KR20140030293A - Solder ball supplier using air curtain - Google Patents

Solder ball supplier using air curtain Download PDF

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Publication number
KR20140030293A
KR20140030293A KR1020140018709A KR20140018709A KR20140030293A KR 20140030293 A KR20140030293 A KR 20140030293A KR 1020140018709 A KR1020140018709 A KR 1020140018709A KR 20140018709 A KR20140018709 A KR 20140018709A KR 20140030293 A KR20140030293 A KR 20140030293A
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KR
South Korea
Prior art keywords
housing
ball
solder ball
mask
solder
Prior art date
Application number
KR1020140018709A
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Korean (ko)
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KR101550688B1 (en
Inventor
이규호
Original Assignee
(주) 에스에스피
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Priority to KR1020140018709A priority Critical patent/KR101550688B1/en
Publication of KR20140030293A publication Critical patent/KR20140030293A/en
Priority to PCT/KR2015/001624 priority patent/WO2015126155A1/en
Application granted granted Critical
Publication of KR101550688B1 publication Critical patent/KR101550688B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/742—Apparatus for manufacturing bump connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/94—Batch processes at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The present invention discloses a solder ball supply device for supplying a solder ball to the upper portion of the ball mask for the ball bumping process. Solder ball supply apparatus according to the present invention, the bottom surface is open cylindrical housing; A rotating shaft coupled to the center of the housing; A pressing member fixed to the inside of the housing to evenly distribute the solder balls on the ball mask and to lightly press the solder balls located on the ball mask into the ball holes of the ball mask; An air curtain portion that sprays gas at a predetermined angle to the center portion of the housing to prevent the solder ball from escaping out of the housing; Rotating driving means for rotating the rotating shaft and the housing and the pressing member and a driving means for moving it to the left and right up and down.
According to the present invention, the solder ball injected into the upper portion of the mask is not only distributed evenly by the pressing member, but also pushed into the pressing member or slightly pressed into the mask hole. In addition, since the solder ball is continuously maintained in the ball holding area in the center of the housing by the gas injected from the outside, it is possible to proceed with the ball bumping process more efficiently by using a smaller amount of solder balls than in the prior art.

Description

Solder ball supply device using air curtain {Solder ball supplier using air curtain}

The present invention relates to a solder ball supply device used in ball bumping equipment for attaching solder balls to wafers or similar materials. Specifically, the present invention relates to a solder ball supply device using an air curtain to prevent solder balls from escaping to the outside of the housing, The present invention relates to a solder ball supply device capable of more effectively injecting solder balls into a mask hole by gently pressing a solder ball on an upper surface of a ball mask using a pressing member.

Generally, in order to manufacture a semiconductor package, a predetermined thin film is first deposited on a wafer, and the deposited thin film is subjected to photolithography and etching to form a circuit pattern.

In addition, a packaging process in which the circuit pattern-formed wafer is sawed again into individual dies (or chips), is attached to the PCB substrate, and molded.

Thus, conventionally, it has been common to divide the wafer into individual dies and then proceed with the packaging process for each die. However, recently, as ball bumping technology becomes more sophisticated, a wafer bumping method of attaching a plurality of solder balls to the front surface of a wafer at a time by using a mask before cutting the wafer has been widely used.

The conventional wafer bumping method of the related art proceeds in the following order.

First, as shown in FIG. 1A, the flux mask 20 is positioned above the wafer W while the wafer W is placed on the chuck 10. Subsequently, when the flux F is squeezed from the upper portion of the flux mask 20 to the blade 22, the flux F passing through the mask hole of the flux mask 20 is dotting to a predetermined position of the wafer W. do.

Subsequently, the ball mask 30 is positioned on the wafer W, and then the solder ball B is poured on the ball mask 30. Subsequently, the solder balls B are sufficiently dispersed in the upper portion of the ball mask 30 using the brush 32 so that the solder balls B pass through the mask hole.

By the way, the process of removing the residual solder ball while pouring the solder ball (B) on the top of the ball mask 30 and brushing by hand takes a lot of work time, there is a problem that the productivity is lowered.

Accordingly, a lot of automated solder ball supplies have recently been introduced.

