KR20140114141A - Touch screen panel with fine circuit formed by the transparent substrate and method of manufacturing the same - Google Patents

Abstract

The present invention relates to a touch panel substrate with a micro metal circuit formed on a transparent substrate and a method for fabricating the same and also to a touchscreen panel made by joining the touch panel substrate in various forms. A micro metal circuit is formed on both sides of the transparent substrate, and includes a sense electrode, wherein the sense electrode is symmetrically formed around the transparent substrate. A micro metal circuit is also formed on one side or both sides of the transparent substrate, and is blackened. The transparent substrate of the present invention has a wire electrode formed in a partial area of the edge of the micro metal circuit. The micro metal circuit is composed of metal. The micro metal circuit is made of one among nickel, chrome, copper, silver, and gold as an example of the metal, of alloys thereof, or of a laminate thereof. The material of the transparent substrate is composed of transparent glass, a transparent resin film, a transparent PET film or an optical transparent film. The micro metal circuit of the present invention forms closed cell structures that have irregular shapes, wherein the closed cell structures that have the irregular shapes are connected to each other to be electrically conducted.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a touch screen panel having a transparent substrate and a fine circuit part formed thereon,

The present invention relates to a touch panel substrate in which a metal micro-circuit portion is formed on a transparent substrate. The present invention also provides a touch screen panel formed by bonding the touch panel substrate in various forms.

In the present invention, a metal fine circuit formed on both sides of a transparent substrate is defined as a double-sided circuit transparent substrate and used. In addition, the formation of a metal microcircuit on only one side of the transparent substrate is defined as the term "single-sided circuit transparent substrate".

The touch panel substrate of the present invention is used as an accessory of a touch screen panel used in a smart phone, a notebook having a touch function, and other display devices.

The concepts of the touch panel substrate and the touch screen panel used in the present invention are defined. A portion of a video display device where a person touches through a finger is referred to as a touch screen panel. The touch panel substrate disclosed in the present invention is used as a part used to make the touch screen panel. That is, the touch screen panel of the present invention is manufactured using the touch panel substrate which is one of the present invention.

In the present invention, a double-sided circuit transparent substrate or a single-sided circuit transparent substrate, which is one of the present invention, will be described and a practical touch screen panel which is another one of the present invention will be described. Various embodiments of these will be described.

When a finger makes physical contact with the surface of the touch panel substrate as in a smart phone, an electrical signal is formed on the sense electrode by the contact, the electrical signal is transmitted to the wiring electrode, Signals are transmitted to the flexible circuit board and the control unit.

 In the touch screen panel, a transparent substrate in contact with the outside is defined as an external contact transparent substrate in the present invention. In most cases, a human hand touches the upper surface of the external contact transparent substrate to apply an electrical signal. In most cases, the upper surface of the external contact transparent substrate is often in contact with the outside, so it is often used with tempered glass.

The uppermost layer of the touch screen panel is referred to as an external contact transparent substrate. This is where there is direct physical contact with a person's hands or outside. An electrically conductive passage is formed in the outer transparent substrate. Recognizes the position designated by the user, converts the position information into electrical information, and sends the electrical information to the control unit.

The control unit recognizes such an electrical signal and operates various programs of the product. That is, in the touch panel substrate of the present invention, when there is physical contact with the surface of the panel substrate, the position information of the touched portion is recognized through the sense electrode by an electrical signal. The electrical signal generated at the sense electrode is transferred to the control unit of the product by the wiring electrode.

In the present invention, a metal microcircuit portion is formed on one side or both sides of a transparent substrate. Of course, a sense electrode is formed in the metal microcircuit portion. If a sense electrode is formed on both sides of the transparent substrate, it is preferable that the two sense electrodes are formed symmetrically with respect to the transparent substrate in the present invention. In the present invention, the metal microcircuit portion is blackened.

The present invention relates to a touch panel substrate on which a metal micro-circuit portion is formed on a transparent substrate and a manufacturing method thereof. The present invention also provides a touch screen panel formed by bonding the touch panel substrate in various forms.

A typical touch screen panel uses ITO or a conductive polymer made of indium as a sense electrode. However, this has a disadvantage in that the signal sensitivity and detection sensitivity are somewhat deteriorated in the manufacture of a large-area touch screen panel due to the high electrical resistance compared with metal.

In the region where the sense electrode is present and the region where the sense electrode is not present, that is, the region where the ITO or the conductive polymer is removed by etching, the problem of patterning marks due to the difference in transmittance is felt there was.

In the present invention, electrical recognition is possible by a method of forming a metal microcircuit on a transparent substrate without using expensive ITO or conductive polymer as a means for transmitting a current flow in the transparent substrate.

By using a metal circuit as a means for flowing a current, the present invention can reduce the resistance of the sense electrode, improve detection sensitivity, and improve the transmittance. In general, a sense electrode and a wiring electrode are required for the touch panel substrate. Needless to say, the present invention is applicable to a touch panel substrate which can be constituted only by a sense electrode which does not require a wiring electrode.

The present invention forms a metal microcircuit portion on one side or both sides of a transparent substrate. The metal microcircuit portion includes a sense electrode. A wiring electrode is formed at the tip portion of the sense electrode. In general, the wiring electrode is formed thicker than the line width of the metal fine circuit constituting the sense electrode. The present invention reduces the resistance of the sense electrode, improves the detection sensitivity, and provides an effect of improving the transmittance.

A sense electrode and a wiring electrode are required for the touch panel substrate. In the present invention, a metal microcircuit portion is formed on one side or both sides of a transparent substrate. Of course, a sense electrode is formed in the metal microcircuit portion.

If a sense electrode is formed on both sides of the transparent substrate, it is preferable that the two sense electrodes are formed symmetrically with respect to the transparent substrate in the present invention. In the present invention, the metal microcircuit portion is blackened.

Further, the present invention is characterized in that a metal microcircuit portion is formed on one side or both sides of a transparent substrate, and the metal microcircuit portion is blackened.

Disclosure of Invention Technical Problem [8] The present invention is intended to solve the problems occurring in a touch panel substrate made of a metal microcircuit. Although the touch panel substrate manufactured by the metal microcircuit has many advantages, there are points to be improved by the physical phenomenon by the metal fine circuits formed on the touch panel substrate.

First, it is desirable that the metal microcircuits are not visible to the human eye. However, there was a side effect that the presence of metal microcircuits was recognized by the human eye. Of course, fine metal microcircuits are thin enough not to be perceived by human vision as one by one. However, when these metal microcircuits are structured with regularity, there are things that must be recognized due to the physical action of light.

The most representative is the moire pattern. Even if the moire phenomenon is removed, if the metal microcircuits are regularly constructed, another physical phenomenon such as passing light is dispersed in a cross shape, or the like, occurs. The present invention is characterized in that a metal microcircuit is formed in an irregular shape in order to eliminate such a visual side effect.

Secondly, in the present invention, when a metal microcircuit is formed on both sides of a transparent substrate, a metal microcircuit constituting a sense electrode around the transparent substrate is formed to be exactly symmetrical in order to increase the transmittance of light.

If the metal microcircuits constituting the sense electrodes formed on both sides of the transparent substrate are not symmetrically formed around the transparent substrate and exist at different positions, when the light passes through the transparent substrate, the light transmittance Of course, the loss is increased. If the metal fine circuits on both sides of the transparent substrate have exactly symmetrical shapes, it is possible to maintain the same transmittance as in the case of forming a metal fine circuit on one surface.

Third, one of the greatest features of the present invention is to blacken the metal microcircuit formed on the transparent substrate so as not to shine light. One of the biggest problems when metal is vacuum deposited on a transparent substrate is that the metal shines by receiving light. Even if it is a fine line, if a metal is vacuum-deposited on a transparent substrate, the surface of the vacuum-deposited metal becomes the same as the mirror surface, so it is natural that the light shines when reflected from the outside.

In the present invention, after the metal microcircuit is formed, blackening treatment is performed in the plating bath to remove such light reflection. Or when a metal thin film is formed by vacuum vapor deposition, there is a method of constituting a metal microcircuit after the blackening treatment is performed in advance on the uppermost layer of the metal thin film.

In the present invention, the sense electrode composed of the metal microcircuit is formed into a closed cell shape having irregular shape to be connected continuously. The wiring electrode connected to the sense electrode does not need to be formed in a closed cell shape having an irregular shape.

The wiring electrode is formed in a convenient shape in the rim portion of the sense electrode and the wiring electrode is not included in the present invention. The concept of a polygon used in the present invention will be described. In the case where the sense electrode of the present invention has a polygonal shape, it is preferable that the lines constituting each side of the polygon have irregular curves. Of course, a sense electrode having a polygonal shape of a general concept is also an object of the present invention. However, in order to construct a more effective sense electrode, the lines constituting each side of the polygon are formed of irregular curves, and the vertexes of the polygon are irregularly present at arbitrary positions.

The sensing electrode in the present invention is formed into a closed cell structure having an irregular shape, and the closed cell structure having the irregular shape is configured to be connected to each other to enable conduction. Each cell does not have to be the same size, but it is shaped into a variety of different closed cell structures.

The sizes of the respective cells may be freely set so as to be connected to each other. The sense electrode, which is formed by the irregularly connected metal microcircuits, can suppress the dispersion phenomenon of physical light generated when light passes through the electrode. If there is a dispersion phenomenon of light, no matter how fine a metal wire exists, the presence of a metal wire does not feel the human vision, but the dispersion phenomenon of light can be felt.

In the present invention, it is important to increase the light transmittance. For this purpose, the transparent substrate of the present invention emphasizes symmetry. The symmetry is applied when a metal microcircuit is formed on both sides of the transparent substrate.

That is, the metal fine circuits forming the sense electrodes formed on both sides of the transparent substrate are symmetrically formed around the transparent substrate. With such a configuration, it is possible to prevent a decrease in the light transmittance when passing through the transparent substrate.

Further, in the present invention, after completing a metal microcircuit on a transparent substrate, the transparent substrate is placed in a plating bath to blacken the metal microcircuit. When the blackening process is performed on the metal microcircuit, the problem that the metal microcircuit receives light and reflects light can be solved. As a blackening treatment method, a general plating technique can be applied as it is, so it is not described in the description of the present invention.

There are two cases for the blackening process. First, after a metal microcircuit is formed on a transparent substrate, the metal microcircuit may be subjected to a blackening treatment. Secondly, a metal thin film is formed by vacuum deposition in a step prior to forming a metal microcircuit on a transparent substrate, and blackening treatment is applied to the top of the metal thin film layer. The metal microcircuit can be formed through etching or the like in the metal thin film which has been subjected to the blackening treatment in advance.

It is an object of the present invention to provide a touch panel substrate made of a metal microcircuit instead of ITO or a conductive polymer. The fine metal lines are not recognized by human eyes, The purpose. Of course, the metal microcircuits are made of metal wires, so that the electric resistance value is low.

The metal microcircuit mainly forms a sense electrode, and a wiring electrode is partially formed at a rim portion of the sense electrode. The shape of the sense electrode and the wiring electrode are different from each other. However, since the sense electrode and the wiring electrode are formed simultaneously in the manufacturing process, the simplification of the operation can be achieved.

As a result, the conductivity of the touch panel substrate is increased and the detection strength is improved as compared with the conventional ITO or conductive polymer circuit. Since the electrode of the touch panel substrate is constituted of the metal microcircuit, the light transmittance is high. Practically, the transmittance of the touch panel substrate of the present invention is higher than that of the conventional ITO or conductive polymer. However, in spite of these advantages, there are some problems to be solved by the physical phenomenon of the metal microcircuits formed on the touch panel substrate.

The most typical element is that the metal microcircuits should not be recognized by the human eye. Of course, fine metal microcircuits are not perceived by the human eye because each individual line is so fine. In practice, the linewidth of a metal microcircuit, which is mainly used in the present invention, is used at a level of 1 micrometer, 2 micrometer, or 3 micrometer. However, no matter how fine these metal microcircuits are, when configured with regularity, light causes unexpected physical phenomena.

The most representative is the moiré pattern phenomenon. Of course, even if the moiré phenomenon is eliminated, if the metal microcircuit is regularly constructed, another kind of physical phenomenon, that is, the spread of light, occurs. This is a phenomenon in which light is seen as a cross when observing a light source behind a metal microcircuit. The present invention is configured to eliminate such visual side effects. Further, since the sense electrode and the wiring electrode can be formed at the same time, the present invention can simplify the work process and save cost.

The present invention also constitutes a metal microcircuit having a symmetrical structure in order to maximize the transmittance of light.

The present invention solves the problem that the metal microcircuits receive light and glitter by adopting the blackening processing method.

1 is an explanatory diagram in which a metal microcircuit is formed on a transparent substrate.
2 is an explanatory diagram of an irregular pattern pattern of a metal microcircuit.
Fig. 3 is an explanatory view of a transparent substrate on which a metal fine circuit is formed on a one-sided circuit transparent substrate.
Fig. 4 is an explanatory diagram of a case where a metal microcircuit is formed symmetrically on a double-sided circuit transparent substrate.
Fig. 5 is an explanatory diagram of a case where a metal microcircuit is formed asymmetrically in a double-sided circuit transparent substrate.
Figure 6 is an embodiment of a touch screen panel of the present invention.
7 is another embodiment of the touch screen panel of the present invention.
Fig. 8 shows another embodiment of the touch screen panel of the present invention.
Fig. 9 is an explanatory view of forming a metal thin film on a double-sided circuit transparent substrate.
10 is an explanatory view of a process of applying a photosensitive layer to a metal thin film on a double-sided circuit transparent substrate.
11 is an explanatory view of an etching process in a double-sided circuit transparent substrate.
12 is an explanatory diagram of a blackening process of a metal microcircuit in a double-sided circuit transparent substrate
Fig. 13 is an explanatory diagram of the production of a transparent substrate on both surfaces by a line exposure process and a post-vacuum deposition process.
14 is an explanatory diagram of a double-sided circuit transparent substrate of the present invention.
15 is an explanatory view for explaining the configuration of the wiring electrodes formed on the upper surface and the lower surface of the double-sided circuit transparent substrate;
Fig. 16 is an explanatory view for explaining connection of a junction terminal in which a silver paste is printed on a wiring electrode to a flexible circuit board; Fig.
Fig. 17 is an explanatory view of a double-sided circuit transparent substrate 66 having a negative-side-part junction terminal.
Fig. 18 is an explanatory view of connecting to a flexible circuit board on a double-sided circuit transparent substrate 66 having a negative-side-part junction terminal.
Fig. 19 is an explanatory view of the penetrating portion in the penetrating portion junction terminal. Fig.
Fig. 20 is an explanatory diagram of filling silver paste in the penetration portion. Fig.
Fig. 21 is an explanatory view of forming a sense electrode and a wiring electrode after filling the silver paste in the penetration portion. Fig.
22 is a cross-sectional explanatory view of a double-sided circuit transparent substrate having a through-hole junction terminal.
23 is an explanatory view for explaining filling silver paste in the penetration portion.
Fig. 24 is an explanatory diagram of a double-sided circuit transparent substrate having a penetrating portion.
25 is an explanatory view for explaining bonding of a flexible circuit board to a double-sided circuit transparent substrate having a penetrating portion.
26 is an explanatory view of a case where the metal microcircuit portions of the two-sided circuit transparent substrates are arranged in the same direction.
FIG. 27 is an explanatory view of a case where two transparent substrates face each other. FIG.
Fig. 28 is an explanatory diagram of a case where two metal microcircuit parts face each other. Fig.
29 is an explanatory view of a touch panel substrate in which a transparent coating layer is formed on one side of a double-sided circuit transparent substrate.
30 is an embodiment of a touch screen panel in which an external contact transparent substrate and a double-sided circuit transparent substrate are bonded.
Fig. 31 shows an embodiment of a touch screen panel in which an outer transparent substrate is formed of a transparent adhesive layer for optical.
32 shows an embodiment in which a transparent coating layer is formed without using a transparent adhesive for optical use.
33 is an embodiment of a touch screen panel in which an external contact transparent substrate and a single-sided circuit transparent substrate are bonded.
Fig. 34 shows an embodiment of a touch screen panel in which an outer transparent transparent substrate is formed of a transparent adhesive layer for optical.
Figure 35 is an embodiment of a touch screen panel featuring an external touch transparent substrate having conductive circuitry.
36 is an embodiment of a touch screen panel in which a single-sided circuit transparent substrate is bonded to an external touch transparent substrate having a conductive circuit portion.
Fig. 37 is an embodiment of a touch screen panel constituted by two opposing two-sided circuit transparent substrates.
38 is an explanatory view for explaining disconnection of the metal microcircuit.
Fig. 39 is an explanatory view for explaining the configuration of the X-axis sense electrode. Fig.
FIG. 40 is an explanatory view for explaining the configuration of the Y-axis sense electrode. FIG.
FIG. 41 is an explanatory view for explaining a bridge line formed on the Y-axis sense electrode. FIG.
42 is an explanatory view of a roll-shaped elastic substrate having a very fine circuit groove.
43 is an explanatory view of a plate-like elastic substrate having a very fine circuit groove.
44 is an explanatory view of a very fine circuit groove of the elastic master.
45 is an explanatory diagram of a state in which a conductive filler is filled in a very fine circuit groove of an elastic master.
46 is an explanatory diagram of a state in which a conductive filler is transferred to a transparent substrate.
47 is an explanatory view of the depth and width of the fine grooves formed in the elastic substrate.
48 is an explanatory view of the shape of fine grooves formed in the elastic substrate.
49 is an explanatory diagram of a state in which a conductive filler is moved to a lower portion of an external contact transparent substrate;
50 is an explanatory view of a touch screen formed by moving a conductive filler to an external contact transparent substrate.
51 is a diagram for explaining production of a double-sided circuit transparent substrate by a printing method.

