KR20140071423A - Rfid antenna modules and methods of making - Google Patents

Abstract

A tubular body portion B and a winding core WC having two ends are mounted on the module tape MT by one of its ends and a module antenna MA is wound around the winding core WC, A chip CM is disposed on the module tape MT in the winding core WC. A connection portion wb is formed and a globe-top GT is coated on the chip CM to fill substantially the inner region of the winding core WC. The module antenna MA, the winding core WC and the chip CM are sequentially overmolded with the mold mass MM. The winding core (WC) may have a flange (F) at one end.

Description

Technical Field [0001] The present invention relates to an RFID antenna module,

The present invention also relates to a method of operating in a contactless mode (ISO 14443) comprising RFID (Radio Frequency Identification) chips or chip modules (CM) and including dual interface (DI or DIF) The present invention relates to a "security document" such as an electronic passport, an electronic ID card and a smart card (data carrier) capable of operating in a contact mode (ISO 7816-2), comprising a module antenna Coupling between elements in the smart card, such as between a smart card and a booster antenna BA (inductive coupling with module antenna MA) on a card body of a smart card (CB) (CM) that interacts with an external RFID reader in accordance with the results of the improvement.

For the purpose of this discussion, an RFID transponder generally comprises a substrate, an RFID chip or a chip module (CM) disposed on or in the substrate, and an antenna disposed on or in the substrate. A transponder may form the basis of a secure document such as an electronic passport, a smart card or a National ID card, which may also be referred to as a "data carrier ".

The RFID chip CM may operate alone in a non-contact mode (such as ISO 14443), or may additionally operate to function in a contact mode (such as ISO 7816-2) (DI, DIF) chip module (CM). The RFID chip CM can obtain energy from the RF signal supplied by the external RFID reader device communicating therewith. The chip module (CM) may be a lead frame chip module or an epoxy-glass type chip module. The epoxy-glass module may be metallized on one side (contact surface) or on both sides with through-hole plating to facilitate interconnection with the antenna.

Substrates that may be referred to as "inlay substrates" (eg, for electronic passports) or "card bodies" (eg, for smart cards) include polyvinyl chloride (PVC), polycarbonate (PC) And may comprise one or more layers of materials such as polyethylene (PE), PET (doped PE), PET-G (derivative of PE), Teslin ™, paper or cotton /

An antenna, which may be referred to as a "card antenna" (CA), is mounted on the inlay substrate using a sonotrode (ultrasonic tool) and can be electrically connected to the chip module CM. See US 6,698,089 and US 6,233,818, incorporated herein by reference. A typical pattern for the card antenna CA is generally rectangular, in the form of a flat (planar) coil (spiral) with a plurality of turns, disposed at the periphery of the substrate (or its associated portion). See, for example, US 7,980,477 (2011, Finn).

Rather than directly connecting the RFID chip CM to the card antenna CA directly, the module antenna MA may include an antenna module (AM) including an RFID chip CM and a module antenna MA ). ≪ / RTI > In contrast to a card antenna (CA) (such as about 50 mm x 80 mm), the module antenna MA can be very small (such as about 15 mm x 15 mm). In such a case, the card antenna CA may be referred to as a booster antenna BA. The booster antenna BA is provided with a portion where the card main body CB is disposed around the peripheral portion and a coupler coil CC disposed in the inner region of the card main body CB for inductive coupling with the module antenna MA But may include other parts that may be. The term card antenna CA and the booster antenna BA may be used interchangeably herein.

US 20120038445 (2012, Finn) includes an antenna module (AM) having a chip module (CM) and an antenna (MA); Discloses a transponder having a booster antenna (BA) having outer and inner antenna structures (D, E) in the form of flat coils arranged around the periphery of the card body (CB). The antenna module AM may be arranged so that its antenna MA overlaps only one of the antenna structure or the second antenna structure for inductive coupling.

US 5,084,699 (Trovan, 1992), which is referred to as an impedance matching coil assembly for an inductive coupling transponder. Attention is drawn to FIG. The coil assembly for use in an inductively powered transponder includes a primary coil 156 and a secondary coil 158 wrapped around the same coil forming the ferrite rod 160. The lead 162 of the primary coil is in a floating state while the lead 164 of the secondary coil is connected to the integrated identification circuit of the transponder.

US 5,955, 723 (Siemens, 1999), referred to as a contactless chip card, describes a data carrier device including a semiconductor chip. Attention is drawn to FIG. The first conductor loop 2 is connected to the semiconductor chip 1 and has a cross-sectional area close to that of the at least one winding and the semiconductor chip. The at least one second conductor loop 3 has at least one winding, a cross-sectional area close to the dimension of the data carrier device, and a region forming a third loop 4 close to the dimension of the first conductor loop 2 . The third loop 4 inductively couples the first conductor loop 2 and the at least one second conductor loop 3 to each other.

US 6,378,774 (Toppan, 2002), referred to as IC modules and smart cards. 12a, b and 17a, b. The smart card includes an IC module and an antenna for contactless transmission. The IC module has both a contact type function and a non-contact type function. The first and second coupler coils are arranged to be coupled closely to each other and are coupled in a noncontact state by a transformer coupling. Various methods of forming the first coupler coil 8 are shown. 14, the first coupler coil 8 is wound around the coil frame 7, which is provided around the seal resin 16 of the IC chip 6.

US 7,928,918 (Gemalto, 2011), referred to as Resonant Frequency Adjustment by Controlling Distributed Inter-Turn Capacity, is a winding with a capacity between the floating spacing windings with regular spacing. Describes a method for adjusting frequency tuning.

