CN113394149A - Silicon wafer transmission fork with position detection function, manipulator and transmission method - Google Patents
Silicon wafer transmission fork with position detection function, manipulator and transmission method Download PDFInfo
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- 235000012431 wafers Nutrition 0.000 description 191
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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Abstract
The invention provides a silicon wafer transmission fork with a position detection function, wherein the fork is provided with a bearing area for bearing a silicon wafer, N detection points are arranged in the bearing area, N is more than or equal to 3, and a connecting line of the positions of any two detection points is not parallel to the direction of the movement of the fork towards the silicon wafer to be taken; the silicon wafer taking device is characterized in that the wafer fork is provided with a laser position detection module, the laser position detection module comprises a light source, an optical transmission assembly and an energy detector, when the wafer fork moves to a detection point and is positioned below a silicon wafer to be taken, incident light emitted by the light source is transmitted by the optical transmission assembly and then is incident to the silicon wafer to be taken from the detection point, and reflected light is transmitted to the energy detector by the optical transmission assembly after being reflected to the detection point by the silicon wafer to be taken. The silicon wafer transmission manipulator with the position detection function and the transmission method are also provided. The scheme provided by the invention can acquire the edge position of the silicon wafer to be taken so as to identify the center position of the silicon wafer for deviation correction, does not occupy the space of the wafer fork, and reduces the cost.
Description
Technical Field
The invention relates to the technical field of semiconductor processing equipment, in particular to a silicon wafer transmission fork with a position detection function, a manipulator and a transmission method.
Background
At present, in a silicon wafer front end transmission device (EFEM), position parameters of a silicon wafer transmission link are generally acquired and stored in a controller in an off-line teaching mode, a manipulator carries out taking and placing operations on a silicon wafer placed on a bearing mechanism according to stored off-line teaching data, the position of the silicon wafer can deviate due to the reasons of temperature, load change, mechanical deformation, failure of the bearing mechanism and the like of the silicon wafer bearing table, when the deviation position is large, the manipulator carries out wafer transmission according to the teaching data, so that accidents such as wafer falling and wafer collision can possibly occur when the silicon wafer is placed at a buffer storage table, pre-aligned and even a wafer box, and irreparable loss is caused.
In the prior art, 3 image sensors are placed on a mechanical wafer fork, and when a wafer is forked to take a wafer, the edge information of a silicon wafer is obtained through the 3 image sensors so as to obtain the center position of the silicon wafer, so that the deviation is corrected. In this way, when the wafer fork reaches the lower part of the silicon wafer to be taken and contacts with the silicon wafer, the image sensor identifies and feeds back the data information of the edge of the silicon wafer, and the following problems exist:
1. the thickness of a common commercial image sensor is thicker, the thickness of a sheet fork is generally 2-5 mm, and the image sensor is difficult to mount;
2. because the edge information is acquired after the wafer fork reaches the position below the silicon wafer to be taken, and the image sensor is required to be placed at the position of the wafer fork corresponding to the edge of the silicon wafer, the size of the wafer fork is increased, and the design difficulty of the bearing mechanism platform is improved;
3. the image sensor is generally high in price, and at least 3 sensors are required to be configured on one chip fork, so that the cost is greatly increased.
Therefore, there is a need for an improved wafer transfer robot that facilitates obtaining wafer edge positions and reduces costs.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a silicon wafer transmission fork with a position detection function, a manipulator, a transmission method and semiconductor equipment.
In order to achieve the above purpose, the invention is realized by the following technical scheme:
a silicon wafer transmission fork with a position detection function is provided with a bearing area for bearing a silicon wafer, N detection points are arranged in the bearing area, N is more than or equal to 3, and a connecting line of the positions of any two detection points is not parallel to the direction of the movement of the fork towards the silicon wafer to be taken;
the silicon wafer taking device is characterized in that the wafer fork is provided with a laser position detection module, the laser position detection module comprises a light source, an optical transmission assembly and an energy detector, when the wafer fork moves to the detection point and is positioned below the silicon wafer to be taken, incident light emitted by the light source is transmitted by the optical transmission assembly, then is incident to the silicon wafer to be taken from the detection point, and is reflected to the detection point by the silicon wafer to be taken, and then is transmitted to the energy detector by the optical transmission assembly.
