TWI692713B - Method for manufacturing capacitive touch panel and capacitive touch control panel - Google Patents

Abstract

The invention discloses a method for manufacturing a capacitive touch panel. The method comprises three major steps: step1, forming a sensing circuit structure with a plurality of electrode structure on a substrate and forming a connecting structure on the substrate, wherein the connecting structure is disposed adjacent to the plurality of electrode structure and a gap exists between the structure and electrode structure; step2, forming a bridge structure to connect the plurality of electrode structure and the connecting structure; step3, cutting the connecting structure to form a plurality of output circuit. The present invention has low production cost.

Description

Manufacturing method of capacitive touch panel and capacitive touch panel

The invention relates to a method for manufacturing a touch panel and a touch panel, in particular to a method for manufacturing a capacitive touch panel and a capacitive control panel.

As shown in FIG. 1, in the existing capacitive touch panel P, the manufacturer must set the output circuit module PX (including the flexible board for connecting the output circuit of the touch panel P) to the touch according to different customer needs The sides P1, P2, P3, P4 of the panel P are different. Even if different customers specify to set the output line module PX on the same side of the touch panel P, the position specified by different customers may still be different, for example, two customers may specify the output line module PX to be set on the side Side P1, but it is possible that one of the customers specifies that the output line module PX is set close to the side P2, while the other customer specifies that the output line module PX is set close to the side P3.

According to the existing production process of the capacitive touch panel P, when the manufacturer changes the position of the output line module PX, it is necessary to redesign the corresponding photomask, thus causing a substantial increase in production cost.

An embodiment of the present invention is to provide a method for manufacturing a capacitive touch panel and a touch panel to improve the existing manufacturers of capacitive touch panels. When different customers demand different positions of output lines, they must renew The problem of designing a photomask has led to a significant increase in its production costs.

An embodiment of the present invention discloses a method for manufacturing a capacitive touch panel, which includes the following steps: a sensing circuit structure forming step: forming a sensing circuit structure on a substrate; the sensing circuit structure includes multiple sensing Electrodes; a plurality of the sensing electrodes are arranged in multiple rows; a communication structure forming step: forming a communication structure on the substrate, the communication structure is a conductive structure, the communication structure is adjacent to the substrate At least two adjacent sides are provided, and there is a gap between the communication structure and the adjacent multiple electrode structures; a bridge structure forming step: forming multiple bridge structures, multiple bridge structures One end of the is connected to the plurality of sensing electrodes, and the other ends of the plurality of bridge structures are connected to the communication structure; the bridge structure is a conductive structure; an output line forming step: removing part of the connection structure by laser , So that the communication structure becomes a plurality of output lines, and one end of each output line is connected to one of the sensing electrodes through the bridge structure; each of the output lines is not connected to each other; wherein, the output line It is used to connect with a control device, and any signal corresponding to the sensing electrode being operated can be transmitted to the control device through the output line.

An embodiment of the present invention also discloses a method for manufacturing a capacitive touch panel, which includes the following steps: a circuit structure forming step: forming a sensing circuit structure and a connecting structure on a substrate; the sensing circuit structure includes multiple Sensing electrodes; a plurality of the sensing electrodes are arranged in multiple rows; the communication structure is a ring structure, the sensing circuit structure is correspondingly located in the area surrounded by the communication structure, and the communication There is a gap between the structure and a plurality of adjacent electrode structures; the communication structure is a conductive structure; a bridge structure forming step: forming a plurality of bridge structures, one end of the plurality of bridge structures is connected to a plurality of electrodes The sensing electrode, the other ends of the plurality of bridge structures are connected to the communication structure; the bridge structure is a conductive structure; an output line forming step: removing part of the communication structure with a laser to make the communication The structure becomes a plurality of output lines, and one end of each of the output lines is connected to one of the sensing electrodes through the bridge structure; each of the output lines is not connected to each other; wherein, the output line is used to communicate with a control device In connection, any signal generated by the sensing electrode being operated can be transmitted to the control device through the output line.

