CN108666258A - Wafer jig and the method that wafer is clamped - Google Patents
Wafer jig and the method that wafer is clamped Download PDFInfo
- Publication number
- CN108666258A CN108666258A CN201710209060.8A CN201710209060A CN108666258A CN 108666258 A CN108666258 A CN 108666258A CN 201710209060 A CN201710209060 A CN 201710209060A CN 108666258 A CN108666258 A CN 108666258A
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- Prior art keywords
- wafer
- platform
- push rod
- sensor
- top surface
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
Abstract
A kind of method that the present invention proposes wafer jig and holding chip, the wafer chuck include the platform with top surface；Stopper is set to the front end of platform；Push rod is set to the rear end of platform；At least an actuator is articulated in push rod；Sensor is set to the front end of platform, to measure sensor and the distance between wafer thereon.
Description
Technical field
The present invention relates to a kind of wafer jig (wafer clamp) more particularly to a kind of crystalline substances suitable for robot system
Circle fixture, to pick up and place wafer.
Background technology
Manipulator (robotic hand) or the tooth fork (fork) of robot system generally to automatic Picking and are placed brilliant
Circle (wafer or chip).Wafer is clamped using vacuum tooth fork (vacuum fork) in traditional robot system.Due to tradition
Vacuum tooth fork is easily dislocated (misalignment) situation so that wafer can not be refined contraposition and pickup, cause wafer
It falls and ruptures.
In addition, traditional vacuum tooth fork is the top surface or bottom surface designed to contact wafer to be picked up.Such equipment can not be applicable in
In some wafers, such as optical element (such as optical lens or glass).
In consideration of it, a kind of engagement type (engaged) tooth fork is therefore proposed, to improve the missing of vacuum tooth fork.However, traditional
Engagement type tooth fork can not be fast moved and be rotated, thus cause kicking down for wafer 10.
Wafer effectively can not be aligned and pick up in view of tradition machinery tooth fork, therefore there is an urgent need for propose a kind of novel wafer clamp
Tool, to improve the shortcomings that tradition machinery tooth is pitched.
Invention content
In view of above-mentioned, the first purpose of the embodiment of the present invention is to propose a kind of wafer jig suitable for robot system
And the method for clamping wafer.The wafer jig that the embodiment of the present invention is provided can precisely to being located at wafer, and can fast move and
It rotates without and causes kicking down for wafer.
According to embodiments of the present invention, wafer jig includes platform, stopper, push rod, at least an actuator and sensor.It is flat
Platform has a top surface.Stopper is set to the front end of platform, and push rod is set to the rear end of platform.Actuator is articulated in push rod.Sensing
Device is set to the front end of platform, to measure sensor and the distance between wafer thereon.
According to the method for the clamping wafer that another embodiment of the present invention is proposed, mobile wafer jig extremely has wafer
Slot.Sensor detects the presence of wafer on sensor.Wafer jig is continued to move along, until sensor detects wafer
Be not present.Wafer jig is up moved, and activate an at least actuator and by push rod toward being pushed forward so that wafer is by firmly
It is held between stopper and push rod.
The beneficial effects of the present invention are, (vacuum fork) is pitched compared to traditional vacuum tooth, it is provided by the present invention
Wafer chuck is using sensor (especially FIBER OPTIC SENSORS) with precisely to being located at wafer.Wafer chuck provided by the present invention makes
With actuator (especially pneumatic cylinder) to fast move and rotate, without causing kicking down for chip.
Description of the drawings
Figure 1A shows the perspective view of the wafer jig suitable for robot system of the embodiment of the present invention.
The perspective view of the pneumatic cylinder of Figure 1B view similars.
The perspective view of the FIBER OPTIC SENSORS of Fig. 1 C view similars.
Fig. 2 shows the vertical view of the wafer jig of Figure 1A.
Fig. 3 A to Fig. 3 D displays are using the wafer jig of Figure 1A to pick up the flow diagram of wafer.
Fig. 4 shows the perspective view of Fig. 3 D.
Wherein, the reference numerals are as follows：
100 wafer jigs
10 wafers
11 platforms
12 stoppers
13 push rods
14 actuators
15 panels
16 sensors
17 mounting holes
18 mounting holes
31 cassettes
The first distances of d1
D2 second distances
Specific implementation mode
Figure 1A shows the perspective view of the wafer jig 100 suitable for robot system of the embodiment of the present invention.Fig. 2 display figures
The vertical view of the wafer jig 100 of 1A.Wafer 10 can be temporarily clamped in fixed position, to keep away in the wafer jig 100 of the present embodiment
Exempt from mobile or detaches.Wafer jig 100 especially (but non-limiting) but will not can touch the top surface of wafer wafer is clamped
Or bottom surface.When wafer jig 100 be used as manipulator, coordinate the other elements of robot system to pick up and place 10 (example of wafer
Such as optical lens or glass) when, then wafer jig 100 is alternatively referred to as mechanical tooth fork (robot fork).
In the present embodiment, wafer jig 100 may include platform (platform) 11, with flat top.Platform 11
Under wafer 10, to support wafer 10.
