CN105632997A - Safe pickup method and system for silicon wafer in silicon wafer carrying device - Google Patents
Safe pickup method and system for silicon wafer in silicon wafer carrying device Download PDFInfo
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- CN105632997A CN105632997A CN201511023511.6A CN201511023511A CN105632997A CN 105632997 A CN105632997 A CN 105632997A CN 201511023511 A CN201511023511 A CN 201511023511A CN 105632997 A CN105632997 A CN 105632997A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a safe pickup method and system for a silicon wafer in a silicon wafer carrying device. On the basis of demonstration data, a movement locus and a position of a manipulator are set; a sensor group arranged on a manipulator sheet fork is used for detecting a distance measurement value between a sheet fork and a silicon wafer; according to the distance measurement value, an intersection line equation of a plane where the silicon wafer is located and a plane where the sheet fork of the manipulator is calculated and determined and then an inclination angle of the silicon wafer relative to the sheet fork is calculated; and then whether the silicon wafer slides or not is determined based on the inclination angle and the silicon wafer can not be picked up until the silicon wafer does not slide. Therefore, real-time determination of a position of a silicon wafer during the pickup process can be realized, so that a phenomenon that the silicon wafer is damaged because of contact of the manipulator sheet fork and the silicon wafer can be avoided and thus safety of the pickup process of the silicon wafer can be improved.
Description
Technical field
The present invention relates to semiconductor processing equipment technical field, the safe pick-up method being specifically related in the silicon chip bogey of a kind of semiconductor devices silicon chip and silicon chip distribution recognition system.
Background technology
The secure access of silicon chip and transport are the big production line of unicircuit extremely important technical indicators; Usually require in process of production the silicon chip fragment rate that transportation equipment self causes should be less than 100,000/. As batch type wafer heat system, relative to monolithic formula process system, chip transmission needed for each production technique, silicon chip are placed and to get sheet number of times more, and the safety and reliability thus chip transmission, silicon chip being placed and being got sheet requires higher.
At present, mechanical manipulator is widely used in semiconductor integrated circuit manufacturing technology field, mechanical manipulator is the important equipment in silicon chip transmission system, for accessing the silicon chip process front and art breading with transportation technology after, it can accept instruction, accurately navigate to certain on three-dimensional or two-dimensional space a bit to carry out picking and placeing silicon chip, both single piece of silicon chip can be picked and placeed operation, it is possible to many pieces of silicon chips are picked and placeed operation.
At present, the silicon chip of batch type wafer heat system passes the location parameter getting link and generally adopts the mode of off-line teaching to obtain and store in the controller, carries out monitoring and testing by the cycle simultaneously. The silicon chip placed on load carrier is carried out loading or unloading operation according to the data of the off-line teaching stored by mechanical manipulator. When mechanical manipulator is when picking and placeing operation to silicon chip, silicon chip load carrier is due to the impact of the factors such as variation of ambient temperature, load change and physical construction distortion, when mechanical manipulator picks and places the silicon chip on load carrier by the position coordinate of offline storage, exist and produce collision and cause silicon chip or the impaired risk of equipment, cause irretrievable loss. Meanwhile, the situations such as the temperature distortion produced in heat treatment process due to silicon chip also can make the actual distribution state of silicon chip have different from off-line teaching location parameter so that the motion that mechanical manipulator picks and places silicon chip is in non-security state,
Referring to Fig. 1, Fig. 1 is that in prior art, mechanical manipulator is placed and position structural representation when getting sheet at chip transmission, silicon chip. As shown in the figure, when silicon chip 2 is in the error state (ERSTies such as inclination on support component 3, mechanical manipulator 1 is in non-security working order in the motion of access silicon chip 2 automatically, is very easy to the damage causing silicon chip 2 and equipment (comprising mechanical manipulator 1).
Therefore, after mechanical manipulator 1 completes silicon chip placement or before preparing to get sheet, silicon chip 2 distribution in silicon chip group on support component 3 need to be carried out pose identification accurately, provide accurate counter-measure to the various error state (ERSTies identified simultaneously, pick and place sheet to realize safety.
Summary of the invention
In order to overcome above problem, the present invention is intended to by carrying out chip transmission on silicon chip bogey relative to the identification of the safe state pose of distribution of the silicon chip of machinery handsheet fork upper-lower position, and a kind of silicon chip distribution recognition system is provided, thus measure the state of silicon chip in silicon chip bogey fast and accurately, diagnose relative levelness distribution results, it is ensured that the safety pickup of silicon chip.
