KR20140062944A - Light emitting device - Google Patents
Light emitting device Download PDFInfo
- Publication number
- KR20140062944A KR20140062944A KR1020120129275A KR20120129275A KR20140062944A KR 20140062944 A KR20140062944 A KR 20140062944A KR 1020120129275 A KR1020120129275 A KR 1020120129275A KR 20120129275 A KR20120129275 A KR 20120129275A KR 20140062944 A KR20140062944 A KR 20140062944A
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- KR
- South Korea
- Prior art keywords
- layer
- semiconductor layer
- gallium nitride
- light emitting
- conductive type
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of group III and group V of the periodic system
- H01L33/32—Materials of the light emitting region containing only elements of group III and group V of the periodic system containing nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
Abstract
Description
Embodiments relate to a light emitting device, a method of manufacturing a light emitting device, a light emitting device package, and an illumination system.
Light Emitting Device is a pn junction diode whose electrical energy is converted into light energy. It can be produced from compound semiconductor such as group III and group V on the periodic table and by controlling the composition ratio of compound semiconductor, It is possible.
When a forward voltage is applied to the light emitting device, electrons in the n-layer and holes in the p-layer are coupled to emit energy corresponding to the band gap energy of the conduction band and the valance band. Is mainly emitted in the form of heat or light, and when emitted in the form of light, becomes a light emitting element.
For example, nitride semiconductors have received great interest in the development of optical devices and high power electronic devices due to their high thermal stability and wide bandgap energy. Particularly, blue light emitting devices, green light emitting devices, ultraviolet (UV) light emitting devices, and the like using nitride semiconductors have been commercialized and widely used.
The epitaxial structure used in the light emitting device includes an electron injection layer, an active layer, and a hole injection layer, and the active layer is a multiple quantum well structure (MQWs), which is usually composed of a heterojunction of a III-V semiconductor that is not doped.
Conventional light-emitting diode epi (EPI) growth technology consists of an electron injection layer, a light-emitting layer and a hole-injection layer. Among them, the light-emitting layer is an important and sensitive part for determining device characteristics such as luminous efficiency and luminous efficiency.
Therefore, in order to reduce the strain and defects of the light emitting layer, layers having a structure similar to the light emitting layer are present at the bottom. The lower auxiliary layer is designed in such a direction as to minimize charge transfer and strain on the band structure by different growth temperatures from the light emitting layer.
However, according to the related art, doping of an n-type element such as Si or a p-type element such as Mg in a light emitting element is necessary to make a p-n junction structure.
On the other hand, the degree of doping of Si and Mg must be increased in order to form a carrier of high concentration in the intrinsic semiconductor. However, this deteriorates the quality of the semiconductor thin film and changes the strain, which adversely affects the device characteristics.
In particular, excessive Si doping for n-type GaN under multiple quantum wells (MQWs), which are light emitting layers, causes problems in low current characteristics and other electrical characteristics as it leads to quality degradation of MQWs.
Embodiments provide a light emitting device, a method of manufacturing a light emitting device, a light emitting device package, and an illumination system capable of improving brightness and improving electrical characteristics.
The light emitting device according to the embodiment includes a first
According to the light emitting device, the method of manufacturing the light emitting device, the light emitting device package, and the illumination system according to the embodiment, continuous doping of the n-type GaN is modulated in a specific layer, it is possible to improve the quality and strain of the upper multiple quantum wells (MQWs) without causing a driving voltage increase, that is, to increase the dopant amount. Thus, the light emitting device according to the embodiment can improve the light intensity and the improvement of the electrical characteristics.
1 is a cross-sectional view of a light emitting device according to an embodiment.
2 is a diagram illustrating a secondary-ion mass spectroscopy (SIMS) analysis of a light-emitting device according to an embodiment.
3 to 7 are cross-sectional views illustrating a method of manufacturing a light emitting device according to an embodiment.
8 is a sectional view of a light emitting device package according to an embodiment.
9 to 11 are views showing a lighting apparatus according to an embodiment.
12 and 13 are views showing another example of the lighting apparatus according to the embodiment.