An embodiment of the present invention also discloses a method for manufacturing a capacitive touch panel, which includes the following steps: a circuit structure forming step: forming a sensing circuit structure and a connecting structure on a substrate; the sensing circuit structure includes multiple Sensing electrodes; a plurality of the sensing electrodes are arranged in multiple rows; the communication structure is a ring structure, the sensing circuit structure is correspondingly located in the area surrounded by the communication structure, and the communication The structure is connected to a plurality of the sensing electrodes adjacent to it; the communication structure is a conductive structure; an output line forming step: removing part of the communication structure by laser, so that the communication structure becomes a plurality of An output line, one end of each of the output lines is connected to one of the sensing electrodes; each of the output lines is not connected to each other; wherein, the output line is used to connect to a control device, and any of the sensing The signal generated by the operation of the electrode can be transmitted to the control device through the output line.

An embodiment of the present invention also discloses a capacitive touch panel manufactured by any one of the above-mentioned touch panel manufacturing methods. The capacitive touch panel includes: a substrate, a sensing circuit structure, an output line, and at least one shield structure.

In summary, when a touch panel manufacturer uses the method of manufacturing a capacitive touch panel disclosed in the embodiments of the present invention to manufacture a touch panel, it only needs Changing the formation position of the connection structure and changing the position of removing the connection structure without changing the relevant photomask for making the sensing circuit structure, thereby, the production efficiency of the touch panel can be greatly improved, and the production cost can be greatly reduced. More flexible to change the output line position according to different customer needs

Please refer to FIGS. 2 to 6 together. FIG. 2 is a schematic flowchart of a first embodiment of the method for manufacturing a touch panel of the present invention. FIGS. 3 to 6 are top views of substrates in different steps of this embodiment. .

As shown in FIG. 2, the manufacturing method of the capacitive touch panel of the present invention includes the following steps:

A sensing circuit structure forming step S10: forming a sensing circuit structure 20 on a substrate 10; the sensing circuit structure 20 includes a plurality of sensing electrodes 211, 221; the plurality of sensing electrodes 211, 221 are arranged in multiple rows Set up

A communication structure forming step S11: a communication structure 30 is formed on the substrate 10, the communication structure 30 is a conductive structure, the communication structure 30 is disposed adjacent to at least two adjacent sides of the substrate 10, and the communication structure 30 is adjacent to it There is a gap R between the plurality of sensing electrodes 211, 221;

A bridge structure forming step S12: forming a plurality of bridge structures 40, one end of the plurality of bridge structures 40 is connected to the plurality of sensing electrodes 211, 221, and the other end of the plurality of bridge structures 40 is connected to the communication structure 30; the bridge structure 40 is a conductive structure ;

An output line forming step S13: the portion of the communication structure 30 is removed by laser, so that the communication structure 30 becomes a plurality of output lines 31, and one end of each output line 31 is connected to one sensing electrode 211, 221 through the bridge structure 40; The output lines are not connected to each other;

The output line 31 is used to connect with a control device, and the signal generated by any of the sensing electrodes 211 and 221 can be transmitted to the control device through the output line 31. In a specific application, the ends of each output line 31 away from the sensing electrodes 211 and 221 to which they are connected may be used to connect a flexible circuit board.

As shown in FIG. 3, it is shown as a top view of the substrate after performing the above-mentioned sensing circuit structure forming step S10. In practical applications, the sensing circuit structure 20 may include multiple rows of Y-axis sensing channel structures 21 and multiple rows of X-axis sensing channel structures 22; each row of Y-axis sensing channels The structure 21 and each row of X-axis sensing channel structures 22 respectively include a plurality of sensing electrodes 211 and 221 connected to each other. The sensing circuit structure 20 may be manufactured by using a single-layer indium tin oxide (Single ITO, SITO) process technology, a double-layer indium tin oxide (Double ITO, DITO) process technology, etc., which is not limited herein.

In different embodiments, the sensing circuit structure 20 may also include only multiple columns of X-axis sensing channel structures 22; or, the sensing circuit structure 20 may also include only multiple columns of Y-axis sensing channel structures 21 . In addition, the appearance of each sensing electrode 211, 221 may be changed according to requirements, and the figure shows only one of the exemplary aspects.

As shown in FIG. 4, it is shown as a top view of the substrate 10 after performing the above-described communication structure forming step S11. In the figure of this embodiment, the shape of the communication structure 30 is L-shaped as an example, but the shape of the communication structure 30 is not limited to this, and the shape of the communication structure 30 may be similar to the U-shape Or a ring (for example, a mouth shape). In addition, the communication structure 30 in this embodiment is generally composed of two rectangles, but the appearance of the communication structure 30 is not limited to this. The appearance of the communication structure 30 can be any shape according to the needs, for example In other words, the communication structure 30 may be arc-shaped or the like, but the communication structure 30 must be disposed adjacent to two adjacent sides of the substrate 10.