In order to achieve the above object, the present invention provides the safe pick-up method of silicon chip in a kind of semiconductor devices silicon chip bogey, described semiconductor devices comprises for placing the described silicon chip bogey of multiple silicon chip and the mechanical manipulator for picking up and transport silicon chip, described silicon chip bogey has support component, described silicon wafer horizontal is positioned on support component, multiple described silicon chip in the vertical direction arranges, described mechanical manipulator has sheet fork, the sensor group of described fork be fixed with not on same bar straight line three of upper and lower surface or more, described sensor group is used for defining one or more reference plane, described recognition methods comprises gets sheet process and film releasing process, described sheet process of getting comprises:
Step S01: arrange and get the theoretical teaching data of sheet, perform to get sheet operational order;
Step S02: described robot movement is to sheet secure location of looking ahead, and the mechanical manipulator on sheet secure location of looking ahead also does not stretch into silicon chip bogey region;
Step S03: described mechanical manipulator moves to the pre-sheet position of upwards getting below the silicon chip put area to be got in silicon chip bogey, in this moving process, periodically each sensor and the observed value of the Distance geometry bottom silicon chip described to be got with the distance of adjacent silicon chip below silicon chip described to be got in sensor group described in continuous acquisition, and judge that whether described mechanical manipulator can upwards get sheet position below silicon chip put area to be got described in safe operation extremely in advance according to described observed value; The described pre-mechanical manipulator touching upwards got on sheet position less than the support component bottom silicon chip described to be got and bottom this and is touched less than silicon chip upper surface adjacent below silicon chip described to be got; If it does, then perform step S05; If, then not performing step S04;
Step S04: mechanical manipulator is out of service, and warnings etc. are pending;
Step S05: described mechanical manipulator move to described in wait get below silicon chip put area pre-upwards get sheet position after, observed value according to the distance of each sensor and silicon chip described to be got in up-to-date described sensor group, the pitch angle of the sheet fork place plane of silicon chip place plane to be got and described mechanical manipulator described in calculating;
Step S06: according to described pitch angle judge described fork contact described in time getting silicon chip, described in silicon chip to be got whether can produce slide; If it does, then perform step S07; If, then not performing step S08;
Step S07: mechanical manipulator is out of service, and warnings etc. are pending;
Step S08: according to the observed value of the distance of each sensor and silicon chip described to be got in described up-to-date described sensor group, the ultimate range of the sheet fork place plane of silicon chip to be got and described mechanical manipulator described in calculating and minor increment;
Step S09: get the theoretical teaching data of sheet described in combining according to described ultimate range and described minor increment and judge whether the sheet fork of described mechanical manipulator can get safely sheet; If it does, then perform step S11; If, then not performing step S10; Wherein, get described in the thickness of the theoretical teaching data comprise silicon chip of sheet, adjacent silicon chip spacing, described upwards get the mechanical manipulator on sheet position in advance the distance of sheet fork bottom to the described lower side silicon wafer upper surface of fork, exit the mechanical manipulator got on sheet position in advance sheet fork top to described in the distance of adjacent support component above silicon chip to be got and described upwards get sheet position to exiting the distance got between sheet position in advance in advance;
Step S10: mechanical manipulator is out of service, report to the police and etc. pending;
Step S11: the sheet fork of described mechanical manipulator according to described teaching data exposure and silicon chip to be got described in picking up, then described mechanical manipulator rise to described in exiting in advance above silicon chip to be got get sheet position;
Step S12: described mechanical manipulator is got sheet position machine outwards exited described silicon chip bogey region to exiting secure location by described being exited in advance, and whether the whole described silicon chip judged in described silicon chip bogey picks up complete; If it does, then perform step S13; If, then not performing step S02;
Step S13: the operation stopping getting sheet process;
Preferably, the pre-safe limit value upwards getting the distance of adjacent silicon chip below fork bottom to silicon chip to be got, sheet position upper slice is that lower safety gets sheet allowance, when when to get the adjacent lower side silicon wafer of silicon chip be horizontal positioned, and upwards get in advance fork bottom, sheet position upper slice to wait the distance getting adjacent silicon chip below silicon chip be greater than lower safety get sheet allowance time, the mechanical manipulator in this step S03 comprises the silicon chip that sheet fork can not touch the adjacent lower section of silicon chip to be got.
Preferably, in described step S03, the sheet fork bottom upwards getting sheet position bottom silicon chip described to be got with the thickness of the spacing-silicon chip of the minor increment ultimate value=adjacent silicon chip of the sheet of described mechanical manipulator fork place plane-described in advance to described in distance-equipment of adjacent silicon chip allows below silicon chip to be got location variation, described step 03 specifically comprises: described mechanical manipulator moves to the pre-sheet position of upwards getting below the silicon chip put area to be got in silicon chip bogey, in this moving process, periodically in sensor group described in continuous acquisition each sensor to described in Distance geometry bottom silicon chip to be got to described in the observed value of the distance of adjacent silicon chip below silicon chip to be got, and ask for the minimum value of these observed values, by this minimum value compared with described minor increment ultimate value, when this minimum value is less than described minor increment ultimate value, perform described step S04, otherwise perform described step S05.
Preferably, described step S05 specifically comprises:
Step S051: described mechanical manipulator move to described in wait get below silicon chip put area pre-upwards get sheet position after, obtain the observed value of the distance of each sensor and silicon chip described to be got in up-to-date described sensor group;
Step S052: taking the sheet of described mechanical manipulator fork place plane as the XOY plane getting sheet process, the excircle distribution equation of the theoretical silicon chip of setting is cylindrical surface equation, calculate described cylindrical surface equation, the plane equation of silicon chip lower surface to be got described in calculating according to up-to-date described observed value;
Step S053: the plane equation of silicon chip lower surface to be got described in calculating and the section line equation of described cylindrical surface equation;
Step S054: according to the angle of described section line Equation for Calculating section line and the described described fork place XOY plane got in sheet process, get the pitch angle of silicon chip to be got described in being positioned in sheet process described in namely;
Described step S06 specifically comprises: setting silicon chip can not produce the theory �� coefficient pitch angle threshold value slided, and is compared in described pitch angle and described theory �� coefficient pitch angle threshold value; When described pitch angle is less than or equals described theory �� coefficient pitch angle threshold value, perform described step S08; Otherwise, perform described step S07.
Preferably, described theory �� coefficient pitch angle threshold value equals the arc tangent functional value of the frictional coefficient of silicon chip.
Preferably, described step S08 specifically comprises: utilize described section line Equation for Calculating to go out the function about distance, and in conjunction with described cylindrical surface equation as restricted condition, adopts the differential method to try to achieve described ultimate range and described minor increment.
Preferably, described step S09 specifically comprises: according to the described sheet fork bottom upwards getting in advance the mechanical manipulator on sheet position to the distance of the described lower side silicon wafer upper surface of fork and the sheet fork top of exiting the mechanical manipulator got on sheet position in advance to described in the distance of adjacent support component above silicon chip to be got calculate described in the sheet of silicon chip to be got and described mechanical manipulator pitch ultimate range ultimate value and the minor increment ultimate value of place plane, described ultimate range ultimate value equals described and upwards gets sheet position to exiting the distance got between sheet position in advance in advance, for judge mechanical manipulator from described upwards get in advance whether sheet position to the uphill process of silicon chip to be got described in contact can touch described in silicon chip to be got, the thickness of the spacing-silicon chip of described minor increment ultimate value=adjacent silicon chip-described upwards get in advance sheet position to described in distance-equipment of adjacent silicon chip allows below silicon chip to be got location variation, for judge mechanical manipulator whether touch from described sheet secure location to the described moving process upwards getting in advance sheet position of looking ahead described in silicon chip adjacent below silicon chip to be got and silicon chip described to be got, when described minor increment is greater than described minor increment ultimate value, and when described ultimate range is less than described ultimate range ultimate value, then perform described step S11, otherwise, perform described step S10.
