CN105666489A - Manipulator used for correcting offline training data and method - Google Patents
Manipulator used for correcting offline training data and method Download PDFInfo
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- CN105666489A CN105666489A CN201511022412.6A CN201511022412A CN105666489A CN 105666489 A CN105666489 A CN 105666489A CN 201511022412 A CN201511022412 A CN 201511022412A CN 105666489 A CN105666489 A CN 105666489A
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- silicon chip
- sheet
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1694—Programme controls characterised by use of sensors other than normal servo-feedback from position, speed or acceleration sensors, perception control, multi-sensor controlled systems, sensor fusion
Abstract
The invention provides a manipulator used for correcting offline training data and a method. Fake silicon wafers are arranged on a wafer fork. A wireless transceiver, a detector and a converter are embedded in each fake silicon wafer, wherein the wireless transceivers are used for sending out detection signals, the detectors are sensitive to the detection signals and used for converting the detection signals into electrical signals, and the converters are used for converting the electrical signals into numerical value; in addition, shielding of the wafer fork is avoided by arranging the wireless transceivers, and the wireless transceivers are made to send out the detection signals to the outside from the upper portions of the fake silicon wafers or the lower portions of the fake silicon wafers, so that real-time detection is conducted on the upper portion of the wafer fork or the lower portion of the wafer fork in the process of picking and placing the fake silicon wafers, the offline training data is timely corrected, and the effect that the fake silicon wafers are safely taken and placed is ensured; moreover, the mode that the fake silicon wafers are arranged on the wafer fork is simple and easy to implement, and thus the process difficulty is reduced.
Description
Technical field
The present invention relates to semiconductor processing equipment technical field, it is specifically related to a kind of mechanical manipulator for revising off-line teaching data and picks and places the modification method of sheet off-line teaching data.
Background technology
The secure access of silicon chip and transport are the big production line of unicircuit extremely important technical indicators; Usually require in process of production the silicon chip fragment rate that transportation equipment self causes should be less than 100,000/. As batch type wafer heat system, relative to monolithic formula process system, chip transmission needed for each production technique, silicon chip are placed and to get sheet number of times more, and the safety and reliability thus chip transmission, silicon chip being placed and being got sheet requires higher.
At present, mechanical manipulator is widely used in semiconductor integrated circuit manufacturing technology field, mechanical manipulator is the important equipment in silicon chip transmission system, for accessing the silicon chip process front and art breading with transportation technology after, it can accept instruction, accurately navigate to certain on three-dimensional or two-dimensional space a bit to carry out picking and placeing silicon chip, both single piece of silicon chip can be picked and placeed operation, it is possible to many pieces of silicon chips are picked and placeed operation.
At present, the silicon chip of batch type wafer heat system passes the location parameter getting link and generally adopts the mode of off-line teaching to obtain and store in the controller, carries out monitoring and testing by the cycle simultaneously. The silicon chip placed on load carrier is carried out loading or unloading operation according to the data of the off-line teaching stored by mechanical manipulator. When mechanical manipulator is when picking and placeing operation to silicon chip, silicon chip load carrier is due to the impact of the factors such as variation of ambient temperature, load change and physical construction distortion, when mechanical manipulator picks and places the silicon chip on load carrier by the position coordinate of offline storage, exist and produce collision and cause silicon chip or the impaired risk of equipment, cause irretrievable loss. Meanwhile, the situations such as the temperature distortion produced in heat treatment process due to silicon chip also can make the actual distribution state of silicon chip have different from off-line teaching location parameter so that the motion that mechanical manipulator picks and places silicon chip is in non-security state,
Referring to Fig. 1, Fig. 1 is that in prior art, mechanical manipulator is placed and position structural representation when getting sheet at chip transmission, silicon chip.As shown in the figure, when silicon chip 2 is in the error state (ERSTies such as inclination on support component 3, mechanical manipulator 1 is in non-security working order in the motion of access silicon chip 2 automatically, is very easy to the damage causing silicon chip 2 and equipment (comprising mechanical manipulator 1). After mechanical manipulator 1 completes silicon chip placement or before preparing to get sheet, silicon chip 2 distribution in silicon chip group on support component 3 need to be carried out pose identification accurately, provide accurate counter-measure to the various error state (ERSTies identified simultaneously, pick and place sheet to realize safety.
Therefore, picking and placeing the pose of silicon chip is identified be very important by sheet process.
Summary of the invention
In order to overcome above problem, it is desirable to provide a kind of mechanical manipulator for revising off-line teaching data and method, by arranging false silicon chip on sheet fork, false silicon chip embeds the structure being used for distance measurement, can avoid being arranged on sheet fork for the structure of distance measurement and block position, in not only making sheet pitch, the structure for distance measurement is installed and becomes more simple, and effectively can revise picking and placeing sheet off-line data.
In order to achieve the above object, the present invention provides a kind of mechanical manipulator for revising off-line teaching data, it is installed in semiconductor devices, semiconductor devices also comprises the described silicon chip bogey for placement of multiple layers silicon chip, described silicon chip bogey has the support component for carrying silicon chip, and described mechanical manipulator is for picking up the silicon chip of described silicon chip bogey or is positioned over by silicon chip in described silicon chip bogey; Described mechanical manipulator has the fork of the sheet for carrying silicon chip, described fork upper surface has false silicon chip, described false silicon chip is embedded with the wireless receiving and dispatching device for sending detectable signal, to described detectable signal sensitivity and described detectable signal is converted to the detector of electrical signal and described electrical signal is converted to the transmodulator of numerical value; Described wireless receiving and dispatching device outwards sends detectable signal above described false silicon chip or below described false silicon chip, and described fork does not block described wireless receiving and dispatching device.
Preferably, described false silicon chip is mechanically fastened on described fork.
Preferably, described fork has the clamping parts clamping wafer.
Preferably, the sheet fork having described false silicon chip only uses when obtaining off-line teaching data and described off-line teaching data revised.
In order to realize above-mentioned purpose, present invention also offers a kind of modification method getting sheet off-line teaching data carried out according to above-mentioned mechanical manipulator, comprising:
Step 101: perform off-line and get sheet operational order, off-line teaching data are set; Wherein, described off-line teaching data comprise: distance secure threshold, inclination angle secure threshold, mechanical manipulator run in specified location and the offline parameter data of described specified location; Described mechanical manipulator run in specified location comprise sheet secure location of looking ahead, in advance upwards get sheet position and contact position with silicon chip, exit to get sheet position and get sheet and exit secure location in advance;
Step 102: the described mechanical manipulator with described false silicon chip carries out detection acquisition range observation data at the specified location of described off-line teaching data, and calculates the inclination angle of described false silicon chip relative to horizontal plane according to described range observation data; Wireless receiving and dispatching device in described false silicon chip sends detectable signal up and down, and detectable signal is sent to detector after returning, and signal is converted to corresponding electrical signal by detector, and transmodulator converts electrical signals to corresponding distance measure;
Step 103: whether the distance value judged in the range observation data of described false silicon chip exceeds distance secure threshold and judge described false silicon chip is relative to whether the inclination angle of horizontal plane exceeds described inclination angle secure threshold;If both having at least one be yes, then perform step 104; If both are no, then perform step 105;
Step 104: the offline parameter data of the specified location of described off-line teaching data are revised;
Step 105: the correction having proceeded to get the offline parameter data of all specified locationes in the off-line teaching data of sheet operation.
Preferably, upwards get in advance the distance of the silicon chip upper surface adjacent to described fork lower section of described false silicon chip lower surface on sheet position described in described range observation data comprise and described exit the distance getting adjacent silicon chip lower surface above described false silicon chip upper surface to described fork on sheet position in advance.
