KR20140020007A - Organic light emitting display device and method for manufacturing of the same - Google Patents

Abstract

An organic light emitting display device according to one embodiment of the present invention includes a substrate and an organic light emitting diode which is located on the substrate and includes a first electrode, an organic layer, and a second electrode. The organic light emitting diode includes a barrier to cover. The barrier includes a first silicon oxide film which is made of first polysilazane and a second silicon oxide film which is located on the first silicon oxide film and is made of second polysilazane.

Description

TECHNICAL FIELD [0001] The present invention relates to an organic electroluminescent display device,

The present invention relates to an organic light emitting display device and a method of manufacturing the same, and more particularly, to an organic light emitting display device and a method of manufacturing the same to prevent the defect of the device due to moisture permeation and easy to process.

2. Description of the Related Art In recent years, the importance of flat panel displays (FPDs) has been increasing with the development of multimedia. In response, such as Liquid Crystal Display (LCD), Plasma Display Panel (PDP), Field Emission Display (FED), Organic Light Emitting Display Device, etc. Various flat panel displays have been put to practical use.

Particularly, the organic light emitting display device has a response speed of 1 ms or less, a high response speed, low power consumption, and self light emission. In addition, there is no problem in the viewing angle, which is advantageous as a moving picture display medium regardless of the size of the apparatus. In addition, since it can be manufactured at a low temperature and the manufacturing process is simple based on the existing semiconductor process technology, it is attracting attention as a next generation flat panel display device.

Conventionally, an organic light emitting display has been manufactured by forming an organic light emitting diode including a first electrode, an organic layer, and a second electrode on a substrate, sealing the sealing substrate made of glass or metal and the substrate with an adhesive. However, the organic electroluminescent display device is difficult to realize a thin shape by use of an encapsulating substrate, and has a problem of poor durability.

Recently, organic light emitting display devices are manufactured by stacking a plurality of thin films such as an inorganic film and an organic film on an organic light emitting diode and sealing them. However, it takes a long time to laminate the inorganic film and the organic film alternately, and the structure becomes complicated. Further, there is a problem that particles are generated in the process of vapor deposition of an inorganic film using a low-temperature PECVD method, thereby providing a moisture infiltration path by the particles.

The present invention provides an organic light emitting display device and a method for manufacturing the same, which prevent a device defect due to moisture permeation and are easy to process.

In order to achieve the above object, an organic light emitting display device according to an embodiment of the present invention is a substrate, an organic light emitting diode and a first electrode, an organic layer and a second electrode disposed on the substrate, and the organic The light emitting diode may include a covering barrier, and the barrier may include a first silicon oxide film formed of first polysilazane and a second silicon oxide film formed on the first silicon oxide film and formed of second polysilazane.

The first polysilazane may be perhydro polysilazane.

The second polysilazane may be a polysilazane having a hydrophobic functional group.

The hydrophobic functional group may be any one selected from fluoro group, alkyl group, vinyl group or cycloalkyl group.

The first silicon oxide film may have a greater density than the second silicon oxide film.

The first silicon oxide film may be thicker than the second silicon oxide film.

The distance from the side surface of the organic light emitting diode to the outer surface of the barrier may be longer than the distance from the top surface of the organic light emitting diode to the top surface of the barrier.

In addition, a method of manufacturing an organic light emitting display device according to an embodiment of the present invention comprises the steps of forming an organic light emitting diode comprising a first electrode, an organic layer and a second electrode on a substrate and the organic light emitting diode is formed And forming a barrier on the substrate, the barrier comprising the first polysilazane and the second polysilazane.

The barrier may be formed by applying a solution in which the first polysilazane and the second polysilazane are mixed.

The method may further include arranging a mask on the substrate on which the organic light emitting diode is formed before applying the mixed solution of the first polysilazane and the second polysilazane.

The mask may be formed of an opening for exposing a region where the organic light emitting diode is formed.

The barrier may be formed in a film form including a first silicon oxide film formed of the first polysilazane and a second silicon oxide film formed of the second polysilazane.

The barrier in the form of a film may be attached onto the substrate on which the organic light emitting diode is formed.

In the organic light emitting display device and a method of manufacturing the same according to an embodiment of the present invention, by forming a barrier using polysilazane on the organic light emitting diode, it is possible to simply manufacture the barrier by a solution process rather than a deposition process.