Preferably, in described step S11, after mechanical manipulator rises to and exits in advance and get sheet position, stop motion, treat and get whether silicon chip detects on sheet fork; If it does, then perform step S12; If not, then mechanical manipulator stops motion, and warning etc. are pending.
Preferably, described silicon chip bogey comprise inside be mounted with silicon chip film magazine and load silicon chip enter reaction chamber silicon chip support mechanism; Described semiconductor devices also has the film magazine carrying described film magazine and supports mechanism.
In order to realize above-mentioned purpose, present invention also offers silicon chip distribution recognition system in a kind of semiconductor devices silicon chip bogey according to the safe pick-up method of silicon chip in above-mentioned semiconductor devices silicon chip bogey, comprising:
Sensor group, the upper and lower surface being arranged at the sheet fork of described mechanical manipulator, for detect the described distance measure of fork bottom silicon chip described to be got or bottom the silicon chip being positioned on described support component and described fork to described in the distance measure of adjacent silicon chip below silicon chip to be got;
Judgment means, for judging described mechanical manipulator is getting in sheet or film releasing moving process whether can touch silicon chip, and judges whether silicon chip is pitched at the sheet of described mechanical manipulator, and sends signal to warning device;
According to the judged result of described judgment means, control device, controls whether described mechanical manipulator stops motion; And perform to get sheet operational order for controlling described mechanical manipulator, theoretical teaching data are set;
Warning device, receives the signal that described judgment means sends, then gives the alarm.
The safe pick-up method of silicon chip and silicon chip distribution recognition system in the silicon chip bogey of the semiconductor devices of the present invention, motion track and the position of mechanical manipulator are set by teaching data, the sensor group on machinery handsheet fork is utilized to detect the distance measure between sheet fork and silicon chip, calculate the section line equation of the sheet fork place plane judging silicon chip place plane and mechanical manipulator according to distance measure and calculate the pitch angle that silicon chip is pitched relative to sheet accordingly, thus judging whether silicon chip can produce to slide, it is ensured that silicon chip does not produce just to get sheet when sliding. Therefore, present invention achieves and the pose of silicon chip has been judged getting in sheet process, thus avoid machinery handsheet fork to touch silicon chip and cause silicon chip impaired, it is to increase get the security of sheet process.
Accompanying drawing explanation
Fig. 1 is that in prior art, mechanical manipulator is placed and position view when getting sheet at chip transmission, silicon chip
Fig. 2 is the structural representation of the silicon chip bogey of the semiconductor devices of a better embodiment of the present invention
Fig. 3 is the chip transmission of a better embodiment of the present invention, gets sheet or the sheet fork of mechanical manipulator and the relative position relation perspective diagram of silicon chip in film releasing process
Fig. 4 is the relative position relation schematic top plan view of the sensor group of a better embodiment of the present invention, mechanical manipulator, silicon chip and support component
Fig. 5 is the position relation of the silicon chip of a better embodiment of the present invention, support component and sheet fork and gets sheet route schematic diagram
Fig. 6 is the schematic flow sheet of the safe pick-up method of the silicon chip of a better embodiment of the present invention
The sheet that Fig. 7 a is a better embodiment of the present invention pitches place plane, the silicon chip of inclination and the relative position relation schematic diagram on silicon chip excircle distribution cylindrical surface
Fig. 7 b is the cross section structure schematic diagram of the relative position relation on the sheet fork place plane of a better embodiment of the present invention, the silicon chip of inclination and silicon chip excircle distribution cylindrical surface
Fig. 8 is that the inclination silicon chip of a better embodiment of the present invention is by power schematic diagram
Embodiment
For making the content of the present invention clearly understandable, below in conjunction with Figure of description, the content of the present invention is described further. Certain the present invention is not limited to this specific embodiment, and the general replacement known by those skilled in the art is also encompassed in protection scope of the present invention.
The semiconductor devices of the present invention comprises for placing the silicon chip bogey of multiple silicon chip and the mechanical manipulator for picking up and transport silicon chip, and silicon chip bogey has support component, and silicon wafer horizontal is positioned on support component, and multiple silicon chip in the vertical direction arranges; As shown in Figure 2, the silicon chip bogey in the semiconductor devices of a better embodiment of the present invention, comprising: black line frame is interior to be mounted with the film magazine B of silicon chip for inner and load the silicon chip support mechanism A that silicon chip enters reaction chamber C; The film magazine that semiconductor devices also has carrying film magazine B supports mechanism F, and film magazine supports mechanism F and is connected on base G; Mechanical manipulator E for picking up silicon chip from film magazine B and is positioned over silicon chip and supports mechanism A, when fire door D bottom reaction chamber C opens, silicon chip support mechanism A carries silicon chip and enters in reaction chamber C, or after reaction terminates, fire door D bottom reaction chamber C opens, silicon chip support mechanism A carry process after silicon chip exit bottom reaction chamber C, mechanical manipulator E supports from silicon chip that mechanism A is to be picked up silicon chip and be positioned in film magazine B; Arrow in Fig. 2 represents the movable direction of each parts. Therefore, the sheet process of getting of the present invention can be, but not limited to comprise the process picking up silicon chip from film magazine, it is also possible to comprises the process supporting from silicon chip and picking up silicon chip mechanism; With reason, the film releasing process of the present invention can be, but not limited to comprise and is positioned in film magazine by silicon chip, it is also possible to comprises and silicon chip is positioned over silicon chip supports in mechanism.
In the present invention, mechanical manipulator has sheet fork, the sensor group of sheet fork be fixed with not on same bar straight line three of upper and lower surface or more, and sensor group is used for defining one or more reference plane; Three sensors of sheet fork upper surface are used for defining reference plane, and three sensors of sheet fork lower surface are used for defining lower reference plane, and upper reference plane and lower reference plane can be same plane can also be tool plane at regular intervals; In semiconductor applications, mechanical manipulator generally has single only machinery pawl or many mechanical pawls, to adapt to the needs of mass production. In some embodiments of the invention, mechanical manipulator can have many mechanical pawls, any one or more machinery pawl sheet fork upper surface and three or more sensor of lower surface, the following examples only have three sensors respectively for a mechanical manipulator sheet fork upper surface and lower surface, other embodiment principle is identical, does not repeat them here.
