KR20140039458A

KR20140039458A - Vortex type substrate cleaning nozzle and apparatus using same

Info

Publication number: KR20140039458A
Application number: KR1020120105583A
Authority: KR
Inventors: 윤근식
Original assignee: 주식회사 케이씨텍
Priority date: 2012-09-24
Filing date: 2012-09-24
Publication date: 2014-04-02

Abstract

The present invention relates to a substrate cleaning nozzle and a substrate cleaning apparatus using the same, a gas supply unit configured to discharge gas through a gas discharge port; A casing having a discharge port formed at a position spaced apart from the gas discharge port while surrounding a circumference of the gas discharge port; The liquid is discharged from the outside of the gas discharge port in the inclined direction and the flow direction of the gas discharged from the gas discharge port, from the liquid discharged from the liquid discharge port and the gas discharge port in the mixed space between the gas discharge port and the discharge port A liquid supply unit for discharging a liquid such that the discharged gas meets; And the liquid and the gas discharged from the discharge port as the liquid having the inclined direction component and the gas having the linear direction component meet and mix in a mixing space between the gas discharge port and the discharge port of the casing to form a vortex component. Of the mixed fluid is sprayed in the form of wider cross-section by the vortex component to perform wide cleaning, so that the foreign substances and contamination remaining on the surface of the substrate can be removed more cleanly while reducing the time required for cleaning the substrate. A cleaning nozzle and a substrate cleaning apparatus using the same are provided.

Description

Vortex type substrate cleaning nozzle and substrate cleaning device using the same {VORTEX TYPE SUBSTRATE CLEANING NOZZLE AND APPARATUS USING SAME}

The present invention relates to a substrate cleaning nozzle and a substrate cleaning apparatus using the same, and more particularly, a substrate cleaning nozzle capable of improving the efficiency of cleaning or rinsing a substrate by mixing a high-pressure gas and a liquid and spraying the surface of the substrate. It relates to a substrate cleaning device using the same.

The process of manufacturing a semiconductor device includes a process of allowing foreign matter to remain on the surface, such as a CMP process. Accordingly, an apparatus for removing and cleaning particles, organic contaminants, metal impurities, and the like adhering to the surface of the wafer is used. In addition, also in the process of manufacturing a display apparatus, it is necessary to apply a liquid crystal display element to the clean glass substrate from which the foreign material on the surface of the thin glass substrate was removed.

As such, the processing of substrates such as wafers used to manufacture semiconductor devices or glass substrates used to manufacture display devices (hereinafter referred to as "wafers" and "glass substrates" are referred to as "substrates"). The cleaning process is necessarily accompanied.

The substrate cleaning process may be performed in various forms, but one of them is known by mixing a cleaning liquid and a high pressure gas by using a fluid nozzle and spraying onto the wafer surface. 1 shows a conventional substrate cleaning apparatus. The nozzle 10 shown in FIG. 1 has a gas passage 11 through which 11 d of high pressure gas is supplied, and a pure passage 12 through which 12 d of purified water (DIW) is supplied. It is sprayed onto the substrate (W) in a mixed form to meet the foreign matter remaining on the surface of the substrate (W).

However, in the conventional substrate cleaning nozzle 10 shown in FIG. 1, when the mixed fluid 55 of the high pressure gas AIR and the pure water DIW is injected from the discharge port 50a, the injected mixed fluid 55 is injected. Since the width d1 of) is limited to the cross-sectional size of the discharge port 50a, the entire surface of the substrate W is cleaned by moving the substrate W 66 or moving the nozzle 10 10d. To do this was a very long time-consuming problem.

In addition, since the mixed fluid 55 injected from the discharge port 50a of the substrate cleaning nozzle 10 is linearly sprayed in a direction perpendicular to the surface of the substrate W, the particles remaining on the surface of the substrate W are removed from the substrate ( It strongly pushed away in the direction perpendicular to the surface of W), and there was also a possibility of damaging the substrate W by the particles.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to shorten the cleaning and rinsing time of a substrate when cleaning or rinsing the surface of the substrate using a mixed fluid mixed with a high pressure gas and a liquid.