Preferably, in described step 101, described mechanical manipulator run in specified location be also included in described exit in advance get sheet position to described get sheet exit in secure location operational process to silicon chip clamping position.
In order to achieve the above object, present invention also offers a kind of modification method carrying out film releasing off-line teaching data according to above-mentioned mechanical manipulator, it is characterised in that, comprising:
Step 201: perform off-line film releasing operational order, off-line teaching data are set; Wherein, described off-line teaching data comprise: distance secure threshold, inclination angle secure threshold, mechanical manipulator run in specified location and the offline parameter data of described specified location; Specified location in the operation of described mechanical manipulator comprises pre-film releasing secure location, pre-film releasing position downwards contacts position with silicon chip, exit film releasing position in advance and secure location is exited in film releasing;
Step 202: the described mechanical manipulator with described false silicon chip carries out detection acquisition range observation data at the specified location of described off-line teaching data, and calculates the inclination angle of described false silicon chip relative to horizontal plane according to described range observation data; Wireless receiving and dispatching device in described false silicon chip sends detectable signal up and down, and detectable signal is sent to detector after returning, and signal is converted to corresponding electrical signal by detector, and transmodulator converts electrical signals to corresponding distance measure;
Step 203: whether the distance value judged in the range observation data of described false silicon chip exceeds distance secure threshold and judge described false silicon chip is relative to whether the inclination angle of horizontal plane exceeds described inclination angle secure threshold; If both having at least one be yes, then perform step 204; If both are no, then perform step 205;
Step 204: the offline parameter data of the specified location of described off-line teaching data are revised;
Step 205: the correction having proceeded the offline parameter data of all specified locationes in the off-line teaching data of film releasing operation.
Preferably, the distance of adjacent silicon chip lower surface above described false silicon chip upper surface to described fork on described false silicon chip lower surface on film releasing position to the distance and described pre-film releasing position downwards of the adjacent silicon chip upper surface in described fork lower section is exited described in described range observation data comprise in advance.
Preferably, in described step 201, the specified location in the operation of described mechanical manipulator is also included in described pre-film releasing secure location and clamps position to being cancelled by silicon chip in described pre-film releasing position operational process downwards.
Mechanical manipulator and the method for revising off-line teaching data of the present invention, by arranging false silicon chip on sheet fork, false silicon chip is embedded with the wireless receiving and dispatching device for sending detectable signal, detectable signal is responsive and detectable signal is converted to the detector of electrical signal, and convert electrical signals to the transmodulator of numerical value, and blocking of sheet fork is avoided in the setting of wireless receiving and dispatching device, wireless receiving and dispatching device is made outwards to send detectable signal above false silicon chip or below false silicon chip, thus picking and placeing the detection above or below pitching in real time in sheet process to sheet, and revise off-line teaching data in time, guarantee that safety picks and places sheet operation,Further, the mode arranging false silicon chip on sheet fork is simple, reduces technology difficulty.
Accompanying drawing explanation
Fig. 1 is that in prior art, mechanical manipulator is placed and position view during film releasing at chip transmission, silicon chip
Fig. 2 is the structural representation of the silicon chip bogey of the semiconductor devices of a better embodiment of the present invention
Fig. 3 is the chip transmission of a better embodiment of the present invention, gets sheet or the sheet fork of mechanical manipulator and the relative position relation perspective diagram of silicon chip in film releasing process
Fig. 4 is the relative position relation schematic top plan view of the sensor of a better embodiment of the present invention, mechanical manipulator, silicon chip and support component
Fig. 5 is the position relation of the silicon chip of a better embodiment of the present invention, support component and sheet fork and gets sheet route schematic diagram
Fig. 6 is position relation and the film releasing route schematic diagram of the silicon chip of a better embodiment of the present invention, support component and sheet fork
Fig. 7 is the mechanical handsheet fork of a better embodiment of the present invention and the relational structure schematic diagram of false silicon chip
Fig. 8 is the schematic flow sheet of the modification method getting sheet off-line teaching data of a better embodiment of the present invention
The false silicon chip of inclination that Fig. 9 is a better embodiment of the present invention is subject to power schematic diagram
Figure 10 is the schematic flow sheet of the modification method of the film releasing off-line teaching data of a better embodiment of the present invention
Embodiment
For making the content of the present invention clearly understandable, below in conjunction with Figure of description, the content of the present invention is described further. Certain the present invention is not limited to this specific embodiment, and the general replacement known by those skilled in the art is also encompassed in protection scope of the present invention.
The semiconductor devices of the present invention comprises for placing the silicon chip bogey of multiple silicon chip and the mechanical manipulator for picking up and transport silicon chip, and silicon chip bogey has support component, and silicon wafer horizontal is positioned on support component, and multiple silicon chip in the vertical direction arranges; As shown in Figure 2, the silicon chip bogey in the semiconductor devices of a better embodiment of the present invention, comprising: is mounted with the film magazine B of silicon chip for inner and load the silicon chip silicon chip bogey A that silicon chip enters reaction chamber C in black line frame; Semiconductor devices also has the film magazine silicon chip bogey F of carrying film magazine B, and film magazine silicon chip bogey F is connected on base G; Mechanical manipulator E for picking up silicon chip from film magazine B and is positioned over silicon chip silicon chip bogey A, when fire door D bottom reaction chamber C opens, silicon chip silicon chip bogey A carries silicon chip and enters in reaction chamber C, or after reaction terminates, fire door D bottom reaction chamber C opens, silicon chip silicon chip bogey A carry process after silicon chip exit bottom reaction chamber C, mechanical manipulator E picks up silicon chip from silicon chip silicon chip bogey A and is positioned in film magazine B; Arrow in Fig. 2 represents the movable direction of each parts. Therefore, the sheet process of getting of the present invention can be, but not limited to comprise the process picking up silicon chip from film magazine, it is also possible to comprises the process picking up silicon chip from silicon chip silicon chip bogey; With reason, the film releasing process of the present invention can be, but not limited to comprise and is positioned in film magazine by silicon chip, it is also possible to comprises and being positioned over by silicon chip on silicon chip silicon chip bogey.
In the present invention, mechanical manipulator has sheet fork, the sensor group of sheet fork be fixed with not on same bar straight line three of upper and lower surface or more, and sensor group is used for defining one or more reference plane; Three sensors of sheet fork upper surface are used for defining reference plane, and three sensors of sheet fork lower surface are used for defining lower reference plane, and upper reference plane and lower reference plane can be same plane can also be tool plane at regular intervals; The sheet fork of the present invention can overturn in horizontal plane or in vertical plane, thus causes sheet fork may produce inclination conditions; In semiconductor applications, mechanical manipulator generally has single only machinery pawl or many mechanical pawls, to adapt to the needs of mass production. In some embodiments of the invention, mechanical manipulator can have many mechanical pawls, any one or more machinery pawl sheet fork upper surface and three or more sensor of lower surface, the following examples only have three sensors respectively for a mechanical manipulator sheet fork upper surface and lower surface, other embodiment principle is identical, does not repeat them here.
Below in conjunction with accompanying drawing 3-10 and specific embodiment, the present invention is described in further detail.It should be noted that, accompanying drawing all adopts the form simplified very much, uses non-ratio accurately, and only in order to object convenient, that clearly reach aid illustration the present embodiment.
In semiconductor devices silicon chip bogey, silicon chip distribution recognition system comprises: be arranged at machinery handsheet fork, judgment means, control device and warning device; In one embodiment of the invention, machinery handsheet fork is provided with sensor; In another embodiment of the present invention, machinery handsheet fork is provided with false silicon chip, false silicon chip is embedded with wireless receiving and dispatching device, detector and transmodulator.
