KR101761410B1 - Organic Light Emitting Display Device And Method For Manufacturing Of The Same - Google Patents

Abstract

An organic light emitting display according to an embodiment of the present invention includes a substrate, an organic light emitting diode (OLED) including a first electrode, an organic layer, and a second electrode, and a protective layer covering the organic light emitting diode, May include a first adhesive layer, a first hydrophobic coating layer, and a first barrier layer.

Description

Technical Field [0001] The present invention relates to an organic light emitting display device,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic light emitting display device and a method of manufacturing the same, and more particularly, to an organic light emitting display device and a method of manufacturing the same.

2. Description of the Related Art In recent years, the importance of flat panel displays (FPDs) has been increasing with the development of multimedia. In accordance with this, a liquid crystal display (LCD), a plasma display panel (PDP), a field emission display (FED), an organic light emitting display device Various flat-panel displays have been put into practical use.

Particularly, the organic light emitting display device has a response speed of 1 ms or less, a high response speed, low power consumption, and self light emission. In addition, there is no problem in the viewing angle, which is advantageous as a moving picture display medium regardless of the size of the apparatus. In addition, since it can be manufactured at a low temperature and the manufacturing process is simple based on the existing semiconductor process technology, it is attracting attention as a next generation flat panel display device.

Conventionally, an organic light emitting display has been manufactured by forming an organic light emitting diode including a first electrode, an organic layer, and a second electrode on a substrate, sealing the sealing substrate made of glass or metal and the substrate with an adhesive. However, the organic electroluminescent display device is difficult to realize a thin shape by use of an encapsulating substrate, and has a problem of poor durability.

In recent years, a plurality of thin films such as inorganic films are stacked on an organic light emitting diode and sealed to manufacture an organic light emitting display. However, there is a problem that the organic light emitting diode is damaged due to the use of the dry deposition method in the inorganic film deposition.

Accordingly, the present invention provides an organic electroluminescent display device and a method of manufacturing the same that prevent defective elements due to moisture permeation and are easy to process.

According to an aspect of the present invention, there is provided an organic light emitting display including a substrate, an organic light emitting diode (OLED) disposed on the substrate and including a first electrode, an organic layer, and a second electrode, The protective film may include a first adhesive layer, a first hydrophobic coating layer, and a first barrier layer.

The protective film may be laminated in the order of the first adhesive layer, the first hydrophobic coating layer, and the first barrier layer.

A second barrier layer may be further laminated between the first adhesive layer and the first hydrophobic coating layer.

A second adhesive layer and a second hydrophobic coating layer may be further laminated between the organic light emitting diode and the first adhesive layer.

The barrier layer includes an inorganic material and may be composed of silicon oxide (SiOx) or silicon nitride (SiNx).

The first and second hydrophobic coating layers may be formed of at least one selected from the group consisting of silicon oil, hexamethyldisilazane (HMDS), trimethyl chlorosilane (TMSCL), amino silane, alkyl silane, polydimethyl siloxane (PDMS) dichlorosilane, and the like.

The first and second hydrophobic coating layers may be at least one selected from the group consisting of parylene monomer, parylene dimer, polyethylene monomer, dianhydrides and diamines. And a polyimide monomer.

The first and second hydrophobic coating layers may be formed of at least one selected from high density polyethylene (HDPE) and polyimide.

According to another aspect of the present invention, there is provided a method of fabricating an organic light emitting display, comprising: forming an organic light emitting diode including a first electrode, an organic layer, and a second electrode on a substrate; Forming a protective film film including a first barrier layer, a coating layer, and a first barrier layer on the substrate; and attaching the protective film film on the substrate on which the organic light emitting diode is formed to form the first adhesive layer, the first hydrophobic coating layer, To form a second layer.

In the forming of the protective film, the first hydrophobic coating layer may be formed by one method selected from the group consisting of a vapor deposition method, a sputtering method and a vacuum deposition method.

