KR20140087841A - Fixing apparatus for printed circuit board - Google Patents

Fixing apparatus for printed circuit board Download PDF

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Publication number
KR20140087841A
KR20140087841A KR1020120158563A KR20120158563A KR20140087841A KR 20140087841 A KR20140087841 A KR 20140087841A KR 1020120158563 A KR1020120158563 A KR 1020120158563A KR 20120158563 A KR20120158563 A KR 20120158563A KR 20140087841 A KR20140087841 A KR 20140087841A
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KR
South Korea
Prior art keywords
substrate
picker
drive shaft
adsorption
adsorption table
Prior art date
Application number
KR1020120158563A
Other languages
Korean (ko)
Inventor
박성진
김동선
정진일
맹덕영
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020120158563A priority Critical patent/KR20140087841A/en
Publication of KR20140087841A publication Critical patent/KR20140087841A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A substrate fixing device is disclosed. The substrate fixing device includes a main adsorption table which adsorbs a portion of a substrate by using a plurality of adsorption holes; a secondary adsorption table which is disposed adjacent to the main adsorption table and adsorbs the remaining portion of the substrate by using a plurality of adsorption holes; a table moving unit which moves the secondary adsorption table in one axial direction; and a substrate pressurizing unit which pressurizes the substrate from the upper side of the secondary adsorption table.

Description

[0001] FIXING APPARATUS FOR PRINTED CIRCUIT BOARD [0002]

The present invention relates to a substrate holding apparatus.

 With the development of the electronic industry, there is a rapid increase in demand for miniaturization and miniaturization of electronic components. In order to cope with this trend, printed circuit boards have also been thinned and integrated. In addition, as the demand for high density and high reliability of a substrate on which chips are mounted increases, a method for inspecting defects of a substrate is becoming increasingly important.

In general, an apparatus for inspecting defects of a substrate fixes the substrate by a vacuum adsorption method, a clamping method using a clamp, and the like. However, as the thinning of the substrate progresses, a problem of warpage of the substrate arises, so that there is a problem that the deflection of the substrate can be corrected in the adsorption method or the clamping method, or various problems due to the warping of the substrate can not be prevented. In order to solve such a problem, various researches on a method of fixing a substrate in an apparatus for inspecting defects of a substrate have been conducted.

Korean Patent Publication No. 2008-0023647

An object of the present invention is to provide a substrate fixing apparatus which corrects warping of a substrate by applying an attraction method using a vacuum and a tensile force to the substrate.

A substrate holding apparatus according to an embodiment of the present invention includes a main adsorption table for adsorbing a portion of a substrate using a plurality of adsorption holes, a plurality of adsorption holes arranged adjacent to the main adsorption table for adsorbing the remaining portion of the substrate A table moving part for moving the auxiliary suction table in the one axial direction, and a substrate pressing part for applying pressure to the substrate above the auxiliary suction table.

According to an embodiment of the present invention, the table moving unit includes at least one drive shaft installed on the back surface of the main suction table and disposed in the unidirectional direction; At least one drive shaft connection portion provided on a rear surface of the auxiliary absorption table and connected to the drive shaft; And a motor unit installed on a rear surface of the main adsorption table and rotating the driving shaft.

According to an embodiment of the present invention, the motor unit includes a motor for rotating the drive shaft; A receiving portion for receiving the motor; And at least one worm gear connecting the motor and the drive shaft.

According to an embodiment of the present invention, the substrate presser includes a picker for applying pressure to the substrate; A pad coupled to the picker and in contact with the substrate; A support for supporting the picker to move the picker; And a connection pipe connecting the external pump and the picker.

According to an embodiment of the present invention, the substrate presser may further include a picker engaging member that engages the picker with the support.

According to an embodiment of the present invention, the picker engagement member may be inserted into the guide groove of the support portion and move in the uniaxial direction.

According to an embodiment of the present invention, the support portion includes a support bar for supporting the picker; And a support bar connected to the support bar to move the support bar up and down.

A substrate holding apparatus according to an embodiment of the present invention fixes a substrate on an auxiliary adsorption table by using an adsorption method using vacuum, applies a tensile force to the substrate by moving a subsidiary adsorption table, presses the substrate on the substrate, And the substrate can be fixed.