Below in conjunction with accompanying drawing 3-8 and specific embodiment, the safe pick-up method of silicon chip in the semiconductor devices silicon chip bogey of the present invention and silicon chip distribution recognition system are described in further detail. It should be noted that, accompanying drawing all adopts the form simplified very much, uses non-ratio accurately, and only in order to object convenient, that clearly reach aid illustration the present embodiment.
In the semiconductor devices silicon chip bogey of the present embodiment, silicon chip distribution recognition system comprises: sensor group, judgment means, control device and the warning device being arranged on machinery handsheet fork.
Referring to Fig. 3 and Fig. 4, in the present embodiment, support component 101 carries silicon chip W, support component 101 is uniformly distributed in the edge of the silicon chip W of half, and the sheet fork 101 of mechanical manipulator 100 is symmetrical V-type, and mechanical manipulator 100 also has clamping parts; The symmetry axis of sheet fork 101 overlaps with the diameter of silicon chip W, and two width tilted between sidewall outermost of sheet fork 101 are less than the diameter of silicon chip W;
The sensor group (black filled circles) of the present embodiment, the upper and lower surface being arranged at the sheet fork 101 of mechanical manipulator 100, pitches the distance measure bottom 101 to one silicon chip for detection lug and sheet pitches the distance measure that 101 arrive adjacent silicon chip below this silicon chip; The upper surface pitching 101 at sheet is provided with three sensors S1, S2, S3, wherein two sensor S1 and S2 lay respectively on two oblique walls of the symmetry of V-type sheet fork 101 and corresponding to the silicon chip W being placed on sheet fork 101 diametrically, a remaining sensor S3 is positioned on the position intersected inside symmetry two oblique walls of V-type sheet fork 101, pitch 101 place planes at this sheet and set up initial point, be set to XOY reference plane, the mid point of the line of sensor S1, S2 with the line of sensor S3 vertical and divide the line of sensor S1, S2 equally; Therefore, the line that V-type sheet is pitched two on oblique wall sensor S1, S2 is set to X-axis, the line of the mid point of the line of sensor S1, S2 and sensor S3 is set to Y-axis, the mid point of the line of sensor S1, S2 is true origin O, sheet fork place XOY plane is formed with this, here it should be noted that, when relating to the relative position relation of sensor, sensor is considered as a point. In the present embodiment, pitch, with sheet, the observed value that sensor S1, S2, S3 of 101 upper surfaces feed back and to judge the pose of silicon chip W and get whether sheet process can get safely sheet, for the minor increment and the ultimate range that calculate the angle of cylindrical surface equation, section line equation, silicon chip place plane and sheet fork place plane, section line and sheet pitch place plane; In the present embodiment, sensor is realized by optical signal detection distance.
The judgment means of the present embodiment, for judging that mechanical manipulator comprises sheet fork is getting in sheet or film releasing moving process whether can touch silicon chip, and judges whether silicon chip is pitched at the sheet of described mechanical manipulator, sends signal when touching silicon chip to warning device;
According to the judged result of judgment means, control device, controls whether mechanical manipulator stops motion; And perform to get sheet operational order for controlling mechanical manipulator, theoretical teaching data are set; Before getting sheet or film releasing, first control device being inputted teaching data, then control device performs to get sheet operational order according to these teaching Data Control mechanical manipulators; When judgment means judges that mechanical manipulator may touch silicon chip, control device makes mechanical manipulator stop motion; Refer to Fig. 5, for the position relation of the silicon chip of a better embodiment of the present invention, support component and sheet fork and get sheet route schematic diagram; Silicon chip W is positioned on support component 102, thick dotted line with arrow represents sheet process of getting or the route of film releasing process of the present embodiment, fine dotted line frame represents the silicon chip W ' in motion, P1 position is sheet secure location of looking ahead, P2 position is for upwards to get sheet position in advance, and P3 is that the sheet getting mechanical manipulator in sheet process pitches the position touching silicon chip, and P4 gets sheet position or pre-film releasing position downwards for exiting in advance, P5 is the position of the clamping parts clamping wafer getting mechanical manipulator in sheet process, and P6 exits secure location after getting sheet. Fig. 5 demonstrates theoretical each parameter of teaching data, comprise the thickness d of silicon chip W, support component thickness t, adjacent silicon chip W distance s, upwards get the mechanical manipulator on the P2 of sheet position in advance sheet fork bottom to the lower side silicon wafer upper surface of sheet fork distance s2, exit the distance s1 bottom support component adjacent above the silicon chip top on the sheet fork got on the P4 of sheet position to sheet fork and upwards get sheet position P2 to exiting the distance s3 got between the P4 of sheet position in advance in advance in advance.
Warning device, receives the signal that judgment means sends, then gives the alarm.
Referring to Fig. 6, in the semiconductor devices silicon chip bogey of the present embodiment, the safe pick-up method of silicon chip comprises:
Step S01: arrange and get the theoretical teaching data of sheet, perform to get sheet operational order;
Concrete, get the theoretical teaching data of sheet by input in control device, thus control mechanical manipulator and perform to get sheet operational order; Get the thickness of the theoretical teaching data comprise silicon chip of sheet, adjacent silicon chip spacing, upwards get the mechanical manipulator on sheet position in advance sheet fork bottom to the lower side silicon wafer upper surface of sheet fork distance, exit the distance of the adjacent support component of the silicon chip top on the sheet fork got on sheet position above silicon chip to be got in advance and upwards get sheet position to exiting the distance got between sheet position in advance in advance;
Step S02: robot movement is to sheet secure location of looking ahead, and the mechanical manipulator on sheet secure location of looking ahead also does not stretch into silicon chip bogey region;
Concrete, the side of sheet secure location of looking ahead at silicon chip bogey, the mechanical manipulator on this position is touched less than the silicon chip in silicon chip bogey; Preferably, sheet position of looking ahead is greater than distance s between the adjacent silicon chip of 2 times.