As an example, Japanese Laid-Open Patent Publication No. 2010-177230 introduces a so-called cyclone-type solder ball supply device in which a circular air blowing device is installed around a hopper. This method has the advantage that a smaller number of balls can be used than the conventional ones because the solder balls are not dispersed around the substrate. However, when the ball is operated while moving on the substrate, the solder balls entering the mask hole due to the strong wind pressure of the air ejecting device are pulled out again. There is a risk of coming out. In addition, the impact and the amount of impact of the solder ball is increased by the strong wind pressure may damage the solder ball may cause product defects.

As another example, Korean Patent No. 10-1116937 introduces a solder ball printing apparatus in which a wire rod having a line spacing smaller than the diameter of the solder ball is installed under the solder ball supply unit.

According to the registered patent, since the vibration must be generated after supplying the solder ball on the upper portion of the wire rod, the exciter (vibration device) must be installed. However, the exciter not only accelerates the deterioration of the device when used for a long time, but also increases the product cost. In addition, since the vibration is applied while the lower end of the wire is in contact with the mask surface, the service life of the wire is shortened due to contact friction.

In addition, the solder ball supplied to the top is uniformly distributed so that the line spacing must be constant to pass through the wire rod, but the thin diameter wire is hard to maintain a constant spacing because there is little rigidity. Therefore, the solder ball is not uniformly distributed on the mask, there is a problem that the solder ball is not stably injected into the mask hole.

Japanese Laid-Open Patent No. 2010-177230 Korean Patent Registration No. 10-1116937

An object of the present invention is to provide a solder ball supply device which can more stably input the solder ball in the mask hole in the ball bumping process. In addition, an object of the present invention is to provide a solder ball supply apparatus that can reduce the cost and increase the productivity by reducing the amount and loss of solder balls and the time that the solder ball is put into the mask hole.

In order to achieve the above object, the present invention is a solder ball supply device for performing a ball bumping process while supplying a solder ball to the upper portion of the ball mask, the bottom surface of the cylindrical housing; A rotating shaft coupled to the center of the housing; A pressing member fixed to the inside of the housing to evenly distribute the solder balls on the ball mask and to lightly press the solder balls located on the ball mask into the ball holes of the ball mask; An air curtain portion that sprays gas at a predetermined angle to the center portion of the housing to prevent the solder ball from escaping out of the housing; It provides a solder ball supply device comprising a rotary drive means for rotating the housing and the pressing member by rotating the rotary shaft and a drive means for moving the left and right up and down.

The pressing member of the solder ball supply apparatus according to the present invention may be fixed to the center of the ceiling of the housing by a fixing member.

In addition, the pressing member of the solder ball supply apparatus according to the present invention may be characterized in that the shape seen from the bottom surface is straight or cross-shaped, the shape of the side cross-section is circular, arc or straight.

In addition, the air curtain portion of the solder ball supply apparatus according to the present invention, the first flow path formed on the ceiling of the housing; A second passage formed on the sidewall of the housing and communicating with the first passage; An injection nozzle part inclined inwardly at a lower end of the side wall of the housing and communicating with the second flow path; It may be characterized in that it comprises a gas supply means for supplying gas to the first passage.

In addition, in the solder ball supply apparatus according to the present invention, a gas flow guide is formed to protrude inwards on an inner wall of the housing, and the gas flow guide may include an inclined surface that is lowered toward the outside.

In addition, the solder ball supply apparatus according to the present invention may be characterized in that the gas outlet is formed on the side wall and ceiling of the housing, respectively.

According to the present invention, the solder ball injected into the upper portion of the mask is not only distributed evenly by the pressing member, but also pushed into the pressing member or slightly pressed into the mask hole.

In addition, since the solder ball is continuously maintained in the ball holding area at the center of the housing by the gas injected from the outside of the housing, it is possible to proceed with a more efficient ball bumping process using a smaller amount of solder balls than in the prior art.