In FIG. 4 of this embodiment, the communication structure 30 is formed at the upper right corner of the substrate 10, but the formation position of the communication structure 30 is not limited to this. The formation position of the communication structure 30 may be changed according to requirements, for example, FIG. The communication structure 30 in 4 may also be located in the lower right corner, the upper left corner, the lower left corner, or the like of the substrate 10. In a specific implementation, the communication structure 30 may be formed on the substrate 10 by printing, etching, or the like. The material of the communication structure 30 may be a conductive material such as copper or silver, which is not limited herein.

As shown in FIG. 5, it is shown as a top view of the substrate 10 after performing the above-mentioned bridge structure forming step S12. In a specific application, the plurality of bridge structures 40 may be formed by printing silver paste. The plurality of bridge structures 40 are used to connect the communication structure 30 to the adjacent plurality of sensing electrodes 211 and 221. Therefore, the number of the bridge structures 40 corresponds to the plurality of sensing electrodes 211 adjacent to the communication structure 30. The number of 221.

As shown in FIG. 4 to FIG. 6, when a touch panel manufacturer uses the touch panel manufacturing method of the present invention to manufacture a touch panel, it is only necessary to change the formation position of the communication structure 30 to correspondingly change the position of the output line 31 In this embodiment, since the connecting structure forming step S11 is independent of the sensing circuit structure forming step S10, changing the forming position of the connecting structure 30 does not require correspondingly changing the sensing circuit structure forming step S10, that is Therefore, changing the communication structure 30 does not require correspondingly changing any mask used in the manufacturing process of the sensing circuit structure 20. On the other hand, in the existing method of manufacturing a capacitive touch panel, if you want to change the position of the output line, you must change the photomask accordingly, which results in an increase in production costs. Therefore, the method of manufacturing a capacitive touch panel of the present invention Compared with the conventional technology, it has the technical effect of reducing production cost.

In addition, as shown in FIG. 4, in the embodiment where the substrate 10 is rectangular, in the sensing circuit structure forming step S10 and the communication structure forming step S11, since the substrate 10 and the communication structure 30 have no directivity, regardless of the final Wherever the output line 31 is desired to be located on the substrate 10, there is no need to modify the sensing circuit structure forming step S10 and the communication structure forming step S11. However, in this embodiment, the manufacturer of the touch panel only needs to change the position where the communication structure 30 is removed in the above-mentioned output line forming step S13 according to different customer requirements for the position of the output line 31.

In the specific implementation, the way of performing the output line forming step S13 is mostly to make the related mechanical equipment perform laser removal on the specific position of the communication structure 30 according to a predetermined pattern; therefore, the manufacturer When the position of the output line 31 is required, the predetermined pattern can be simply changed.

As shown in FIG. 6, after the output line forming step S13 may further include a substrate cutting step: cutting the substrate 10. Before the substrate cutting step, a mark forming step may also be included: forming a plurality of mark structures 60 on the substrate; and, in the substrate cutting step, the substrate 10 is cut according to the plurality of mark structures 60, that is, related tools may be The substrate 10 is cut by a virtual line. In a specific implementation, the mark forming step may be after the output line forming step S13, and in the mark forming step, it may also cooperate with the image capturing unit to capture the image of the substrate 10 to confirm the position of the output line 31, Then, the formation positions of the plurality of mark structures 60 are determined, so as to ensure that the output line 31 is not cut in the substrate cutting step.

Please refer to FIG. 7 and FIG. 8 together. FIG. 7 is a schematic flowchart of a second embodiment of the method for manufacturing a touch panel of the present invention. FIG. 8 is one of the steps of the method for manufacturing a touch panel according to this embodiment. View from above. As shown in FIG. 7, the biggest difference between this embodiment and the previous embodiment is that the sensing circuit structure forming step S10 may include:

Multiple sensing electrode forming step S101: forming multiple rows of sensing channel (Y/X channel) structures 21, 22 on the substrate 10; each row of sensing channel structures 21, 22 includes multiple sensing electrodes 211, 221 (e.g. (Figure 8);

An auxiliary test structure forming step S102: an auxiliary test structure 50 is formed on each sensing electrode 211, 221 adjacent to the outer side of the substrate 10, and each auxiliary test structure 50 is a conductive structure (as shown in FIG. 3).

