KR20140070071A - Apparatus for supplying a substrate - Google Patents

Apparatus for supplying a substrate Download PDF

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Publication number
KR20140070071A
KR20140070071A KR1020120138121A KR20120138121A KR20140070071A KR 20140070071 A KR20140070071 A KR 20140070071A KR 1020120138121 A KR1020120138121 A KR 1020120138121A KR 20120138121 A KR20120138121 A KR 20120138121A KR 20140070071 A KR20140070071 A KR 20140070071A
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KR
South Korea
Prior art keywords
substrate
heater block
vacuum
die bonding
die
Prior art date
Application number
KR1020120138121A
Other languages
Korean (ko)
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KR101422357B1 (en
Inventor
정연혁
김동진
김재용
Original Assignee
세메스 주식회사
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Priority to KR1020120138121A priority Critical patent/KR101422357B1/en
Publication of KR20140070071A publication Critical patent/KR20140070071A/en
Application granted granted Critical
Publication of KR101422357B1 publication Critical patent/KR101422357B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Abstract

The present invention relates to an apparatus to supply a substrate to bond a die in a die bonding process, including: a heater block to heat the substrate; a fixed rail arranged on one side of the heater block to support and guide one portion of the substrate to move the substrate via the heater block; variable rails arranged in parallel with the fixed rail on the upstream and downstream of the heater block to support the other side of the substrate, while being vertically movable about the moving direction of the substrate; and a substrate transfer unit to move the substrate. Accordingly, the heater block does not need to be replaced in a situation wherein the width of the substrate changes.

Description

[0001] APPARATUS FOR SUPPLYING A SUBSTRATE [0002]

Embodiments of the present invention relate to a substrate supply apparatus. More particularly, the present invention relates to an apparatus for supplying a substrate to be die-bonded, such as a lead frame, a printed circuit board and the like, in a die bonding process.

Generally, in a die bonding process, a die pick-up unit for picking up and transporting the dies from a wafer to bond individualized dies to the substrate through a sawing process and a die feeder for feeding the substrate to which the die is to be bonded can be used.

The die supply apparatus may include transferring rails for transferring a substrate to be subjected to a die bonding process, and a substrate transferring unit for holding and moving the substrate. In particular, it is desirable to preheat the substrate to a constant temperature when pressing the die on the substrate to perform the die bonding process. To this end, the substrate supply device may include a heater block for heating the substrate in a bonding area where the die bonding process is performed.

The heater block may be disposed between the transferring rails and the substrate may be moved onto the heater block by the substrate transferring unit. However, since the size of the substrate can be changed in various ways, the size of the heater block must be changed according to the size of the substrate. To this end, it is troublesome to mount a new heater block after disassembling the substrate supply device .

In order to solve the above problems, Korean Patent Laid-Open Publication No. 10-2007-0081378 discloses a conveyor for semiconductor bonding, which includes a fixed rail and a movable rail configured to adjust a width of a conveyance path according to a width of the substrate. According to the related art, the heater block can be mounted on the movable rail, and when the width of the conveyance path is adjusted by the movable rail, the heater block is configured to be movable under the fixed rail.

However, according to the related art, since the heater block is disposed to be spaced apart from the substrate by a predetermined distance, there is a problem that it is difficult to fix the substrate at the time of bonding the die and a pressing force for die bonding can not be sufficiently applied. The heater block moves through the lower portion of the fixed rail, thereby causing a restriction on the space for disposing the substrate transferring portion for moving the substrate.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a new type of substrate supplying apparatus capable of adjusting the width of the substrate transfer path according to the width of the substrate.

According to an aspect of the present invention, there is provided an apparatus for supplying a substrate to be die-bonded in a die bonding process, the apparatus comprising: a heater block for heating the substrate; A fixing rail disposed on an upstream side and a downstream side of the heater block for supporting and guiding one side of the substrate to move the substrate via the heater block, And a substrate transferring unit for moving the substrate. The substrate transferring unit may be configured to move the substrate in a direction perpendicular to the moving direction of the substrate.

According to embodiments of the present invention, the heater block may extend in a direction perpendicular to the moving direction of the substrate.

According to embodiments of the present invention, the heater block may include a plurality of regions each including at least one vacuum hole for adsorbing the substrate.

According to embodiments of the present invention, the apparatus may further include a vacuum supply unit coupled to the vacuum holes of the areas and selectively providing a vacuum to the areas.