1 is a side view showing a substrate holding apparatus according to an embodiment of the present invention.
2 is a plan view showing a main adsorption table and a second adsorption table according to an embodiment of the present invention.
3 is a plan view showing a configuration of a motor unit according to an embodiment of the present invention.
4 is a plan view showing a plane of a table moving part according to an embodiment of the present invention.
5 is a side view showing a side surface of a table moving part according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and described in detail in the detailed description. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present invention, the term "comprises" or "having ", etc. is intended to specify that there is a feature, number, step, operation, element, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Hereinafter, a substrate holding apparatus according to an embodiment of the present invention will be described with reference to FIGS. 1 to 5 attached hereto.

1 is a side view showing a substrate holding apparatus according to an embodiment of the present invention.

2 is a plan view showing a main adsorption table and a protection adsorption table according to an embodiment of the present invention.

1 and 2, a substrate holding apparatus according to an embodiment of the present invention includes a main adsorption table 110, at least one auxiliary adsorption table 120, 130, at least one table moving part 140, (180).

The main adsorption table (110) adsorbs a portion of the substrate (50). Here, the main adsorption table 110 includes a plurality of adsorption holes 105. The main adsorption table 110 adsorbs and fixes the central portion of the substrate 50 using a plurality of adsorption holes 105. The main adsorption table 110 can adsorb a large area of the substrate 50 more than the auxiliary adsorption tables 120 and 130.

The auxiliary adsorption tables 120 and 130 adsorb the rest of the substrate 50. The auxiliary adsorption tables (120, 130) include a plurality of adsorption holes (105). The auxiliary adsorption tables 120 and 130 are disposed adjacent to the main adsorption table 110. Here, in one embodiment, the auxiliary adsorption tables 120 and 130 may include a first auxiliary adsorption table 120 and a second auxiliary adsorption table 130 disposed with the main adsorption table 110 interposed therebetween.

The first auxiliary adsorption table 120 is disposed adjacent to one side of the main adsorption table 110. The first auxiliary adsorption table (120) adsorbs one side end portion of the substrate (50).

The second auxiliary adsorption table 130 is disposed adjacent to the other side of the main adsorption table 110. The second auxiliary adsorption table 130 adsorbs the other side end portion of the substrate 50.

Each of the first and second secondary adsorption tables 120 and 130 can move in the uniaxial direction with the main adsorption table 110 interposed therebetween. Particularly, each of the first and second secondary adsorption tables 120 and 130 moves outward in a state where one side end portion and the other side end portion of the substrate 50 are adsorbed, thereby applying tensile force to the substrate 50 Can be added.

The table moving unit 140 moves the auxiliary adsorption tables 120 and 130 in the uniaxial direction. The table moving part 140 includes at least one driving shaft 151 and 152, at least one driving shaft connecting part 161 and 162, and at least one motor part 170.

More specifically, the table moving unit 140 may include a first driving shaft 151, a second driving shaft 152, a first driving shaft connecting unit 161, a second driving shaft connecting unit 162, and a motor unit 170.

The first drive shaft 151 rotates to move the first auxiliary suction table 120. At this time, the first drive shaft 151 rotates in a predetermined direction by the motor unit 170. [ The first driving shaft 151 extends in one direction and is disposed on the back surface of the main adsorption table 110 and the first auxiliary adsorption table 120.

The second drive shaft 152 rotates to move the second auxiliary suction table 130. At this time, the second drive shaft 152 is rotated in a predetermined direction by the motor unit 170. [ The second driving shaft 152 extends in the other direction and is disposed on the back surface of the main adsorption table 110 and the second auxiliary adsorption table 130.

Each of the first drive shaft 151 and the second drive shaft 152 can be rotated in the same direction or in different directions by the motor unit 170. If they are set to rotate in the same direction, the first drive shaft 151 and the second drive shaft 152 are threaded in different directions. The first drive shaft 151 and the second drive shaft 152 are threaded in the same direction as each other.

The first driving shaft connecting portion 161 is disposed on the back surface of the first auxiliary adsorption table 120. The first driving shaft connecting portion 161 connects the first driving shaft 151 and the first auxiliary suction table 120. The first driving shaft connection part 161 may include a screw hole into which the first driving shaft 151 is inserted. The first drive shaft connection portion 161 is moved away from the main adsorption table 110 when the first drive shaft 151 is rotated in one direction and can move adjacent to the main adsorption table 110 when the first drive shaft 151 rotates in the other direction have.