1 illustrates a conventional wafer bumping method.
Figure 2 is a perspective view of a ball bumping equipment equipped with a solder ball supply apparatus according to an embodiment of the present invention
3 to 5 are a perspective view, a bottom perspective view and a cross-sectional view of a solder ball supply device according to an embodiment of the present invention, respectively
6 is a view showing several types of injection nozzles
7 and 8 are each a cross-sectional view showing the operation of the solder ball supply apparatus according to an embodiment of the present invention in order
9 is a view illustrating a movement path of the housing in the upper part of the ball mask.
10 to 12 are a bottom perspective view, a cross-sectional view and a process cross-sectional view showing a modification of the solder ball supply apparatus according to an embodiment of the present invention, respectively.
13 and 14 are views showing various modifications of the pressing member

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. First, the present invention relates to a solder ball supply apparatus, and the scope of the present invention is not limited to wafer bumping. Hereinafter, all materials including solder wafer bumping will be referred to as 'substrates'.

Solder ball supply apparatus 100 according to an embodiment of the present invention constitutes a part of the ball bumping equipment 200, as illustrated in Figure 2, by lifting and lowering by the vertical driving means provided in the ball bumping equipment 200 Then, the solder ball is supplied to the upper portion of the ball mask 30 while moving in the horizontal direction by the horizontal driving means.

Hereinafter, a preferred embodiment of the solder ball supply device 100 will be described with reference to the drawings.

Solder ball supply apparatus 100 according to an embodiment of the present invention is fixed to the fixing bracket 102, the lower end of the fixing bracket 102, as shown in a perspective view of FIG. 3, a bottom perspective view of FIG. The support frame 120, the housing 110 is rotatably coupled to the lower portion of the support frame 120, the pressing member is installed in the inner center of the housing 110 to evenly distribute the solder ball to the upper portion of the ball mask ( 150).

The fixing bracket 102 serves to mount the solder ball supplying device 100 to the vertical driving means or the horizontal driving means of the ball bumping equipment (200 of FIG. 2), and the support frame 120 can rotate the housing 110. To support them. The upper portion of the support frame 120 is provided with a rotation driving means 104 such as a motor for rotating the housing 110.

The rotating shaft 130 is rotatably coupled to the center of the support frame 120, the rotating shaft 130 may be directly connected to the rotary driving means 104, using a power transmission means such as a belt, gear, wire, chain It may also be indirectly connected. In particular, in the embodiment of the present invention, a longitudinal through portion 132 is formed inside the rotating shaft 130, and the through portion 132 is used as a gas supply passage. A gas supply hole 122 is formed in the center of the support frame 120 to communicate with the through part 132 of the rotation shaft 130.

The housing 110 has an inverted cylindrical shape having an open bottom, and a center thereof is coupled to a lower end of the rotation shaft 130 protruding downward of the support frame 120.

The housing 110 is provided with a means for preventing the solder ball from escaping the outside of the housing by forming an air curtain by injecting gas into the interior of the housing. Specifically, the first passage 111 communicating with the penetrating portion 132 of the rotation shaft 130 is formed inside the ceiling of the housing 110, and the first passage 111 communicates with the first passage 111 inside the sidewall. Two flow paths 112 are formed. In addition, the injection nozzle portion 116 communicating with the second flow path 112 is formed at the lower edge of the inner wall of the housing 110.

Meanwhile, a plurality of gas outlets 117 are symmetrically formed on the ceiling of the housing 110, and a plurality of gas outlets 114 are symmetrically formed on the sidewall of the housing 110. Therefore, the gas injected into the interior of the housing 110 through the injection nozzle unit 116 rises while rotating in the internal space 113 of the housing, and part of the gas is discharged to the outside through the gas outlet 114 of the side wall, and the rest is ceiling. It is discharged to the outside through the gas outlet 117. A plurality of through holes 124 may be formed in the support frame 120 at a position corresponding to the gas outlet 117 of the ceiling of the housing 110 for smoother gas discharge.

In the exemplary embodiment of the present invention, a ball supply pipe (not shown) is provided at one of the gas outlets 117 of the gas outlets 117 formed on the ceiling of the housing 110 to supply solder balls to the inside of the housing 110. Install the ball supply pipe in a separate location.

The pressing member 150 is fixed to the ceiling center of the housing 110 through the fixing member 118, so that the housing 110 is rotated together when the housing 110 rotates.