In addition, an object of the present invention is to improve the cleaning and rinsing efficiency by more easily separating foreign substances such as particles remaining on the substrate during the cleaning or rinsing process of the substrate.

In addition, an object of the present invention is to minimize the scratching of the substrate by the foreign matter in the process of removing the foreign matter remaining on the surface of the substrate.

By doing so, the present invention uses a mixed fluid of high pressure gas and liquid to clean or rinse the substrate in a shorter time, while minimizing the possibility of damaging the substrate to foreign substances such as particles remaining on the surface of the substrate. It is aimed at separating and removing effectively.

In order to achieve the above technical problem, the present invention, the gas supply unit for discharging the gas through the gas discharge port; A casing having a discharge port formed at a position spaced apart from the gas discharge port while surrounding a circumference of the gas discharge port; Discharging liquid in a flow direction and an inclined direction of the gas discharged from the gas discharge port, so that the liquid discharged from the liquid discharge port meets the gas discharged from the gas discharge port in a mixed space between the gas discharge port and the discharge hole; A liquid supply unit for discharging a liquid; And a pressure of the gas discharged from the gas discharge port is higher than a pressure of the liquid discharged from the liquid discharge port.

This discharges the gas at a high pressure from the gas discharge port and at the same time discharges the liquid from the liquid discharge port inclined with respect to the flow direction of the gas discharged from the gas discharge port, so that the liquid having the inclined direction component and the gas having the linear direction component are the gas discharge port. As the vortex component is generated while being met and mixed in the mixing space between the outlet and the discharge port of the casing, the mixed fluid of the liquid and the gas discharged from the discharge port is sprayed in such a manner that the cross section is gradually widened by the vortex component. Here, since the flow of the liquid discharged from the liquid discharge port is discharged in a direction inclined with respect to the linear component of the gas, the liquid flow naturally includes a circumferential component that rotates about the center point of the linear component of the gas. The vortex is formed while mixing.

As such, the mixed fluid in which the gas and the liquid discharged at a high pressure are injected in a form in which the cross section is gradually increased from the discharge port of the nozzle, so that the area in which the mixed fluid comes into contact with the surface of the substrate is wider than in the related art. As a result, it is possible to shorten the time required for the mixed fluid to sweep through the substrate surface while moving either the substrate or the nozzle.

When the vortex components of the mixed fluid generated by mixing different components of the liquid and gas reach the surface of the substrate, the vortices having a direction component parallel to the substrate surface remove the foreign matter attached to the surface of the substrate. Unlike the conventional art, in which foreign matters are perpendicular to the plate surface of the substrate by the mixed fluid, shear force acts in a direction parallel to the plate surface of the substrate by the mixed fluid, so that the foreign matter is attached or fixed to the surface of the substrate. By separating foreign matters more easily from the surface of the substrate without causing scratches or the like on the substrate, the cleaning and rinsing efficiency can be improved.

At this time, the liquid supply part discharges the liquid in two or more inclined directions different from the flow direction of the gas so that two vortices are formed where the gas discharged from the gas discharge port and the liquid discharged from the liquid discharge port meet each other. By generating the above path, the vortices are uniformly guided in all directions with respect to the center point of the discharge port of the nozzle, so that the effect of removing the foreign substances due to the vortices is uniform and excellent over the entire area of the substrate where the mixed fluid reaches. do.

On the other hand, the inclination angle Φ of the flow direction of the liquid discharged from the liquid discharge port and the flow direction of the gas discharged from the gas discharge port is greater than 10 degrees and is set within a range of 90 degrees or less. When the inclination angle is smaller than 10 degrees, it is preferable to maintain the inclination angle larger than 10 degrees because the spreading phenomenon of the mixed fluid discharged from the discharge port of the nozzle becomes smaller. Further, even when the inclination angle is 90 degrees (that is, when the liquid is discharged in a direction perpendicular to the flow direction of the gas), the phenomenon of spreading of the mixed fluid may be realized by the flow of the gas.

