KR101868907B1 - Tilt and height adjustable wafer stage device - Google Patents

Abstract

The present invention relates to a tilt and height adjustable wafer stage device and, more specifically, to a tilt and height adjustable wafer stage device capable of adjusting the tilt and the height of a stage module having a wafer mounted thereon when a micro solder ball is mounted on the wafer in a predetermined pattern through a flux printing process and a sold ball loading process in a wafer level solder ball placement system. In particular, triaxial motion control is realized in a Z-direction to the stage module having the wafer mounted thereon, such that the flatness of the stage module and a gap between a stencil and the wafer are easily and correctly adjust, thereby minimizing a defect rate and largely increasing yield and productivity of a product. Accordingly, the present invention improves reliability and competitiveness in a semiconductor field and a semiconductor package manufacturing field, in particular, a wafer level chip scale package (WLCSP)-based manufacturing field and a solder ball placement system field, and also a similar or related field. According to the present invention, the tilt and height adjustable wafer stage device comprises the stage module, a tilting module, a planar moving module, a control module, a distance measurement sensor, and a vision sensor.

Description

[0001] Tilt and height adjustable wafer stage device [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer stage apparatus capable of adjusting inclination and height, and more particularly, to a wafer stage apparatus capable of performing a flux printing process and a solder ball loading process in a wafer level solder ball placement system The inclination and height of the stage module on which the wafer is placed can be adjusted in the process of mounting the micro solder balls in a predetermined pattern on the wafer.

In particular, the present invention is configured to enable three-axis motion control in the Z-axis direction with respect to the stage module on which the wafer is placed so that the flatness of the stage module and the gap between the stencil and the wafer can be easily and accurately adjusted And a wafer stage device capable of adjusting the inclination and height of the wafer stage device so as to minimize the defect rate and greatly improve the yield and productivity of the product.

The technology of the semiconductor field has been developed in order to improve miniaturization and integration. Recently, according to the miniaturization trend of IT devices, it is being developed to develop a low power, high performance chip which processes a large amount of data.

A flip chip, which is one of the semiconductor chip packages by the development of the technology, does not use a metal lead (wire) when mounting a semiconductor unit, which is also called a die, on a substrate, It is manufactured by bonding directly to a substrate using a solder ball, which is a bump ball, and is also referred to as a wireless semiconductor.

As such, the performance of electronic devices, such as thinner wafers and increased input / output (I / O) terminals, has continued to be a trend toward low-power, light-weight and small size. Recently, a method of manufacturing packages by directly attaching solder balls, Technologies of WLCSP (Wafer Level Chip Scale Package) have been developed. A solder ball placement system is a system for attaching solder balls.

On the other hand, in order to attach the solder ball directly to a substrate or a wafer, a solder ball is first applied to the substrate or wafer after printing flux (hereinafter, mixed with solder paste).

As a technique for printing a flux on a wafer, Korean Patent Registration No. 10-0220328, " Solder paste printing squeegee device ", which is described in the prior art, is known.

As a technique for attaching a solder ball to a wafer on which a flux is printed, Korean Patent Registration No. 10-1550688 entitled " Solder Ball Supply Device Using Air Curtain "

On the other hand, in the case of using a stencil in the form of a thin metal plate, which is a type of mask, in a process of printing a flux or attaching a solder ball, a wafer is placed under the stencil, And solder balls are attached.

In this case, when the stencil and the wafer are not kept parallel to each other at a predetermined interval, the flux may not be uniformly printed, and the solder ball may be dropped Or two or more of them may be attached at the same time. In this case, there is a problem that the yield of the semiconductor is lowered.

Korean Registered Patent No. 10-0220328 'Solder paste printing squeegee device' Korean Registered Patent No. 10-1550688 'Solder Ball Supply Device Using Air Curtain'

In order to solve the above-described problems, the present invention provides a wafer level solder ball placement system, which is capable of performing a flux printing process and a solder ball loading process on a wafer, An object of the present invention is to provide a wafer stage apparatus capable of adjusting a tilt and a height of a stage module on which a wafer is placed in a process of mounting a micro solder ball in a predetermined pattern.

More specifically, the present invention relates to a wafer stage capable of three-axis motion control in the Z-axis direction and capable of adjusting the flatness of the wafer and the gap between the stencil and the wafer easily and accurately, And a stage device.