Step S03: mechanical manipulator moves to the pre-sheet position of upwards getting below the silicon chip put area to be got in silicon chip bogey, in this moving process, periodically each sensor and the observed value of the Distance geometry bottom silicon chip to be got with the distance of adjacent silicon chip below silicon chip to be got in continuous acquisition sensor group, and judge that whether mechanical manipulator can upwards get sheet position below safe operation to silicon chip put area to be got in advance according to observed value; The pre-mechanical manipulator touching upwards got on sheet position less than the support component bottom silicon chip to be got and bottom this and is touched less than silicon chip upper surface adjacent below silicon chip to be got; If it does, then perform step S05; Otherwise, perform step S04;
Concrete, the pre-safe limit value upwards getting the distance of adjacent silicon chip below fork bottom to silicon chip to be got, sheet position upper slice is that lower safety gets sheet allowance, when when to get the adjacent lower side silicon wafer of silicon chip be horizontal positioned, and upwards get in advance fork bottom, sheet position upper slice to wait the distance getting adjacent silicon chip below silicon chip be greater than lower safety get sheet allowance time, the mechanical manipulator in this step S03 comprises the silicon chip that sheet fork can not touch the adjacent lower section of silicon chip to be got. With the minor increment ultimate value Z of the sheet fork place plane of mechanical manipulator bottom silicon chip to be gotmin-limitThe thickness d of the distance s-silicon chip of=adjacent silicon chip-pre-location variation �� upwards getting the distance s2-equipment of adjacent silicon chip below the sheet fork bottom to silicon chip to be got of sheet position and allowing.
This step S03 specifically comprises: mechanical manipulator moves to the pre-sheet position of upwards getting below the silicon chip put area to be got in silicon chip bogey, in this moving process, the periodically observed value of the distance of adjacent silicon chip below Distance geometry bottom each sensor to silicon chip to be got to silicon chip to be got in continuous acquisition sensor group, the distance measure of three sensors of machinery handsheet fork upper surface is Z1, Z2 and Z3, and asks for the minimum value Z of these observed valuesmin-distance, by judgment means by this minimum value Zmin-distanceWith minor increment ultimate value Zmin-limit��Zmin-limitCompare:
As this minimum value Zmin-distanceIt is less than minor increment ultimate value Zmin-limit, time, perform step S04;
Otherwise, as minimum value Zmin-distanceIt is more than or equal to minimum spacing ultimate value Zmin-limitTime, perform step S05;
Here it should be noted that, during three range detection sensors, the detection line of departure bottom three sensors to silicon chip is parallel, such that it is able to detect the distance of corresponding position on silicon chip;
Step S04: mechanical manipulator is out of service, and warnings etc. are pending;
Concrete, it is pending that control device control mechanical manipulator is out of service etc., and judgment means sends signal to warning device, and warning device gives the alarm after receiving the signal that judgment means sends;
Step S05: mechanical manipulator move to wait get below silicon chip put area pre-upwards get sheet position after, according to the observed value of each sensor in up-to-date sensor group with the distance of silicon chip to be got, calculate the pitch angle of the sheet fork place plane of silicon chip place plane to be got and mechanical manipulator;
Concrete, step S05 specifically comprises:
Step S051: mechanical manipulator move to wait get below silicon chip put area pre-upwards get sheet position after, obtain the observed value of each sensor and the distance of silicon chip to be got in up-to-date sensor group;
Concrete, in mechanical manipulator operational process, the sensor in sensor group can continuous probe at certain intervals, when mechanical manipulator move to wait get below silicon chip put area pre-upwards get sheet position after, it should carry out follow-up calculating according to the observed value of up-to-date detection.
Step S052: taking the sheet of mechanical manipulator fork place plane as the XOY plane getting sheet process, the excircle distribution equation of the theoretical silicon chip of setting is cylindrical surface equation, calculates cylindrical surface equation, calculates the plane equation of silicon chip lower surface to be got according to up-to-date observed value;
Concrete, taking P2 position as basic point, O point correspondence position on sheet fork is that theoretical silicon chip places central position, namely silicon chip be placed on XOY plane along Z-direction up and down taking silicon chip diameter as in the cylindrical surface of circumference, setting silicon chip radius is R, diameter is 2R, and setting silicon chip circumference and position deviation are ��, in the circumference that namely it is radius that silicon chip is distributed in by center of circle R+ �� of O point; Cylindrical surface equation is X2+Y2=R.
Step S053: calculate the plane equation of silicon chip lower surface to be got and the section line equation of cylindrical surface equation;
Concrete, refer to Fig. 7 a and Fig. 7 b, Fig. 7 a is the relative position relation schematic diagram on the sheet fork place plane of a better embodiment of the present invention, the silicon chip of inclination and silicon chip excircle distribution cylindrical surface, and Fig. 7 b is the cross section structure schematic diagram of the sheet fork place plane of a better embodiment of the present invention, the silicon chip of inclination and the relative position relation on silicon chip excircle distribution cylindrical surface; The right cylinder that right cylinder 201 is formed for silicon chip peripheral circumferential, sheet fork place plane is 202, when in time getting silicon chip W and be inclined, the intersecting surface that silicon chip W to be got produces in right cylinder 201 is inclined, as shown in Figure 7b, sheet fork place plane 202 is horizontal positioned as reference plane, and the angle trying to achieve section line and sheet fork place plane 202 is exactly the pitch angle of silicon chip W to be got relative to horizontal plane.
The distance measure that three sensors of sheet fork upper surface obtain is respectively z1, z2 and z3, known with defined XOY plane, the coordinate figure in not 3, the space on same bar straight line that silicon chip corresponds respectively to three sensors in the plane is respectively (x1, y1, z1), (x2, y2, z2) and (x3, y3, z3); The plane equation of silicon chip lower surface to be got is calculated, aX+bY+cZ+d=0 according to these coordinate figures;
Wherein, a, b, c and d calculating formula is as follows:
A=y1z2-y1z3-y2z1+y2z3+y3z1-y3z2
B=-x1z2+x1z3+x2z1-x2z3-x3z1+x3z2
C=x1y2-x1y3-x2y1+x2y3+x3y1-x3y2,
D=-x1y2z3+x1y3z2+x2y1z3-x2y3z1-x3y1z2+x3y2z1.