US 8,130,166 (2012, Assa Abloy) describes a coupling device for a transponder and a smart card with the device. Attention is drawn to FIG. The coupling device is formed by a continuous conductive path having a central section 12 and two end sections 11, 11 ', and the central section 12 is at least as small as an inductive coupling with the transponder device And the distal sections 11, 11 ', respectively, form one large spiral for inductive coupling with the reader device.

US 2010/0176205 (SPS, 2010), referred to as a chip card with a dual communication interface. Attention is drawn to FIG. The card body 22 includes an apparatus 18 for concentrating and / or amplifying electromagnetic waves which is directed toward the coil of the antenna 13 of the microelectronic module 11, Lt; RTI ID = 0.0 > flow. ≪ / RTI > The device 18 for concentrating and / or amplifying the electromagnetic waves can be constructed of a metal sheet disposed in the card body 22 at the bottom of the cavity 23 housing the microelectronic module 11, And an antenna composed of at least one coil disposed in the card body 22 at a lower portion of the cavity 23 that houses the electronic module 11. [

The following patents and published patents are incorporated herein by reference and are incorporated herein by reference:

CA 2,279, 176 (1998, PAV); DE 39 35 364 (1990, ADE); DE 43 11 493 (2000, Amatech); NL 9100347 (1992, 'Nedap'); US 5,773,812 (1998, ADE); US 6,008, 993 (1999, ADE); US 6,142, 381 (2000, Finn et al.); US 6,190, 942 (2001, "PAV"); US 6,095, 423 (2000, Siemens); US 6,310,778 (2001, Finn et al.); US 6,406,935 (2002, ASK); US 6,719, 206 (2004, On Track); US 7,320,738 (2008, FCI); US 8,100,337 (2012, "SPS"); US 2008/0283615 (2008, Finn); US 2008/0308641 (2008, Finn); US 2008/0314990 (2008, Smartrac); US 20090057414; US 2002/0020903 (2002, ADE); US 20100283690 (2010, SPS); US 2011/0163167 (2011, SPS).

A tubular body portion B and a winding core WC having two ends are mounted on the module tape MT by one of its ends and a module antenna MA is wound around the winding core WC, A chip CM is disposed on the module tape MT in the winding core WC. A connection portion wb is formed and a globe-top GT is coated on the chip CM to fill substantially the inner region of the winding core WC. The module antenna MA, the winding core WC and the chip CM are sequentially overmolded with the mold mass MM. The winding core (WC) may have a flange (F) at one end.

According to an embodiment of the present invention, an antenna module (AM, 200, 400) for a smart card (SC) comprises a module tape (MT) 202, 402; Chips (CM, 210, 410) disposed on the surface of the module tape (MT); And a module antenna MA, 230, 430 disposed on the surface of the module tape MT and connected to the chip CM, wherein the support structure DS, WC, 220, And serves as a dam for the globe-top which is fixed to the surface of the module tape MT and serves as a winding core for the module antenna MA and covers the chip CM, 220 and 420 includes a tubular body portion B having two opposed open ends 220a / b and 420a / b and one end of the two ends is fixed to the surface of the module tape MT , And the other end is a free end. The support structure WC 420 may have a flange 424 disposed about the free end 420a of the body portion B. [ The module antenna MA may be disposed outside the main body portion B; The chip CM may be disposed on the module tape MT inside the main body B. At least one slot S is formed such that a corresponding at least one end of the module antenna MA passes through the main body B from the outside of the main body B to the inside of the main body B , And extend through the main body (B). The globe-tower GT may cover at least the chip CM in the support structure. The mold mass MM may cover the chip CM, the support structures DS and WC, and the module antenna MA. The contact pads CP may be disposed on opposite sides of the module tape MT for a contact interface.

The smart card SC includes a card body CB; A booster antenna BA having an outer portion disposed around the periphery of the card body CB; And a coupler coil CC disposed in an inner region of the card main body CB, and the antenna module AM may include an inductive coupling of the coupler coil CC and the module antenna MA And is disposed in the inner region of the card main body CB. A recess R may be provided in the card body CB to receive the antenna module AM. At least a portion of the coupler coil (CC) may be embedded within the recess (R).

According to an embodiment of the present invention, a method of manufacturing an antenna module comprises attaching a tubular support structure (DS, WC, 220, 420) having two opposed open ends (220a / b, 410a / b) , 402); And winding a wire for the module antenna MA around the tubular support structure DS, WC. The module antennas MA, 230, 430 may be wound using a flyer winding technique (FIG. 3). Before winding the wire around the support structure, the first end of the wire may be secured to the first pin to form the module antenna MA; The first end of the wire can pass across the first bond pad (BP) on the module tape (MT). Before winding the wire around the support structure, the second end of the wire may pass across the second bond pad (BP) on the module tape (MT); The second end of the wire may be secured to the second pin. The first and second ends may be connected to the first and second bond pads.

According to an embodiment of the present invention, a method for manufacturing an antenna module (AM, FIG. 1B, FIG. 4E) includes the steps of mounting a module antenna MA on a module tape MT; Mounting and connecting a chip (CP) to the module tape (MT); And covering the chip (CM) and its connection with a resin (GT); The chip CM and the connection portion thereof are formed by mounting the module antenna MA and mounting and connecting the chip CM and filling the inner region of the module antenna MA with a resin GT ). ≪ / RTI >

The smart card SC may include a card main body CB and an antenna module AM. The card main body CB may have a booster antenna BA including a winding disposed around the periphery of the card main body CB and a coupler coil CC disposed inside the card main body CB. The antenna module AM having the module antenna MA can be disposed in the recess of the card body CB inside the coupler coil CC and the module antenna MA can be arranged in the coupler coil CC, May be substantially coplanar with the coupler coil (CC), such as to provide a positive coupling (transformer coupling).