In practical applications, in the auxiliary test structure forming step S102, a plurality of auxiliary test structures 50 may be formed on the substrate 10 by printing, but not limited thereto.

As shown in FIG. 5, in the subsequent bridge structure forming step S12, one end of the plurality of bridge structures 40 is connected to the plurality of sensing electrodes 211 and 221, and the other end of the plurality of bridge structures 40 is connected to the communication structure 30 Through the design of the auxiliary test structure 50, the connection effect between each sensing electrode 211, 221 and the bridge structure 40 can be strengthened.

As shown in FIG. 3, in a specific implementation, each auxiliary test structure 50 may be used to connect with an external detection device, and the external detection device can pass through each auxiliary test structure 50 to detect multiple senses located in the same column The conduction state between the measuring electrodes 211 and 221 can be used to eliminate the touch panel with poor conduction state, and the production cost of the subsequent process can be avoided.

In particular, in this embodiment, multiple auxiliary test structures 50 are formed in the sensing circuit structure forming step S10, but the multiple auxiliary test structures 50 are not limited to the sensing circuit structure forming step Formed in S10. In different embodiments, a plurality of auxiliary test structures 50 may be formed in other steps according to requirements. For example, in the first embodiment of the aforementioned method for manufacturing a touch panel of the present invention, a plurality of auxiliary test structures 50 50 may be formed on the substrate 10 together with the communication structure 30 in the connection structure forming step S11, or a plurality of auxiliary test structures 50 and the connection structure 30 may be formed on the substrate 10 in succession in the connection structure formation step S11 according to requirements .

Please refer to FIG. 9 to FIG. 14 together. FIG. 9 is a schematic flowchart of a third embodiment of the method for manufacturing a touch panel of the present invention. FIG. 10 is a top view of a substrate in one step of this embodiment; FIG. 11 FIG. 12 to FIG. 14 are top views of different steps of the substrate in this embodiment.

As shown in FIG. 9, the manufacturing method of the touch panel of this embodiment includes the following steps:

A circuit structure forming step S20: forming a sensing circuit structure 20 and a communication structure 30 on a substrate 10; the sensing circuit structure 20 includes a plurality of sensing electrodes 211, 221; The communication structure 30 is a ring structure, and the sensing circuit structure 20 is correspondingly located in the area surrounded by the communication structure 30, and there is a connection between the communication structure 30 and the adjacent sensing electrodes 211, 221 Gap R; the communication structure 30 is a conductive structure;

A bridge structure forming step S21: forming a plurality of bridge structures 40, one end of the plurality of bridge structures 40 is connected to the plurality of sensing electrodes 211, 221, and the other end of the plurality of bridge structures 40 is connected to the communication structure 30; the bridge structure 40 is a conductive structure ;

An output line forming step S22: the portion of the communication structure 30 is removed by laser, so that the communication structure 30 becomes a plurality of output lines 31, and one end of each output line 31 is connected to one sensing electrode 211, 221 through the bridge structure 40; The output lines 31 are not connected to each other;

The output line 31 is used to connect with a control device, and the signal generated by any of the sensing electrodes 211 and 221 can be transmitted to the control device through the output line 31.

As shown in FIG. 11, the circuit structure forming step S20 may use a single-layer indium tin oxide (Single ITO, SITO) process technology to simultaneously form the sensing circuit structure 20 and the connection structure 30 on the substrate 10, the specific steps may be contain:

Step 1: forming a metal circuit structure 11 and a communication structure 30 on the substrate 10, the metal circuit structure 11 will serve as a conductive communication structure for each row of X/Y axis sensing channel structures (as shown in FIG. 11(a)). In practical applications, the metal line structure 11 and the communication structure 30 may be formed at the same time with the same photomask.

Step 2: forming an isolation layer 12 on the substrate 10 and the metal circuit structure 11 (as shown in FIG. 11(b)). In this step, the isolation layer 12 may not be formed on the communication structure 30.