14 is a perspective view of a backlight unit according to an embodiment.
In the description of the embodiments, it is to be understood that each layer (film), area, pattern or structure may be referred to as being "on" or "under" the substrate, each layer Quot; on "and" under "are intended to include both" directly "or" indirectly " do. Also, the criteria for top, bottom, or bottom of each layer will be described with reference to the drawings.
The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of each component does not entirely reflect the actual size.
(Example)
1 is a cross-sectional view of a
The
The first
2 is an example of secondary-ion mass spectroscopy (SIMS) analysis of a light-emitting device according to an embodiment. And the X-axis is the depth (nm) from the second conductivity
According to the prior art, doping of an n-type element such as Si or a p-type element such as Mg in a light emitting device is necessary for forming a pn junction structure. In order to form a carrier of high concentration in an intrinsic semiconductor, The degree of Mg doping must be increased. However, this deteriorates the quality of the semiconductor thin film and changes the strain, which adversely affects the device characteristics.
In particular, excessive Si doping for n-type GaN under multiple quantum wells (MQWs), which are light emitting layers, causes problems in low current characteristics and other electrical characteristics as it leads to quality degradation of MQWs.
Accordingly, it is an object of the present invention to provide a light emitting device, a method of manufacturing a light emitting device, a light emitting device package, and an illumination system capable of improving brightness and improving electrical characteristics.
For this, the concentration of the first conductive type element of the first conductive
In detail, the first
For example, the second concentration of the first conductive type
The first
In addition, the first conductivity
The thickness of the first conductivity
Table 1 shows the characteristics of the light emitting device at predetermined wavelengths (WD: dominant wavelength) of Examples (Examples) and Comparative Examples (Reference).
According to the embodiment, the luminous intensity (IV) and ESD (electrostatic discharge) yield of the light emitting device can be improved without increasing the operating voltage VF3
According to the embodiment, the Si concentration of the first conductive type
The thickness of the first conductivity
According to the light emitting device and the method of manufacturing the light emitting device according to the embodiments, the conventional doping of the n-type GaN is modulated in a specific layer, , It is possible to improve the quality and strain of the upper multiple quantum wells (MQWs) without causing a driving voltage rise. Thus, the light emitting device according to the embodiment can improve the light intensity and the improvement of the electrical characteristics.
In the embodiment, the gallium nitride-based
In order to form a pn junction structure in the light emitting device, the doping of the p-type element and the n-type element is required. In order to form a carrier with high concentration in the intrinsic semiconductor, the degree of doping must be increased. there is a problem that the characteristics of the light emitting device are adversely affected by causing a change in strain.
Accordingly, in order to improve the light intensity through charge balance matching of the LED device, the concentration of the first conductivity type element, for example Si, immediately before the growth of the multiple quantum well is important, The first GaN-based
In the embodiment, the first gallium
Meanwhile, in the embodiment, the concentration of the first conductive type element in the second gallium nitride-based
In this embodiment, attention is paid to the main role of the carrier injection layer, and in order to minimize the inverse effect due to doping, the carrier injection efficiency is increased by increasing the carrier concentration in the region adjacent to the active layer, and the doped first gallium nitride- The region of the
For example, the thickness of the doped first gallium
For example, when the thickness of the doped first gallium nitride based
On the other hand, when the thickness of the doped first gallium
For example, in an embodiment, the thickness of the doped first gallium nitride based
The embodiment further includes an AlGaN-based
Hereinafter, reference numerals not shown in Figs. 1 and 2 will be described in the following manufacturing method.
According to the light emitting device and the method of manufacturing the light emitting device according to the embodiment, the improvement of the lightness and the improvement of the electrical characteristics can be improved.
Hereinafter, a method of manufacturing a light emitting device according to an embodiment will be described with reference to FIGS.
3 to 7 illustrate a horizontal light emitting device in which a
First, an
The
In addition, the embodiment may include the
For example, the
Thereafter, the first conductive type 5
The first conductive type
For example, the first conductive type
In the embodiment, an AlGaN-based
Next, as shown in FIG. 5, a first
The first conductive
Embodiments provide a light emitting device, a method of manufacturing a light emitting device, a light emitting device package, and an illumination system capable of improving brightness and improving electrical characteristics.