Reference will now be made in detail to embodiments of the invention, examples of which are illustrated in the accompanying drawings (FIGs). The drawings are generally diagrams. Some elements in the figures may be exaggerated and others may be omitted for clarity of illustration. Although the present invention has been generally described in connection with various exemplary embodiments, it is to be understood that the invention is not intended to be limited to the specific embodiments thereof, but that the various features of the various embodiments may be combined with one another. The arbitrary text (legend, note, code, etc.) appearing in the drawings is incorporated herein by reference. Some drawings can be in the form of diagrams.
Figure 1 is a cross-sectional view of a portion of a dual interface (DI) smart card (SC), also showing external "contact" and "non-contact reader devices".
Figures 1A and 1B are cross-sectional views of an antenna module (AM) that may be used in the smart card (SC) of Figure 1, in accordance with an embodiment of the present invention.
Figure 1C is a cross-sectional view of a module antenna (MA) subassembly that may be used with a portion of an antenna module (AM) disclosed herein, in accordance with the present invention.
2 is a cross-sectional view of an antenna module AM according to an embodiment of the present invention.
2A is a cross-sectional view of a dam structure element (DS) element for the antenna module (AM) of FIG.
Figures 2B and 2C are plan views of a lower portion of a module tape (MT) for an antenna module (AM), according to some embodiments of the present invention.
Figures 3 and 3a are perspective and plan views of a technique for forming module antennas (MAs) of an antenna module (AM), respectively, in accordance with some embodiments of the present invention.
4 is a cross-sectional view of a winding core (WC) in which an antenna module can be wound, according to an embodiment of the present invention.
4a-f are cross-sectional views of techniques for forming antenna modules (AMs), in accordance with an embodiment of the present invention.
5 is an enlarged cross-sectional view showing an antenna module AM installed in the card main body CB of the smart card SC.

Various embodiments will be described to illustrate the teachings of the invention and should be regarded as illustrative rather than restrictive. The dimensions and materials or processes referred to herein are to be regarded as illustrative and exemplary, unless otherwise indicated. Mainly, a secure document type transponder, which may be a smart card or a national ID card, may be discussed as an example of various features and embodiments of the invention (s) described herein. As will be appreciated, many features and embodiments may be applicable (and easily incorporated therein) to other types of secure documents, such as electronic passports. As used herein, any one of the terms "transponder "," smart card ", "data carrier ", etc. is to be construed as referring to any other device similar thereto that operates under ISO 14443 or similar RFID standards . The following standards are incorporated herein by reference in their entirety:

- ISO / IEC 14443 (Identification card - contactless integrated circuit card - proximity card) is an international standard that defines the proximity used for identification and the transmission protocol for communicating with it.

ISO / IEC 7816 is an international standard for contact electronic identification cards, especially smart cards.

The exemplary data carrier disclosed herein includes (i) an antenna module (AM) having an RFID chip or chip module and a module antenna (MA), (ii) a card body (CB) and (iii) May include a booster antenna BA disposed on the card body CB to enhance coupling between the antenna of the " reader ". When a chip module is referred to herein, it should be considered as including a "chip " and vice versa, unless expressly stated otherwise. The module antenna MA may comprise a coil of wire, a conductive trace etched or printed on a module tape (MT) substrate of an antenna module (AM), or may be integrated directly on the chip itself.

The booster antenna BA may be formed by embedding wires in the inlay substrate or the card body CB. However, in addition to wire embedding in the substrate, the antenna may also include a printed antenna structure, a coil winding technique (as described in US 6,295,720), an antenna structure formed on an individual antenna substrate and transferred to an inlay substrate (or layer thereof) Such as an additional structure or a subtractive process, such as an antenna structure, which is etched from a conductive material on a substrate layer, a conductive material deposited within a channel of the substrate layer, and the like. When an "inlay substrate" is referred to herein, it should be considered to include a "card body ", and vice versa, as well as any other substrate for security documents, unless expressly stated otherwise.

The accompanying explanation relates to the dual interface (DI, DIF) mostly for smart cards, mostly for its non-contact operation. Many of the teachings described herein may be applicable to electronic passports having only a non-contact mode of operation. In general, any of the dimensions described herein are approximate, and the materials described herein are intended to be exemplary.

Generally, the coupling between the module antenna MA and the antenna of the external RFID reader can be enhanced by incorporating a booster antenna BA on the card body CB. In some aspects, the booster antenna BA is similar to the card antenna CA. However, in contrast to a card antenna (CA) (as in US 7,980,477) that is directly electrically connected to an RFID chip or chip module, the booster antenna BA includes a module antenna MA that can be connected to the RFID chip CM Inductively coupled. Such inductive couplings are much more difficult to achieve than direct electrical connections.

The booster antenna BA (and other features) disclosed herein can increase the effective operating ("read") distance between the antenna module AM and the external non-contact reader with capacitive and inductive coupling. With a distance of typically only a few centimeters, an increase of 1 cm may represent a significant improvement.

Dual  interface( DI ) Smart cards and readers

Figure 1 shows a dual interface (DI) smart card (SC) comprising:

An RFID chip (or chip module) CM, which may be a dual interface (DI) chip or a chip module, disposed under the substrate or module tape MT (or chip carrier tape, or metal leadframe);

A plurality (such as 6) of contact pads (CP) for implementing a contact interface (ISO 7816) on the top side of the module tape (MT); And

A module antenna MA disposed at the bottom of the module tape MT, which is typically formed from an etched conductor or wire, in a spiral (coil) pattern.

- Module tape (MT) supports and influences the interconnection between the RFID chip (CM), the contact pads (CP) and the module antenna (MA), and can be a single face with metallization on one side only, Or a double-sided surface having a metallizing portion.

The RFID chip CM may be connected in any suitable manner, such as by being flip-chip bonded to the module tape MT or wire-bonded.

