of: forming an accommodating portion for accommodating a sucking pad in a main body of a metal material; Wherein the forming of the receiving portion includes forming a concave portion having a shape corresponding to the engaging portion of the adsorption pad on the side surface of the receiving portion.

After the step of forming the adsorption pad, the adsorption pad may further include a suction pad for adsorbing the semiconductor material on the upper surface of the adsorption pad and a suction pad processing step for forming a blade relief groove for preventing interference of the cutting blade.

In addition, the adsorption pad forming step may be performed by filling molten rubber in the receiving portion of the main body.

Here, the step of forming the adsorption pad may be performed by a method of adhering the adsorption pad previously formed with the engagement part to the accommodation part.

In this case, the receiving portion forming step may include forming protrusions on the bottom surface of the receiving portion at regular intervals.

According to the chuck table according to the present invention, the adhesion state of the adsorption pad and the body constituting the chuck table can be further strengthened.

Specifically, according to the chuck table according to the present invention, separation phenomenon between the adsorption pad and the main body can be prevented or mitigated by a physical method other than the adhesive, and occurrence of cracks or the like generated in the adsorption pad can be prevented.

It is possible to minimize the error of the semiconductor cutting process which may be caused by the separation phenomenon of the adsorption pad or the occurrence of cracks, so that the failure of the cut semiconductor chip can be minimized and the durability of the chuck table itself can be improved .

Figure 1 shows a plan view of a typical chuck table.
2 shows a cross-sectional view and a shot image of a general chuck table in which a problem occurs in the adsorption pad.
Fig. 3 shows a sectional view and a shot image of a general chuck table in which a problem occurs in the adsorption pad.
Figure 4 shows a top view of a chuck table according to the invention.
Fig. 5 shows a perspective view and a cross-sectional view of the chuck table shown in Fig.
6 shows an imaging plane image of a chuck table according to the present invention.
Figure 7 shows another embodiment of a chuck table according to the present invention.
Figure 8 shows a cross-sectional view of another embodiment of a chuck table according to the present invention.
9 shows a block diagram of a method of manufacturing the chuck table according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments disclosed herein are provided so that the disclosure can be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like reference numerals designate like elements throughout the specification.

Fig. 4 shows a plan view of the chuck table 1 according to the present invention, and Fig. 5 shows a perspective view and a cross-sectional view of the chuck table 1 shown in Fig.

The chuck table 1 according to the present invention as shown in FIGS. 4 and 5 also includes a metal body (not shown) formed with a connection hole 110 for sucking and mounting a semiconductor strip (semiconductor material) (100), a suction hole (210) for communicating with the connection hole (110) of the main body (100) and applying pneumatic pressure on the main body (100), and a blade relief groove (230) through which the cutting blade can pass, And an adsorption pad 200 made of a rubber material.

The main body 100 constituting the chuck table 1 according to the present invention is also provided with a receiving portion (see FIG. 5) recessed to a predetermined depth so that the suction pad 200 can be seated on the upper surface thereof, The adsorptive pad 200 is manufactured by a method of bonding the adsorptive pad 200 with an adhesive or the like and then forming the adsorptive hole 210 or the blade relief groove 230 at an accurate position measured using a vision unit or the like on the adsorption pad 200 .

The present invention can prevent separation of the adhesion area between the adsorption pad 200 and the main body 100 even if the adhesive force between the adsorption pad 200 and the main body 100 is lost or lacked, It is possible to further include separation preventing means for preventing the main body 100 from being separated. The detachment preventing means includes a latching portion 250 provided on the side of the adsorption pad 200 and a recessed portion 150 provided on the side of the main body 100 to which the latching portion 250 of the adsorption pad 200 is caught and fixed .

Specifically, the chuck table 1 of the semiconductor cutting apparatus according to the present invention includes a plurality of protruding engaging portions 250 provided on a side surface (or a side edge), and a suction hole 210 for sucking semiconductor material And a recessed portion 150 having a shape corresponding to the retaining portion 250 of the absorbing pad 200 and accommodating the absorbing pad 200. The absorbing pad 200 is made of rubber, (Not shown), and a connection hole 110 formed to be in communication with the suction hole 210. The main body 100 may be made of a metal.

4 and 5, the suction pad 200 constituting the chuck table 1 according to the present invention is provided with a plurality of latching parts 250 along the side surface thereof.