In particular, the present invention provides a method of optimizing initialization and operation of a tilting module for tilting the stage module in three directions, thereby providing a wafer stage device capable of adjusting the inclination and height of the micro solder ball, The purpose is to provide.

In order to accomplish the above object, the present invention provides a wafer stage apparatus capable of adjusting a tilt and a height of a wafer stage apparatus, which is configured in a solder ball placement system and includes a wafer stage apparatus for loading and unloading wafers, A stage module on which a wafer is placed; A tilting module for performing three-axis motion by three oblique Z-axes formed inclined about the Z-axis; And a control module controlling at least one of the tilting module and the plane moving module to adjust the inclination and the position of the stage module.

The tilting module may include three tilters for performing a motion with respect to the stage module in an inclined Z axis disposed radially about the Z axis, 1 fixed station; A second fixing part fixed to the lower part of the stage module; An inclined Z-axis moving part that is reciprocally movable to the first fixing part and is rotatably connected to the second fixing part; And a driving unit for reciprocating the tilted Z-axis.

At least one distance measuring sensor for measuring, at a fixed position, a distance to at least one point set on the stage module; A vision sensor for photographing a center portion of the stage module; A horizontal movement module for moving the stage module in the X and Y axes on the plane; And a horizontal rotation module for rotating the stage module on the Z axis, wherein the control module confirms the measurement value of the distance measurement sensor and the image photographed by the vision sensor, and detects the tilting module, The inclination and the position of the stage module can be adjusted by controlling the operation of at least one of the pivoting modules.

The control module may further include a tilt initializing step of initializing a position of the tilting Z-axis moving part; A flattening process of adjusting the tilt of the stage module by controlling three tilters corresponding to the measured values of the distance measuring sensor; A center position adjustment process of checking an image photographed by the vision sensor and controlling the position of the center of the stage module by controlling the horizontal movement module; A step of confirming an inclination of the stage module using a tilt confirmation chuck; And a loading process of moving the stage module to a lower side of the stencil and then simultaneously elevating the stage module by simultaneously controlling three tilters, thereby loading the stage module to a lower portion of the stencil.

In the tilt initializing process, the control module may cause the tilted Z-axis to rapidly move the tilted Z-axis so that the tilted Z-axis approaches the origin, using an origin sensor that detects the origin position of the tilted Z- Wherein the position of the tilting Z-axis moving portion is finely adjusted by using an encoder of the drive motor, and in the flattening process, the stage module is rotated on the plane by using the horizontal tilting module and three tilters, So that the three points can be adjusted to have the same height.

According to the above-described solution, the present invention is applicable to a wafer level solder ball placement system, which is capable of performing a flux printing process and a solder ball loading process in a wafer level solder ball placement system, In the process of mounting the micro solder balls in the pattern, there is an advantage that the inclination (tilt) and height of the stage module on which the wafer is placed can be adjusted.

For example, the present invention is advantageous in that the flatness of a stage on which a wafer is placed is automatically adjusted in a flux printing process in a semiconductor manufacturing process of a WLCSP system, thereby enabling a stencil and a wafer to maintain a constant interval in the horizontal direction .

The present invention also has the advantage of minimizing the occurrence of defects such as missing solder balls or mounting of multiple solder balls by keeping the gap between the stage and the stencil constant in the solder ball loading process.

Accordingly, the present invention has the effect of significantly improving the semiconductor yield through precise dotting of the flux.

Specifically, the present invention has an advantage that the flatness of the wafer and the gap between the stencil and the wafer can be easily and accurately adjusted by using the wafer stage capable of three-axis motion control in the Z-axis direction.

Particularly, the present invention enables quick and accurate initialization of the tilting module for tilting the stage module in three directions, and also enables optimization of operation, thereby improving the accuracy of mounting of the micro solder ball .

Thus, the present invention has the effect of improving the productivity of the product.

Accordingly, reliability and competitiveness can be improved in the semiconductor field and the semiconductor package manufacturing field, in particular, the wafer level chip scale package (WLCSP) -based manufacturing field and the solder ball placement system field as well as similar or related fields.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a configuration diagram showing an embodiment of a wafer stage apparatus capable of adjusting inclination and height according to the present invention.
Figure 2 is an exploded perspective view of the stage module and tilting module shown in Figure 1;
3 is a view for explaining the function of the tilting module shown in FIG.
FIG. 4 is a configuration diagram showing an embodiment of a wafer level solder ball placement system to which FIG. 1 is applied.
FIG. 5 is a view for explaining the operation of FIG. 1 in FIG.
6 is a flowchart specifically illustrating the process of FIG.
FIG. 7 is a diagram for explaining 'S100' shown in FIG. 6 with reference to FIG.
FIG. 8 is a diagram for explaining 'S200' and 'S300' shown in FIG. 6 with reference to FIG.

