KR20140052228A - Organic light emitting display device - Google Patents

Abstract

Provided is an organic electroluminescence display device comprising a panel including a transistor unit and an organic light emitting device unit; a power supply unit for supplying power to the panel; a sensing wiring formed on the organic light emitting device unit; and a short detection unit for sensing whether a short between a power supply wire or an electrode formed on the panel and a sensing wire, and outputting a shutdown signal for turning off the power supply unit when the short is generated.

Description

[0001] The present invention relates to an organic light emitting display device,

The present invention relates to an organic light emitting display.

An organic electroluminescent device used in an organic electroluminescent display device is a self-luminous device in which a light emitting layer is formed between two electrodes located on a substrate. The organic light emitting display device may be a top emission type, a bottom emission type or a dual emission type depending on a direction in which light is emitted. It is divided into a passive matrix and an active matrix depending on the driving method.

The subpixel disposed in the organic light emitting display panel includes a transistor portion including a switching transistor, a driving transistor and a capacitor, and an organic light emitting diode including a lower electrode connected to the driving transistor included in the transistor portion, an organic light emitting layer, and an upper electrode .

The brightness of the organic light emitting display panel varies depending on the amount of current flowing through the organic light emitting diode. Since an organic light emitting display panel requires a higher current than a liquid crystal display panel, an overcurrent flows to a device included in a sub pixel when a short circuit occurs. In the manufacturing process (or module process), a short circuit is a phenomenon in which an internal structural factor such as particles, cracks, misalignment of a pad portion, a narrow wiring layout, and the like external to the organic electroluminescent display panel The cause, location and subject vary.

On the other hand, when a short circuit occurs, an overcurrent flows into the panel to generate high-temperature heat, burnt the devices included in the sub-pixels of the panel, and there is a high possibility of causing a fire due to the burnt It is necessary to take measures.

The present invention for solving the above-mentioned problems of the background art is to provide an organic electroluminescent device capable of detecting the occurrence of a short circuit or an overcurrent between a power source or an electrode to eliminate the possibility that a local burnt of the device spreads to the front, And an electroluminescent display device.

According to an aspect of the present invention, there is provided a panel including a transistor portion and an organic light emitting element portion. A power supply unit for supplying power to the panel; A sensing wiring formed in the organic light emitting element portion; And a short detection part for sensing whether a short circuit occurs between the sensing wiring and the electrode or power supply wiring formed on the panel and outputting a shutdown signal for turning off the power supply part when a short is generated.

The sensing wiring may be formed in the same layer as the lower electrode of the organic light emitting element portion.

The sensing wiring can be arranged in the X-axis direction, the Y-axis direction, or the X-axis and Y-axis directions of the panel.

The short detection unit supplies a sensing signal to the sensing wiring and senses the sensing signal. When a change amount is generated in the sensing signal, the short detection unit can determine a short and output a shutdown signal.

In another aspect, the present invention provides a panel comprising a transistor portion and an organic light emitting element portion; A power supply unit for supplying power to the panel; A sensing wiring formed on the organic light emitting element portion; And a short detection unit for sensing whether heat is generated due to a short circuit between electrodes or power supply wiring formed on the panel through the sensing wiring and outputting a shutdown signal for turning off the power supply unit when a short is generated.

The sensing wiring may include an organic material layer positioned on the upper electrode of the organic light emitting element portion and a metal layer located on the organic material layer.

The short detection unit supplies and senses a sensing signal to the metal layer, and when the organic material layer melts due to heat generation when a panel is short-circuited and a change amount is generated in the sensing signal, the short detection unit can output a shutdown signal.

According to another aspect of the present invention, there is provided a panel including a transistor portion and an organic light emitting element portion. A power supply unit for supplying power to the panel; A sensing wiring formed on a front surface of the substrate corresponding to a non-display surface of the panel; And a short detection unit for sensing whether heat is generated due to a short circuit between electrodes or power supply wiring formed on the panel through the sensing wiring and outputting a shutdown signal for turning off the power supply unit when a short is generated.

