KR20140006480A

KR20140006480A - Metal frame with excellent heat dissipating for led and led including the same

Info

Publication number: KR20140006480A
Application number: KR1020120073502A
Authority: KR
Inventors: 송연균; 정용균; 김중규; 최창훈; 김연호; 고경필; 김세희
Original assignee: 주식회사 포스코
Priority date: 2012-07-05
Filing date: 2012-07-05
Publication date: 2014-01-16

Abstract

A metal support with high heat dissipation for an LED according to one side of the present invention includes a resin layer which includes a thermally conductive filler on the surface thereof as a metal support for an LED. Also, the LED according to the other side of the present invention includes an LED source part, an aluminum extrusion bar which supports the LED source part, and the metal support which supports the aluminum extrusion bar.

Description

METAL FRAME WITH EXCELLENT HEAT DISSIPATING FOR LED AND LED INCLUDING THE SAME}

The present invention relates to a metal support for an LED having excellent heat dissipation and an LED including the same, which is used as a display for home appliances.

BACKGROUND With the development of electronic and communication technologies, electronic devices applying LEDs (light emitting diodes) are being used. LED is recognized as a next-generation light source because it is more energy-saving and semi-permanent than other light sources such as fluorescent and incandescent lamps.

Such an LED element is a light source that emits light and simultaneously emits a lot of heat. However, these LED devices have heat sensitive characteristics. Therefore, when the temperature of the LED element is usually 70 ℃ or more, the life time is drastically reduced from 40000 hours to 20000 hours.

In order to solve this problem, conventionally, the LED light source unit has been processed by an adhesive to the aluminum extrusion bar of the 'ㅏ' type, to ensure heat dissipation. In addition, the aluminum support bar is connected to the metal support with two to three rivets. The metal support serves to support the entire display panel.

However, such a structure is also difficult to effectively dissipate heat, so efforts to secure heat dissipation by adding a heat sink (heat sink) to the surface of the metal support to secure additional heat dissipation or by forcing convection by adding a small motor. there was. However, despite these attempts, there are still problems of low heat dissipation efficiency and noise generation.

Therefore, it is time to research a method that can combine the aluminum extrusion bar and the metal support with excellent adhesion, and exhibit excellent heat dissipation.

One aspect of the present invention relates to a metal support for an LED having excellent heat dissipation and an LED including the same.

An LED metal support having excellent heat dissipation, which is one side of the present invention, includes an LED metal support, wherein a resin layer including a thermally conductive filler is formed on a surface of the metal support. In addition, an LED having excellent heat dissipation as another aspect of the present invention includes an LED light source unit, an aluminum extrusion bar supporting the LED light source unit, and a metal support supporting the aluminum extrusion bar.

An LED having excellent heat dissipation, which is another aspect of the present invention, includes an LED light source unit, an aluminum extrusion bar supporting the LED light source unit, and a metal support supporting the aluminum extrusion bar.

According to one aspect of the invention, by applying a metal support including a thermally conductive resin layer to the metal frame for the LED, it is possible to increase the thermal conductivity by minimizing the gap between the aluminum extrusion bar and the metal support.

In addition, by adding a thermally conductive filler to the resin layer, it is possible to ensure a higher heat dissipation, it is possible to further extend the life of the LED.

1 is a schematic diagram schematically showing an LED as a conventional example.
2 is a schematic view schematically showing an aluminum extrusion bar and a metal support as a conventional example.
3 is a schematic diagram schematically showing an aluminum extrusion bar and a metal support as an embodiment of the present invention.

The present inventors have conducted studies to increase the heat dissipation of the LED and adhesion of the structure, forming a thermally conductive resin layer on the metal support, or forming a resin layer containing a thermally conductive pillar, and applied to the metal support of the LED, By using the entire area of the metal support as a heat radiating tool, it was realized that the superior adhesion and thermal conductivity of the LED can be secured to the present invention.