The present invention relates to a touch panel substrate on which a metal micro-circuit portion is formed on a transparent substrate and a manufacturing method thereof. The present invention also provides a touch screen panel formed by bonding the touch panel substrate in various forms.

The present invention can constitute a metal microcircuit on one side or both sides of a transparent substrate.

The transparent substrate in the present invention may be a transparent substrate, transparent resin substrate, transparent resin film, transparent PET substrate, transparent PET film, transparent optical film, transparent plastic substrate, transparent plastic film, transparent silicon substrate, A transparent material can be used. It is a matter of course that the transparent material is used in a flexible form or in a form in which it is necessary to use both the form and the rigid form.

In the present invention, the transparent substrate may be formed on the surface of the transparent substrate, or may be any substrate as long as it can support and support the transparent substrate on which the metal fine circuit is formed. Particularly, in the case of a plastic substrate, flexibility is high, which is advantageous for manufacturing a flexible substrate.

Examples of the plastic substrate include polyimide, polycarbonate, polyphenylene sulfide, polyamide imide, polyethylene terephthalate, polybutylene And may be any of those having transparency among polybutylene terephthalate, polyether sulfone, polyether imide, and polyetheretherketone.

Further, the thickness of the transparent substrate may be significantly different depending on the application.

A transparent film formed to a thickness of several micrometers or several tens of micrometers is often used. Alternatively, the transparent substrate may be made of transparent glass to have sufficient strength. In the present invention, a metal micro-circuit portion is constituted on one surface or both surfaces of a transparent substrate. The main reason for the simultaneous construction on both sides is due to the inherent function of the touch panel substrate.

For external physical contact, two metal microcircuits are required for position recognition on the X and Y axes for position recognition. A metal microcircuit that recognizes the coordinates of the X axis and a metal microcircuit that recognizes the coordinates of the Y axis can be simultaneously formed on the front and rear surfaces of one transparent substrate. To. For this purpose, a metal microcircuit is formed on both sides of the transparent substrate at the same time.

The material of the metal microcircuit portion of the present invention can be mostly metal. However, most preferred embodiments include Ag, Cu, Ni, Cr, Al, Gold, Mo, and Co. It may also be composed of an alloy of these metals or a laminate of these metals. However, it is needless to say that the material of the metal micro-circuit part of the present invention is not limited to the above-mentioned metal, but also various metal materials may be used. The selection of these materials can be made by taking into consideration economics, conductivity and objectivity.

1 is an explanatory diagram in which a metal microcircuit is formed on a transparent substrate.

The metal microcircuit 1 can be configured in various patterns. The most common one is a checkerboard pattern. The shape of the pattern can be a honeycomb pattern composed of hexagons and a pattern of various polygons. Patterns made with arbitrary patterns are also possible. In order to increase the transmittance of the substrate, the line width of the metal microcircuit is thin and the pitch is larger. That is, as the area of each unit shape is larger and the line width is smaller, the transmittance is increased.

However, considering the current flow, the line width dimension can not be reduced indefinitely, and the unit area can not be made large indefinitely. In the present invention, the line width of the metal microcircuit is preferably in the range of about 1 to 30 micrometers. In the case of a smart phone or the like, a line width in the range of 1 micrometer to 5 micrometers is preferable.

However, in a display image device such as a small notebook computer, a line width slightly larger is desirable in order to reduce electrical resistance. In the case of a smart phone, if the metal microcircuit is designed in the form of a square, the pitch between the line and the ship is preferably about 50 to 300 micrometers. However, considering the light transmittance and current flow, it is good to design the line width of the metal microcircuit well.

2 is an explanatory diagram of an irregular pattern pattern of a metal microcircuit.

When the pattern pattern is continuously arranged in a certain shape and a certain size such as a square, a moire pattern may occur or other physical and optical phenomena may occur. This phenomenon varies depending on the size of the line width and the size of the pitch.

However, when physical and optical phenomena that are not desirable are revealed, they are not suitable as a touch panel substrate. Although the transmitted image should be transmitted as it is, the image may be undesirably affected by the regular pattern pattern.

In the present invention, in order to eliminate such a phenomenon, the patterns of the metal microcircuits formed on the transparent substrate may be irregularly shaped. Of course, the metal microcircuit can be formed in any polygonal shape such as a triangle, a rectangle, a pentagon, a hexagon, and an octagon. These polygons are connected to each other to be energized.

In addition, the patterns of the metal microcircuits may be composed of a combination of various shapes, and they may be connected to each other to have a net-like structure. However, when the fine metal microcircuits have regularity, for example, in the form of a checkerboard or a honeycomb structure, when a metal microcircuit is formed, a moire pattern due to physical and optical phenomena and other undesirable phenomena It can be a cause.

In the present invention, the shape of the metal microcircuit can be irregularly formed in order to eliminate such physical and optical phenomena. Hereinafter, the basic cell of a metal microcircuit connected to each other is referred to as a cell, which is defined in the present invention. It is preferable that the line constituting the cell is constituted by an irregular curve (2) instead of a straight line.

It is also important to ensure that the metal microcircuits have an irregular shape but have regularity as a whole, in order to keep the resistance of the current uniform when the current flows through the metal microcircuit. That is, it is preferable that the thickness of the metal microcircuit is constant, and it is preferable that the lengths constituting the unit cells are the same.

That is, the total length of the metal constituting the unit cell is preferably kept constant for all possible cells. Even if the lengths of the cells are the same, the cell area (3) varies depending on the shape of the cell. The transmittance of light increases as the area of the cell increases, and as the line width of the cell becomes smaller. It is preferable to reduce the line width of the metal microcircuit and increase the transmittance of the cell, but if the line width is made small, the current resistance value becomes large.

It is necessary to make irregular shapes of the metal microcircuits in order to eliminate the physical and optical effects that appear as side effects when light passes through the transparent substrate on which the metal microcircuit is formed. In order to achieve the above object, it is preferable that the line width is in the range of 1 micrometer to 30 micrometer, and the unit area of the cells constituting the micrometer is not less than 2,500 square micrometers.

A metal microcircuit having the above-described irregular shape and having a closed cell structure is formed as a sense electrode. A wiring electrode can be formed on the sense electrode. When the wiring electrode is formed, the wiring electrode is positioned at the edge of the touch panel substrate. And is located at the outer edge portion of the sense electrode of the wiring electrode as a whole.

The sense electrode and the wiring electrode are electrically connected to each other. When the user physically contacts the touch panel substrate, the sense electrode recognizes the electrical signal first.

The electrical signal thus recognized is sent to the wiring electrode. In the present invention, the wiring electrode and the sense electrode can be manufactured at the same time. In the present invention, the control unit and the flexible circuit board are connected to the wiring electrode but are not shown. The sense electrode and the wiring electrode are made of the same metal, and both can be manufactured at the same time without making them separately, so that the manufacturing process can be simplified.

In the present invention, the wiring electrode transmits the recognized electrical signal to the flexible circuit board or the control unit. It is preferable that the width of the wiring electrode is relatively thicker than that of the internal sense electrode. The wiring electrode carries the function of transmitting the electrical signal of the sense electrode to the control unit, and is connected to the flexible circuit board or the control unit. A conductive material such as a silver paste may be applied to the wiring electrodes so that the wiring electrodes are well connected to the flexible circuit board or the control unit. The silver paste may be applied only to the point where the wiring electrode and the flexible circuit board or the control unit are connected by the printing method.

When the silver paste is applied to the wiring electrode through printing as described above, the height of the portion is increased. In order to prevent height increase due to the silver paste, a groove is formed on the surface of the transparent substrate, and the groove is filled with silver paste. Thereafter, the silver paste and the wiring electrode may be connected. The groove may be formed by machining a groove on the surface of the transparent substrate through a laser or by depressing the surface while applying heat to the surface to form a groove through mechanical processing.

In the present invention, since the sense electrode made of a metal micro-circuit and the wiring electrode connected to the sense electrode are formed of a metal wire, the resistance of the electrode can be reduced. This increases the conductivity of the touch panel substrate and improves the detection strength. Since the electrode of the touch panel substrate is constituted of an extremely fine metal microcircuit, the permeability is improved compared to the conventional ITO or conductive polymer.

When a conventional metal microcircuit is used to fabricate a sense electrode, the shape of the metal fine circuit is generally linear. However, the metal microcircuits used in the present invention are made of a closed cell structure having an irregular shape.

The cell structure is continuously connected. In addition, the cell structure is formed of an irregular polygon, the lines forming each side of the polygon are formed of irregular curves, and the respective vertexes of the polygon are irregularly positioned.

When the sense electrode is constructed by a conventional method, the metal fine circuit has a polygonal shape that is continuously connected. The polygon is composed of sides connecting the vertex and the vertex. Conventionally, the vertexes are arranged in a state having regularity, and the sides are formed in a straight line.

However, in the present invention, the lines forming each side of the polygon are formed of irregularly shaped curves. Needless to say, a partial straight line of an irregular shape is of course possible. The curves forming the sides are composed of various irregular shapes.

In the case of polygons, polygons of various shapes such as a triangle, a rectangle, a pentagon, and a hexagon are connected to each other so that they are electrically connected to each other. The sides constituting the polygons are connected by irregular curves. The constituent vertices are not arranged in a regular order, but exist irregularly at arbitrary positions.

Of course, the sizes of the polygons do not have to be the same, and various types of polygons may be connected to each other. That is, various polygons of various shapes can be freely connected with each other in shape and size. However, since the sides are curved, they do not coincide with the definition of the existing polygon.

If the irregularly connected metal microcircuits are formed of sense electrodes, it is possible to suppress the visually undesirable physical phenomenon that occurs when the light passes through the electrodes.

Optical phenomena including moire patterns and the like are removed. A description will be made of a case where the line width constituting the sense electrode is 3 micrometers and the interval between the metal microcircuits is 100 micrometers in the case of configuring a square net shape sense electrode composed of an accurate straight line . In fact, metal wires with a line width of 3 micrometers are not visible to the naked eye. Therefore, when the touch panel substrate is manufactured, the touch panel substrate can be manufactured because the transmittance is increased and the electrical resistance is small.

In this case, however, due to the optical property provided by the uniformly formed square net shape characteristic, the spreading of light is caused by the metal micro circuits of 3 micrometers, and a person can recognize this. Therefore, this phenomenon can not help but detract from the value of the touch panel substrate. In order to eliminate such side effects, the present invention is configured to have irregular shapes of metal microcircuits.

Of course, this principle is applied in various fields. When passing through an extremely fine pattern of the same shape, light may appear as a moire phenomenon. In this case, however, if the pattern is formed in an irregular shape, the moire pattern disappears. The present invention applies such a physical phenomenon to a touch panel substrate.

Fig. 3 is an explanatory view of a transparent substrate on which a metal fine circuit is formed on a one-sided circuit transparent substrate.

In the present invention, a metal fine circuit formed on both sides of a transparent substrate is defined as a double-sided circuit transparent substrate and used. In addition, the formation of a metal microcircuit on only one side of the transparent substrate is defined as the term "single-sided circuit transparent substrate".

In the present invention, it is natural that metal fine circuits can be formed on both sides of the transparent substrate. When the metal microcircuit is formed on the transparent substrate 7, the metal microcircuit can be composed of the sense electrode 5 and the wiring electrodes 4 and 6. In general, the wiring electrodes are formed at the edges of the metal microcircuits, and constitute left and right and / or upper and lower edges of the metal microcircuits.

The wiring electrode carries the function of transmitting the electrical signal of the sense electrode to the control unit, and is connected to the flexible circuit board or the control unit. A conductive material such as a silver paste may be applied to the wiring electrodes so that the wiring electrodes are well connected to the flexible circuit board or the control unit. The silver paste may be applied only to the point where the wiring electrode and the flexible circuit board or the control unit are connected by the printing method.

When the silver paste is applied to the wiring electrode through printing as described above, the height of the portion is increased. In order to prevent height increase due to the silver paste, a groove is formed on the surface of the transparent substrate, and the groove is filled with silver paste. And then the silver paste and the wiring electrode may be connected.

The sense electrode is formed inside the metal microcircuit. In most cases, the metal microcircuit corresponds to a sense electrode, and a wiring electrode having a pattern different from that of the metal microcircuit is connected to a rim of the sense electrode. Normally, the line width of the wiring electrode is designed to be thicker than that of the sense electrode.

Conventionally, a sensing electrode is formed by using ITO or a conductive polymer, and a wiring electrode is formed by using silver paste at the edge of the sensing electrode. A flexible circuit board or a control unit is connected to the wiring electrodes using the silver paste.

Fig. 4 is an explanatory diagram of a case where a metal microcircuit is formed symmetrically on a double-sided circuit transparent substrate.

Metal fine circuits 9 and 10 are formed on both sides of the transparent substrate 8, respectively. In this case, it is preferable that each of the metal micro circuits formed on both sides has a pattern symmetrically formed around the transparent substrate. In this way, when the light passes through the two metal microcircuits, it is possible to prevent the decrease in the transmittance.

Each of the metal microcircuits naturally inhibits the transmission of light. Ideally, even if two metal microcircuits are used, it is necessary to prevent the transmission of light by passing through a single metal microcircuit. For this purpose, each metal fine circuit formed on both sides of the transparent substrate is symmetrically formed around the transparent substrate.

When the thickness of the transparent substrate is extremely small in several micrometers, it actually functions as if two metal microcircuits are one. When the thickness of the transparent substrate is extremely thin and the thickness of the photosensitive material coated on both sides of the transparent substrate is also several micrometers thick, the transparent substrate is coated on both sides of the transparent substrate by a single exposure through an exposure machine The photosensitive material can be exposed simultaneously. The metal microcircuit fabricated in this way can be fabricated in exactly the shape of a symmetrical structure.

If the metal microcircuits formed on both sides of the transparent substrate are not formed symmetrically about the transparent substrate and the metal microcircuits are present at different positions, when the light 11 passes through the transparent substrate, The transmittance is of course low. However, if the metal microcircuits on both sides of the transparent substrate have exactly symmetrical shapes, it is possible to maintain the same transmittance as in the case of forming a metal microcircuit on only one side.

Therefore, considering the light transmittance, it is preferable that the metal microcircuits on both sides of the transparent substrate have exactly symmetrical shapes.

Fig. 5 is an explanatory diagram of a case where a metal microcircuit is formed asymmetrically in a double-sided circuit transparent substrate.

Metal fine circuits 13 and 14 are formed on both sides of the transparent substrate 12, respectively. At this time, the pattern of each metal fine circuit formed on both sides is asymmetrically formed around the transparent substrate. When this happens, when light passes through, the transmission is reduced. Each metal microcircuit acts to prevent transmission of light.

These side effects work twice. Therefore, such a design is an undesirable design. Also, since the two metal microcircuit portions are optically interfering with each other, side effects due to interference are not so small.

Figure 6 illustrates an embodiment of a touch screen panel of the present invention.

In the touch screen panel, a transparent substrate in contact with the outside is defined as an external contact transparent substrate 15 in the present invention. In most cases, a human hand touches the upper surface of the external contact transparent substrate to apply an electrical signal. In most cases, the upper surface of the external contact transparent substrate is often in contact with the outside, so it is often used with tempered glass.

In the touch screen panel, a transparent adhesive layer for optical 17 is formed on the bottom of the outer contact transparent substrate 15 which is the uppermost layer. A double-sided circuit transparent substrate panel 18 is formed under the transparent adhesive layer, and a transparent coating layer 19 is formed under the double-sided circuit transparent substrate panel. A decorative portion 16, which is a printed portion, is formed below the external contact transparent substrate 15.

Fig. 7 illustrates another embodiment of the touch screen panel of the present invention.

In the touch screen panel, an optical transparent adhesive layer 21 is formed under the outer contact transparent substrate 20 which is the uppermost layer.

A transparent circuit substrate panel 22 is formed under the transparent adhesive layer and an optical transparent adhesive layer 23 is formed under the transparent circuit substrate panel 22. The transparent adhesive layer 23 Another cross section circuit transparent substrate panel 24 is formed.

Figure 8 illustrates another embodiment of a touch screen panel of the present invention.

In the touch screen panel, a transparent adhesive layer for optical use 26 is formed under the outer contact transparent substrate 25 which is the uppermost layer. A transparent circuit substrate panel 27 is formed under the transparent adhesive layer and a transparent transparent adhesive layer 28 is formed under the transparent circuit substrate panel 27 for the optical circuit. Another cross section circuit transparent substrate panel 29 is formed.

A transparent transparent adhesive layer 30 for optical is formed on the bottom of the single-sided circuit transparent substrate panel 29 and a single-sided circuit transparent substrate panel 31 is formed on the bottom of the transparent adhesive layer 30. The metal micro-circuit portions formed on the single-sided circuit transparent substrate panels are formed in three places. Two of them can be used as an electric signal transmission channel for recognizing a touched position, and the other one can be used as an electromagnetic wave shielding device.

Fig. 9 is an explanatory view of forming a metal thin film on a double-sided circuit transparent substrate.

A metal is vacuum-deposited on both sides of the transparent substrate 33 to form thin metal films 32 and 34. In the present invention, metals are used to form the metal thin film. However, most typical examples thereof include Ag, Cu, Ni, Cr, Al, Gold, Mo and Co. Or an alloy thereof, or a laminate thereof.