In one embodiment of the present of invention, referring to Fig. 3 and Fig. 4, support component 101 carries silicon chip W, support component 101 is uniformly distributed in the edge of the silicon chip W of half, and the sheet fork 101 of mechanical manipulator 100 is symmetrical V-type, and mechanical manipulator 100 also has clamping parts; The symmetry axis of sheet fork 101 overlaps with the diameter of silicon chip W, and two width tilted between sidewall outermost of sheet fork 101 are less than the diameter of silicon chip W;
Sensor group (black filled circles), is arranged at the upper and lower surface of the silicon chip W of mechanical manipulator 100, arrives the distance measure of adjacent silicon chip below this silicon chip for the distance measure bottom detection lug fork 101 to one silicon chip and sheet fork 101; The upper surface pitching 101 at sheet is provided with three sensors S1, S2, S3, wherein two sensor S1 and S2 lay respectively on two oblique walls of the symmetry of V-type sheet fork 101 and corresponding to the silicon chip W being placed on sheet fork 101 diametrically, a remaining sensor S3 is positioned on the position intersected inside symmetry two oblique walls of V-type sheet fork 101, pitch 101 place planes at this sheet and set up initial point, be set to XOY reference plane, the mid point of the line of sensor S1, S2 with the line of sensor S3 vertical and divide the line of sensor S1, S2 equally; Therefore, the line that V-type sheet is pitched two on oblique wall sensor S1, S2 is set to X-axis, the line of the mid point of the line of sensor S1, S2 and sensor S3 is set to Y-axis, the mid point of the line of sensor S1, S2 is true origin O, sheet fork place XOY plane is formed with this, here it should be noted that, when relating to the relative position relation of sensor, sensor is considered as a point. In the present embodiment, pitch, with sheet, the observed value that sensor S1, S2, S3 of 101 upper surfaces feed back and to judge the pose of silicon chip W and get whether sheet process can get safely sheet, for the minor increment and the ultimate range that calculate the angle of cylindrical surface equation, section line equation, silicon chip place plane and sheet fork place plane, section line and sheet pitch place plane; In the present embodiment, sensor is realized by optical signal detection distance, be also exactly sensor is photo-sensor.
Judgment means, for judging that mechanical manipulator comprises sheet fork is getting in sheet or film releasing moving process whether can touch silicon chip, and judges whether silicon chip is pitched at the sheet of described mechanical manipulator, sends signal when touching silicon chip to warning device;
According to the judged result of judgment means, control device, controls whether mechanical manipulator stops motion; And perform to get sheet operational order for controlling mechanical manipulator, theoretical teaching data are set; Before getting sheet or film releasing, first control device being inputted teaching data, then control device performs to get sheet operational order according to these teaching Data Control mechanical manipulators; When judgment means judges that mechanical manipulator may touch silicon chip, control device makes mechanical manipulator stop motion; Refer to Fig. 5, for the position relation of the silicon chip of a better embodiment of the present invention, support component and sheet fork and get sheet route schematic diagram;Silicon chip W is positioned on support component 102, thick dotted line with arrow represents the route getting sheet process of the present embodiment, fine dotted line frame represents the silicon chip W ' in motion, P1 position is sheet secure location of looking ahead, P2 position is for upwards to get sheet position in advance, and P3 is that the sheet getting mechanical manipulator in sheet process pitches the position touching silicon chip, and P4 gets sheet position for exiting in advance, P5 is the position of the clamping parts clamping wafer getting mechanical manipulator in sheet process, and P6 exits secure location after getting sheet; In the present embodiment, the route getting sheet process is identical with the route of film releasing process, and both direction of motion is contrary; Get each parameter value of the theoretical teaching data of sheet process and the theoretical teaching data of film releasing process each parameter value can identical can not also be identical. Fig. 5 demonstrates theoretical each parameter of teaching data, comprise the thickness d of silicon chip W, support component thickness t, adjacent silicon chip W distance s, upwards get the mechanical manipulator on the P2 of sheet position in advance sheet fork bottom to the lower side silicon wafer upper surface of sheet fork distance s2, exit the distance s1 bottom support component adjacent above the silicon chip top on the sheet fork got on the P4 of sheet position to sheet fork and upwards get sheet position P2 to exiting the distance s3 got between the P4 of sheet position in advance in advance in advance; Refer to Fig. 6, it is position relation and the film releasing route schematic diagram of the silicon chip of a better embodiment of the present invention, support component and sheet fork; Silicon chip W is positioned on support component 102, thick dotted line with arrow represents sheet process of getting or the route of film releasing process of the present embodiment, fine dotted line frame represents the silicon chip W ' in motion, P ' 1 position is exit secure location after film releasing, P ' 2 position is for exiting film releasing position in advance, the sheet that P ' 3 is mechanical manipulator in film releasing process pitches position when silicon chip is positioned over support component, P ' 4 is pre-film releasing position downwards, the clamping parts that P ' 5 is mechanical manipulator in film releasing process cancel the position clamped, and P ' 6 is pre-film releasing secure location; Fig. 6 demonstrates theoretical each parameter of teaching data, comprises the distance s1 bottom the silicon chip top on sheet fork on the distance s2, pre-film releasing position P ' 4 downwards of the lower side silicon wafer upper surface of sheet fork of the thickness d of silicon chip W, support component thickness t, the distance s of adjacent silicon chip W, the sheet fork bottom of mechanical manipulator exited on film releasing position P ' 2 to the adjacent support component in sheet fork top and downward film releasing position P ' 4 to the distance s3 exiting film releasing position P ' 2 in advance in advance; It should be noted that, in the present invention, each parameter value of the theoretical teaching data of film releasing process can be the same or different with each parameter value of the theoretical teaching data getting sheet process. Here it should be noted that, the distance s of adjacent silicon chip W is determined by the distance between support component, and the distance s of adjacent silicon chip W equals the distance bottom adjacent support member.
Warning device, receives the signal that judgment means sends, then gives the alarm.
In the safe transmission process of silicon chip, make use of the sensor of not three on same straight line or more arranged respectively at sheet fork upper surface and lower surface, the off-line teaching data of silicon chip are revised;
In one embodiment of the invention, machinery handsheet fork is provided with false silicon chip, false silicon chip is embedded with wireless receiving and dispatching device, detector and transmodulator; In this embodiment, refer to Fig. 7, it is possible to directly false silicon chip W ' is positioned on sheet fork 101 ', in other embodiment, adopt but vacation silicon chip is fixed on sheet by the mode that is not limited to paste or bolt is fixing pitches; In the present embodiment, false silicon chip W ' upper surface embeds the wireless receiving and dispatching device S1 ' for sending detectable signal, S2 ', S3 ', detectable signal is responsive and detectable signal is converted to the detector (not shown) of electrical signal and converts electrical signals to the transmodulator (not shown) of numerical value;Wireless receiving and dispatching device S1 ', S2 ', S3 ' are arranged on the false silicon chip W ' position avoiding being pitched 101 ' block by sheet, like this, wireless receiving and dispatching device S1 ', S2 ', S3 ' false silicon chip W ' top or false silicon chip W ' lower section can outwards send detectable signal, and during without the need to considering to pitch 101 ' detection downwards from sheet, signal is pitched 101 ' by sheet and blocked and cannot realize downward detection. Here, false silicon chip W ' upper and lower surface is all provided with three not wireless receiving and dispatching devices on the same line, sheet fork also has clamping parts, does not drop for the wafer clamped on sheet fork. It should be noted that, the above-mentioned sheet with false silicon chip is pitched in the process that can only be used for obtaining off-line teaching data and off-line teaching data revised, and can not be used for on-line monitoring. It can be isosceles triangle or equilateral triangle that wireless receiving and dispatching device S1 ', S2 ', S3 ' are arranged at the relation of false silicon chip W ' upper surface.