And the second drive shaft connection portion 162 is disposed on the back surface of the second auxiliary absorption table 130. The second driving shaft connecting portion 162 connects the second driving shaft 152 and the second auxiliary suction table 130. The second driving shaft connecting portion 162 may include a screw hole into which the second driving shaft 152 is inserted. The second drive shaft connection portion 162 moves away from the main adsorption table 110 when the second drive shaft 152 is rotated in one direction and is moved adjacent to the main adsorption table 110 when the second drive shaft 152 rotates in the other direction Can be moved.

The motor unit 170 rotates the first drive shaft 151 or the second drive shaft 152. Here, the motor unit 170 will be described with reference to the drawings.

3 is a plan view showing a configuration of a motor unit according to an embodiment of the present invention.

3, the motor unit 170 includes a receiving portion 171, a motor 172, a first worm gear 173, and a second worm gear 174. [

The storage portion 171 accommodates the motor 172. The accommodating portion 171 can accommodate the first driving shaft 151, the second driving shaft 152, the first worm gear 173, and the second worm gear 174.

The motor 172 rotates the first drive shaft 151 or the second drive shaft 152. Here, the motor 172 may rotate the first worm gear 173 coupled to the first driving shaft 151 or the second worm gear 174 coupled to the second driving shaft 152. The motor 172 may rotate the first drive shaft 151 or the second drive shaft 152 in one direction or the other direction. The motor 172 may be, for example, a servo motor.

The first worm gear 173 is coupled to the first drive shaft 151. The first worm gear 173 can rotate in engagement with the motor 172.

The second worm gear 174 is coupled to the second drive shaft 152. The second worm gear 174 can rotate in engagement with the motor 172. [

A plurality of table moving parts 140 may be installed under the main suction table 110, the first auxiliary suction table 120, and the second auxiliary suction table 130. When one table moving part 140 moves the first auxiliary suction table 120, the first auxiliary suction table 120 is rotated by the connection of the first drive shaft 151 and the first drive shaft connection part 161, . Similarly, when one table moving part 140 moves the second auxiliary suction table 130, the first auxiliary suction table 120 is moved by the connection of the second drive shaft 152 and the second drive shaft connection part 162, Can be rotated.

4 and 5, the substrate inspection apparatus according to an embodiment of the present invention includes a plurality of table moving parts (not shown) for moving the first and second secondary adsorption tables 120 and 130 without rotating 140 may be disposed below the main adsorption table 110, the first auxiliary adsorption table 120, and the second auxiliary adsorption table 130.

Referring to FIGS. 4 and 5, the first table moving part 140 and the second table moving part 145 can move the first auxiliary suction table 120.

The first table moving part 140 includes the first driving shaft 151, the first driving shaft connecting part 161 and the first motor part 170 to move the first auxiliary suction table 120 have. Also, the first table moving part 140 can move the second auxiliary suction table 130 as well.

The second table moving part 145 may move the first auxiliary suction table 120 including the third driving shaft 153, the third driving shaft connecting part 163 and the second motor part 175. Also, the second table moving part 145 can move the second auxiliary suction table 130 as well.

Referring again to FIG. 1, the substrate pressing unit 180 applies pressure to the substrate 50 above the first and second secondary adsorption tables 120 and 130, respectively. The substrate pressing portion 180 includes a picker 190, a pad 195, a support 200, and a coupling tube 220.

The picker 190 applies pressure to the substrate 50. The picker 190 may be formed in the form of a pipe having a through hole formed therein. The picker 190 may be disposed above each of the first and second secondary adsorption tables 120 and 130.

The pad 195 is in contact with the substrate 50 to relieve the impact applied to the substrate 50. The pad 195 may be coupled to one end of the picker 190. In addition, the pad 195 may be formed of a soft material.

The support part 200 supports the picker 190. In addition, the support portion 200 moves the picker 190. Here, the support part 200 may include a support bar 201 for supporting the plurality of pickers 190 and a support bar 203 for moving the support bar 201.