Furthermore, the number of the laser position detection modules is N, and one detection point corresponds to one laser position detection module.
Further, the light transmission component comprises a first light splitting prism, a first reflecting mirror and a second reflecting mirror which are arranged along the light transmission path, and the second reflecting mirror is arranged at the detection point;
incident light emitted by the light source is transmitted by the first light splitting prism and then is continuously transmitted to the first reflector along the incident direction, the incident light is reflected by the first reflector and then enters the second reflector, and the second reflector reflects the incident light to the silicon wafer to be taken;
the reflected light reflected by the silicon wafer to be taken is reflected by the second reflecting mirror and then enters the first reflecting mirror, is reflected by the first reflecting mirror and then enters the first light splitting prism, and is reflected by the first light splitting prism and then enters the energy detector.
Furthermore, a plurality of detection points share one laser position detection module.
Further, the light transmission component comprises a first light splitting prism, a first reflecting mirror, n-1 second light splitting prisms and a second reflecting mirror which are arranged along the light transmission path, wherein the n-1 second light splitting prisms are arranged at the n-1 detection points close to the light source, and the second reflecting mirror is arranged at the detection point farthest from the light source; wherein N is more than or equal to 2 and less than or equal to N;
incident light emitted by the light source is transmitted by the first light splitting prism and then is continuously transmitted to the first reflector along the incident direction, the incident light is sequentially transmitted to n-1 second light splitting prisms after being reflected by the first reflector, the last second light splitting prism is transmitted to the second reflector, and the n-1 second light splitting prisms and the second reflector reflect the incident light to the silicon wafer to be taken;
and the reflected light reflected by the silicon wafer to be taken is reflected by the corresponding second light splitting prism and the second reflecting mirror, finally enters the first reflecting mirror, is reflected by the first reflecting mirror, enters the first light splitting prism, and enters the energy detector after being reflected by the first light splitting prism.
Furthermore, the piece fork is Y-shaped and comprises two interdigital parts, and the N detection points are arranged on the two interdigital parts.
Further, N is equal to 4.
The silicon wafer transmission manipulator with the automatic centering function is characterized in that the silicon wafer transmission piece fork with the position detection function is mounted at the tail end of the silicon wafer transmission manipulator.
A silicon wafer transmission method adopts the silicon wafer transmission mechanical arm with the automatic centering function, and the method comprises the following steps;
step S01, after the wafer is taken at the station 1 and the wafer fork extends into the position below the silicon wafer to be taken, the energy detector is triggered when the N detection points are sequentially positioned under the edge of the silicon wafer;
step S02, acquiring edge position data of the silicon wafer according to the positions of the wafer forks when the energy detector is triggered by the N detection points;
step S03, calculating the identification center position of the silicon wafer according to the edge position data of the silicon wafer;
step S04, calculating the offset vector of the center of the silicon wafer according to the identification center position and the theoretical center position of the silicon wafer;
step S05, judging whether the actual eccentricity of the silicon chip is in a safe range according to the offset vector; if so, go to step S06A;
step S06A, the silicon wafer of station 1 is obtained by the wafer fork;
step S07, adjusting the position of the wafer fork according to the eccentric vector, and aligning the recognition center position of the silicon wafer with the theoretical center position of the station 2 when the wafer fork reaches the station 2;
and step S08, normally placing the film on the station 2 by the film fork, and completing a round of film taking and placing process.
Further, in step S05, if no, step S06B is executed, the sheet fork stops taking the sheet, and the machine is stopped for inspection.
A semiconductor device comprising a silicon wafer transport fork with position detection as described above.
Compared with the prior art, the invention has the following advantages:
1. accidents such as collision, falling and the like caused by large position deviation of the silicon wafer to be taken can be avoided, particularly in a subsequent machine, the value of each wafer is not good, and considerable economic loss can be recovered;
2. if the scheme of placing the sensors at the front ends of the bearing tables is used, the sensors need to be placed in front of each bearing table, and when the number of the bearing tables is large, the cost is high;
3. because the requirement of the terminal customer on the yield is higher, the manipulator can replace the pre-alignment function in some occasions without orienting the silicon wafer, and the cost of pre-aligning monomers can be reduced while the yield is improved.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings used in the description will be briefly introduced, and it is obvious that the drawings in the following description are an embodiment of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts according to the drawings:
fig. 1 is a schematic structural diagram of a silicon wafer transmission fork with a position detection function according to an embodiment of the present invention;
FIG. 2 is a light path diagram of the detection point in FIG. 1;
fig. 3 is a flowchart of a silicon wafer transmission method according to an embodiment of the present invention.