In the present embodiment, in the process that the safety adopting the mechanical manipulator of the above-mentioned sheet fork with false silicon chip to carry out silicon chip picks and places, wireless receiving and dispatching device in false silicon chip is by sending detectable signal up and down, detectable signal is sent to detector after returning, signal is converted to corresponding electrical signal by detector, transmodulator converts electrical signals to corresponding distance measure, such that it is able to the specified location picked and placeed in sheet process carries out monitor in real time and correction. concrete, the present embodiment gets sheet process for safety be described, get sheet route to carry out according to the sheet route of getting in above-mentioned Fig. 5, false silicon chip and sheet fork, the relation of support component, pitch with above-mentioned silicon chip and sheet, the relation of support component is identical, namely it is pitch at sheet, in the three position relation of support component and silicon chip, silicon chip is substituted with false silicon chip, therefore, false silicon chip and sheet fork, silicon chip shown in the relative position parameter of support component and above-mentioned Fig. 5 and sheet fork, the relative position parameter of support component is identical, below for false silicon chip and sheet fork, the description of the relative position parameter of support component can with reference to the description shown in above-mentioned Fig. 5, referring to Fig. 8, the modification method getting sheet off-line teaching data of the present embodiment comprises:
Step 101: perform off-line and get sheet operational order, off-line teaching data are set;
Concrete, off-line teaching data comprise: distance secure threshold, inclination angle secure threshold, mechanical manipulator run in specified location and the offline parameter data of described specified location; Described mechanical manipulator run in specified location comprise the sheet secure location P1 that looks ahead, in advance upwards get sheet position P2 contact with silicon chip position P3, in advance exit get sheet position P4, exit in advance get sheet position P4 to get sheet exit in secure location P6 operational process to silicon chip clamping position P5 and get sheet and exit secure location P6;
Step 102: the mechanical manipulator with false silicon chip carries out detection acquisition range observation data at the specified location of off-line teaching data, and calculates the inclination angle of false silicon chip relative to horizontal plane according to range observation data;
Concrete, the wireless receiving and dispatching device in false silicon chip sends detectable signal up and down, and detectable signal is sent to detector after returning, and signal is converted to corresponding electrical signal by detector, and transmodulator converts electrical signals to corresponding distance measure; Range observation data comprise is upwards got the distance of the silicon chip upper surface that false silicon chip lower surface is adjacent to sheet fork lower section on sheet position in advance and is exited the distance getting the silicon chip lower surface that false silicon chip upper surface is adjacent to sheet fork top on sheet position in advance;
Here, false silicon chip upper and lower surface is all provided with not three wireless receiving and dispatching devices on the same line, upwards to get sheet position P2 in advance, on this position, distance secure threshold is the safety range of false silicon chip lower surface to the distance of the adjacent silicon chip upper surface in sheet fork lower section, and inclination angle secure threshold is the safety range of false silicon chip lower surface to the inclination angle of the adjacent silicon chip upper surface in sheet fork lower section;Taking false silicon chip place plane as XOY plane, it is set to initial point with false silicon chip center, and think that the adjacent silicon chip in sheet fork lower section is for being horizontally disposed with, distance coordinate figure (x1, y1, z1), (x2 at adjacent silicon chip top below false silicon chip lower surface to sheet fork is obtained respectively at three the wireless receiving and dispatching devices upwards getting false silicon chip lower surface on sheet position in advance, y2, and (x3, y3, z3) z2); Obtain distance z1 along Z axle, z2 and z3 of false each wireless receiving and dispatching device of silicon chip lower surface with adjacent silicon chip top, sheet fork lower section according to coordinate figure, then ask for the mean value of these distances as the distance along Z axle of false silicon chip lower surface with adjacent silicon chip top, sheet fork lower section; Angle between the sheet fork adjacent silicon chip place plane in lower section and false silicon chip is the pitch angle of false silicon chip relative to horizontal plane; Then, according to above-mentioned three coordinate figures ask for sheet fork lower section adjacent silicon chip plane equation be
AX+BY+CZ+D=0;
Wherein, A, B, C and D calculating formula is as follows:
A=y1z2-y1z3-y2z1+y2z3+y3z1-y3z2
B=-x1z2+x1z3+x2z1-x2z3-x3z1+x3z2
C=x1y2-x1y3-x2y1+x2y3+x3y1-x3y2,
D=-x1y2z3+x1y3z2+x2y1z3-x2y3z1-x3y1z2+x3y2z1.
Then, calculate the inclination angle of false silicon chip relative to the adjacent silicon chip in sheet fork lower section by plane equation; The plane equation of false silicon chip is Z=0, set up the plane equation of the adjacent silicon chip in sheet fork lower section and false silicon chip plane equation group,
AX+BY+CZ+D=0
Z=0
Their normal vector be respectively A, B, C} and 0,0,1}, if the angle of these two normal vectors is α, so the angle of these two planes is exactly α, so,
Cos α=C/ [√ (A2+B2+C2)]
α=arccos (C/ [√ (A2+B2+C2)])。
By aforesaid method, the inclination angle of false silicon chip relative to horizontal plane can be tried to achieve; For looking ahead, sheet secure location P1 can also adopt aforesaid method to ask for inclination angle.
In addition, get on the P4 of sheet position exiting in advance, taking false silicon chip place plane as XOY plane, it is set to initial point with false silicon chip center, and think that the adjacent silicon chip in sheet fork top is for being horizontally disposed with, distance secure threshold on this position is the safety range of the distance bottom false silicon chip upper surface to sheet fork top adjacent support member, and inclination angle secure threshold is the safety range of false silicon chip upper surface to the inclination angle of the adjacent silicon chip lower surface in sheet fork top; Three wireless receiving and dispatching devices of false silicon chip upper surface obtain distance coordinate figure (x1, y1, z1), (x2, y2, the z2) and (x3, y3, z3) of adjacent silicon chip lower surface above false silicon chip upper surface to sheet fork respectively; Distance z1 along Z axle, z2 and z3 of false each wireless receiving and dispatching device of silicon chip upper surface with the adjacent silicon chip lower surface in sheet fork top is obtained according to coordinate figure, distance z1, z2 and z3 are subtracted respectively the thickness of support component again, thus obtaining the distance z ' 1 along Z axle, the z ' 2 and z ' 3 bottom false each wireless receiving and dispatching device of silicon chip upper surface and sheet fork top adjacent support member, the mean value then asking for these distance z ' 1, z ' 2 and z ' 3 is as the distance along Z axle bottom false silicon chip upper surface and sheet fork top adjacent support member; Meanwhile, the angle that sheet is pitched between the adjacent silicon chip lower surface place plane in top and false silicon chip is the pitch angle of false silicon chip relative to horizontal plane; Then, according to above-mentioned three coordinate figures z1, z2 and z3 ask for sheet fork top adjacent silicon chip lower surface plane equation be
AX+BY+CZ+D=0;
Wherein, A, B, C and D calculating formula is as follows:
A=y1z2-y1z3-y2z1+y2z3+y3z1-y3z2
B=-x1z2+x1z3+x2z1-x2z3-x3z1+x3z2
C=x1y2-x1y3-x2y1+x2y3+x3y1-x3y2,
D=-x1y2z3+x1y3z2+x2y1z3-x2y3z1-x3y1z2+x3y2z1.