INDUSTRIAL APPLICABILITY The organic electroluminescence display device and the method of manufacturing the same of the present invention have an advantage that the organic light emitting diode can be prevented from being damaged by attaching the protective film on the organic light emitting diode in the form of a film without using a chemical or physical vapor deposition method.

In addition, there is an advantage that moisture permeation and damage to the organic light emitting diode can be prevented by the excellent chemical resistance, water resistance and moisture resistance of the hydrophobic coating layer and physical barrier property of the barrier layer.

1 is a plan view showing an organic light emitting display according to an embodiment of the present invention.
2 is a sectional view of an organic light emitting display according to an embodiment of the present invention, taken along line I-I 'of FIG.
3 and 4 are cross-sectional views illustrating an organic light emitting display according to an exemplary embodiment of the present invention.
5A through 5C are cross-sectional views illustrating a method of manufacturing an organic light emitting display according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a plan view showing an organic light emitting display according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view illustrating an organic light emitting display according to an embodiment of the present invention taken along line I-I ' .

1 and 2, an organic light emitting display device 10 according to an exemplary embodiment of the present invention includes an organic light emitting diode 200 disposed on a substrate 100, a protective layer 200 covering the organic light emitting diode 200, (300).

More specifically, the organic light emitting diode 200 is located on the substrate 100. The substrate 100 may be made of glass, plastic, or a transparent substrate made of a conductive material. In order to protect the organic light emitting diode formed in a subsequent process from impurities such as these substrates alkali ions leaked from the substrate 100. On 100, a buffer layer 110 such as silicon oxide (SiO _2), silicon nitride (SiNx) .

An organic light emitting diode 200 including a first electrode 210, an organic layer 230 and a second electrode 240 is disposed on the substrate 100.

The first electrode 210 may be an anode, and may be a transparent electrode or a reflective electrode. When the first electrode 210 is a transparent electrode, the first electrode 210 may be one of indium tin oxide (ITO), indium zinc oxide (IZO), and zinc oxide (ZnO). When the first electrode 210 is a reflective electrode, the first electrode 210 may be formed of one of aluminum (Al), silver (Ag), and nickel (Ni) under the layer of any one of ITO, IZO, And may further include a reflective layer made of any one of them and may include the reflective layer between two layers made of any one of ITO, IZO and ZnO.

The first electrode 210 may be formed using a sputtering method, an evaporation method, a vapor phase deposition method, or an electron beam deposition method.

An insulating layer 220 is formed on the substrate 100 on which the first electrode 210 is formed to expose a part of the first electrode 210. The insulating layer 220 may include organic materials such as benzocyclobutene (BCB) resin, acrylic resin or polyimide resin, but is not limited thereto.

The organic layer 230 is positioned on the first electrode 210 exposed by the insulating layer 220. The organic layer 230 may include at least a light emitting layer and may further include a hole injecting layer, a hole transporting layer, an electron transporting layer, or an electron injecting layer on the upper or lower portion of the light emitting layer.

The hole injection layer may function to smoothly inject holes from the first electrode 210 into the light emitting layer, and may be formed of at least one of cupper phthalocyanine, PEDOT (poly (3,4) -ethylenedioxythiophene), PANI (polyaniline) And NPD (N, N-dinaphthyl-N, N'-diphenyl benzidine), but the present invention is not limited thereto.

The hole transport layer plays a role of facilitating the transport of holes, and it is preferable to use a hole transport layer such as NPD (N-dinaphthyl-N, N'-diphenyl benzidine), TPD (N, N'- -bis- (phenyl) -benzidine), s-TAD and 4,4 ', 4 "-tris (N-3-methylphenyl-N- phenylamino) -triphenylamine But is not limited thereto.

The light emitting layer may be formed of a material that emits red, green, and blue light, and may be formed using phosphorescent or fluorescent materials.

When the light emitting layer is red, it includes a host material including CBP (carbazole biphenyl) or mCP (1,3-bis (carbazol-9-yl) , PQIr (acac) (bis (1-phenylquinoline) acetylacetonate iridium), PQIr (tris (1-phenylquinoline) iridium) and PtOEP (octaethylporphyrin platinum) Alternatively, it may be made of a fluorescent material including PBD: Eu (DBM) ₃ (Phen) or Perylene, but not limited thereto.