Step 3: Remove part of the isolation layer 12 to expose part of the metal circuit structure 11 (as shown in FIG. 11(c));

Step 4: forming an indium tin oxide (ITO) pattern structure 13 on the isolation layer 12 and the metal circuit structure 11 to form a plurality of sensing electrodes (electrode), part of the sensing electrodes will be connected to the metal circuit structure 11, While forming a multi-row X-axis sensing channel (X channel) structure, another part of the sensing electrodes 211, 221 constitute a multi-row Y-axis sensing channel (Y channel) structure (as shown in FIG. 11(d)) .

In the above step 1, since the communication structure 30 is a ring structure, no matter which side of the substrate 10 the output line 31 of the related manufacturer of the touch panel specifies, the related manufacturer does not need to change to form the communication structure 30 and the photomask of the metal circuit structure 11, so that the problem of the need to change the photomask and increase the production cost in the conventional technology can be avoided.

It is worth mentioning that in different applications, the circuit structure forming step S20 may also use a double indium tin oxide (Double ITO, DITO) process technology to simultaneously form the sensing circuit structure 20 and the connection on the substrate 10 Structure 30.

As shown in FIG. 12, before the bridge structure forming step S21, the aforementioned auxiliary test structure forming step (S102) may be included to form a plurality of auxiliary test structures 50. As shown in FIG. 13, in the bridge structure forming step S21, the position where the plurality of bridge structures 40 are formed, that is, the position corresponding to the final output line 31. That is, in the step S21 of forming the bridge structure in this embodiment, it may be that not all the sensing electrodes 211 and 221 adjacent to the communication structure 30 are formed with the bridge structure 40, so that the plurality of bridge structures 40 are formed only partially Sense electrode 211, 221.

As shown in FIG. 14, in the output line forming step S22, the portion of the communication structure 30 is removed by laser to form the output line 31, and at least one shielding structure 32 is formed correspondingly. Any output line 31 or any sensing electrodes 211, 221 are connected. The shielding structure 32 can enhance the ability of the touch panel to resist external electromagnetic interference. The shape and position of the shielding structure 32 can be changed according to requirements. Preferably, the shielding structure 32 can be substantially surrounded by a plurality of adjacent sensing electrodes 211 and 221. In practical applications, in the touch panel shown in FIG. 14, in the subsequent substrate cutting step, part of the shielding structure 32 may be cut according to requirements.

Please refer to FIGS. 15 to 17 together. FIG. 15 is a schematic flowchart of a fourth embodiment of the method for manufacturing a touch panel of the present invention. FIGS. 16 and 17 are top views of a substrate in one step of this embodiment. .

As shown in FIG. 15, the manufacturing method of the touch panel of this embodiment includes the following steps:

A circuit structure forming step S30: forming a sensing circuit structure 20 and a communication structure 30 on a substrate 10; the sensing circuit structure 20 includes a plurality of sensing electrodes 211, 221; The communication structure 30 is a ring structure, the sensing circuit structure 20 is correspondingly located in the area surrounded by the communication structure 30, and the communication structure 30 is connected to a plurality of adjacent sensing electrodes 211, 221; Structure 30 is a conductive structure;

An output line forming step S31: the portion of the communication structure 30 is removed by laser, so that the communication structure 30 becomes a plurality of output lines 31, and one end of each output line 31 is connected to one sensing electrode 211, 221; each output line 31 is mutually Disconnected

The output line 31 is used to connect with a control device, and the signal generated by any of the sensing electrodes 211 and 221 can be transmitted to the control device through the output line 31.

As shown in FIG. 16, it is shown as a top view of the substrate 10 after performing the circuit structure forming step S30. In a specific application, the communication structure 30 may be formed on the substrate 10 together with a part of the structure of the sensing circuit structure 20, or the communication structure 30 may be formed after the sensing circuit structure 20 is formed on the substrate 10 Also formed.

In a specific application, after the circuit structure forming step S30, the aforementioned bridge structure forming step (S12) may be included to enhance the connection effect of the communication structure 30 and the plurality of sensing electrodes 211, 221.

Please refer to FIG. 6, FIG. 14 and FIG. 17 together, which are respectively shown as top views of the touch panel of the present invention. The touch panels are manufactured by the method for manufacturing the touch panel of the present invention.