According to embodiments of the present invention, the substrate transferring portion may include a gripper for gripping the substrate between the fixing rail and the heater block, and a gripper driving portion for moving the gripper in a moving direction of the substrate .

According to embodiments of the present invention, a height adjusting unit for adjusting the height of the heater block may be further provided.

According to the embodiments of the present invention, a guide member connecting the variable rails and guiding the movement of the substrate on the heater block may be further provided.

According to embodiments of the present invention, the upper edge portion of the downstream variable rail adjacent to the heater block can be chamfered.

According to embodiments of the present invention, the unloader in which the loader in which the first magazine accommodating the plurality of substrates to be subjected to the die bonding process are disposed and the unloader in which the second magazine in which the substrates having completed the die bonding process are disposed, .

According to embodiments of the present invention as described above, an apparatus for supplying a substrate in a die bonding process includes a fixed rail and a heater block, and a heater block disposed on an upstream side and a downstream side of the heater block, And may include variable rails movably disposed in the width direction of the substrate for adjustment. Therefore, even when the width of the substrate changes, it is not necessary to replace the heater block, so that the operating rate of the die bonding equipment including the substrate supply device can be greatly improved.

Particularly, since the variable rails can move separately from the heater block on the upstream side and the downstream side of the heater block, the mounting space of the substrate transferring part can be ensured in a relaxed manner compared to a method of moving the heater block in the prior art. Further, since the heater block can be moved in the vertical direction, that is, the height of the heater block can be easily adjusted, the substrate can be firmly fixed to the substrate when the die bonding process is performed, and the substrate can be fixed using vacuum. So that the defective process can be sufficiently reduced.

In addition, by arranging the vacuum holes in the heater block which can be vacuum-controlled individually for each region, the fixing of the substrate can be more stably performed.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram for explaining a substrate supply apparatus according to an embodiment of the present invention; FIG.
2 is a schematic side view for explaining the substrate supply apparatus shown in FIG.
3 is a schematic diagram for explaining the die bonding equipment shown in FIG.
Fig. 4 is a schematic sectional view for explaining the heater block shown in Fig. 1. Fig.
Figs. 5 and 6 are schematic plan views for explaining the operation of the variable rails shown in Fig.
Figs. 7 and 8 are schematic side views for explaining the operation of the heater block shown in Fig.

Hereinafter, a head replacement apparatus and a die bonding system including the head replacement apparatus according to embodiments of the present invention will be described in detail with reference to the accompanying drawings. The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are enlarged to illustrate the present invention in order to clarify the present invention.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a part or a combination thereof is described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

FIG. 1 is a schematic structural view for explaining a substrate supply apparatus according to an embodiment of the present invention, and FIG. 2 is a schematic side view for explaining a substrate supply apparatus shown in FIG.

1 and 2, a substrate supply apparatus 100 according to an embodiment of the present invention picks up a die 20 from a wafer 10 divided into a plurality of dies 20 by a dicing process, To feed the substrate 50 in a die bonding process that bonds to a substrate 50, such as a lead frame or printed circuit board.

The substrate supplying apparatus 100 may be disposed at one side of the wafer stage 60 in which the wafer 10 is disposed in the die bonding facility 1 and the die 20 is moved by the die transferring unit 80 And transferred from the wafer 10 onto the substrate 50. Although the die bonding equipment 1 is constructed in a very simple manner, the configuration of the die bonding equipment 1 can be variously changed. Therefore, the wafer stage 60, the die transfer unit 80, The scope of the present invention is not limited by the configuration.

3 is a schematic diagram for explaining the die bonding equipment shown in FIG.

Referring to FIG. 3, the wafer 10 may be provided with the plurality of dies 20 attached to the dicing tape 30. For example, the dicing tape 30 may be mounted on a mounting ring 40 of a generally circular ring shape, and the die bonding apparatus 1 may include a wafer stage 60 for supporting the wafer 10, . ≪ / RTI >

A clamp 62 for gripping the mounting frame 40 may be provided on the wafer stage 60 and the dicing tape 30 may be provided on the wafer stage 60 by an extension ring 64 disposed on the wafer stage 60, Lt; / RTI > In particular, the extension ring 64 can support the edge portion of the dicing tape 30 between the wafer 10 and the mounting frame 40, and the clamp 62 supports the dicing tape 30, The mounting frame 40 can be moved downward to expand the mounting frame 40. [ Although not shown in detail, a clamp driving unit (not shown) for moving the clamp 62 in the vertical direction may be mounted on the wafer stage 60, and the dicing tape 30 may be extended, The distance between the first and second electrodes 20 can be enlarged.