Then, calculate the inclination angle of false silicon chip relative to the adjacent silicon chip lower surface in sheet fork top by plane equation; The plane equation of false silicon chip is Z=0, set up the plane equation of the adjacent silicon chip upper surface in sheet fork top and false silicon chip plane equation group,
AX+BY+CZ+D=0
Z=0
Their normal vector be respectively A, B, C} and 0,0,1}, if the angle of these two normal vectors is α, so the angle of these two planes is exactly α, so,
Cos α=C/ [√ (A2+B2+C2)]
α=arccos (C/ [√ (A2+B2+C2)])。
By aforesaid method, the inclination angle of false silicon chip relative to horizontal plane can be tried to achieve; For to silicon chip clamping position P5 with get sheet and exit secure location P6 aforesaid method can also be adopted to ask for inclination angle.
Step 103: whether the distance value judged in the range observation data of false silicon chip exceeds distance secure threshold and judge false silicon chip is relative to whether the inclination angle of horizontal plane exceeds inclination angle secure threshold; If both having at least one be yes, then perform step 104; If both are no, then perform step 105;
Concrete, distance secure threshold can set according to experience, distance secure threshold is that sheet fork and false silicon chip do not touch its upper support parts or the safe distance scope of its lower side silicon wafer, inclination angle secure threshold is that silicon chip can not produce the inclination angle safety range slided when online pickup silicon chip, slip herein comprises false silicon chip opposite panel fork and produces to slide, refer to Fig. 9, for the false silicon chip of inclination of a better embodiment of the present invention is by power schematic diagram, wherein, α is the pitch angle of false silicon chip and horizontal plane in reality, false silicon chip is subject to downward gravity mg, sheet pitches the reactive force N of silicon chip of granting the leave, in addition, if the coefficient of sliding friction of false silicon chip is μ, it is subject to maximum static friction force slightly larger than sliding friction power, here sliding friction power it is approximately, so the maximum static friction force of false silicon chip is a μm gcos α, when gravity and frictional force to make a concerted effort be zero, when just making false silicon chip not move downward, corresponding false silicon chip pitch angle is the theory α coefficient pitch angle threshold value δ of false silicon chip,
The safe tilt threshold slided can not be produced according to the false false silicon chip of silicon chip stressing conditions setting:
Mgsin (δ) mgcos (δ) μ=0, thus obtain δ=arctan (μ).
Step 104: the offline parameter data of the specified location of off-line teaching data are revised;
Concrete, the distance value in the range observation data of false silicon chip exceeded when secure threshold and/or false silicon chip exceed inclination angle secure threshold relative to the inclination angle of horizontal plane, performed this step; The method that the offline parameter data of specified location are revised is comprised: along distance adjustment and the Inclination maneuver of Z axle, be described upwards to get sheet position P2 in advance;
Distance adjustment process along Z axle comprises:
Step 1041: the distance of continuous twice detection of wireless receiving and dispatching device of the upper false silicon chip lower surface of sheet fork and the adjacent silicon chip upper surface in sheet fork lower section, obtains the first time coordinate figure and coordinate figure for the second time of each wireless receiving and dispatching device of false silicon chip lower surface;
Concrete, carry out continuous twice detection and averaged can increase numerical stability. If the coordinate figure of twice detection is (x11, y11, z11) before and after three sensors on sheet fork lower surface, (x21, y21, z21), (x31, y31, z31), (x12, y12, z12), (x22, y22, z22), (x32, y32, z32);
Step 1042: ask for the first mean value of first time coordinate figure and the 2nd mean value of second time coordinate figure;
Concrete, the mean value of Z value is Zave1=Average (z11, z21, z31), Zave2=Average (z12, z22, z32);
Step 1043: calculate the first mean value and the difference of the 2nd mean value, as compensated distance value;
Concrete, the compensated distance value along Z axle is Zchange=Zave1-Zave2;
Step 1044: each specified location in theoretical teaching data is all added compensated distance value.
Concrete, the Z value of the coordinate figure of each specified location adds Zchange all accordingly. Here, pre-upwards getting, the Z value of sheet position adds Zchange.
When the levelness of sheet fork is improper, carries out Inclination maneuver process, comprising:
Step 1045: according to the plane equation of the adjacent silicon chip upper surface of the plane equation of false silicon chip lower surface and sheet fork lower section, calculates the normal vector of false silicon chip lower surface and the normal vector of the adjacent silicon chip upper surface in sheet fork lower section;
Concrete, can the description of refer step 102 about asking for of the plane equation of the adjacent silicon chip upper surface of plane equation and sheet fork lower section of false silicon chip lower surface place plane and corresponding normal vector.
Step 1046: the inclination angle pitched the coordinate figure between the normal vector of the adjacent silicon chip upper surface in lower section according to the coordinate figure of the normal vector of false silicon chip lower surface and sheet and obtain in step 102, the angle that the normal vector calculating false silicon chip lower surface in rectangular coordinate system rotates along X-axis direction and the angle rotated along Y-axis direction;
Concrete, this step 1046 comprises: ask for the rotation matrix of sheet fork lower surface lower surface relative to the adjacent silicon chip upper surface in sheet fork lower section
Then, the normal vector being multiplied by the adjacent silicon chip upper surface in sheet fork lower section according to rotation matrix obtains the normal vector of false silicon chip lower surface, and here, the normal vector of the adjacent silicon chip upper surface in sheet fork lower section is set to The normal vector of false silicon chip lower surface is set to
Then have
Sheet fork rotates according to above-mentioned rotation matrix, can complete false silicon chip and regulate relative to the levelness of horizontal plane, concrete, the normal vector being gone out false silicon chip lower surface by above-mentioned Equation for Calculating is relative to the sheet fork lower section angle of rotation of normal vector along X-axis direction of adjacent silicon chip upper surface and the angle of rotation along Y-axis direction, the normal vector of false silicon chip lower surface is false silicon chip lower surface relative to the angle of rotation of the adjacent silicon chip upper surface in sheet fork lower section along X-axis direction relative to the normal vector of the adjacent silicon chip upper surface in sheet fork lower section along the angle of rotation in X-axis direction, the normal vector of false silicon chip lower surface is false silicon chip lower surface relative to the angle of rotation of the adjacent silicon chip upper surface in sheet fork lower section along Y-axis direction relative to the normal vector of the adjacent silicon chip upper surface in sheet fork lower section along the angle of rotation in X-axis direction,
Step 1047: along the angle that X-axis direction rotates, sheet fork is rotated along X-axis with the normal vector of false silicon chip lower surface, along the angle that Y-axis direction rotates, sheet fork is rotated along Y-axis with the normal vector of false silicon chip lower surface, thus make false silicon chip lower surface relative to the inclination angle of the adjacent silicon chip upper surface in sheet fork lower section within the scope of tilt threshold;
Step 1048: calculate each wireless receiving and dispatching device detection of the false silicon chip lower surface after adjustment and the new distance of adjacent silicon chip upper surface below sheet fork, judges new distance whether within the scope of distance threshold; If it does, then mechanical manipulator continues execution gets sheet operation; If, then not carrying out distance adjustment according to each specified location in the off-line teaching data pitched by sheet apart from adjustment process. After sheet fork overturns, it is possible to deviate original position or due to sheet fork tilts the distance that detects can insincere, thus need to re-start distance measuring and adjustation, it is possible to adopt and above-mentioned adjust apart from adjustment process, repeat no more here.
It should be noted that, sheet position P4 is got for exiting in advance, the wireless receiving and dispatching device of false silicon chip upper surface is adopted to detect, about exiting in advance, get can with reference to upwards getting sheet position P2 in advance along the distance adjustment process of Z axle and Inclination maneuver process on the P4 of sheet position, wherein, the wireless receiving and dispatching device changing detection is the wireless receiving and dispatching device of false silicon chip upper surface, the distance of detection changes into the wireless receiving and dispatching device of false silicon chip upper surface and the distance of the adjacent silicon chip lower surface in sheet fork top, the wireless receiving and dispatching device that the thickness utilizing the wireless receiving and dispatching device of false silicon chip upper surface and the distance of the adjacent silicon chip lower surface in sheet fork top to subtract support component is false silicon chip upper surface pitch to sheet above distance bottom adjacent support member, and the inclination angle asked for changes into the inclination angle between false silicon chip upper surface with the adjacent silicon chip lower surface in sheet fork top, other set-up procedure principle is with above-mentioned in advance upwards to get corresponding steps on the P2 of sheet position identical, here repeat no more.