The pressing member 150 is installed so that the bottom end of the ball mask is in contact with the upper part of the ball mask or is spaced apart by a small distance, and pushes and distributes the solder ball supplied to the upper part of the ball mask while slightly pressing the upper part of the solder ball. It acts as a mask hole.

In the exemplary embodiment of the present invention, the pressing member 150 having a circular tubular shape is disposed in the horizontal direction of the housing 110 so that when the pressing member 150 is rotated, the solder ball is pushed by the outer wall of the circular tube. However, the shape of the pressing member 150 is not necessarily limited thereto, which will be described later.

In addition, the pressing member 150 may be made of various materials such as metal, plastic, vinyl, paper. For example, when a SUS plate having a thickness of 0.03 to 0.05 mm is processed into a predetermined shape and used as a pressing member, since the thickness is thin, almost no damage occurs even when contacting the solder ball (B).

The pressing member 150 serves to evenly distribute the solder ball to the upper part of the ball mask 30 and press or push near the upper end of the solder ball flowing from the upper part of the ball mask 30 to the solder ball mask hole of the ball mask 30. To be effective in

Meanwhile, the first flow path 111 formed on the ceiling of the housing 110 is substantially horizontal, and the second flow path 112 formed on the sidewall is substantially vertical. One end of the first passage 111 communicates with the penetrating portion 132 of the rotation shaft 130, and the other end communicates with the upper end of the second passage 112.

The shape of the first flow path 111, the second flow path 112, and the injection nozzle part 116 is not particularly limited, but is preferably symmetrically formed with respect to the center of rotation of the housing 110.

Accordingly, gas such as nitrogen and air supplied from the upper end of the rotating shaft 130 through the through part 132 passes through the first channel 111 of the ceiling of the housing 110 and the second channel 112 of the side wall. It is injected toward the inside of the housing 110 through the injection nozzle unit 116.

The injection nozzle unit 116 may be formed of a plurality of holes as illustrated in FIG. 6A, or may be formed in a slit form as shown in FIG. 6B. In the case of a hole shape, the diameter is preferably 0.3 mm or less and is formed at intervals of about 10 degrees. In the case of a slit shape, the width of the outlet is preferably 0.05 mm or less, but is not necessarily limited thereto. In any case, the injection nozzle unit 116 may be symmetrically disposed with respect to the center of the housing 110.

In addition, the injection nozzle unit 116 is preferably formed to be inclined slightly downward rather than horizontally, preferably at an angle of 5 to 45 degrees with respect to the surface of the ball mask 30.

The injection nozzle unit 116 may be formed such that the injection direction is toward the center of the housing 110, or may be formed to be inclined in the circumferential direction with respect to the center of the housing 110.

In order for the gas supplied through the injection nozzle unit 116 to flow smoothly into the housing 110, the gas supplied into the housing 110 must be smoothly discharged. In the embodiment of the present invention, a plurality of gas outlets 117 and 114 are formed on the ceiling and the sidewall of the housing 110, respectively, so that the gas inside the housing is naturally exhausted.

For more effective natural exhaust, a mechanical configuration can be added to raise the internal gas. For example, as shown in FIG. 5, a gas flow guide 119 having an inclined surface that is lowered toward the center may be formed near the lower end of the inner wall of the housing 110. The gas flow guide 119 serves to push up the air inside when the housing 110 rotates, so that the air inside the air flows more smoothly through the gas outlets 117 and 114 of the ceiling and sidewalls. It becomes possible. The inclined surface of the gas flow guide 119 may be flat or curved.

Hereinafter, the operation of the solder ball supply apparatus 100 according to the embodiment of the present invention will be described with reference to FIGS. 7 and 8.

First, the flux is doped into the bumping area of the substrate W, and then the ball mask 30 is positioned on the substrate W for the ball bumping process. The ball mask 30 is fixed to the mask support, and the substrate W is positioned below the ball mask 30.

As shown in FIG. 7, the ball mask 30 includes a hole pattern in which a plurality of mask holes 35 are formed in the center, and the hole pattern corresponds to the bumping area of the substrate W. As shown in FIG.

In this state, the horizontal drive means and the vertical drive means are selectively driven to move the solder ball supply device 100 to the process start position on the upper side of the ball mask 30.

