KR20140111975A - EMI shielding film manufactured by electroplating and printed circuit board using the same - Google Patents

Abstract

A method of manufacturing an electromagnetic wave shielding film for transfer according to the present invention includes a step of forming a release layer on an insulating substrate, a step of forming a primer for plating on the release layer, a step of forming an undercoat layer on the primer for plating by wet plating, a step of forming a plating layer on the undercoat layer by using wet plating, and a step of forming an adhesive layer on the plating layer.

Description

[0001] The present invention relates to an electromagnetic shielding film,

The present invention relates to a method of manufacturing an electromagnetic wave shielding film, and more particularly, to a method of manufacturing an electromagnetic wave shielding film capable of forming an electromagnetic wave shielding layer on a printed circuit board or the like using a transfer method.

Recently, as the use of advanced electric and electronic products and communication devices in a variety of fields such as automobile, aerospace, ship, and bio industry has been rapidly increased, problems of electromagnetic noise or electromagnetic interference have become serious. That is, due to the electromagnetic waves emitted from these devices, the electric and electronic products interfere with each other, resulting in malfunction of other devices and various adverse effects on the human body. Electromagnetic interference (EMI) is a phenomenon in which electromagnetic waves radiated or conducted from an electronic device interfere with the functions of other devices. In today's information society, radio waves are actively used as information transmission means such as computers, mobile phones, and wireless LANs. However, the spread of information devices is progressing, and problems such as the harmfulness of the human body due to radio wave trouble overflowed due to high-speed and high-density information transmission, malfunctions of various instruments and information leakage are occurring. Moreover, in the case of widely used wireless communication devices, since the device itself transmits and receives a radio frequency signal and is directly used in contact with the human body, the human body caused by the above-mentioned radiation of electromagnetic waves is more likely to be damaged.

As a countermeasure against such radio wave interference, it is urgently required to establish a radio wave control technology under limited conditions, and there is a growing interest in the international regulation of electromagnetic wave emission and electromagnetic wave resistance, harmfulness of the human body due to electromagnetic wave radiation, and the like Regulations are being tightened.

Electromagnetic wave attenuation is a mechanism that causes reflection loss due to impedance mismatch between an air layer and a metal, transmission loss that dissipates into heat due to resistance loss while passing through a metal shielding film, and multiple reflection loss due to retroreflection into the metal layer in both boundary layers of the metal shielding film . Electromagnetic wave shielding can be divided into electric field shielding and magnetic field shielding. The electric field shielding is required to cover an object to be protected with a highly conductive material. The shielding effect varies depending on the thickness of the material. For magnetic shielding, there is a way to bypass the magnetic field by increasing the absorption loss using a high permeability material or by lowering the magnetoresistance to magnetic flux. For this shielding, it is necessary to apply a metal thin film such as aluminum foil or silver foil excellent in conductivity, or to apply a conductive paste prepared by dispersing the conductive powder to the binder resin uniformly on the surface of the printed circuit board, A conductive adhesive film type product is applied. Particularly, in the case of a flexible printed circuit board requiring repeated bending characteristics, the metal thin film or the liquid paste paste has a poor bending property and is restricted in use. In applications requiring excellent bending properties, the bending property is good and the bending property and the electric conductivity A demand for a product having such an excellent adhesive film shape is greatly increased.

As described above, the electromagnetic wave shielding film used for mobile devices may be formed by laminating and laminating an insulating layer such as polyethylene terephthalate (PET) and a conductive layer such as a metal foil, or by forming a metal such as Ag on the insulating layer such as terephthalate A method of forming a conductive layer by sputtering, silver paste or the like, or a method of producing a film by using a resin that forms a conductive layer and an insulating layer has been introduced and applied.

The electromagnetic wave shielding film produced by this method forms a conductive layer on the whole surface. In the case of the heat-immersed film, the electromagnetic wave shielding film is attached in such a manner that the electromagnetic wave shielding film is cut to fit the shape of the attaching portion, It is difficult because of low productivity.

Korean Patent No. 0995563, Korean Patent No. 1044567 and Korean Patent Publication No. 2009-0008557 disclose a technique for manufacturing an electromagnetic wave shielding film using a resin, No mention is made.

Accordingly, a first object of the present invention is to provide a method for manufacturing a conductive electromagnetic wave shielding film capable of forming an electromagnetic wave shielding layer by transferring to a printed circuit board or the like with a mold releasing function.

Accordingly, a second object of the present invention is to provide a method of manufacturing a printed circuit board to which the method for manufacturing a conductive electromagnetic shielding film is applied.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising the steps of: forming a release layer on an insulating substrate; forming a primer for plating on the release layer; forming a base plating layer by wet plating on the primer for plating; Forming a plating layer on the base plating layer using a wet plating method, and forming an adhesive layer on the plating layer.