Detailed Description
The invention is described in further detail below with reference to the figures and the detailed description. The advantages and features of the present invention will become more apparent from the following description. It is to be noted that the drawings are in a very simplified form and are all used in a non-precise scale for the purpose of facilitating and distinctly aiding in the description of the embodiments of the present invention. To make the objects, features and advantages of the present invention comprehensible, reference is made to the accompanying drawings. It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for matching with the disclosure of the specification, so as to be understood and read by those skilled in the art, and are not used to limit the implementation conditions of the present invention, so that the present invention has no technical significance, and any structural modification, ratio relationship change or size adjustment should still fall within the scope of the present invention without affecting the efficacy and the achievable purpose of the present invention.
The core idea of the invention is to provide a wafer fork with a position detection function, which is arranged at the tail end of a silicon wafer transmission manipulator and is used for automatically detecting the edge of a silicon wafer in the silicon wafer transmission process so as to determine the identification center of the silicon wafer and judge whether the identification center of the silicon wafer is aligned with the theoretical center. The wafer fork is provided with a bearing area for bearing a silicon wafer, N detection points are arranged in the bearing area, N is more than or equal to 3, and a connecting line of the positions of any two detection points is not parallel to the direction of the wafer fork moving towards the silicon wafer to be taken; the silicon wafer taking device is characterized in that the wafer fork is provided with a laser position detection module, the laser position detection module comprises a light source, an optical transmission assembly and an energy detector, when the wafer fork moves to the detection point and is positioned below the silicon wafer to be taken, incident light emitted by the light source is transmitted by the optical transmission assembly, then is incident to the silicon wafer to be taken from the detection point, and is reflected to the detection point by the silicon wafer to be taken, and then is transmitted to the energy detector by the optical transmission assembly. In the present invention, the light source may be a laser diode or other suitable type of light source.
When the silicon wafer transmission manipulator takes the silicon wafer, the wafer fork extends to the position below the silicon wafer to be taken and is not in contact with the silicon wafer, and the N detection points are respectively shielded by the edge of the silicon wafer. Before the first detection point is shielded, incident light emitted by the light source is transmitted to the first detection point and then cannot be reflected back to the energy detector, after the first detection point is shielded by the edge of the silicon wafer, the edge of the silicon wafer reflects the incident light and finally reflects the incident light back to the energy detector, and after the energy detector receives a reflection signal, the real-time position of the manipulator can be recorded at the same time, so that the position information of the first edge of the silicon wafer can be obtained. And the wafer fork continues to advance, when the second detection point is blocked, the incident light emitted by the light source is reflected to the second edge position of the silicon wafer through the second detection point, the reflected light is finally received by the energy detector, and the real-time position of the mechanical arm wafer fork can be recorded, so that the second edge position information of the silicon wafer can be obtained. And repeating the steps until the edges of the silicon wafer are detected at all the detection points, thereby obtaining N pieces of edge position information of the silicon wafer to be taken. And then, the identification center position of the silicon wafer to be taken can be calculated according to the N pieces of edge position information, so that when the wafer is placed, the silicon wafer transmission manipulator can compensate according to the actual position offset of the silicon wafer, and accidents such as wafer collision and the like are avoided. The calculation principle of the identification center position is that an N-polygon can be obtained from the N pieces of edge position information, and the center of a circumscribed circle (namely, the centroid) of the N-polygon is the identification center position of the silicon wafer to be taken.
Preferably, the value of N is 4, that is, 4 detection points are arranged on the wafer fork to obtain 4 edge position information on the silicon wafer to be taken. It will be appreciated that there will be a notch, i.e. a gap, in the wafer to orient the wafer. According to the invention, by arranging 4 detection points, even if one detection point detects the edge position information at the notch, the edge position information detected by other three detection points can be ensured to belong to the circumference of the silicon wafer to be taken, the three edge position information detected by the other three detection points can obtain a triangle, and the center position of the circumscribed circle of the triangle is the identification center position of the silicon wafer.