Hereinafter, with reference to the drawings will be described in detail a specific embodiment of the present invention. It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the inventive concept. Other embodiments falling within the scope of the inventive concept may be easily suggested, but this will also be included in the spirit of the present invention.

As shown in FIG. 1, in general, an LED includes an LED light source unit 11 and an aluminum extrusion bar 12 supporting the LED light source unit 11, the aluminum extrusion bar 12, and an LED light source unit 11. And a supporting metal support 13.

In addition, as shown in FIG. 2, specifically, the metal support 23 and the aluminum extrusion bar 22 are connected by a plurality of rivets 21. Accordingly, a number of voids 24 are formed between the metal support 23 and the aluminum extrusion bar 22. By the voids 24, first, the adhesion between the metal support 23 and the aluminum extrusion bar 22 is lowered, and secondly, between the metal support 23 and the aluminum extrusion bar 22. The gap is formed, and the air is filled, so that the heat transferred from the LED light source to the aluminum extrusion bar is not continuously transferred to the metal support (radiation heat transfer). As a result, the heat dissipation becomes inferior, the temperature of the LED light source increases, and the life of the LED is shortened.

One embodiment of the present invention is derived to solve this problem, by applying a metal support formed with a resin layer excellent in thermal conductivity, by expanding the area in which the metal support directly contacted from the aluminum extrusion bar, to the radiant heat transfer By increasing the thermal conductivity, and also can improve the adhesive strength.

In addition, another embodiment of the present invention, as shown in Figure 3, the gap between the metal support 23 and the aluminum extrusion bar 22 can be filled with the resin layer 25, the resin layer is a thermoelectric The conductive filler 26 may be further included to further improve thermal conductivity.

Hereinafter, an LED metal support for excellent heat dissipation, which is one embodiment of the present invention, will be described in detail.

The LED metal support serves to support the aluminum extrusion bar. In addition, it receives the heat transferred to the aluminum extrusion bar again, and serves to radiate heat to the outside. Here, the metal support preferably includes a material having excellent thermal conductivity, and more preferably, one or two or more of carbon steel, aluminum alloy and magnesium alloy.

In addition, it is preferable that a resin layer is formed on the surface of the metal support. Even when the aluminum extruded bar and the metal support are joined by a fastening means by rivets or the like, a plurality of voids exist in a portion where the different materials contact each other. At this time, if the resin layer is provided on the metal support as described above, since the resin layer can fill the voids, the voids can be minimized. Through this, the contact area between the aluminum extrusion bar and the metal frame is maximized, thereby maximizing the thermal conductivity generated from the LED light source. In addition, the improvement effect of the adhesive force by a resin layer can be exhibited.

Therefore, it is preferable that resin of the said resin layer consists of a material excellent in thermal conductivity. In addition, the resin is preferably made of a material excellent in adhesion. Here, it is preferable that the said resin layer contains 1 type (s) or 2 or more types of acrylic resin, urethane type resin, polyester resin, and polyamide resin. Through this, it is possible to secure the adhesiveness and thermal conductivity.

In addition, it is preferable to control the thickness of a resin layer to a certain degree. By controlling the thickness of the resin layer to 0.1 µm or more, it is possible to secure adhesive strength and thermal conductivity. However, when the thickness becomes so thick that it exceeds 50 micrometers, a heat insulation effect may arise, and rather heat conductivity may fall. Therefore, it is preferable that the thickness of the said resin layer is 0.1-50 micrometers. And in order to suitably control the said heat transfer effect and a heat insulation effect, it is more preferable to control the thickness of the said resin layer to 5-15 micrometers.

The method of forming such a resin layer is not specifically limited in this invention. If it is a method which can form a resin layer on the surface of a metal material, what kind of method is applied does not affect this invention.