Then, calculating the section line equation of this plane equation and cylindrical surface equation, setting up set of equations is:
AX+bY+cZ+d=0
X2+Y2=R
Can obtain by above two equations: AX+BY+CZ+D=0, this equation is section line equation.
Step S054: according to the angle of section line Equation for Calculating section line with the sheet fork place XOY plane got in sheet process, namely get the pitch angle being positioned at silicon chip to be got in sheet process;
Concrete, forming system of equations according to the plane equation of silicon chip lower surface to be got and sheet fork place plane equation is:
AX+BY+CZ+D=0
Z=0
Their normal vector be respectively A, B, C} and 0,0,1}, if the angle of these two normal vectors is ��, so the angle of these two planes is exactly ��, so,
Cos ��=C/ [�� (A2+B2+C2)]
��=arccos (C/ [�� (A2+B2+C2)])��
Step S06: judging to contact in time getting silicon chip at sheet fork according to pitch angle, whether silicon chip to be got can produce to slide; If it does, then perform step S07; If, then not performing step S08;
Concrete, slip herein comprises silicon chip and skids off locating slot or the fork generation slip of silicon chip opposite panel, refer to Fig. 8, for the inclination silicon chip of a better embodiment of the present invention is subject to power schematic diagram, wherein, �� is the pitch angle of silicon chip and horizontal plane in reality, silicon chip is subject to downward gravity mg, support component is to the reactive force N of silicon chip, in addition, if the coefficient of sliding friction of silicon chip is ��, it is subject to maximum static friction force slightly larger than sliding friction power, here sliding friction power it is approximately, so the maximum static friction force of silicon chip is a ��m gcos ��, when gravity and frictional force to make a concerted effort be zero, when just making silicon chip not move downward, corresponding silicon chip pitch angle is the theory �� coefficient pitch angle threshold value �� of silicon chip,
The theory �� coefficient pitch angle threshold value that silicon chip can not produce slip is set according to silicon chip stressing conditions:
Mgsin (��) mgcos (��) ��=0, thus obtain ��=arctan (��).
The inclined angle alpha of the silicon chip to be got tried to achieve and theory �� coefficient pitch angle threshold value are compared; When pitch angle is less than or equals theory �� coefficient pitch angle threshold value, perform step S08; Otherwise, perform step S07; It is specially:
When judgment means judges ���ܦ�, illustrate to contact at sheet fork silicon chip to be got can not be caused in time getting silicon chip to produce to slide, it is possible to proceed to get sheet operation, perform step S08;
When judgment means judges �� > ��, illustrate to contact at sheet fork silicon chip to be got can be caused in time getting silicon chip to produce to slide, if mechanical manipulator proceeds to get sheet operation can produce the danger touching silicon chip, perform step S07;
Step S07: mechanical manipulator is out of service, and warnings etc. are pending;
Concrete, it is pending that control device control mechanical manipulator is out of service etc., and judgment means sends a signal to warning device, and warning device gives the alarm;
Step S08: according to the observed value of each sensor in up-to-date sensor group with the distance of silicon chip to be got, calculates ultimate range and the minor increment of the sheet fork place plane of silicon chip to be got and mechanical manipulator;
Concrete, utilize section line Equation for Calculating to go out the function about distance, and in conjunction with cylindrical surface equation as restricted condition, adopt the differential method to try to achieve ultimate range and minor increment; Concrete, drawing Z=(-D-AX-BY)/C by section line equation, restricted condition is: X2+Y2=R, can try to achieve Z by the differential methodminAnd Zmax��
Step S09: judge whether the sheet fork of mechanical manipulator can get safely sheet according to ultimate range and minor increment binding isotherm teaching data; If it does, then perform step S11; If, then not performing step S10;
Concrete, step S09 comprises: the sheet calculating silicon chip to be got and mechanical manipulator according to the distance s2 of the sheet fork bottom to the lower side silicon wafer upper surface of sheet fork of upwards getting the mechanical manipulator on sheet the position in advance and distance s3 that exits the adjacent support component above the sheet fork top to silicon chip to be got of the mechanical manipulator got on sheet position in advance pitches the ultimate range ultimate value Z of place planemax-limitWith minor increment ultimate value Zmin-limit;
Ultimate range ultimate value Zmax-limitEqual upwards to get sheet position to exiting the distance s3 got between sheet position in advance in advance, for judging that mechanical manipulator is from upwards getting in advance whether sheet position can touch silicon chip to be got to contacting the uphill process of silicon chip to be got;
Minor increment ultimate value Zmin-limitThe thickness d of the distance s-silicon chip of=adjacent silicon chip-pre-location variation �� upwards getting the distance s2-equipment of adjacent silicon chip below sheet position to silicon chip to be got and allowing, for judging whether sheet secure location touches silicon chip adjacent below silicon chip to be got and silicon chip to be got to mechanical manipulator to the pre-moving process upwards getting sheet position from looking ahead;
Judgment means judges above-mentioned minor increment ZminIt is greater than minor increment ultimate value Zmin-limit, and ultimate range ZmaxIt is less than ultimate range ultimate value Zmax-limitTime, illustrate that mechanical manipulator can get safely sheet, then perform step S11; Otherwise, perform step S10;
Step S10: mechanical manipulator is out of service, report to the police and etc. pending;
Concrete, it is pending that control device control mechanical manipulator is out of service etc., and judgment means sends a signal to warning device, and warning device gives the alarm;
Step S11: the sheet fork of mechanical manipulator according to teaching data exposure and picks up silicon chip to be got, and then mechanical manipulator rises to exiting in advance above silicon chip to be got and gets sheet position;
Concrete, after mechanical manipulator rises to and exits in advance and get sheet position, stop motion, treat and get whether silicon chip detects on sheet fork; If it does, then perform step S12; If not, then mechanical manipulator stops motion, and warning etc. are pending; Here, control device control mechanical manipulator stopping motion etc. are pending, and judgment means sends a signal to warning device, and warning device gives the alarm;
Step S12: mechanical manipulator is got sheet position machine by exiting in advance and outwards exited silicon chip bogey region to secure location, and whether the whole silicon chips judged in silicon chip bogey pick up complete; If it does, then perform step S13; If, then not performing step S02;
Concrete, in the process that mechanical manipulator outwards exits, the clamping parts at P5 position mechanical manipulator perform the holding action to silicon chip, it is ensured that silicon chip can not drop in transmitting procedure. Preferably, the distance s that silicon chip bogey region to secure location is greater than the adjacent silicon chip of 2 times is outwards exited.