The present invention can be applied to various types of wafer stage devices capable of adjusting inclination and height. Hereinafter, the most preferred embodiments will be described with reference to the accompanying drawings.

1 is an exploded perspective view of a stage module and a tilting module shown in FIG. 1, and FIG. 3 is an exploded perspective view of a wafer stage device according to an embodiment of the present invention. 1 shows the function of the tilting module shown in Fig.

Referring to FIG. 1, a wafer stage apparatus A capable of adjusting the tilt and the height includes a stage module 100, a tilting module 200, and a control module 300.

2, the stage module 100 includes an upper plate 110 having a plurality of suction holes 111, a lower plate 120 having a vacuum nozzle 121, and a diffusion plate 130).

Accordingly, the stage module 100 can be formed uniformly in the plurality of suction holes 111 by the negative pressure generated by the vacuum nozzle 121, and by using the negative pressure formed in the suction holes 111, 110 can be stably supported.

The tilting module 200 performs three-axis motion by three inclined Z-axes formed to be inclined with respect to the Z-tuk. The tilting module 200 includes a base (not shown) that is rotated (Z-axis rotated) on the plane by the horizontal rotation module 500 A plate 210 and three tilters 220 formed on the upper portion of the base plate 210.

As shown in Fig. 2, the tilt mechanism 220 is provided to the first fixing part 221, the second fixing part 222, and the inclined Z-axis to move in the vertical direction 223, and a driving unit 224.

The first fixing part 221 can be fixed to the edge of the base plate so as to be rotatable.

The second fixing part 222 is fixed to the lower part of the stage module 100 and can be fixed so as not to move in the plane direction. In particular, the second fixing part 222 may be relatively inwardly positioned relative to the first fixing part 221 in order to allow the tilting Z-axis to be engaged with the tilting part 223 in an inclined manner.

The inclined Z-axis moving part 223 is installed to be reciprocatable to the first fixing part 221 and is rotatably connected to the second fixing part 222. One end of the Z-axis moving part 223 is connected to the first fixing part 221, And the other end portion can be coupled to the second fixing portion in a ball joint structure.

In particular, the inclined Z-axis shifting portion 223 is connected to the second fixing portion 222 located relatively inward relative to the first fixing portion 221, so that the inclined Z-axis shifting portion 223 can be tilted.

Referring to FIG. 3, the first fixing part 221 may be fixed at a predetermined position on the base plate 210.

As described above, the second fixing part 222 can be coupled to the lower part of the stage module 100 so that the second fixing part 222 can not move in the horizontal direction, and the inclined Z-axis moving part 223 can be coupled to the first fixing part 221, And the second fixing part 222, as shown in FIG.

3, the base plate 210 provided with the first fixing part 221 and the stage module 100 provided with the second fixing part 222 can maintain a constant height H1 .

Then, when the driving motor (not shown) of the driving unit 224 is operated to move the inclined Z-axis moving part 223 in one direction (second fixing direction) as shown in the lower part of FIG. 3, The second fixing portion 222 is moved along the imaginary axis a along the imaginary axis a along the change of the diameter of the tilting Z-axis moving portion 223 (c to c ') since the tilting portion 222 can not move in the horizontal direction. Direction.

Accordingly, one tilt unit 220 can move a certain point of the stage module 100 in the vertical direction.

As a result, when the certain position of the stage module 100 is moved up and down by the plurality of tilters 220 constituting the tilting module 200, the stage module 100 is inclined, The flatness of the stage module 100 can be adjusted.

Further, when the plurality of tilters 220 are simultaneously operated, the stage module 100 can be moved in the vertical direction.

Therefore, the wafer stage device A capable of adjusting the tilt and height of the present invention can easily and precisely adjust the flatness of the wafer and the gap between the stencil and the wafer by using a plurality of tilters 220 have.

The control module 300 controls the tilter 220 of the tilting module 200 to adjust the inclination and position of the stage module 100. A specific method of this will be described below.