In addition, by forming a barrier having adhesion and hydrophobicity, there is an advantage in that external moisture and oxygen can be prevented from penetrating into the organic light emitting diode. Furthermore, by applying a barrier by a solution process, and by forming a longer length on the side surface of the organic light emitting diode, there is an advantage that the penetration of moisture and oxygen on the side of the organic light emitting diode can be further prevented.

1 is a plan view showing an organic light emitting display according to an embodiment of the present invention.
2 is a sectional view of an organic light emitting display according to an embodiment of the present invention, taken along line I-I 'of FIG.
3 is a cross-sectional view illustrating an organic light emitting display device according to another embodiment of the present invention.
4 is a cross-sectional view showing a barrier film of the present invention.
5A to 5D are cross-sectional views illustrating a method of manufacturing an organic light emitting display according to an exemplary embodiment of the present invention.
6A to 6C are cross-sectional views illustrating a method of manufacturing an organic light emitting display device according to another embodiment of the present invention.
Figure 7 is a graph showing the measurement of the contact angle to the water by dropping water on the surface of the barrier in accordance with an embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a plan view illustrating an organic light emitting display device according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view illustrating an organic light emitting display device according to an embodiment of the present invention according to II ′ of FIG. 1. 3 is a cross-sectional view showing an organic light emitting display device according to another embodiment of the present invention, and FIG. 4 is a cross-sectional view showing a barrier film of the present invention.

1 and 2, in an organic light emitting display device 10 according to an embodiment of the present invention, an organic light emitting diode 200 is positioned on a substrate 100 and a barrier covering the organic light emitting diode 200. It consists of 300.

More specifically, the organic light emitting diode 200 is located on the substrate 100. The substrate 100 may be made of glass, plastic, or a transparent substrate made of a conductive material. An organic light emitting diode 200 including a first electrode 210, an organic layer 230 and a second electrode 240 is disposed on the substrate 100.

The first electrode 210 may be an anode, and may be a transparent electrode or a reflective electrode. When the first electrode 210 is a transparent electrode, the first electrode 210 may be one of indium tin oxide (ITO), indium zinc oxide (IZO), and zinc oxide (ZnO). When the first electrode 210 is a reflective electrode, the first electrode 210 may be formed of one of aluminum (Al), silver (Ag), and nickel (Ni) under the layer of any one of ITO, IZO, And may further include a reflective layer made of any one of them and may include the reflective layer between two layers made of any one of ITO, IZO and ZnO.

The first electrode 210 may be formed using a sputtering method, an evaporation method, a vapor phase deposition method, or an electron beam deposition method.

An insulating layer 220 is formed on the substrate 100 on which the first electrode 210 is formed to expose a part of the first electrode 210. The insulating layer 220 may include organic materials such as benzocyclobutene (BCB) resin, acrylic resin or polyimide resin, but is not limited thereto.

The organic layer 230 is positioned on the first electrode 210 exposed by the insulating layer 220. The organic layer 230 may include at least a light emitting layer and may further include a hole injecting layer, a hole transporting layer, an electron transporting layer, or an electron injecting layer on the upper or lower portion of the light emitting layer.

The hole injection layer may function to smoothly inject holes from the first electrode 210 into the light emitting layer, and may be formed of at least one of cupper phthalocyanine, PEDOT (poly (3,4) -ethylenedioxythiophene), PANI (polyaniline) And NPD (N, N-dinaphthyl-N, N'-diphenyl benzidine), but the present invention is not limited thereto.

The hole transport layer serves to facilitate the transport of holes, NPD (N, N-dinaphthyl-N, N'-diphenyl benzidine), TPD (N, N'-bis- (3-methylphenyl) -N, N at least one selected from the group consisting of '-bis- (phenyl) -benzidine), s-TAD and MTDATA (4,4', 4 "-Tris (N-3-methylphenyl-N-phenyl-amino) -triphenylamine) It may be made of but is not limited thereto.

The light emitting layer may be formed of a material that emits red, green, and blue light, and may be formed using phosphorescent or fluorescent materials.

When the light emitting layer is red, it includes a host material including CBP (carbazole biphenyl) or mCP (1,3-bis (carbazol-9-yl) , PQIr (acac) (bis (1-phenylquinoline) acetylacetonate iridium), PQIr (tris (1-phenylquinoline) iridium) and PtOEP (octaethylporphyrin platinum) Alternatively, it may be made of a fluorescent material including PBD: Eu (DBM) ₃ (Phen) or Perylene, but not limited thereto.

