JP2005209412A - Light-emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting device sufficiently protected from intrusion of moisture, of which a thickness can be reduced. <P>SOLUTION: An organic EL element 50 has a lamination structure of a hole injection electrode 2, a hole injection layer 3, a hole transport layer 4, a light-emitting layer 5, an electron transport layer 6, an electron injection layer 7, and an electron injection electrode 8, on a substrate 1. A protection layer 9 is formed so as to cover an area including the organic EL element 50. Afterwards, a water-repellent treatment film 12 made of carbon fluoride is formed on an outside area of the protection layer 9 at an outer peripheral part of the substrate 1. A resin layer 10 is formed so as to cover an upper part and outer peripheral part of the protection layer 9. Further, an inorganic layer 11 is formed so as to cover an upper part and outer peripheral part of the resin layer 10. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a light emitting device including a light emitting element.

  In recent years, with the advancement and diversification of advanced information society, there is an increasing demand for display devices that consume less power and are thinner than CRT (Cathode-Ray Tube) that has been generally used.

  In response to such demand, a display using an organic electroluminescence (hereinafter abbreviated as organic EL) element has characteristics such as low power consumption, high-speed response, thin and light weight, and no viewing angle dependency. Therefore, research and development are actively conducted because of its high potential.

  Here, the organic EL element means that an electron and a hole are respectively injected from an electron injection electrode and a hole injection electrode toward the light emitting portion, and these electrons and holes are recombined in the light emitting portion, thereby organically forming the light emitting portion. The molecule is excited and emits fluorescence when the organic molecule returns from the excited state to the ground state.

  On the other hand, since the organic EL element is very sensitive to moisture, a technique for blocking moisture is important. Generally, an organic EL element is sealed with a metal can, and a water absorbing agent is provided in the metal can.

  However, as described above, in the method of sealing the organic EL element with a metal can, it is difficult to reduce the thickness of the display using the organic EL element.

Therefore, development of a method for sealing an organic EL element that does not use a metal can is currently underway. For example, in the method for sealing an organic EL element disclosed in Patent Document 1, in order to seal an organic layer and an electrode, a resin film and aluminum oxide (Al ₂ O) are formed by an ALE (Atomic Layer Epitaxy) method. ₃ ) A laminated film is formed with the film. In this case, a resin film is provided to prevent pressure on the organic layer and the electrode due to internal stress of the aluminum oxide film.
JP 2002-151254 A

  However, as described above, when the aluminum oxide film is formed on the resin film in order to seal the organic layer and the electrode, the resin film may not be completely covered with the film. As a result, moisture penetrates into the organic layer through the resin film.

  An object of the present invention is to provide a light-emitting device that can be thinned and is sufficiently prevented from entering moisture.

  A light-emitting device according to the present invention includes a substrate, one or more light-emitting elements disposed on the substrate, and a sealing film that covers the one or more light-emitting elements, and the sealing film includes one or more sealing films. A resin layer formed so as to cover the region including the light emitting element and an inorganic layer formed so as to cover the resin layer and the outer peripheral portion of the resin layer are included.

  In the light emitting device according to the present invention, the resin layer is formed so as to cover a region including one or a plurality of light emitting elements arranged on the substrate. An inorganic layer is formed so as to cover the resin layer and the outer periphery of the resin layer.

  Accordingly, moisture can be prevented from entering the light emitting element through the resin layer. In addition, since the light-emitting element can be sealed without using a sealing can, the light-emitting device can be thinned.

  The light emitting device may further include a water repellent film formed at least outside the region on the substrate.

  In this case, the water-repellent treatment film prevents the resin layer from protruding outside the inorganic layer. Thereby, it is possible to reliably prevent moisture from entering the light emitting element.

  The water repellent film may be formed outside the region except for the inside of the region on the substrate.

  In this case, the water-repellent treatment film formed outside the region prevents the resin layer from protruding outside the inorganic layer. Thereby, it is possible to reliably prevent moisture from entering the light emitting element.

  The water repellent film may be formed over the entire area of the substrate. In this case, the water repellent film formed on the entire area of the substrate prevents the resin layer from protruding outside the inorganic layer. Thereby, it is possible to reliably prevent moisture from entering the light emitting element.

  Each of the one or more light-emitting elements includes a first electrode, an organic layer, and a second electrode in order on a substrate, and the water repellent film extends between the first electrode and the organic layer to inject carriers. It may function as a layer and / or a carrier transport layer.

  In this case, the water-repellent treatment film functions as a carrier injection layer and / or a carrier transport layer by providing the water-repellent treatment film so as to extend between the first electrode of the light emitting element and the organic layer. Thereby, a water repellent film, a carrier injection layer, and a carrier transport layer can be formed by a common process. As a result, the manufacturing time and manufacturing process can be reduced.