However, it is needless to say that the material of the metal micro-circuit part of the present invention is not limited to the above-mentioned metal, but also various metal materials may be used. The selection of these materials can be made by taking into consideration economics, conductivity and objectivity. In the present invention, when vacuum vapor deposition of molybdenum on a transparent glass is used, the bonding between the metal thin film and the glass is relatively strong. The molybdenum has advantages of low electrical resistance and easy vacuum deposition.

The metal thin film layer throughout the present invention will be described below. The surface of the material of the transparent substrate including the transparent glass is cleaned and the vacuum deposition is first carried out at a thin thickness. It is generally said that it forms a seed layer. When the seed layer is formed, extremely fine metal particles generated from the target metal are embedded in the transparent substrate to form a firm bond. Once the seed layer is formed, it is generally used to increase the thickness of the thin film through plating on the seed layer.

The metal or alloy of Ag, Cu, Ni, Cr, Al, Gold, Mo and Co used in the present invention is mainly used for forming such a seed layer. In the present invention, since the thickness of the metal layer to be vacuum-deposited is thin, a metal thin film is often formed only in the seed layer itself.

However, in the present invention, when the thickness of the metal thin film is to be several micrometers, the metal thin film forms an additional metal layer by plating after forming the seed layer. The metal thin film thus formed also belongs to the present invention. However, since the thickness of the metal microcircuit of the present invention is mainly made of several thousands of angstroms, a metal thin film is often formed by the seed layer itself. However, a case where the metal thin film layer is reinforced through plating after forming the seed layer also belongs to the present invention.

Even if this part is not further described in each embodiment of the present invention, it will be applied to the entirety of the present invention.

In the present invention, when a vacuum deposition is performed, a single metal may be vacuum deposited or a vacuum deposition may be performed using a metal alloy to form a thin film. The metal thin film may have a multi-layer structure having different kinds of metals. After forming the metal thin film, the outermost layer of the metal thin film can be blackened to prevent the metal from reflecting light. Such a blackening operation may be performed by a metal blackening process by a general plating operation.

10 is an explanatory view of a process of applying a photosensitive layer to a metal thin film on a double-sided circuit transparent substrate.

First, metal is vacuum-deposited on both surfaces of the double-sided circuit transparent substrate 35 to form a metal thin film. Thereafter, the photosensitive material (36, 37) is uniformly applied to the metal thin film.

There are various methods of uniformly applying the photosensitive material. Depending on the thickness of the photosensitive material, the photosensitive material dry film may be laminated, the liquid photosensitive material may be spin-coated, or may be coated with a uniform thickness by various methods. This is a known technique.

11 is an explanatory view of an etching process in a double-sided circuit transparent substrate.

A light is irradiated by using a pattern film or a photomask in which a pattern constituting a metal microcircuit is formed on a photosensitive material. A part of the photosensitive material is removed through a developing process. A general etching process is performed on the portion from which the photosensitive material is removed. The metal fine circuits 40 and 39 are formed on both sides of the double-sided circuit transparent substrate 42 by such an etching process.

It is preferable that the portion where the metal thin film is removed by etching and the transparent substrate is exposed on the surface is subjected to seed etching in order to improve the transparency and improve the current flow. This is to improve the transparency by removing the metal deposited on the surface of the transparent substrate at the time of vacuum evaporation by etching a part of the surface with a minute thickness and to improve the transparency in the vacuum deposition, .

Such application techniques are well known in the art and will not be described in detail in the present invention.

The metal microcircuit can simultaneously form the sense electrode 40 and the wiring electrodes 38 and 41 by etching. It is also possible to make all the sense electrodes without wiring electrodes 38 and 41 as necessary.

In performing an exposure operation to construct a metal microcircuit, the pattern film or photomask used must be well designed for each metal microcircuit. The metal microcircuits need to maintain the pattern of the pattern in order to have uniformity from the overall viewpoint.

In practice, however, it is necessary to cut off the electrical current by forming a disconnection line that cuts the connecting wires finely to the metal microcircuit. When the sense electrodes are stacked in two layers, it is preferable that the metal microcircuits existing in the overlapping areas are arranged by disconnection.

If a disconnection is formed so that there is no overlapping part between them, there is an effect that it is possible to prevent confusion of an electric signal which occurs when there is external physical contact. That is, it is preferable to prevent the electric signal from being confused by preventing the electrically overlapping region from being present.

In the present invention, the metal microcircuit is mostly formed directly on the transparent substrate. In another embodiment, the transparent substrate on which the metal microcircuits are directly formed may be bonded to a separate transparent substrate on which the metal microcircuits are not directly formed.

When viewed from the outside, it seems that the metal microcircuit formed on the transparent substrate is attached as a whole, but the electric current must be substantially cut off. In other words, it is necessary to control the path of electricity by forming a single wire. This means that the visible form on the outside and the way in which electricity flows are very different.

In the present invention, the metal microcircuits are formed in a plurality of communities. Only the metal microcircuits constituting the same cluster can be energized. The electrical signal generated by the metal microcircuits forming the same cluster is taken up by one wiring electrode. The electrical signal is transmitted to the wiring electrode through the sense electrode.

12 is an explanatory diagram of a blackening process of a metal microcircuit in a double-sided circuit transparent substrate.

A double-sided circuit transparent substrate 43 on which a metal fine circuit is formed on both sides of a transparent substrate and then subjected to a blackening process. In this case, not only the outermost surface portions 44 and 45 of the metal microcircuit but also the side surface of the metal microcircuit portion can be blackened. It can be said that the metal micro-circuit completed all of the processes of the blackening process is a metal micro-circuit of the most preferable form in the present invention.

When the blackening treatment is performed, the metal microcircuit formed on the transparent substrate does not reflect directly on the light that is shone. When a metal thin film is formed on only one side of the transparent substrate and an etching operation is performed on the metal thin film to form a metal circuit, a blackening treatment is performed. On the other side where the blackening operation is not performed, . When a metal thin film is formed on a transparent substrate by vacuum deposition, reflection of light occurs even if a metal fine circuit of fine line width is formed.

The blackening treatment is not possible at the boundary portion where the transparent substrate and the metal thin film are bonded, that is, the surface portion of the transparent substrate to which the metal thin film is bonded. In other words, the surface where the transparent substrate and the metal fine circuit are in contact with each other can not be blackened.

Therefore, when the arrangement is such that the human eye can see the place, the human eye recognizes the shining of the metal surface. However, if a metal microcircuit is formed symmetrically on both sides of the transparent substrate and these metal microcircuits are blackened, the glittering portion of the metal can not be seen by human eyes.

In the case of forming a metal microcircuit on only one side of the transparent substrate, it is possible to constitute the transparent substrate so as not to see the shiny part of the metal if two blackened substrates are used in layers. In both of the cases, it is sufficient to position the portion subjected to the blackening treatment in a direction recognized by the human eye.

In the above, the process of forming the metal microcircuits blackened on the transparent substrate by the etching process has been described. However, it is possible to constitute a metal microcircuit which is blackened on a transparent substrate by the vacuum deposition method as well as the etching method described above. This method is also an embodiment of the present invention, and this process will be described below.

Fig. 13 is an explanatory diagram of the production of a transparent substrate on both surfaces by a line exposure process and a post-vacuum deposition process.

The photosensitive material 46 is uniformly coated on both sides of the transparent substrate 48. [ The photosensitive material is subjected to an exposure work using a pattern film or a photomask having a pattern formed thereon.

When the thickness of the transparent substrate 48 is thin and the thickness of the photosensitive material 46 applied to both sides of the transparent substrate is also several micrometers thick, So that the photosensitive material applied on both sides of the photosensitive material can be simultaneously exposed.

And irradiating the two photosensitive layers with a single light.

After the exposure operation, the space portion 47 is formed through the developing process. A metal thin film layer 50 is formed on the space portion through vacuum deposition to fabricate a metal microcircuit 52. The metal microcircuits 52 fabricated in this manner are made to have exactly symmetrical structures on both sides of the transparent substrate.

In order to increase the thickness of the metal thin film layer obtained through vacuum vapor deposition, the thin film layer may be further plated. When the double-sided circuit transparent substrate is manufactured in this way, since the metal fine circuits on both sides of the transparent substrate are exactly the same, the shapes of the sense electrode and the wiring electrode are also the same.

However, in practice, since the sense electrode and the wiring electrode must be configured differently on both sides of the transparent substrate, in order to control the sense electrode and the wiring electrode, the metal fine circuit portion is coated with the photosensitive material once again, . After this step, a blackening operation is performed on the metal microcircuit as necessary.

I will describe this process again. The photosensitive material 46 is applied uniformly to the both surfaces of the transparent substrate 48 to the same thickness. The photosensitive material is subjected to an exposure work using a pattern film or a photomask having a pattern formed thereon.

After the exposure process, a part of the photosensitive material is removed through a developing process. The portion where the photosensitive material is removed is defined as the space portion 47 in the present invention.

Thereafter, a process of vacuum-depositing metal on both sides of the transparent substrate is performed. When the metal is vacuum-deposited, the metal thin film layers 49 and 50 are simultaneously formed on the space portion and the upper portion of the photosensitive material remaining after the developing operation.

Examples of the vacuum deposition apparatus include a sputter system, an E-beam system, and a thermal system.

At this time, the metal used for the vacuum deposition is vacuum-deposited metal such as nickel, chromium, copper, silver, gold, cobalt, and molybdenum. Alternatively, the thin film can be formed by vacuum evaporation with an alloy of these metals. The metal thin film may have a multi-layer structure having different kinds of metals. Further, in the case where the thickness of the metal thin film is intended to be remarkably increased, plating may be additionally performed.

As described above, after the metal thin film is formed, the blackening operation can be performed. When the blackening operation is performed on the outermost layer of the metal thin film, the metal does not reflect light. Such a blackening operation may be performed by a metal blackening process by a general plating operation.

Next, a work is performed so that only a metal microcircuit remains on the transparent substrate. There are two types of metal thin films on the top of the transparent substrate.

First, the metal thin film deposited on the space portion and the second metal thin film deposited on the exposure portion exist. It is necessary to maintain the metal thin film formed in the space portion and to remove the metal thin film in other portions in order to construct the metal microcircuit. That is, the portion to be removed is the photosensitive material remaining after the developing operation and the metal thin film laminated on the photosensitive material.

Consider removing the photosensitive material first. If the thickness of the laminated metal thin film is extremely small, the photosensitive material is removed by immersing the thin metal film in a chemical liquid. However, the photosensitive material is protected by the metal thin film layer. However, if the metal thin film is thin, the chemical liquid penetrates through the extremely thin metal thin film and melts or causes the photosensitive material to melt.

When the photoresist material is lost by the chemical liquid, the thin metal film deposited on the photoresist material is removed without difficulty.

However, if the thickness of the metal thin film is relatively large, even if the metal thin film is simply immersed in the chemical liquid, the chemical liquid penetrates the metal thin film and can not penetrate the photosensitive material. In this case, the metal thin film layer is first polished through the fine polishing apparatus 51. When the metal thin film layer is wound by polishing, the chemical liquid can penetrate into the photosensitive material through the wound.

If the photosensitive material is lost in function, the metal thin film formed on the photosensitive material is easily removed. When the photosensitive material and the metal thin film vacuum-deposited on the photosensitive material are removed, only the vacuum deposited metal thin film is present in the space. After the metal microcircuit 52 is formed on the transparent substrate 53, the metal microcircuit can be blackened if necessary. The blackening processing section 54 is formed on both the outer and side portions of the metal microcircuit.

Hereinafter, the penetration exposure method, which is one of the features of the present invention, will be described. The through-hole exposure method is utilized in the fabrication of a double-sided circuit transparent substrate. A double-sided transparent substrate made by through-exposure method is a method that ensures that two metal microcircuits are exactly symmetrical. First, a photosensitive material is uniformly applied to both surfaces of a transparent substrate to form two photosensitive layers on both sides of the transparent substrate. Thereafter, only one of the two photosensitive layers is placed on a pattern film or a photomask, and the pattern film or the photomask is irradiated with light from above to expose the two photosensitive layers simultaneously.

In the present invention, this is defined as through exposure.

After the penetration exposure operation, a part of the photosensitive layer is removed by a developing process to form a space portion. Thereafter, the metal thin film layer is uniformly formed by vacuum deposition. When the vacuum deposition is performed, a metal thin film is formed on the space portions on both sides of the transparent substrate and on the photosensitive layer remaining on the transparent substrate.

The metal thin film layer formed in the space portion becomes a metal microcircuit. For this, the metal thin film and the photosensitive layer laminated on the photosensitive layer must be removed first. After these are removed, a thin metal layer remains only in the space portion, which is made of a metal microcircuit on both sides of the transparent substrate. The metal thin film layer can be subjected to the blackening treatment as described above.

The metal microcircuit portion may include a sense electrode, and the sense electrode may have a symmetrical structure with respect to a transparent substrate. A wiring electrode is formed at a rim portion of the metal microcircuit portion, and the wiring electrode is connected to a flexible circuit board or a control portion.

In addition, the metal microcircuit portion may have a closed cell structure having an irregular shape, and the closed cell structure having the irregular shape may be connected to each other to be conductive.

Figs. 14, 15, 16, 17, and 18 explain the wiring electrodes of the double-sided circuit transparent substrate.

14 is an explanatory diagram of a double-sided circuit transparent substrate of the present invention.

Of course, when viewed from one side, the sectional circuit transparent substrate is an explanatory diagram. A metal fine circuit portion 56 is formed on the transparent substrate 55. The metal micro-circuit portion serves as a sense electrode, and a wiring electrode 57 is formed at a rim portion of the sense electrode. A junction terminal portion (58) is formed at the distal end of the wiring electrode. The sense electrode portion and the wiring electrode portion are connected by the same metal thin film. The wiring electrodes are generally configured to have a significantly wider line width than the sense electrodes. If the line width of the sense electrode is 2 micrometers, the line width of the wiring electrode is made, for example, 30 micrometers. The junction terminal portion 58 is connected to the control unit or the flexible circuit board. It is preferable that the bonding terminal portion is formed thick and wide so that the connection terminal portion can be easily connected to the flexible circuit board. It is preferable that the silver paste is formed by printing.

15 is an explanatory view for explaining the configuration of the wiring electrodes formed on the upper surface and the lower surface of the double-sided circuit transparent substrate;

A wiring electrode portion or a junction terminal portion is formed on the upper surface and the lower surface of the transparent substrate 61, respectively. The junction terminal portion formed on the upper surface is referred to as an upper junction terminal, and the junction terminal portion formed on the lower surface is referred to as a lower junction terminal. The junction terminal portion is composed of a wiring electrode 60 formed by a gold foil thin film on a transparent substrate and a silver paste electrode 59 coated on the wiring electrode.

Fig. 16 is an explanatory view for explaining connection of a junction terminal in which a silver paste is printed on a wiring electrode to a flexible circuit board; Fig.

In the double-sided circuit transparent substrate, the upper junction terminal and the lower junction terminal exist via the transparent substrate. The wiring electrodes are formed by metal thin films on the top and bottom of the transparent substrate, and a silver paste is formed on the wiring electrodes by printing. The thickness of the wiring electrode is set to be less than 1 micrometer, and the thickness of the silver paste is generally several tens of micrometers.

The present embodiment describes that the flexible circuit board 63 is coupled to the double-sided circuit transparent substrate 62 on which wiring electrodes are formed by metal thin films on the upper and lower sides of the transparent substrate and silver paste is printed on the wiring electrodes do. A flexible circuit board may be connected to the junction terminal portion or a control portion may be connected.

The flexible circuit board 63 or the control unit should be connected to all the joint terminals. That is, the upper junction terminal and the lower junction terminal are bonded to the flexible circuit board. The flexible circuit board 63 is a circuit formed on a non-conductive soft substrate. The wiring electrodes of the double-sided circuit transparent substrate of the present invention are connected in a one-to-one correspondence to the respective circuits of the flexible circuit board. If the flexible circuit board is disposed on the upper surface of the double-sided circuit transparent substrate 62, the flexible circuit board and the upper junction terminals are easily connected.

However, if it is attempted to join the lower junction terminals to the flexible circuit board, it is impossible to directly connect them because the transparent substrate is blocked. A way to solve this is to use a via-hole. Utilizing a via hole is a commonly used technique for existing FPCBs. In the case of an FPCB composed of multiple layers, a multilayer circuit is connected through a via hole. A through hole is formed in the double-sided circuit transparent substrate of the present invention by application thereof, and the lower junction terminals are connected to the circuits of the flexible circuit board through the through hole. It is a common skill to connect the circuitry of the flexible circuit board and the lower junction terminals through the through-holes of the transparent substrate.

Fig. 17 is an explanatory view of a double-sided circuit transparent substrate 66 having a negative-side-part junction terminal.

In the double-sided circuit transparent substrate, a depressed portion is formed in a portion where the junction terminal is to be located. The engraved portions are respectively formed on the upper surface and the lower surface of the transparent substrate. It is most preferable that the engraved portion is formed by laser processing on a transparent substrate. The intaglio part is a transparent substrate, and is formed at the end of the wiring electrode. The engraved portion is formed in the engraved portion for the purpose of filling the silver paste used for the joining terminal. Therefore, the size of the engraved portion is formed to be similar to the size of the junction terminal. Of course, the machining method of the engraved portion may be machined in addition to the laser processing, or may be formed by heating the transparent substrate and then pressing it.