And a phosphorescent material including a dopant material including Ir (ppy) 3 (fac tris (2-phenylpyridine) iridium), which includes a host material including CBP or mCP when the light emitting layer is green, Alternatively, it may include, but is not limited to, a fluorescent material containing Alq3 (tris (8-hydroxyquinolino) aluminum).

(4,6-F ₂ ppy) ₂ Irpic when the emissive layer is blue, and a host material comprising CBP or mCP. Alternatively, the phosphorescent material may comprise a spiro- But is not limited to, a fluorescent material including any one selected from the group consisting of DPVBi, spiro-6P, distyrylbenzene (DSB), distyrylarylene (DSA), PFO polymer and PPV polymer.

The electron transport layer plays a role of facilitating transport of electrons and may be composed of at least one selected from the group consisting of Alq3 (tris (8-hydroxyquinolino) aluminum), PBD, TAZ, spiro-PBD, BAlq and SAlq It is not limited.

The electron transport layer may also prevent the holes injected from the first electrode from moving through the light emitting layer to the second electrode. In other words, it plays a role of a hole blocking layer and plays a role of efficient bonding of holes and electrons in the light emitting layer.

The electron injection layer plays a role of injecting electrons smoothly. Alq3 (tris (8-hydroxyquinolino) aluminum), PBD, TAZ, spiro-PBD, BAlq or SAlq may be used.

The electron injection layer may further include an inorganic material, and the inorganic material may further include a metal compound. The metal compound may include an alkali metal or an alkaline earth metal. Metal compound containing the alkali metal or alkaline earth metal is LiQ, LiF, NaF, KF, RbF, CsF, FrF, BeF 2, MgF 2, CaF 2, SrF 2, BaF any one selected from ₂ the group consisting of RaF ₂ But is not limited thereto.

The second electrode 240 may be a cathode electrode and may be made of magnesium (Mg), calcium (Ca), aluminum (Al), silver (Ag), or an alloy thereof having a low work function. Here, the second electrode 240 may be formed to have a thickness thin enough to transmit light when the organic light emitting display device has a front or both-side light emitting structure. When the organic light emitting display device has a back light emitting structure, It can be formed thick enough to reflect light.

A barrier 300 covering the organic light emitting diode 200 is located. The barrier 300 may prevent external moisture or air from penetrating and may protect the organic light emitting diode 200 from external impact. The barrier 300 has a structure in which the first silicon oxide film 310 and the second silicon oxide film 320 are stacked. The first silicon oxide film 310 is formed of the first polysilazane, and the second silicon oxide film 320 is formed of the second polysilazane.

Polysalazan used in the present invention reacts with moisture and oxygen in the air to form an oxidation reaction (oxidation) to form silicon oxide (SiO ₂ ), the longer the chain length bonded to the polysilazane, the slower the oxidation reaction proceeds do. In the present invention, the barrier 300 is formed by using the first polysilazane and the second polysilazane having a large difference in reactivity by using a different oxidation rate according to the type of polysilazane. Therefore, when the first polysilazane and the second polysilazane are mixed and applied, the first polysilazane is first oxidized to form the first silicon oxide film 310, and the second polysilazane is oxidized thereon. The second silicon oxide film 320 is formed. That is, the barrier 300 having the structure in which the first silicon oxide film 310 and the second silicon oxide film 320 are stacked is formed.

The first polysilazane may be perhydropolysilazane having the fastest reaction rate, and the second polysilazane may be polysilazane having a hydrophobic functional group. In particular, the second polysilazane has a hydrophobic functional group to prevent moisture from penetrating into the silicon oxide film when the silicon oxide film is formed. Here, the hydrophobic functional group may be any one selected from hydrocarbon groups such as alkyl groups, vinyl groups, cycloalkyl groups, or fluoro groups.

In the barrier 300 of the present invention, the first silicon oxide film 310 formed of the first polysilazane having a fast reaction rate is positioned under the organic light emitting diode 200 in contact with the first silicon oxide film 310. A second silicon oxide film 320 formed of a slow second polysilazane is formed. In particular, the above-described hydrophobic functional groups are present in the second silicon oxide film 320 to make it difficult for external moisture to penetrate the second silicon oxide film 320.