At this time, since the solder ball (B) should not escape to the outside of the housing 110, the distance between the lower sidewall of the housing 110 and the ball mask 30 should be smaller than the diameter of the solder ball (B).

The spacing between the lowest point of the pressing member 150 installed in the housing 110 and the ball mask 30 is not particularly limited, but the pressing member 150 slightly presses the upper portion of the solder ball B to close the ball mask 30. Maintain a gap that can be pushed into the mask hole 35 of) or by pressing the solder balls (B) stacked on the upper portion of the ball mask (30) from the top to the lower solder ball (B) is pushed into the mask hole (35) Leave enough space to enter.

In this state, as shown in FIG. 7, the solder ball B is supplied into the housing 110 through a ball supply pipe (not shown).

Subsequently, as shown in FIG. 8, when gas (eg, nitrogen) is supplied through the penetrating portion 132 of the rotation shaft 130, the supplied gas is injected through the flow path formed at the ceiling and the sidewall of the housing 110. It is injected into the housing 110 through the nozzle unit 116.

At the same time, when the rotary shaft 130 is rotated by controlling the rotation driving means, the housing 110 and the pressing member 150 therein rotate together, and the ball mask in the center of the housing 110 is rotated due to the rotation of the housing 110. On the upper surface of 30, a ball holding area surrounded by a kind of air curtain is formed.

In this process, the pressing member 150 fixed to the housing 110 is also rotated together, and the solder balls B placed on the ball mask 30 are pressed into the empty mask holes 35, and the solder balls B stuck together. The ball mask 30 is evenly distributed over the top.

In addition, the dispersed solder ball B is continuously pushed toward the inner center of the housing 110 by being pushed by the injected gas, and is then introduced into the mask hole 35 by the pressing member 150 or dispersed again. The solder ball B injected into the mask hole 35 is attached to the flux F doped on the substrate W.

The gas injected into the interior of the housing 110 is rotated and rotates through the internal space 113 of the housing 110 and then rises through the gas outlets 114 and 117 formed on the side wall and the ceiling of the housing 110. It is discharged to the outside.

Meanwhile, the solder ball supply device 100 according to the embodiment of the present invention may perform the ball bumping process while rotating in the stopped state on the upper portion of the ball mask 30, but in order to miniaturize the device and reduce the amount of solder balls used, the ball mask 30 may be used. It is necessary to form the ball holding area formed on the upper surface of the () smaller than the substrate (W).

In this case, the ball bumping process should be performed while moving the solder ball supply apparatus 100 on the upper portion of the substrate (W). That is, as shown in FIG. 9, it is preferable to perform the ball bumping process while moving the solder ball supply device 100 so that the housing 110 covers all of the hole patterns of the ball mask 30. More preferably, the solder ball supply device 100 is moved so that the ball holding area formed inside the housing 110 covers all of the hole patterns of the ball mask 30, thereby moving the solder ball to the hole pattern of the ball mask 30. This should be supplied without exception.

After moving in this way, after the solder ball supply device 100 completely escapes the hole pattern of the ball mask 30, the residual solder ball B should be removed. In this case, after raising the solder ball supply device 100, the remaining solder ball may be removed by a separate suction means, and the suction means may be lifted on the outer wall of the housing 110 of the solder ball supply device 100 to remove the residual solder ball more conveniently. It can also be installed. In the case of installing in the housing 110, after the solder ball supply device 100 which has been processed is slightly raised, the suction means is lowered to the surface of the ball mask 30, and the solder ball supply device 100 is moved in the horizontal direction. Vacuum suction.

Although the preferred embodiment of the present invention has been described above, the present invention is not limited to the above-described embodiment, and may be modified or modified in various forms.

For example, the pressing member 150 used in the embodiment of the present invention is not limited in shape to the circular tube shape.

That is, as shown in Figs. 10 to 12, the plate body having a straight cross-sectional shape may be used as the pressing member 150. In this case, if the lower end of the plate-shaped pressing member is formed to be slightly bent to one side, the solder ball (B) in contact with the lower side can be pushed into the mask hole more effectively.

In addition, although one plate-shaped pressing member 150 is installed in FIGS. 10 to 12, two or more plate-shaped pressing members 150 may be crossed to form a cross or pinwheel shape when viewed from the bottom.