The engraved portion is first filled with a silver paste 64 so that the surface of the silver paste is kept flush with the surface of the transparent substrate 65. Thereafter, a metal thin film is formed on the upper and lower surfaces of the transparent substrate by vacuum vapor deposition. Of course, the metal thin film is also formed on the surface of the silver paste filled in the engraved portion. The metal thin film is etched to form a metal microcircuit to simultaneously form a sense electrode and a wiring electrode. The metal microcircuit portion may be formed by etching a metal thin film, but it is needless to say that the metal microcircuit portion can be formed by vacuum-depositing metal on a photosensitizer having a space portion.

A junction terminal portion is formed at the distal end of the wiring electrode 63. The silver paste 64 is placed under the wiring electrode 63, and the silver paste 64 is located in the recessed portion of the transparent substrate. In the present invention, the double-sided circuit transparent substrate having such a structure will be referred to as a double-sided circuit transparent substrate 66 having a negative-side-part junction terminal. A feature of the double-sided circuit transparent substrate 66 having a negative-side-part junction terminal is that the separation distance between the upper sense electrode and the lower sense electrode can be minimized. The reason why the separation distance can be reduced is that the silver paste is embedded in the transparent substrate.

Fig. 18 is an explanatory view of connecting to a flexible circuit board on a double-sided circuit transparent substrate 66 having a negative-side-part junction terminal.

A through hole is bored through a double-sided circuit transparent substrate 66 having a negative-side-part junction terminal, and each circuit of the flexible circuit board 67 is connected. All of the junction terminals of the upper junction terminal and the lower junction terminal are connected to the circuit of the flexible circuit board one to one.

Figs. 19, 20, 21, 22, 23, 24, and 25 are explanatory diagrams of a double-sided circuit transparent substrate having a through-hole bonding terminal.

Fig. 19 is an explanatory view of the penetrating portion in the penetrating portion junction terminal. Fig.

The penetrating portion 69 is formed at the distal end portion of the wiring electrode of the double-sided circuit transparent substrate 68. The penetrating portion is composed of a plurality of through grooves passing through the upper surface and the lower surface of the transparent substrate. The number of the grooves of the penetration portion is the same as the number of the junction terminals. A double-sided circuit transparent electrode having a penetrating portion at the distal end of the wiring electrode is referred to as a double-sided circuit transparent substrate having a penetrating junction terminal in the present invention.

Fig. 20 is an explanatory diagram of filling silver paste in the penetration portion. Fig.

And the silver paste 70 is filled in all of the penetrating portions of the penetrating portion junction terminals. The plane of the silver paste is flush with the upper and lower surfaces of the transparent substrate. In the present invention, silver paste is used as an example of the material filling the penetrating portion. However, it is of course possible to substitute any material as long as it is filled with a conductive conductive material and cured.

Fig. 21 is an explanatory view of forming a sense electrode and a wiring electrode after filling the silver paste in the penetration portion. Fig.

The silver paste 70 is filled in all of the through-holes, and the plane of the silver paste is flush with the upper and lower surfaces of the transparent substrate. Thereafter, metal is vacuum-deposited on the upper and lower surfaces of the transparent substrate to form a metal thin film. Of course, the metal thin film is also formed on the surface of the silver paste filled in the above penetrating portion.

The metal thin film is etched to form the metal microcircuit portion 72. The metal microcircuit portion simultaneously forms a sense electrode and a wiring electrode. The metal microcircuit portion may be formed by etching a metal thin film, but it is needless to say that the metal microcircuit portion can be formed by vacuum-depositing metal on a photosensitizer having a space portion.

Wiring electrodes are simultaneously formed on the upper and lower portions of the silver paste 70 filled in the penetrating portion.

The wiring electrodes formed on the upper surface of the transparent substrate and the wiring electrodes formed on the lower surface of the transparent substrate through the rational design of the pattern film or the photomask for forming the wiring electrodes can be uniformly formed on the silver paste filled in the through- . The connections are not overlapped with each other so that the silver paste filled in one tube bundle is connected to only one wiring electrode. A double-sided circuit transparent substrate in which a silver paste filled in a penetrating portion of the transparent substrate and a wiring electrode are connected to each other in a one-to-one manner will be referred to as a double-sided circuit transparent substrate 68 having a penetrating portion in the present invention.

22 is a cross-sectional explanatory view of a double-sided circuit transparent substrate having a through-hole junction terminal.

A through hole 69 penetrating from the upper surface to the lower surface of the transparent substrate 68 is formed. It is most preferable that the through grooves are formed by laser processing on a transparent substrate. The through-hole is a transparent substrate, and is formed at the end of the wiring electrode. The through-hole is formed for the purpose of filling the silver paste to be used for the junction terminal. Therefore, the size of the through-hole is formed to be similar to the size of the junction terminal. Of course, the machining method of the through-hole can be realized by various methods such as machining in addition to laser machining.

23 is an explanatory view for explaining filling silver paste in the penetration portion.

The silver paste 70 is filled in the through-hole of the transparent substrate 68. The top and bottom planes of the silver paste are flush with the top and bottom surfaces of the transparent substrate. In the present invention, silver paste is used as an example of the material filling the penetrating portion. However, it is of course possible to substitute any material as long as it is filled with a conductive conductive material and cured. It is also possible to inject metal into the through-hole. A ball-shaped metal is injected into the through-hole, and the filling can be performed by pressing it up and down. Alternatively, electroless plating may be performed on the through grooves to impart conductivity. Techniques for imparting conductivity to such through-holes are within the prior art. In the present invention, the silver paste is mainly described in the penetration portion, but filling the substitute material falls within the scope of the present invention. It is also advantageous to inject the metal rather than fill the silver paste. When the silver paste is filled, it takes a lot of work to cleanly arrange it so as not to touch the other parts.

Fig. 24 is an explanatory diagram of a double-sided circuit transparent substrate having a penetrating portion.

The upper and lower planes of the silver paste 70 are flush with the upper and lower surfaces of the transparent substrate and the metal is vacuum deposited on the upper and lower surfaces of the transparent substrate 68 to form a metal thin film do. Of course, the metal thin film is also formed on the surface of the silver paste filled in the above penetrating portion.

The metal thin film is etched to form the metal microcircuit portion 72. The metal microcircuit portion simultaneously forms a sense electrode and a wiring electrode. The metal microcircuit portion may be formed by etching a metal thin film, but it is needless to say that the metal microcircuit portion can be formed by vacuum-depositing metal on a photosensitizer having a space portion.

Wiring electrodes are simultaneously formed on the upper and lower portions of the silver paste 70 filled in the penetrating portion.

The wiring electrodes formed on the upper surface of the transparent substrate and the wiring electrodes formed on the lower surface of the transparent substrate through the rational design of the pattern film or the photomask for forming the wiring electrodes can be uniformly formed on the silver paste filled in the through- . The connections are not overlapped with each other so that the silver paste filled in one tube bundle is connected to only one wiring electrode.

A double-sided circuit transparent substrate in which the silver paste filled in the penetrating portion of the transparent substrate and the wiring electrodes are connected to each other in a one-to-one manner will be referred to as a double-sided circuit transparent substrate 71 having a penetrating portion in the present invention.

25 is an explanatory view for explaining bonding of a flexible circuit board to a double-sided circuit transparent substrate having a penetrating portion.

The flexible circuit board 73 or the control unit is connected to the double-sided circuit transparent substrate 71 having the penetrating portion. All the through-holes of the double-sided circuit transparent substrate 71 having the penetrating portion are joined together in a one-to-one manner in all the circuits connected to the flexible circuit board or the control unit. In the case of the double-sided circuit transparent substrate 71 having a penetrating portion, it is not necessary to form a via hole in the transparent substrate. This is because a penetrating portion is already formed in the transparent substrate and silver paste is filled in the penetrating portion to make an electrical path. Therefore, the double-sided circuit transparent substrate having the flexible circuit board and the penetrating portion can be bonded very easily.

Figs. 26, 27, and 28 are explanatory diagrams of the intervals of the one-sided circuit transparent substrate.

The one in which a metal fine circuit is formed on only one side of the transparent substrate is referred to as a one-side circuit transparent substrate in the present invention. In the case of using a single-sided circuit transparent substrate, two single-sided circuit transparent substrates are necessarily used to form a touch screen panel. When two sheets of single-sided circuit transparent substrates are used, the spacing between the two metal microcircuits present in the single-sided circuit transparent substrate plays an important role.

When two sheets of single-sided circuit transparent substrates are used, they are roughly divided into three types. First, it is the case as shown in Fig. This is the case where the metal microcircuit portions of the two sectional circuit transparent substrates are arranged in the same direction. Second, this is the case as in Fig. This is the case when two transparent substrates are facing each other. Third, it is the case as in Fig. This is the case when the two metal micro-circuits are facing each other.

Even in the case of a single-sided circuit transparent substrate, a junction terminal portion is formed at the end portion of the wiring electrode. When forming the junction terminals, there are two types of silver paste existing depending on the form of the silver paste formed on the wiring electrode. Firstly, a silver paste is printed on the upper part of the metal microcircuit part. Secondly, a negative part is formed on a transparent substrate, a silver paste is filled in the recessed part, and a metal microcircuit part is formed on the silver paste.

For each of the above three forms of arrangement, in each case there may be an existing form of the two silver pastes as described above.

The transparent circuit board of the present invention has a metal microcircuit portion formed on one surface thereof, the metal microcircuit portion includes a sense electrode, a wiring electrode is formed at a rim portion of the sense electrode, The junction terminal portion is connected to the control portion or the flexible circuit board, and the junction terminal portion includes a silver paste printed on the wiring electrode. In addition, the transparent circuit board of the present invention has a recessed portion formed on one side of the transparent substrate, and the recessed portion is formed at the end of the wiring electrode, and the recessed portion is filled with silver paste.

26 is an explanatory view of a case where the metal microcircuit portions of the two-sided circuit transparent substrates are arranged in the same direction.

The metal fine circuit portions 74 and 75 are formed on the transparent substrate 77. The sensing electrode 75 and the wiring electrode 74 may be composed of the metal microcircuit portion. Two such single-sided circuit transparent electrodes 76 are laminated. In the stacking of these, the two sectional circuit transparent electrodes are arranged in the same direction. A transparent adhesive for optical use is used between the two cross section circuit transparent electrodes. When the thickness of the transparent adhesive is minimized, the interval t between the two metal microcircuit portions can be made approximately equal to the thickness of the transparent substrate 77.

However, also in this case, in forming the junction terminal in the wiring electrode, the intervals between the two metal microcircuit parts differ depending on the method of placing the silver paste. That is, there is a big difference depending on whether the silver paste is to be printed on the metal micro-circuit part or by the engraving method. Printing silver paste works well but is accompanied by an increase in thickness. With the engraving method, there is a problem of filling the engraved portion with the silver paste, and a processing operation of machining the engraved portion. However, there is no increase in thickness due to silver paste.

FIG. 27 is an explanatory view of a case where two transparent substrates face each other. FIG.

In this case also, in the case of constructing the junction terminal by the wiring electrode 78, the spacing between the two metal microcircuit parts differs according to the method of placing the silver paste. That is, whether the silver paste 79 is printed on the metal microcircuit portion 80 or by the engraved method. Fig. 27 shows the silver paste printed on the metal microcircuit portion. When the thickness of the transparent adhesive is minimized, the interval t between the two metal microcircuit portions is almost equal to twice the thickness of the transparent substrate 81 Level.

Fig. 28 is an explanatory diagram of a case where two metal microcircuit parts face each other. Fig.

In this case also, the spacing t between the two metal microcircuit portions is different according to the method of positioning the silver paste in the construction of the junction terminal in the wiring electrode 85. [ That is, there is a big difference depending on whether the silver paste is to be printed on the metal micro-circuit part or by the engraving method. 28 shows a case where the silver paste 83 is filled in the recessed portion of the transparent substrate 84. Fig. When the thickness of the transparent adhesive is minimized, the distance between the two metal microcircuit parts can be made to be almost the same as the distance between the two transparent microcircuit parts. The silver paste 83 is filled in the recessed portion by the wiring electrode 85 as seen from the cut surface of the junction terminal portion. The feature of this structure is that the separation distance between the upper sense electrode and the lower sense electrode can be minimized. The reason why the separation distance can be reduced is that the silver paste is embedded in the transparent substrate. When the spacing distance is reduced as described above, the metal microcircuit portion maintains a symmetrical structure with respect to the transparent substrate precisely, and the function of the touch screen panel can be performed most accurately.

29 is an explanatory view of a touch panel substrate in which a transparent coating layer is formed on one side of a double-sided circuit transparent substrate.

In the case of a double-sided circuit transparent substrate having a metal microcircuit formed on both sides of the transparent substrate 87, a transparent coating layer 88 may be further provided on either side. Or a transparent substrate may be coated with a transparent adhesive for optical use. The methods of coating vary. However, the coating must be transparent.

Of course, the double-sided circuit transparent substrate itself is completed without a transparent coating layer formed. In other words, the product is completed by only the touch panel substrate itself having the metal fine circuit portions formed on both sides of the transparent substrate.

However, a transparent coating layer 88 is formed to bond the double-sided circuit transparent substrate to the external contact transparent substrate so that a touch screen panel can be formed. When the external contact transparent substrate and the double-sided circuit transparent substrate are combined, they are bonded with a transparent adhesive for optical use.

One example of the optical transparent adhesive is OCA (Optical Clear Adhesive).

Figs. 30, 31, 32, 33, 34, 35, 36, and 37 show a case where the double-sided circuit transparent substrate or the single-sided circuit transparent substrate of the present invention is bonded to the external contact transparent substrate, Various types of embodiments for completing with a panel will be described.

In the present invention, a metal fine circuit formed on both sides of a transparent substrate is defined as a double-sided circuit transparent substrate and used. In addition, the formation of a metal microcircuit on only one side of the transparent substrate is defined as the term "single-sided circuit transparent substrate".

Embodiments of the various types of touch screen panels disclosed below are subject to the protection of the present invention. The concepts of the touch panel substrate and the touch screen panel used in the present invention are defined. What is used in the image display device is called a touch screen panel. The touch screen panel is a touch panel substrate bonded to an external contact transparent substrate.

In the present invention, the touch screen panel of the present invention is manufactured using the touch panel substrate which is one of the present invention. In the touch screen panel, a transparent substrate in contact with the outside is defined as an external contact transparent substrate in the present invention.

In most cases, the top surface of the outer contact transparent substrate is in direct contact with the human hand, through which physical contact occurs. In most cases, the upper surface of the external contact transparent substrate is often in contact with the outside, so it is often used with tempered glass.

In the present embodiment, the illustrated figure is intended to illustrate the concept but not to the actual size. For example, in the case of a smart phone, most of the external transparent substrates use tempered glass, and the thickness of the tempered glass is about 4 mm.

However, the thickness of the double-sided circuit transparent substrate of the present invention applied to smart phones is only a few tens of micrometers to several hundreds of micrometers in thickness. The thickness of the optical transparent adhesive layer is formed to be about several micrometers in thickness. And the thickness of the transparent coating layer is only about a few micrometers in thickness. In addition, the line width of the metal microcircuit is within 2 micrometers to 10 micrometers, and the size of the metal microcircuit is typically about 100 micrometers wide and 100 micrometers wide, considering square.

These figures are for reference only, as they are set differently depending on the product. However, in order to facilitate understanding of the present invention, a brief mention is made of the size.

30 is an embodiment of a touch screen panel in which an external contact transparent substrate and a double-sided circuit transparent substrate are bonded.

In this embodiment, a portion where a human hand touches and applies a physical signal is referred to as an external contact transparent substrate 57 or 62, which is most often a transparent glass having enhanced surface strength. In addition, various transparent materials such as a transparent plastic substrate can be used. Flexible Flexibility In order to produce a touch screen panel, it is of course also possible to adopt a flexible flexible material for the outer contact transparent substrate.

In the present embodiment, the double-sided circuit transparent substrates 92 and 96 are bonded to the lower portions of the external contact transparent substrates 89 and 94. The external contact transparent substrates 89 and 94 and the double-sided circuit transparent substrates 92 and 96 are bonded to each other via the optical transparent adhesive layers 91 and 95.

In the lower portion of the double-sided circuit transparent substrates 92 and 96, transparent coating layers 93 and 97 may be formed to protect the metal microcircuit portions. The transparent coating layers 93 and 97 are formed for the purpose of protecting the metal microcircuit constituted in the lower part, and made of a transparent material.

Therefore, although the name is a transparent coating layer, it is needless to say that the present invention can be configured in various materials and forms suitable for the above purposes. That is, it is needless to say that the transparent coating layer can be replaced with a transparent adhesive layer for optical.

 The metal microcircuit portion includes a sense electrode, a wiring electrode is formed at a part of the edge of the sense electrode, and the wiring electrode can be connected to a flexible circuit board or a control portion.

In addition, the metal microcircuit portion may have a closed cell structure having an irregular shape, and the closed cell structure having the irregular shape may be connected to each other to be conductive, and the metal microcircuit portion may be blackened have.

The metal microcircuit portion is preferably symmetrical with respect to the transparent substrate. This embodiment is an embodiment in which a double-sided circuit transparent substrate is applied to an actual touch screen panel.

In the touch screen panel, the uppermost layer is referred to as an external contact transparent substrate 89, 94. This is where there is direct physical contact with a person's hands or outside. Normally, the lower side of the outer transparent substrate is printed with a paint.

In the present invention, this is referred to as a decor (90). The deco is formed at the edge of the transparent substrate, which is in contact with the outside, when viewed from a smart phone or the like. This is an area printed with a colored paint on the lower surface of the external contact transparent substrate. When a decoration is formed, there is a certain thickness due to the colored paint which makes the decoration.