In summary, when a touch panel manufacturer uses the touch panel manufacturing method of the present invention to manufacture a touch panel, it can be easily modified by changing the output circuit at different positions on the substrate in response to different customer requirements. The position where the connection structure is formed, and the position where the connection structure is removed by laser, can correspondingly change the position of the output line. Compared with the conventional technology, the manufacturing method of the touch panel of the present invention does not need to redesign the mask when changing the position of the output line. Therefore, the manufacturing method of the touch panel of the present invention has a production cost relative to the conventional technology Low power efficiency, and can more flexibly change the position of the output circuit on the substrate according to the needs of different customers. In addition, in the conventional technology, if the manufacturer wants to modify the position of the output line, it is necessary to redesign the photomask, and it takes a lot of time. In contrast, the manufacturing method of the touch panel of the present invention, when modifying the position of the output line Since there is no need to redesign the photomask, mass production can be started more quickly.

The content disclosed above is only a preferred and feasible embodiment of the present invention, and therefore does not limit the patent scope of the present invention. Therefore, any equivalent technical changes made by using the description and drawings of the present invention are included in the patent scope of the present invention. Inside.

P: capacitive touch panel

PX: output line module

P1, P2, P3, P4: side

R: clearance

10: substrate

11: Metal line structure

12: isolation layer

13: Indium tin oxide (ITO) pattern structure

20: Sensing circuit structure

21: Y-axis sensing channel structure

22: X-axis sensing channel structure

211, 221: sensing electrode

30: Connected structure

31: output line

32: shielding structure

40: Bridge structure

50: auxiliary test structure

60: Marking structure

FIG. 1 is a schematic diagram of the conventional technology.

FIG. 2 is a schematic flowchart of a first embodiment of a method for manufacturing a capacitive touch panel of the present invention.

3 to 6 are top views of the substrate in different steps of the first embodiment of the manufacturing method of the capacitive touch panel of the present invention.

7 is a schematic flowchart of a second embodiment of a method for manufacturing a capacitive touch panel of the present invention.

FIG. 8 is a top view of one step of the second embodiment of the method for manufacturing the capacitive touch panel of the present invention.

9 is a schematic flowchart of a third embodiment of a method for manufacturing a capacitive touch panel of the present invention.

10 is a top view of one step of the substrate in the third embodiment of the method for manufacturing a capacitive touch panel of the present invention.

11 is a schematic cross-sectional side view of one step of the substrate in the third embodiment of the method for manufacturing a capacitive touch panel of the present invention.

12 to 14 are top views of different steps of the substrate in the third embodiment of the manufacturing method of the capacitive touch panel of the present invention.

15 is a schematic flowchart of a fourth embodiment of the method for manufacturing a capacitive touch panel of the present invention.

16 and FIG. 17 are top views of different steps of the substrate in the fourth embodiment of the manufacturing method of the capacitive touch panel of the present invention.

10: substrate

20: Sensing circuit structure

211, 221: sensing electrode

30: Connected structure

40: Bridge structure

50: auxiliary test structure

Claims (12)