Meanwhile, in the barrier 300 of the present invention, the thickness T1 of the first silicon oxide film 310 is greater than the thickness T2 of the second silicon oxide film 320. The first silicon oxide layer 310 is formed to have a thickness T1 that covers at least the organic light emitting diode 200 to prevent penetration of moisture and oxygen into the organic light emitting diode 200. In addition, the second silicon oxide film 320 has a hydrophobic property on the surface of the barrier 300 through a hydrophobic functional group to further prevent moisture from penetrating. Therefore, the thickness T1 of the first silicon oxide film 310 is formed to be thicker than the thickness T2 of the second silicon oxide film 320.

In addition, the first silicon oxide film 310 forms a silicon oxide film by rapidly oxidizing the first polysilazane, thereby forming a high density silicon oxide film, and the second silicon oxide film 320 oxidizes the second polysilazane slowly. Therefore, a silicon oxide film having a lower density than the first silicon oxide film 310 is formed. Therefore, in order to prevent external penetration of moisture and oxygen, the thickness T1 of the first silicon oxide film 310 may be formed thicker than the thickness T2 of the second silicon oxide film 320.

Meanwhile, in the barrier 300 of the present invention, the distance d1 from the side surface of the organic light emitting diode 200 to the outer surface of the barrier 300 is from the top surface of the organic light emitting diode 200 to the top surface of the barrier 300. It is formed longer than the distance d2. The organic electroluminescent display device is vulnerable to penetration of moisture and oxygen in the lateral direction of the organic light emitting diode 200 than in the top surface direction. Therefore, in the present invention, the distance d1 from the side surface of the organic light emitting diode 200 to the outer side surface of the barrier 300 is larger than the top surface of the organic light emitting diode 200. By forming longer than the distance (d2), it is possible to prevent the penetration of moisture and oxygen in the side surface of the organic light emitting diode (200).

In the above-described barrier 300 of the present invention, the effectiveness of improving the moisture permeability of the barrier 300 formed on the side of the organic light emitting diode 200 through a solution process is theoretically determined through the Fick's 1st law. It is easy to derive. The first law of the fix is expressed as follows.

Where J is the diffusivity, D is the diffusivity of the material, C is the concentration and x is the length. A negative sign (-) indicates the flow of material from high to low concentrations. The diffusivity is based on the inherent properties of the material and can be controlled in detail by adjusting the process. Here, in the present invention, since the barrier has a long distance between the side portions, the x value becomes large and the diffusion degree becomes low. Accordingly, the barrier 300 of the present invention is a distance d1 from the side surface of the organic light emitting diode 200 to the outer surface of the barrier 300 from the top surface of the organic light emitting diode 200 to the top surface of the barrier 300. By forming longer than the distance (d2), there is an advantage that can prevent the penetration of external moisture and oxygen.

Although the organic light emitting display device according to the exemplary embodiment described above with reference to FIGS. 1 and 2 has been described in which the organic light emitting diode 200 is sealed using the barrier 300, the passivation layer may not be formed. It can also be used as a seal or manufactured in the form of a film.

Referring to FIG. 3, a barrier 300 covering the organic light emitting diode 200 is formed on the substrate 100 on which the organic light emitting diode 200 is formed. In addition, a seal material 410 is coated on the substrate 100 on which the barrier 300 is formed and sealed with an encapsulation substrate 400 to form an organic light emitting display device. In FIG. 3, the barrier 300 acts as a passivation, unlike in FIG. 2. This is because the material 410 formed between the organic light emitting diode 200 and the encapsulation substrate 400 is made of an organic material, and thus may act as a passage through which external moisture and oxygen penetrate. Therefore, in the exemplary embodiment of the present invention, the barrier 300 is formed in the organic light emitting diode 200 to prevent the penetration of external moisture and oxygen.

Meanwhile, referring to FIG. 4, the barrier 300 of the present invention may be formed in a film form. In more detail, an adhesive 170 is formed on a base film 150 such as polycarbonate (PC) or polyethylene terephthalate (PET), and the first silicon oxide film 310 and the agent described above are formed on the adhesive 170. The barrier 300 including the silicon oxide film 320 is formed. In addition, the protective film 160 is attached to the barrier 300.

The barrier 300 in the form of a film is formed by removing the base film 150 and the protective film 160 on the substrate on which the organic light emitting diode is formed. More detailed manufacturing process will be described later.