And a phosphorescent material including a dopant material including Ir (ppy) 3 (fac tris (2-phenylpyridine) iridium), which includes a host material including CBP or mCP when the light emitting layer is green, Alternatively, it may be made of a fluorescent material including Alq3 (tris (8-hydroxyquinolino) aluminum), but is not limited thereto.

(4,6-F ₂ ppy) ₂ Irpic when the emissive layer is blue, and a host material comprising CBP or mCP. Alternatively, the phosphorescent material may comprise a spiro- But is not limited to, a fluorescent material including any one selected from the group consisting of DPVBi, spiro-6P, distyrylbenzene (DSB), distyrylarylene (DSA), PFO-based polymer and PPV-based polymer.

The electron transport layer plays a role of facilitating transport of electrons and may be composed of at least one selected from the group consisting of Alq3 (tris (8-hydroxyquinolino) aluminum), PBD, TAZ, spiro-PBD, BAlq and SAlq It is not limited.

The electron transport layer may also prevent holes injected from the first electrode from passing through the light emitting layer to the second electrode. In other words, it plays a role of a hole blocking layer and plays a role of efficient bonding of holes and electrons in the light emitting layer.

The electron injection layer plays a role of injecting electrons smoothly. Alq3 (tris (8-hydroxyquinolino) aluminum), PBD, TAZ, spiro-PBD, BAlq or SAlq may be used.

The electron injection layer may further include an inorganic material, and the inorganic material may further include a metal compound. The metal compound may include an alkali metal or an alkaline earth metal. Metal compound containing the alkali metal or alkaline earth metal is LiQ, LiF, NaF, KF, RbF, CsF, FrF, BeF 2, MgF 2, CaF 2, SrF 2, BaF any one selected from ₂ the group consisting of RaF ₂ But is not limited thereto.

The second electrode 240 may be a cathode electrode and may be made of magnesium (Mg), calcium (Ca), aluminum (Al), silver (Ag), or an alloy thereof having a low work function. Here, if the organic electroluminescent device is a front or both-side light emitting structure, the second electrode 240 may be formed to have a thickness thin enough to transmit light. When the organic electroluminescent device has a back light emitting structure, It can be formed thick enough to reflect light.

A protective film 300 covering the organic light emitting diode 200 is positioned. The protective film 300 may prevent external moisture or air from penetrating and may protect the organic light emitting diode 200 from external impact.

The protective film 300 is formed in the form of a film and attached on the organic light emitting diode 200. The protective layer 300 includes a first adhesive layer 310a, a first hydrophobic coating layer 320a, and a first barrier layer 330a.

The first adhesive layer 310a attaches the protective film 300 in the form of a film to seal the organic light emitting diode 200. The first adhesive layer 310a may be made of an adhesive material, and may be made of an acrylic resin or an epoxy resin.

The first hydrophobic coating layer 320a exhibits excellent hydrophilicity on the surface, exhibits excellent chemical resistance, water resistance and moisture resistance, and has a low dielectric constant to exhibit excellent electrical insulation characteristics.

The first hydrophobic coating layer 320a may be formed of silicon oil, hexamethyldisilazane (HMDS), trimethyl chlorosilane (TMSCL), amino silane, alkyl silane, polydimethyl siloxane (PDMS), and dimethyl dichlorosilane ). ≪ / RTI >

The first hydrophobic coating layer 320a may include at least one selected from the group consisting of a parylene monomer, a parylene dimer, a polyethylene monomer, dianhydrides, and diamines. Or a polyimide monomer containing one of the polyimide monomers.

Also, the first hydrophobic coating layer 320a may be made of at least one selected from high density polyethylene (HDPE) and polyimide.

The first barrier layer 330a located on the first hydrophobic coating layer 320a is a transparent inorganic insulating layer and protects the organic light emitting diode 200, the first adhesive layer 310a and the first hydrophobic coating layer 320a It plays a role.