The laser position detection module is described in detail below with reference to fig. 1 and 2. As shown in fig. 1, an area of the wafer fork 100 coinciding with the silicon wafer 200 is a carrying area of the wafer fork 100 for carrying the silicon wafer 200, and the N detection points are all disposed in the carrying area.
In a first implementation manner, the number of the laser position detection modules is N, and one detection point corresponds to one laser position detection module. As shown in the upper part of fig. 1, in a laser position detecting module, the light transmission member includes a first beam splitter prism 302, a first reflecting mirror 303, and a second reflecting mirror 305 disposed along a light transmission path, and the second reflecting mirror 305 is disposed at the detection point;
incident light emitted by the light source 301 is transmitted by the first light splitting prism 302 and then continuously transmitted to the first reflecting mirror 303 along the incident direction, the incident light is reflected by the first reflecting mirror 303 and then enters the second reflecting mirror 305, and the second reflecting mirror 305 reflects the incident light to the silicon wafer 200 to be taken;
the reflected light reflected by the to-be-taken silicon wafer 200 is reflected by the second reflecting mirror 305 and then enters the first reflecting mirror 303, is reflected by the first reflecting mirror 303 and then enters the first light splitting prism 302, and is reflected by the first light splitting prism 302 and then enters the energy detector 306.
In a second implementation manner, a plurality of detection points can share one laser position detection module. As shown in the lower part of fig. 1, in a laser position detecting module, the light transmission component includes a first beam splitter prism 302, a first reflector 303, n-1 second beam splitter prisms 304 and a second reflector 305, which are arranged along the light transmission path, n-1 second beam splitter prisms 304 are arranged at n-1 detecting points close to the light source 301, and the second reflector 305 is arranged at the detecting point farthest from the light source; wherein N is more than or equal to 2 and less than or equal to N. It should be noted that "close to the light source" and "farthest from the light source" as used herein refer to the distance from the light source in the light transmission path, not the actual spatial position.
Referring to fig. 2, the incident light emitted by the light source 301 is transmitted by the first beam splitter prism 302 and then continuously transmitted to the first reflector 303 along the incident direction, the incident light is sequentially incident to n-1 second beam splitter prisms 304 after being reflected by the first reflector 303, the incident light is transmitted to the second reflector 305 by the last second beam splitter prism 304, and the n-1 second beam splitter prisms 304 and the second reflector 305 reflect the incident light to the to-be-taken silicon wafer 200;
the reflected light reflected by the to-be-taken silicon wafer 200 is reflected by the corresponding second light splitting prism 304 and the second reflecting mirror 305, and finally enters the first reflecting mirror 303, is reflected by the first reflecting mirror 303, enters the first light splitting prism 302, and enters the energy detector 306 after being reflected by the first light splitting prism 302.
In practical applications, the laser position detection modules in the two implementations may be separately disposed on the blade fork 100, or may be disposed in a mixed manner, and the embodiment shown in fig. 1 is an arrangement situation in the mixed manner, which is not limited in the present invention. Preferably, 4 detection points can be arranged on the blade fork, the positions of the 4 detection points are shown in fig. 1, and two laser position detection modules as described in the second implementation manner are arranged, wherein the upper two detection points share one laser position detection module, and the lower two detection points share one laser position detection module.
It should be noted that, for the second implementation manner, after the first detection point detects the edge of the silicon wafer, the first detection point will continue to transmit the reflected light reflected by the silicon wafer to the energy detector 306, and when the second detection point detects the edge of the silicon wafer, the second detection point transmits the reflected light reflected by the silicon wafer to the energy detector 306, and the energy received by the energy detector 306 is increased, so that the system can determine whether the second detection point has detected the edge of the silicon wafer according to whether the energy received by the energy detector 306 is increased.
Preferably, the plate fork 100 is Y-shaped and includes two fingers and a connecting arm, and the N detecting points are disposed on the two fingers. As shown in fig. 1, 4 detection points are symmetrically distributed on two fingers, the connecting arm is used to connect a wafer transmission manipulator, and the light source 301 and the energy detector 306 in the laser position detection module may be disposed in a wrist space of the wafer transmission manipulator.