The RFID chip (CM) and the module antenna (MA) can be overmolded by a mold mass (MM) to protect the CM and MA elements, and the interconnections.

- As used herein, a "chip module" includes one or more bare semiconductor die (chip). A "hybrid" chip module may include a chip for a contactless interface and a chip for a contact interface. US 6,378,774 (Toppan, 2002) for an embodiment of a DIF chip solution, and US 2010/0176205 for an embodiment of two chip solutions in which one chip performs a contact function and another chip performs a contactless function (SPS, 2010).

The ferrite element (film or layer) may be embodied in the antenna module AM, between the contact pad CP and the module antenna MA, and may be attenuating, which may be caused by the conductive contact pad CP. Thereby reducing the effect.

The RFID chip (CM), the chip tape (MT), the contact pad (CP) and the module antenna (MA) together constitute the "antenna module" (AM).

The smart card (SC) further includes:

A substrate CB (for an electronic passport, the substrate will be an "inlay substrate") which may be referred to as a " card body CB "

The booster antenna BA (or card antenna CA) is shown as being arranged around the periphery of the card body CB, typically in the form of a rectangular, planar spiral having a plurality of turns.

- As used herein, the term card body CB is intended to surround any substrate that supports the booster antenna BA and accommodates the antenna module AM. The recess may be provided in the card body CB to accommodate the antenna module AM.

The smart card may be referred to as a "data carrier" or "transponder ".

Some exemplary and / or approximate dimensions, materials, and details may be as follows:

- Module Tape (MT): Epoxy-based tape, 60 μm thick

- Chip module (CM): NXP SmartMx or Infineon SLE66, or something else

- Antenna module (AM): 15 mm x 15 mm and 300 μm thick

Modular antenna (MA): several windings of approximately 50 mu m copper wire, approximately encircling the chip module (CM), approximately the size (and not greater than AM in size) of the chip module (CM).

- Card body (CB): approx. 54 mm x 86 mm, 300 μm thick, polycarbonate (PC). The card body and its card antenna are considerably larger (such as 20 times) than the chip module (CM) and its module antenna (MA).

- Booster antenna (BA): 3-12 turns of a 112 μm copper, self-bonding wire that is ultrasonically embedded in the card body (CB). Alternatively, the booster antenna BA may include a helical pattern of approximately 46 mm x 76 mm (slightly smaller than the card), representing a resonant frequency of 13.56 MHz, an insulated 80 micrometer copper wire disposed at a pitch of 300 micrometers of winding have. The optimized self-resonant frequency of the booster antenna BA may be approximately 13-17 MHz.

An example of a booster antenna having an outer section forming a large helix 11, 11 'and a central section forming a small helix 12 can be seen in US 8,130,166 (2012, "Assa Abloy) The large helix can be compared (or similar) to the BA in Figure 1, and the small helix can be compared to the CC in Figure 1.

An example of a booster antenna having an antenna coil 4 and a coupler coil 3 can be seen in US 6,378,774 (2002, "Toppan"), incorporated herein by reference. The antenna coil can be compared (or similar) to BA in FIG. 1 and the coupler coil can be compared to CC in FIG.

The present invention is not limited to the use of any particular booster antenna, but rather relates to the antenna module (AM) and its manufacturing details.

A material exhibiting electromagnetic coupling characteristics such as ferrite may be disposed as a thin film on the surface of the card body CB to improve the coupling between the module antenna MA and the booster antenna BA, In a pattern, as particles in the card body, or both (film and particle). The use of ferrite as a material for improving coupling or for shielding (preventing) coupling is discussed here as an example of a material exhibiting high electromagnetic permeability, which is often used in various forms with antennas. See, for example, US 5,084,699 (Trovan).

Additional layers (not shown), such as a cover layer, may be laminated to the card body to complete the configuration of the smart card.

The antenna module AM is located within the card body CB so that its module antenna MA overlaps or lies in a substantially same plane with or at a different level from the coupler coil CC, For example, in a milled recess. See, for example, US 6,378,774 (2002, Toppan), incorporated herein by reference in its entirety.

Figure 1 shows a contact reader having contacts for interacting (providing power and exchanging data) with the chip module CM via a contact pad CP in a contact mode (ISO 7816) ISO 14443) further comprises a contactless reader having an antenna for interacting with a chip module (CM) via a booster antenna (BA) and a module antenna (MA).

Antenna module ( AM )of Example

1A shows an antenna module AM having an RFID chip (CM) 110 and a winding wire module antenna (MA) 130, both of which are bonded to a lower surface of a module tape (MT) And may be wire-bonded to the pad (BP) Especially,

An epoxy glass substrate (MT) 102 includes a plurality of contact pads (CP) 104 for forming a contact interface with an external reader during "contact mode" operation on its top MT having a plurality of bond pads (BP) (BP) (106) (BP) disposed on opposite sides of a module tape (102);

The chip (CM) 110 is mounted on a lower portion (when viewed) of the module tape (MT) 102, for example, by a terminal CT (CT) connected to a selected one of the bond pads (Viewed) of a module tape (MT) 102 having a plurality of module tapes (110a, 110b). For illustrative clarity, only two wire bond connections 114a, 114b are shown.

A module antenna (MA) 130 includes several wire turns, such as a 3x6 configuration (three layers, each layer having six turns), and two ends 130a and 130b ). As shown, the module antenna 130 may be connected to a bond pad (BP) 106 on the lower portion of the module tape (MT) 102, such as by its ends 130a, 130b, which may be thermocompression bonding.

After the module antenna MA is mounted on the module tape MT and the chip CM is mounted on the module tape MT in order to protect the wire bond between the chip module CT and the bond pad BP, The inner area of the module antenna MA can be filled with the resin GT and the module antenna MA can be filled with the resin GT (either before or after the mounting of the module antenna MA) As a "dam" See FIG.