According to an embodiment of the present invention, the insulating substrate may be made of a resin selected from the group consisting of polyethyleneterephthalate, acrylic, polycarbonate, polypropylene, polyethylene, polystyrene, polyester, cellulosic, At least one selected from the group consisting of

According to another embodiment of the present invention, the release layer may be at least one selected from the group consisting of a melanin series, a fluoric series, a silicone series, and an alkyl acrylate series.

According to another embodiment of the present invention, the underlying plating layer may be made of nickel or copper.

According to another embodiment of the present invention, the plating layer may be at least one selected from the group consisting of silver, zinc, copper, and nickel.

According to another embodiment of the present invention, the method may further include a mask forming step for patterning the electromagnetic wave shielding region before or after the step of forming the ground plating layer by wet plating on the plating primer.

In order to achieve the second object of the present invention, there is provided a method of manufacturing a printed circuit board using the method for manufacturing a conductive electromagnetic shielding film.

Since the electromagnetic wave shielding film of the present invention forms an electromagnetic wave shielding layer by a plating method, an expensive electromagnetic wave shielding process such as sputtering is not used, and thus an electromagnetic wave shielding layer can be formed at a low cost.

In addition, the electromagnetic wave shielding film for transfer according to the present invention can selectively form an electromagnetic wave shielding region on a printed circuit board or an electronic device where electromagnetic wave shielding is required by a transfer method.

1 shows the structure of a conventional electromagnetic wave shielding film.
2 is a flow chart for explaining a method of manufacturing a transfer electromagnetic shielding film of the present invention.
3 is a cross-sectional view of an electromagnetic wave shielding film produced by the method for manufacturing electromagnetic wave shielding film for transfer according to the present invention.

The method for manufacturing a conductive electromagnetic wave shielding film of the present invention includes the steps of forming a release layer on an insulating substrate, forming a primer for plating on the release layer, forming a base plating layer by wet plating on the primer for plating Forming a plating layer on the base plating layer using wet plating; and forming an adhesive layer on the plating layer.

1 shows the structure of a conventional electromagnetic wave shielding film. 1, the conventional electromagnetic wave shielding film includes a release layer 101, a conductive pressure-sensitive adhesive layer 102, a conductive sheet layer 103, and an insulating layer 104. Since such a conventional electromagnetic wave shielding film forms a conductive sheet layer by a method such as sputtering, there is a problem that an expensive vacuum process is used and a conductive sheet layer is formed on the entire surface. Therefore, after attaching an electromagnetic wave shielding film to a printed circuit board, It is necessary to remove the portion excluding the shielding portion of the electronic car.

The present invention relates to a method of manufacturing an electromagnetically shielding film for use in the prior art. The present invention reduces the manufacturing cost by applying a plating process, and selectively forms only a region requiring electromagnetic shielding by a patterning method using a photo- The plating process is performed to remove the conductive layer removing process after the conductive layer is attached to the printed circuit board.

2 is a flow chart for explaining a method of manufacturing a transfer electromagnetic shielding film of the present invention. Referring to FIG. 2, first, an insulating substrate such as polyethylene terephthalate (PET) is prepared (S1). An insulating substrate is a base substrate for forming an electromagnetic wave shielding layer by using a plating method, and is a portion removed after being attached to a printed circuit board or the like. The insulating substrate may be made of polyethyleneterephthalate, acrylic, polycarbonate, polypropylene, polyethylene, polystyrene, polyester, cellulosic, polyvinyl chloride, or the like. Next, a release layer is formed on the insulating substrate (S2). The release layer is a part for separating the insulating substrate and the plating layer, and may be at least one selected from the group consisting of a melanin series, a fluoric series, a silicone series, and an alkyl acrylate series. Subsequently, a primer layer for plating is formed on the release layer (S3). As the primer for plating, acrylic epoxy used as a finish coating and printing agent can be used, and since the adhesion after electroless plating is lowered, it is difficult to directly coat the primer, so the primer for plating is applied and an anchor is formed to secure adhesion . Plating primers can be applied in various ways depending on the type and use of finish coating agents and printing agents. Subsequently, a base plating layer is formed on the plating primer layer (S4). The formation of the underlying plated layer may be performed by a process such as electroless plating, and may be performed specifically with a nickel or copper electroless plating process. Subsequently, a plating layer is formed on the underlying plating layer (S5). The plating layer may be formed of a metal layer such as silver, zinc, copper, or nickel, and electroplating or electroless plating may be applied. Then, an adhesive layer is formed on the plating layer (S6). The adhesive layer is a means for attaching to a printed circuit board or the like. Various types of resin may be used depending on the material and the type of the object to be processed. A primer using heat, ultraviolet rays, pressure, or the like as a curing medium may be used Can be used.