Hereinafter, a method of manufacturing the organic light emitting display device will be described with reference to the accompanying drawings. Hereinafter, the description will be briefly given with the same reference numerals as the components of the organic light emitting display device described with reference to FIGS. 2 to 4.

5A to 5D are cross-sectional views illustrating a method of manufacturing an organic light emitting display according to an exemplary embodiment of the present invention.

5A, one of indium tin oxide (ITO), indium zinc oxide (IZO), and zinc oxide (ZnO) is deposited on a transparent substrate 100 made of glass, plastic, 210 are formed. Next, a benzocyclobutene (BCB) resin, an acrylic resin, or a polyimide resin is applied on the first electrode 210 by a spin coating method or a screen pouring method and patterned by photolithography to form a first electrode The insulating layer 220 exposing a part of the insulating layer 220 is formed.

Next, a material emitting red, green or blue light is deposited on the first electrode 210 exposed by the insulating layer 220 to form an organic layer 230 including at least a light emitting layer. Further, a hole injection layer, a hole transport layer, an electron transport layer or an electron injection layer may be further formed on or below the light emitting layer. Next, magnesium (Mg), calcium (Ca), aluminum (Al), silver (Ag), or an alloy thereof is deposited on the substrate 100 including the organic layer 230 to form the second electrode 240 Thereby forming the organic light emitting diode 200.

The mask 450 having an opening OP exposing an area where the organic light emitting diode 200 is formed on the substrate 100 on which the organic light emitting diode 200 is formed is aligned. The mask 450 has a frame shape, and the opening OP exposes an area where the organic light emitting diode 200 is formed. The thickness of the barrier to be formed later is determined by adjusting the depth of the opening OP of the mask 450, and the width or length of the barrier is determined by adjusting the size of the opening OP.

Next, referring to FIG. 5B, a barrier solution 460 in which a first polysilazane and a second polysilazane are mixed in a solvent is applied onto the substrate 100 on which the mask 450 is aligned. Here, as the solvent, commonly used organic solvents such as toluene, xylene, benzene or methyl benzoate can be used. The solution thus prepared may be coated using methods such as spin coating, screen printing, and slit coating.

At this time, the barrier solution 460 can be prevented from escaping to the outside by the mask 450 and coated on the substrate 100. The applied barrier solution 460 may be applied to a thickness up to the top surface of the maximum mask 450.

Subsequently, referring to FIG. 5C, the coated barrier solution 460 is oxidized by reacting with moisture and oxygen in the air. The first polysilazane having a fast reaction rate is oxidized first to form a first silicon oxide layer 310. The second polysilazane is oxidized on the first silicon oxide layer 310 to form the second silicon oxide layer 320 to manufacture the barrier 300. Finally, as shown in FIG. 5D, the organic light emitting display device having the structure of FIG. 2 is manufactured by removing the mask 450.

Meanwhile, although not shown, the organic light emitting display device having the structure of FIG. 3 may be manufactured in the same manner as in FIGS. 5A to 5C, and then may be manufactured by applying a material to a substrate and bonding the encapsulation substrate.

6A through 6C are cross-sectional views illustrating a method of manufacturing an organic light emitting display device according to another embodiment of the present invention. In the following, the same components as those of FIGS. 5A to 5D are denoted by the same reference numerals, and description thereof will be omitted.

Referring to FIG. 6A, a base film 150 is prepared. The base film 150 may be made of polyethylene terephthalate (PET) or polycarbonate (PC). Next, the adhesive layer 170 is formed on the base film 150. The adhesive layer 170 serves to attach the barrier 300 in the form of a film to the organic light emitting diode 200, and forms an acrylic resin or an epoxy resin by screen printing.

Then, as described above, after mixing the first polysilazane and the second polysilazane in a solvent, the barrier solution mixed on the adhesive layer 170 using spin coating, screen printing, slit coating or the like method Coating. Subsequently, the first polysilazane and the second polysilazane are oxidized to form a barrier 300 in which the first silicon oxide film 310 and the second silicon oxide film 320 are stacked. Then, the protective film 160 to protect the barrier 300 is attached to form a barrier film 480.

Next, referring to FIG. 6B, the barrier film 480 may be removed from the substrate film 150 on the organic light emitting diode 200 formed on the substrate 100, and the protective film 160 may be removed while applying pressure. Attach. Thus, as shown in FIG. 6C, the barrier 300 in which the first silicon oxide layer 310 is formed on the organic light emitting diode 200 and the second silicon oxide layer 320 is formed on the first silicon oxide layer 310 is formed. ).