The sensing wiring may be located on the outer surface of the substrate not facing the organic light emitting element portion or on the inner surface of the substrate facing the organic light emitting element.

The sensing wiring may be composed of a first metal layer, an organic material layer, and a second metal layer, and the organic material layer may be made of a material that melts by generation of heat when a panel is short-circuited.

The short detection unit supplies and senses different first and second sensing signals to the first metal layer and the second metal layer. When a change amount is generated in the first and second sensing signals due to melting of the organic layer due to heat generation when a short- And output a shutdown signal.

The present invention relates to an organic electroluminescent display device capable of detecting the occurrence of a short circuit or an overcurrent between a power source or an electrode and using a structure and a circuit structure of the panel to eliminate the possibility that the local combustion of the device is spread to the front, There is an effect of providing a display device.

1 is a schematic view of an organic light emitting display device according to a first embodiment of the present invention;
Fig. 2 is an exemplary circuit configuration of a subpixel. Fig.
Figs. 3 to 5 are various examples of the sensing wiring formed on the panel. Fig.
6 and 7 are cross-sectional exemplary views for explaining a structure of a sensing wiring according to a first embodiment of the present invention;
8 is an exemplary view of a signal supplied to the sensing wiring;
9 is a diagram for explaining an output state of a power supply unit when a short occurs.
10 is a diagram for explaining an example in which the timing control section includes a short detection section;
11 is a cross-sectional exemplary view for explaining a structure of a sensing wiring according to a second embodiment of the present invention.
12 is a plan view of the sensing wiring shown in Fig. 11. Fig.
13 is a cross-sectional exemplary view for explaining a structure of a sensing wiring according to a third embodiment of the present invention.
Fig. 14 is a plan view of the sensing wiring shown in Fig. 13. Fig.
15 is an exemplary view of a signal supplied to the sensing wiring;

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

≪ Embodiment 1 >

FIG. 1 is a schematic configuration diagram of an organic light emitting display according to a first embodiment of the present invention. FIG. 2 is a circuit diagram of a subpixel. FIGS. 3 to 5 show various examples .

1 to 5, an organic light emitting display according to a first exemplary embodiment of the present invention includes an image processing unit 120, a power supply unit 125, a timing control unit 130, a data driving unit 150, A scan driver 140, a panel 160, and a short detection unit 170 are included.

The image processing unit 120 supplies the vertical synchronization signal Vsync, the horizontal synchronization signal Hsync, the data enable signal DE, the clock signal CLK and the data signal DATA to the timing control unit 130 do. The image processing unit 120 is formed on the system board 110.

The timing controller 130 uses a timing signal such as a vertical synchronization signal Vsync, a horizontal synchronization signal Hsync, a data enable signal DE and a clock signal CLK supplied from the image processing unit 120 And controls the operation timings of the data driver 150 and the scan driver 140. The timing controller 130 can determine the frame period by counting the data enable signal DE in one horizontal period so that the vertical synchronization signal Vsync and the horizontal synchronization signal Hsync supplied from the outside can be omitted. The control signals generated by the timing controller 130 include a gate timing control signal GDC for controlling the operation timing of the scan driver 140 and a data timing control signal DDC for controlling the operation timing of the data driver 150. [ ). The gate timing control signal GDC includes a gate start pulse, a gate shift clock, a gate output enable signal, and the like. The data timing control signal DDC includes a source start pulse, a source sampling clock, a source output enable signal, and the like.

The scan driver 140 sequentially generates a scan signal while shifting the level of the gate driving voltage in response to the gate timing control signal GDC supplied from the timing controller 130. The scan driver 140 supplies the scan signals through the scan lines GL connected to the sub-pixels SP included in the panel 160.

The data driver 150 samples and latches the data signal DATA supplied from the timing controller 130 in response to the data timing control signal DDC supplied from the timing controller 130 and converts the sampled data signal into data of a parallel data system . The data driver 150 converts the data signal DATA into a gamma reference voltage. The data driver 150 supplies the data signal DATA through the data lines DL connected to the sub-pixels SP included in the panel 160.