For this, the concentration of the first conductive type element of the first conductive
In detail, the first
For example, the second concentration of the first conductive type
The first
In addition, the first conductivity
The thickness of the first conductivity
As shown in Table 1, according to the embodiment, the luminous intensity (IV) and ESD (electrostatic discharge) yield of the light emitting device are improved without increasing the operating voltage VF3
According to the embodiment, the Si concentration of the first conductive type
In the embodiment, the gallium nitride-based
For example, in the case of the first conductive type element, for example Si, the concentration immediately prior to the growth of the multiple quantum well is important for improving the luminance through charge balance matching of the LED device, The gallium
In the embodiment, the first gallium
Meanwhile, in the embodiment, the concentration of the first conductive type element in the second gallium nitride-based
The thickness of the doped first gallium
For example, when the thickness of the doped first gallium nitride based
On the other hand, when the thickness of the doped first gallium
For example, in an embodiment, the thickness of the doped first gallium nitride based
Next, the
In an embodiment, the
For example, the
The well layer / barrier layer of the
Next, in the embodiment, the second conductivity type gallium nitride based
The second conductivity type gallium nitride based
The second conductivity type gallium nitride based
Thereafter, the second conductivity
For example, the second
In an embodiment, the first
Next, in the embodiment, the light-transmitting
For example, the
6, the light-transmitting
7, a
According to the light emitting device and the manufacturing method thereof according to the embodiment, it is possible to improve the brightness and the electrical characteristics.
8 is a view illustrating a light emitting
The light emitting
The
The
The
The
The
The
A light guide plate, a prism sheet, a diffusion sheet, a fluorescent sheet, and the like, which are optical members, may be disposed on a path of light emitted from the light emitting device package. The light emitting device package, the substrate, and the optical member may function as a backlight unit or function as a lighting unit. For example, the lighting system may include a backlight unit, a lighting unit, a pointing device, a lamp, and a streetlight.
9 to 11 are views showing a lighting apparatus according to an embodiment.
FIG. 9 is a perspective view of the illumination device according to the embodiment viewed from above, FIG. 10 is a perspective view of the illumination device shown in FIG. 9, and FIG. 11 is an exploded perspective view of the illumination device shown in FIG.
9 to 11, the illumination device according to the embodiment includes a
For example, the
The inner surface of the
The
The
The
The surface of the
The
The
The
The
The
The
The
12 and 13 are views showing another example of the lighting apparatus according to the embodiment.
Fig. 12 is a perspective view of a lighting apparatus according to the embodiment, and Fig. 13 is an exploded perspective view of the lighting apparatus shown in Fig.
12 and 13, the lighting device according to the embodiment includes a
The
The
The
The inner surface of the
The
The
13, the
The
In addition, the
The light emitting device 3230 may be a light emitting diode chip that emits red, green, or blue light, or a light emitting diode chip that emits UV light. Here, the light emitting diode chip may be a lateral type or a vertical type, and the light emitting diode chip may emit blue, red, yellow, or green light. .
The light emitting device 3230 may have a phosphor. The phosphor may be at least one of a garnet system (YAG, TAG), a silicate system, a nitride system, and an oxynitride system. Alternatively, the fluorescent material may be at least one of a yellow fluorescent material, a green fluorescent material, and a red fluorescent material.
The
A plurality of radiating
The
Specifically, the
The
The
The material of the
The
The
The plurality of
The
The
The
14 is an exploded
The
The
The light emitting
The
The
The plurality of light emitting device packages 200 may be mounted on the
The
The
The
The light emitting device, the light emitting device manufacturing method, the light emitting device package, and the illumination system according to the embodiments can improve the light intensity and the electrical characteristics.
The features, structures, effects and the like described in the embodiments are included in at least one embodiment and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects and the like illustrated in the embodiments can be combined and modified by other persons skilled in the art to which the embodiments belong. Accordingly, the contents of such combinations and modifications should be construed as being included in the scope of the embodiments.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention. It can be seen that the modification and application of branches are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that the present invention may be embodied in many other specific forms without departing from the spirit or essential characteristics thereof.