4 and 5, the hook 250 of the suction pad 200 has a circular shape. However, if it is possible to provide a hooking function of the hook 250 to be described later The shape is not limited.

The latching part 250 may be provided along a side surface of the suction pad 200. Therefore, when the adsorption pad 200 is adhered to the main body 100, separation between the adsorption pad 200 and the main body 100 can be prevented in the entire area of the adsorption pad 200.

The main body 100 may be formed with a recessed portion formed such that a step is formed so that the suction pad 200 is adhered to the main body 100. The recessed portion 150 is formed on the inner side surface 101 Vertical direction side surface) of the main body.

4 and 5, the engaging portion 250 of the adsorption pad 200 and the recessed portion 150 formed in the inner side surface 101 of the receiving portion of the main body 100 correspond to each other Shape. A method of configuring the engaging portion 250 of the adsorption pad 200 and the recessed portion 150 formed in the inner side surface 101 of the receiving portion of the main body 100 to have corresponding shapes will be described later.

The engaging portion 250 of the adsorption pad 200 and the recessed portion 150 of the main body 100 as separation preventing means for preventing the separation between the adsorption pad 200 and the main body 100 are prevented from separating In order to perform, besides merely constituting the shape corresponding to the shape or the shape to be formed, the following conditions must be satisfied. Will be described with reference to FIG.

6 shows an imaging plane image of the chuck table 1 according to the present invention.

The shape of the latching part 250 of the suction pad 200 and the shape of the recessed part 150 of the main body 100 correspond to each other. The width wi at a certain inner point of the recessed portion 150 should be larger than the width we.

That is, the recessed groove portion 150 has a cross-sectional area larger than the entrance direction of the recessed portion 150 formed at a certain inner side of the recessed portion 150 toward the receptacle portion 150 (the inlet direction of the recessed portion provided with the inlet on the receiving side) So that the fastening state between the fastening part 250 of the suction pad and the recessed part 150 can be maintained.

The size of the width of the latching portion 250 at the entrance of the recessed portion 150 may be smaller than the width of the recessed portion 250 when the shape of the latching portion 250 has a shape corresponding to the shape of the recessed portion 150, The size of the width of the latching part 250 at a certain inner point of the recessed part 150 may be equal to the width of the opening of the recessed part 150 of the recessed part 150, And may have a size corresponding to the width wi at the point.

Therefore, even when each of the engaging portions 250 of the adsorption pad 200 is inserted into the respective recessed portions 150 of the main body 100 and the adsorption pad 200 is contracted in the horizontal direction The engaging portion 250 of the adsorption pad 200 is engaged with the inlet of the recessed portion 150 while being inserted into the recessed portion 150 to separate the adsorption pad 200 from the main body 100 .

Therefore, even if the suction pad 200 is entirely contracted in the horizontal direction, the latching protrusion as the latching part 250 inserted into the recessed part as the recessed part 150 formed on the side surface of the receiving part of the main body 100, Since the width wi at a certain point inward of the recessed portion 150 is larger than the width w1 of the inlet of the recessed portion 150, it can not pass through the inlet of the recessed portion 150 and can perform the separation preventing function.

In the embodiment shown in FIGS. 4 to 6, the latching protrusion as the latching part 250 is a part of a circle including the maximum diameter. However, in the recessed part as the recessing part 150, The shape of the latching part 250 may be variously modified if the latching part is not separated from the inserted part.

Fig. 7 shows another embodiment of the chuck table 1 according to the present invention. The description with reference to Figs. 1 to 6 is omitted.

The embodiment shown in FIG. 7 also has a configuration in which the shape of the latching protrusion as the latching portion 250 of the suction pad 200 corresponds to the shape of the recessed portion as the recessed portion 150 of the main body 100, The width wi at a certain inner point of the recessed portion 150 is larger than the width we of the recessed portion of the recessed portion 150 as the recessed portion 150. Further, The width w1 of the inlet of the recessed portion is smaller than the width of any region other than the inlet of the recessed portion.

That is, the width of the recess may be minimized at the entrance of the recess, and may have a triangular shape increasing linearly in each end direction of the latching part 250.

The separation preventing function of the adsorption pad 200 and the main body 100 can be further enhanced by the shape of the latching protrusion as the latching part 250 of the triangular shape.

