KR20140117148A - 표면개질 무기필러, 이의 제조방법, 다층프린트 배선판용 빌드업필름 조성물 및 이를 포함하는 다층프린트 배선판 - Google Patents

표면개질 무기필러, 이의 제조방법, 다층프린트 배선판용 빌드업필름 조성물 및 이를 포함하는 다층프린트 배선판 Download PDF

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KR20140117148A
KR20140117148A KR1020130032213A KR20130032213A KR20140117148A KR 20140117148 A KR20140117148 A KR 20140117148A KR 1020130032213 A KR1020130032213 A KR 1020130032213A KR 20130032213 A KR20130032213 A KR 20130032213A KR 20140117148 A KR20140117148 A KR 20140117148A
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South Korea
Prior art keywords
inorganic filler
fluorine
group
curing agent
epoxy resin
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KR1020130032213A
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English (en)
Korean (ko)
Inventor
김기석
심지혜
이화영
배준호
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삼성전기주식회사
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Priority to KR1020130032213A priority Critical patent/KR20140117148A/ko
Priority to US13/963,807 priority patent/US20140290994A1/en
Priority to JP2013169782A priority patent/JP2014189793A/ja
Publication of KR20140117148A publication Critical patent/KR20140117148A/ko

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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0227—Insulating particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

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KR1020130032213A 2013-03-26 2013-03-26 표면개질 무기필러, 이의 제조방법, 다층프린트 배선판용 빌드업필름 조성물 및 이를 포함하는 다층프린트 배선판 KR20140117148A (ko)

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KR1020130032213A KR20140117148A (ko) 2013-03-26 2013-03-26 표면개질 무기필러, 이의 제조방법, 다층프린트 배선판용 빌드업필름 조성물 및 이를 포함하는 다층프린트 배선판
US13/963,807 US20140290994A1 (en) 2013-03-26 2013-08-09 Surface-modified inorganic filler, method of preparing the same, buildup film composition for multilayer printed wiring board, and the multilayer printed wiring board including the same
JP2013169782A JP2014189793A (ja) 2013-03-26 2013-08-19 表面改質無機フィラー、その製造方法、多層プリント配線板用ビルドアップフィルム組成物、およびこれを含む多層プリント配線板

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KR1020130032213A KR20140117148A (ko) 2013-03-26 2013-03-26 표면개질 무기필러, 이의 제조방법, 다층프린트 배선판용 빌드업필름 조성물 및 이를 포함하는 다층프린트 배선판

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CN112852019B (zh) * 2021-03-12 2021-10-22 南昌大学 改性超细重质碳酸钙及其制备方法和应用、顺丁橡胶复合材料
CN115353720B (zh) * 2022-09-06 2023-12-12 森之物工艺品有限责任公司 一种环氧树脂复合材料及其制备方法

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