The resin layer may additionally include a thermally conductive filler. The filler is a generic term for a plate, sphere, or amorphous substance added to an industrially used resin layer, and the present invention performs a function of a heat transfer passage. In general, the resin layer is composed of a polymer is characterized by a large heat insulating effect. As described above, even when the resin layer is formed by selecting a resin material having excellent thermal conductivity, the heat transfer performance is relatively lower than that of the metal oxide or the inorganic material. Therefore, in order to improve the heat transfer function of the resin layer, a filler (metal oxide or inorganic material) having relatively high thermal conductivity may be added into the resin layer. Then, the thermally conductive filler is dispersed in the resin layer in the form of particles to form a passage (a kind of stepping bridge) through which heat is transferred. Through this, it is possible to improve the heat transfer performance of the resin layer having a large thermal insulation effect.

The form of the said thermally conductive filler is not specifically limited, Any form will not affect this invention as long as it is contained in a resin layer and can improve thermal conductivity. Such a thermally conductive filler is dispersed and provided in the form of particles in the resin layer, thereby increasing the effect of transferring the heat transferred from the aluminum extrusion bar to the metal support.

At this time, the size of the thermally conductive filler particles is preferably 0.01 ~ 0.5um. If the size of the filler particles is less than 0.01 um, the surface area is large and does not evenly disperse, but is entangled with each other to reduce the surface area, making it difficult to use industrially. If it exceeds 0.5um, the bonding strength with the resin layer decreases, which acts as a kind of defect. The filler commonly used to overcome these adverse conditions is 0.01 ~ 0.5um.

And it is preferable that the said thermally conductive filler contains a carbon component. The carbon component is a material having excellent thermal conductivity (C: 5300 (W / mk), Steel: 60 W / mk) and excellent electrical conductivity, which is suitable for the purpose of the present invention. In addition, the filler may include one or two or more of graphene, carbon nanotubes, aluminum oxide, and artificial diamond.

In addition, the thermally conductive filler is preferably contained by weight of 0.05 to 30% of the total resin layer. When the thermally conductive filler is included in the resin layer less than 0.05% by weight, it is difficult to realize the effect of improving the thermal conductivity intended by the present invention, and when included in excess of 30%, the film is entangled without being dispersed between the filler particles. It can be broken.

The resin layer may further include a curing agent. The curing agent serves to make the liquid resin into a solid phase. In addition, the curing agent is preferably contained by weight of 0.1 to 10% of the total resin layer. If it is less than 0.1%, the amount is insufficient to perform the hardening function properly, and if it exceeds 10%, the hardenability becomes saturated and its physical meaning is lost. As a component of the curing agent usable in the present invention, melamine is preferred.

Hereinafter, an LED having excellent heat dissipation which is another embodiment of the present invention will be described in detail.

The LED includes an LED light source unit, an aluminum extrusion bar and a metal support. Here, the LED light source unit may be applied to any one as long as it can exhibit such an effect. The aluminum extrusion bar supports the LED light source and directly transfers heat emitted from the LED light source to the metal support.

The metal support serves to support the LED light source unit and the aluminum extrusion bar. As described above, the metal support is preferably a resin layer formed on the surface of the metal support. In addition, the LED can be applied to a resin layer having the characteristics of the resin layer described above. Through this, it is possible to provide an LED having excellent heat dissipation and adhesion.

Hereinafter, the present invention will be described more specifically by way of examples. It should be noted, however, that the following examples are intended to illustrate the invention in more detail and not to limit the scope of the invention. The scope of the present invention is determined by the matters set forth in the claims and the matters reasonably inferred therefrom.

(Example)

The heat dissipation was measured after manufacturing the LED using the commonly used electro-galvanized steel sheet as a metal support.