A lower portion of the wafer stage 60 may be provided with a die ejector 70 for selectively lifting the dies 20 to separate the dies 20 from the dicing tape 30, The die 20 lifted by the die ejector 70 can be picked up by the die feeder 80 and then transferred. To this end, the wafer stage 60 may have an opening for operation of the die ejector 70 as shown. The die transferring unit 80 may include a pick-up unit 82 for picking up the die 20 using vacuum and a separate drive unit 84 for moving the pick-up unit 82.

Referring again to FIGS. 1 and 2, the substrate supply apparatus 100 may include fixed rails 102 and variable rails 104A and 104B arranged parallel to each other. According to an embodiment of the present invention, the substrate 50 can be moved in the extending direction of the fixed rail 102 and the variable rails 104A and 104B, A region where the die 20 is bonded on the substrate 50 may be positioned.

Particularly, in the die bonding region, a heater block 110 for heating the substrate 50 to a predetermined temperature may be disposed, and the variable rails 104A and 104B may be disposed on the heater block 110 For example, on the upstream side and the downstream side of the conveyance path of the substrate 50, respectively. As an example, a heater (not shown) such as an electric resistance heating wire may be disposed inside the heater block 110 to heat the substrate 50.

The fixed rail 102 and the variable rails 104A and 104B support and support both sides of the substrate 50 while moving the substrate 50 via the upper portion of the heater block 110 Can be used. Particularly, as shown in the drawing, the fixed rail 102 may have a stepped portion for supporting and guiding one side of the substrate 50, and the variable rails 104A and 104B may support the heater block 110 And may have a stepped portion disposed on the upstream side and the downstream side, respectively, for supporting and guiding the other side of the substrate 50.

According to an embodiment of the present invention, the variable rails 104A and 104B may be arranged to be movable in a direction perpendicular to the moving direction of the substrate 50. [ Particularly, the substrate 50 can be moved in the longitudinal direction, and when the width of the substrate 50 is changed, the positions of the variable rails 104A and 104B can be adjusted accordingly.

Although not shown in detail, the variable rails 104A and 104B may be movably arranged in the width direction of the substrate 50 by a guide member such as a linear motion guide, In the width direction of the substrate 50. For example, although not shown in detail, the rail driver 106 may be constructed using a step motor, a ball screw, a ball nut, or the like, for precise position adjustment. Alternatively, a pneumatic or hydraulic cylinder may be used.

The heater block 110 may extend in a direction perpendicular to the moving direction of the substrate 50, that is, in the width direction of the substrate, in order to correspond to a change in the width of the substrate 50. Therefore, even when the width of the substrate 50 is changed, the replacement of the heater block 110 may be unnecessary. The heater block 110 may be provided with a plurality of vacuum holes 112A, 114A and 116A (see FIG. 4) for sucking and fixing the substrate 50.

Fig. 4 is a schematic sectional view for explaining the heater block shown in Fig. 1. Fig.

Referring to FIG. 4, a plurality of regions 112B, 114B, and 116B including at least one vacuum hole 112A, 114A, and 116A may be formed on the upper surface of the heater block 110. Referring to FIG. The vacuum holes 112A, 114A and 116A of the regions 112B, 114B and 116B can be connected to the vacuum supplier 120 including the vacuum pump or the like through the vacuum pipes 118A, 118B and 118C .

According to an embodiment of the present invention, the substrate supply apparatus 100 may include a vacuum supply unit 120 for selectively supplying a vacuum to the regions 112B, 114B, and 116B. The vacuum supply unit 120 may be connected to the vacuum holes 112A, 114A, and 116A through the vacuum pipes 118A, 118B, and 118C, and the vacuum pipes 118A, 118B, Vacuum valves 122A, 122B, and 122C may be provided, respectively. In particular, although not shown, a control unit (not shown) selectively opens and closes the vacuum valves 122A, 122B and 122C according to the width of the substrate 50, ) Can be adsorbed and fixed.

Referring again to FIGS. 1 and 2, the substrate supply apparatus 100 may include a substrate transfer unit 130 for moving the substrate 50. The substrate transfer unit 130 may include a gripper 132 for gripping the substrate 50 and a gripper driving unit 134 for moving the gripper 132.