Step 105: the correction having proceeded to get the offline parameter data of all specified locationes in the off-line teaching data of sheet operation.
Concrete, it is possible to obtain distance coordinate figure with reference to above-mentioned detection and ask for the method at inclination angle, and determination methods performs the correction getting the offline parameter data of other specified location such as position P4 in sheet route.
The present invention to adopt the above-mentioned sheet with false silicon chip to pitch the film releasing method that carries out identical with the above-mentioned principle getting sheet method, in the present embodiment, in the process that the safety adopting the mechanical manipulator of the above-mentioned sheet fork with false silicon chip to carry out silicon chip picks and places, wireless receiving and dispatching device in false silicon chip is by sending detectable signal up and down, detectable signal is sent to detector after returning, signal is converted to corresponding electrical signal by detector, transmodulator converts electrical signals to corresponding distance measure, such that it is able to the specified location picked and placeed in sheet process carries out monitor in real time and correction. concrete, the present embodiment is described for safe film releasing process, film releasing route carries out according to the sheet route of getting in above-mentioned Fig. 6, false silicon chip and sheet fork, the relation of support component, pitch with above-mentioned silicon chip and sheet, the relation of support component is identical, namely it is pitch at sheet, in the three position relation of support component and silicon chip, silicon chip is substituted with false silicon chip, therefore, false silicon chip and sheet fork, silicon chip shown in the relative position parameter of support component and above-mentioned Fig. 6 and sheet fork, the relative position parameter of support component is identical, below for false silicon chip and sheet fork, the description of the relative position parameter of support component can with reference to the description shown in above-mentioned Fig. 6, referring to Figure 10, in a better embodiment of the present invention, the modification method of film releasing off-line teaching data comprises:
Step 201: perform off-line film releasing operational order, off-line teaching data are set;
Concrete, off-line teaching data comprise: distance secure threshold, inclination angle secure threshold, mechanical manipulator run in specified location and the offline parameter data of described specified location; Specified location in mechanical manipulator operation comprises pre-film releasing secure location P ' 6, pre-film releasing position P ' 4 downwards contacts position P ' 3 with silicon chip, exit film releasing position P ' 2 in advance and secure location P ' 1 is exited in film releasing; Here, sheet fork can also have clamping parts, therefore, pre-film releasing secure location P ' 6 with pre-downwards between film releasing position P ' 4 and the clamping parts also in silicon chip bogey external region with mechanical manipulator in film releasing process cancel the position P ' 5 clamped.
Step 202: the mechanical manipulator with false silicon chip carries out detection acquisition range observation data at the specified location of off-line teaching data, and calculates the inclination angle of false silicon chip relative to horizontal plane according to range observation data;
Concrete, the wireless receiving and dispatching device in false silicon chip sends detectable signal up and down, and detectable signal is sent to detector after returning, and signal is converted to corresponding electrical signal by detector, and transmodulator converts electrical signals to corresponding distance measure; Range observation data comprise exits on film releasing position the distance of adjacent silicon chip lower surface above false silicon chip upper surface to sheet fork on false silicon chip lower surface to the distance and pre-film releasing position downwards of the adjacent silicon chip upper surface in sheet fork lower section in advance;
Here, false silicon chip upper and lower surface is all provided with not three wireless receiving and dispatching devices on the same line, for in pre-film releasing position downwards, on this position, distance secure threshold is the safety range of the distance bottom false silicon chip upper surface to sheet fork top adjacent support member, and inclination angle secure threshold is the safety range of false silicon chip upper surface to the inclination angle of the adjacent silicon chip lower surface in sheet fork top; Taking false silicon chip place plane as XOY plane, it is set to initial point with false silicon chip center, and think that the adjacent silicon chip in sheet fork top is for being horizontally disposed with, on pre-film releasing position downwards, three wireless receiving and dispatching devices of false silicon chip upper surface obtain distance coordinate figure (x1, y1, z1), (x2 of adjacent silicon chip lower surface above false silicon chip upper surface to sheet fork respectively, y2, and (x3, y3, z3) z2);Distance z1 along Z axle, z2 and z3 of false each wireless receiving and dispatching device of silicon chip upper surface with the adjacent silicon chip lower surface in sheet fork top is obtained according to coordinate figure, distance z1, z2 and z3 are subtracted respectively the thickness of support component again, thus obtaining the distance z ' 1 along Z axle, the z ' 2 and z ' 3 bottom false each wireless receiving and dispatching device of silicon chip upper surface and sheet fork top adjacent support member, the mean value then asking for these distance z ' 1, z ' 2 and z ' 3 is as the distance along Z axle bottom false silicon chip upper surface and sheet fork top adjacent support member; Angle between the sheet fork adjacent silicon chip lower surface in top and false silicon chip upper surface is the pitch angle of false silicon chip relative to horizontal plane; Then, according to above-mentioned three coordinate figures ask for sheet fork top adjacent silicon chip lower surface plane equation be
AX+BY+CZ+D=0;
Wherein, A, B, C and D calculating formula is as follows:
A=y1z2-y1z3-y2z1+y2z3+y3z1-y3z2
B=-x1z2+x1z3+x2z1-x2z3-x3z1+x3z2
C=x1y2-x1y3-x2y1+x2y3+x3y1-x3y2,
D=-x1y2z3+x1y3z2+x2y1z3-x2y3z1-x3y1z2+x3y2z1.
Then, calculate the inclination angle of false silicon chip relative to the adjacent silicon chip lower surface in sheet fork top by plane equation; The plane equation of false silicon chip is Z=0, set up the plane equation of the adjacent silicon chip upper surface in sheet fork top and false silicon chip plane equation group,
AX+BY+CZ+D=0
Z=0
Their normal vector be respectively A, B, C} and 0,0,1}, if the angle of these two normal vectors is α, so the angle of these two planes is exactly α, so,
Cos α=C/ [√ (A2+B2+C2)]
α=arccos (C/ [√ (A2+B2+C2)])。
By aforesaid method, the inclination angle of false silicon chip relative to horizontal plane can be tried to achieve; Aforesaid method can also be adopted to ask for inclination angle for the position P ' 5 of pre-film releasing secure location P ' 6 and cancellation clamping.
Exiting film releasing position P ' 2 in advance or film releasing is exited on secure location P ' 1, distance secure threshold on this position is the safety range of false silicon chip lower surface to the distance of the adjacent silicon chip upper surface in sheet fork lower section, and inclination angle secure threshold is the safety range of false silicon chip lower surface to the inclination angle of the adjacent silicon chip upper surface in sheet fork lower section; Taking false silicon chip place plane as XOY plane, it is set to initial point with false silicon chip center, and think that the adjacent silicon chip in sheet fork lower section is for being horizontally disposed with, three wireless receiving and dispatching devices of false silicon chip lower surface obtain distance coordinate figure (x1, y1, z1), (x2 at adjacent silicon chip top below false silicon chip lower surface to sheet fork respectively, y2, and (x3, y3, z3) z2); Obtain distance z1 along Z axle, z2 and z3 of false each wireless receiving and dispatching device of silicon chip lower surface with adjacent silicon chip top, sheet fork lower section according to coordinate figure, then ask for the mean value of these distances as the distance along Z axle of false silicon chip lower surface with adjacent silicon chip top, sheet fork lower section; Angle between the sheet fork adjacent silicon chip upper surface in lower section and false silicon chip is the pitch angle of false silicon chip relative to horizontal plane; Then, according to above-mentioned three coordinate figures ask for sheet fork lower section adjacent silicon chip upper surface plane equation be
AX+BY+CZ+D=0;
Wherein, A, B, C and D calculating formula is as follows:
A=y1z2-y1z3-y2z1+y2z3+y3z1-y3z2
B=-x1z2+x1z3+x2z1-x2z3-x3z1+x3z2
C=x1y2-x1y3-x2y1+x2y3+x3y1-x3y2,
D=-x1y2z3+x1y3z2+x2y1z3-x2y3z1-x3y1z2+x3y2z1.