The wafer jig 100 of the present embodiment may include stopper (stopper) 12, be set to the front end of platform 11.In this reality
It applies in example, stopper 12 is fixedly arranged on platform 11, and the top surface of stopper 12 is higher than the top surface of platform 11.Therefore, when wafer 10 supports
When on platform 11, the top surface of stopper 12 is identical or top surface higher than wafer 10.In one embodiment, stopper 12 can with it is flat
Platform 11 is integrally formed.In another embodiment, stopper 12 can manufacture respectively with platform 11, then (using adhesive) is installed in one
It rises.
The wafer jig 100 of the present embodiment may include push rod 13, be set to the rear end of platform 11.In the present embodiment, push rod
13 can move relative to the rear end of platform 11, and the top surface of push rod 13 is higher than the top surface of platform 11.Therefore, when wafer 10 supports
When on platform 11, the top surface of push rod 13 is identical or top surface higher than wafer 10.
The wafer jig 100 of the present embodiment also may include an at least actuator (actuator) 14, be pivotally connected (pivotally
Connected) in push rod 13.Wherein, actuator 14 can (that is, front end of past platform 11) pushes forward by push rod 13 so that brilliant
Circle 10 can be held fixedly between stopper 12 and push rod 13.Embodiment as shown in Figure 1A, two actuators 14 are parallel to be articulated in
Push rod 13.In another embodiment, an actuator 14 at least an auxiliary rod (not shown) is parallel is articulated in push rod 13.
In the present embodiment, actuator 14 may include pneumatic cylinder (pneumatic cylinder), also known as cylinder (air
Cylinder), be it is a kind of using compressed gas to generate the mechanical device of linear reciprocating motion power.Pneumatic cylinder have it is quiet,
The advantages that totally few with occupied space.The perspective view of the pneumatic cylinder 14 of Figure 1B view similars.Steven
The pneumatic cylinder of model C J1 manufactured by Engineering companies (California, USA) is applicable to the present embodiment, but is not limited to
This.Although the present embodiment uses pneumatic cylinder, other mechanical devices can also be used instead.
In the present embodiment, pneumatic cylinder 14 has the function of spring return function (spring return), when pneumatic cylinder does not activate
When, the front end of pneumatic cylinder 14 can be returned to home position by internal spring (not shown).Therefore, push rod 13 can be pulled (also
Moved toward the opposite direction of 11 front end of platform), thus freeing that wafer 10.In another embodiment, pneumatic cylinder 14 does not have spring
Return function, but so that it is moved toward the opposite direction of 11 front end of platform from external springs (not shown).Pneumatic cylinder 14 can be by face
Plate (plate) 15 supports.In one embodiment, panel 15 is made as a module together with pneumatic cylinder 14, can it is fixed (such as through
By mounting hole 17, spiral shell is set) in the other parts of wafer jig 100.
The wafer jig 100 of the present embodiment more may include sensor 16, be set to stopper 12 or set on the front end of platform 11.
Sensor 16 faces upward, to measure sensor 16 and the distance between object (being in this example wafer 10) thereon.Control
Device (not shown) transmission control signal receives sensing signal caused by sensor 16 to sensor 16, and controllable actuating
Device 14.
In the present embodiment, sensor 16 includes FIBER OPTIC SENSORS (fiber optic sensor), such as reflection-type
(reflective) FIBER OPTIC SENSORS, by the characteristic for changing optical fiber so that measured quantity (measured quantity) modulation
The intensity, phase of light, polarization (polarization), wavelength or transit time in optical fiber, to measure distance.Optical fiber senses
Utensil have the advantages that it is small, from electromagnetic interference, resist high voltage and temperature.The optical fiber sense of Fig. 1 C view similars
Survey the perspective view of device.The FIBER OPTIC SENSORS of model FU manufactured by Ji Ensi (Keyence) company (Taiwan) is applicable to this reality
Example is applied, but not limited thereto.In one embodiment, FIBER OPTIC SENSORS is made as a module, can be fixed (such as via mounting hole
18 and spiral shell is set) in the other parts of wafer jig 100.Although the present embodiment uses FIBER OPTIC SENSORS, other can also be used instead
Sensor.
The flow of wafer 10 is picked up in Fig. 3 A to Fig. 3 D displays using the wafer jig 100 of Figure 1A from cassette (cassette) 31
Schematic diagram.First, as shown in Figure 3A, manipulator of the wafer jig 100 as robot system is moved to a slot of cassette 31
(slot).At this point, actuator 14 is not yet activated, therefore push rod 13 is located at the position (backward) (that is, raw bits backward
It sets).Sensor 16 detects the presence of wafer 10 according to the first distance d1 measured between sensor 16 and wafer 10.
In one embodiment, when sensor 16 receives reflection from the optical signal of wafer 10, then the presence of wafer 10 is detected.
As shown in Figure 3B, wafer jig 100 continues to move along, and second distance d2 is arrived until sensor 16 measures, big
In the first distance d1, thus detect being not present for wafer 10.In the present embodiment, when sensor 16 does not receive reflection eleutheromorph
The optical signal of circle 10, then detect being not present for wafer 10.