In particular, the gripper 132 may grip the substrate 50 at a position adjacent to the inner surface of the fixed rail 102. 2, a predetermined gap may be present between the fixed rail 102 and the heater block 110, and the gripper 132 may be moved through the gap.

The gripper 132 may include a lower member that is in close contact with the lower surface of the substrate 50 and an upper member that is in close contact with the upper surface of the substrate 50. The gripper 132 may be a pneumatic cylinder, It is possible to perform operations such as grasping and releasing the substrate 50 by the same actuator (not shown).

The gripper 132 may be guided by a guide member such as a linear motion guide so as to be movable in parallel with the fixed rail 102. The gripper drive unit 134 may be driven by a motor, a ball screw, a ball block, Lt; / RTI > However, since the structure of the gripper driver 134 can be variously modified, the scope of the present invention is not limited by the detailed structure of the gripper driver 134. [ For example, the gripper driving unit 134 may be constructed using a motor, a belt, or the like.

In addition, the substrate transferring unit 130 may include a plurality of grippers 132, and the grippers 132 may move the substrates 50 in a predetermined area, respectively. That is, by sequentially moving the substrates 50, the time required for supplying the substrates 50 can be shortened.

A first magazine 140 housing a plurality of substrates 50 for performing a die bonding process may be disposed at an end of the fixed rail 102 and the upstream variable rail 104A, The second magazine 150, in which the substrates 50 subjected to the die bonding process are housed, may be disposed at the ends of the fixed rail 104 and the downstream-side variable rail 104B. For example, the substrate supply apparatus 100 may include a loader 142 and an unloader 152, in which the first magazine 140 and the second magazine 150 are disposed, respectively.

Figs. 5 and 6 are schematic plan views for explaining the operation of the variable rails shown in Fig. 1, and Figs. 7 and 8 are schematic side views for explaining the operation of the heater block shown in Fig.

Referring to FIGS. 5 and 6, the variable rails 104A and 140B are formed to correspond to the width of the second substrate 52, as shown in the case where the size of the substrate 50 to be bonded, The width of the conveyance path of the second substrate 52 can be adjusted by moving the second substrate 52 in the width direction. Accordingly, unlike the prior art, the replacement operation of the heater block 110 is not required, and accordingly, the operating rate of the die bonding equipment 1 including the substrate supply apparatus 100 can be greatly improved.

In addition, since the width of the conveyance path can be adjusted very precisely by using a step motor or the like, the process error can be greatly reduced as compared with the conventional technique which depends on the manual operation of the operator.

Referring to FIGS. 7 and 8, the heater block 110 may be vertically movable. For example, the substrate supply apparatus 100 may include a height adjusting unit 160 for adjusting the height of the heater block 110 by vertically moving the heater block 110.

Particularly, in order to prevent the rear surface of the substrate 50 from contacting the heater block 110 and the rear surface of the substrate 50 during transportation of the substrate 50, It is possible to prevent the heater block 110 and the rear surface of the substrate 50 from contacting each other by controlling the height of the heater block 110 to a low level. Also, when the die bonding process is performed on the substrate 50, The height of the heater block 110 may be adjusted to be higher by contacting the rear surface of the substrate 50 by raising the heater block 110.

For example, the height adjuster 160 may be constructed using a motor, a ball screw, a ball block, or the like. Alternatively, the height adjuster 160 may be constructed using a pneumatic or hydraulic cylinder.

The heater block 110 which is in contact with the rear surface of the substrate 50 absorbs the substrate 50 by using the vacuum provided through the vacuum holes 112A, 114A, and 116A, The substrate 50 may be fixed while the die bonding process is performed.

The height adjuster 160 may adjust the height of the heater block 110 to adjust the temperature of the substrate 50. That is, in order to prevent the substrate 50 from being excessively heated when the die bonding process is temporarily stopped, the height of the heater block 110 may be adjusted to be low.

A guide member 170 for connecting the variable rails 104A and 104B and guiding the movement of the substrate 50 may be provided on the heater block 110. [ The guide member 170 may be positioned on the heater block 110 when the die bonding process is performed on the substrate 50 and may guide the side surface of the substrate 50 during the movement of the substrate 50. [ .