In summary, the silicon wafer transmission fork with the position detection function provided by the invention has the following advantages:
1. the light source and the energy detector can be arranged in the wrist space of the manipulator, and do not occupy the space of the slice fork;
2. because the detection point is a single micro reflector prism and a single beam splitter prism, the size can reach 2mm, if the detection point is damaged, the detection point can be replaced independently, and the cost is lower;
3. at least 4 detection points can be arranged, at least 3 pieces of edge position information can be guaranteed to be effective, and the influence of notch is avoided.
Based on the same invention concept, the invention also provides a silicon wafer transmission manipulator with an automatic centering function, wherein the tail end of the silicon wafer transmission manipulator is provided with the silicon wafer transmission piece fork with the position detection function. Meanwhile, the invention also provides semiconductor equipment which comprises the silicon wafer transmission manipulator with the position detection function.
The silicon wafer transmission fork with the position detection function is arranged at the tail end of a silicon wafer transmission manipulator and is used for transmitting a silicon wafer among a plurality of stations in semiconductor equipment. The semiconductor equipment also comprises a plurality of stations such as a bearing device for placing a silicon wafer and a control device for controlling the manipulator to perform various actions, the bearing device is provided with a supporting part for bearing the silicon wafer, the control device is provided with a judging device, at least 3 detection points are arranged on a sheet fork, when the sheet fork extends into the position below the silicon wafer to be taken, at least 3 detection points are respectively shielded by the edge of the silicon wafer, emergent light rays emitted by a light source reach the back of the silicon wafer and are reflected to an energy detector along an original path through a beam splitter prism, a reflecting mirror and a reflecting mirror or the beam splitter prism at the detection points, the real-time position of the manipulator is recorded when the energy detector receives a reflection signal, the judging device in the controller can calculate the identification center position of the silicon wafer according to the real-time position of the manipulator when triggering each detection point, and compare the identification center position with the theoretical center position, when the film is within the safety range, the film fork normally takes the film, and executes automatic centering when the film is placed at the next station, if the film exceeds the safety range, the judging device gives an alarm, the film fork stops taking the film, and the machine station checks. The identification center position and the theoretical center position both refer to the relative position of the silicon wafer on the wafer fork.
In the invention, the silicon wafer bearing device can be a supporting structure in the processing cavity, and can also be equipment such as a wafer box, a pre-alignment platform, a cache platform and the like. The wafer removal process of the present invention may therefore include, but is not limited to, the removal of silicon wafers from a processing chamber, and may also include the picking of silicon wafers from a cassette.
As shown in fig. 3, the silicon wafer transmission method provided by the present invention, which uses the above silicon wafer transmission manipulator with the automatic centering function, specifically includes:
step S01, after the wafer is taken at the station 1 and the wafer fork extends into the position below the silicon wafer to be taken, the energy detector is triggered when the N detection points are sequentially positioned under the edge of the silicon wafer;
specifically, the wafer fork extends into the position below the to-be-taken silicon wafer at the wafer taking height, and before the wafer is lifted to be taken, N (introduced as N4) detection points are respectively shielded by the edge of the silicon wafer, and incident light emitted by a light source reaches the back of the silicon wafer to be reflected and then reaches an energy detector along an original path through a spectroscope, a reflector, a beam splitter prism or a reflector to trigger the energy detector.
Step S02, acquiring edge position data of the silicon wafer according to the positions of the wafer forks when the energy detector is triggered by the N detection points;
specifically, when the manipulator extends into the position below the silicon wafer to be taken, the controller reads the position of the manipulator fork in real time, and when the trigger signal of the energy detector is obtained, the positions of the manipulator fork at the moment are respectively recorded, so that the position data (X1, Y1), (X2, Y2), (X3, Y3), (X4, Y4) of the edge of the silicon wafer are obtained. It can be understood that the recorded position of the mechanical arm blade fork can be regarded as the position of the center of the mechanical arm blade fork, and the relative position relationship between each detection point and the center position of the blade fork is known because the position of each detection point on the blade fork is fixed, so that when the position of the blade fork is recorded, the position data of the detection point can be obtained according to the position of the blade fork and the relative position relationship between the center of the blade fork and the detection point, and the position data of the detection point is the position data of the edge of the silicon wafer.