The first barrier layer 330a includes an inorganic material and is formed of a single layer of an oxide such as silicon oxide (SiOx) or a nitride such as silicon nitride (SiNx), or a multilayer thereof.

That is, by sealing the organic light emitting diode 200 with the protective film 300 including the first adhesive layer 310a, the first hydrophobic coating layer 320a and the first barrier layer 330a, Can be prevented.

Meanwhile, the protective layer 300 of the organic light emitting display device 10 of the present invention may further include at least one of an adhesive layer, a hydrophobic coating layer, and a barrier layer.

3 and 4 are cross-sectional views illustrating an organic light emitting display according to an embodiment of the present invention.

Referring to FIG. 3, the protective layer 300 of the present invention may further include a second barrier layer 330b between the first adhesive layer 310a and the first hydrophobic coating layer 320a.

That is, in the protective layer 300 of the present invention, the first adhesive layer 310a, the second barrier layer 330b, the first hydrophobic coating layer 320a, and the first barrier layer 330a are sequentially formed on the organic light emitting diode 200 . ≪ / RTI >

The second barrier layer 330b may be formed of the same material as the first barrier layer 330a or may be a single layer of a silicon oxide layer (SiOx) or a silicon nitride layer (SiNx) .

Accordingly, the second barrier layer 330b is further provided between the first adhesive layer 310a and the first hydrophobic coating layer 320a, thereby further preventing the moisture permeation to the organic light emitting diode 200. [

4, the protective layer 300 may further include a second adhesive layer 310b and a second hydrophobic coating layer 320b on the organic light emitting diode 200. Referring to FIG.

That is, the protective layer 300 of the present invention includes a second adhesive layer 310b, a second hydrophobic coating layer 320b, a first adhesive layer 310a, a first hydrophobic coating layer 320a, and a first hydrophobic coating layer 320b on the organic light emitting diode 200, The barrier layer 330a may be sequentially stacked.

The second adhesive layer 310b may be formed of the same material as the first adhesive layer 310a and the second hydrophobic coating layer 320b may be formed of the same material as the first hydrophobic coating layer 320a.

Accordingly, the second adhesive layer 310b and the second hydrophobic coating layer 320a are further included, which is advantageous in that the moisture permeation into the organic light emitting diode 200 can be further prevented.

Hereinafter, a method of manufacturing the organic light emitting display device will be described with reference to the accompanying drawings. Hereinafter, a method of manufacturing the organic light emitting display device shown in FIG. 2 will be described.

5A to 5C are cross-sectional views illustrating a method of manufacturing an organic light emitting display according to an exemplary embodiment of the present invention.

Referring to FIG. 5A, a buffer layer 410 is formed on a transparent substrate 400 made of glass, plastic, or a conductive material. Any one of indium tin oxide (ITO), indium zinc oxide (IZO), and zinc oxide (ZnO) is deposited on the buffer layer 410 to form the first electrode 510.

Next, a benzocyclobutene (BCB) resin, an acrylic resin, or a polyimide resin is applied on the first electrode 510 by a spin coating method or a screen pouring method and patterned by photolithography to form a first electrode 510 are formed on the insulating layer 520.

Next, a material emitting red, green or blue light is deposited on the first electrode 510 exposed by the insulating layer 520 to form an organic layer 530 including at least a light emitting layer. Further, a hole injecting layer, a hole transporting layer, an electron transporting layer, or an electron injecting layer may be further formed on the upper or lower part of the light emitting layer.

The second electrode 540 is formed by depositing magnesium (Mg), calcium (Ca), aluminum (Al), silver (Ag), or an alloy thereof on the substrate 400 including the organic layer 530 Thereby forming the organic light emitting diode 500.

Next, referring to FIG. 5B, a base film 610 is prepared. The base film 610 may be a transparent film made of PET (polyethylene terephthalate) or PC (poly carbonate).