The module antenna MA and its ends as well as the chip CM and its connections (which may already be covered with resin GT) can be overmolded with a mold mass MM.

A group of the aforementioned elements, generally module tapes (MT) 102, chip modules (CM) 110 and module antennas (MA) 130 can be referred to as "antenna modules" (AM) have.

FIG. 1C illustrates a module antenna MA, or coil subassembly 130, which may be used as an antenna module described herein, such as but not limited to the antenna module of FIG. 1A. The coil 112 of the wire for the module antenna MA may be wound using any suitable coil winding tool and disposed on the film support layer 132. The module antenna MA may comprise a turn of several wires and may be in the form of a ring (cylinder) having an inner diameter (ID) of about 9 mm and an outer diameter (OD) of about 10 mm. Lt; / RTI >

The film support layer 132 can be a 60 탆 thick nitrile film and can be about 10-15 mm x 1015 mm or about twice the size of a module antenna MA that can be mounted thereon Lt; RTI ID = 0.0 > dimension). ≪ / RTI > The central aperture 134 can be provided through the film 132 and is generally aligned with the location of the module antenna MA and has a directivity that is approximately the ID size of the module antenna MA. The opening 134 may be formed by a punching operation. The opening 134 is for receiving the chip CM (such as 110 in FIG. 1A) and its wire bond when the antenna module AM is assembled.

The two openings 136a and 136b are respectively connected to the film 132 to accommodate the bonding of the antenna wire ends 112a and 112b to the bond pads BP (106 in Fig. 1A) on the module tape (MT) (In the same punching operation as in the central opening 134).

The release liner 138 may be provided on one side of the film 132, such as a side facing the module antenna MA. The central opening 134 may or may not extend through a release liner 138 having a thickness of about 60 microns, which may be paper.

After being mounted on the module tape MT and after the chip (CP) 110 is mounted and connected, the module antenna (MA) 112 can be filled with resin to protect the chip CM and its connections have. The module antenna MA may be connected prior to connecting the chip CM to prevent damage to the CM connection.

In the dam structure, Winding

 Figure 2 shows a dam structure (or simply a "dam") (DS) dam structure 220 disposed at the bottom of the module tape (MT) , As an adhesive). (The module tape (MT) 202 is shown inverted as opposed to Figures 1 and 1A, and the contact pad (CP) 204 is at the bottom as viewed in this figure.)

Can be referred to as a dam (DS) 230, a "winding core WC" or a "support structure" or simply a "ring" 230b, and may be cylindrical (as shown) or substantially rectangular (or any other suitable shape). One end portion 230b of the main body portion B is mounted on the module tape MT using a suitable adhesive and the other end portion 230a is a free end portion (not mounted). The dam DS may be formed of a plastic material such as Mylar and has a thickness t of about 200 mu m. The inner diameter ID of the dam DS may be about 7 mm, and the outer diameter of the dam DS may be about 8 mm.

The cross section of the dam DS may be substantially rectangular or otherwise suitably shaped (to wind the module antenna MA thereon), where "ID" And "OD" can be an external dimension of the main body B.

A module antenna MA (230) having several layers and turns of magnetic bonding wires can be wound on the dam DS. The dam DS has at least the height of the module antenna MA obtained, The dam DS can be impregnated with ferrite to increase the inductance of the module antenna MA while a fixture (not shown) The resulting intermediate product comprising the module antenna MA and the dam DS mounted on the module tape MT may be considered to be a subassembly for the antenna module AM. The two ends a and b (compare 112a and 112b) of the module MA are connected to a bond pad (BP) 206 (compare 106) on the surface of the module tape MT, .

The RFID chip (CM) 210 (compare 110) can be sequentially mounted on the surface of the module tape MT inside the dam DS and the module tape MT And is wire-bonded to a bond pad (BP) on the lower side (upper side in FIG. 2). Next, a glob-top potting compound GT (not shown) may be added to the interior of the dam DS to protect the chip CM and wire bonds, Thereby forming a module (AM) 200. The RFID chip CM and the module antenna MA are used to protect the individual interconnections to the bond pads BP on the chip CM and the module MA components and the module tape MT to complete the antenna module AM Mold (MM) (not shown, see Fig. 1).

Figure 2a shows a module antenna MA wire (not shown) passing through and into at least one slot (S) 232 in an "inner" space surrounded by a dam DS from the outside to the body portion B, Through the body portion B of the dam DS (winding core WC) to receive the corresponding at least one end a, b of the winding core WC. The end portions a and b of one or both of the module antennas MA can be extended inwardly through one or two slots in the body portion B (at another level, The ends a and b terminate in the area on the module tape MT. The slot (s) S must be sized (wide enough) to accommodate the diameter of the antenna wire passing therethrough. Having the end of the antenna wire terminating internally to the dam DS has the advantage that they can be protected by the same gob-tower GT protecting the chip CM (see Fig. 4E).

35 mm chip carrier  The antenna modules formed on the tape

Figure 2B illustrates a technique for forming one of many module antennas MA on a winding core WC on a 35 mm chip carrier tape (module tape MT). The two ends a and b of the modular antenna MA are connected to a winding core WC for bonding to a bond pad BP disposed on a module tape MT which is internal to the winding core WC, Lt; / RTI > through one or more slots in the base station). Alternatively, the winding core WC may be omitted and the module antenna MA may be an air-core coil.

2C illustrates a technique for forming one of many module antennas MA on a winding core WC on a 35 mm chip carrier tape (module tape MT). The two ends a and b of the module antenna MA are connected to the outside of the winding core WC by means of an external . ≪ / RTI > Alternatively, the winding core WC may be omitted and the module antenna MA may be an air-core coil.