At this time, the liquid discharged from the liquid discharge port flows with a rotating component (circumferential component) surrounding the center of the gas discharge port, and mixes with the gas discharged from the gas discharge port, and vortex is generated in the mixed fluid.

On the other hand, according to another embodiment of the present invention, the end of the liquid supply portion is formed by a spiral passage that surrounds the gas supply portion, the liquid is injected from the liquid discharge port in a spiral path, the Larger circumferential components around the center can be implemented.

According to another embodiment of the present invention, a vortex forming blade which guides the liquid discharged from the liquid discharge port into a vortex having a spiral flow component is formed inside the casing, so that the flow of liquid discharged from the liquid discharge port is discharged from the gas discharge port. Even if the gas flow proceeds in parallel with the discharged gas flow, the path is changed so that the flow of the liquid is inclined with the gas discharge port and has a circumferential direction by the vortex forming blade. The farther it is, the larger the cross section is sprayed.

On the other hand, it is effective that the gas supply part has two or more gas discharge ports. Even when the gas is discharged through the gas supply unit at the same flow rate and flow rate, a plurality of gas discharge ports are formed, thereby dividing the liquid into smaller droplets in the process of meeting and mixing the liquid discharged from the liquid discharge port, thereby allowing the liquid to flow into the mixed fluid. Can lead to a smaller droplet size of the liquid. As a result, even when the mixed fluid contains the same amount of liquid, the surface of the substrate is brought into contact with the surface of the smaller droplets, so that the spraying force can be uniformly applied to the entire area of the mixed fluid.

The liquid used in the nozzle according to the present invention may be any one or more of deionized water and a cleaning liquid. That is, the board | substrate rinsing process can be performed with the mixed fluid which mixed pure water and gas, and the board | substrate washing process can also be performed with the mixed fluid which mixed the washing | cleaning liquid and gas. The term 'wash' described in the present specification and claims is defined as including not only the meaning of washing cleanly, but also the meaning of 'rinsing' to wash once again.

On the other hand, according to another field of the invention, the present invention comprises a liquid chamber for storing a liquid; A gas chamber for storing gas; Liquid is supplied from the liquid chamber to the liquid supply portion, gas is supplied from the gas chamber to the gas supply portion, and a mixed fluid in which the liquid and the gas are mixed is injected through the discharge port. and; Moving means for moving any one of said substrate cleaning nozzle and said substrate; It provides a substrate cleaning device comprising.

At this time, the distance between the substrate cleaning nozzle and the substrate is adjusted to 20mm to 200mm. In the substrate cleaning apparatus according to the present invention, after the mixed fluid in which the liquid and gas are mixed is discharged from the nozzle discharge port, the wide area can be cleaned by the vortex component, so that the substrate is positioned at a position shorter than 20 mm from the discharge port. However, since the mixed fluid reaches the substrate before the cross-sectional area of the mixed fluid is sufficiently widened by the vortex component, it is limited in improving the cleaning efficiency. This is because the further away from the discharge port, the weaker it becomes and the efficiency of removing foreign matter on the surface of the substrate by the vortex component is lowered.

The gas supply unit may include two or more gas discharge ports, thereby further increasing the effect of dividing the liquid discharged from the liquid discharge port into smaller micro-mist.

The liquid may be any one or more of deionized water and a cleaning liquid.

As described above, the present invention discharges the gas from the gas discharge port at high pressure, and simultaneously discharges the liquid from the liquid discharge port inclined with respect to the flow direction of the gas discharged from the gas discharge port, so that the liquid having the inclined direction component and the linear component As the gas having the gas is formed in the mixing space between the gas discharge port and the discharge port of the casing, the vortex component is generated while being mixed, the mixed fluid of the liquid and gas discharged from the discharge port is injected in a form in which the cross section is gradually widened by the vortex component. It is possible to obtain an advantageous effect of enabling wide cleaning.