Then, calculate the inclination angle of false silicon chip relative to the adjacent silicon chip upper surface in sheet fork lower section by plane equation;The plane equation of false silicon chip is Z=0, sets up the plane equation of the adjacent silicon chip upper surface in sheet fork lower section and the plane equation group of false silicon chip,
AX+BY+CZ+D=0
Z=0
Their normal vector be respectively A, B, C} and 0,0,1}, if the angle of these two normal vectors is α, so the angle of these two planes is exactly α, so,
Cos α=C/ [√ (A2+B2+C2)]
α=arccos (C/ [√ (A2+B2+C2)])。
By aforesaid method, can try to achieve exit film releasing position P ' 2 in advance or false silicon chip that film releasing is exited on secure location P ' 1 relative to the inclination angle of horizontal plane;
Step 203: whether the distance value judged in the range observation data of false silicon chip exceeds distance secure threshold and judge false silicon chip is relative to whether the inclination angle of horizontal plane exceeds inclination angle secure threshold; If both having at least one be yes, then perform step 04; If both are no, then perform step 05;
Concrete, distance secure threshold can set according to experience, distance secure threshold is that sheet fork and false silicon chip do not touch its upper support parts or the safe distance scope of its lower side silicon wafer, inclination angle secure threshold is that silicon chip can not produce the inclination angle safety range slided when online pickup silicon chip, slip herein comprises false silicon chip opposite panel fork and produces to slide, please again consult Fig. 9, for the false silicon chip of inclination of a better embodiment of the present invention is by power schematic diagram, wherein, α is the pitch angle of false silicon chip and horizontal plane in reality, false silicon chip is subject to downward gravity mg, sheet pitches the reactive force N of silicon chip of granting the leave, in addition, if the coefficient of sliding friction of false silicon chip is μ, it is subject to maximum static friction force slightly larger than sliding friction power, here sliding friction power it is approximately, so the maximum static friction force of false silicon chip is a μm gcos α, when gravity and frictional force to make a concerted effort be zero, when just making false silicon chip not move downward, corresponding false silicon chip pitch angle is the theory α coefficient pitch angle threshold value δ of false silicon chip,
The safe tilt threshold slided can not be produced according to the false false silicon chip of silicon chip stressing conditions setting:
Mgsin (δ) mgcos (δ) μ=0, thus obtain δ=arctan (μ).
Step 204: the offline parameter data of the specified location of off-line teaching data are revised;
Concrete, the distance value in the range observation data of false silicon chip exceeded when secure threshold and/or false silicon chip exceed inclination angle secure threshold relative to the inclination angle of horizontal plane, performed this step; The method that the offline parameter data of specified location are revised is comprised: along distance adjustment and the Inclination maneuver of Z axle, be still described for pre-film releasing position P ' 4 downwards;
Distance adjustment process along Z axle comprises:
Step 2041: the distance of continuous twice detection of wireless receiving and dispatching device of the upper false silicon chip upper surface of sheet fork and the adjacent silicon chip lower surface in sheet fork top, obtains the first time coordinate figure and coordinate figure for the second time of each wireless receiving and dispatching device of false silicon chip upper surface;
Concrete, carry out continuous twice detection and averaged can increase numerical stability. If the coordinate figure of twice detection is (x11, y11, z11) before and after three sensors on false silicon chip upper surface, (x21, y21, z21), (x31, y31, z31), (x12, y12, z12), (x22, y22, z22), (x32, y32, z32);
Step 2042: ask for the first mean value of first time coordinate figure and the 2nd mean value of second time coordinate figure;
Concrete, the mean value of Z value is Zave1=Average (z11, z21, z31), Zave2=Average (z12, z22, z32);
Step 2043: calculate the first mean value and the difference of the 2nd mean value, as compensated distance value;
Concrete, the compensated distance value along Z axle is Zchange=Zave1-Zave2;
Step 2044: each specified location in theoretical teaching data is all added compensated distance value.
Concrete, the Z value of the coordinate figure of each specified location adds Zchange all accordingly. Here, the Z value of pre-film releasing position P ' 4 downwards adds Zchange.
When the levelness of sheet fork is improper, carries out Inclination maneuver process, comprising:
Step 2045: according to the plane equation of the adjacent silicon chip lower surface of the plane equation of false silicon chip upper surface and sheet fork top, calculates the normal vector of false silicon chip upper surface and the normal vector of the adjacent silicon chip lower surface in sheet fork top;
Concrete, can the description of refer step 202 about asking for of the plane equation of the adjacent silicon chip lower surface of plane equation and sheet fork top of false silicon chip place plane and corresponding normal vector.
Step 2046: the inclination angle pitched the coordinate figure between the normal vector of the adjacent silicon chip lower surface in top according to the coordinate figure of the normal vector of false silicon chip upper surface and sheet and obtain in step 202, the angle that the normal vector calculating false silicon chip upper surface in rectangular coordinate system rotates along X-axis direction and the angle rotated along Y-axis direction;
Concrete, this step 2046 comprises: ask for the rotation matrix of false silicon chip upper surface relative to the adjacent silicon chip lower surface in sheet fork top,
Then, the normal vector being multiplied by the adjacent silicon chip lower surface in sheet fork top according to rotation matrix obtains the normal vector of false silicon chip upper surface, and here, the normal vector of the adjacent silicon chip lower surface in sheet fork top is set to The normal vector of false silicon chip upper surface is set to
Then have
Sheet fork rotates according to above-mentioned rotation matrix, can complete false silicon chip and regulate relative to the levelness of horizontal plane, concrete, the normal vector being gone out false silicon chip upper surface by above-mentioned Equation for Calculating is relative to the sheet fork top angle of rotation of normal vector along X-axis direction of adjacent silicon chip lower surface and the angle of rotation along Y-axis direction, the normal vector of false silicon chip upper surface is false silicon chip upper surface relative to the angle of rotation of the adjacent silicon chip lower surface in sheet fork top along X-axis direction relative to the normal vector of the adjacent silicon chip lower surface in sheet fork top along the angle of rotation in X-axis direction, the normal vector of false silicon chip upper surface is false silicon chip upper surface relative to the angle of rotation of the adjacent silicon chip lower surface in sheet fork top along Y-axis direction relative to the normal vector of the adjacent silicon chip lower surface in sheet fork top along the angle of rotation in X-axis direction,
Step 2047: along the angle that X-axis direction rotates, sheet fork is rotated along X-axis with the normal vector of false silicon chip upper surface, along the angle that Y-axis direction rotates, sheet fork is rotated along Y-axis with the normal vector of false silicon chip upper surface, thus make false silicon chip upper surface relative to the inclination angle of the adjacent silicon chip lower surface in sheet fork top within the scope of tilt threshold;
Step 2048: calculate each wireless receiving and dispatching device detection of the false silicon chip upper surface after adjustment and the new distance of adjacent silicon chip lower surface above sheet fork, judges new distance whether within the scope of distance threshold; If it does, then mechanical manipulator continues execution gets sheet operation; If, then not carrying out distance adjustment according to each specified location in the off-line teaching data pitched by sheet apart from adjustment process. After sheet fork overturns, it is possible to deviate original position or due to sheet fork tilts the distance that detects can insincere, thus need to re-start distance measuring and adjustation, it is possible to adopt and above-mentioned adjust apart from adjustment process, repeat no more here.