4 to 7 illustrate a state in which the latching protrusion of the suction pad 200 as the latching part 250 and the latching protrusion of the main body 100 in order to prevent separation of the suction pad 200 and the main body 100, (X-axis direction or y-axis direction) in order to perform a separation preventing function when the adsorption pad 200 is contracted. Alternatively, the width of the recessed portion 150 may be changed in a plane direction (x axis -y axis direction) formed by the upper surface of the main body or an inlet direction of the recessed portion in the depth direction (x axis -z axis direction) The adsorption pad 200 and the main body 100 can be prevented from separating from each other.

However, in order to perform the separation prevention function when the adsorption pad 200 is retracted and the width of the recessed portion as the recessed portion 250 and the recessed portion as the recessed portion 150 of the main body 100 contracts, The width of the concave portion does not have to be changed only in the horizontal direction.

Fig. 8 shows a cross-sectional view of another embodiment of the chuck table 1 according to the present invention.

8A is a perspective view illustrating a state in which the engagement protrusion 250 of the suction pad 200 and the recessed portion 150 of the main body 100 are formed in order to prevent separation between the suction pad 200 and the main body 100. [ Is changed in the vertical direction (z-axis direction) in order to perform the separation preventing function when the adsorption pad 200 is contracted.

However, the width of the latching portion 250 or the recessed portion 150 may be changed in the horizontal direction or the vertical direction to provide the separation preventing function. However, the width or the cross- (Reduced in the inlet direction of the recessed portion) so that the separation preventing function between the adsorption pad 200 and the main body 100 can be further enhanced.

That is, the latching protrusion of the suction pad 200 as the latching part 250 performs the separation preventing function between the suction pad 200 and the main body 100 even when the width in the vertical direction is changed without changing the width in the horizontal direction .

4 to 7 show that the engaging protrusions 250 of the suction pad 200 and the engaging recesses 150 of the main body 100 are formed on the chuck table 1 or the upper surface of the main body 100 8 (a), the recessed portion is formed at the central portion of the side surface of the receiving portion of the main body 100, and the latching protrusion is formed at the corresponding position, so that the chuck table 1), the fixing holes and the engagement protrusions may not be observed on the upper surface.

8B shows an example in which the latching portion 260 and the protrusion 160 are provided as the separation preventing means of the adsorption pad 200 and the main body 100. As shown in FIG.

The latching portions 260 and the protrusions 160 provided for preventing the separation of the absorption pad 200 and the main body 100 constituting the chuck table 1 are different from those of the above- It is possible to additionally provide a function of preventing a malfunction.

Specifically, the embodiment shown in FIG. 8 (b) is characterized in that a latching portion 260 is provided on a suction pad 200 constituting the chuck table 1 according to the present invention, And a protrusion 160 to which the protrusion 260 is fixed.

However, unlike the above-described embodiments, the protrusion 160 of the embodiment shown in FIG. 8 (b) is not formed in the groove formed on the inner side surface 101 of the receiving portion of the main body 100, but on the bottom surface of the receiving portion of the main body 100 It has a protruded column or partition shape.

The locking protrusion 260 as the locking part fixed by the protrusion is disposed between the side surface of the receiving part of the main body 100 and the protrusion so as to prevent horizontal shrinkage by the protrusion and extends downward .

Here, the height h2 of the projecting portion 160 should be lower than the height h1 of the depressed step of the receiving portion. The protruding portion serving as the protruding portion 160 serves as a boundary, and the locking protrusion must be connected to the adsorption pad side.

8 (b), the latching protrusion 260 of the suction pad 200 and the protrusion 160 of the main body 100 constitute the suction pad 200, Separation phenomenon of the adsorption pad 200 and the main body 100 can be prevented.

The embodiment shown in FIG. 8B may be used to prevent separation of the adsorption pad 200 and the main body 100 due to the horizontal contraction of the adsorption pad 200, It is possible to prevent or alleviate the crack generated in the vicinity of the bonding region of the main body 100 to some extent.

The adhesive region or the adhesive surface of the adsorption pad 200 and the main body 100 may be physically or chemically cured by adhesion during the adhesive process and adsorbed to the adjacent region A phenomenon in which the stress due to the horizontal contraction of the pad 200 is relatively concentrated may occur, and cracks or cracks may be generated in the adsorption pad 200 due to such stress concentration.