As shown in Figure 3 C, when detecting being not present for wafer 10, then wafer jig 100 up moves, and 14 quilt of actuator
Actuating and by push rod 14 toward being pushed forward (that is, toward front end of platform 11) so that wafer 10 be held fixedly in stopper 12 with push away
Between bar 13.Finally, as shown in Figure 3D, wafer jig 100 is lifted to leave cassette 31.Fig. 4 shows the perspective view of Fig. 3 D.
According to above-described embodiment, (vacuum fork) is pitched compared to traditional vacuum tooth, wafer clamp provided by the present invention
Tool 100 is using sensor 16 (especially FIBER OPTIC SENSORS) with precisely to being located at wafer 10.Wafer jig provided by the present invention
100 using actuator 14 (especially pneumatic cylinder) to fast move and rotate, without causing kicking down for wafer 10.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not limited to the guarantor of claims of the present invention
Protect range；The equivalent change or modification completed under all other spirit disclosed without departing from invention, should be included in following
In the protection domain of claims.
Claims (19)
1. a kind of wafer jig, including：
One platform has a top surface；
One stopper is set to the front end of the platform；
One push rod is set to the rear end of the platform；
An at least actuator is articulated in the push rod；And
One sensor is set to the front end of the platform, to measure the sensor and the distance between wafer thereon.
2. wafer jig according to claim 1, the wherein top surface of the platform are flat.
3. wafer jig according to claim 1, the wherein top surface of the stopper are higher than the top surface of the platform, therefore working as should
For wafer support when on the platform, the top surface of the stopper is identical or top surface higher than the wafer.
4. wafer jig according to claim 1, the wherein top surface of the push rod are higher than the top surface of the platform, therefore work as the crystalline substance
Circle is when being supported on the platform, and the top surface of the push rod is identical or top surface higher than the wafer.
5. wafer jig according to claim 1, the wherein actuator push forward the push rod so that the wafer is firm
Ground is held between the stopper and the push rod.
6. wafer jig according to claim 1, wherein an at least actuator include two actuators, parallel to be articulated in this
Push rod.
7. wafer jig according to claim 1, wherein an at least actuator include an actuator, auxiliary at least one
Help bar is parallel to be articulated in the push rod.
8. wafer jig according to claim 1, the wherein actuator include pneumatic cylinder.
9. wafer jig according to claim 8, when the pneumatic cylinder does not activate, the front end of the pneumatic cylinder is drawn back into original
Beginning position.
10. wafer jig according to claim 1 includes also a panel, to support the actuator.
11. wafer jig according to claim 1, the wherein sensor include FIBER OPTIC SENSORS.
12. wafer jig according to claim 11, the wherein FIBER OPTIC SENSORS include reflection-type optical fiber sensor.
13. a kind of method of clamping wafer, including:
One wafer jig is provided；
The slot that the mobile wafer jig has wafer to one；
One sensor detects the presence of wafer on the sensor；
The wafer jig is continued to move along, until the sensor detects being not present for wafer；And
The wafer jig is up moved, and activate an at least actuator and by a push rod toward being pushed forward so that wafer is by firmly
It is held between a stopper and the push rod.
14. according to the method that wafer is clamped described in claim 13, the wherein wafer jig includes：
One platform；
The stopper is set to the front end of the platform；
The push rod is set to the rear end of the platform；
An at least actuator, is articulated in the push rod；And
The sensor is set to the front end of the platform.
15. according to the method that wafer is clamped described in claim 13, wherein the actuator includes pneumatic cylinder.
16. according to the method that wafer is clamped described in claim 15, when the pneumatic cylinder does not activate, the front end of the pneumatic cylinder is drawn
It is back to home position.
17. according to the method that wafer is clamped described in claim 13, wherein the sensor includes reflection-type optical fiber sensor.
18. according to the method that wafer is clamped described in claim 17, when the reflection-type optical fiber sensor receives reflection from wafer
Optical signal, then detect the presence of wafer.
19. according to the method that wafer is clamped described in claim 17, when the reflection-type optical fiber sensor does not receive reflection eleutheromorph
Round optical signal then detects being not present for wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710209060.8A CN108666258A (en) | 2017-03-31 | 2017-03-31 | Wafer jig and the method that wafer is clamped |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710209060.8A CN108666258A (en) | 2017-03-31 | 2017-03-31 | Wafer jig and the method that wafer is clamped |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108666258A true CN108666258A (en) | 2018-10-16 |
Family
ID=63784014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710209060.8A Pending CN108666258A (en) | 2017-03-31 | 2017-03-31 | Wafer jig and the method that wafer is clamped |
Country Status (1)
| Country | Link |
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| CN100440421C (en) * | 2003-06-27 | 2008-12-03 | 马特森技术公司 | Endeffectors for handling semiconductor wafers |
| KR20050098581A (en) * | 2004-04-07 | 2005-10-12 | 삼성전자주식회사 | Wafer transport apparatus and method for sensing wafer of the same |
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Application publication date: 20181016 |
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