On the other hand, the upper edge portion of the downstream variable rail 104B adjacent to the heater block 110 can be chamfered as shown in FIGS. This prevents the substrate 50 and the downstream variable rail 104B from colliding with each other when the substrate 50 is moved from the upper part of the heater block 110, And guided on the step portion of the downstream side variable rail 104B.

The apparatus 100 for supplying the substrate 50 in the die bonding process includes a stationary rail 102 and a heater block 110 and a plurality of heater blocks 110, And variable rails 104A and 104B disposed on the downstream side and movable in the width direction of the substrate 50 to adjust the width of the conveyance path of the substrate 50. [

Particularly, since the variable rails 104A and 104B can move separately from the heater block 110 on the upstream side and the downstream side of the heater block 110, a method of moving the heater block 110 according to the related art The space for installing the substrate transfer unit 130 can be ensured easily. Further, since the heater block 110 can be easily moved in the vertical direction, that is, the height of the heater block 110 can be easily adjusted, the substrate 50 can be closely attached to the substrate 50 during the die bonding process, Since the pressing force for die bonding can be sufficiently applied, the defective process can be sufficiently reduced.

In addition, the vacuum holes 112A, 114A, and 116A, which can be individually controlled by vacuum, are arranged in the heater block 110, thereby fixing the substrate 50 more stably.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims. It can be understood that it is possible.

10: wafer 20: die
50: substrate 80: die transfer part
100: substrate supply device 102: fixed rail
104A, 104B: variable rail 110: heater block
112A, 114A, 116A: vacuum hole 120:
130: substrate transferring unit 160: height adjusting unit
170: Guide member

Claims (9)

An apparatus for feeding a substrate to be die bonded in a die bonding process,
A heater block for heating the substrate;
A fixing rail disposed at one side of the heater block for supporting and guiding one side of the substrate to move the substrate via the heater block;
A variable rail disposed on the upstream side and the downstream side of the heater block so as to be parallel to the fixed rail and movable in a direction perpendicular to the moving direction of the substrate while supporting and guiding the other side of the substrate, ; And
And a substrate transferring unit for transferring the substrate. The substrate feeding apparatus according to claim 1, wherein the heater block extends in a direction perpendicular to the moving direction of the substrate. 2. The substrate supply apparatus according to claim 1, wherein the heater block includes a plurality of regions each including at least one vacuum hole for adsorbing the substrate. 4. The substrate supply apparatus according to claim 3, further comprising a vacuum supply unit connected to vacuum holes of the regions and selectively providing a vacuum to the regions. The substrate processing apparatus according to claim 1,
A gripper for holding the substrate between the stationary rail and the heater block; And
And a gripper driver for moving the gripper in a moving direction of the substrate. The apparatus of claim 1, further comprising a height adjuster for adjusting a height of the heater block. The substrate feeding apparatus according to claim 1, further comprising a guide member connecting between the variable rails and guiding movement of the substrate at an upper portion of the heater block. 2. The substrate feeding apparatus according to claim 1, wherein the upper edge portion of the downstream variable rail adjacent to the heater block is chamfered. The method according to claim 1, further comprising: a loader in which a first magazine accommodating a plurality of substrates to be subjected to the die bonding process is disposed; and an unloader in which a second magazine accommodating the substrates on which the die bonding process is completed is disposed Wherein the substrate supply device comprises:
KR1020120138121A 2012-11-30 2012-11-30 Apparatus for supplying a substrate KR101422357B1 (en)

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KR1020120138121A KR101422357B1 (en) 2012-11-30 2012-11-30 Apparatus for supplying a substrate

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022004151A1 (en) * 2020-06-30 2022-01-06 キヤノン株式会社 Article manufacturing device and article manufacturing method

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KR20190043729A (en) 2017-10-19 2019-04-29 세메스 주식회사 Apparatus for transferring wafers

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KR200145265Y1 (en) * 1996-02-28 1999-06-15 이해규 Apparatus for supplying lead frame
KR100781150B1 (en) 2001-12-28 2007-11-30 삼성테크윈 주식회사 Wire bonder
KR100643715B1 (en) * 2005-03-07 2006-11-10 삼성테크윈 주식회사 Semiconductor chip bonding apparatus
KR101190866B1 (en) * 2006-02-10 2012-10-12 삼성테크윈 주식회사 Conveyer for semiconductor bonding

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022004151A1 (en) * 2020-06-30 2022-01-06 キヤノン株式会社 Article manufacturing device and article manufacturing method

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