The panel 160 includes sub-pixels SP arranged in a matrix form. The subpixels SP include red subpixels, green subpixels, and blue subpixels, and occasionally white subpixels. On the other hand, the panel 160 including the white subpixels can emit white light without emitting red, green, and blue light emission layers of the respective subpixels SP. In this case, the light emitted in white is converted into red, green and blue by the RGB color filter.

For example, the sub-pixels included in the panel 160 may be configured as shown in FIG. One subpixel includes a switching transistor SW, a driving transistor DR, a capacitor Cst, a compensation circuit CC, and an organic light emitting diode D. The switching transistor SW is operated so that a data signal supplied through the first data line DL1 is stored as a data voltage in the capacitor Cst in response to a scan signal supplied through the first scan line GL1. The driving transistor DR operates so that the driving current flows between the first power supply line VDD and the ground line GND in accordance with the data voltage stored in the capacitor Cst. The compensation circuit CC compensates the threshold voltage of the driving transistor DR and the like. The compensation circuit CC consists of one or more transistors and a capacitor. The configuration of the compensation circuit (CC) is very various, and a detailed illustration and description thereof are omitted. The organic light emitting diode D operates to emit light in accordance with the driving current generated by the driving transistor DR.

One subpixel is composed of a 2T (Transistor) 1C (Capacitor) structure including a switching transistor SW, a driving transistor DR, a capacitor Cst and an organic light emitting diode D. However, when the compensation circuit (CC) is added, it is composed of 3T1C, 4T2C, 5T2C, and the like. The subpixels having the above-described structure may be formed by a top emission method, a bottom emission method, or a dual emission method according to the structure.

On the other hand, in the panel 160, a sensing wiring 180 is formed as shown in FIGS. The sensing wiring 180 is wired in a stripe shape (FIGS. 3 and 4) or a mesh shape (FIG. 5). Specifically, it is as follows.

The sensing wiring 180 is wired in the Y-axis direction of the panel 160 as shown in Fig. The sensing wiring 180 is arranged in the same direction as the data lines so as to pass through the spacing space between the sub-pixels SP. The sensing wiring 180 is wired in the X axis direction of the panel 160 as shown in Fig. The sensing wiring 180 is arranged in the same direction as the scan line so as to pass the space between the sub pixels SP. The sensing wiring 180 is wired in the X-axis and Y-axis directions of the panel 160 as shown in Fig. The sensing wiring 180 is arranged in the same direction as the data lines and the scan lines so as to pass the space between the subpixels SP.

The power supply unit 125 converts an external voltage supplied from the outside to output a first potential voltage (e.g., 20V level), a second potential voltage (e.g., 3.3V level), and a low potential voltage (e.g. The first potential voltage is a voltage supplied to the first power supply line VDD, the second potential voltage is a voltage supplied to the second power supply line VCC, and the low potential voltage is a voltage supplied to the ground line GND . The power supply unit 125 is formed on the system board 110 together with the image processing unit 120. The power supplied from the power supply unit 125 is used in the image processing unit 120, the timing control unit 130, the data driving unit 150, the scan driving unit 140, and the panel 160.

The short detection unit 170 senses whether the sensing wiring 180 formed on the panel 160 is short-circuited between an electrode or a power supply wiring formed on the panel 160 and outputs a shutdown signal SDS ).

Since the panel 160 is driven by a high current, when a short circuit occurs, an overcurrent flows into the panel 160 to generate heat at a high temperature. When a device included in the sub-pixel of the panel 160 is burnt ), As well as a fire caused by this.

The short circuit is caused by external factors such as static electricity as well as internal structural factors such as particles introduced into the panel 160, cracks, misalignment of the pad portions, narrow wiring layout, etc. during the manufacturing process The cause, location and subject vary.

