KR20140001931A - Material for electrical/electronic use - Google Patents

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KR20140001931A
KR20140001931A KR1020137014432A KR20137014432A KR20140001931A KR 20140001931 A KR20140001931 A KR 20140001931A KR 1020137014432 A KR1020137014432 A KR 1020137014432A KR 20137014432 A KR20137014432 A KR 20137014432A KR 20140001931 A KR20140001931 A KR 20140001931A
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mass
hardness
electrical
alloy
bending strength
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류 시시노
켄이치로 미야모토
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가부시키가이샤 토쿠리키 혼텐
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C22C5/08—Alloys based on silver with copper as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/04—Alloys based on a platinum group metal
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/14—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
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Abstract

본 발명은, 낮은 접촉 저항으로 내식성이 뛰어나고, 경도가 높고, 절곡 강도가 크고 또한 가공성이 뛰어난 전기·전자 재료를 제공하는 것으로, 당해 전기·전자 재료는 Ag 20~40 질량%, Pd 20~40 질량%, Cu 10~30 질량% 및 Pt 1.0~20 질량%로 구성되어, 소성 가공 후의 석출 경화 시의 경도를 340 내지 420 HV로 하고, 또한 절곡 강도를 가지는 것을 특징으로 한다.The present invention provides an electrical and electronic material having excellent contact resistance, low hardness, high bending strength, and excellent workability due to low contact resistance, and the electrical and electronic material is 20 to 40 mass% Ag and 20 to 40 Pd. It is comprised by the mass%, 10-30 mass% of Cu, and 1.0-20 mass% of Pt, The hardness at the time of precipitation hardening after plastic working is 340-420 HV, It is characterized by having bending strength.

Description

전기·전자용 재료 {MATERIAL FOR ELECTRICAL/ELECTRONIC USE}Electrical and Electronic Materials {MATERIAL FOR ELECTRICAL / ELECTRONIC USE}

본 발명은, 전기·전자기기용의 Ag－Pd－Cu 합금에 관한 것이다.The present invention relates to an Ag-Pd-Cu alloy for electric and electronic devices.

전기·전자기기에 사용되는 재료는, 일반적으로 낮은 접촉 저항이나 뛰어난 내식성 등의 여러 특성이 요구되기 때문에, 고가의 Pt 합금, Au 합금, Pd 합금, Ag 합금 등의 귀금속 합금이 광범위하게 이용되고 있다.In general, precious metal alloys such as expensive Pt alloys, Au alloys, Pd alloys, and Ag alloys are widely used in materials used in electrical and electronic devices, because various properties such as low contact resistance and excellent corrosion resistance are required. .

그러나, 반도체 집적회로의 검사용 프로브 핀 등과 같이, 사용 용도에 따라 낮은 접촉 저항이나 내식성 외에, 경도, 내마모성 등도 요구된다.However, in addition to low contact resistance and corrosion resistance, such as probe pins for inspection of semiconductor integrated circuits, etc., hardness, wear resistance, and the like are also required.

이런 경우, 소성 가공을 실시한 상태에서 높은 경도를 나타내는 Pt 합금, Ir 합금 등이나 석출 경화되는 Au 합금, Pd 합금 등이 바람직하게 사용되고 있다(예를 들면, 특허문헌 1 참조).In this case, Pt alloy, Ir alloy, etc. which show high hardness in the state which performed plastic working, Au alloy which precipitate hardening, Pd alloy, etc. are used preferably (for example, refer patent document 1).

특허문헌 1 : 특허 제4176133호 공보Patent Document 1: Patent No. 4176133

검사용 프로브 핀에 관해서는, 검사 대상에 따라 캔틸레버, 코브라, 스프링 등 여러가지 타입(형상)이 사용되고 있고, 요구되는 특성도 각각 다르다.As for the probe pin for inspection, various types (shapes) such as cantilever, cobra, and spring are used depending on the inspection object, and the required characteristics are also different.

경도를 중시하는 경우에는, 소성 가공을 실시한 상태에서 높은 경도를 나타내는 Pt 합금, Ir 합금 등이나, 석출 경화를 실시한 상태에서 높은 경도를 나타내는 Au 합금 및 Pd 합금 등이 추천된다.When hardness is important, Pt alloy, Ir alloy, etc. which show high hardness in the plastic working state, Au alloy, Pd alloy, etc. which show high hardness in the state which performed precipitation hardening etc. are recommended.

그러나, 이런 일반적으로 높은 경도를 갖는 재료는, 절곡에 대해 취약하다(취성을 갖는다).However, these generally high hardness materials are vulnerable to bending (with brittleness).