Illustrates a technique for forming modular antennas (MA's) on winding cores (WCs), for example, 35 mm chip carrier tape (module tape MT). The two ends of the module antenna MA can extend outward and are connected to the bonding pads BP on the module tapes MT outside the winding cores WC. Alternatively, the winding core (WC) may be omitted and the module antenna may be an air-core coil.

2B and 2C, a square pad is shown for receiving the chip CM. A number of small bond pads are shown inside the winding core WC, internally connected to the module tape with respect to the contact pads CP (not shown) on the face-up side of the module tape MT, Terminals can be wire bonded thereto and a globe-top filling of the winding core (WC) for protecting the wire bonds can be involved. In Figs. 2B and 2C, some interconnects are shown and others may be omitted for illustrative clarity.

pliers ( Flyer ) Coil Winding

Fig. 3 shows a plurality (about five (5) pieces of wafers) of the type shown in Fig. 2C wound on the winding core WC on a 35 mm chip carrier tape (module tape MT) ≪ / RTI > The winding cores (WC) can be arranged in two rows, and the two winding cores (WC) are conveniently fitted side by side across the width of the 35 mm carrier tape. The 35 mm chip carrier tape can advance along the stage and stop to have a plurality (say, 2) of module antennas MA wound around it at once. A number of reciprocal "fixed" pins of a number (say 15) extend from the stage, adjacent to a 35 mm carrier tape, on both sides thereof, each pin pair being associated with each of the winding cores WC. Fewer (e.g., fewer) nozzles may be provided for feeding and winding wires for the module antenna MA around the same number of wire cores WC (e.g., 2).

In general, to form a given modular antenna MA, the nozzle may first cover the first end of the wire around the first pin pair to lock (anchor, "fix") the first end of the wire to the first pin- do. Next, the nozzle moves toward the winding core WC, and the first end portion of the wire extends (passes) (crosses) on the first two bond pads BP on the module tape MT. The nozzle then "plies" (orbits) around the winding core WC and winds the wire around the winding core WC a number of times (say 20) Flyer "winding technology. After completing the turn of the designated number (say 20), the nozzle head moves away from the winding core WC, the second end portion of the wire passes over the second two bond pads for the module antenna MA, The second end of the wire is fixed (bundled) with respect to the pin pair. Next, the end portions of the wires passing over the two bond pads BP for the module antenna MA can be bonded to the respective bond pads.

Before bonding the end portions of the module antenna BP, it may be convenient to first form a plurality of module antennas MA. Note that several / (six) module antennas MA are already formed and their two end portions extend over the bond pads BP and are tied to the corresponding pin pairs. Next, in a sequential step, an end portion of the module antenna MA may be bonded (e.g., using a thermal pad) to each bond pad BP. After completion of the formation of the module antenna MA, the remaining part of the end of the wire (between the bond pad BP and the associated pins) can be cut, the pins are withdrawn, and the wire removed by the suction system is discarded.

The formation of module antennas MAs and the bonding of these end portions to the respective bond pads BP can be performed before inserting the chip CM on the module tape MT. By completing these steps (e.g., see FIG. 4D) prior to wire bonding the chip CM, the wire bonds for the chip CM will not be disturbed during the bonding of the ends of the module antenna MA.

The flyer winding technique shown in Figure 3 is applicable to winding the module antenna MA on the dam structure of Figure 4 as well as the dam structure DS of Figures 2 and 2a.

The following patents relating to flyer technology are incorporated herein by reference:

US 5,261,615 (1993, Gustafson); US 5,393,001 (1995, Gustafson); US 5,572,410 (1996, Gustafson); US 5,606,488 (1997, Gustafson); US 5,649, 352 (1997, Gustafson)

FIG. 3A illustrates some additional details and / or alterations (s) to the techniques described above. The rows of four formed antenna modules AMs are shown arranged along one side of a 35 mm carrier tape. A plurality of tubular, open-ended support structures WC, DS are located at corresponding sites to form a corresponding plurality of antenna modules AMs. A plurality of reciprocating fixation pins for wire ends are incorporated within the shuttle (stage). These pin pairs (categorized as #a and #b) are placed adjacent to the carrier tape at each corresponding site for the antenna modules. An exemplary method of forming a sequence of module antennas (MAs) for antenna modules (AMs) may include some or all of the following steps,

The wire can be clamped by a clamping mechanism.

- The wire is then guided by the nozzle past the first pin 1a of the first pair of rotatable fixing pins 1a, 1b associated with the first antenna modules AMs (shown at the right) .

The winding nozzle may be controlled by an x-y servo system (not shown).

- The wire can then be guided through the first opening in the shuttle to the first winding core (WC) associated with the first antenna module (AM).

The openings in the shuttle can facilitate cutting (occurring later) of the wire during bonding.

- The nozzle then moves around the orbit around the winding core WC and forms a turn of the wire of a predetermined number (say 20) for the module antenna MA.

The nozzle then passes through the edge of the 35 mm carrier tape and through the second opening in the shuttle and is guided out to the second pin 1b of the first pair of retrievable pins associated with the first antenna module.

Next, rather than securing the wire to the second pin 1b, the nozzle is moved toward the first pin 2a of the next pin pair 2a, 2b associated with the next (right to second) antenna modules, And guides the wire partially (e.g., about 90 degrees) around the pin 1b. The partial winding of such a wire will be sufficient to anchor (secure) the wire to the pin 2a.

- Next, the nozzle directs the wire around the pin (2a) towards the wire core of the second (right) antenna module through the other opening in the shuttle.

- The nozzle then moves around (orbits around) the second winding core WC and forms a turn of a predetermined number (say 20) of wires for the module antenna MA.