It should be noted that, for exiting film releasing position P ' 2 in advance, the wireless receiving and dispatching device of false silicon chip lower surface is adopted to detect, can with reference to pre-film releasing position P ' 4 downwards along the distance adjustment process of Z axle and Inclination maneuver process on film releasing position P ' 2 about exiting in advance, wherein, the wireless receiving and dispatching device changing detection is the wireless receiving and dispatching device of false silicon chip lower surface, the distance of detection changes into the wireless receiving and dispatching device of false silicon chip lower surface and the distance of the adjacent silicon chip upper surface in sheet fork lower section, and the inclination angle asked for changes into the inclination angle between false silicon chip lower surface with the adjacent silicon chip upper surface in sheet fork lower section, other set-up procedure principle is identical with corresponding steps on above-mentioned pre-film releasing position P ' 4 downwards, here repeat no more.
Step 205: the correction having proceeded the offline parameter data of all specified locationes in the off-line teaching data of film releasing operation.
Here it should be noted that, in the present invention, false silicon chip lower surface and sheet fork lower surface are similar to regards a surface as.
Although the present invention discloses as above with better embodiment; right described embodiment is only illustrated for convenience of explanation; and be not used to limit the present invention; the technician of this area can do some changes and retouching without departing from the spirit and scope of the present invention, and the protection domain that the present invention advocates should to be as the criterion described in claim book.
Claims (10)
1. one kind for revising the mechanical manipulator of off-line teaching data, it is installed in semiconductor devices, semiconductor devices also comprises the silicon chip bogey for placement of multiple layers silicon chip, described silicon chip bogey has the support component for carrying silicon chip, and described mechanical manipulator is for picking up the silicon chip of described silicon chip bogey or is positioned over by silicon chip in described silicon chip bogey; Described mechanical manipulator has the fork of the sheet for carrying silicon chip, it is characterized in that, described fork upper surface has false silicon chip, described false silicon chip is embedded with the wireless receiving and dispatching device for sending detectable signal, to described detectable signal sensitivity and described detectable signal is converted to the detector of electrical signal and described electrical signal is converted to the transmodulator of numerical value; Described wireless receiving and dispatching device outwards sends detectable signal above described false silicon chip or below described false silicon chip, and described fork does not block described wireless receiving and dispatching device.
2. the mechanical manipulator for revising off-line teaching data according to claim 1, it is characterised in that, described false silicon chip is mechanically fastened on described fork.
3. the mechanical manipulator for revising off-line teaching data according to claim 1, it is characterised in that, described fork has the clamping parts of clamping wafer.
4. the mechanical manipulator for revising off-line teaching data according to claim 1, it is characterised in that, the sheet fork with described false silicon chip only uses when obtaining off-line teaching data and described off-line teaching data revised.
5. the modification method getting sheet off-line teaching data that a mechanical manipulator according to claim 1 carries out, it is characterised in that, comprising:
Step 101: perform off-line and get sheet operational order, off-line teaching data are set; Wherein, described off-line teaching data comprise: distance secure threshold, inclination angle secure threshold, mechanical manipulator run in specified location and the offline parameter data of described specified location; Described mechanical manipulator run in specified location comprise sheet secure location of looking ahead, in advance upwards get sheet position and contact position with silicon chip, exit to get sheet position and get sheet and exit secure location in advance;
Step 102: the described mechanical manipulator with described false silicon chip carries out detection acquisition range observation data at the specified location of described off-line teaching data, and calculates the inclination angle of described false silicon chip relative to horizontal plane according to described range observation data; Wireless receiving and dispatching device in described false silicon chip sends detectable signal up and down, and detectable signal is sent to detector after returning, and signal is converted to corresponding electrical signal by detector, and transmodulator converts electrical signals to corresponding distance measure;
Step 103: whether the distance value judged in the range observation data of described false silicon chip exceeds distance secure threshold and judge described false silicon chip is relative to whether the inclination angle of horizontal plane exceeds described inclination angle secure threshold; If both having at least one be yes, then perform step 104;If both are no, then perform step 105;
Step 104: the offline parameter data of the specified location of described off-line teaching data are revised;
Step 105: the correction having proceeded to get the offline parameter data of all specified locationes in the off-line teaching data of sheet operation.
6. the modification method getting sheet off-line teaching data according to claim 4, it is characterized in that, upwards get in advance the distance of the silicon chip upper surface adjacent to described fork lower section of described false silicon chip lower surface on sheet position described in described range observation data comprise and described exit the distance getting adjacent silicon chip lower surface above described false silicon chip upper surface to described fork on sheet position in advance.
7. the modification method getting sheet off-line teaching data according to claim 4, it is characterized in that, in described step 101, described mechanical manipulator run in specified location be also included in described exit in advance get sheet position to described get sheet exit in secure location operational process to silicon chip clamping position.
8. a mechanical manipulator according to claim 1 carries out the modification method of film releasing off-line teaching data, it is characterised in that, comprising:
Step 201: perform off-line film releasing operational order, off-line teaching data are set; Wherein, described off-line teaching data comprise: distance secure threshold, inclination angle secure threshold, mechanical manipulator run in specified location and the offline parameter data of described specified location; Specified location in the operation of described mechanical manipulator comprises pre-film releasing secure location, pre-film releasing position downwards contacts position with silicon chip, exit film releasing position in advance and secure location is exited in film releasing;
Step 202: the described mechanical manipulator with described false silicon chip carries out detection acquisition range observation data at the specified location of described off-line teaching data, and calculates the inclination angle of described false silicon chip relative to horizontal plane according to described range observation data; Wireless receiving and dispatching device in described false silicon chip sends detectable signal up and down, and detectable signal is sent to detector after returning, and signal is converted to corresponding electrical signal by detector, and transmodulator converts electrical signals to corresponding distance measure;
Step 203: whether the distance value judged in the range observation data of described false silicon chip exceeds distance secure threshold and judge described false silicon chip is relative to whether the inclination angle of horizontal plane exceeds described inclination angle secure threshold; If both having at least one be yes, then perform step 204; If both are no, then perform step 205;
Step 204: the offline parameter data of the specified location of described off-line teaching data are revised;
Step 205: the correction having proceeded the offline parameter data of all specified locationes in the off-line teaching data of film releasing operation.
9. the modification method of film releasing off-line teaching data according to claim 4, it is characterized in that, described in described range observation data comprise, exit the distance of adjacent silicon chip lower surface above described false silicon chip upper surface to described fork on described false silicon chip lower surface on film releasing position to the distance and described pre-film releasing position downwards of the adjacent silicon chip upper surface in described fork lower section in advance.
10. the modification method of film releasing off-line teaching data according to claim 4, it is characterized in that, in described step 201, the specified location in the operation of described mechanical manipulator is also included in described pre-film releasing secure location and clamps position to being cancelled by silicon chip in described pre-film releasing position operational process downwards.
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| CN201511022412.6A CN105666489B (en) | 2015-12-31 | 2015-12-31 | For correcting the manipulator and method of off-line teaching data |
| US15/281,110 US10056282B2 (en) | 2015-12-31 | 2016-09-30 | Method and system of robot fork calibration and wafer pick-and-place |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017066873A1 (en) * | 2015-10-19 | 2017-04-27 | Novena Tec Inc. | Process monitoring device |
| CN109866208A (en) * | 2017-12-05 | 2019-06-11 | 日本电产三协株式会社 | The teaching method of robot and robot |
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