JP3196176B2 - Method for manufacturing dissimilar metal bonded probe - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to an LSI chip and the like.
Used to measure the electrical characteristics of semiconductor integrated circuits.
Probes, especially dissimilar metal joints
The present invention relates to a method for manufacturing a combined probe.

[0002]

2. Description of the Related Art Probes used in conventional probe cards are often made of a hard and highly elastic metal such as tungsten or beryllium copper. In particular, tungsten, which is excellent in wear resistance and can be used at a low price even for wires having a diameter of several tens of μm, is often used, and at present 90% or more of the probes are made of tungsten.

[0003]

However, tungsten is a very good material for the probe, but when it comes into contact with the electrode pad in the order of tens of thousands of times, the contact resistance increases, and ultimately the electrical characteristics are increased. Measurement becomes impossible.

[0004] This is due to an increase in the temperature of the contact portion at the tip of the probe due to current flowing between the electrode pad and contact friction at the time of contact with the electrode pad, or formation on the surface of the electrode pad on which aluminum is deposited. It is considered that the aluminum oxide thin film is peeled off and adheres to the contact portion of the probe as a foreign matter, and aluminum oxide is generated and adhered to the aluminum film.

[0005] Such a problem arises when an LSI chip is used at 85 ° C to 1 ° C.
This is a particularly significant problem in a burn-in test performed by heating to 50 ° C.

At present, such a problem is solved by performing a cleaning operation for polishing the contact portion of the probe about once every several thousand times. However, since the measurement of various electrical characteristics of an LSI chip and the like is performed automatically, it is a problem to perform another operation even once every several thousand times.

The present invention has been made in view of the above circumstances.
The service life can be extended,
Method for Manufacturing Dissimilar Metal Bonded Probe Contributing to Constant Stabilization
It is intended to provide.

[0008]

DISCLOSURE OF THE INVENTION Dissimilar metal contact according to the present invention
The method of manufacturing the combined probe is as follows:
At the end of the stainless steel wire, wire a metal other than tungsten
Contacting, and applying a large current to the joint surface of the two wires
And joining the two wires, and
Cutting and polishing the metal.

Also, an alloy of palladium is used as the metal.
It is desirable to use phosphor bronze or beryllium copper.

[0010]

FIG . 1 shows an embodiment of the present invention.
Different types of metal manufactured by different metal bonded probe manufacturing methods
FIG. 2 is a schematic cross-sectional view of a main part of a seed metal bonding probe.
Manufacturing method of dissimilar metal bonding probe according to the embodiment of the present invention
FIG. 3 is a schematic perspective view showing one process, and FIG.
1 shows one step of a method for manufacturing a dissimilar metal-bonded probe according to the present invention.
FIG. 4 is a schematic perspective view, and FIG.
Tongue in one step of the manufacturing method of metal bonded probe
Outline of joint surface between stainless wire and metal other than tungsten
It is a schematic sectional drawing.

[0011] A dissimilar metal joining device according to an embodiment of the present invention.
Dissimilar metal bonding professional manufactured by lobe manufacturing method
The lobe 100 is divided in terms of the materials that make it up.
, A probe body 110 made of tungsten,
The contact portion 120 is made of a radium alloy.

The probe main body 110 occupies most of the dissimilar metal-bonded probe 100, and is formed in an arbitrary shape such as a so-called cantilever type or vertical contact type. The probe body 110 may be made of only tungsten or a tungsten alloy containing about 3% rhenium.

One contact portion 120 is connected to the probe body 1
LSI, not shown, joined to the tip of
This is the part that contacts the electrode pad of the chip. Therefore, the tip of the contact portion 120 is polished and sharpened.

Next, a method for manufacturing such a dissimilar metal bonded probe will be described. First, the probe body 11
A wire rod 200 made of tungsten (tungsten alloy) having a diameter of 0.08 mm is used for the part where the diameter becomes zero.

The contact portion 120 is made of a metal having good conductivity and low contact resistance, for example, 35% by weight of palladium, 10% by weight of platinum, 30% by weight of silver, 10% by weight of gold, and 14% by weight of copper %, And a palladium alloy wire 300 having a composition of 1% by weight of zinc is used. The palladium alloy wire 300 also has a diameter of 0.08 mm. As the palladium alloy, Pareney 7 (trade name) is excellent.