The above-described steps (the nozzle is guided outward through the opening in the shuttle to the second pin of the next pair of recoverable pins, to the outside with the first pin of the next pair of recoverable pins, ) And passes through the opening in the shuttle and is guided inward by the next winding core or the like) continues until the final winding core is wound with the module antenna MA. Next, the wire may be tied around the second pin 4b of the last pair 4a, 4b of the recovery pin (by the nozzle).

In Figure 3a, the nozzle terminates in a third (on the right) winding core and is shown facing the second pin of the pin pair 3a, 3b associated with the antenna module site.

Then, as described above with reference to Fig. 3, the end portion of the wire passing through each bond pad BP can be bonded.

In the final step, the pin is withdrawn and the residual wire is removed.

Single flange Winding  core

4 shows a winding core (WC) 420 on which the module antenna MA can be wound. The winding core (WC), which may be referred to as a "support structure ", may be made of a polyplastic material such as glass fiber reinforced PPS (polyphenylene sulfide). Like the dam structure DS, the winding core WC may be in the form of a circular or substantially rectangular cross section, and a ring or tubular structure with two opposed open ends 420a and 420b, (Attached) to the bottom of the module tape MT, and the other open end is a free end (not mounted).

The winding core WC includes a main body portion B 422 and a flange portion F extending radially outwardly from the free end of the body portion B ) ≪ / RTI > (This is in contrast to the dam (DS) 220 where the ends of both are essentially equal to one another.)

The flange F serves to restrict the winding of the module antenna MA since the body portion B is cured and wound. The flange F functions as one flange of the "bobbin" and the surface of the module tape MT functions as the second flange of the "bobbin ". The module antenna MA will be wound on the coil winding area between the two "bobbin" flanges. Fig. 4 shows a part of the module tape MT with a dotted line (broken line), and a coil winding area formed between the flange F and the lower surface of the module tape MT. (The module tape MT may be copper-coated epoxy-glass on both sides, etched to form bond pads BP on the face-up side lower contact pads CP).

The winding core (WC) 420 may have the following dimensions (approximately):

- thickness (t) of the main body portion B = - 0.85 mm

- width (fw) of flange (F) = ~ 0.5 mm

- OD (including flange F) of the winding core WC = ~ 9.4 mm

- inner diameter of winding core (WC) = ~ 6.7 mm

- Height of coil winding area (h1) = ~ 0.250 mm

- the height of the flange (F) (h2) = ~ 0.100 mm

- Overall height (h3) of body portion (B) = ~ 0.350 mm

The coil winding area between the flange F and the surface of the module tape MT can accommodate about twenty turn of 112 mu m diameter self-bonding wires for the module antenna MA. A wire having a different diameter, 112 탆 or more, can be used for the module antenna MA.

The method of forming the module antenna MA 430 on the winding core WC further includes the steps of forming the antenna module AM described in relation to Figures 4A-4F and generally includes:

- Fixed WC to MT

- MA winding on WC

- Adhesive distribution for CM

- CM placement, adhesive curing (self-bonding wire curing)

- Wire bonding (CM and MA for BP on MT)

- Globe top filling the inside of WC (covering CM)

- Overmold of MA, WC, CM.

4A shows a first step, wherein the winding core (WC) 420 may be secured to the module tape MT using, for example, an adhesive. The adhesive may be applied to one of the ends 420b of the winding core WC or the surface of the module tape MT. The final thickness of the adhesive can be about 30 占 퐉. Alternatively, the winding core WC may be secured to the module tape by, for example, spin-welding (friction welding technique) without adhesive. In the manufacturing process, a winding core WC (or simply "ring") is wound around a 35 mm carrier tape (in a winding core (WC), or in preparation of the winding of a module antenna MA in a dam Can be arranged in a plurality of positions along the axis of the ring. This step can be referred to as "ring placement ".

Contact pads CPs for the contact interface (with an external reader) are shown as being on the face-up (bottom, lower) surface of the module tape MT for a dual interface (DI) antenna module AM . However, it should be understood that the present invention can be practiced in the context of an antenna module (AM) that operates only in a non-contact mode, without such a contact pad (CP).

Figure 4b shows a winding core (WC) attached (assembled, mounted) to the module tape (MT). The coil winding area is formed between the flange F and the surface of the module tape MT. In this and subsequent figures, the adhesive is omitted for illustrative clarity.

4C shows the next step in which a module antenna MA 430 is mounted on the winding core WC around the body portion B in the coil winding area between the flange F and the surface of the module tape MT It is wound. This can be done in the manner shown and described with reference to FIG. 3 (using the "flyer" winding technique). Other coil winding techniques may be used to form the coils of the module antenna MA. The ends a and b of the module antenna MA, which extend outward from the winding core WC, can be connected to the respective bond pads BP at this stage. Although not shown, the winding core 420 may be configured to extend at least one of the ends of the module antenna MA to a bond pad BP disposed within the winding core WC, May have at least one slot (S), similar to slot (S).

The coils (turns) of the wires may not be arranged so neatly as shown. Nevertheless, the coil (turn) of the wire is limited within the coil winding area by the flange F and the surface of the module tape MT as shown. The module antenna MA comprises two twenty ends of the wire in the coil winding area and two ends a and b extending over the respective bond pads BP on the surface of the module tape MT .

Fig. 4D shows the next step in forming the antenna module MA, in which the chip CM is installed in the inner region of the winding core WC. Next, a wire bond wb may be formed between the selected one of the bond pads BP on the surface of the module tape MT and the terminals 110a, 110b of the chip 110. The ends a and b of the module antenna MA can also be bonded to a selected one of the bond pads BP on the surface of the module tape MT at this stage if they are not previously connected.