  The water repellent film may be made of fluorocarbon. In this case, since the fluorocarbon has excellent water repellency, the resin layer can be sufficiently prevented from protruding outside the inorganic layer.

  The light emitting element may be an organic electroluminescence (hereinafter abbreviated as “organic EL”) element. In this case, it is possible to reduce the thickness of the light emitting device and sufficiently prevent moisture from entering the organic EL element.

  According to the present invention, it is possible to prevent moisture from entering the light emitting element through the resin film. In addition, since the light-emitting element can be sealed without using a sealing can, the light-emitting device can be thinned.

  Hereinafter, an organic EL device will be described as an example of a light emitting device according to the present invention with reference to the drawings.

(First embodiment)
FIG. 1 is a schematic cross-sectional view of an organic EL device according to a first embodiment and second, third, and fourth embodiments described later, and FIG. 2 is an organic EL according to the first embodiment. It is the one part enlarged view of an apparatus.

  The organic EL device 100 according to the first and second embodiments has a bottom emission structure in which light is extracted from the lower surface side (side on which no element is formed on the substrate), and the third and fourth embodiments have the same structure. The organic EL device 100 has a top emission structure in which light is extracted from the upper surface side (side on which an element is formed on the substrate).

  Hereinafter, three directions orthogonal to each other are defined as an X direction, a Y direction, and a Z direction. The X direction and the Y direction are directions parallel to the surface of the substrate 1, and the Z direction is a direction perpendicular to the surface of the substrate 1. The plurality of organic EL elements 50 are arranged along the X direction and the Y direction.

  In the organic EL device 100 of FIG. 1, a plurality of hole injection electrodes 2 extending in the X direction are formed on a substrate 1. A plurality of organic EL elements 50 are arranged in a matrix on the hole injection electrode 2. Each organic EL element 50 constitutes a pixel. In the simple matrix type (passive type), a transparent glass substrate is used as the substrate 1. In the active matrix type, a TFT substrate having a plurality of TFTs (thin film transistors) and a planarizing layer on the transparent glass substrate is used as the substrate 1. Used. Details of the structure of the organic EL element 50 will be described later.

  A protective layer 9 is formed so as to cover a region including the plurality of organic EL elements 50. The protective layer 9 is made of silicon nitride (SiN) or the like. A resin layer 10 is formed so as to cover the protective layer 9 and the outer periphery of the protective layer 9. Furthermore, the inorganic layer 11 is formed so that the resin layer 10 and the outer peripheral part of the resin layer 10 may be covered. The resin layer 10 is made of acrylic resin or the like, and the inorganic layer 11 is made of silicon nitride or the like.

  As shown in FIG. 2, the organic EL element 50 has a stacked structure of a hole injection electrode 2, a hole injection layer 3, a hole transport layer 4, a light emitting layer 5, an electron transport layer 6, an electron injection layer 7, and an electron injection electrode 8. Have.

  The hole injection electrode 2 is arranged continuously or pixel by pixel along the X direction, and the electron injection electrode 8 is arranged along the Y direction. Adjacent organic EL elements 50 are separated by an element isolation insulating layer (not shown) made of a resist material.

  In the present embodiment, after the protective layer 9 is formed so as to cover the region including each organic EL element 50, the region outside the protective layer 9 in the outer peripheral portion on the substrate 1 is made of fluorocarbon (CFx). A water repellent film 12 is formed. A method for forming the water repellent film 12 will be described later.

The hole injection electrode 2 is a transparent electrode made of a metal compound such as ITO (indium-tin oxide) having a thickness of 800 mm, for example, formed on the substrate 1 by RF (high frequency) sputtering. For example, argon (Ar) gas is used as the sputtering gas. The pressure during film formation is, for example, 1.5 × 10 ⁻¹ Pa, and the RF output is, for example, 200 W.

  The hole injection layer 3 is formed on the hole injection electrode 2 by a vacuum deposition method, and is made of copper phthalocyanine (hereinafter abbreviated as CuPc) represented by the following formula (1). The thickness of the hole injection layer 3 is, for example, 100 mm.

  The hole transport layer 4 is formed on the hole injection layer 3 by a vacuum deposition method, and N, N′-di (naphthalen-1-yl) -N, N′-diphenyl-benzidine represented by the following formula (2) ( N, N′-Di (naphthalene-1-yl) -N, N′-diphenyl-benzidine (hereinafter abbreviated as NPB)). The thickness of the hole transport layer 4 is, for example, 500 mm.

  The light emitting layer 5 is formed on the hole transport layer 4 by a vacuum deposition method, and is represented by the following formula (3): Tris (8-hydroxyquinolinato) aluminum (hereinafter abbreviated as Alq). ) Etc.