Step S03, calculating the identification center position of the silicon wafer according to the edge position data of the silicon wafer;
specifically, according to 4 pieces of position data, any three pieces of position data can form a triangle, and four triangles are obtained, the diameters of 4 circumscribed circles corresponding to the four triangles are D1, D2, D3 and D4 respectively, the controller compares the diameters of the 4 circumscribed circles with the theoretical diameter D of the silicon wafer, eliminates data with the diameter difference larger than a threshold value C, accordingly avoids the influence of silicon wafer notch, and then obtains the identification center position P1 of the silicon wafer to be taken according to the remaining effective position data. That is, if a certain position data is the position data at the silicon wafer notch, the difference between the circumscribed circle diameter of the three triangles formed by the position data and the theoretical diameter D of the silicon wafer is greater than the threshold value C, and therefore the position data needs to be eliminated, and the center of the circumscribed circle of the triangle formed by the remaining three position data is the recognition center position P1 of the silicon wafer to be taken. If the difference between the diameters of the four circumscribed circles and the theoretical diameter D of the silicon wafer is smaller than the threshold value C, the center of any one circumscribed circle can be obtained as the identification center position P1 of the silicon wafer to be obtained, or the centers of the four circumscribed circles can be respectively obtained, and then the identification center position P1 of the silicon wafer to be obtained is obtained through calculation according to the four centers (for example, an average value is obtained).
Step S04, calculating the offset vector of the center of the silicon wafer according to the identification center position and the theoretical center position of the silicon wafer;
specifically, the recognition center position P1 is compared with the theoretical position center position P0 to calculate an offset vector P2.
Step S05, judging whether the actual eccentricity of the silicon chip is in a safe range according to the offset vector; if yes, perform step S06A, if no, perform step S06B;
specifically, the controller evaluates the actual offset vector, and if the actual offset vector is within the safety range, the controller performs step S06A, and if the actual offset vector is greater than the safety range, the controller performs step S06B.
Step S06A, the silicon wafer of station 1 is obtained by the wafer fork;
specifically, the mechanical wafer fork is lifted at the station 1 to obtain the silicon wafer.
Step S07, adjusting the position of the wafer fork according to the eccentric vector, and aligning the recognition center position of the silicon wafer with the theoretical center position of the station 2 when the wafer fork reaches the station 2;
specifically, when the wafer placing height of the mechanical wafer fork is in the station 2, the original teaching position of the mechanical wafer fork on the station 2 is compensated according to the actual offset vector P2, so that the silicon wafer identification center can be aligned with the theoretical center.
And step S08, normally placing the film on the station 2 by the film fork, and completing a round of film taking and placing process.
And step S06B, stopping taking the film by the film fork, and stopping checking the machine table.
In conclusion, the invention can avoid the accidents of collision, falling and the like caused by large position deviation of the silicon wafer to be taken, and particularly, in the subsequent machine, the value of each wafer is not good, and the considerable economic loss can be recovered; if the scheme of placing the sensors at the front ends of the bearing tables is used, the sensors need to be placed in front of each bearing table, and when the number of the bearing tables is large, the cost is high; because the requirement of the terminal customer on the yield is higher, the manipulator can replace the pre-alignment function in some occasions without orienting the silicon wafer, and the cost of pre-aligning monomers can be reduced while the yield is improved.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
While the present invention has been described in detail with reference to the preferred embodiments, it should be understood that the above description should not be taken as limiting the invention. Various modifications and alterations to this invention will become apparent to those skilled in the art upon reading the foregoing description. Accordingly, the scope of the invention should be determined from the following claims.
Claims (11)
1. A silicon wafer transmission fork with a position detection function is characterized in that the fork is provided with a bearing area for bearing a silicon wafer, N detection points are arranged in the bearing area, N is not less than 3, and a connecting line of the positions of any two detection points is not parallel to the direction of the movement of the fork towards the silicon wafer to be taken;
the wafer fork is provided with a laser position detection module, the laser position detection module comprises a light source, an optical transmission assembly and an energy detector, when the wafer fork moves to the detection point and is positioned below the silicon wafer to be taken, incident light emitted by the light source is transmitted by the optical transmission assembly, then is incident to the silicon wafer to be taken from the detection point, and is reflected to the detection point by the silicon wafer to be taken, and then is transmitted to the energy detector by the optical transmission assembly.