Step S13: the operation stopping getting sheet process;
Refer to table one, for the present invention another better embodiment at the safe state classification table getting distance to the silicon chip of its upper-lower position of mechanical manipulator in sheet process and film releasing process and silicon chip; In table, getting in sheet process, sheet is pitched on P1 position, P5 position and P6 position, and the sensor all can pitched by sheet is detected and obtains result, distance between the sensor detection sheet fork of the sheet fork upper surface on P1 position and silicon chip bogey, as the same on P6 position; On P5 position, the sensor detection sheet fork of sheet fork upper surface and the distance of the silicon chip being positioned on support component.
Table one
In sum, the safe pick-up method of silicon chip and safe picking up system thereof in the silicon chip bogey of the semiconductor devices of the present invention, motion track and the position of mechanical manipulator are set by teaching data, the sensor group on machinery handsheet fork is utilized to detect the distance measure between sheet fork and silicon chip, calculate the section line equation of the sheet fork place plane judging silicon chip place plane and mechanical manipulator according to distance measure and calculate the pitch angle that silicon chip is pitched relative to sheet accordingly, thus judge whether silicon chip can produce to slide, guarantee that silicon chip does not produce just to get sheet when sliding or guarantee not produce to slide after silicon chip is placed. therefore, present invention achieves and the pose of silicon chip has been judged getting in sheet or film releasing process, thus avoid machinery handsheet fork to touch silicon chip and cause silicon chip impaired, it is to increase get sheet or the security of film releasing process.
Although the present invention discloses as above with better embodiment; right described embodiment is only illustrated for convenience of explanation; and be not used to limit the present invention; the technician of this area can do some changes and retouching without departing from the spirit and scope of the present invention, and the protection domain that the present invention advocates should to be as the criterion described in claim book.
Claims (10)
1. the safe pick-up method of silicon chip in the silicon chip bogey of a semiconductor devices, described semiconductor devices comprises for placing the described silicon chip bogey of multiple silicon chip and the mechanical manipulator for picking up and transport silicon chip, described silicon chip bogey has support component, described silicon wafer horizontal is positioned on support component, multiple described silicon chip in the vertical direction arranges, described mechanical manipulator has sheet fork, the sensor group of described fork be fixed with not on same bar straight line three of upper and lower surface or more, described sensor group is used for defining one or more reference plane; The safe pick-up method of silicon chip comprises:
Step S01: arrange and get the theoretical teaching data of sheet, perform to get sheet operational order;
Step S02: described robot movement is to sheet secure location of looking ahead, and the mechanical manipulator on sheet secure location of looking ahead also does not stretch into silicon chip bogey region;
Step S03: described mechanical manipulator moves to the pre-sheet position of upwards getting below the silicon chip put area to be got in silicon chip bogey, in this moving process, periodically each sensor and the observed value of the Distance geometry bottom silicon chip described to be got with the distance of adjacent silicon chip below silicon chip described to be got in sensor group described in continuous acquisition, and judge that whether described mechanical manipulator can upwards get sheet position below silicon chip put area to be got described in safe operation extremely in advance according to described observed value; The described pre-mechanical manipulator touching upwards got on sheet position less than the support component bottom silicon chip described to be got and bottom this and is touched less than silicon chip upper surface adjacent below silicon chip described to be got; If it does, then perform step S05; If, then not performing step S04;
Step S04: mechanical manipulator is out of service, and warnings etc. are pending;
Step S05: described mechanical manipulator move to described in wait get below silicon chip put area pre-upwards get sheet position after, observed value according to the distance of each sensor and silicon chip described to be got in up-to-date described sensor group, the pitch angle of the sheet fork place plane of silicon chip place plane to be got and described mechanical manipulator described in calculating;
Step S06: according to described pitch angle judge described fork contact described in time getting silicon chip, described in silicon chip to be got whether can produce slide; If it does, then perform step S07; If, then not performing step S08;
Step S07: mechanical manipulator is out of service, and warnings etc. are pending;
Step S08: according to the observed value of the distance of each sensor and silicon chip described to be got in described up-to-date described sensor group, the ultimate range of the sheet fork place plane of silicon chip to be got and described mechanical manipulator described in calculating and minor increment;
Step S09: get the theoretical teaching data of sheet described in combining according to described ultimate range and described minor increment and judge whether the sheet fork of described mechanical manipulator can get safely sheet; If it does, then perform step S11; If, then not performing step S10; Wherein, get described in the thickness of the theoretical teaching data comprise silicon chip of sheet, adjacent silicon chip spacing, described upwards get the mechanical manipulator on sheet position in advance the distance of sheet fork bottom to the described lower side silicon wafer upper surface of fork, exit the mechanical manipulator got on sheet position in advance sheet fork top to described in the distance of adjacent support component above silicon chip to be got and described upwards get sheet position to exiting the distance got between sheet position in advance in advance;
Step S10: mechanical manipulator is out of service, report to the police and etc. pending;
Step S11: the sheet fork of described mechanical manipulator according to described teaching data exposure and silicon chip to be got described in picking up, then described mechanical manipulator rise to described in exiting in advance above silicon chip to be got get sheet position;
Step S12: described mechanical manipulator is got sheet position machine outwards exited described silicon chip bogey region to exiting secure location by described being exited in advance, and whether the whole described silicon chip judged in described silicon chip bogey picks up complete; If it does, then perform step S13; If, then not performing step S02;
Step S13: the operation stopping getting sheet process.
2. the safe pick-up method of silicon chip in the silicon chip bogey of semiconductor devices according to claim 1, it is characterized in that, the pre-safe limit value upwards getting the distance of adjacent silicon chip below fork bottom to silicon chip to be got, sheet position upper slice is that lower safety gets sheet allowance, when when to get the adjacent lower side silicon wafer of silicon chip be horizontal positioned, and upwards get in advance fork bottom, sheet position upper slice to wait the distance getting adjacent silicon chip below silicon chip be greater than lower safety get sheet allowance time, the mechanical manipulator in this step S03 comprises the silicon chip that sheet fork can not touch the adjacent lower section of silicon chip to be got.