Therefore, a level difference exists between the plane of the lower surface of the external contact transparent substrate and the plane of the decor, so that a step is formed. Despite the step difference due to the decoloration, the external transparent transparent substrates 89 and 94 and the double-sided circuit transparent substrates 92 and 96 can be bonded to each other due to the use of the optical transparent adhesive layer.

In the structure of this embodiment, transparent adhesive layers 91 and 95 for optical are formed on the lower surface of the external contact transparent substrates 89 and 94. The double-sided circuit transparent substrates 92 and 96 are positioned below the optical transparent adhesive layers 91 and 95.

On both sides of the double-sided circuit transparent substrates 92 and 96, a metal microcircuit is formed. Transparent coating layers 93 and 97 are formed to protect the metal microcircuits on the lower surface of the double-sided circuit transparent substrate.

Of course, the metal microcircuit portion can be subjected to blackening treatment.

The metal microcircuit portion may include a sense electrode, and the sense electrode may have a symmetrical structure with respect to a transparent substrate. A wiring electrode is formed at a rim portion of the metal microcircuit portion, and the wiring electrode is connected to a flexible circuit board or a control portion.

In addition, the metal microcircuit portion may have a closed cell structure having an irregular shape, and the closed cell structure having the irregular shape may be connected to each other to be conductive.

Fig. 31 shows an embodiment of a touch screen panel in which an outer transparent substrate is formed of a transparent adhesive layer for optical.

FIG. 31 shows optical transparent adhesives 98, 100, 101, and 103 formed on the upper and lower surfaces of the double-sided circuit transparent substrates 99 and 102.

This is characterized in that the optical transparent adhesives 98 and 101 are directly used as an external contact transparent substrate.

When a liquid optical adhesive for optical use is used, a liquid transparent adhesive for optical use is injected into the upper surface of the double-sided circuit transparent substrates 99 and 102, and planarization is performed. Of course, in order to perform the flat forming, it is preferable to work through the roller.

In the case of forming a sheet-like (plate-like) optical transparent adhesive to be molded, the optical transparent adhesive on the sheet is placed on the upper surface of the double-sided circuit transparent substrates 99 and 102, . Of course, in order to perform the flat forming, it is preferable to work through the roller.

There are various ways of heating. For example, direct heating may be performed, or only the surface may be heated through a high-frequency or ultrasonic generator.

In addition, the lower surface of the double-sided circuit transparent substrates 99 and 102 is also bonded and flat-formed by the optical transparent adhesive.

The metal microcircuit portion can be subjected to blackening treatment.

In addition, the metal microcircuit portion may include a sense electrode, and the sense electrode may be formed in a symmetrical structure around a transparent substrate of a double-sided circuit transparent substrate. A wiring electrode is formed at a rim portion of the metal microcircuit portion, and the wiring electrode is connected to a flexible circuit board or a control portion.

In addition, the metal microcircuit portion may have a closed cell structure having an irregular shape, and the closed cell structure having the irregular shape may be connected to each other to be conductive. Since the metal microcircuit portion is subjected to the blackening treatment, the light reflected from the outside is reflected on the metal microcircuit portion and is prevented from being shiny.

32 shows an embodiment in which a transparent coating layer is formed without using a transparent adhesive for optical use.

There are also various methods for forming a transparent coating layer without using an optical transparent bonding agent. The purpose of the transparent coating layer is to protect the metal microcircuits, so that only the corresponding role is required. The important thing is to coat with uniform thickness while maintaining transparency.

Optical transparent adhesives 104 and 107 are formed on the upper surfaces of the double-sided circuit transparent substrates 105 and 108, and transparent coating layers 106 and 109 are formed on the lower surface. This is characterized in that the optical transparent adhesives 104 and 107 are directly used as an external contact transparent substrate.

When a liquid optical adhesive for optical use is used, a liquid transparent adhesive for optical use is injected into the upper surface of the double-sided circuit transparent substrates 105 and 108, and planar molding is performed. Of course, in order to perform the flat forming, it is preferable to work through the roller.

33 is an embodiment of a touch screen panel in which an external contact transparent substrate and a single-sided circuit transparent substrate are bonded.

And two two-sided circuit transparent substrates 112 and 114 are bonded to an external-contact transparent substrate 110. Fig. A metal fine circuit is formed on the upper surface of the one-side circuit transparent substrate. Optical transparent adhesives 111 and 113 are placed on top of each of the two-sided circuit transparent substrates, and they are bonded.

The external contact transparent substrate and the two single-sided circuit transparent substrates are bonded. Of course, the metal microcircuit portion can be subjected to blackening treatment.

The metal microcircuit portion may include a sense electrode, and the sense electrode may have a symmetrical structure with respect to a transparent substrate. A wiring electrode is formed at a rim portion of the metal microcircuit portion, and the wiring electrode is connected to a flexible circuit board or a control portion.

In addition, the metal microcircuit portion may have a closed cell structure having an irregular shape, and the closed cell structure having the irregular shape may be connected to each other to be conductive.

Fig. 34 shows an embodiment of a touch screen panel in which an outer transparent transparent substrate is formed of a transparent adhesive layer for optical.

This is an application example of an embodiment of a touch screen panel in which an external contact transparent substrate and a single-sided circuit transparent substrate are bonded.

That is, this embodiment is an embodiment in which an optical transparent adhesive layer is used as an external contact transparent substrate without separately configuring an external contact transparent substrate.

Transparent adhesive layers 115, 117, 119 and 121 for optical are formed on the upper surfaces of the single-sided circuit transparent substrates 116, 118, 120 and 122. This is characterized in that the optical transparent adhesive is directly used as an external contact transparent substrate. When a liquid optical adhesive for optical use is used, a liquid transparent adhesive for optical use is injected into the upper surface of the above-mentioned one-sided circuit transparent substrates 116 and 120, and planarization is performed. Of course, in order to perform the flat forming, it is preferable to work through the roller.

Of course, the metal microcircuit portion can be subjected to blackening treatment.

The metal microcircuit portion may include a sense electrode, and the sense electrode may have a symmetrical structure with respect to a transparent substrate. A wiring electrode is formed at a rim portion of the metal microcircuit portion, and the wiring electrode is connected to a flexible circuit board or a control portion.

In addition, the metal microcircuit portion may have a closed cell structure having an irregular shape, and the closed cell structure having the irregular shape may be connected to each other to be conductive.

Figure 35 is an embodiment of a touch screen panel featuring an external touch transparent substrate having conductive circuitry.

This is characterized in that the conductive circuit part 125 is directly formed on the lower surface of the external contact transparent substrate 123. [

A decal 124 is printed on the lower surface of the external contact transparent substrate 123 and a metal microcircuit, an ITO circuit or a conductive polymer circuit is directly formed on the lower surface of the external transparent substrate 123.

Means that the circuit is not bonded by using a transparent adhesive for optical, and a circuit is formed directly on the external contact transparent substrate.

ITO stands for Indium Tin Oxide. ITO can be replaced with transparent conductive film forming materials such as IZO, ZnO, and In2O3.

In order to form the conductive circuit part 125 directly on the outer surface of the external contact transparent substrate, vacuum deposition is performed on one surface of the external transparent substrate. Then, a conductive circuit portion such as metal or ITO is formed on one surface of the external contact transparent substrate through a photosensitive process, a development process, and an etching process.

To constitute the touch screen panel, another transparent substrate 126 having circuit portions is bonded to the external contact transparent substrate 123 on which the conductive circuit portion is formed. Of course, the above bonding is performed through the optical transparent adhesive 127.

Another transparent substrate 126 having a circuit portion is a transparent substrate formed with a metal microcircuit or an ITO circuit or a conductive polymer circuit. In the case of a metal microcircuit, the single-sided circuit transparent substrate of the present invention is applied.

In the case of a transparent substrate on which an ITO circuit or a conductive polymer circuit is formed, as described above, ITO or a polymer is vacuum deposited on one surface of the transparent substrate, and a conductive circuit is formed through a photosensitive process, a development process, and an etching process.

When the conductive circuit part 125 is directly formed on the lower surface of the external contact transparent substrate 123, the metallic microcircuit part forms a sense electrode, and a wiring electrode is formed at the edge of the sense electrode And the wiring electrodes are connected to a flexible circuit board or a control unit.

In addition, the metal microcircuit portion may have a closed cell structure having an irregular shape, and the closed cell structure having the irregular shape may be connected to each other to be conductive.

When joining is performed through the transparent adhesive layer for optical, there is a step difference between the outer surface of the transparent substrate 91 and the decor 124 that is printed with the paint. Even if there is a step difference, the use of the optical transparent adhesive layer 127 progresses smoothly. The present invention provides the advantage of simultaneously forming the sense electrode and the wiring electrode.

36 is an embodiment of a touch screen panel in which a single-sided circuit transparent substrate is bonded to an external touch transparent substrate having a conductive circuit portion.

This is characterized in that a conductive circuit portion is directly formed on the lower surface of the external contact transparent substrate 131. [ And a cross-sectional circuit transparent substrate of the present invention is bonded to the external contact transparent substrate.

A metal microcircuit, an ITO circuit or a conductive polymer circuit is directly formed on the lower surface of the external contact transparent substrate 131. Means that a circuit is directly bonded to the external contact transparent substrate 96 without using a transparent adhesive for optical purposes.

The single-sided circuit transparent substrate 133 of the present invention is bonded to the external contact transparent substrate 131 having the conductive circuit portion via the optical transparent bonding agent 132. [

In the single-sided circuit transparent substrate 133 of the present invention, a metal fine circuit portion is constituted. Of course, the metal microcircuit portion can be subjected to blackening treatment.

The metal microcircuit portion may include a sense electrode, and the sense electrode may have a symmetrical structure with respect to a transparent substrate. A wiring electrode is formed at a rim portion of the metal microcircuit portion, and the wiring electrode is connected to a flexible circuit board or a control portion.

In addition, the metal microcircuit portion may have a closed cell structure having an irregular shape, and the closed cell structure having the irregular shape may be connected to each other to be conductive.

Fig. 37 is an embodiment of a touch screen panel constituted by two opposing two-sided circuit transparent substrates.

This is obtained by placing two transparent circuit boards of the present invention facing each other and forming an optical transparent bonding layer 138 between the two circuit board transparent substrates 137 and 139.

The upper single-sided circuit transparent substrate 137 fulfills the function of the external contact transparent substrate having the conductive circuit portion. In the single-sided circuit transparent substrate 137 present on the upper side, the transparent substrate has a somewhat thicker thickness so as to fulfill the role of the external contact transparent substrate.

In other words, it is necessary to strengthen the strength because it is a portion having contact with a finger of a person from the outside. For this purpose, it is preferable not only to increase the thickness but also to increase the strength and to prevent the external scratches by applying a transparent coating or a coating film. It is also preferable that the material is tempered glass having high strength.

A metal fine circuit portion 140 is formed on the lower single circuit transparent substrate 139.

In this case, it is preferable that the metal fine circuit portion is formed in a symmetrical structure with the optical transparent adhesive layer 138 as the center.

Of course, the metal microcircuit portion can be blackened, wiring electrodes can be formed in a part of the edge portion of the metal microcircuit portion, and the wiring electrodes can be connected to a flexible circuit board or a control portion.

Wherein the metal microcircuit portion is configured to have a single wire, the metal microcircuit portion has a closed cell structure having a continuous polygonal shape or an irregular shape, and the closed cell structure having the irregular shape is connected to each other So that current can be supplied.

The closed cell structure having the irregular shape is composed of an irregularly shaped polygon connected continuously, the lines constituting each side of the polygon are formed of irregular curves, and the respective vertexes of the polygon are irregularly positioned I can do it.

In addition, the metal microcircuit portion is formed of a plurality of electrically independent groups, and only the metal microcircuits constituting the same cluster are electrically connected to each other.

38 is an explanatory view for explaining disconnection of the metal microcircuit.

The metal microcircuit portion is constructed so as to have disconnection lines 142 and 144. The lines (141, 143) constituting the metal microcircuits constitute a closed cell structure having a continuous polygonal shape or an irregular shape, and the closed cell structure having the irregular shape can be connected to each other to be energized There is a number. Alternatively, the electrified fine circuit portion can be constituted by a horizontal line or a vertical line as will be described later. In any case, the touch panel substrate is formed with a communicable group. All the metal microcircuit parts or the energized microcircuit parts belonging to the same community are electrically connected to each other. In order to electrically isolate the metal microcircuits or the current-carrying microcircuits, the lines of the metal microcircuits or the current-carrying microcircuits are disconnected.

It is important to ensure that disconnection is not visible. Therefore, it is preferable to cut the wire with an extremely fine width. The figure at the lower part of Fig. 28 shows that the metal microcircuit part or the energized microcircuit part is formed with the horizontal line in the center, and the disconnection at the appropriate position on the horizontal line is explained. The points 142 and 144 indicated by the triangles in the figure indicate points where the triangle has formed a disconnection at that point. In the present invention, a micro-circuit portion including a metal and capable of being energized is referred to as an energized micro-circuit portion. Particularly, when the metal constituting the conductive fine circuit portion is a metal, it is referred to as a metal fine circuit portion. Generally, a conductive material such as a silver paste or a conductive ink constituting a fine circuit portion is referred to as a conductive fine circuit portion.

Figs. 39 and 40 are explanatory views for explaining the configurations of the X-axis and Y-axis sense electrodes.

In the present invention, when the metal microcircuit portions are formed on both sides of the transparent substrate, the metal microcircuits to be formed can be constituted of parallel lines without constituting arbitrary figures. An X-axis sense electrode is formed on one surface of the transparent substrate, and a Y-axis sense electrode is formed on the other surface.

The X and Y axes are orthogonal. The X-axis sense electrode and the Y-axis sense electrode are formed of a plurality of electrically-independent power supply assemblies, and only the metal micro-circuits forming the same current-carrying community are energized.

 On the X-axis sense electrode, the X-axis sense electrode and the Y-axis sense electrode are formed by the metal line parallel to the X-axis.

If a double-sided circuit transparent substrate is fabricated from metal lines parallel to the X-axis and metal lines parallel to the Y-axis, the transmittance can be increased. A metal line parallel to the X axis is formed on one surface of the transparent substrate and a metal line parallel to the Y axis is formed on the other surface of the transparent substrate on the one surface of the transparent substrate rather than the metal fine circuit portion having the same shape as the mesh is placed on both surfaces of the transparent substrate. It is a matter of course that the transmittance can be increased more than when the metal microcircuit portion is formed in the same shape as the mesh with the same line width.

If a double-sided circuit transparent substrate is fabricated from metal lines parallel to the X-axis and metal lines parallel to the Y-axis, the transmittance can be increased and optical side effects can be reduced. Of course, it is possible to construct a line with an irregular curve instead of a straight line without using a straight line.

Fig. 39 is an explanatory view for explaining the configuration of the X-axis sense electrode. Fig.

An X-axis sense electrode 146 is formed on the transparent substrate 145. The X-axis sense electrode is composed of metal lines 147 parallel to the Y-axis. The X-axis sense electrode is formed of a plurality of electrically-independent power supply assemblies, and only the metal micro-circuits forming the same current-carrying community are energized.

A wiring electrode 148 is formed at the end of each current-carrying community. When the silver paste printing unit 149 is formed at the distal end of the wiring electrode, connection can be conveniently performed when connecting the flexible circuit board.

Fig. 40 is an explanatory view for explaining the configuration of the Y-axis sense electrode. Fig.

And a Y-axis sense electrode 151 is formed on the transparent substrate 150. [ The Y-axis sense electrode is composed of metal lines 152 parallel to the X-axis. The Y-axis sense electrode is formed of a plurality of electrically-independent power supply assemblies, and only the metal micro-circuits forming the same current-carrying community are energized.

A wiring electrode 153 is formed at the end of each energizing community. When the silver paste printed portion 154 is formed at the distal end of the wiring electrode, connection can be conveniently performed when connecting the flexible circuit board.

FIG. 41 is an explanatory view for explaining a bridge line formed on the Y-axis sense electrode. FIG.

A bridge line 157 is formed in a current-carrying community 155 constituting a sense electrode so that current flows to neighboring lines even when the metal lines 156 formed in parallel to the axis are broken.

The bridge line is formed such that a metal line parallel to the X axis is formed in the energizing community composed of metal lines parallel to the Y axis, and in the energizing community composed of metal lines parallel to the X axis, And a metal line is formed in various places.

The bridge line is not required to have a large number, but it is desirable to form the bridge line with an appropriate number in consideration of the breakage of the parallel metal line at the time of designing the circuit. The bridge line not only provides contrast when a parallel metal line is broken, but also helps smooth flow of the whole bridge.

Of course, the wiring electrode 158 is formed at the end of the current-carrying community. It is preferable that a silver paste printing portion 159 is formed at the end portion of the wiring electrode.

It goes without saying that the techniques of the touch panel substrate described above are applicable to the X-axis and Y-axis sense electrodes, which are one of the present invention. That is, the wiring electrode can be formed in the edge region of the sense electrode. Further, a silver paste may be printed on the end portion of the wiring electrode, and may be connected to the flexible circuit board or the control unit through the silver paste. Further, the metal microcircuit portion can be blackened, and a transparent coating layer can be additionally formed on the metal microcircuit portion on one or both sides of the transparent substrate.

The metal microcircuit portion may be composed of any one of metals of Ag, Cu, Ni, Cr, Al, Gold, Mo and Co, or an alloy thereof, or a laminate thereof. Transparent resin, transparent PET, transparent plastic, or transparent optical film. The metal microcircuit part has a disconnection.