  The electron transport layer 6 is formed on the light emitting layer 5 by a vacuum deposition method and is made of Alq or the like. The total thickness of the light emitting layer 5 and the electron transport layer 6 is, for example, 500 mm.

  The electron injection layer 7 is formed on the electron transport layer 6 by a vacuum deposition method, and is made of a halide such as LiF (lithium fluoride). The electron injection layer 7 has a thickness of 5 mm, for example.

The pressure at the time of film formation of the hole injection layer 3, the hole transport layer 4, the light emitting layer 5, the electron transport layer 6 and the electron injection layer 7 is, for example, 5.0 × 10 ⁻⁵ Pa.

The electron injection electrode 8 is formed on the electron injection layer 7 by a vacuum deposition method and is made of aluminum or the like. The thickness of the electron injection electrode 8 is, for example, 1000 mm, and the pressure during film formation is, for example, 1.0 × 10 ⁻⁴ Pa.

  Next, a method for manufacturing the organic EL device 100 according to the present embodiment will be described.

  FIG. 3 is a schematic diagram showing a procedure for manufacturing the organic EL device 100 according to the present embodiment. A plan view of the organic EL device 100 is shown on the left side of FIGS. 3A to 3D, and a cross-sectional view taken along line AA in this plan view is shown on the right side. FIG. 3 shows an organic EL device 100 having 2 × 2 pixels in order to simplify the illustration.

  First, a hole injection electrode 2, a hole injection layer 3, a hole transport layer 4, a light emitting layer 5, an electron transport layer 6, an electron injection layer 7, and an electron injection electrode 8 are sequentially formed on the substrate 1 by the method described above. To do.

  Thereafter, as shown in FIG. 3A, the protective layer 9 is formed so as to cover the plurality of organic EL elements 50 by ECR (electron cyclotron resonance) sputtering using a predetermined mask. The protective layer 9 is made of silicon nitride, and the thickness of the protective layer 9 is, for example, 1000 mm.

The pressure at the time of forming the protective layer 9 is, for example, 1.9 × 10 ⁻¹ Pa, and the RF output is, for example, 300 W. As the sputtering gas, for example, a mixed gas of argon (Ar) gas and nitrogen (N ₂ ) gas is used. In this case, the flow rate ratio of nitrogen gas to argon gas is, for example, 22%. The area where the protective layer 9 is formed is denoted by a.

  Next, as shown in FIG. 3B, a water repellent film is formed on the outer region of the outer peripheral portion of the substrate 1 by plasma CVD (chemical vapor deposition) using a predetermined mask. 12 is formed. In this case, when the surface area of the predetermined mask is a ′, the relationship a′≈a (a ′> a) is established.

The water repellent film 12 is made of, for example, carbon fluoride (CFx). Trifluoromethane (CHF ₃ ) or the like is used as a source gas. The pressure at the time of forming the water repellent film 12 is, for example, 20 Pa, and the applied power of the bias voltage is, for example, 100 W. The film formation time of the water repellent film 12 is, for example, 10 seconds.

  Next, as shown in FIG. 3C, a resin layer 10 is applied so as to cover the region including the protective layer 9 by spin coating using a mask having a predetermined opening. Since the resin is repelled on the water repellent film 12, the resin layer 10 is not formed. The resin layer 10 is made of, for example, acrylic resin, and the thickness of the resin layer 10 is, for example, 5 μm. When the area where the resin layer 10 is applied is b, the relationship b≈a ′ (b <a ′) is established.

  Next, as shown in FIG. 3D, the inorganic layer 11 is formed so as to cover the region including the resin layer 10 using a predetermined mask. The thickness of the inorganic layer 11 is, for example, 1000 mm, and the film formation method and film formation conditions are the same as those of the protective layer 9. When the area where the inorganic layer 11 is formed is c, the relationship c >> b is established. That is, the upper surface and the outer periphery of the resin layer 10 are covered with the inorganic layer 11.

  In the present embodiment, resin layer 10 is formed so as to cover a region including one or more organic EL elements 50 arranged on substrate 1. Moreover, the inorganic layer 11 is formed so that the resin layer 10 and the outer peripheral part of the resin layer 10 may be covered. Thereby, moisture can be prevented from entering the organic EL element 50 through the resin layer 10. Moreover, since the organic EL element 50 can be sealed without using a sealing can, the organic EL device 100 can be thinned.

  Further, since the water repellent film 12 is formed on the substrate 1 outside the area except for the inside of the area including the organic EL element 50, the water repellent film 12 formed on the outside of the area is used as a resin. The layer 10 is prevented from protruding outside the inorganic layer 11. Thereby, it is possible to reliably prevent moisture from entering the organic EL element 50.