Next, a first adhesive layer 620 is formed on the base film 610. The first adhesive layer 620 is formed by a screen printing method or the like using the above-described materials. Then, a first hydrophobic coating layer 630 is formed on the first adhesive layer 620. The first hydrophobic coating layer 630 is formed of any one selected from the group consisting of a chemical vapor deposition method, a physical vapor deposition method, a sputtering method, and a vacuum deposition method using the above-described materials.

Next, a first barrier layer 640 is formed on the first hydrophobic coating layer 630. The first barrier layer 640 is formed by a chemical vapor deposition method or a physical vapor deposition method using the above-described materials. Thus, a protective film 600 having a first adhesive layer 620, a first hydrophobic coating layer 630, and a first barrier layer 640 sequentially stacked on the base film 610 is formed.

Referring to FIG. 5C, the base film 610 is removed while applying pressure to the organic light emitting diode 500 formed on the substrate 400 by the produced protective film 600.

Therefore, the organic light emitting display device of FIG. 2 described above is manufactured.

As described above, the organic light emitting display device and the method of manufacturing the same according to an embodiment of the present invention can prevent the organic light emitting diode from being damaged by attaching the protective film on the organic light emitting diode in a film form without using chemical or physical vapor deposition There is an advantage that it can be prevented.

In addition, there is an advantage that moisture permeation and damage to the organic light emitting diode can be prevented by the excellent chemical resistance, water resistance and moisture resistance of the hydrophobic coating layer and physical barrier property of the barrier layer.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that the invention may be practiced. It is therefore to be understood that the embodiments described above are to be considered in all respects only as illustrative and not restrictive. In addition, the scope of the present invention is indicated by the following claims rather than the detailed description. Also, all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

Claims (10)

Board;
An organic light emitting diode (OLED) disposed on the substrate, the organic light emitting diode including a first electrode, an organic layer, and a second electrode; And
And a protective film covering the organic light emitting diode,
The protective film
A first adhesive layer laminated while covering the organic light emitting diode;
A first hydrophobic coating layer disposed on the first adhesive layer; And
And a first barrier layer disposed on the first hydrophobic coating layer.
delete The method according to claim 1,
And a second barrier layer is further laminated between the first adhesive layer and the first hydrophobic coating layer.
The method according to claim 1,
And a second adhesive layer and a second hydrophobic coating layer are further laminated between the organic light emitting diode and the first adhesive layer.
The method of claim 3,
Wherein the first and second barrier layers comprise an inorganic material and are made of silicon oxide (SiOx) or silicon nitride (SiNx).
5. The method of claim 4,
The first and second hydrophobic coating layers may be formed of at least one selected from the group consisting of silicon oil, hexamethyldisilazane (HMDS), trimethyl chlorosilane (TMSCL), amino silane, alkyl silane, polydimethyl siloxane (PDMS) and at least one material selected from the group consisting of dichlorosilane and dichlorosilane.
5. The method of claim 4,
The first and second hydrophobic coating layers may be at least one selected from the group consisting of parylene monomer, parylene dimer, polyethylene monomer, dianhydrides and diamines. And a polyimide monomer.
5. The method of claim 4,
Wherein the first and second hydrophobic coating layers comprise at least one selected from high density polyethylene (HDPE) and polyimide.
Forming an organic light emitting diode including a first electrode, an organic film layer, and a second electrode on a substrate;
Forming a protective film film including a first adhesive layer, a first hydrophobic coating layer, and a first barrier layer; And
And attaching the protective film film on the substrate on which the organic light emitting diode is formed to form the first adhesive layer, the first hydrophobic coating layer, and the first barrier layer,
The protective film
A first adhesive layer laminated while covering the organic light emitting diode;
A first hydrophobic coating layer disposed on the first adhesive layer; And
Forming a first barrier layer on the first hydrophobic coating layer; and forming a first barrier layer on the first hydrophobic coating layer.
10. The method of claim 9,
In the step of forming the protective film,
Wherein the first hydrophobic coating layer is formed by one method selected from the group consisting of a vapor deposition method, a sputtering method, and a vacuum deposition method.

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