In this way, the present invention is because the mixed fluid is injected over a larger cross-sectional area than the case of cleaning the substrate by a conventional nozzle cleaning method, the substrate cleaning process by shortening the time to clean the mixed fluid through the entire surface of the substrate The efficiency can be further improved.

In addition, the present invention, because the vortex component of the mixed fluid generated by mixing the different components of the liquid and gas removes the foreign matter adhered to the surface of the substrate by the shear force, the foreign matter adhered to or adhered to the surface of the substrate There is an advantage that it is possible to separate more easily from the surface of the substrate without causing damage, such as scratches, to enable a cleaner cleaning than the conventional.

In the present invention, since the liquid and the gas are discharged from two or more discharge ports and mixed with each other, the size of the droplets forming the vortex becomes finer, and the vortex is induced uniformly over the whole position based on the center point of the discharge port of the nozzle. An advantageous effect can be obtained in which the effect of removing foreign matters due to vortex is uniform and excellent over the entire area of the substrate where the mixed fluid reaches.

Through this, the present invention can remove the foreign matter and contamination remaining on the surface of the substrate more cleanly while reducing the time required to clean the substrate.

1 is a view showing the configuration of a conventional substrate cleaning nozzle
Figure 2 is a photograph taken showing the appearance of the substrate cleaning nozzle according to the first embodiment of the present invention
FIG. 3 is a photograph showing an appearance of the substrate cleaning nozzle of FIG. 2 as viewed from below. FIG.
4 is a view for explaining the principle of operation of FIG.
Fig. 5 is a bottom view showing the flow direction of the liquid in Fig. 4
6 is a longitudinal sectional view of the substrate cleaning nozzle according to the second embodiment of the present invention;
FIG. 7A is a cross-sectional view along the cutting line AA of FIG. 6
FIG. 7B is a cross-sectional view along the cutting line BB of FIG. 6
8 is a longitudinal sectional view of the substrate cleaning nozzle according to the third embodiment of the present invention.
9 is a cross-sectional view taken along the cutting line CC of FIG.
10 is a perspective view of a substrate cleaning nozzle according to a fourth embodiment of the present invention.

Hereinafter, the substrate cleaning nozzle 101 according to the first embodiment of the present invention will be described in detail with reference to the accompanying drawings. In describing the present invention, well-known functions or constructions will be omitted for the sake of clarity of the present invention, and the same or similar function or configuration will be given the same or similar reference numerals.

2 to 5, the substrate cleaning nozzle 101 according to the first embodiment of the present invention, the gas supply unit 110 for discharging the gas 66 through the gas discharge port 110a, and the liquid The discharge port 130a is disposed at a position spaced apart from the gas discharge port 110a while surrounding the periphery of the liquid discharge part 120 and the gas discharge port 110a through the discharge port 120a. The casing 130 is formed.

The gas supply unit 110 receives the gas 66 from a gas chamber (not shown) and transfers the gas 66 through the gas supply passage 111 so that the three gas discharge holes 110a are spaced at 120 degree intervals. Gas is sprayed in a straight line at a high pressure. The gas may be high pressure air or high pressure nitrogen.

The liquid supply unit 120 receives the liquid 77 from a liquid chamber (not shown), transfers the liquid 77 through the liquid supply passage 121, and discharges it from the gas discharge port 110a as shown in FIG. 4. The liquid 77 is discharged from the liquid discharge port 120a so as to form an inclination angle Φ of approximately 30 degrees to 65 degrees in the flow direction 66d of the gas 66 thus obtained. At this time, the discharge pressure of the liquid 77 discharged through the liquid discharge port 120a is smaller than the discharge pressure of the gas 66d discharged through the gas discharge port 110a.