  In the present embodiment, the hole injection electrode 2 corresponds to the first electrode, the hole injection layer 3, the hole transport layer 4, the light emitting layer 5, the electron transport layer 6 and the electron injection layer 7 correspond to an organic layer, The electron injection electrode 8 corresponds to the second electrode, the organic EL element 50 corresponds to the organic electroluminescent element, the organic EL device 100 corresponds to the organic electroluminescent device, and the hole injection layer 3 corresponds to the carrier injection layer. The hole transport layer 4 corresponds to the carrier transport layer.

  Although carbon fluoride is used as the water-repellent treatment film 12, other water-repellent inorganic films such as titanium oxide, organic films, etc. may be used, and acrylic resin is used as the resin layer 10. Other resins such as an epoxy resin may be used. Furthermore, the material of the inorganic layer 11 is not limited to silicon nitride, and other various inorganic materials such as silicon oxide and aluminum nitride can be used alone or in a stacked manner.

  Further, the water repellent film 12 may be formed before the protective layer 9 is formed, or the resin layer 10 may be applied by spraying using a predetermined mask.

  Further, a sealing can may be further provided on the substrate 1 so as to cover a region including the inorganic layer 11.

  Further, an electron injection electrode, an electron injection layer, an electron transport layer, a light emitting layer, a hole transport layer, a hole injection layer, and a hole injection electrode may be sequentially stacked on the substrate 1.

(Second Embodiment)
FIG. 4 is an enlarged view of a part of the organic EL device according to the second embodiment.

  As shown in FIG. 4, the organic EL device according to the present embodiment is different from the organic EL device 100 according to the first embodiment in the following points.

  In this embodiment, after forming the hole injection electrode 2 on the substrate 1, the water repellent film 12 is formed on the entire area of the substrate 1. Thereafter, the hole injection layer 3 in FIG. 2 is not formed, and the hole transport layer 4, the light emitting layer 5, the electron transport layer 6, the electron injection layer 7, the electron injection electrode 8, and the protective layer are formed as in the first embodiment. 9, the resin layer 10 and the inorganic layer 11 are formed in order. The film forming method will be described later.

  The thickness of the hole transport layer 4 is, for example, 600 mm, and the thickness of the electron transport layer 6 is, for example, 600 mm.

  Except for the above points, the organic EL device according to the present embodiment is manufactured using the same materials and configuration as those of the organic EL device 100 according to the first embodiment.

  Next, a method for manufacturing the organic EL device according to this embodiment will be described. The manufacturing method of the organic EL device according to the present embodiment is different from the manufacturing method of the organic EL device 100 according to the first embodiment in that the film formation time of the water repellent film 12 is, for example, 20 seconds. is there.

  FIG. 5 is a schematic diagram showing a procedure for manufacturing the organic EL device according to the present embodiment. A plan view of the organic EL device is shown on the left side of FIGS. 5A to 5D, and a cross-sectional view taken along the line BB in this plan view is shown on the right side. FIG. 5 shows an organic EL device having 2 × 2 pixels for the sake of simplicity.

  First, the hole injection electrode 2 is formed on the substrate 1 by the method described above. Thereafter, as shown in FIG. 5A, a water repellent film 12 is formed over the entire area of the substrate 1 by plasma CVD.

  Next, as shown in FIG. 5B, the hole transport layer 4, the light emitting layer 5, the electron transport layer 6, the electron injection layer 7, and the electron injection electrode 8 are formed on the water repellent film 12.

  Next, as shown in FIG. 5C, the protective layer 9 is formed so as to cover the plurality of organic EL elements 50 by ECR sputtering using a predetermined mask. The area where the protective layer 9 is formed is d.

  Next, as shown in FIG. 5D, a resin layer 10 is applied so as to cover the region including the protective layer 9 by spin coating using a mask having a predetermined opening. In this case, the outer peripheral portion of the resin layer 10 is repelled by the water-repellent treatment film 12, so that the resin layer 10 is formed on the water-repellent treatment film 12 in a shape corresponding to the opening of the mask without expanding. When the area where the resin layer 10 is applied is represented by e, the relationship of e≈d (e> d) is established.

  Next, as shown in FIG. 5E, the inorganic layer 11 is formed so as to cover the region including the resin layer 10 using a predetermined mask. When the area where the inorganic layer 11 is formed is f, the relationship f >> e is established. That is, the upper surface and the outer periphery of the resin layer 10 are covered with the inorganic layer 11.

  In the present embodiment, resin layer 10 is formed so as to cover a region including one or more organic EL elements 50 arranged on substrate 1. Moreover, the inorganic layer 11 is formed so that the resin layer 10 and the outer peripheral part of the resin layer 10 may be covered. Thereby, moisture can be prevented from entering the organic EL element 50 through the resin layer 10. Moreover, since the organic EL element 50 can be sealed without using a sealing can, the organic EL device 100 can be thinned.