3. the safe pick-up method of silicon chip in the silicon chip bogey of semiconductor devices according to claim 1, it is characterized in that, in described step S03, the sheet fork bottom upwards getting sheet position bottom silicon chip described to be got with the thickness of the spacing-silicon chip of the minor increment ultimate value=adjacent silicon chip of the sheet of described mechanical manipulator fork place plane-described in advance to described in distance-equipment of adjacent silicon chip allows below silicon chip to be got location variation, described step 03 specifically comprises: described mechanical manipulator moves to the pre-sheet position of upwards getting below the silicon chip put area to be got in silicon chip bogey, in this moving process, periodically in sensor group described in continuous acquisition each sensor to described in Distance geometry bottom silicon chip to be got to described in the observed value of the distance of adjacent silicon chip below silicon chip to be got, and ask for the minimum value of these observed values, by this minimum value compared with described minor increment ultimate value, when this minimum value is less than described minor increment ultimate value, perform described step S04, otherwise perform described step S05.
4. the safe pick-up method of silicon chip in the silicon chip bogey of semiconductor devices according to claim 1, it is characterised in that, described step S05 specifically comprises:
Step S051: described mechanical manipulator move to described in wait get below silicon chip put area pre-upwards get sheet position after, obtain the observed value of the distance of each sensor and silicon chip described to be got in up-to-date described sensor group;
Step S052: taking the sheet of described mechanical manipulator fork place plane as the XOY plane getting sheet process, the excircle distribution equation of the theoretical silicon chip of setting is cylindrical surface equation, calculate described cylindrical surface equation, the plane equation of silicon chip lower surface to be got described in calculating according to up-to-date described observed value;
Step S053: the plane equation of silicon chip lower surface to be got described in calculating and the section line equation of described cylindrical surface equation;
Step S054: according to the angle of described section line Equation for Calculating section line and the described described fork place XOY plane got in sheet process, get the pitch angle of silicon chip to be got described in being positioned in sheet process described in namely;
Described step S06 specifically comprises: setting silicon chip can not produce the theory �� coefficient pitch angle threshold value slided, and is compared in described pitch angle and described theory �� coefficient pitch angle threshold value; When described pitch angle is less than or equals described theory �� coefficient pitch angle threshold value, perform described step S08; Otherwise, perform described step S07.
5. the safe pick-up method of silicon chip in the silicon chip bogey of semiconductor devices according to claim 4, it is characterised in that, described theory �� coefficient pitch angle threshold value equals the arc tangent functional value of the frictional coefficient of silicon chip.
6. the safe pick-up method of silicon chip in the silicon chip bogey of semiconductor devices according to claim 1, it is characterized in that, described step S08 specifically comprises: utilize described section line Equation for Calculating to go out the function about distance, and in conjunction with described cylindrical surface equation as restricted condition, adopt the differential method to try to achieve described ultimate range and described minor increment.
7. the safe pick-up method of silicon chip in the silicon chip bogey of semiconductor devices according to claim 6, it is characterized in that, described step S09 specifically comprises: according to the described sheet fork bottom upwards getting in advance the mechanical manipulator on sheet position to the distance of the described lower side silicon wafer upper surface of fork and the sheet fork top of exiting the mechanical manipulator got on sheet position in advance to described in the distance of adjacent support component above silicon chip to be got calculate described in the sheet of silicon chip to be got and described mechanical manipulator pitch ultimate range ultimate value and the minor increment ultimate value of place plane, described ultimate range ultimate value equals described and upwards gets sheet position to exiting the distance got between sheet position in advance in advance, for judge mechanical manipulator from described upwards get in advance whether sheet position to the uphill process of silicon chip to be got described in contact can touch described in silicon chip to be got, the thickness of the spacing-silicon chip of described minor increment ultimate value=adjacent silicon chip-described upwards get in advance sheet position to described in distance-equipment of adjacent silicon chip allows below silicon chip to be got location variation, for judge mechanical manipulator whether touch from described sheet secure location to the described moving process upwards getting in advance sheet position of looking ahead described in silicon chip adjacent below silicon chip to be got and silicon chip described to be got, when described minor increment is greater than described minor increment ultimate value, and when described ultimate range is less than described ultimate range ultimate value, then perform described step S11, otherwise, perform described step S10.
8. the safe pick-up method of silicon chip in the silicon chip bogey of semiconductor devices according to claim 1, it is characterized in that, in described step S11, after mechanical manipulator rises to and exits in advance and get sheet position, stop motion, treat and get whether silicon chip detects on sheet fork; If it does, then perform step S12; If not, then mechanical manipulator stops motion, and warning etc. are pending.
9. the safe pick-up method of silicon chip in the silicon chip bogey of semiconductor devices according to claim 1, it is characterised in that, described silicon chip bogey comprises inside and is mounted with the film magazine of silicon chip and loads the silicon chip that silicon chip enters reaction chamber and support mechanism; Described semiconductor devices also has the film magazine carrying described film magazine and supports mechanism.
10. the silicon chip distribution recognition system of the safe pick-up method of silicon chip in the silicon chip bogey of semiconductor devices according to claim 1-9 any one, comprising:
Sensor group, the upper and lower surface being arranged at the sheet fork of described mechanical manipulator, for detect the described distance measure of fork bottom silicon chip described to be got or bottom the silicon chip being positioned on described support component and described fork to described in the distance measure of adjacent silicon chip below silicon chip to be got;
Judgment means, for judging described mechanical manipulator is getting in sheet moving process whether can touch silicon chip, and judges whether silicon chip is pitched at the sheet of described mechanical manipulator, and sends signal to warning device;
According to the judged result of described judgment means, control device, controls whether described mechanical manipulator stops motion; And perform to get sheet operational order for controlling described mechanical manipulator, theoretical teaching data are set;
Warning device, receives the signal that described judgment means sends, then gives the alarm.
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