The support bars 201 extend in the horizontal direction. The support bar 201 can support the picker 190 using the picker engagement member 210. Here, the support bar 201 includes a guide groove 205 into which the picker engagement member 210 can be inserted.

The guide groove 205 is formed in the longitudinal direction of the support bar 201. The guide groove 205 provides a space through which the picker engagement member 210 moves.

The picker engagement member 210 moves along the guide groove 205 in the uniaxial direction. Particularly, the picker engaging member 210 can move in the guide groove 205 according to the movement of the picker 190 vacuum-adsorbed to the substrate 50 in combination with the picker 190.

The support bar 203 is connected to a central portion of the support bar 201. The support bar 203 moves the support bar 201 up and down.

The connection pipe 220 provides a pressure to the picker 190 according to vacuum or supply. The connection pipe 220 can connect the picker 190 and an external pump (not shown).

A substrate holding apparatus according to an embodiment of the present invention includes a main adsorption table for adsorbing a central portion of a substrate, a second adsorption table for adsorbing a remaining portion of the substrate, a second adsorption table for moving a substrate, The substrate adsorbed on the auxiliary adsorption table by pressing can be fixed while the warping of the substrate is corrected.

A substrate holding apparatus according to an embodiment of the present invention fixes a substrate on an auxiliary adsorption table by using an adsorption method using vacuum, applies a tensile force to the substrate by moving a subsidiary adsorption table, presses the substrate on the substrate, And the substrate can be fixed.

The foregoing description is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention.

Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments.

The scope of protection of the present invention should be construed according to the following claims, and all technical ideas falling within the scope of the same shall be construed as falling within the scope of the present invention.

50: substrate
110: main adsorption table
120: first auxiliary adsorption table
130: Second auxiliary absorption table
140: table moving part

Claims (7)

An apparatus for fixing a substrate,
A main adsorption table for adsorbing a portion of the substrate using a plurality of adsorption holes;
A second adsorption table disposed adjacent to the main adsorption table and using the plurality of adsorption holes to adsorb the remaining portion of the substrate;
A table moving part for moving the auxiliary adsorption table in one axial direction; And
And a substrate pressing portion for applying pressure to the substrate on the upper side of the auxiliary adsorption table.
The method according to claim 1,
The table moving unit
At least one drive shaft disposed on the back surface of the main adsorption table and disposed in the unidirectional direction;
At least one drive shaft connection portion provided on a rear surface of the auxiliary absorption table and connected to the drive shaft; And
And a motor unit installed on a back surface of the main adsorption table and rotating the drive shaft.
3. The method of claim 2,
The motor unit
A motor for rotating the drive shaft;
A receiving portion for receiving the motor; And
And at least one worm gear connecting the motor and the drive shaft.
The method according to claim 1,
The substrate pressing portion
A picker for applying pressure to the substrate;
A pad coupled to the picker and in contact with the substrate;
A support for supporting the picker to move the picker; And
And a connection pipe connecting the external pump and the picker.
5. The method of claim 4,
The substrate pressing portion
And a picker engaging member for engaging the picker to the support portion.
6. The method of claim 5,
And the picker engagement member is inserted into the guide groove of the support portion and moves in the uniaxial direction.
5. The method of claim 4,
The support
A support bar for supporting the picker; And
And a support rod connected to the support bar to vertically move the support bar.
KR1020120158563A 2012-12-31 2012-12-31 Fixing apparatus for printed circuit board KR20140087841A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020120158563A KR20140087841A (en) 2012-12-31 2012-12-31 Fixing apparatus for printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120158563A KR20140087841A (en) 2012-12-31 2012-12-31 Fixing apparatus for printed circuit board

Publications (1)

Publication Number Publication Date
KR20140087841A true KR20140087841A (en) 2014-07-09

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Application Number Title Priority Date Filing Date
KR1020120158563A KR20140087841A (en) 2012-12-31 2012-12-31 Fixing apparatus for printed circuit board

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180035952A (en) * 2016-09-29 2018-04-09 삼성디스플레이 주식회사 Deposition aparatus and deposition method using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180035952A (en) * 2016-09-29 2018-04-09 삼성디스플레이 주식회사 Deposition aparatus and deposition method using the same

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