  Further, since the water repellent film 12 is formed over the entire area of the substrate 1, the resin layer 10 is prevented from protruding outside the inorganic layer 11 by the water repellent film 12 formed over the entire area of the substrate 1. The Thereby, it is possible to reliably prevent moisture from entering the organic EL element 50.

  Further, since the water repellent film 12 is provided so as to extend between the hole injection electrode 2 and the hole transport layer 4, the water repellent film 12 functions as a hole injection layer. Thereby, the water repellent film 12 and the hole injection layer can be formed by a common process. As a result, the manufacturing time and manufacturing process can be reduced.

  Note that the water repellent film 12 having a hole transport function may be provided without providing the hole transport layer 4.

  Further, an electron injection layer, an electron transport layer, a light emitting layer, a hole transport layer, and a hole injection layer may be sequentially stacked on the substrate 1. In this case, by using a film having an electron injection function or an electron transport function as the water repellent treatment film 12, the water repellent treatment film 12 and the electron injection layer or the electron transport layer can be formed by a common process.

(Third embodiment)
FIG. 6 is an enlarged view of a part of the organic EL device according to the third embodiment.

  As shown in FIG. 6, the organic EL device according to the present embodiment is different from the organic EL device 100 according to the first embodiment in the following points.

  In the present embodiment, for example, molybdenum (Mo) is used as the hole injection electrode 2 formed on the substrate 1. The thickness of the hole injection electrode 2 is, for example, 1000 mm.

Further, for example, lithium oxide (Li ₂ O) is used as the electron injection layer 7 formed on the electron transport layer 6. The electron injection layer 7 has a thickness of 15 mm, for example.

  Further, a stacked structure of a metal thin film 8 a and a transparent conductive film 8 b is used as the electron injection electrode 8 formed on the electron injection layer 7. In this case, for example, silver (Ag) is used as the metal thin film 8a. The thickness of the metal thin film 8a is, for example, 150 mm.

The transparent conductive film 8b is formed on the metal thin film 8a by ECR sputtering. In this case, for example, IZO (indium zinc oxide) is used as the transparent conductive film 8b. The thickness of the transparent conductive film 8b is, for example, 1000 mm. The pressure at the time of forming the transparent conductive film 8b is, for example, 1.9 × 10 ⁻¹ Pa, and the RF output is, for example, 300 W. For example, a mixed gas of argon gas and oxygen gas is used as the sputtering gas, and the flow rate ratio of oxygen gas to argon gas is 0.3%, for example.

  In the present embodiment, resin layer 10 is formed so as to cover a region including one or more organic EL elements 50 arranged on substrate 1. Moreover, the inorganic layer 11 is formed so that the resin layer 10 and the outer peripheral part of the resin layer 10 may be covered. Thereby, moisture can be prevented from entering the organic EL element 50 through the resin layer 10. Moreover, since the organic EL element 50 can be sealed without using a sealing can, the organic EL device 100 can be thinned.

  Further, since the water repellent film 12 is formed on the substrate 1 outside the area except for the inside of the area including the organic EL element 50, the water repellent film 12 formed on the outside of the area is used as a resin. The layer 10 is prevented from protruding outside the inorganic layer 11. Thereby, it is possible to reliably prevent moisture from entering the organic EL element 50.

(Fourth embodiment)
FIG. 7 is an enlarged view of a part of the organic EL device according to the fourth embodiment.

  As shown in FIG. 7, the organic EL device according to the present embodiment is different from the organic EL device according to the second embodiment in the following points.

  In the present embodiment, for example, molybdenum is used as the hole injection electrode 2 formed on the substrate 1. The thickness of the hole injection electrode 2 is, for example, 1000 mm.

  Further, for example, lithium oxide is used as the electron injection layer 7 formed on the electron transport layer 6. The electron injection layer 7 has a thickness of 15 mm, for example.

  Further, a stacked structure of a metal thin film 8 a and a transparent conductive film 8 b is used as the electron injection electrode 8 formed on the electron injection layer 7. In this case, for example, silver is used as the metal thin film 8a. The thickness of the metal thin film 8a is, for example, 150 mm.

The transparent conductive film 8b is formed on the metal thin film 8a by ECR sputtering. In this case, for example, IZO is used as the transparent conductive film 8b. The thickness of the transparent conductive film 8b is, for example, 1000 mm. The pressure at the time of forming the transparent conductive film 8b is, for example, 1.9 × 10 ⁻¹ Pa, and the RF output is, for example, 300 W. For example, a mixed gas of argon gas and oxygen gas is used as the sputtering gas, and the flow rate ratio of oxygen gas to argon gas is 0.3%, for example.