Therefore, the short detection unit 170 controls the power supply unit 125 to prevent the occurrence of a fire in the panel 160 or the like by preventing this problem in advance. To this end, the short detection unit 170 uses the sensing wiring 180 formed on the panel 160, which will be described in detail as follows.

FIGS. 6 and 7 are cross-sectional views for explaining the structure of the sensing wiring according to the first embodiment of the present invention.

The panel shown in Fig. 6 includes red subpixels, green subpixels, and blue subpixels. A transistor portion (TFT) and an organic light emitting element portion (OLED) are formed on a first substrate 160a constituting a panel. The transistor portion (TFT) includes a switching transistor, a driving transistor, a capacitor, a compensation circuit, and the like located on the first substrate 160a. The organic light emitting diode OLED includes a lower electrode, a sensing wiring, an organic light emitting layer, a bank layer, and an upper electrode. Hereinafter, the configuration located on the transistor portion (TFT) will be described in more detail.

A lower electrode 163 is formed on the insulating film 162 covering the transistor portion (TFT). The lower electrode 163 is divided into sub-pixel regions. The lower electrode 163 is connected to the source electrode or the drain electrode of the driving transistor included in the transistor portion (TFT). The lower electrode 163 is selected as an anode electrode or a cathode electrode. When the lower electrode 163 is selected as an anode electrode, it may be formed of a metal such as indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO), zinc oxide (ZnO), indium gallium zinc oxide A transparent conductive material such as a graphene or the like. When the lower electrode 163 is selected as the cathode electrode, it is selected from a metal material such as aluminum (Al), silver (Ag), magnesium (Mg), calcium (Ca)

On the insulating film 162, a sensing wiring 180 is formed, which is separated from the lower electrode 163. [ The sensing wiring 180 is formed on the same layer as the lower electrode 163, and is located in a spaced space between the lower electrodes 163. The sensing wiring 180 is arranged in the form shown in Figs. 3 to 5 above. The sensing wiring 180 is formed of the same transparent conductive material as the lower electrode 163 or is formed of a metal material.

On the lower electrode 163, a bank layer 164 defining the opening of the subpixel is formed. The bank layer 164 is formed to cover both the lower electrode 163 and the sensing wiring 180.

An organic light emitting layer 165 is formed on the lower electrode 163 exposed by the bank layer 164. The organic light emitting layer 165 may be composed of a hole injection layer (HIL), a hole transport layer (HTL), a light emitting layer (EML), an electron transport layer (ETL) and an electron injection layer (EIL). The organic light emitting layer 165 may further include a functional layer for adjusting the transport characteristics of holes and electrons, and a functional layer for stabilizing interfacial stability between layers.

An upper electrode 166 is formed on the organic light emitting layer 165. The upper electrode 166 is formed in the form of a front electrode so as to be connected in common across all sub-pixel regions. The upper electrode 166 is selected as a cathode electrode (when the lower electrode is selected as the anode electrode) or an anode electrode (when the lower electrode is selected as the cathode electrode).

The panel shown in Figure 7 includes a red subpixel, a green subpixel, a blue subpixel, and a white subpixel. A transistor portion (TFT) and an organic light emitting element portion (OLED) are formed on a first substrate 160a constituting a panel. The structure of FIG. 7 is similar to that of FIG. 6 except that white light emitted from a white organic light emitting diode is converted into an RGB color filter 168 to implement RGB, so a detailed description thereof will be omitted.

6 (a) shows an example of a normal panel, and FIG. 6 (b) shows a case where a panel is formed between the upper electrode 166 and the sensing wiring 180 due to a crack, Fig. 7 (a) shows an example of a normal panel, and Fig. 7 (b) shows a case where a short circuit occurs between the lower wiring 161 and the sensing wiring 180 due to cracks, Here is an example of the panel that occurred. Here, the lower wiring 161 includes signal wiring such as data lines DL and scan lines GL as well as power wiring such as a first power supply line VDD and a ground line GND. Further, the lower wiring 161 further includes an auxiliary power supply wiring for transmitting an auxiliary voltage to the compensation circuit, a reference power supply wiring for transmitting a reference voltage, and an initialization power supply wiring for transferring an initialization voltage. Therefore, the lower wiring 161 must be interpreted as one of the wirings listed above.