FIG. 4 is a configuration diagram showing an embodiment of a wafer level solder ball placement system to which FIG. 1 is applied.

4, a wafer level solder ball placement system S includes a flux printing device 10, a solder ball loading device 20, a wafer loading and unloading device 30, And the wafer transfer apparatus 40 and the wafer stage apparatus A described above.

The flux printing apparatus 10 uses a flux stencil 11 to dot the flux on the wafer and mixes the flux to the upper portion of the flux stencil 11 as shown in FIG. And a squeegee module 13 for applying the supplied flux to the printing area 11a.

In addition, the flux printing apparatus 10 may be constituted by an inclination confirming chuck 14 for confirming the horizontal state of the wafer.

The solder ball loading device 20 may include a ball supply module 22 and a solder ball loader 23 as shown in FIG. 4 by attaching a solder ball to a flux-dwelling wafer using a loading stencil 21 have.

The ball supply module 22 is for supplying a micro solder ball to the solder ball loader 23 when necessary and the solder ball loader 23 supplies the supplied micro solder ball to the ball mounting area 21a of the loading stencil 21 , And attaching (loading and mixing) micro solder balls to the wafer.

Also, the solder ball loading device 20 may be provided with a tilt confirmation chuck 24 which can confirm the horizontal state of the wafer.

The wafer loading and unloading apparatus 30 can be interlocked with a dual wafer transfer robot 41 to be described later by supplying a wafer from the outside to the inside of the system or discharging the wafer to which the solder ball has been attached to the outside .

The wafer transfer device 40 transfers the flux-diced wafer to the solder ball loading device 20 in the flux printing device 10 and transfers the wafer to the solder ball loading device 20 by using the dual type wafer transfer robot 41 as shown in FIG. Can be transported.

FIG. 5 is a view for explaining the operation of FIG. 1 in FIG.

First, in applying the wafer stage apparatus A shown in FIG. 1 to a wafer level solder ball placement system S as shown in FIG. 4, the following configuration May be added, and it is needless to say that these additional configurations can be variously changed according to the system.

5, the inclined and height adjustable wafer stage device A may further include a horizontal movement module 400, a horizontal rotation module 500, a distance measurement sensor 600, and a vision sensor 700 have.

The horizontal movement module 400 moves the stage module 100 on which the wafer is placed in the X-axis moving part 410 and the Y-axis direction (the direction orthogonal to the X-axis) for moving the X- And the Y-axis moving part 420 may include the moving part 420. The specific configuration and the operation method may be variously modified according to the requirements of the person skilled in the art,

The stage module 100 constructed in the lower portion of the loading stencil 210 can move through the lower and the lower outer sides of the solder ball loading device 20 by the horizontally moving module 400 as described above.

The horizontal rotation module 500 rotates the stage module 100 on the Z axis (vertical direction in FIG. 5). Like the horizontal movement module 400 described above, the specific configuration and operation method are not limited to specific ones Do not. For example, the horizontal pivoting module 500 can rotate the stage module 100 with the rotational force generated by the motor through the pulley and belt structure.

The distance measuring sensor 600 may be configured in a fixed position to measure a distance to at least one point set on the stage module 100, and may include a laser sensor or the like.

The vision sensor 700 is for capturing the center of the stage module 100 and checking the degree of deviation of the center of the stage module 100, and may include a CCD camera or the like.

Meanwhile, the control module 300 shown in FIG. 1 is electrically connected to the respective components shown in FIG. 5, and may be configured as a panel outside the wafer level solder ball placement system S shown in FIG.

5, the wafer stage device A according to the present invention having the above-described structure is configured such that the wafer is placed on the stage module 100, and the tilting module 200 performs the flatness, Can be adjusted.

The control module 300 shown in FIG. 1 confirms the measured values of the distance measuring sensor 600 and the images photographed by the vision sensor 700 and displays the tilting module 200, the horizontal movement module 400, The inclination and position of the stage module 100 can be adjusted by controlling the operation of at least one of the modules 500. [

Hereinafter, the control method of the control module 300 will be described in detail.

5, the wafer stage apparatus 300 moves to the inner lower portion of the solder ball loading apparatus 200 (specifically, the lower portion of the ball attachment region 21a shown in FIG. 4) Module 200 so as to be positioned close to the lower portion of the stencil 21 for loading.