  In the present embodiment, resin layer 10 is formed so as to cover a region including one or more organic EL elements 50 arranged on substrate 1. Moreover, the inorganic layer 11 is formed so that the resin layer 10 and the outer peripheral part of the resin layer 10 may be covered. Thereby, moisture can be prevented from entering the organic EL element 50 through the resin layer 10. Moreover, since the organic EL element 50 can be sealed without using a sealing can, the organic EL device 100 can be thinned.

  Further, since the water repellent film 12 is formed over the entire area of the substrate 1, the resin layer 10 is prevented from protruding outside the inorganic layer 11 by the water repellent film 12 formed over the entire area of the substrate 1. The Thereby, it is possible to reliably prevent moisture from entering the organic EL element 50.

  Further, since the water repellent film 12 is provided so as to extend between the hole injection electrode 2 and the hole transport layer 4, the water repellent film 12 functions as a hole injection layer. Thereby, the water repellent film 12 and the hole injection layer can be formed by a common process. As a result, the manufacturing time and manufacturing process can be reduced.

  Note that the water repellent film 12 having a hole transport function may be provided without providing the hole transport layer 4.

(Fifth embodiment)
FIG. 8 is a schematic diagram of an organic EL device according to the fifth embodiment. FIG. 8A is a schematic plan view of the organic EL device according to the present embodiment, and FIG. 8B is a cross-sectional view taken along line CC of the organic EL device according to the present embodiment.

  As shown in FIGS. 8A and 8B, the organic EL device 200 has a top emission structure and is configured by a single organic EL element. The organic EL device 200 is used as a backlight of a liquid crystal display device, for example.

  A hole injection electrode 2 is formed on the glass substrate 1. An organic compound layer 51 is formed on the hole injection electrode 2 made of metal, alloy, or the like. The organic compound layer 51 has a stacked structure of, for example, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer. An electron injection electrode 8 made of a transparent conductive film is formed on the organic compound layer 51. The organic EL element 52 includes a hole injection electrode 2, an organic compound layer 51, and an electron injection electrode 8.

  Further, the protective layer 9 is formed so as to cover the region including the organic compound layer 51 and the electron injection electrode 8. After the protective layer 9 is formed, a water repellent film 12 made of fluorocarbon (CFx) is formed in a region outside the protective layer 9 on the outer peripheral portion on the substrate 1.

  Further, a resin layer 10 is formed so as to cover the protective layer 9 and the outer periphery of the protective layer 9. An inorganic layer 11 is formed so as to cover the resin layer 10 and the outer periphery of the resin layer 10.

  In the present embodiment, resin layer 10 is formed so as to cover a region including organic EL element 52 arranged on substrate 1. Moreover, the inorganic layer 11 is formed so that the resin layer 10 and the outer peripheral part of the resin layer 10 may be covered. Thereby, moisture can be prevented from entering the organic EL element 52 through the resin layer 10. Moreover, since the organic EL element 52 can be sealed without using a sealing can, the organic EL device 200 can be thinned.

  Further, since the water repellent film 12 is formed on the substrate 1 outside the region except for the inside of the region including the organic EL element 52, the water repellent film 12 formed on the outside of the region is used as a resin. The layer 10 is prevented from protruding outside the inorganic layer 11. Thereby, it is possible to reliably prevent moisture from entering the organic EL element 52.

  In the present embodiment, the hole injection electrode 2 corresponds to the first electrode, the organic compound layer 51 corresponds to the organic layer, the electron injection electrode 8 corresponds to the second electrode, and the organic EL element 52 is organic. It corresponds to an electroluminescent element, and the organic EL device 200 corresponds to an organic electroluminescent device.

(Sixth embodiment)
FIG. 9 is a schematic diagram of an organic EL device according to a sixth embodiment. FIG. 9A is a schematic plan view of the organic EL device according to the present embodiment, and FIG. 9B is a sectional view taken along the line DD of the organic EL device according to the present embodiment.

  As shown in FIGS. 9A and 9B, the organic EL device 201 has a top emission structure and is configured by a single organic EL element. The organic EL device 201 is used as a backlight of a liquid crystal display device, for example.

  A hole injection electrode 2 is formed on the glass substrate 1. A water repellent film 12 made of fluorocarbon (CFx) is formed on the entire area of the substrate 1 on which the hole injection electrode 2 is formed.

  On the water repellent film 12, an organic compound layer 51 is formed. The organic compound layer 51 has, for example, a stacked structure of a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer. In this case, a hole injection layer made of CuPc, for example, may be separately formed between the water repellent film 12 and the hole transport layer.