A method for manufacturing a capacitive touch panel includes the following steps: a sensing circuit structure forming step: forming a sensing circuit structure on a substrate; the sensing circuit structure includes a plurality of sensing electrodes; a plurality of The sensing electrodes are arranged in multiple rows; a connecting structure forming step: forming a connecting structure on the substrate, the connecting structure is a conductive structure, and the connecting structure is adjacent to at least two neighbors of the substrate And there is a gap between the communication structure and the adjacent sensing electrodes; a bridge structure forming step: forming a plurality of bridge structures, one end of each of the bridge structures is connected Each of the sensing electrodes, the other ends of the plurality of bridge structures are connected to the communication structure; the bridge structure is a conductive structure; an output line forming step: removing part of the communication structure by laser, so that all The communication structure becomes a plurality of output lines, and one end of each of the output lines is connected to one of the sensing electrodes through the bridge structure; each of the output lines is not connected to each other; wherein, the output line is used to The control device is connected, and any signal corresponding to the sensing electrode being operated can be transmitted to the control device through the output line. The method for manufacturing a capacitive touch panel according to claim 1, wherein the In the step of forming the output line, at the same time as removing the part of the communication structure by laser to form the output line, at least one shielding structure is formed correspondingly, the shielding structure is not connected to any of the output lines or any of the sensing Electrode connection. The method for manufacturing a capacitive touch panel according to claim 1, wherein the communication structure is L-shaped, U-shaped, or ring-shaped. The method for manufacturing a capacitive touch panel according to claim 1, wherein after the output line forming step, a substrate cutting step is further included: cutting only the substrate or cutting the substrate and the communication structure at the same time; Before the substrate cutting step, a mark forming step is further included: forming a plurality of mark structures on the substrate; wherein, in the substrate cutting step, the substrate is cut according to the plurality of mark structures. The method for manufacturing a capacitive touch panel according to claim 1, wherein, between the forming step of the sensing circuit structure and the forming step of the bridge structure, an auxiliary test structure forming step: Each of the sensing electrodes on the outer side of the substrate forms an auxiliary test structure, and each of the auxiliary test structures is a conductive structure; in the step of forming the bridge structure, one end of the plurality of bridge structures is connected A plurality of the auxiliary test structures, and connect the other ends of the plurality of bridge structures to the communication structure; wherein each of the auxiliary test structures can be connected to an external detection device, and the external detection device can penetrate Each of the auxiliary test structures is used to detect the conduction between the plurality of sensing electrodes located in the same column. A method for manufacturing a capacitive touch panel includes the following steps: a circuit structure forming step: forming a sensing circuit structure and a communication structure on a substrate; the sensing circuit structure includes a plurality of sensing electrodes; The sensing electrodes are arranged in multiple rows; the communication structure is a ring structure, and the sensing circuit junction The structure is located in the area surrounded by the connection structure, and there is a gap between the connection structure and the adjacent plurality of sensing electrodes; the connection structure is a conductive structure; and a bridge structure forming step: Forming a plurality of bridge structures, one end of the plurality of bridge structures is connected to the plurality of sensing electrodes, and the other ends of the plurality of bridge structures are connected to the communication structure; the bridge structure is a conductive structure; and an output line is formed Step: removing part of the communication structure with a laser, so that the communication structure becomes a plurality of output lines, and one end of each output line is connected to one of the sensing electrodes through the bridge structure; each output The lines are not connected to each other; wherein the output line is used to connect with a control device, and any signal generated by the sensing electrode being operated can be transmitted to the control device through the output line. The method for manufacturing a capacitive touch panel according to claim 6, wherein in the step of forming the output line, at least one shielding structure is formed while removing the part of the communication structure to form the output line , The shielding structure is not connected to any of the output lines or any of the sensing electrodes. The method for manufacturing a capacitive touch panel according to claim 6, wherein after the output line forming step, a substrate cutting step is further included: cutting only the substrate or cutting the substrate and the communication structure at the same time; Before the substrate cutting step, a mark forming step is further included: forming a plurality of mark structures on the substrate; wherein, In the substrate cutting step, the substrate is cut according to a plurality of the marking structures. The method for manufacturing a capacitive touch panel according to claim 6, wherein, before the step of forming the bridge structure, an auxiliary test structure forming step is included: each of the senses adjacent to the outer side of the substrate Measuring electrodes to form an auxiliary test structure, each of which is a conductive structure; in the step of forming the bridge structure, one end of the plurality of bridge structures is connected to the plurality of auxiliary test structures The other end of the bridge structure is connected to the communication structure; wherein each of the auxiliary testing structures can be connected to an external testing device, and the external testing device can pass through each of the auxiliary testing structures to detect The conduction status of the plurality of sensing electrodes in a row. A method for manufacturing a capacitive touch panel includes the following steps: a circuit structure forming step: forming a sensing circuit structure and a communication structure on a substrate; the sensing circuit structure includes a plurality of sensing electrodes; The sensing electrodes are arranged in multiple rows; the communication structure is a ring structure, the sensing circuit structure is correspondingly located in the area surrounded by the communication structure, and the communication structure is adjacent to the adjacent one A plurality of the sensing electrodes are connected; the communication structure is a conductive structure; an output line forming step: removing part of the communication structure with a laser, so that the communication structure becomes a plurality of output lines, each One end of the output line is connected to one of the sensing electrodes; each of the output lines is not connected to each other; wherein, the output line is used to connect with a control device, any of the sensing The signal corresponding to the operation of the electrode can be transmitted to the control device through the output line. The method for manufacturing a capacitive touch panel according to claim 10, wherein in the step of forming the output line, at least one shielding structure is formed while removing the portion of the communication structure to form the output line The shielding structure is not connected to any of the output lines or any of the sensing electrodes. A capacitive touch panel manufactured by the method for manufacturing a capacitive touch panel according to any one of claims 2, 7, and 11 includes: the substrate, The sensing circuit structure, the output line and the shielding structure.

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