5, the operation of the wafer stage apparatus A has been described by taking the solder ball loading apparatus 20 as an example. However, the present invention is not limited to this, and the apparatus using the stamper, such as the flux printing apparatus 10 shown in FIG. 4, It goes without saying that they can be applied equally or similarly.

Hereinafter, a process of initializing the position of the stage module 100 using the distance measuring sensor 600 and the vision sensor 700 shown in FIG. 5 will be described.

FIG. 6 is a flow chart specifically illustrating the process of FIG. 5, specifically illustrating a method of initializing the stage module 100 in the process shown in the upper part of FIG. 5, and FIG. 7 is a flowchart illustrating a method of initializing 'S100' FIG. 8 is a diagram for explaining applying 'S200' and 'S300' shown in FIG. 6 to FIG.

Referring to FIG. 6, the control module 300 initializes the stage module 100 by a tilter 220 initialization process (S100), a planarization process (S200), and a center position adjustment process (S300) The wafer can be moved to the stencil side through the loading process (S500) through the tilt reaffirmation process (S400).

The initialization process (S100) of the tilter 220 is for initializing the position of the inclined Z-axis moving part 223 of the tilter 220. As shown in Fig. 2, the tilter 220 initializes the tilter 220 in three directions Z1, Z2, Z3 ) Can be mechanically initialized.

At this time, the initialization of the position of the inclined Z-axis moving part 223 can be performed in two steps as shown in FIG. 6 and FIG.

Referring to FIG. 7, the tilt sensor 220 may further include a home sensor 225 and a pointer 226.

The home sensor 225 is for confirming the position of the pointer 226, and may include a hall sensor or the like.

The pointer 226 is for identifying a specific position of the inclined Z-axis moving part 223 and may be configured corresponding to the groove sensor 225. [

In other words, the home sensor 225 and the pointer 226 are for measuring a specific position of the inclined Z-axis moving part 223, and it is needless to say that various changes and applications can be made according to the needs of those skilled in the art.

In the initialization process (S100) of the tilter 220, the control module 300 moves the tilted Z-axis moving part 223 in one direction (the downward direction in FIG. 7) while moving the pointer 226 through the home sensor 225 If it is detected, the movement of the inclined Z-axis moving part 223 can be stopped (S110). Here, the home sensor 225 and the pointer 226 refer to an origin detecting sensor for detecting the origin position. The control module 300 uses the origin detecting sensor so that the inclined Z-axis moving portion 223 approaches the origin It can be moved quickly.

On the other hand, when the position of the inclined Z-axis moving part 223 is adjusted by this method, the motor shaft inertia moment of the driving motor constituted in the driving part 224 (the rotational axis continues to rotate after the power supply is stopped The magnitude of the property to be generated).

At this time, the position of the pointer 226 can be precisely adjusted using the encoder configured in the driving motor (S120).

When the mechanical initialization of the three tilters 220 is completed, the control module 300 controls the three tilter 220 and the horizontal rotation module 500 in accordance with the measured value of the distance measurement sensor 600 A flattening process of adjusting the inclination of the stage module 100 may be performed (S200).

For example, in the planarization process (S200), the control module 300 simultaneously controls three tilters 220 to move the height of the stage module 100 to a wafer receive level (S210) The tilt of the stage module 100 can be adjusted by three-axis motion by three oblique Z-axes which are inclined about the Z-axis by controlling the respective tilters 220 at the corresponding heights (S220).

8 (a) to 8 (d), the control module 300 uses the distance measuring sensor 600 to detect the position of the tilt sensor 220 on the upper surface of the stage module 100 And the distance to the point P1 corresponding to the position of the second fixing part 222 constituted in the second direction (i.e., the second direction).

The control module 300 controls the tilter 220 according to the measurement result to adjust the height of the tilter 220 to the next point P1 using the horizontal rotation module 500, It is possible to sequentially measure the point P2 and the next point P3 corresponding to the second fixing unit 222 to adjust the height.

In other words, when the three tilters 220 are mechanically initialized, the control module 300 moves the stage module 100 to the wafer receiving level, and then controls the tilters 220 individually, Can be adjusted.

At this time, in the process of adjusting the three tilters 220, the center point CP of the stage module 100 may deviate from the set reference point BP. Here, the reference point BP may include a center point of each work area 11a, 21a of each stencil 11, 21 shown in Fig.