The liquid flow 77d discharged from the liquid discharge port 120a is mixed with the gas flow 66d discharged from the gas discharge port 110a in the mixing space 18 between the gas discharge port 110a and the nozzle discharge port 130a. . At this time, as shown in FIG. 5, the liquid flow 77d from the liquid discharge port 120a is discharged in a direction eccentrically with the center O of the gas supply unit 110 by a predetermined distance e, and the gas is discharged. It includes both a circumferential component 77c that rotates about the center O of the supply 110 and a radial component 77r that faces the center O of the gas supply 110.

Therefore, the gas 66 discharged in a linear direction from the gas discharge port 110a and the liquid 77 discharged obliquely with respect to the gas flow 66d from the liquid discharge port 120a are mixed in the mixing space 18, and thus the liquid ( 77 is split into a plurality of micro-mist forms by a high-pressure gas and spreads in the form of droplets 12 in the gas 66, and the rotating circumferential component 77c of the liquid 77 By the inclined direction component by the inclination angle Φ, the mixed fluid 88 of the liquid 77 and the gas 66 becomes wider in cross section by the vortex component 88d as it moves away from the nozzle discharge port 130a. Sprayed in the form.

At this time, the liquid supply part 120 discharges the liquid 77 in two places in the inclined direction different from the flow direction 66d of the gas 66. Accordingly, the vortices 88d formed by the gas 66 discharged from the gas discharge port 110a and the liquid 77 discharged from the liquid discharge port 120a meet each other in the mixing space 18 correspond to the number of paths of the liquid. As many vortex paths are created in mixing space 18. However, as the vortices 88d move away from the nozzle discharge port 130a, the paths of the different vortices 88d are mixed with each other to be uniform. However, when two or more liquid supply units 120 are formed, the center point of the discharge port of the nozzle Vortex is induced more uniformly over all directions on the basis of, so that the effect of removing foreign matters by the vortex can be uniformly adjusted over the entire area of the substrate where the mixed fluid reaches.

As such, the mixed fluid 88 in which the gas 66 discharged at a high pressure and the liquid 77 is mixed is injected from the discharge port 130a of the nozzle in the form of a larger cross section. The contact area at the time of reaching the surface of the cleaning object becomes much wider. Therefore, since the substrate cleaning nozzle 101 according to the first embodiment of the present invention configured as described above can perform wide-width cleaning in contact with the surface of the substrate, which is the object to be cleaned, with a wider area, the substrate and the nozzle 101 can be cleaned. An advantageous effect can be obtained that can reduce the time required for the mixed fluid 88 to sweep through and pass through the entire substrate surface while moving either.

Further, when the vortex component 88d of the mixed fluid 88 generated by mixing the different components of the liquid 77 and the gas 77 reaches the surface of the substrate, the directional component parallel to the substrate surface (circumferential component) The shear force parallel to the plate surface of the substrate acts on the foreign matter adhering to the surface of the substrate by the vortices 88d moving in), thereby removing the foreign matter from the surface of the substrate. Therefore, in removing the foreign matter adhered to or adhered to the surface of the substrate, the hard foreign matter is scratched again on the surface of the substrate so as not to cause damage such as scratches on the substrate, and by separating the foreign matter adhered to the surface of the substrate more easily. Can improve the cleaning and rinsing efficiency.

Hereinafter, a substrate cleaning nozzle 102 according to a second embodiment of the present invention will be described in detail with reference to the accompanying drawings. However, in describing the present invention, the functions or configurations of the first and second embodiments described above are omitted to clarify the gist of the second embodiment of the present invention, and the same or similar functions or configurations are the same. Or similar reference numerals will be given.

The substrate cleaning nozzle 102 according to the second embodiment of the present invention differs from the configuration of the first embodiment in the configuration of the liquid supply unit 120. That is, the substrate cleaning nozzle 102 according to the second embodiment of the present invention, the end portion 122e of the liquid supply passage 121 extending in the vertical direction along the inner wall of the casing 130 as shown in FIG. It is characterized in that it is composed of a liquid supply unit 120 having a bending passage 122 bent inward.