The short detection unit 170 shown in FIG. 1 senses a short, as shown in FIGS. 6 (b) and 7 (b), and blocks the output of the power supply unit.

FIG. 8 is a diagram illustrating an example of a signal supplied to the sensing wiring, FIG. 9 is a diagram for explaining an output state of a power supply unit when a short occurs, and FIG. 10 is a diagram for explaining an example of including a short detection unit in the timing control unit.

As shown in FIGS. 1 to 8, the short detection unit 170 may generate the sensing signal SS in the form of a pulse signal PLS, for example, as shown on the left side of FIG. 8, and supply the sensing signal SS through the sensing wiring 180.

When the panel is in a normal state as shown in Figs. 6 and 7A, the short detection unit 170 senses the pulse signal PLS as it is in Fig. 8A. On the other hand, when the shot is generated as shown in Figs. 6 and 7 (b), the short detection unit 170 senses a signal in which the pulse signal PLS is distorted as shown in Fig. 8 (b).

Then, the short detection unit 170 determines via the sensing wiring 180 that the panel 160 is in an abnormal state (Abnormal) due to a short circuit or the like other than the normal state. The short detection unit 170 outputs a shutdown signal SDS to the power supply unit 125. [

On the other hand, when the shutdown signal SDS is not output from the short detection unit 170, the power supply unit 125 maintains the output as shown in FIG. 9A. On the other hand, when the shutdown signal SDS is outputted from the short detection unit 170, the power supply unit 125 cuts off the output as shown in FIG. 9 (b).

The short detection unit 170 supplies and senses the sensing signal SS in the form of a pulse signal PLS as described above. In this case, the short detection unit 170 may be included in the timing control unit 130 as shown in FIG.

As described above, the structure in which the sensing wiring 180 is formed on the lower portion of the bank layer corresponding to the non-light emitting region of the panel may be a top emission scheme, a bottom emission scheme, a dual- Emission) method.

≪ Embodiment 2 >

11 is a cross-sectional view for explaining a structure of a sensing wiring according to a second embodiment of the present invention, and FIG. 12 is a plan view of the sensing wiring shown in FIG.

The panel 160 shown in FIG. 11 is formed in a bottom-emission manner in which light L is emitted toward the first substrate 160a.

In this structure, the sensing wiring 180 is formed between the first substrate 160a and the second substrate 160b constituting the panel 160. [ The sensing wiring 180 is formed on the organic light emitting element portion OLED. The sensing wiring 180 includes an organic layer 182 located on the upper electrode of the organic light emitting diode OLED and a metal layer 181 located on the organic layer 182.

The upper electrode of the organic light emitting diode OLED is formed as a front electrode on the front surface of the display area AA. Therefore, the sensing wiring 180 may be formed on the entire surface corresponding to the light emitting area AA, as shown in FIG. It should be noted, however, that the sensing wiring 180 is located on the upper electrode which does not emit the light L.

11 (a) shows an example of a normal panel 160, and FIG. 11 (b) shows a panel 160 in which a short between the upper electrode and the lower electrode or the first power supply line occurs during the manufacturing process of the panel 160, Fig. When the upper electrode is short-circuited with another electrode or wiring, an overcurrent flows to the short-circuited region, thereby generating a high temperature. Then, the organic material layer 182 is melted and melted by the heat generated at this time, and a short circuit occurs between the upper electrode and the sensing wiring 180.

The short detection unit 170 supplies a sensing signal to the metal layer 181 and senses the sensing signal. At this time, if the panel 160 is in a normal state as shown in FIG. 11A, no distortion occurs in the sensing signal sensed from the metal layer 181. On the other hand, when a short is generated as shown in FIG. 11 (b), distortion occurs in the sensing signal sensed from the metal layer 181.