As described above, the organic light emitting display device and the method of manufacturing the same according to an embodiment of the present invention by forming a barrier using a polysilazane on the organic light emitting diode, it is possible to simply manufacture the barrier by a solution process rather than a deposition process Can be.

In addition, by forming a barrier having adhesion and hydrophobicity, there is an advantage in that external moisture and oxygen can be prevented from penetrating into the organic light emitting diode. Furthermore, by applying a barrier by a solution process, and by forming a longer length on the side surface of the organic light emitting diode, there is an advantage that the penetration of moisture and oxygen on the side of the organic light emitting diode can be further prevented.

Meanwhile, in the above-described embodiments, the formation of a barrier directly on the organic light emitting diode has been disclosed, but the present invention is not limited thereto, and a passivation film surrounding the organic light emitting diode may be further formed, and a barrier may be formed thereon.

Hereinafter, the barrier of the present invention will be described in detail in the following experimental examples. However, the following experimental examples are merely illustrative of the present invention, and the present invention is not limited to the following experimental examples.

Experiment: Measurement of contact angle for water according to volume of first polysilazane and second polysilazane

A barrier was formed while controlling the volume ratio of the first polysilazane, perhydro silazane, and the second polysilazane, methyl polysilazane, and water was dropped on the surface of the barrier to measure the contact angle with respect to water. At this time, the perhydro polysilazane was faster than the methyl polysilazane reaction rate and could implement a high density membrane.

Referring to FIG. 7, when the volume ratio of the hydrophobic methyl polysilazane was 0, the contact angle was about 86 degrees, but as the methyl polysilazane was added, the contact angle increased to about 97 degrees, and the volume ratio of the methyl polysilazane was increased. At about 0.35, it was confirmed that the contact angle was maintained without increasing. Through this, it was confirmed through the contact angle to water that most of the small amount of methyl polysilazane was formed on the surface of the barrier by a slow reaction rate.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that the invention may be practiced. It is therefore to be understood that the embodiments described above are to be considered in all respects only as illustrative and not restrictive. In addition, the scope of the present invention is indicated by the following claims rather than the detailed description. Also, all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

100 substrate 200 organic light emitting diode
210: first electrode 230: organic film layer
240: second electrode 300: barrier
310: first silicon oxide film 320: second silicon oxide film

Claims (13)

Board;
An organic light emitting diode (OLED) disposed on the substrate, the organic light emitting diode including a first electrode, an organic layer, and a second electrode; And
The organic light emitting diode includes a covering barrier,
And the barrier includes a first silicon oxide layer formed of first polysilazane and a second silicon oxide layer formed on second silicon oxide layer and formed of second polysilazane.
The method according to claim 1,
The first polysilazane is a perhydro polysilazane organic light emitting display device.
The method according to claim 1,
The second polysilazane is a polysilazane having a hydrophobic functional group.
The method of claim 3,
The hydrophobic functional group is an organic light emitting display device of any one selected from a fluoro group, an alkyl group, a vinyl group or a cycloalkyl group.
The method according to claim 1,
The first silicon oxide layer has a greater density than the second silicon oxide layer.
The method according to claim 1,
The first silicon oxide layer is thicker than the second silicon oxide layer.
The method according to claim 1,
And a distance from a side surface of the organic light emitting diode to an outer side surface of the barrier is longer than a distance from an upper surface of the organic light emitting diode to an upper surface of the barrier.
Forming an organic light emitting diode including a first electrode, an organic film layer, and a second electrode on a substrate; And
And forming a barrier including a first polysilazane and a second polysilazane on the substrate on which the organic light emitting diode is formed.
The method of claim 8,
The barrier is formed by applying a solution in which the first polysilazane and the second polysilazane are mixed.
10. The method of claim 9,
And arranging a mask on the substrate on which the organic light emitting diode is formed before applying the mixed solution of the first polysilazane and the second polysilazane.
11. The method of claim 10,
And wherein the mask is formed with an opening that exposes an area where the organic light emitting diode is formed.
The method of claim 8,
The barrier is formed in the form of a film comprising a first silicon oxide film formed of the first polysilazane and the second silicon oxide film formed of the second polysilazane.
13. The method of claim 12,
The barrier in the form of a film is a method of manufacturing an organic light emitting display device is attached to the substrate on which the organic light emitting diode is formed.

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