At this time, the bent passage 122 of the liquid supply part 120 induces the liquid 77 to flow 77d in the inclined direction with respect to the gas 66 discharged from the gas discharge port 110a. Therefore, as shown in FIG. 7A, the liquid flow 77d discharged from the liquid discharge port 120a is mixed with the discharged gas 66d in the mixing space 18, forming a vortex 88d while forming the nozzle discharge port 130a. The farther away from), the mixed fluid 88 is injected in a spreading manner.

As such, the diameter do of the contact area of the mixed fluid 88 that reaches the surface of the substrate W is much larger than the diameter di of the nozzle discharge port 130a, so that the conventional substrate shown in FIG. Compared to the cleaning nozzle 1, the time required for cleaning the entire surface of the substrate W can be shortened.

At this time, the vortices 88d formed in the mixing space 18 depend on the size of the circumferential component of the liquid 77 discharged from the liquid discharge port 120a and the speed of the gas 66 discharged from the gas discharge port 110a. Its strength is determined by Therefore, when the surface of the substrate W to be cleaned is further away from the nozzle outlet 130a than the critical distance, the intensity of the vortex 88d in the mixed fluid 88 is reduced to remove foreign substances on the surface of the substrate W. It is weakened to a degree that cannot be achieved. Therefore, the substrate cleaning nozzle 102 according to the present invention configured as described above preferably maintains the distance H from the nozzle discharge port 130a to the surface of the substrate W at 200 mm or less when configuring the substrate cleaning apparatus. .

On the other hand, if the distance H from the nozzle discharge port 130a to the surface of the substrate W is kept smaller than 20 mm, the spreading effect of the mixed fluid 88 is not sufficiently revealed, and the efficiency of shortening the cleaning time does not increase significantly. It is preferable to keep the distance H from the nozzle discharge port 130a to the surface of the substrate W at 20 mm or more.

Hereinafter, a substrate cleaning nozzle 103 according to a third embodiment of the present invention will be described in detail with reference to the accompanying drawings. However, in describing the present invention, the functions or configurations of the first and second embodiments described above are omitted to clarify the gist of the fourth embodiment of the present invention, and the same or similar functions or configurations are the same. Or similar reference numerals will be given.

The substrate cleaning nozzle 103 according to the third exemplary embodiment of the present invention inclines the liquid 77 discharged from the liquid supply part 120 to the gas 66 discharged from the gas discharge port 110a. There is a difference from the configuration of the second embodiment.

More specifically, as shown in Fig. 8, the liquid supply passage 221 of the liquid supply part 220 is arranged in a direction parallel to the flow 66d of the gas discharged from the gas discharge port 110a, thereby discharging the liquid discharge port. Although the liquid 77d discharged from the gas is parallel to the discharged gas flow 66d, the vortex induction blade 140 is formed on the inner wall of the casing 130, and the liquid flow 77d discharged parallel to the gas flow 66d. ) Is in contact with the vortex induction blade 140 and the flow direction 77d 'is changed in the direction inclined to the discharged gas flow 66d as shown in FIG.

Accordingly, as shown in FIG. 8, in the mixed space 18 between the gas discharge port 110a and the nozzle discharge port 130a, the gas flow 66d and the vortex induction blade (discharged from the gas discharge port 110a) As the liquid flow 77d passing through 140 is mixed, the vortices 88x are induced so that the mixed fluid 88 injected from the discharge port 130a is gradually injected in the form of a larger cross section.

Hereinafter, a substrate cleaning nozzle 103 according to a fourth embodiment of the present invention will be described in detail with reference to the accompanying drawings. However, in describing the present invention, the functions or configurations of the first to third embodiments described above are omitted to clarify the gist of the fourth embodiment of the present invention, and the same or similar functions or configurations are the same. Or similar reference numerals will be given.

In the substrate cleaning nozzle 104 according to the fourth embodiment of the present invention, the liquid supply passage 121 of the liquid supply part 420 is formed in a spiral shape, and thus the flow of the liquid 77 discharged from the liquid discharge port 120a ( 77d) is discharged in a spiral form. The spiral liquid flow 77d meets the gas flow 66d discharged from the gas discharge port 110a while vortexing along the inner wall of the region 132 where the cross section decreases gradually at the end of the casing 130. 88x).