In addition, as shown in FIG. 13, the pressing member 150 having an arc-shaped side cross section may be installed in a straight or cross shape with respect to the bottom surface.

In addition, as illustrated in FIG. 14, a brush-type pressing member 150 having a plurality of brushes 152 may be used.

In addition, the present invention may be modified or modified in various ways, and it is to be understood that modifications and variations may be made without departing from the scope and spirit of the invention as set forth in the appended claims.

30: ball mask 35: mask hole 100: solder ball supply device
102: fixing bracket 104: rotary drive means 110: housing
111: Euro 1 112: Euro 2 113: Internal space
114: gas discharge port 116: injection nozzle unit 117: gas discharge port
118: fixing member 119; Gas flow guide 120: Support frame
130: rotating shaft 132: through part 150: pressing member
152: brush 200: ball bumping equipment

Claims (5)

A solder ball supplying apparatus for performing a ball bumping process while supplying a solder ball to an upper portion of a ball mask,
A cylindrical housing having an open bottom surface;
A rotating shaft coupled to the center of the housing;
A pressing member fixed to the inside of the housing to evenly distribute the solder balls on the ball mask and to lightly press the solder balls located on the ball mask into the ball holes of the ball mask;
An air curtain portion that sprays gas at a predetermined angle to the center portion of the housing to prevent the solder ball from escaping out of the housing;
Rotating drive means for rotating the housing and the pressing member by rotating the rotary shaft and drive means for moving it left and right and up and down
Solder ball feeder including The method of claim 1,
The pressing member has a straight or cross-shaped shape viewed from the bottom surface, the solder ball supply device characterized in that the shape of the side cross-section is circular, arc or straight. The method of claim 1, wherein the air curtain portion,
A first flow path formed in the ceiling of the housing;
A second passage formed on the sidewall of the housing and communicating with the first passage;
An injection nozzle part inclined inwardly at a lower end of the side wall of the housing and communicating with the second flow path;
Gas supply means for supplying gas to the first flow passage
Solder ball supply device comprising a The method of claim 1,
A gas flow guide protrudes inward from an inner wall of the housing, and the gas flow guide includes an inclined surface that is lowered toward the inside toward the outside. The method of claim 1,
Solder ball supply device characterized in that the gas outlet is formed on the side wall and ceiling of the housing, respectively
KR1020140018709A 2014-02-18 2014-02-18 Solder ball supplier using air curtain KR101550688B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020140018709A KR101550688B1 (en) 2014-02-18 2014-02-18 Solder ball supplier using air curtain
PCT/KR2015/001624 WO2015126155A1 (en) 2014-02-18 2015-02-17 Solder ball supply device using air curtain

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140018709A KR101550688B1 (en) 2014-02-18 2014-02-18 Solder ball supplier using air curtain

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KR20140030293A true KR20140030293A (en) 2014-03-11
KR101550688B1 KR101550688B1 (en) 2015-09-07

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101647660B1 (en) * 2015-02-12 2016-08-11 (주) 에스에스피 Solder ball supplier using air curtain

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Publication number Priority date Publication date Assignee Title
KR101868907B1 (en) 2017-03-15 2018-07-20 (주)에스에스피 Tilt and height adjustable wafer stage device
CN112259478A (en) * 2020-10-23 2021-01-22 技感半导体设备(南通)有限公司 Ball scraping and spreading device and method

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JPH11245370A (en) * 1998-03-02 1999-09-14 Matsushita Electric Ind Co Ltd Aligning method for base and screen mask in electric paste screen printing
TWI273666B (en) * 2004-06-30 2007-02-11 Athlete Fa Corp Method and device for mounting conductive ball
JP5240776B2 (en) * 2009-01-27 2013-07-17 ミナミ株式会社 Ball feeder
JP5206572B2 (en) * 2009-04-23 2013-06-12 株式会社日立プラントテクノロジー Solder ball printing device
JP5808229B2 (en) * 2011-11-14 2015-11-10 株式会社日立製作所 Solder ball printing machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101647660B1 (en) * 2015-02-12 2016-08-11 (주) 에스에스피 Solder ball supplier using air curtain

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WO2015126155A1 (en) 2015-08-27

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