Needless to say, the present invention is applicable not only to a double-sided transparent substrate but also to a single-sided transparent substrate. In the present invention, it is possible to connect the flexible circuit board to the wiring electrode or directly connect the control unit to the wiring electrode. In addition, a flexible circuit board may be formed directly on the wiring electrode itself in order to reduce the cost without bonding the flexible circuit board to the wiring electrode itself.

42 is an explanatory view of a roll-shaped elastic substrate having a very fine circuit groove.

This figure illustrates that a conductive fine circuit is formed on a transparent substrate through a roll-shaped elastic substrate.

The microcircuit as the transparent substrate 166 does not necessarily have to be a metal. Conductive materials are possible without metals. For example, when silver paste or conductive ink is printed on a transparent substrate and the printed conductive material is hardened and used as a microcircuit, the most economical product can be produced.

A method of constituting a circuit by printing is a technique which has been already known. However, conventionally, printing has been performed in a range of a line width of a circuit ranging from 30 micrometers to 60 micrometers. It is hard to imagine that in the mass production process, which mass-manufactures the product, the extremely fine circuit with a line width of 2 micrometers is implemented through printing. The present invention enables this through the elastic substrate technology disclosed in the present invention.

In the present invention, the elastic substrate 164 having the fine grooves 163 filled with the conductive material 160 is used. In this figure, the elastic substrate is formed into a roll shape, but it is needless to say that it is also possible to have a plate shape. The fine grooves can be configured in various shapes. It is common that it is formed in the shape of a circuit. In this case, the fine grooves have the shape of a line forming a fine circuit. The elastic substrate is made of a flat plate or roll 165. The surface of the conductive material 161 filled in the fine grooves is surface-matched by the squeeze 162. In the state of being pressed with a small force, the conductive material moves to the transparent substrate 166 located in the lower portion of the roll in the fine grooves. The transferred conductive material is constituted by a conductive fine circuit on the transparent substrate through the curing action.

Fig. 43 is an explanatory view of a plate-like elastic master having an extremely fine circuit groove.

The present invention also includes a touch panel substrate and a touch screen panel on which a very fine circuit is formed by a printing method. In forming the electrode fine circuit, the metal microcircuit can be formed by etching a metal thin film, but the conductive fine circuit can also form a very fine circuit by printing a conductive material on a transparent substrate.

If the conductive fine circuit is formed by such a printing method, the manufacturing cost can be remarkably reduced. There are a variety of conductive materials to be used when constructing an electrified fine circuit by a printing method. Conventional conductive inks are diverse in the past, but silver pastes will be used as typical examples. Conventionally, it is a generally known technology to implement a circuit by a printing method using a silver paste. However, it has not been easy in the past to print a line width of a circuit in the range of 2 micrometers to 5 micrometers.

In the present invention, an elastic master having a very fine circuit groove is used for printing a circuit of such a very fine line width. In the present invention, the description will be continued with the term elastic master or elastic substrate. The width of the groove of the elastic master is made between 2 micrometers and 5 micrometers, and the groove is filled with a conductive filler. When the conductive filler is moved to the transparent substrate, an electrification fine circuit is formed.

In the present invention, as an exemplary embodiment of the elastic master, an elastic mast made of silicon is used. Needless to say, it is possible to use not only silicone but also various elastic materials.

In the elastic master 168, the fine circuit portion 169 constituting the sense electrode, the fine circuit portion 170 constituting the wiring electrode, and the contact terminal 171 present at the end portion of the wiring electrode can be printed all at once. The size of the line width of the sense electrode is usually in the range of 2 to 5 micrometers and the line width of the wiring electrode is usually in the range of 7 to 30 micrometers. The same or thicker. Particularly, it is preferable that a thickness of the energizing circuit is made thick so that the connection terminal is easily connected to the terminal of the flexible circuit board.

The shape of the sense electrode can be variously configured as a lattice shape, a net shape, various polygonal shapes, an irregular cell shape, a horizontal line, a vertical line, a horizontal line having a bridge line, and a vertical line having a bridge line. In addition, the interval of the lines constituting the electrode, that is, the pitch, is preferably about 50 to 300 micrometers. Although the drawing is shown as a margin, it is preferable that these lines are present on the sensing electrode without any space. By cutting the wires, current is prevented from being energized. It is preferable that the disconnected shape is not visually displayed.

44 is an explanatory view of a very fine circuit groove of the elastic master.

A fine groove (173) is formed under the elastic master (172). The fine grooves are filled with a conductive material. The lower surface of the elastic master and the fine grooves are formed with an extremely thin release layer. If it is made of silicon, release can be done without forming a release layer. Since the elastic master has such a mold releasing function, the conductive material can be filled only in the fine grooves. As a filling method, a conductive material is scratched and filled. Since the surface of the elastic master has a releasing function, the conductive material does not exist on the surface of the elastic master. In addition, since the fine grooves also have a mold releasing function, the conductive material trapped in the fine grooves can be easily moved to the transparent substrate.

The reason why the elastic substrate should be used is that when the conductive material trapped in the fine grooves is moved to the transparent substrate, when the elastic substrate is slightly applied with the force, the elastic substrate shrinks slightly inside and the conductive material It is possible to make contact with the transparent substrate. If the thickness of the resilient substrate having fine grooves is made too thick, it becomes difficult to control the thickness, so that it has a proper thickness. Most preferably, the elastic substrate is formed into a rolled shape which is circular. However, it is a matter of course that the plan is also possible. It is preferable to form a supporting plate on the elastic substrate to support the elastic substrate.

45 is an explanatory diagram of a state in which a conductive filler is filled in a very fine circuit groove of an elastic master.

When the conductive materials 175 and 176 are filled in the microcircuit grooves of the elastic substrate 174, the conductive material exists in a liquid phase, and the surface is organized through the squeeze. The conductive material should be present only in the groove of the elastic substrate.

46 is an explanatory diagram of a state in which a conductive filler is transferred to a transparent substrate.

When the elastic substrate is pressed while the conductive substrate is filled with the conductive substance, the conductive substance filled in the elastic substrate is brought into contact with the transparent substrate by the elasticity of the elastic substrate. Since the elastic substrate has a releasing function, the conductive material moves to the transparent substrate having no releasing function. A conductive material 177 is printed on the transparent substrate 178.

47 is an explanatory view of the depth and width of the fine grooves formed in the elastic substrate.

The fine grooves formed on the elastic substrate can be formed by adjusting the height. When the depth of the fine grooves is made deeper, the conductive material is filled in that much. Further, when printing is performed, a circuit printed on the transparent substrate is formed high. If the width of the fine grooves is widened, the conductive material is filled in that much. Further, when printing is performed, a circuit printed on the transparent substrate is formed to be wide.

By this method, it is possible to easily control the width and the thickness of the conductive fine circuits 179, 180, and 181 easily. In the case of the touch panel substrate, it is preferable to adjust the height and width of the conductive fine circuit as necessary in the ends formed at the ends of the sense electrode, the wiring electrode and the wiring electrode. When the end portion formed at the distal end portion forms a via hole and is coupled to the flexible circuit board, the width of the conductive fine circuit portion is wide and the connection is easy when the height is high.

48 is an explanatory view of the shape of fine grooves formed in the elastic substrate.

The fine grooves 183, 184, and 185 formed on the elastic substrate 182 may be narrow when the internal area is the same as that of the surface of the elastic substrate. Of course, the shape of the cross section may be a line or a curved line. It may be in the shape of a jar. When it is made in the shape of a jar, the inside is wider than the surface.

When the inside is wider than the surface, a lot of conductive material can be stored. Further, there is an advantage that the viscosity of the conductive material does not flow out even if the viscosity is somewhat low.

It will also be examined how the conductive substrate is released from the outside when the elastic substrate is extremely finely pressed.

When the area of the elastic substrate in the fine groove is wider than the area of the inside of the elastic groove, the conductive material tends to leak out to the outside when the elastic substrate is finely pressed. However, when the area of the elastic substrate is narrower than the internal area, the conductive material tends to gradually come out from the elastic substrate when the elastic substrate is finely pressed.

Considering this fact, it is necessary to design the shape of the fine grooves of the elastic substrate in each case.

49 is an explanatory diagram of a state in which a conductive filler is moved to a lower portion of an external contact transparent substrate;

In the touch screen panel, constitution of the electrifying fine circuits 188 and 189 below the external contact transparent substrate 186 will be described. In the present invention, the microcircuit formed by the printing method is referred to as an energized microcircuit because current can be energized. The conductive microcircuit is not necessarily made of metal, but it can be any conductive material. Silver paste and conductive ink are representative examples.

When the conductive material is filled in the fine grooves of the elastic substrate and the conductive material is brought into contact with the external contact transparent substrate to move the external contact transparent substrate, a conductive fine circuit is formed in the external contact transparent substrate. In general, a decor 187 is formed on the lower portion of the external-contact transparent substrate. When the decor is formed, a step is created due to the volume of the decor. Even if there is a step difference, in the case of printing with an elastic substrate within a certain range, there is an advantage that an electrification fine circuit can be constituted. And the energization fine circuit 188 is also printed on the decolator 187.

50 is an explanatory view of a touch screen formed by moving a conductive filler to an external contact transparent substrate.

And a conductive fine electrode is formed as a conductive filler on the lower part of the external contact transparent substrate. A sense electrode and a wiring electrode are formed together in the energized fine electrode. It is preferable that the thickness of the flexible printed circuit board is increased to some extent at the distal end of the flexible printed circuit board. Thereafter, a transparent coating is again applied, or a transparent insulating layer 190 is formed with a transparent adhesive for optical use. And an energizing fine circuit 191 is printed again on the outside of the transparent insulating layer. That is, the conductive material is filled in the fine grooves of the elastic substrate, and the conductive material is brought into contact with the surface of the transparent insulating layer to move, thereby constituting a conductive circuit. It is preferable that a transparent coating is provided to protect the conductive fine circuit.

This energized microcircuit portion is composed of two layers. The shape of the conductive fine circuit portion is the same as that of the metal micro-circuit portion of the present invention. Also in this case, it is needless to say that the general technology of the present invention applied to the metal micro-circuit part is applicable.

It is needless to say that it may be constituted by a microcircuit portion of X axis and Y axis. An electrically conductive fine circuit portion is formed on a lower portion of the external contact transparent substrate; The energization fine circuit portion is composed of a sense electrode and a wiring electrode; Wherein the sense electrode is formed of a plurality of electrically independent power supply assemblies, and the power supply microcircuits forming the same power supply group are energized only; A wiring electrode is formed at each end of the power supply community of the sense electrode; The conductive fine circuit portion constituting the sense electrode and the wiring electrode is formed by moving a conductive filler filled in a groove of an elastic master having an extremely fine circuit groove to a transparent substrate.

At this time, the end portion of the wiring electrode has a larger line width and height than the wiring electrode, thereby facilitating connection to the flexible circuit board or the control unit.

The above-mentioned very fine circuit groove is constituted by a sense electrode electrode fine circuit groove and a wiring electrode electrode fine circuit groove; The width of the micro-circuit groove for the sense electrode may be between 2 and 5 micrometers, and the width of the micro-circuit groove for the wiring electrode may be between 7 and 30 micrometers.

A transparent insulating layer is formed below the conductive fine circuit, and a conductive fine circuit portion is formed below the transparent insulating layer.

An X-axis sense electrode is formed under the external contact transparent substrate, and a Y-axis sense electrode is formed at a lower portion of the transparent insulation layer to form a right angle with the X-axis; The X-axis sense electrode is formed with a current-carrying line by a current-carrying line parallel to the Y-axis; And the energizing community can be formed on the Y-axis sense electrode by energizing lines parallel to the X-axis.

At this time, a bridge line parallel to the X-axis is formed in the vicinity of the energizing community composed of energizing lines parallel to the Y-axis; And the bridge line parallel to the Y axis can be formed in some places in the current-carrying community composed of the current-carrying lines parallel to the X-axis.

Silver paste is one of the most representative examples of conductive fillers filled in the grooves of the elastic master having the microcircuit grooves.

The elastic master having the minute circuit grooves is characterized by using a silicon material or forming a release layer on the surface of the elastic material.

The present invention also claims a method of manufacturing a touch screen panel.

A method of fabricating a touch screen panel, the method comprising the steps of: forming a decor on a lower portion of an external contact transparent substrate; placing the conductive filler filled in the groove of the elastic master having the decor and the ultra- Thereby forming a conductive fine circuit portion;

Forming a transparent insulating layer on the lower portion of the conductive fine circuit portion by applying a transparent coating material or an optical transparent material;

And forming a conductive fine circuit part by moving a conductive filler filled in the groove of the elastic master having a very fine circuit groove in the lower part of the transparent layer to the transparent insulating layer.

In the method of manufacturing a double-sided circuit transparent substrate according to the present invention, a conductive fine circuit portion is formed on both surfaces of a transparent substrate; The energization fine circuit portion is composed of a sense electrode and a wiring electrode; Wherein the sense electrode is formed of a plurality of electrically independent power supply assemblies, and the power supply microcircuits forming the same power supply group are energized only; A wiring electrode is formed at each end of the power supply community of the sense electrode; Wherein the conductive fine circuit portion constituting the sense electrode and the wiring electrode is formed by moving a conductive filler filled in a groove of an elastic master having an extremely fine circuit groove to a transparent substrate. .

At this time, an X-axis sense electrode is formed on one surface of the transparent substrate and a Y-axis sense electrode is formed on the other surface to form a right angle with the X-axis; The X-axis sense electrode is formed with a current-carrying line by a current-carrying line parallel to the Y-axis; And a method of manufacturing a double-sided circuit transparent substrate characterized in that an energizing community is formed in the Y-axis sense electrode by an energizing line parallel to the X-axis. A bridge line parallel to the X axis is formed in the vicinity of the energizing community composed of energizing lines parallel to the Y axis; The bridge line parallel to the Y-axis may be formed in some places in the current-carrying community composed of the current-carrying lines parallel to the X-axis.

51 is a diagram for explaining production of a double-sided circuit transparent substrate by a printing method.

The upper and lower surfaces of the transparent substrate 186 simultaneously constitute an energization fine circuit. The elastic substrates 185 and 187 are formed in a roll shape on the upper and lower portions of the transparent substrate.

It goes without saying that, in the present invention, the transparent adhesive for optical use can be substituted by a transparent adhesive film for optical use. The transparent adhesive for optical use does not hinder the implementation of the technique of the present invention by using a liquid or using a film. Therefore, in the specification and claims of the present invention, the portion recorded with the transparent adhesive for optical can be replaced with a transparent film for optical if necessary.

The metal microcircuit may also perform an electromagnetic shielding function. Accordingly, the touch screen panel manufactured according to the present invention performs a function of shielding electromagnetic waves unlike a touch screen panel which is conventionally configured in the form of ITO or conductive polymer.

The present invention can simultaneously perform the function of shielding the electric current and the function of shielding the electromagnetic wave. In order to effectively perform such a function, it is possible in the present invention to laminate the metal microcircuit parts in multiple layers.

That is, two or more metal microcircuit layers can be stacked using a single-sided circuit transparent substrate or a double-sided circuit transparent substrate. It is not necessary to consist of two layers, but it is possible to constitute a plurality of layers such as three layers and four layers according to necessity.

At this time, if ITO or the conductive polymer layer is used together, at least one layer of metal microcircuit layers may be laminated.

In the present invention, a transparent adhesive for optical use is widely used. This means that the material is made of a transparent material and has an adhesive property. Which means that transparency is released so that it may be used particularly for optical use.

In the present invention, the transparent adhesive for optics or the transparent adhesive film for optical is not limited to specific materials. It has the characteristics required in the present invention, is durable, does not change color even after much time, is durable against temperature, and does not deteriorate in bonding property over time.

There are liquid-like and sheet-shaped ones molded to a certain thickness. Since the sheet shape is made to have a certain thickness, there is an advantage that a certain thickness can be assured by joining by using it.

In the case of a sheet shape, it is common to place two materials to be bonded together and to bond them together by heating. As the heating method, various methods such as direct heating, excitation heating or ultrasonic heating can be adopted.

Since the core technology of the present invention is not such a joining method, it is not described in detail, but it is needless to say that the joining method which is generally used can be employed.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

The embodiments of the present invention can be modified into various other forms and are not limited to the embodiments described in the present invention.