Accordingly, as shown in FIG. 10, the mixed fluid 88 injected from the discharge port 130a is sprayed in such a manner that the cross section is gradually increased.

In the present invention illustrated in various embodiments as described above, the mixed fluid 88 mixed with the gas 66 and the liquid 77 discharged at a high pressure forms a vortex 88d, and is gradually cross-sectioned from the discharge port 130a of the nozzle. As it is sprayed in a larger form, the foreign matter attached to the substrate W is removed by applying a shearing force, thereby improving the cleaning effect, and the problem of damage to the substrate that may occur when the foreign matter is separated from the substrate does not occur. Since the mixed fluid 88 is sprayed in a wider area of (W) for wider cleaning, the advantageous effect of greatly reducing the time required for cleaning the substrate can be obtained.

In the above described exemplary embodiments of the present invention by way of example, the scope of the present invention is not limited to the specific embodiments as described above, by those of ordinary skill in the art to which the present invention belongs It is possible to change as appropriate within the scope described in the claims.

W: Substrate 18: Mixed Space
66: gas 66d: discharged gas flow
77: liquid 77d: discharged liquid flow
88: mixed fluid 88d: vortex component
101, 102, 103, 104: substrate cleaning nozzle
110: gas supply unit 110a: gas discharge port
120: liquid supply part 120a: liquid discharge port
130: casing 130a: nozzle discharge port

Claims

A gas supply unit for discharging gas through the gas discharge port;
A casing having a discharge port formed at a position spaced apart from the gas discharge port while surrounding a circumference of the gas discharge port;
The liquid is discharged in an inclined direction and a flow direction of the gas discharged from the gas discharge port, and the liquid is discharged so that the liquid discharged from the liquid discharge port meets the gas discharged from the gas discharge port in the space between the gas discharge port and the discharge port. A liquid supply unit for discharging;
And the pressure of the gas discharged from the gas discharge port is higher than the pressure of the liquid discharged from the liquid discharge port.

The method according to claim 1,
And the liquid supply part discharges the liquid at two or more places in an inclined direction different from the flow direction of the gas.

The method according to claim 1,
And an inclination angle between the flow direction of the liquid discharged from the liquid discharge port and the flow direction of the gas discharged from the gas discharge port is greater than 10 degrees and equal to or less than 90 degrees.

The method according to claim 1,
And the liquid discharged from the liquid discharge port flows with a rotational component surrounding the center of the gas discharge port.

5. The method of claim 4,
The end of the liquid supply portion is formed with a spiral passageway surrounding the gas supply portion, the liquid is sprayed from the liquid discharge port in a spiral path characterized in that the substrate cleaning nozzle.

The method according to claim 1,
And a vortex forming blade formed inside the casing for guiding the liquid discharged from the liquid discharge port into a vortex having a spiral flow component.

7. The method according to any one of claims 1 to 6,
And the gas supply part has two or more gas discharge ports.

7. The method according to any one of claims 1 to 6,
And the liquid is at least one of deionized water and a cleaning liquid.

9. The method of claim 8,
And the gas supply part has two or more gas discharge ports.

A liquid chamber for storing a liquid;
A gas chamber for storing gas;
The liquid is supplied from the liquid chamber to the liquid supply portion, the gas is supplied from the gas chamber to the gas supply portion, and a mixed fluid in which the liquid and the gas are mixed is injected through the discharge port. A substrate cleaning nozzle according to any one of claims 1 to 3;
Moving means for moving any one of said substrate cleaning nozzle and said substrate;
Substrate cleaning device comprising.

11. The method of claim 10,
And a distance between the substrate cleaning nozzle and the substrate is 20 mm to 200 mm.

11. The method of claim 10,
And said gas supply part has two or more gas discharge ports.

11. The method of claim 10,
And said liquid is at least one of deionized water and a cleaning liquid.