2. The silicon wafer conveying fork with the position detection function as claimed in claim 1, wherein the number of the laser position detection modules is N, and one detection point corresponds to one laser position detection module.
3. The silicon wafer conveying fork with the position detection function as claimed in claim 2, wherein the light transmission assembly comprises a first beam splitter prism, a first reflecting mirror and a second reflecting mirror arranged along a light transmission path, and the second reflecting mirror is arranged at the detection point;
incident light emitted by the light source is transmitted by the first light splitting prism and then is continuously transmitted to the first reflector along the incident direction, the incident light is reflected by the first reflector and then enters the second reflector, and the second reflector reflects the incident light to the silicon wafer to be taken;
the reflected light reflected by the silicon wafer to be taken is reflected by the second reflecting mirror and then enters the first reflecting mirror, is reflected by the first reflecting mirror and then enters the first light splitting prism, and is reflected by the first light splitting prism and then enters the energy detector.
4. The silicon wafer conveying fork with the position detection function as claimed in claim 1, wherein a plurality of the detection points share one laser position detection module.
5. The silicon wafer conveying fork with the position detection function as claimed in claim 4, wherein the light transmission component comprises a first beam splitter prism, a first reflector, n-1 second beam splitter prisms and a second reflector which are arranged along a light transmission path, wherein the n-1 second beam splitter prisms are arranged at n-1 detection points close to the light source, and the second reflector is arranged at the detection point farthest from the light source; wherein N is more than or equal to 2 and less than or equal to N;
incident light emitted by the light source is transmitted by the first light splitting prism and then is continuously transmitted to the first reflector along the incident direction, the incident light is sequentially transmitted to n-1 second light splitting prisms after being reflected by the first reflector, the last second light splitting prism is transmitted to the second reflector, and the n-1 second light splitting prisms and the second reflector reflect the incident light to the silicon wafer to be taken;
and the reflected light reflected by the silicon wafer to be taken is reflected by the corresponding second light splitting prism and the second reflecting mirror, finally enters the first reflecting mirror, is reflected by the first reflecting mirror, enters the first light splitting prism, and enters the energy detector after being reflected by the first light splitting prism.
6. The silicon wafer transmission fork with the position detection function as claimed in claim 1, wherein the fork is Y-shaped and comprises two fingers, and N detection points are arranged on the two fingers.
7. The silicon wafer conveying fork with the position detection function according to any one of claims 1 to 6, wherein N is equal to 4.
8. A silicon wafer conveying manipulator with an automatic centering function, wherein a silicon wafer conveying fork with a position detection function as claimed in any one of claims 1 to 7 is mounted at the tail end of the silicon wafer conveying manipulator.
9. A silicon wafer conveying method, characterized in that the silicon wafer conveying manipulator with the automatic centering function according to claim 8 is adopted, and the method comprises the following steps;
step S01, after the wafer is taken at the station 1 and the wafer fork extends into the position below the silicon wafer to be taken, the energy detector is triggered when the N detection points are sequentially positioned under the edge of the silicon wafer;
step S02, acquiring edge position data of the silicon wafer according to the positions of the wafer forks when the energy detector is triggered by the N detection points;
step S03, calculating the identification center position of the silicon wafer according to the edge position data of the silicon wafer;
step S04, calculating the offset vector of the center of the silicon wafer according to the identification center position and the theoretical center position of the silicon wafer;
step S05, judging whether the actual eccentricity of the silicon chip is in a safe range according to the offset vector; if so, go to step S06A;
step S06A, the silicon wafer of station 1 is obtained by the wafer fork;
step S07, adjusting the position of the wafer fork according to the eccentric vector, and aligning the recognition center position of the silicon wafer with the theoretical center position of the station 2 when the wafer fork reaches the station 2;
and step S08, normally placing the film on the station 2 by the film fork, and completing a round of film taking and placing process.
10. The silicon wafer transfer method of claim 9, wherein in step S05, if no, step S06B is executed, the wafer fork stops taking the wafer, and the machine stops checking.
11. A semiconductor device comprising the silicon wafer transfer chip fork having a position detection function according to claim 8.
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