Figure 4e illustrates the next step wherein the interior region of the winding core WC may be filled with a globe-top potting compound GT or the like to protect the chip CM and the wire bonds wb. If heat is applied to cure the globe-top GT, the heat may also cause the self-bonding wires forming the turns (coils) of the module antenna MA to stick to one another.

Fig. 4F shows the next step in which a mold mass MM is connected to a module antenna MA, ends a and b of the module antenna MA, a winding core WC, a globe-top GT CM) and over wire bonds (by obomorphing). The mold mass MM can be extended over the outer edge (lip) of the flange F, but slightly into the coil winding area (except where the wire is present), which helps maintain the mold mass MM in place . When the dam structure DS (Fig. 2), which is attached at one end to the module tape MT, is used in place of the winding core WC to a lesser extent, the mold mass MM is also supported ).

A method for forming a module antenna MA for the antenna module AM described above is disclosed in which a coil wound around a core frame or core having a flange mounted around the epoxy resin to protect the wire bond to the die and the die 14) Can be compared with Toppan '744. For example, in the above-described technique (Figs. 4A-4F) ...

The winding core WC has only one flange (the other "virtual" flange at the opposite open end of the support structure is the surface of the module tape MT)

The tubular support structure WC, DS may serve as a dam for receiving a subsequently applied globe-top (GT) resin,

The chip CM can be installed after the module antenna MA is formed on the module tape MT (and the wire bond for the chip CM is executed after bonding the end of the module antenna MA) .

5 shows an antenna module AM that can be the antenna module 200 of FIG. 2 or the antenna module 400 of FIG. 4, wherein an outer portion of the antenna module AM (R) in the card body CB of the smart card SC having the coupler coil CC in the inner region of the cage body surrounding the booster antenna BA and the recess R, for example, . At least a portion (including all) of the turns of the coupler coil CC is embedded in the bottom of the recess R to enhance inductive (transformer) coupling between the coupler coil CC and the module antenna MA. . A channel or a wide trench for receiving turns of the wire under the recess R may be formed by laser ablation.

Although the present invention (s) has been described with respect to a limited number of embodiments, they should not be construed as limitations on the scope of the invention (s), and should be construed as examples of some of the embodiments. Those skilled in the art will be able to contemplate other possible variations, modifications and implementations within the scope of the invention (s) based on the invention (s) described herein.

Claims (15)

In an antenna module (AM, 200, 400) for a smart card (SC)
Module tapes (MT, 202, 402);
Chips (CM, 210, 410) disposed on the surface of the module tape (MT); And
And a module antenna (MA, 230, 430) disposed on the surface of the module tape (MT) and connected to the chip (CM)
The support structure (DS, WC, 220, 420) is fixed to the surface of the module tape (MT) to serve as a winding core for the module antenna (MA) In addition,
The support structure (DS, WC, 220, 420) includes a tubular body portion (B) having two opposed open ends (220a / b, 420a / b), one end of the two ends Is fixed to the surface of the antenna (MT), and the other end is a free end. The method according to claim 1,
Characterized in that the support structure (WC) 420 has a flange (F) 424 disposed around the free end 420a of the body portion (B). The method according to claim 1,
The module antenna MA is disposed outside the main body portion B;
The chip CM is disposed on the module tape MT inside the body portion B;
And at least one corresponding end of the module antenna MA is extended through the main body portion B so as to pass through the main body portion B from the outside of the main body portion B to the inside of the main body portion B, And at least one slot (S) to which the antenna is connected. The method according to claim 1,
Further comprising a glove-top (GT) covering at least the chip (CM) in the support structure. The method according to claim 1,
Further comprising a mold mass (MM) covering the chip (CM), the support structure (DS, WC) and the module antenna (MA). The method according to claim 1,
Further comprising a contact pad (CP) on an opposite side of said module tape (MT) for a contact interface. The method according to claim 1,
A card body CB;
A booster antenna BA having an outer portion disposed around the periphery of the card body CB; And
And a coupler coil (CC) disposed in an inner region of the card body (CB)
Wherein the antenna module AM is disposed in an inner region of the card body CB for inductive coupling of the coupler coil CC and the module antenna MA. 8. The method of claim 7,
A recess (R) is provided in the card body (CB) for receiving the antenna module (AM). 9. The method of claim 8,
Wherein at least a portion of the coupler coil (CC) is embedded within the recess (R). A method of manufacturing an antenna module (AM), comprising:
Attaching a tubular support structure (DS, WC, 220, 420) having two opposed open ends (220a / b, 410a / b) on the surfaces of module tapes (MT, 202, 402); And
And winding a wire for a module antenna (MA) around the tubular support structure (DS, WC). 11. The method of claim 10,
Further comprising the step of winding the module antennas (MA, 230, 430) using a flyer winding technique (FIG. 3). 11. The method of claim 10,
Before winding the wire around the support structure,
Securing a first end of the wire to the first pin to form the module antenna MA; And
Further comprising the step of passing a first end of the wire across a first bond pad (BP) on the module tape (MT). 13. The method of claim 12,
Before winding the wire around the support structure,
Passing a second end of the wire across a second bond pad (BP) on the module tape (MT); And
Further comprising fixing the second end of the wire to the second pin to form the module antenna MA. 14. The method of claim 13,
And connecting the first and second ends to the first and second bond pads. ≪ RTI ID = 0.0 > 11. < / RTI > A method for manufacturing an antenna module (AM, FIG. 1B, FIG. 4E)
Mounting a module antenna (MA) on the module tape (MT);
Mounting and connecting a chip (CP) to the module tape (MT); And
Covering the chip (CM) and its connection with a resin (GT);
The chip CM and the connection portion thereof are formed by mounting the module antenna MA and mounting and connecting the chip CM and filling the inner region of the module antenna MA with a resin GT ). ≪ / RTI >

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