1: metal microcircuit 2: irregular curve 3: cell area
4: wiring electrode 5: sense electrode 6: wiring electrode
7: transparent substrate 8: metal transparent substrate 9,10: metal fine circuit
11: light 12: transparent substrate 13,14: metal microcircuit
15: external contact transparent substrate 16: decolour 17: transparent adhesive layer for optical
18: double-sided circuit transparent substrate panel 19: transparent coating layer 20: external contact transparent substrate
21: Optical transparent adhesive layer 22: Cross section circuit: transparent substrate panel
23: Optical transparent adhesive layer 24: Cross section circuit: transparent substrate panel
25: external contact transparent substrate 26: transparent adhesive layer for optical
27: single-sided circuit transparent substrate panel 28: optical transparent adhesive layer
29: Cross section circuit transparent substrate panel 30: Optical transparent adhesive layer
31: single-sided circuit transparent substrate panel 32: metal thin film 33: transparent substrate
34: metal thin film 35: double-sided circuit transparent substrate
36, 37: photosensitive member 38: wiring electrode 39: metal fine circuit
40: sense electrode 41: wiring electrode
42: double-sided circuit transparent substrate 43: double-sided circuit transparent substrate
44, 45: outermost surface portion 46: photosensitive member 47:
48: transparent substrate 49: metal thin film layer 50: metal thin film layer
51: polishing apparatus 52: metal fine circuit 53: transparent substrate
54: blackening processing section 55: transparent substrate 56: metal fine circuit section
57: wiring electrode 58: junction terminal portion 59: silver paste electrode
60: wiring electrode 61: transparent substrate 62: double-sided circuit transparent substrate
63: flexible circuit board 64: silver paste 65: transparent substrate
66: double-sided circuit transparent substrate 67: flexible circuit substrate 68: double-sided circuit transparent substrate
69: penetration part 70: silver paste
71: double-sided circuit transparent substrate having penetrating portion 72: metallic fine circuit portion
73: flexible circuit board 74, 75: metal micro-circuit part 76:
77: transparent substrate 78: wiring electrode 79: silver paste
80: metal micro-circuit part 81: transparent substrate 83: silver paste
84: transparent substrate 85: wiring electrode 87: transparent substrate
88: transparent coating layer

Claims (167)

A touch panel substrate for use in an image display device, wherein a metal microcircuit portion is formed on both sides of a transparent substrate, and the metal microcircuit portion includes a sense electrode formed in a symmetrical structure around the transparent substrate Touch panel substrate. The touch panel substrate according to claim 1, wherein the metal microcircuit portion is blackened. The touch panel substrate according to claim 1, wherein a transparent coating layer is further provided on the metal microcircuit portion on one side of the transparent substrate. The touch panel substrate according to claim 1, wherein a wiring electrode is formed on a part of the edge of the metal microcircuit portion. 5. The touch panel substrate according to claim 4, wherein a silver paste is printed on an end portion of the wiring electrode, and a flexible circuit board or a control unit is connected through the silver paste. The touch panel substrate according to claim 4, wherein a silver paste is connected to an end portion of the wiring electrode, and the silver paste is filled in a groove formed on the surface of the transparent substrate. The device according to claim 1, wherein the metal microcircuit portion is formed of any one of Ag, Cu, Ni, Cr, Al, Gold, Mo, and Co or an alloy thereof or a laminate thereof Touch panel substrate. The touch panel substrate according to claim 1, wherein the material of the transparent substrate is transparent glass, transparent resin, transparent PET, transparent plastic, or transparent optical film. The touch panel substrate according to claim 1, wherein the metal microcircuit portion has a single wire. The touch panel substrate according to claim 1, wherein the metal microcircuit portion has a continuous polygonal shape. The touch panel substrate according to claim 1, wherein the metal microcircuit part has a closed cell structure having an irregular shape, and the closed cell structure having the irregular shape is connected to each other to be conductive. 12. The method according to claim 11, wherein the closed cell structure having the irregular shape is composed of an irregularly shaped polygon connected continuously, the lines forming each side of the polygon are formed of irregular curves, And the vertexes are irregularly positioned. The touch panel substrate according to claim 1, wherein the metal microcircuit portions are formed of a plurality of electrically independent groups, and only the metal microcircuits forming the same group are energized. The touch panel substrate according to claim 1, wherein a transparent coating layer is formed on at least one surface of the transparent substrate on which the metal micro-circuit portion is formed. A touch panel substrate for use in an image display device, wherein a metal microcircuit portion is formed on one side or both sides of a transparent substrate, and the metal microcircuit portion is blackened. The touch panel substrate according to claim 15, wherein a metal microcircuit portion is formed on both sides of the transparent substrate, and the metal microcircuit portion includes a sense electrode formed in a symmetrical structure about the transparent substrate. The touch panel substrate according to claim 15, further comprising a transparent coating layer on the metal micro-circuit portion of the transparent substrate. 16. The touch panel substrate according to claim 15, wherein a wiring electrode is formed on a part of the edge of the metal microcircuit part. The touch panel substrate according to claim 18, wherein a silver paste is printed on an end of the wiring electrode, and a flexible circuit board or a control unit is connected through the silver paste. The touch panel substrate according to claim 18, wherein a silver paste is connected to an end of the wiring electrode, and the silver paste is filled in a groove formed on the surface of the transparent substrate. 21. The semiconductor device according to any one of claims 1 to 20, characterized in that a wiring electrode is formed at the rim of the sense electrode, a penetrating portion is formed at the end of the wiring electrode, and the penetrating portion is filled with silver paste Touch panel substrate. [16] The method according to claim 15, wherein the metal microcircuit portion is formed of any one of Ag, Cu, Ni, Cr, Al, Gold, Mo and Co or an alloy thereof or a laminate thereof Touch panel substrate. The touch panel substrate according to claim 15, wherein the material of the transparent substrate is transparent glass, transparent resin, transparent PET, transparent plastic, or transparent optical film. 16. The touch panel substrate according to claim 15, wherein the metal microcircuit portion has a continuous polygonal shape. [16] The touch panel substrate of claim 15, wherein the metal microcircuit part has a closed cell structure having an irregular shape, and the closed cell structure having the irregular shape is connected to each other to be conductive. 26. The method of claim 25, wherein the closed cell structure having the irregular shape is composed of an irregularly shaped polygon connected continuously, the lines forming each side of the polygon are formed of irregular curves, And the vertexes are irregularly positioned. 16. The touch panel substrate according to claim 15, wherein the metal microcircuit portions are formed of a plurality of electrically independent groups, and only the metal microcircuits forming the same group are energized. The touch panel substrate according to claim 15, wherein a transparent coating layer is formed on at least one surface of the transparent substrate on which the metal micro-circuit portion is formed. A touch panel substrate for use in an image display device, wherein a metal microcircuit portion is formed on one or both sides of a transparent substrate, the metal microcircuit portion has a closed cell structure having an irregular shape, Wherein the closed cell structure includes a metal microcircuit portion connected to each other and capable of conducting electricity. 30. The method of claim 29, wherein the closed cell structure having the irregular shape is composed of an irregularly shaped polygon connected continuously, the lines forming each side of the polygon are formed of irregular curves, And the vertexes are irregularly positioned. The touch panel substrate of claim 29, wherein a metal microcircuit portion is formed on both sides of the transparent substrate, and the metal microcircuit portion includes a sense electrode formed in a symmetrical structure about the transparent substrate. The touch panel substrate according to claim 29, further comprising a transparent coating layer on the metal microcircuit portion of the transparent substrate. 30. The method of claim 29,
And a wiring electrode is formed on a part of the edge of the metal microcircuit portion. The touch panel substrate according to claim 33, wherein a silver paste is printed on an end portion of the wiring electrode, and a flexible circuit board or a control unit is connected through the silver paste. The touch panel substrate according to claim 33, wherein a silver paste is connected to an end of the wiring electrode, wherein the silver paste is filled in a groove formed on the surface of the transparent substrate. The method according to claim 29, wherein the metal microcircuit portion is formed of any one of Ag, Cu, Ni, Cr, Al, Gold, Mo and Co or an alloy thereof or a laminate thereof Touch panel substrate. The touch panel substrate according to claim 29, wherein the material of the transparent substrate is transparent glass, transparent resin, transparent PET, transparent plastic, or a transparent optical film. 30. The touch panel substrate of claim 29, wherein the metal microcircuit portion has a disconnection. The touch panel substrate according to claim 29, wherein the metal microcircuit portions are continuously formed in a polygonal shape. 30. The touch panel substrate of claim 29, wherein the metal microcircuit portions are formed of a plurality of electrically independent groups, and only the metal microcircuits forming the same group are energized. The touch panel substrate according to claim 29, wherein the length of each of the closed cells is the same. The touch panel substrate according to claim 29, wherein a transparent coating layer is formed on either side of the transparent substrate on which the metal microcircuits are formed on both sides. A method of manufacturing a touch panel substrate for use in an image display device,
Forming a metal thin film on one surface or both surfaces of a transparent substrate, etching the metal thin film to form a metal fine circuit portion, and blackening the metal fine circuit portion. 45. The touch panel of claim 43, wherein the transparent substrate has a metal microcircuit portion formed on both sides thereof, the metal microcircuit portion includes a sense electrode, and the sense electrode is formed in a symmetrical structure about a transparent substrate. A method of manufacturing a panel substrate. 45. The method of claim 43, wherein the metal microcircuits are constructed of irregularly shaped polygons connected in series, the lines of each of the sides of the polygon being irregularly curved, each vertex of the polygon being irregularly positioned Wherein the first and second substrates are bonded to each other. A method of manufacturing a touch panel substrate for use in an image display device,
A metal thin film is formed on one surface or both surfaces of a transparent substrate, and the metal thin film is etched to form a metal fine circuit part. The metal fine circuit part includes a sense electrode, and the sense electrode has a symmetrical structure Wherein the first and second electrodes are formed on a surface of the touch panel substrate. A method of manufacturing a touch panel substrate for use in an image display device,
A metal thin film is formed on one side or both sides of a transparent substrate, and the metal thin film is etched to form a metal microcircuit portion. The metal microcircuit portion is composed of an irregular polygon connected continuously, Wherein the lines forming the sides are formed of irregular curves, and the vertexes of the polygons are irregularly positioned. A method of manufacturing a touch panel substrate for use in an image display device,
A metal thin film forming step of forming a metal thin film on one side or both sides of the transparent substrate by using any one of Ag, Cu, Ni, Cr, Al, Gold, Mo and Co or an alloy thereof or a laminate thereof; An exposure step of uniformly applying a photosensitive material to the metal thin film layer and then exposing the photosensitive material through a film having a pattern of a closed cell structure having an irregular shape; A metal circuit part forming step of developing the photosensitive material and etching the metal thin film layer to form a metal fine circuit part; And a blackening treatment for blackening the metal microcircuit portion. A method of manufacturing a touch panel substrate for use in an image display device,
An exposure step of uniformly applying a photosensitive material to one surface or both surfaces of a transparent substrate and then exposing the photosensitive material through a film; A developing step of forming a space portion in the light-sensitive material after the exposure process; A vacuum deposition process of vacuum depositing metal on the space and the upper portion of the photosensitive material; Forming a metal fine circuit part by removing the photosensitive material and the vacuum deposition layer applied to the photosensitive material; And a blackening treatment step of performing blackening treatment on the metal microcircuit portion. The method of claim 49, wherein the metal microcircuit portion includes a sense electrode, and the sense electrode is formed in a symmetrical structure with respect to a transparent substrate. 50. The method of claim 49, wherein the metal microcircuit portion comprises an irregularly shaped polygon that is continuously connected to the closed cell structure having an irregular shape. A method of manufacturing a touch panel substrate for use in an image display device,
An exposure step of uniformly applying a photosensitive material to one or both sides of a transparent substrate and then exposing the photosensitive material through a film having a pattern of a closed cell structure having an irregular shape; A developing step of forming a space portion in the light-sensitive material after the exposure process; A vacuum deposition process of vacuum depositing metal on the space and the upper portion of the photosensitive material; And forming a metal microcircuit portion having a closed cell structure having an irregular shape by removing the photosensitive material and the vacuum deposition layer applied to the photosensitive material. The manufacturing method of a touch panel substrate according to claim 52, further comprising a blackening treatment step of performing blackening treatment on the metal microcircuit portion. The manufacturing method of a touch panel substrate according to claim 52, wherein the metal microcircuit portion includes a sense electrode, and the sense electrode is formed with a symmetrical structure about a transparent substrate. A touch screen panel for use in an image display device,
A transparent glass is formed on the upper part; A transparent transparent adhesive layer is formed on the bottom of the transparent glass; A double-sided circuit transparent substrate having a metal microcircuit formed on both sides of the transparent substrate is formed under the optical transparent adhesive layer; And a transparent coating layer is formed under the double-sided circuit transparent substrate. 56. The touch screen panel of claim 55, wherein the metal microcircuit portion includes a touch panel substrate having a sense electrode formed in a symmetrical structure about the transparent substrate. 56. The touch screen panel of claim 55, wherein the metal microcircuit portion is blackened. The touch screen panel according to claim 55, wherein a wiring electrode is formed on a part of the edge of the metal microcircuit part. The touch panel substrate according to claim 58, wherein a silver paste is printed on an end of the wiring electrode, and a flexible circuit board or a control unit is connected through the silver paste. The touch panel substrate according to claim 58, wherein a silver paste is connected to an end of the wiring electrode, wherein the silver paste is filled in a groove formed on the surface of the transparent substrate. The touch screen panel of claim 55, wherein the wiring electrodes are connected to a flexible circuit board or a control unit. 56. The method according to claim 55, wherein the metal microcircuit portion is formed of any one of Ag, Cu, Ni, Cr, Al, Gold, Mo and Co or an alloy thereof or a laminate thereof Touch screen panel. The touch screen panel of claim 55, wherein the transparent substrate is made of transparent glass, transparent resin, transparent PET, transparent plastic, or transparent optical film. 56. The touch screen panel of claim 55, wherein the metal microcircuit portion has a disconnection. 56. The touch screen panel of claim 55, wherein the metal microcircuit portions are continuously formed in a polygonal shape. 56. The touch screen panel of claim 55, wherein the metal microcircuit portion has a closed cell structure having an irregular shape, and the closed cell structure having the irregular shape is connected to each other to be energized. 55. The method of claim 55, wherein the closed cellular structure having the irregular shape is composed of an irregularly shaped polygon connected continuously, the lines forming each side of the polygon are formed of irregular curves, Wherein the vertices are irregularly positioned. 56. The touch screen panel of claim 55, wherein the metal microcircuit portion is formed of a plurality of electrically independent groups, and only the metal microcircuits forming the same group are energized. A touch screen panel for use in an image display device,
A double-sided circuit transparent substrate on both sides of which a metal microcircuit portion is formed;
Wherein a transparent adhesive layer for optical formation is formed on the upper surface of the double-sided circuit transparent substrate, the transparent adhesive layer being formed by planarization at the same time as bonding;
Wherein a transparent transparent adhesive layer is formed on the lower surface of the double-sided circuit transparent substrate, wherein the transparent transparent adhesive layer is formed by planar molding at the same time as the transparent coating layer or the bonding. 70. The touch screen panel of claim 69, wherein the metal microcircuit portion has a sense electrode formed in a symmetrical structure about the transparent substrate. 70. The touch screen panel of claim 69, wherein the metal microcircuit portion is blackened. 70. The touch screen panel of claim 69, wherein wiring electrode is formed in a part of the edge of the metal microcircuit part. 72. The touch panel substrate of claim 72, wherein a silver paste is printed on an end of the wiring electrode, and a flexible circuit board or a control unit is connected through the silver paste. 73. The touch panel substrate according to claim 72, wherein a silver paste is connected to an end of the wiring electrode, wherein the silver paste is filled in a groove formed on the surface of the transparent substrate. 70. The touch screen panel of claim 69, wherein the wiring electrodes are connected to a flexible circuit board or a control unit. 70. The method according to claim 69, wherein the metal microcircuit portion is formed of any one of Ag, Cu, Ni, Cr, Al, Gold, Mo and Co, or an alloy thereof, Touch screen panel. 70. The touch screen panel of claim 69, wherein the material of the transparent substrate is transparent glass, transparent resin, transparent PET, transparent plastic, or transparent optical film. 70. The touch screen panel of claim 69, wherein the metal microcircuit portion has a disconnection. 70. The touch screen panel of claim 69, wherein the metal microcircuit portion has a continuous polygonal shape. 70. The touch screen panel of claim 69, wherein the metal microcircuit portion is a closed cell structure having an irregular shape, and the closed cell structure having the irregular shape is connected to each other to be energized. 70. The method of claim 69, wherein the closed cell structure having an irregular shape is formed of an irregularly shaped polygon that is continuously connected, the lines forming each side of the polygon are formed of irregular curves, Wherein the vertices are irregularly positioned. 70. The touch screen panel of claim 69, wherein the metal microcircuit portions are formed of a plurality of electrically independent groups, and only the metal microcircuits forming the same cluster are energized. A touch screen panel for use in an image display device,
An optical transparent adhesive layer;
An upper section circuit transparent substrate formed on the transparent adhesive layer for optical and having a metal microcircuit portion only on an upper side of the transparent substrate;
A lower section circuit transparent substrate formed on a lower portion of the optical transparent adhesive layer and having a metal microcircuit portion only on an upper side of the transparent substrate;
Wherein a top surface of the upper section circuit transparent substrate is formed with a glass plate or a transparent adhesive layer for optical formation which is formed by flattening at the same time as bonding. A touch screen panel according to claim 83, wherein the metal microcircuit portion of the upper section circuit transparent substrate and the metal microcircuit portion of the lower section circuit transparent substrate have a sense electrode formed in a symmetrical structure about the transparent adhesive layer for optical, . The touch screen panel of claim 83, wherein the metal microcircuit portion is blackened. The touch screen panel according to claim 83, wherein a wiring electrode is formed on a part of the edge of the metal microcircuit part. The touch panel substrate according to claim 86, wherein a silver paste is printed on an end of the wiring electrode, and a flexible circuit board or a control unit is connected through the silver paste. The touch panel substrate of claim 86, wherein a silver paste is connected to an end of the wiring electrode, wherein the silver paste is filled in a groove formed on a surface of the transparent substrate. The touch screen panel of claim 83, wherein the wiring electrodes are connected to a flexible circuit board or a control unit. The method according to claim 83, wherein the metal microcircuit portion is formed of any one of Ag, Cu, Ni, Cr, Al, Gold, Mo and Co or an alloy thereof or a laminate thereof Touch screen panel. The touch screen panel according to claim 83, wherein the transparent substrate is made of transparent glass, transparent resin, transparent PET, transparent plastic, or transparent optical film. 83. The touch screen panel of claim 83, wherein the metal microcircuit portion has a disconnection. 83. The touch screen panel of claim 83, wherein the metal microcircuit portion has a continuous polygonal shape. 83. The touch screen panel of claim 83, wherein the metal microcircuit portion has a closed cell structure having an irregular shape, and the closed cell structure having the irregular shape is connected to each other to be conductive. 83. The method of claim 83, wherein the closed cell structure having the irregular shape is composed of an irregularly shaped polygon that is connected continuously, the lines forming each side of the polygon are formed of irregular curves, Wherein the vertices are irregularly positioned. 83. The touch screen panel of claim 83, wherein the metal microcircuits are formed of a plurality of electrically independent groups, and only the metal microcircuits forming the same cluster are energized. A touch screen panel for use in an image display device,
A conductive circuit part is directly formed on the lower surface of the external touching transparent substrate which is brought into contact by a human hand;
A transparent adhesive layer for optical is formed under the external contact transparent substrate;
And a transparent substrate having a single-sided circuit with a metal microcircuit formed on one side of the transparent substrate is formed under the optical transparent adhesive layer. 97. The touch screen panel according to claim 97, wherein the external contact substrate is transparent glass or transparent plastic. 97. The touch screen panel of claim 97, wherein the conductive circuit portion formed directly on the lower surface of the external contact transparent substrate is formed by vacuum depositing ITO or metal on the contact transparent substrate. The touch screen panel according to claim 97, wherein the conductive circuit portion formed directly on the lower surface of the external touching transparent substrate is an ITO circuit portion, a conductive polymer circuit portion, or a metal fine circuit portion. A device according to claim 97, wherein the metal microcircuit portion formed directly on the lower surface of the external contact transparent substrate and the metal microcircuit portion formed on the single-sided circuit transparent substrate have a sense electrode formed in a symmetrical structure centering on the optical transparent adhesive layer Features a touch screen panel. 97. The touch screen panel of claim 97, wherein the metal microcircuit portion is blackened. 97. The touch screen panel of claim 97, wherein a wiring electrode is formed in a border region of the metal microcircuit portion. 111. The touch panel substrate according to claim 103, wherein a silver paste is printed on an end portion of the wiring electrode, and a flexible circuit board or a control unit is connected through the silver paste. 111. The touch panel substrate according to claim 103, wherein a silver paste is connected to an end of the wiring electrode, wherein the silver paste is filled in a groove formed on the surface of the transparent substrate. The touch screen panel of claim 97, wherein the wiring electrodes are connected to a flexible circuit board or a control unit. 97. The method according to claim 97, wherein the metal microcircuit portion is made of any one of Ag, Cu, Ni, Cr, Al, Gold, Mo and Co, or an alloy thereof, Touch screen panel. 97. The touch screen panel according to claim 97, wherein the material of the one-sided circuit transparent substrate is transparent glass, transparent resin, transparent PET, transparent plastic, or transparent optical film. 97. The touch screen panel of claim 97, wherein the metal microcircuit portion has a single line. 97. The touch screen panel of claim 97, wherein the metal microcircuit portion has a continuous polygonal shape. [97] The touch screen panel of claim 97, wherein the metal microcircuit part has a closed cell structure having an irregular shape, and the closed cell structure having the irregular shape is connected to each other to be conductive. The method according to claim 95, wherein the closed cell structure having irregular shapes is formed of an irregularly shaped polygon that is continuously connected, the lines forming each side of the polygon are formed of irregular curves, Wherein the vertices are irregularly positioned. 113. The touch screen panel of claim 112, wherein the metal microcircuit portion is formed of a plurality of electrically independent groups, and only the metal microcircuits forming the same cluster are energized. A touch screen panel for use in an image display device,
A blackened metal microcircuit portion is formed on both sides of the transparent substrate; Placing an optical transparent adhesive on the upper surface of the transparent substrate to perform planar molding at the same time as bonding; And a transparent coating layer is formed on the bottom of the transparent substrate. A touch screen panel for use in an image display device,
An outer contact transparent substrate;
A single-sided circuit transparent substrate on both sides of which a metal microcircuit portion is formed, or a single-sided circuit transparent substrate on which a metal microcircuit portion is formed on one side of a transparent substrate;
And a transparent adhesive layer for optical use. The touch screen device according to claim 115, wherein the metal microcircuit portion includes a sense electrode, a wiring electrode is formed on a part of a rim of the sense electrode, and the wiring electrode is connected to a flexible circuit board or a control portion. . 116. The method of claim 115 or 116, wherein the metal microcircuit portion is a closed cell structure having an irregular shape, and the closed cell structure having the irregular shape is configured to be connected to each other to be energized. Screen panel. The touch screen panel according to claim 115 or 116, wherein the metal microcircuit portion is blackened. 116. The touch screen panel according to claim 115 or 116, wherein the metal microcircuit portion is symmetrical about a transparent substrate or a transparent adhesive layer for optical. A method of manufacturing a double-sided circuit transparent substrate for use in an image display device,
A photosensitive material is uniformly applied to both surfaces of a transparent substrate to form two photosensitive layers on both sides of the transparent substrate; Placing a pattern film or a photomask on only one of the two photosensitive layers in a pattern film or a photomask and irradiating the pattern film or the photomask with light at a time to expose the two photosensitive layers simultaneously; After the exposure operation, a space portion is formed through a developing process; Forming a metal thin film on the upper surface of the remaining photosensitive layer and the space portion on both sides of the transparent substrate by vacuum deposition; Removing the metal thin film and the photosensitive layer stacked on the photosensitive layer to form a metal microcircuit by leaving a metal thin film layer only in the space portion. 121. The method according to claim 120, wherein the metal microcircuit portion includes a sense electrode, a wiring electrode is formed at a part of the edge of the sense electrode, and the wiring electrode is connected to a flexible circuit board or a control portion. / RTI > 120. The double-sided circuit transparent substrate as claimed in claim 120, wherein the metal micro-circuit part has a closed cell structure having an irregular shape, and the closed cell structure having the irregular shape is connected to each other to be conductive. Production method. The method of manufacturing a double-sided circuit transparent substrate according to claim 120, wherein the metal microcircuit portion is blackened. A method of manufacturing a double-sided circuit transparent substrate for use in an image display device,
A photosensitive material is uniformly applied to both surfaces of a transparent substrate to form two photosensitive layers on both sides of the transparent substrate; Placing a pattern film or a photomask on only one of the two photosensitive layers in a pattern film or a photomask and irradiating the pattern film or the photomask with light at a time to expose the two photosensitive layers simultaneously; After the exposure operation, a space portion is formed through a developing process; Forming a metal thin film on the upper surface of the remaining photosensitive layer and the space portion on both sides of the transparent substrate by vacuum deposition; Removing the metal thin film and the photosensitive layer stacked on the photosensitive layer to form a metal microcircuit by leaving a metal thin film layer only in the space portion. 122. The method according to claim 124, wherein the metal microcircuit portion includes a sense electrode, a wiring electrode is formed at a part of the edge of the sense electrode, and the wiring electrode is connected to a flexible circuit board or a control portion. / RTI > 125. The touch panel substrate according to claim 125, wherein a silver paste is printed on an end of the wiring electrode, and a flexible circuit board or a control unit is connected through the silver paste. 125. The touch panel substrate according to claim 125, wherein a silver paste is connected to an end of the wiring electrode, wherein the silver paste is filled in a groove formed on a surface of the transparent substrate. 123. The double-sided circuit transparent substrate according to claim 124, wherein the metal microcircuit part has a closed cell structure having an irregular shape, and the closed cell structure having irregular shape is connected to each other to enable conduction. Production method. The method of manufacturing a double-sided circuit transparent substrate according to claim 124, wherein the metal microcircuit portion is blackened. Wherein the metal microcircuit portion includes a sense electrode, a wiring electrode is formed at a rim portion of the sense electrode, a junction terminal portion is formed at a distal end of the wiring electrode, Wherein the terminal portion is connected to the control portion or the flexible circuit board, and the junction terminal portion is formed by printing a silver paste on the upper portion of the wiring electrode. A double-sided circuit transparent substrate, wherein each of the upper and lower surfaces of the transparent substrate is formed with a depressed portion, the depressed portion is formed at the end of each of the wiring electrodes on the upper surface and the lower surface of the transparent substrate, Wherein the paste is filled. In the double-sided circuit transparent substrate, a penetrating portion is formed at the distal end of the wiring electrode. The penetrating portion is composed of a plurality of through grooves that penetrate the upper surface and the lower surface of the transparent substrate, and the penetrating portion is filled with a conductive material A double-sided circuit transparent substrate. 132. The double-sided circuit transparent substrate of claim 132, wherein the conductive material is a silver paste. 132. The double-sided circuit transparent substrate of claim 132, wherein the conductive material is a metal. A metal microcircuit portion is formed on one surface of the transparent substrate, the metal microcircuit portion includes a sense electrode, a wiring electrode is formed at a rim of the sense electrode, a junction terminal portion is formed at a distal end of the wiring electrode, Wherein the junction terminal portion is connected to the control portion or the flexible circuit board, and the junction terminal portion is formed by printing a silver paste on the wiring electrode. A single-sided circuit transparent substrate comprising: a transparent substrate having a depressed portion formed on one side thereof, the depressed portion being formed at a terminal portion of the wiring electrode, and the depressed portion being filled with silver paste. Wherein the transparent substrate is formed with a concave portion, the concave portion is filled with silver paste, and the metal paste is formed on the silver paste, Wherein two of the single-sided circuit transparent substrates are bonded to each other with a transparent adhesive for optical, wherein the metal micro-circuit portions of the single-sided circuit transparent substrate are opposed to each other. A touch panel substrate for use in an image display device, comprising: a metal microcircuit portion formed on both sides of a transparent substrate; Wherein the metal microcircuit portion includes a sense electrode; An X-axis sense electrode is formed on one side of the transparent substrate, and a Y-axis sense electrode is formed on the other side of the transparent substrate to form a right angle with the X-axis; Wherein the sense electrode is formed of a plurality of electrically independent power supply assemblies, and only the metal microcircuits forming the same energized community are energized; The X-axis sense electrode is formed with a metal line parallel to the Y-axis; Wherein the Y-axis sense electrode is formed with a metal line parallel to the X-axis. 136. The method of claim 138, wherein a bridge line parallel to the X axis is in place in the current-carrying community comprising metal lines parallel to the Y axis; And a bridge line parallel to the Y-axis is formed in the power supply community composed of metal lines parallel to the X-axis. The touch panel substrate according to claim 138 or claim 139, wherein a wiring electrode is formed in a rim region of the sense electrode. 140. The touch panel substrate of claim 140, wherein a silver paste is printed on an end of the wiring electrode and connected to the flexible circuit board or the control unit through the silver paste. The touch panel substrate of claim 138, wherein the metal microcircuit portion is blackened. 133. The touch panel substrate of claim 138, wherein a transparent coating layer is further formed on the metal microcircuits on one or both sides of the transparent substrate. The method according to claim 138, wherein the metal microcircuit portion is formed of any one of Ag, Cu, Ni, Cr, Al, Gold, Mo and Co or an alloy thereof or a laminate thereof Touch panel substrate. 143. The touch panel substrate according to claim 138, wherein the transparent substrate is made of transparent glass, transparent resin, transparent PET, transparent plastic or transparent optical film. The touch panel substrate of claim 138, wherein the metal microcircuit portion has a single wire.  133. The touch panel substrate of claim 138, wherein the metal line parallel to the X axis or Y axis is an irregular curve rather than a straight line. A touch panel substrate for use in an image display device, comprising: a transparent substrate; a metal microcircuit portion formed on one side of the transparent substrate; Wherein the metal microcircuit portion includes a sense electrode; Wherein the sense electrode is formed of a plurality of electrically independent power supply assemblies, and only the metal microcircuits forming the same energized community are energized; Wherein a conductive line is formed by a metal line parallel to the sense electrode. 148. The touch panel substrate of claim 148, wherein the conductive line includes a bridge line. 1. A touch panel substrate for use in an image display device, the touch panel substrate comprising: a transparent substrate; The energization fine circuit portion is composed of a sense electrode and a wiring electrode; Wherein the sense electrode is formed of a plurality of electrically independent power supply assemblies, and the power supply microcircuits forming the same power supply group are energized only; A wiring electrode is formed at each end of the power supply community of the sense electrode; Wherein the conductive fine circuit portion constituting the sense electrode and the wiring electrode is formed by moving a conductive filler filled in a groove of an elastic master having an extremely fine circuit groove to a transparent substrate. 150. The touch panel substrate according to claim 150, wherein an end of the wiring electrode has a larger line width and height than the wiring electrode, thereby facilitating connection to the flexible circuit board or the control unit. 153. The method of manufacturing a semiconductor device according to claim 150, wherein the extreme microcircuit groove is composed of a sense microelectrode groove and a wiring electrode microelectrode groove; Wherein a width of the micro-circuit groove for the sense electrode is between 2 and 5, and a width of the micro-circuit groove for the wiring electrode is between 7 and 30. 150. The method as claimed in claim 150, wherein the transparent substrate is formed on both sides thereof with a very fine circuit portion; An X-axis sense electrode is formed on one side of the transparent substrate, and a Y-axis sense electrode is formed on the other side of the transparent substrate to form a right angle with the X-axis; The X-axis sense electrode is formed with a current-carrying line by a current-carrying line parallel to the Y-axis; And an energizing community is formed in the Y-axis sense electrode by an energizing line parallel to the X-axis. 153. The method of claim 153, wherein a bridge line parallel to the X axis is formed in the vicinity of the energizing community comprising the energizing line parallel to the Y axis; And a bridge line parallel to the Y-axis is formed in a plurality of conductive lines formed by the conductive lines parallel to the X-axis. The touch panel substrate according to claim 150, wherein the conductive filler filled in the groove of the elastic master having the microcircuit grooves is a silver paste. The touch panel substrate according to claim 150, wherein the elastic master having the minute circuit grooves uses a silicon material. A method of fabricating a touch screen panel, the method comprising the steps of: forming a decor on a lower portion of an external contact transparent substrate; placing the conductive filler filled in the groove of the elastic master having the decor and the ultra- Thereby forming a conductive fine circuit portion;
Forming a transparent coating on the lower portion of the conductive fine circuit portion or applying a transparent material for optical to form a transparent layer;
And forming a conductive fine circuit part by moving a conductive filler filled in a groove of an elastic master having an extremely fine circuit groove in the lower part of the transparent layer to the transparent layer. A method of manufacturing a double-sided circuit transparent substrate, comprising: forming a conductive fine circuit part on both sides of a transparent substrate; The energization fine circuit portion is composed of a sense electrode and a wiring electrode; Wherein the sense electrode is formed of a plurality of electrically independent power supply assemblies, and the power supply microcircuits forming the same power supply group are energized only; A wiring electrode is formed at each end of the power supply community of the sense electrode; Wherein the conductive fine circuit portion constituting the sense electrode and the wiring electrode is formed by moving a conductive filler filled in a groove of an elastic master having an extremely fine circuit groove to a transparent substrate. 153. The liquid crystal display according to claim 158, wherein the transparent substrate comprises an X-axis sense electrode on one side and a Y-axis sense electrode on the other side forming a right angle with the X-axis; The X-axis sense electrode is formed with a current-carrying line by a current-carrying line parallel to the Y-axis; Wherein the Y-axis sense electrode is formed with an energizing line by an energizing line parallel to the X-axis. 153. The method of claim 158, wherein a bridge line parallel to the X-axis is formed in the vicinity of the energizing community comprising the energizing line parallel to the Y-axis; And a bridge line parallel to the Y axis is formed in the current-carrying block made up of the current-carrying lines parallel to the X-axis. A conductive fine circuit part is formed on one or both sides of the transparent substrate, the conductive fine circuit part includes a sense electrode, a wiring electrode is formed at a rim of the sense electrode, and the wiring electrode is connected to a control part or a flexible circuit board Wherein the conductive fine circuit portion is fabricated by filling conductive grooves formed in an elastic substrate and filling the grooves with conductive material. The touch panel substrate according to claim 161, wherein the fine grooves forming the wiring electrodes have a larger depth and a wider width than the fine grooves forming the sense electrodes. 160. The touch panel substrate according to claim 161, wherein the fine grooves have a larger area inside than the surface portion of the elastic substrate. Filling a fine groove formed in an elastic substrate with a conductive material, and printing the conductive material on a lower portion of the outer contact dipping substrate. 169. A method according to claim 161, wherein a current-carrying fine circuit portion is formed on both sides of the transparent substrate; The energization fine circuit portion is composed of a sense electrode and a wiring electrode; Wherein the sense electrode is formed of a plurality of electrically independent power supply assemblies, and the power supply microcircuits forming the same power supply group are energized only; A wiring electrode is formed at each end of the power supply community of the sense electrode; Wherein the conductive fine circuit portion constituting the sense electrode and the wiring electrode is formed by moving a conductive filler filled in a groove of an elastic master having an extremely fine circuit groove to a transparent substrate. 160. The display device according to claim 161, wherein the transparent substrate comprises an X-axis sense electrode on one side and a Y-axis sense electrode on the other side forming a right angle with the X-axis; The X-axis sense electrode is formed with a current-carrying line by a current-carrying line parallel to the Y-axis; And an energizing community is formed in the Y-axis sense electrode by an energizing line parallel to the X-axis. 169. The method according to claim 161, wherein a bridge line parallel to the X-axis is formed in the vicinity of the energizing community comprising the energizing line parallel to the Y-axis; And a bridge line parallel to the Y-axis is formed in a plurality of conductive lines formed by the conductive lines parallel to the X-axis.

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