In the method of manufacturing electromagnetic wave shielding film for transfer of the present invention, it is possible to apply a patterning of a specific type in the process of forming the base plating layer and the plating layer. When the patterned plating layer is formed as described above, the conductive layer can be formed on the printed circuit board only at a necessary portion without applying a separate patterning process after being attached to the printed circuit board. A method of forming a patterned plating layer includes a method of forming a base plating layer and / or a plating layer in a patterned pattern using a mask such as a photosensitive film or the like before forming the base plating layer, a method of forming a base plating layer and / A method of patterning the underlying plating layer and / or the plating layer by etching using a mask such as a light-sensitive film can be applied. A method of patterning a base plating layer or a plating layer may be used to form a patterned circuit by performing palladium (Pd) catalytic treatment on the plating primer layer followed by copper plating.

When the plating layer is formed in the patterned manner by such a method, the electromagnetic shielding layer can be formed only in a region where electromagnetic shielding is required in the process of attaching the electromagnetic shielding film for transfer to the printed circuit board. The process of applying the electromagnetically shielding film to the printed circuit board includes: a step of joining the electromagnetic shielding film for electronic use and a printed circuit board on which the film is to be adhered, and a step of transferring the pattern by heat pressing the laminated product by a transfer method ≪ / RTI >

3 is a cross-sectional view of an electromagnetic wave shielding film produced by the method for manufacturing electromagnetic wave shielding film for transfer according to the present invention. 3, the electromagnetic wave shielding film includes an insulating substrate 201, a release layer 202, a plating primer 203, a base plating layer 204, a plating layer 205, and an adhesive layer 206 in this order .

The insulating substrate 201 is made of at least one material selected from the group consisting of polyethyleneterephthalate, acrylic, polycarbonate, polypropylene, polyethylene, polystyrene, polyester, cellulosic, . Particularly, it is preferable that the insulating substrate is polyethyleneterephthalate. The polyethyleneterephthalate film can be generally used in the form of a film having a thickness of 13 to 50 mu m, and in order to produce a metal film to be transferred, It is preferable that the film is a polyethyleneterephthalate film having a thickness. This is due to the characteristics of the metal film used before the roll-to-roll process, in which tension must be maintained.

The release layer 202 may be at least one selected from the group consisting of a melanin series, a fluoric series, a silicone series, and an alkyl acrylate series. The release layer is preferably used to remove the insulating substrate from the transfer film by applying a thin coating of Teflon resin, silicone resin or melamine resin to the conductor, and preferably has a thickness of about several micrometers.

In the case of the acrylic epoxy used as the finish coat and the printing agent, the primer for plating 203 is difficult to be directly coated since the adhesion force after electroless plating is lowered, so that the primer for plating is applied and an anchor is formed to secure adhesion . Such a primer for plating may be variously applied depending on the type and use of the finish coating agent and the printing agent.

Nickel, copper, or the like may be used for the base plating layer 204, and silver, zinc, copper, nickel, or the like may be used for the plating layer 205. The metal layer may be formed by electroplating or electroless plating with various metals depending on the application, and it is preferable to form the metal layer at about 0.01 to 10 탆. In general, when electromagnetic shielding is performed, the electroless nickel layer is coated in a thickness of 0.1 to 0.5 μm, the copper plating layer is treated in a range of 0.1 to 1.0 μm, the wiring material is treated with palladium on the primer layer for plating, .

As the adhesive layer 206, various types of resins may be used depending on the material and type of the object to be processed, and a primer using heat, UV, pressure, or the like as a curing medium may be formed.

101: release layer 102: conductive pressure-sensitive adhesive layer
103: conductive sheet layer 104: insulating layer
201: insulating substrate 202: release layer
203: primer for plating 204: lower plating layer
205: Plated layer 206: Adhesive layer

Claims (7)

Forming a release layer on the insulating substrate;
Forming a plating primer on the release layer;
Forming a base plating layer by wet plating on the plating primer;
Forming a plating layer on the underlying plating layer using wet plating; And
And forming an adhesive layer on the plating layer. The method according to claim 1,
Wherein the insulating substrate is at least one selected from the group consisting of polyethyleneterephthalate, acrylic, polycarbonate, polypropylene, polyethylene, polystyrene, polyester, cellulosic, and polyvinyl chloride resins By weight based on the total weight of the electromagnetic wave shielding film. The method according to claim 1,
Wherein the release layer is at least one selected from the group consisting of melanin, fluorine, silicon, and alkyl acrylate. The method according to claim 1,
Wherein the base plating layer is made of nickel or copper. The method according to claim 1,
Wherein the plating layer is at least one selected from the group consisting of silver, zinc, copper, and nickel. The method according to claim 1,
Further comprising the step of forming a mask for patterning the electromagnetic wave shielding region before or after the step of forming the ground plating layer by wet plating on the plating primer. A manufacturing method of a printed circuit board using the method of manufacturing a conductive electromagnetic wave shielding film according to claim 1.

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