KR20140051212A - 폴리싱용 구조 부재 - Google Patents

폴리싱용 구조 부재 Download PDF

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Publication number
KR20140051212A
KR20140051212A KR1020147000358A KR20147000358A KR20140051212A KR 20140051212 A KR20140051212 A KR 20140051212A KR 1020147000358 A KR1020147000358 A KR 1020147000358A KR 20147000358 A KR20147000358 A KR 20147000358A KR 20140051212 A KR20140051212 A KR 20140051212A
Authority
KR
South Korea
Prior art keywords
polishing
adhesive layer
monomer
structural member
acrylate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020147000358A
Other languages
English (en)
Korean (ko)
Inventor
준 후지타
유스케 사이토
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20140051212A publication Critical patent/KR20140051212A/ko
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Adhesive Tapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
KR1020147000358A 2011-06-13 2012-06-08 폴리싱용 구조 부재 Withdrawn KR20140051212A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011131587A JP5851124B2 (ja) 2011-06-13 2011-06-13 研磨用構造体
JPJP-P-2011-131587 2011-06-13
PCT/US2012/041535 WO2012173885A2 (en) 2011-06-13 2012-06-08 Structural member for polishing

Publications (1)

Publication Number Publication Date
KR20140051212A true KR20140051212A (ko) 2014-04-30

Family

ID=47357676

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147000358A Withdrawn KR20140051212A (ko) 2011-06-13 2012-06-08 폴리싱용 구조 부재

Country Status (5)

Country Link
JP (1) JP5851124B2 (enrdf_load_stackoverflow)
KR (1) KR20140051212A (enrdf_load_stackoverflow)
CN (1) CN103596729B (enrdf_load_stackoverflow)
TW (1) TW201307504A (enrdf_load_stackoverflow)
WO (1) WO2012173885A2 (enrdf_load_stackoverflow)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160147917A (ko) 2014-05-02 2016-12-23 쓰리엠 이노베이티브 프로퍼티즈 컴파니 불연속된 구조화된 연마 용품 및 작업편의 연마 방법
JP5921790B1 (ja) * 2014-07-07 2016-05-24 バンドー化学株式会社 研磨フィルム
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
KR102295988B1 (ko) 2014-10-17 2021-09-01 어플라이드 머티어리얼스, 인코포레이티드 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
JP6976048B2 (ja) * 2015-11-30 2021-12-01 日東電工株式会社 研磨パッド固定用粘着シート
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
KR102345784B1 (ko) * 2019-07-10 2022-01-03 에프엔에스테크 주식회사 웨이퍼 후면 연마용 고경도 연마패드
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
CN112171532A (zh) * 2020-08-26 2021-01-05 南京航空航天大学 一种自由曲面加工用弹性铣抛工具及其制造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02220838A (ja) * 1989-02-22 1990-09-04 Rodeele Nitta Kk 積層体、並びに該積層体を用いた被研磨部材の保持材及び研磨布
US5441549A (en) * 1993-04-19 1995-08-15 Minnesota Mining And Manufacturing Company Abrasive articles comprising a grinding aid dispersed in a polymeric blend binder
JP3354744B2 (ja) * 1995-04-25 2002-12-09 ニッタ株式会社 研磨布及びその研磨布の研磨機定盤への脱着方法
BR9808152A (pt) * 1997-03-07 2000-03-28 Minnesota Mining & Mfg Artigo abrasivo, sistema para polimento de vidro, processo para o polimento de uma peça e de um artigo de vidro, e, aparelho compreendendo um tubo de raios catódicos
US6077601A (en) * 1998-05-01 2000-06-20 3M Innovative Properties Company Coated abrasive article
JP2000071170A (ja) * 1998-08-28 2000-03-07 Nitta Ind Corp 研磨用ウエハ保持部材及びそのウエハ保持部材の研磨機定盤への脱着方法
JP2000077366A (ja) * 1998-08-28 2000-03-14 Nitta Ind Corp 研磨布及びその研磨布の研磨機定盤への脱着方法
WO2001045900A1 (en) * 1999-12-23 2001-06-28 Rodel Holdings, Inc. Self-leveling pads and methods relating thereto
US6706383B1 (en) * 2001-11-27 2004-03-16 Psiloquest, Inc. Polishing pad support that improves polishing performance and longevity
US7169199B2 (en) * 2002-11-25 2007-01-30 3M Innovative Properties Company Curable emulsions and abrasive articles therefrom
JP4351007B2 (ja) * 2003-09-08 2009-10-28 東洋ゴム工業株式会社 研磨パッド
JP4898172B2 (ja) * 2005-09-08 2012-03-14 日本ミクロコーティング株式会社 研磨パッド及びその製造方法並びに研磨方法
JP2007138015A (ja) * 2005-11-18 2007-06-07 Toyo Ink Mfg Co Ltd 粘着剤及びそれを用いた粘着シート
JP5702912B2 (ja) * 2008-11-21 2015-04-15 積水化学工業株式会社 粘着剤及び研磨布固定用両面粘着テープ
JP5656379B2 (ja) * 2009-03-03 2015-01-21 日立マクセル株式会社 ダイシング用粘着フィルム、及び半導体素子の製造方法
JP2011044461A (ja) * 2009-08-19 2011-03-03 Nitta Corp レーザーダイシング用粘着テープ
JP2011074308A (ja) * 2009-10-01 2011-04-14 Three M Innovative Properties Co 透明粘着シート及びそれを含む画像表示装置

Also Published As

Publication number Publication date
CN103596729B (zh) 2017-01-18
TW201307504A (zh) 2013-02-16
JP5851124B2 (ja) 2016-02-03
WO2012173885A3 (en) 2013-05-02
WO2012173885A2 (en) 2012-12-20
JP2013000809A (ja) 2013-01-07
CN103596729A (zh) 2014-02-19

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20140107

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid