KR20140049623A - Apparatus and method of unloading substrate - Google Patents

Apparatus and method of unloading substrate Download PDF

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Publication number
KR20140049623A
KR20140049623A KR1020120115334A KR20120115334A KR20140049623A KR 20140049623 A KR20140049623 A KR 20140049623A KR 1020120115334 A KR1020120115334 A KR 1020120115334A KR 20120115334 A KR20120115334 A KR 20120115334A KR 20140049623 A KR20140049623 A KR 20140049623A
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South Korea
Prior art keywords
substrate
edge
signal
flip
flop
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KR1020120115334A
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Korean (ko)
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육진호
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엘지디스플레이 주식회사
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Priority to KR1020120115334A priority Critical patent/KR20140049623A/en
Publication of KR20140049623A publication Critical patent/KR20140049623A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention provides a carrier robot comprising a robot hand moving along an x axis to carry out a substrate; First and second substrate detection sensors mounted on the robot hand and one of which is positioned forward of the other on the x axis; A signal processing circuit for detecting and combining edges of the first and second sensor signals generated by the first and second substrate detection sensors, respectively, and outputting an edge synthesis signal; And a controller having a high speed trigger channel to which the edge synthesis signal is input, and calculating a skewed angle of the substrate based on edges of the first and second sensor signals reflected in the edge synthesis signal, wherein the robot hand is configured to calculate the angle. Provided is a substrate conveying apparatus which rotates by a twisted angle of the prepared substrate and aligns with the substrate.

Description

Substrate conveying apparatus and conveying method {Apparatus and method of unloading substrate}

The present invention relates to a substrate transfer device, and more particularly, to a substrate transfer device and a transfer method.

As the information society develops, the demand for display devices for displaying images is increasing in various forms. Recently, liquid crystal displays (LCDs), plasma display panels (PDPs), and organic light emitting diodes Various flat display devices such as organic light emitting diode displays (OLEDs) are being utilized.

These flat panel display devices may be manufactured by repeatedly forming manufacturing processes such as thin film deposition, etching, and cleaning to form a plurality of thin films on a substrate.

In carrying out the manufacturing process, the substrate on which the previous process is performed is loaded into the cassette and transported and then conveyed from the cassette to carry out the next process.

In order to transport the substrate, the substrate transport apparatus is provided with a transport robot configured with a robot hand. The robot hand enters the lower part of the substrate, seats the substrate on the upper surface, and then ejects the substrate from the cassette.

By the way, due to various factors, the substrate is generally placed in the cassette at a predetermined angle. As such, when the substrate in the twisted state is taken out as it is, the cassette may be damaged and the substrate may be damaged.

In order to prevent this, two substrate detection sensors are mounted on both left and right sides based on the moving direction of the robot hand, and a method of detecting a skewed angle of the substrate has been proposed. Through this, the robot hand can be rotated by the distorted angle so that the substrate and the robot hand can be aligned.

The output signals of the left and right substrate detection sensors are input to the general channels provided in the controller.

The normal channel of the controller has a signal scan period of about 2ms. By the way, the moving speed of the robot hand for detecting the wrong angle of the substrate detection sensor is approximately 1.676 mm / ms assuming a constant velocity.

Therefore, when using a general channel having a relatively long signal scan period, an error occurs in the detection signal detection time. That is, an error occurs with respect to the position of the side portion of the substrate.

This causes an error of the skewed angle of the substrate, resulting in misalignment of the robot hand and the substrate.

On the other hand, the controller is equipped with a fast trigger channel with a considerably faster scan period than the normal channel. The fast trigger channel will have a scan period of approximately 0.1us. When the high speed trigger channel is used as a channel for signal detection, the signal detection error as described above can be minimized.

However, only one high speed trigger channel is provided in the controller. Accordingly, there is a problem in that the controller cannot receive the left and right detection sensor signals.

An object of the present invention is to provide a method for using a single high speed trigger channel provided in a controller of a substrate transfer device as an input channel of a substrate detection sensor signal.

In order to achieve the object as described above, the present invention includes a carrier robot including a robot hand moving along the x axis to carry out the substrate; First and second substrate detection sensors mounted on the robot hand and one of which is positioned forward of the other on the x axis; A signal processing circuit for detecting and combining edges of the first and second sensor signals generated by the first and second substrate detection sensors, respectively, and outputting an edge synthesis signal; And a controller having a high speed trigger channel to which the edge synthesis signal is input, and calculating a skewed angle of the substrate based on edges of the first and second sensor signals reflected in the edge synthesis signal, wherein the robot hand is configured to calculate the angle. Provided is a substrate conveying apparatus which rotates by a twisted angle of the prepared substrate to align with the substrate.

The signal processing circuit may include: a first flip-flop circuit that is triggered at an edge of the first sensor signal and outputs a first edge signal in which the edge of the first sensor signal is inverted; A second flip-flop circuit triggered at an edge of the second sensor signal and outputting a second edge signal in which the edge of the second sensor signal is inverted; And a NAND gate configured to NAND the first and second edge signals to output the edge synthesis signal.

The signal processing circuit may include a level conversion block for down-leveling the high voltage of each of the first and second sensor signals and outputting the high voltage to the first and second flip-flop circuits.

At least one of the first and second flip-flop circuits includes: a D-type flip-flop that is triggered at an edge of the inverted sensor signal and outputs an edge signal in which the edge of the inverted sensor signal is inverted; And an inverting buffer inverting the edge signal outputted from the D-type flip-flop and outputting the inverted signal to the NAND gate. The high voltage may be input to the D (data) terminal of the D flip-flop, and the high voltage may be inverted to the S (set) terminal of the D-type flip flop.

A drive motor for transmitting a driving force to the transport robot; The motor driver may include a motor driver encoding the driving signal output from the controller and transferring the driving signal to the driving motor.

In another aspect, the present invention is the first and second substrate detection sensors mounted on the robot hand of the carrier robot moving along the x-axis to move the substrate and one is located in front of the other relative to the x-axis, the first And generating two sensor signals; In the signal processing circuit, detecting and combining edges of the input first and second sensor signals to generate an edge synthesis signal; At the controller, receiving the edge synthesis signal through a high speed trigger channel and calculating a skewed angle of the substrate based on edges of the first and second sensor signals reflected in the input edge synthesis signal; The robot hand is rotated by the twisted angle of the calculated substrate to provide a substrate transfer method comprising the step of aligning with the substrate.

The signal processing circuit may include: a first flip-flop circuit that is triggered at an edge of the first sensor signal and outputs a first edge signal in which the edge of the first sensor signal is inverted; A second flip-flop circuit triggered at an edge of the second sensor signal and outputting a second edge signal in which the edge of the second sensor signal is inverted; And a NAND gate configured to NAND the first and second edge signals to output the edge synthesis signal.

The signal processing circuit may include a level conversion block for down-leveling the high voltage of each of the first and second sensor signals and outputting the high voltage to the first and second flip-flop circuits.

At least one of the first and second flip-flop circuits includes: a D-type flip-flop that is triggered at an edge of the inverted sensor signal and outputs an edge signal in which the edge of the inverted sensor signal is inverted; And an inverting buffer inverting the edge signal output from the D-type flip-flop and outputting the inverted signal to the NAND gate, wherein an edge signal output from the inverting buffer is inverted and input to the R (reset) terminal of the D-type flip-flop. The high voltage may be input to the D (data) terminal of the D flip-flop, and the high voltage may be inverted to the S (set) terminal of the D-type flip flop.

Aligning the substrate with the robot hand, and then placing the substrate on the robot hand; And returning the robot hand on which the substrate is seated to the pre-alignment position and then removing the substrate.

According to the present invention, a single composite signal reflecting edge information of a sensor signal may be generated by detecting edges using a flip-flop circuit and synthesizing them through NAND operation.

Such a composite signal can be input to a single high speed trigger channel provided in the controller, so that a single high speed trigger channel can be used as an input channel of the substrate detection sensors.

1 is a block diagram schematically showing a substrate transport apparatus according to an embodiment of the present invention.
Figure 2 is a plan view schematically showing a robot of the substrate transfer apparatus according to an embodiment of the present invention.
3 is a view schematically showing a state in which the first and second substrate detection sensors move to detect a substrate according to an embodiment of the present invention.
4 is a waveform diagram illustrating first and second sensor signals output from first and second substrate detection sensors of FIG. 3.
5 is a block diagram schematically showing a signal processing circuit according to an embodiment of the present invention.
6 is a waveform diagram showing signals processed in a signal processing circuit according to an embodiment of the present invention.
7 is a circuit diagram schematically showing an example of the configuration of a flip-flop circuit according to an embodiment of the present invention.
8 is a flow chart schematically showing a method of transporting a substrate using a substrate transport apparatus according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

1 is a block diagram schematically showing a substrate transfer apparatus according to an embodiment of the present invention, Figure 2 is a plan view schematically showing a robot of the substrate transfer apparatus according to an embodiment of the present invention.

1 and 2, a substrate transfer apparatus 100 according to an embodiment of the present invention includes a transfer robot 110, a substrate detection sensor 120, a drive motor 130, and a motor driver 140. And a controller 150 and a signal processing circuit 200.

The transport robot 110 corresponds to a configuration for transporting the substrate S to a processing apparatus that performs thin film deposition on a substrate loading means such as a cassette (not shown).

Referring to FIG. 2, the transport robot 110 may include a robot body 111 and a robot hand 112.

The robot body 111 includes a plurality of joints and links, so that the transport robot 110 can linearly move along the x-axis direction, for example. The robot hand 112 is connected to the end of the robot body 111 to move the substrate (S) is directly seated on the upper surface during the substrate transfer process.

The robot hand 112 may move in the x-axis direction by the operation of the robot body 111. Meanwhile, the robot hand 112 may be configured to be rotatable on the xy plane as a plane parallel to the substrate surface. Accordingly, the robot hand 112 may be rotated by an angle to achieve position alignment with the substrate S. FIG.

On the other hand, the robot body 111 or the robot hand 112 may be configured to allow the lifting motion in the z-axis direction perpendicular to the xy plane. Accordingly, the substrate S may be seated on the top surface of the robot hand 112 or may be detached from the top surface of the robot hand 112.

A plurality of substrate detection sensors 120 for detecting the distorted angle θ of the substrate S may be configured on the upper surface of the robot hand 112. For example, two first and second substrate detection sensors 121 and 122 may be configured as the substrate detection sensor 120.

The first and second substrate detection sensors 121 and 122 may be disposed at both sides of the robot hand 112 based on the entry direction of the robot hand 112. For example, the first and second substrate detection sensors 121 and 122 may be disposed at equal distances in the y axis direction with respect to the center axis in the x axis direction (that is, the y coordinate values are opposite to each other. May be disposed), but is not limited thereto.

On the other hand, the first and second substrate detection sensors 121 and 122 are arranged such that the x coordinate values have different values. For example, the first substrate detection sensor 121 may be disposed in front of or behind the second substrate detection sensor 122. Here, the separation distance d between the first and second substrate detection sensors 121 and 122 may be adjusted according to factors such as the size of the substrate S.

As such, by arranging one of the first and second substrate detection sensors 121 and 122 in the front relatively, the sensor disposed in front of the front can detect the substrate in preference to the sensor disposed in the rear. That is, except in the case where the substrate S is extremely misaligned, the sensor disposed in front of the normal environment can detect the substrate S preferentially.

Meanwhile, in the embodiment of the present invention, for convenience of description, the case where the first substrate detection sensor 121 is disposed ahead of the second substrate detection sensor 122 based on the + x direction is taken as an example.

The first and second substrate detection sensors 121 and 122 may detect the presence or absence of a substrate during the scan period as a section set for the substrate detection.

In this regard, for example, when the robot hand 112 starts to move in the + x direction and reaches a preset position or time, the first and second substrate detection sensors 121 and 122 are respectively configured during the scan period. The first and second sensor signals SS1 and SS2 are output.

For example, when the substrate S is present on the substrate detection sensors 121 and 122, the high voltage sensor signals SS1 and SS2 are output. If the substrate S does not exist, the low voltage sensor signal is output. (SS1, SS2) are output. Here, the high voltage may be 24V and the low voltage may be 0V.

Accordingly, the first and second sensor signals SS1 and SS2 have edges that change from a low state to a high state. That is, while the robot hand 112 moves while moving in a linear motion for seating the substrate S, the side side (L) is based on the side L of the substrate S positioned on the entry side of the robot hand 112. L) has a low state before, and has a high state after the side (L). As a result, rising edges of the first and second sensor signals SS1 and SS2 in which the state of the signal is changed at the point of the side L of the corresponding substrate S are generated.

When the edges of the first and second sensor signals SS1 and SS2 are detected, the twisted degree of the substrate S, that is, the twisted angle, can be calculated.

A method of calculating the skewed angle of the substrate S will be described further with reference to FIGS. 3 and 4. 3 is a diagram schematically illustrating a state in which the first and second substrate detection sensors move to detect a substrate according to an embodiment of the present invention, and FIG. This is a waveform diagram showing 1 and 2 sensor signals.

3 and 4, while the robot hand 112 moves in the + x direction, the first substrate detection sensor 121 corresponds to the side L of the substrate S at a first time t1. At the first point a, the first sensor signal SS1 in the high state is output. That is, the edge of the first sensor signal SS1 is generated at the first point a.

Then, at a second time t2, the second substrate detection sensor 122 outputs the second sensor signal SS2 in a high state at a corresponding second point b of the side surface L of the substrate S. FIG. do. That is, the edge of the second sensor signal SS2 is generated at the second point b.

At this time, the x coordinate value of the second substrate detection sensor 122 at the start of scanning of the detection sensors 121 and 122 is set to 0, and the first substrate detection sensor 121 is smaller than the second substrate detection sensor 122. Suppose it is located forward by the separation distance d in the + x direction.

In this case, the x coordinate value xa of the first point a is obtained by integrating the speed of the robot hand 112 to the edge generation time t1 of the first sensor signal S1. It can be calculated by adding the separation distance d of the two substrate detection sensors 121 and 122.

The x coordinate value xb of the second point b may be detected by integrating the speed of the robot hand 112 to the edge generation time t2 of the first sensor signal S1.

Accordingly, the difference value xab based on the x direction between the first and second points a and b becomes xab = (xb-xa).

Meanwhile, the difference value based on the y direction between the first and second points a and b is a difference value based on the y direction between the first and second substrate detection sensors 121 and 122, which is yab. Let's say

Then, the distorted angle θ with respect to the y axis is θ = tan-1 (xab / yab).

As described above, when the edges of the sensor signals SS1 and SS2 are detected, the sides L of the side sides L of the substrate S intersecting the x-direction moving paths of the substrate detection sensors 121 and 122 are detected. The location can be determined. Thereby, the distorted angle (theta) of the board | substrate S can be calculated.

On the other hand, the above-mentioned transport robot 110 receives the driving force from the drive motor 130 to perform the related operation. The driving motor 130 receives the driving signal from the motor driver 140 and drives the transport robot 110 in response thereto.

The motor driver 140 receives a driving signal such as position information and speed information from the controller 150, encodes it, and transfers the driving signal to the driving motor 130.

The controller 150 corresponds to a configuration for controlling overall operations of the substrate transfer device 100 as a whole. For example, the controller 150 may output the driving signal to control the overall operation of the carrier robot 110.

In addition, the controller 150 receives the edge synthesis signal ECS in which the edge information of the sensor signals SS1 and SS2 are combined to calculate the skewed angle θ of the substrate S, and corrects the skewed angle θ. It outputs a driving signal for Accordingly, the robot hand 112 and the substrate S can be aligned.

On the other hand, in order to minimize the error of the distorted angle (θ), the controller 150 of the first and second sensor signals (SS1, SS2) through a single high-speed trigger channel (CH) that is significantly shorter than the normal channel signal scan period Edge information is received.

As such, in order to receive the edge information of the first and second sensor signals SS1 and SS2 in the single high speed trigger channel CH, in the embodiment of the present invention, signal processing is performed between the controller 150 and the substrate detection sensor 120. The circuit 200 is configured, which will be described with reference to FIGS. 5 and 6.

5 is a block diagram schematically showing a signal processing circuit according to an embodiment of the present invention, and FIG. 6 is a waveform diagram showing signals processed in the signal processing circuit according to an embodiment of the present invention.

Referring to FIG. 5, the signal processing circuit 200 may include a flip flop block 210 and a NAND gate 220.

The flip-flop block 210 receives the first sensor signal SS1 and outputs the first edge signal ES1, and the second flip-flop block 210 receives the second sensor signal SS2. It may include a second flip-flop circuit 212 for outputting the edge signal (ES2).

Meanwhile, the high voltages of the sensor signals SS1 and SS2 input to the flip-flop block 210 are approximately 24 V, and the level conversion block 230 is the flip-flop block 210 in order to convert it to a high voltage having a lower value. It can be configured at the front end.

Through such a level conversion block 230, for example, a high voltage of 24V can be leveled down to a high voltage of 5V.

Here, the level conversion block 230 may be configured to include, for example, an RC filter for noise blocking and a photo coupler for leveling down.

The first and second sensor signals SS1 and SS2 having the high voltage leveled down through the level conversion block 230 are used as clock signals of the first and second flip-flop circuits 211 and 212, respectively.

Each of the first and second flip-flop circuits 211 and 212 is triggered by the rising edges of the input first and second sensor signals SS1 and SS2, so that the edges in the opposite directions to the edges of the sensor signals SS1 and SS2 The signals ES1 and ES2 having inverted edges are output.

In this regard, for example, the first flip-flop circuit 211 is triggered by the rising edge of the first sensor signal SS1 to generate a falling edge in which the rising edge is inverted. Similarly, the second flip-flop circuit 212 is triggered by the rising edge of the second sensor signal SS2 to generate a falling edge in which the rising edge is inverted.

As described above, the output signals ES1 and ES2 having the falling edge are inverted again to the reset terminals of the flip-flop circuits 211 and 212. As a result, the flip-flop circuits 211 and 212 are very short pulse signals, and the edge signals ES1 and ES2 having the falling edge are output.

As such, the first and second edge signals ES1 and ES2 output from the first and second flip-flop circuits 211 and 212 are input to the NAND gate 220 to perform NAND operation.

According to the NAND operation, a single edge synthesis signal ECS obtained by combining the edges of each of the first and second edge signals ES1 and ES2 can be output.

In this regard, when the first and second edge signals ES1 and ES2 have the falling edge at the first and second times t1 and t2, the rising edge is generated by the NAND operation at the first time t1. do. Similarly, the rising edge is generated by the NAND operation in the second time t2.

As described above, the NAND operation of the first and second edge signals ES1 and ES2 results in both a rising edge of the first sensor signal SS1 and a rising edge of the second sensor signal SS2 detected and synthesized. The synthesized signal ECS can be generated.

The generated edge synthesis signal ECS is supplied to the fast trigger channel CH of the controller 150. Accordingly, the controller 150 may include the first and second points a of the side L of the substrate S based on the rising edges of the first and second sensor signals SS1 and SS2 reflected in the edge synthesis signal ECS. , the position of b) can be accurately calculated, and the twist angle [theta] of the substrate S can be calculated.

Meanwhile, the above-described first and second flip-flop circuits 211 and 212 may be configured in various forms. An example thereof will be described with reference to FIG. 7. 7 is a circuit diagram schematically showing an example of the configuration of a flip-flop circuit according to an embodiment of the present invention.

The flip-flop circuit shown in FIG. 7 may be used as the first flip-flop circuit 211 and / or the second flip-flop circuit 212 described above.

Referring to FIG. 7, the flip-flop circuit may include a D-type flip-flop FF and a plurality of inverting buffers IA1 to IA4.

The flip-flop FF of the D type may receive the inverted sensor signal SS at the C (clock) terminal. To this end, the first inverting buffer IA1 may be connected to the input side of the C stage.

A high voltage may be input to the D (data) terminal and an inverted high voltage may be input to the S (set) terminal. Here, as the high voltage input to the D stage, for example, a voltage of 5 V, which is the above-described leveled down high voltage, may be used.

A second inversion buffer IA2 may be connected to the output side of the Q output terminal to invert the Q output. The Q output inverted as described above corresponds to the edge signal ES.

The inverted edge signal ES may be input to the R (reset) terminal. In this regard, for example, the edge signal ES output from the second inverting buffer IA2 may be configured to be input to the inverting R stage through the third and fourth inverting buffers IA3 and IA4.

Incidentally, reference numerals R, C, and D in FIG. 7 denote resistors, capacitors, and diodes, respectively.

By using the flip-flop circuit having the configuration as described above, it is possible to generate the edge signal (ES) from the input sensor signal (SS).

Hereinafter, with reference to FIG. 8 further, the method of conveying a board | substrate using the board | substrate conveyance apparatus which concerns on embodiment of this invention is demonstrated. 8 is a flowchart schematically illustrating a method of transporting a substrate using a substrate transport apparatus according to an embodiment of the present invention.

Referring to FIG. 8, the carrier robot 110 is moved in the + x direction toward the substrate S (st1).

Next, the substrate detection scan is performed using the first and second substrate detection sensors 121 and 122 during the scan period during the movement of the transport robot 110 (st2). Accordingly, the first and second sensor signals SS1 and SS2 are generated from the first and second substrate detection sensors 121 and 122.

Next, the edges of the first and second sensor signals SS1 and SS2 are detected and synthesized using the signal processing circuit 200, and the synthesized signal ECS is input to the fast trigger channel of the controller 150. (st3).

Next, the distorted angle θ of the substrate S is calculated based on edges of the first and second sensor signals SS1 and SS2 reflected in the input composite signal ECS.

Next, the controller 150 outputs the twisted angle θ information of the substrate S to the motor driver 140 and operates the driving motor 130 to rotate the robot hand 112 by the twisted angle θ. Let's do it. Through this, the robot hand 112 and the substrate S are aligned (st5).

Next, the robot hand 112 is raised to seat the substrate S on the upper surface (st6).

Next, in a state where the substrate S is seated, the robot hand 112 is rotated opposite to the twisted angle direction to return to the position before alignment (st7).

Next, the transport robot 110 is moved in the -x direction to carry out the substrate S (st8).

Through the process as described above, it is possible to effectively transport the substrate using the substrate transport apparatus according to an embodiment of the present invention.

As described above, according to an embodiment of the present invention, a single synthesized signal in which edge information of a sensor signal is reflected by detecting edges using a flip-flop circuit and synthesized through a NAND operation for the separately inputted sensor signals Can be generated.

Such a composite signal can be input to a single high speed trigger channel provided in the controller, so that a single high speed trigger channel can be used as an input channel of the substrate detection sensors.

The embodiment of the present invention described above is an example of the present invention, and variations are possible within the spirit of the present invention. Accordingly, the invention includes modifications of the invention within the scope of the appended claims and equivalents thereof.

200: signal processing circuit 210: flip-flop block
211: first flip-flop circuit 212: second flip-flop circuit
220: NAND gate 230: level conversion block
SS1 and SS2: first and second sensor signals
ES1 and ES2: first and second edge signals
ECS: Edge Synthesis Signal

Claims (10)

A transport robot including a robot hand moving along the x axis to carry out the substrate;
First and second substrate detection sensors mounted on the robot hand and one of which is positioned forward of the other on the x axis;
A signal processing circuit for detecting and combining edges of the first and second sensor signals generated by the first and second substrate detection sensors, respectively, and outputting an edge synthesis signal;
A controller having a high speed trigger channel to which the edge synthesis signal is input, and calculating a skewed angle of the substrate based on edges of the first and second sensor signals reflected in the edge synthesis signal;
The robot hand rotates by the distorted angle of the calculated substrate to align with the substrate
Substrate Carrier.
The method of claim 1,
The signal processing circuit,
A first flip-flop circuit triggered at an edge of the first sensor signal and outputting a first edge signal in which the edge of the first sensor signal is inverted;
A second flip-flop circuit triggered at an edge of the second sensor signal and outputting a second edge signal in which the edge of the second sensor signal is inverted;
And a NAND gate configured to NAND the first and second edge signals to output the edge synthesis signal.
Substrate Carrier.
3. The method of claim 2,
The signal processing circuit includes a level conversion block for down-leveling the high voltage of each of the first and second sensor signals and outputting the high voltage to the first and second flip-flop circuits.
Substrate Carrier.
3. The method of claim 2,
At least one of the first and second flip-flop circuit,
A D-type flip-flop that is triggered at an edge of the inverted sensor signal and outputs an edge signal in which the edge of the inverted sensor signal is inverted;
An inverting buffer inverting the edge signal outputted from the D flip-flop and outputting the inverted buffer to the NAND gate;
An edge signal output from the inversion buffer is inverted and input to an R (reset) terminal of the D type flip-flop,
A high voltage is input to the D (data) terminal of the D flip-flop,
The high voltage is inverted and input to the S (set) terminal of the D flip-flop.
Substrate Carrier.
The method of claim 1,
A drive motor for transmitting a driving force to the transport robot;
A motor driver that encodes a driving signal output from the controller and transfers the driving signal to the driving motor.
Substrate conveying apparatus comprising a.
In the first and second substrate detection sensors mounted on the robot hand of the transport robot moving along the x axis to move the substrate and one is located ahead of the other with respect to the x axis, the first and second sensor signals are generated. Steps;
In the signal processing circuit, detecting and combining edges of the input first and second sensor signals to generate an edge synthesis signal;
At the controller, receiving the edge synthesis signal through a high speed trigger channel and calculating a skewed angle of the substrate based on edges of the first and second sensor signals reflected in the input edge synthesis signal;
Rotating the robot hand by the distorted angle of the substrate to align the substrate with the substrate;
Substrate conveying method comprising a.
The method according to claim 6,
The signal processing circuit,
A first flip-flop circuit triggered at an edge of the first sensor signal and outputting a first edge signal in which the edge of the first sensor signal is inverted;
A second flip-flop circuit triggered at an edge of the second sensor signal and outputting a second edge signal in which the edge of the second sensor signal is inverted;
And a NAND gate configured to NAND the first and second edge signals to output the edge synthesis signal.
Substrate conveying method.
The method of claim 7, wherein
The signal processing circuit includes a level conversion block for down-leveling the high voltage of each of the first and second sensor signals and outputting the high voltage to the first and second flip-flop circuits.
Substrate conveying method.
The method of claim 7, wherein
At least one of the first and second flip-flop circuit,
A D-type flip-flop that is triggered at an edge of the inverted sensor signal and outputs an edge signal in which the edge of the inverted sensor signal is inverted;
An inverting buffer inverting the edge signal outputted from the D flip-flop and outputting the inverted buffer to the NAND gate;
An edge signal output from the inversion buffer is inverted and input to an R (reset) terminal of the D type flip-flop,
A high voltage is input to the D (data) terminal of the D flip-flop,
The high voltage is inverted and input to the S (set) terminal of the D flip-flop.
Substrate conveying method.
The method according to claim 6,
After aligning the robot hand and the substrate,
Mounting the substrate on the robot hand;
Returning the robot hand on which the substrate is seated to a position before the alignment and then removing the substrate
Substrate conveying method comprising a.
KR1020120115334A 2012-10-17 2012-10-17 Apparatus and method of unloading substrate KR20140049623A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108666258A (en) * 2017-03-31 2018-10-16 奇景光电股份有限公司 Wafer jig and the method that wafer is clamped

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108666258A (en) * 2017-03-31 2018-10-16 奇景光电股份有限公司 Wafer jig and the method that wafer is clamped

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