이 때문에, 선단에 굽힘 가공을 실시하는 타입의 프로브 핀의 경우, 절곡 가공시 또는 프로브 핀으로서 사용했을 때에 발생하는 절곡 개소에의 피로가 원인이 되어, 프로브 핀의 굽힘 개소가 절손(折損)되는 경우가 있다.For this reason, in the case of the probe pin of the type which bends a tip, fatigue to the bending point which arises at the time of bending or when used as a probe pin causes the bending point of a probe pin to be broken. There is a case.

그래서, 선단에 굽힘 가공을 실시하는 타입의 프로브 핀의 경우에는, 낮은 접촉 저항, 내식성, 경도에 더해 절곡 강도를 가지는 재료가 요구되고 있다.Therefore, in the case of the probe pin of the type which bends a tip, the material which has bending strength in addition to low contact resistance, corrosion resistance, and hardness is calculated | required.

그래서 본 발명은, Ag 20~40 질량%, Pd 20~40 질량%, Cu 10~30 질량%에, 특정 원소인 Pt 1.0~20 질량%를 첨가함으로써, 합금으로서의 기계적 특성의 향상 즉 소성 변형 후의 석출 경화 시의 경도가 340~420 HV, 절곡 강도의 향상과 내식성을 향상시킨 전기·전자용의 재료로 했다.Therefore, in the present invention, by adding Pt 1.0 to 20% by mass, which is a specific element, to 20 to 40% by mass of Ag, 20 to 40% by mass of Pd, and 10 to 30% by mass of Cu, the mechanical properties as an alloy, that is, after plastic deformation The hardness at the time of precipitation hardening was made into the material for electrical and electronics which improved 340-420 HV, the improvement of bending strength, and corrosion resistance.

여기에서, Pt의 첨가량을 1.0~20 질량%로 한 이유는, 절곡 강도를 향상시키기 때문인데, 1.0 질량% 미만에서는 절곡 강도의 향상의 효과를 얻지 못하고, 20 질량%를 초과하면 소정의 경도를 얻을 수 없기 때문이다.The reason why the added amount of Pt is 1.0 to 20% by mass is because the bending strength is improved. If the amount of Pt is less than 1.0% by mass, the effect of improving the bending strength is not obtained. Because you can not get.

Ag－Pd－Cu에 Pt를 첨가한 합금에, 더욱이, 용도에 따라 특성을 개선하는 첨가 원소로서, Au 0.1~10 질량%, Re, Rh, Co, Ni, Si, Sn, Zn, B, In 중 적어도 1종을 0.1~3.0 질량%으로 첨가한다.In addition to Ag-Pd-Cu, Pt is added to the alloy, which further improves the properties depending on the application, and includes 0.1 to 10% by mass of Au, Re, Rh, Co, Ni, Si, Sn, Zn, B, and In. At least 1 sort (s) is added at 0.1-3.0 mass%.

또한, Au를 0.1~10 질량% 첨가하는 이유는, 경도를 향상시키고 내산화성을 얻기 때문인데, 0.1 질량% 미만에서는 그 효과가 없고, 10 질량%를 초과하면 가공성이 나빠지기 때문이다.The reason for adding 0.1 to 10% by mass of Au is to improve the hardness and to obtain oxidation resistance, because if it is less than 0.1% by mass, there is no effect, and if it exceeds 10% by mass, the workability is deteriorated.

또한, Re, Rh, Co, Ni, Si, Sn, Zn, B, In 중 적어도 1종을 0.1~3.0 질량%을 첨가하는 이유는, 경도를 향상시키기 때문인데, 0. 1 질량% 미만에서는 그 효과가 없고, 3.0 질량%를 초과하면 가공성이 나빠지기 때문이다. Re, Rh 및 Ni는 결정립을 미세화시키는 효과재로서도 작용한다.In addition, the reason for adding 0.1 to 3.0 mass% of at least one of Re, Rh, Co, Ni, Si, Sn, Zn, B, and In is to improve the hardness, but when it is less than 0.1 mass%, It is because there is no effect and when workability exceeds 3.0 mass%, workability will worsen. Re, Rh and Ni also serve as effect materials for miniaturizing crystal grains.

본 발명의 전기·전자 재료에 의하면, 낮은 접촉 저항으로서 내식성이 뛰어나고, 경도가 높고, 절곡 강도가 크고 또한 가공성이 뛰어난 재료로 된다.According to the electrical and electronic material of this invention, it is a material which is excellent in corrosion resistance as a low contact resistance, high in hardness, large in bending strength, and excellent in workability.

도 1은　절곡 시험을 나타내는 설명도1 is an explanatory diagram showing a kinematic bending test

본 발명의 실시예를 표 1에 의해 설명한다.The Example of this invention is described by Table 1. FIG.

또한, 본 실시예에서는, 진공 용해에 의해 Ag－Pd－Cu 합금에 Pt를 첨가한 합금 잉곳(φ10mm × L100mm)을 제작했다.In addition, in the present Example, the alloy ingot (phi 10mm x L100mm) which added Pt to Ag-Pd-Cu alloy by vacuum melting was produced.