However, if the projecting portion is configured so as to protrude in the vertical direction from the bottom surface of the accommodating portion and the engaging projection is disposed between the side surface of the accommodating portion of the main body 100 and the projecting portion, cracks, It has been experimentally confirmed that an effect of anger is effective.

It can be understood that the protruding portion generates an opposite direction stress to the stress in the adjacent region of the bonding surface, thereby alleviating the stress concentration which is a cause of cracking.

In the embodiment shown in FIG. 8 (b), it is preferable that the protrusions 160 and the latching protrusions 260 are provided in parallel with the rim of the adsorption pad 200.

Here, the latching part 260 may be formed along one side of the rim of the adsorption pad, or may be formed in a square or circular shape along the rim. In the latter case, the latching part 260 may include a plurality of rectangular or circular latching parts (260) may be overlapped with each other in size.

Although not shown in FIG. 8B, a plurality of protrusions may be formed at a predetermined interval on the bottom surface of the accommodating portion to prevent concentration of shrinkage force generated when the adsorption pad 200 is contracted in a certain region have.

As shown in FIG. 8 (b), the protruding portion 160 may be formed in the form of a partition wall, but may be formed in a plurality of columnar shapes. In the latter case, it is preferable that they are uniformly dispersed in the accommodating portion.

The surface of the receiving portion, the recessed portion, and the protruding portion of the main body 100 of the chuck table 1 according to the present invention may be provided with a function of enhancing the adhesion with the adsorption pad 200 and preventing the concentration of stress upon shrinkage of the adsorption pad 200 The surface irregularity or surface roughness can be artificially increased in part or in whole. The possibility of separating the adsorption pad and the main body can be further reduced by the surface irregularity treatment or the surface roughness formation, and the defect of the cut semiconductor chip can be reduced.

When the chuck table 1 and the adsorption pad 200 have a circular shape, the projecting portion as the recessed portion 150 and the latching protrusion as the latching portion 250 may be circular.

The adsorption pad of the chuck table according to the present invention described with reference to FIGS. 4 to 8 may be configured such that the molten rubber is filled in the receiving portion of the main body and the hook portion is formed, or the hook portion is adhered to the receiving portion of the main body have. That is, it is also possible to form a suction pad having a pouring part with a molten liquid rubber in a receiving part provided with a recessed part, and a plurality of suction parts provided on the side of the rim part are mounted on the receiving part of the main body The chuck table may be manufactured by a method of individually inserting the engaging portions of the adsorption pad into the recessed portions formed in advance in the accommodation portion.

The present invention provides a method of manufacturing a semiconductor device, the method comprising: forming a receiving portion (S100) for forming a receiving portion in which a receiving pad is received in a body of a metal material; and forming an adsorption pad on the adsorption pad receiving portion S200). In the receiving portion forming step (S100), a recessed portion having a shape corresponding to the engaging portion of the adsorption pad is formed on a side surface of the receiving portion.

The method of forming the adsorption pad in the adsorption pad forming step (S200) may be carried out by a method of attaching the adsorption pad formed in advance with the catching part to the receiving part, or by injecting the molten rubber into the receiving part, Thereby forming a latching portion or the like.

As described with reference to Fig. 8 (b), at least one projecting portion may be formed on the bottom surface of the accommodating portion in the process of forming the accommodating portion, and the surface of the accommodating portion, the recessed portion, It may further include a separation prevention function by performing surface roughness increasing treatment.

In the chuck table manufacturing method according to the present invention, after the adsorption pad forming step (S200), adsorption holes for adsorbing the semiconductor material and adsorption holes for forming blade relief grooves for preventing interference of the cutting blades are formed on the adsorption pad, And a pad processing step (S300).

 The adsorption pad processing step (S300) is preferably performed by grasping an accurate position or the like through image information captured by a vision unit or the like.

While the present invention has been particularly shown and described with reference to preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the following claims. . It is therefore to be understood that the modified embodiments are included in the technical scope of the present invention if they basically include elements of the claims of the present invention.