Then, the short detection unit 170 determines via the sensing wiring 180 that the panel 160 is in an abnormal state (Abnormal) due to a short circuit or the like other than the normal state. The short detection unit 170 outputs a shutdown signal SDS to the power supply unit 125. [

On the other hand, when the shutdown signal SDS is not output from the short detection unit 170, the power supply unit 125 maintains the output as shown in FIG. 9A. On the other hand, when the shutdown signal SDS is outputted from the short detection unit 170, the power supply unit 125 cuts off the output as shown in FIG. 9 (b).

As described above, the short detection unit 170 supplies and senses a sensing signal to the metal layer 181, and when the organic layer 182 is melted by heat generation when a short circuit of the panel 160 is generated and a change amount is generated in the sensing signal, And outputs a shutdown signal SDS. To enable this, it is preferable that the organic material layer 182 is selected as a low melting point material that is highly soluble in high temperature.

≪ Third Embodiment >

13 is a cross-sectional view illustrating a structure of a sensing wiring according to a third embodiment of the present invention, FIG. 14 is a plan view of the sensing wiring shown in FIG. 13, and FIG. Fig.

The panel 160 shown in FIG. 13 is formed in a bottom-emission manner in which light L is emitted toward the first substrate 160a.

In this structure, the sensing wiring 180 is formed on the entire surface of the second substrate 160b constituting the panel 160. [ At this time, the sensing wiring 180 may be formed as a film on the entire surface of the second substrate 160b. The sensing wiring 180 includes a first metal layer 181, an organic material layer 182, and a second metal layer 182.

13, the sensing wiring 180 is formed on the outer surface of the second substrate 160b which is not opposed to the organic light emitting element OLED. However, the sensing wiring 180 may be formed on the inner surface of the second substrate 160b facing the organic light emitting device OLED. In this case, an insulating film for electrically insulating the sensing wiring 180 and the organic light emitting element OLED is further formed.

The sensing wiring 180 is formed in the form of a film and attached to the non-light emitting surface of the panel 160. Therefore, the sensing wiring 180 may be formed on the entire surface corresponding to the second substrate 160b as shown in FIG. It should be noted, however, that the sensing wiring 180 is located on the surface of the second substrate 160b which does not emit the light L.

13A shows an example of a normal panel 160 and FIG. 13B shows an example of a panel 160 in which a short circuit occurs between a specific electrode and an electrode or a specific electrode and a wiring at the time of driving the panel 160 . When a specific electrode and an electrode or a specific electrode and a wiring are short-circuited, an overcurrent flows to a short-circuited region, thereby generating a high temperature. Then, the organic material layer 182 is melted and melted by the heat generated at this time, and short-circuiting occurs between the first metal layer 181 and the second metal layer 183.

The short detection unit 170 can supply the first and second sensing signals SS1 and SS2 in the form of a voltage as shown in FIG. 13 (a), when the panel 160 is in the normal state, the first and second sensing signals SS1 and SS2 maintain the original voltage. On the other hand, if the second sensing signal SS2 is in an abnormal state (Abnormal) due to a short circuit as shown in FIG. 13 (b), the second sensing signal SS2 is down to the voltage level of the first sensing signal SS1 and is distorted.

Then, the short detection unit 170 determines via the sensing wiring 180 that the panel 160 is in an abnormal state (Abnormal) due to a short circuit or the like other than the normal state. The short detection unit 170 outputs a shutdown signal SDS to the power supply unit 125. [

On the other hand, when the shutdown signal SDS is not output from the short detection unit 170, the power supply unit 125 maintains the output as shown in FIG. 9A. On the other hand, when the shutdown signal SDS is outputted from the short detection unit 170, the power supply unit 125 cuts off the output as shown in FIG. 9 (b).

As described above, the short detection unit 170 supplies and senses the first and second sensing signals SS1 and SS2 to the first and second metal layers 181 and 183, When the organic layer 182 melts and the first and second sensing signals SS1 and SS2 are changed, a short circuit is detected and a shutdown signal SDS is output. To enable this, it is preferable that the organic material layer 182 is selected as a low melting point material that is highly soluble in high temperature.