The first
The first conductive type
The first conductive type
The first conductive type
The first conductive type
A gallium
The first conductive type first gallium nitride-based
A first conductive type second gallium nitride-based
The
Claims (11)
A gallium nitride superlattice layer on the first conductive type semiconductor layer;
An active layer on the gallium nitride superlattice layer; And
And a second conductive semiconductor layer on the active layer,
Wherein the first conductivity type semiconductor layer includes a plurality of layers having different concentrations of the first conductive type element.
The first conductivity type semiconductor layer may include a first conductivity type semiconductor layer,
A first conductive type first semiconductor layer closest to the gallium nitride based super lattice layer,
And a first conductive type second semiconductor layer below the first conductive type first semiconductor layer,
The first concentration of the first conductive type first semiconductor layer is
And the second concentration of the first conductive type second semiconductor layer is higher than the second concentration of the first conductive type second semiconductor layer.
The second concentration of the first conductive type second semiconductor layer
Wherein the first concentration of the first conductivity type first semiconductor layer is 50% or more and less than 100% of the first concentration.
The second concentration of the first conductive type second semiconductor layer
The light emitting device 1 × E18 to 4 × E18 (atoms / cm 3 ).
The first conductivity type semiconductor layer may include a first conductivity type semiconductor layer,
And a first conductive type third semiconductor layer below the first conductive type second semiconductor layer,
The second concentration of the first conductive type second semiconductor layer
And the third concentration of the first conductive type third semiconductor layer is higher than the third concentration of the first conductive type third semiconductor layer.
And the thickness of the first conductivity type semiconductor layer is 0.5 占 퐉 to 1.5 占 퐉.
The gallium nitride-based superlattice layer
A first gallium nitride superlattice layer of a first conductivity type below the active layer,
And a second conductive type second gallium nitride based superlattice layer under the first conductive type first gallium nitride based superlattice layer,
The concentration of the first conductive type first gallium nitride based superlattice layer is
Type gallium nitride superlattice layer is higher than the concentration of the first conductive type second gallium nitride superlattice layer.
And the thickness of the first gallium nitride superlattice layer is thinner than that of the second gallium nitride superlattice layer.
Wherein the thickness of the first gallium nitride superlattice layer is 10% to 30% of the thickness of the second gallium nitride superlattice layer.
Further comprising an AlGaN-based superlattice layer under the first conductive type semiconductor layer,
And a fifth conductive type semiconductor layer below the AlGaN-based superlattice layer.
And the active layer further comprises a second conductivity type gallium nitride series layer between the second conductivity type semiconductor layers.
Priority Applications (1)
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KR1020120129275A KR20140062944A (en) | 2012-11-15 | 2012-11-15 | Light emitting device |
Applications Claiming Priority (1)
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KR1020120129275A KR20140062944A (en) | 2012-11-15 | 2012-11-15 | Light emitting device |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190116828A (en) * | 2018-04-05 | 2019-10-15 | 엘지이노텍 주식회사 | Semiconductor device |
JP2020521312A (en) * | 2017-05-19 | 2020-07-16 | エルジー イノテック カンパニー リミテッド | Semiconductor device and semiconductor device package including the same |
JP2021010038A (en) * | 2020-10-30 | 2021-01-28 | 日機装株式会社 | Nitride semiconductor light-emitting element |
-
2012
- 2012-11-15 KR KR1020120129275A patent/KR20140062944A/en not_active Application Discontinuation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020521312A (en) * | 2017-05-19 | 2020-07-16 | エルジー イノテック カンパニー リミテッド | Semiconductor device and semiconductor device package including the same |
KR20190116828A (en) * | 2018-04-05 | 2019-10-15 | 엘지이노텍 주식회사 | Semiconductor device |
JP2021010038A (en) * | 2020-10-30 | 2021-01-28 | 日機装株式会社 | Nitride semiconductor light-emitting element |
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