In other words, it is necessary to adjust the center point CP of the stage module 100 in order to match the wafer placed on the stage module 100 with each work area 11a, 21a.

When the horizontal state is adjusted at the wafer receiving level through the planarization process (S200), the control module 300 confirms the position of the center point CP at the corresponding level (S310) as shown in FIG. 8 (b) , The center point CP determined using the horizontal movement module 400 can be adjusted to the reference point BP.

When the initialization of the tilt and position of the stage module 100 is completed in this manner, the inclination of the adjusted stage module 100 can be confirmed using the tilt confirmation chucks 14 and 24 shown in Figs. 4 and 5 (S400).

If it is determined that there is no abnormality after confirming the inclination of the stage module 100, the control module 300 loads the wafer to the work area side using the horizontal movement module 400 and the tilting module 200, (S400).

5, when the initialization of the stage module 100 is completed, the control module 300 controls the wafer loading and unloading device 30 shown in FIG. The stage module 100 is moved to the lower side of the stencil 21 as shown in the lower part of Fig. 5 and then the tilter 220 is simultaneously controlled to move the stage module 100 to the stencil 21 As shown in Fig.

As described above, since the stage module 100 is accurately initialized, the stage module 100 can be raised to a precise position in the lower portion of the stencil 21, through which the flux printing and micro- The solder ball can be precisely tagged.

The wafer stage device capable of adjusting the tilt and height according to the present invention has been described above. It will be understood by those skilled in the art that the technical features of the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof.

It is to be understood, therefore, that the embodiments described above are in all respects illustrative and not restrictive.

A: Wafer stage device
100: stage module 200: tilting module
210: base plate 220: tilt
221: first fixing portion 222: second fixing portion
223: Inclined Z-axis moving part 224: Driving part
225: Home sensor 226: Pointer
300: control module 400: horizontal movement module
500: Horizontal rotation module 600: Distance measuring sensor
700: Vision sensor

Claims (5)

1. A wafer stage apparatus for loading and unloading wafers in a solder ball placement system,
A stage module on which a wafer is placed; A tilting module for performing three-axis motion by three oblique Z-axes formed inclined about the Z-axis; A plane moving module including a horizontal movement module for moving the stage module in the X-axis and a Y-axis on a plane, and a horizontal rotation module for rotating the stage module in the Z-axis; A control module controlling at least one of the tilting module and the plane moving module to adjust the inclination and the position of the stage module; At least one distance measurement sensor for measuring, at a fixed position, a distance to at least one point set on the stage module; And a vision sensor for photographing a center portion of the stage module,
The tilting module includes:
And three tilters for performing motion with respect to the stage module in an oblique Z axis disposed radially about the Z axis,
The tilter
A first fixing part fixedly installed on the base plate so as to be rotatable; A second fixing part fixed to the lower part of the stage module; An inclined Z-axis moving part that is reciprocally movable to the first fixing part and is rotatably connected to the second fixing part; And a driving unit for reciprocating the tilted Z-axis in the moving part,
The control module includes:
A tilt initializing step of initializing a position of the tilting Z-axis moving part; A flattening process of adjusting the tilt of the stage module by controlling three tilters corresponding to the measured values of the distance measuring sensor; A center position adjustment process of checking the image photographed by the vision sensor and controlling the position of the center of the stage module by controlling the horizontal movement module; A step of confirming an inclination of the stage module using a tilt confirmation chuck; And a loading process of moving the stage module to the lower side of the stencil and then simultaneously raising the stage module by controlling the three tilters. And a height adjustable wafer stage device.
The method according to claim 1,
The control module includes:
And a tilting module, a horizontal movement module, and a horizontal rotation module to control the operation of at least one of the tilting module, the horizontal movement module, and the horizontal rotation module to adjust the inclination and position of the stage module. A wafer stage device capable of adjusting the inclination and the height.
4. The method according to any one of claims 1 to 3,
The control module includes:
In the tilt initialization process,
The inclined Z-axis is moved to the origin so that the inclined Z-axis approaches the origin by using an origin detection sensor that senses the origin position of the inclined Z-
Axis position of the tilt Z axis is finely adjusted by using an encoder of a drive motor provided in the drive unit,
In the planarization process,
The height of at least three points is measured while the stage module is rotated on the plane by using the horizontal rotation module and three tilters so that the three points are adjusted to have the same height. A possible wafer stage device. delete delete

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