  An electron injection electrode 8 made of a transparent conductive film is formed on the organic compound layer 51. The organic EL element 52 includes a hole injection electrode 2, an organic compound layer 51, and an electron injection electrode 8.

  Further, the protective layer 9 is formed so as to cover the region including the organic compound layer 51 and the electron injection electrode 8.

  Further, a resin layer 10 is formed so as to cover the protective layer 9 and the outer periphery of the protective layer 9. An inorganic layer 11 is formed so as to cover the resin layer 10 and the outer periphery of the resin layer 10.

  In the present embodiment, resin layer 10 is formed so as to cover a region including organic EL element 52 arranged on substrate 1. Moreover, the inorganic layer 11 is formed so that the resin layer 10 and the outer peripheral part of the resin layer 10 may be covered. Thereby, moisture can be prevented from entering the organic EL element 52 through the resin layer 10. Moreover, since the organic EL element 52 can be sealed without using a sealing can, the organic EL device 201 can be thinned.

  Further, since the water repellent film 12 is formed over the entire area of the substrate 1, the resin layer 10 is prevented from protruding outside the inorganic layer 11 by the water repellent film 12 formed over the entire area of the substrate 1. The Thereby, it is possible to reliably prevent moisture from entering the organic EL element 52.

  Further, since the water repellent treatment film 12 is provided so as to extend between the hole injection electrode 2 and the organic compound layer 51, the water repellent treatment film 12 functions as a hole injection layer. Thereby, the water repellent film 12 and the hole injection layer can be formed by a common process. As a result, the manufacturing time and manufacturing process can be reduced.

  The water repellent film 12 having a hole transport function may be provided without providing the hole transport layer.

  In the present embodiment, the hole injection electrode 2 corresponds to the first electrode, the organic compound layer 51 corresponds to the organic layer, the electron injection electrode 8 corresponds to the second electrode, and the organic EL element 52 is organic. It corresponds to an electroluminescent element, and the organic EL device 201 corresponds to an organic electroluminescent device.

  Hereinafter, the organic EL devices of Examples 1 to 4 and Comparative Examples 1 and 2 were manufactured based on the first to fourth embodiments, and the edge growth of the manufactured organic EL devices was measured. In this example, a constant temperature and humidity test of the organic EL device was performed, and edge growth after 1000 hours was measured.

  Here, the edge growth refers to the ratio of the non-light emitting area that stops emitting light due to the influence of moisture or the like on the light emitting area of the organic EL element in the initial state (before the constant temperature and humidity test).

(1) Examples 1 and 2 and Comparative Example 1
In Example 1, an organic EL device having the same structure as that of the organic EL device 100 according to the first embodiment is manufactured. In Example 2, the same structure as that of the organic EL device according to the second embodiment is prepared. An organic EL device having was produced. In Comparative Example 1, an organic EL device having the same structure as that of the organic EL device 100 of Example 1 was manufactured except that the water-repellent treatment film 12 was not formed.

  FIG. 10 is a diagram showing the results of the constant temperature and humidity test of the organic EL devices of Examples 1 and 2 and Comparative Example 1.

  As shown in FIG. 10, the edge growth after 1000 hours of the organic EL device 100 of Example 1 was 0.6%. Further, the edge growth after 1000 hours of the organic EL device of Example 2 was 0.4%.

  On the other hand, the edge growth after 1000 hours of the organic EL device of Comparative Example 1 was 12%.

  From the above results, it was found that the organic EL device having the water repellent treatment film 12 has a significantly lower edge growth value than the organic EL device having no water repellent treatment film 12.

  FIG. 11 is a diagram illustrating a non-light-emitting portion by a constant temperature and humidity test of the organic EL devices of Examples 1 and 2 and Comparative Example 1.

  11A shows the light emitting unit in the initial state of the organic EL device 100 of Example 1, and the lower part of FIG. 11A shows the light emitting unit after 1000 hours of the organic EL device 100 of Example 1. FIG. Indicates. In the lower part of FIG. 11A, the part indicated by a dotted circle is a non-light-emitting part that does not emit light by the constant temperature and humidity test.

  11B shows the light emitting part in the initial state of the organic EL device of Comparative Example 1, and the lower part of FIG. 11B shows the light emitting part after 1000 hours of the organic EL device of Comparative Example 1. FIG. . In the lower part of FIG. 11B, the part indicated by a dotted circle is a non-light-emitting part that does not emit light by the constant temperature and humidity test.

  11C shows the light emitting part in the initial state of the organic EL device of Example 2, and the lower part of FIG. 11C shows the light emitting part after 1000 hours of the organic EL device of Example 2. FIG. . In the lower part of FIG. 11 (c), the part indicated by a dotted circle is a non-light-emitting part that does not emit light by the constant temperature and humidity test.