탕인 등의 용해 결함부를 제거한 후, 신선 가공과 용체화 처리(800℃ × 1hr H2와 N2의 혼합 분위기 중)를 φ2. 0 mm까지 반복하여, 최종 단면 감소율이 약 75%가 되도록 신선 가공한 것을 시험편(φ1. 0mm × L200mm)으로 하고, 석출 경화의 조건은, H2와 N2의 혼합 분위기 중에서 300~500 ℃ × 1 hr로 하여 실시했다. 또한, 시험편의 경도 측정은, 표면 경도를 비커스 경도 시험기로, HV 0.2에서 측정을 실시했다.The (in 800 ℃ × 1hr H 2 and a mixed atmosphere of N 2) remove parts of dissolved defects such tangin, fresh processing solution treatment and φ2. Repeatedly to 0 mm, 300 ~ 500 ℃ in the final reduction of area the test piece that fresh processing so that approximately 75% (φ1. 0mm × L200mm ) to, and conditions of the precipitation hardening is, H 2 and a mixed atmosphere of N 2 × It carried out as 1 hr. In addition, the hardness measurement of the test piece measured the surface hardness with the Vickers hardness tester at HV 0.2.

절곡 강도의 조사는, 시험편을 도 1에 도시하는 바와 같이, R 0.5의 치구로 고정하고, 시험편이 절손될 때까지 반복해서 절곡하여, 절손에 이르는 절곡 회수를 조사했다. 또한, 90도 구부러진 시점에서 1회 카운트하고, 0회는 90도까지 구부러지지 않은 것을 가리킨다.As shown in FIG. 1, the bending strength was fixed by a jig of R 0.5, repeatedly bent until the test piece was broken, and the number of times of bending was reached. In addition, it counts once at the time of 90 degree bend, and 0 time indicates that it is not bent to 90 degree | times.

표 1에 각 실시예의 조성을 나타내며, 절손에 이르는 절곡 회수 가공 후 및 석출 경화 후의 경도를 나타낸다.The composition of each Example is shown in Table 1, and the hardness after bending recovery processing and precipitation hardening which leads to breakage is shown.

[표 1][Table 1]

Figure pct00001
Figure pct00001

표 1의 결과로부터, Ag－Pd－Cu에 Pt를 첨가하지 않은 비교예의 석출 경화재는, 절곡 강도가 작아, 2회 이상 절곡하지 못하고 절손되었지만, Pt를 첨가한 실시예 1은 2회 이상의 절곡이 가능하여, 절곡 강도의 향상을 확인할 수 있었다.From the results of Table 1, the precipitation hardening material of the comparative example in which Pt was not added to Ag-Pd-Cu had a small bending strength and was broken without bending more than two times. It was possible to confirm the improvement of the bending strength.

마찬가지로, 실시예 2~6의 Ag－Pd－Cu에 Pt 및 Au, Re, Rh, Co, Ni, Si, Sn, Zn, B, In 중 적어도 1종을 첨가한 합금의 석출 경화재도 2회 이상의 절곡이 가능했다.Similarly, the precipitation hardening material of the alloy which added at least 1 sort (s) of Pt and Au, Re, Rh, Co, Ni, Si, Sn, Zn, B, In to Ag-Pd-Cu of Examples 2-6 is also two or more times. Bending was possible.

Claims (2)

Ag 20~40 질량%, Pd 20~40 질량%, Cu 10~30 질량% 및 Pt 1.0~20 질량%로 구성되어, 소성 가공 후의 석출 경화 시의 경도를 340~420 HV로 하고, 또한 절곡 강도를 가지는 것을 특징으로 하는 전기·전자용 재료.It consists of Ag-40-40 mass%, Pd 20-40 mass%, Cu 10-30 mass%, and Pt 1.0-20 mass%, The hardness at the time of precipitation hardening after plastic working is 340-420 HV, and also bending strength Electrical and electronic material, characterized by having a. 청구항 1의 합금에, 용도에 따라 특성을 개선하는 첨가 원소로서, Au 0.1~10 질량%, Re, Rh, Co, Ni, Si, Sn, Zn, B, In 중 적어도 1종을 0.1~3.0 질량%으로 첨가한 것을 특징으로 하는 전기·전자용 재료. 0.1-3.0 mass of at least 1 sort (s) among Au 0.1-10 mass%, Re, Rh, Co, Ni, Si, Sn, Zn, B, In as an additional element which improves a characteristic according to a use to the alloy of Claim 1 Electrical and electronic material characterized by the addition in%.
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JP4176133B1 (en) * 2007-06-06 2008-11-05 田中貴金属工業株式会社 Probe pin
JP5657881B2 (en) * 2009-12-09 2015-01-21 株式会社徳力本店 Probe pin material

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CN103249852A (en) 2013-08-14
US20130292008A1 (en) 2013-11-07

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