1: chuck table
100:
150:
200: adsorption pad
250:

Claims (15)

In a chuck table of a semiconductor cutting apparatus,
A rubber-made adsorption pad having a plurality of protruding engaging portions on a side surface thereof and having a suction hole penetrating the semiconductor material in a vertical direction; And
And a main body made of a metal material, the main body including a receiving portion accommodating the adsorption pad and having a recess having a shape corresponding to the engaging portion of the adsorption pad, and a connection hole communicating with the adsorption hole. The method according to claim 1,
Wherein the recessed portion is configured to be reduced along a direction of an entrance of the recessed portion formed at a certain inner side of the recessed portion to a side of the recessed portion so that the engagement state of the engagement portion of the suction pad and the recessed portion is maintained. Chuck table. 3. The method of claim 2,
Wherein the width of the concave portion changes in a plane direction formed by the upper surface of the main body or a depth direction of the receiving portion. The method of claim 3,
And the cross-sectional area of the recessed portion is minimum at the entrance of the recessed portion formed in the side surface of the receiving portion. The method of claim 3,
Wherein the recessed portion and the engaging portion are formed at positions exposed to the upper surface of the body and the adsorption pad. The method of claim 3,
Wherein the recessed portion and the engaging portion are provided at positions that are not exposed to the upper surface of the body and the adsorption pad. 7. The method according to any one of claims 1 to 6,
Wherein the adsorption pad is adhered to a receiving portion of the main body in a state in which a molten rubber is filled in a receiving portion of the main body and a latching portion is formed or a latching portion is formed. 8. The method of claim 7,
Wherein a protruding portion is formed at a predetermined interval on a bottom surface of the accommodating portion. 9. The method of claim 8,
Wherein the protrusions are formed in the form of pillars or pillars. 10. The method of claim 9,
And the surfaces of the receiving portion and the protruding portion are subjected to a roughening treatment. Forming an accommodating portion for accommodating the adsorption pad in a body of a metallic material; And
And forming an adsorption pad on the side of the adsorption pad, the adsorption pad having a plurality of protrusion-type engagement portions formed on a side surface thereof,
Wherein the forming of the accommodating portion includes forming a concave portion having a shape corresponding to the engaging portion of the adsorption pad on a side surface of the accommodating portion. 12. The method of claim 11,
And forming a suction relief groove for absorbing the semiconductor material on the upper surface of the adsorption pad and a blade relief groove for preventing the interference of the cutting blade after the adsorption pad formation step. 13. The method of claim 12,
Wherein the adsorption pad forming step is performed by filling molten rubber in a receiving portion of the main body. 13. The method of claim 12,
Wherein the step of forming the adsorption pad is carried out by a method of adhering the adsorption pad previously formed with the engagement part to the accommodation part. 12. The method of claim 11,
Wherein the accommodating portion forming step includes forming protrusions on the bottom surface of the accommodating portion at regular intervals.
KR20130072185A 2013-06-24 2013-06-24 Chuck Table And Manufacturing Method Of The Same KR20150000148A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111771272A (en) * 2017-12-27 2020-10-13 胜高股份有限公司 Adsorption chuck
KR102320338B1 (en) * 2021-04-16 2021-11-02 (주)네온테크 Vacuum pad capable of easily desticking electronic chips, vacuum chuck table and picker having the same and pick-up method of electronic chips by the same
KR102427019B1 (en) * 2021-12-03 2022-07-28 윤동열 vacuum chuck
KR102622598B1 (en) * 2023-08-30 2024-01-09 제너셈(주) Method for making kit for package sawing
KR102622597B1 (en) * 2023-08-30 2024-01-09 제너셈(주) Member applied to kit for package sawing and kit for package sawing including the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111771272A (en) * 2017-12-27 2020-10-13 胜高股份有限公司 Adsorption chuck
CN111771272B (en) * 2017-12-27 2023-12-05 胜高股份有限公司 Adsorption chuck
KR102320338B1 (en) * 2021-04-16 2021-11-02 (주)네온테크 Vacuum pad capable of easily desticking electronic chips, vacuum chuck table and picker having the same and pick-up method of electronic chips by the same
KR102427019B1 (en) * 2021-12-03 2022-07-28 윤동열 vacuum chuck
KR102622598B1 (en) * 2023-08-30 2024-01-09 제너셈(주) Method for making kit for package sawing
KR102622597B1 (en) * 2023-08-30 2024-01-09 제너셈(주) Member applied to kit for package sawing and kit for package sawing including the same

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