In the first to third embodiments, the short detection unit 170 can supply and sense a sensing signal for each frame or for each specific frame or time in order to detect whether or not a short occurs. Also, it is possible to determine a threshold value in consideration of the parasitic capacitance acting on the sensing wiring, and to determine that the signal is short-circuited only when distortion of a signal out of the above range occurs.

The present invention eliminates the possibility that the local burnt of the device may spread to the front and lead to fire by using the structure of the panel and the circuit structure capable of detecting short circuit or over current between the power source or the electrodes There is an effect of providing an organic electroluminescence display device having a light emitting layer.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that the invention may be practiced. It is therefore to be understood that the embodiments described above are to be considered in all respects only as illustrative and not restrictive. In addition, the scope of the present invention is indicated by the following claims rather than the detailed description. Also, all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

120: image processing unit 125: power supply unit
130: a timing controller 150: a data driver
140: scan driver 160: panel
170: short detection unit 180: sensing wiring
181: metal layer, first metal layer 182: organic layer
183: second metal layer

Claims (11)

A panel including a transistor portion and an organic light emitting element portion;
A power supply unit for supplying power to the panel;
A sensing wiring formed in the organic light emitting element portion; And
And a short detection unit for sensing whether a short circuit occurs between the sensing wiring and an electrode or power supply wiring formed on the panel and outputting a shutdown signal for turning off the power supply when a short is generated. The method according to claim 1,
The sensing wiring
And the lower electrode of the organic light emitting diode is divided into the same layer as the lower electrode of the organic light emitting diode. The method according to claim 1,
The sensing wiring
Axis direction, the Y-axis direction, or the X-axis and Y-axis directions of the panel. The method according to claim 1,
The short-
Wherein the sensing circuit supplies and senses a sensing signal to the sensing wiring and determines that the sensing signal is short when the sensing signal changes, and outputs the shutdown signal. A panel including a transistor portion and an organic light emitting element portion;
A power supply unit for supplying power to the panel;
A sensing wiring formed on the organic light emitting element portion; And
And a short detection unit for sensing whether heat is generated due to a short circuit between electrodes or power supply wiring formed on the panel through the sensing wiring and outputting a shutdown signal for turning off the power supply unit when a short is generated. 6. The method of claim 5,
The sensing wiring
An organic material layer disposed on the upper electrode of the organic light emitting device,
And a metal layer disposed on the organic material layer. The method according to claim 6,
The short-
And a sensing signal is supplied to the metal layer and sensed. When the organic layer is melted due to heat generation at the time of occurrence of a short circuit of the panel and a change amount is generated in the sensing signal, the organic layer is determined as a short circuit and the shutdown signal is outputted. Device. A panel including a transistor portion and an organic light emitting element portion;
A power supply unit for supplying power to the panel;
A sensing wiring formed on a front surface of the substrate corresponding to a non-display surface of the panel; And
And a short detection unit for sensing whether heat is generated due to a short circuit between electrodes or power supply wiring formed on the panel through the sensing wiring and outputting a shutdown signal for turning off the power supply unit when a short is generated. 9. The method of claim 8,
The sensing wiring
Wherein the organic electroluminescent device is located on an outer surface of a substrate not facing the organic electroluminescent device or an inner surface of a substrate facing the organic electroluminescent device. 9. The method of claim 8,
Wherein the sensing wiring comprises a first metal layer, an organic material layer and a second metal layer,
Wherein the organic material layer is made of a material that is melted by heat generated when a short circuit occurs in the panel. 11. The method of claim 10,
The short-
The first and second sensing layers supply and sense different first and second sensing signals to the first metal layer and the second metal layer, and the organic layer is melted by the heat generated when the panel is short-circuited to generate a change amount in the first and second sensing signals And outputs the shutdown signal to the organic light emitting display device.

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