The experimental example in which no resin layer was formed on the galvanized steel sheet was made as Comparative Example 1. In addition, an example in which a resin layer was formed on an electrogalvanized steel sheet was referred to as an inventive example, and an experimental example without adding a thermally conductive filler was referred to as Inventive Example 1, and according to the thickness of the resin layer shown in Table 1, Inventive Example 2 To Inventive Example 5. Here, the resin layer of Inventive Example 1 is composed of 85% by weight polyester resin and melamine (curing agent), the resin layer of Inventive Examples 2 to 5 is 80% by weight polyester resin, aluminum oxide (heat conductive filler) 10 Weight percent and 10 weight percent melamine (curing agent).

Samples were prepared in Comparative Example 1 and Inventive Examples 1 to 5 with a size of 300 × 400 mm, and an aluminum extrusion bar equipped with an LED was riveted to the specimen, and then loaded into a 1000 × 2000 mm insulating cabinet. The thermometer which can measure the temperature of an LED element is put in the said insulation cabinet, and the temperature of an LED element is changed with time. It is shown in Table 1 after the measurement.

division Resin layer thickness (㎛) Temperature (℃) first After 1 hour After 3 hours After 6 hours Comparative Example 1 0 25 76 79 80 Inventory 1 10 25 77 77 77 Inventive Example 2 One 25 76 75 76 Inventory 3 10 25 76 73 72 Honorable 4 20 25 77 77 75 Inventory 5 30 25 76 78 77

As shown in Table 1, Comparative Example 1 to which a metal support having no resin layer was applied was found to reach thermal saturation at 79 to 80 ° C as time passed.

On the contrary, inventive example 1 using the metal support having the resin layer, the temperature measured after 6 hours was 77 ° C., and the temperature was decreased by 3 ° C. compared to the comparative example 1. And, Inventive Examples 2 to 5 using a metal support having a resin layer containing a thermally conductive pillar, the temperature measured after 6 hours was 72 ~ 77 ℃, it can be confirmed that the temperature was reduced by 3 ~ 8 ℃ compared to Comparative Example 1. there was. In addition, in the case of invention example 3, the temperature of the LED after 6 hours was 72 degreeC, and it confirmed that it was the most excellent heat dissipation. Although the resin layer thickness of the invention example 5 was 10 micrometers, as mentioned above, this supports that the optimal resin layer thickness is 5-15 micrometers.

11: LED light source, 12: aluminum extrusion bar,
13: metal support,
21: rivet, 22: aluminum extrusion bar,
23: metal support, 24: void,
25: resin layer, 26: thermally conductive filler.

Claims

As the metal support for the LED,
LED support having excellent heat dissipation, characterized in that a resin layer comprising a thermally conductive filler formed on the surface of the metal support.

The method according to claim 1,
The resin component of the resin layer is an LED resin having excellent heat dissipation, characterized in that it comprises one or two or more of acrylic resins, urethane resins, polyester resins and polyamide resins.

The method according to claim 1,
The thickness of the resin layer is 0.1 to 50 ㎛ LED support for excellent heat dissipation, characterized in that.

The method according to claim 1,
The metal support is an LED metal support having excellent heat dissipation, characterized in that it comprises one or two or more of carbon steel, aluminum alloy and magnesium alloy.

The method according to claim 1,
The thermally conductive filler is an LED metal support for excellent heat dissipation, characterized in that containing carbon.

The method according to claim 1,
The thermally conductive filler is an LED metal support for excellent heat dissipation, characterized in that it comprises one or two or more of graphene, carbon nanotubes, aluminum oxide and artificial diamond.

The method according to claim 1,
The thermally conductive filler is an LED metal support having excellent heat dissipation, characterized in that 0.05% to 30% of the total resin layer by weight%.

The method according to claim 1,
LED resin having excellent heat dissipation, characterized in that the resin layer comprises a curing agent.

The method according to claim 8,
The hardener is a metal support for LED excellent in heat dissipation, characterized in that 0.1% to 10% of the total resin layer by weight%.

LED light source unit;
Aluminum extrusion bar for supporting the LED light source; And
It includes a metal support for supporting the aluminum extrusion bar,
LED is excellent in heat dissipation is the metal support of any one of claims 1 to 8.