  11A, 11B, and 11C, the non-light-emitting portion of the organic EL device of Comparative Example 1 is much less than the non-light-emitting portion of the organic EL devices of Examples 1 and 2, respectively. You can see that it is getting bigger.

  As described above, the organic EL device forms the water-repellent treatment film 12 on the outer peripheral portion of the substrate 1 on the outer region of the protective layer 9 or on the entire region of the substrate 1, thereby allowing moisture to enter the organic EL element 50. It can be seen that infiltration can be sufficiently prevented.

(2) Examples 3 and 4 and Comparative Example 2
In Example 3, an organic EL device having the same structure as that of the organic EL device according to the third embodiment is manufactured. In Example 4, the same structure as that of the organic EL device according to the fourth embodiment is prepared. An organic EL device was prepared. In Comparative Example 2, an organic EL device having the same structure as that of the organic EL device of Example 3 was manufactured except that the water-repellent treatment film 12 was not formed.

  FIG. 12 is a diagram showing the results of the constant temperature and humidity test of the organic EL devices of Examples 3 and 4 and Comparative Example 2.

  As shown in FIG. 12, the edge growth after 1000 hours of the organic EL device of Example 3 was 0.7%. Further, the edge growth after 1000 hours of the organic EL device of Example 4 was 0.9%.

  On the other hand, the edge growth after 1000 hours of the organic EL device of Comparative Example 2 was 16%.

  From the above results, it was found that the organic EL device having the water repellent treatment film 12 has a significantly lower edge growth value than the organic EL device having no water repellent treatment film 12.

  As described above, the organic EL device forms the water-repellent treatment film 12 on the outer peripheral portion of the substrate 1 on the outer region of the protective layer 9 or on the entire region of the substrate 1, thereby allowing moisture to enter the organic EL element 50. It can be seen that infiltration can be sufficiently prevented.

  The present invention can be used as a light emitting device capable of preventing moisture and the like from entering the light emitting element.

It is a typical sectional view of an organic EL device concerning the 1st, 2nd, 3rd, and 4th embodiment. 1 is an enlarged view of a part of an organic EL device according to a first embodiment. It is a schematic diagram which shows the procedure of manufacture of the organic electroluminescent apparatus which concerns on 1st Embodiment. It is a one part enlarged view of the organic electroluminescent apparatus concerning 2nd Embodiment. It is a schematic diagram which shows the procedure of manufacture of the organic electroluminescent apparatus which concerns on 2nd Embodiment. It is a one part enlarged view of the organic electroluminescent apparatus concerning 3rd Embodiment. It is a one part enlarged view of the organic electroluminescent apparatus which concerns on 4th Embodiment. It is a schematic diagram of the organic electroluminescent apparatus which concerns on 5th Embodiment. It is a schematic diagram of the organic electroluminescent apparatus which concerns on 6th Embodiment. It is a figure which shows the result of the constant temperature / humidity test of the organic EL apparatus of Examples 1, 2 and Comparative Example 1. It is a figure which shows the non-light-emission part by the constant temperature and humidity test of the organic EL apparatus of Example 1, 2 and the comparative example 1. FIG. It is a figure which shows the result of the constant temperature and humidity test of the organic EL apparatus of Example 3, 4 and the comparative example 2. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate 2 Hole injection electrode 3 Hole injection layer 4 Hole transport layer 5 Light emitting layer 6 Electron transport layer 7 Electron injection layer 8 Electron injection electrode 9 Protective layer 10 Resin layer 11 Inorganic layer 12 Water repellent film 50, 52 Organic EL element 51 Organic compound layer 100, 200, 201 Organic EL device

Claims (7)

A substrate,
One or more light-emitting elements disposed on the substrate;
A sealing film covering the one or more light emitting elements,
The sealing film includes a resin layer formed so as to cover a region including the one or more light emitting elements,
And an inorganic layer formed so as to cover the resin layer and an outer peripheral portion of the resin layer. The light emitting device according to claim 1, further comprising a water repellent film formed on at least the outside of the region on the substrate. 3. The light emitting device according to claim 2, wherein the water repellent film is formed on the substrate outside the region except for the inside of the region. The light emitting device according to claim 2, wherein the water repellent film is formed over the entire area of the substrate. Each of the one or more light-emitting elements includes a first electrode, an organic layer, and a second electrode in order on a substrate,
The light-emitting device according to claim 4, wherein the water repellent film extends between the first electrode and the organic layer and functions as a carrier injection layer and / or a carrier transport layer. The light emitting device according to claim 2, wherein the water repellent film is made of fluorocarbon. The light emitting device according to claim 1, wherein the light emitting element is an organic electroluminescence element.

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