The two wires 200 and 300 are joined using, for example, a low voltage, high current welding machine generally called a super welder. First, a tungsten wire 20 is inserted into a groove 411 formed at the upper end of one butting jig 410 made of ceramics and the like, which is as thin as possible.
Supply 0. Also, the other equivalent butting jig 42
The wire 300 of the palladium alloy is supplied to the groove 421 formed at the upper end of the zero.

A pair of butting jigs 410 and 420
They are opposed directly below the electrodes 510 and 520 of the welding machine. Therefore, the two wires 200, 300 supplied to the butting jigs 410, 420 are connected to the electrodes 510,
Contact just below 520.

As shown in FIG. 3, a portion where the two wires 200 and 300 abut each other is covered with a glass tube 700, and a non-oxidizing gas, for example, argon gas Ar is supplied to the nozzle 600 inside the glass tube 700. Supplied from Thus, the joining of the two wires 200 and 300 is performed in a non-oxidizing atmosphere.

In this state, the tungsten wire 2
00 and the palladium alloy wire 300
0 and 520 are brought into contact with each other, and a low voltage and a large current of 5V-1500A are applied.

Then, the two wires 200 and 300 are instantaneously welded and joined. The joining surface of both wires 200 and 300 is as shown in FIG. That is, the melting point of the tungsten wire 200 is better than the palladium alloy wire 3
00, which is higher than that of palladium alloy wire 300
Melts and follows the cut surface of the tungsten wire 200.

When the two wires 200 and 300 are joined,
Palladium alloy wire 300 is replaced by tungsten wire 20
Cut with about 1 mm remaining at 0. Also, the tungsten wire 200 is cut at an appropriate position.

The palladium alloy wire 300 bonded to the tungsten wire 200 is polished and sharpened to form a contact portion 120 of the dissimilar metal bonding probe 100. Also, the tungsten wire 200 is subjected to necessary processing (for example, bending, bending, etc.) as the dissimilar metal bonding probe 100. Thus, the dissimilar metal bonding probe 100 is completed.

After completion as the dissimilar metal bonding probe 100, the probe is placed in a vacuum furnace at 750.degree.
It may be heated for about 0 minutes. Then, the probe body 11
0 and the palladium alloy of the contact portion 120 cause interdiffusion, and as a result, the probe body 11
0 and the contact portion 120 are more firmly joined.

Further, a foil piece of a brazing material such as silver brazing is interposed at a portion where the two wires 200 and 300 are abutted with each other.
The probe main body 110 and the contact portion 120 can be more firmly joined.

Further, when the two wires 200 and 300 are joined, the surroundings are made in a non-oxidizing atmosphere.
For example, it is also possible in normal air.

In the above embodiment, the wire 300 made of a palladium alloy is used, but a wire made of phosphor bronze or beryllium copper may be used. In particular, phosphor bronze or beryllium copper has an advantage of contributing to stabilization of measurement because it has lower resistance.

[0027]

According to the present invention, a probe for joining dissimilar metals according to the present invention is manufactured.
The fabrication method is based on the tungsten wire material used as the probe body.
A step of contacting a metal wire other than tungsten with the tip
And a large current is applied to the joint surface of the two wires to connect the two wires.
And cutting and polishing a metal other than tungsten.
Polishing step.

[0028] For this reason, the production of this dissimilar metal bonding probe
Dissimilar metal bonded probes manufactured by
The part is made of inexpensive tungsten and the power of the LSI chip is
Only the contact part that contacts the pole pad has good conductivity,
Probes can be made of low resistance metal
With appropriate rigidity and elasticity, and longer than before
It can be a long-life probe. Also, this manufacturing method
Method, except for the wire made of tungsten and the timing
Can be easily joined with a wire made of various metals.
You.

The use of an alloy of palladium as the metal, in particular, an alloy having a composition of 35% by weight of palladium, 10% by weight of platinum, 30% by weight of silver, 10% by weight of gold, 14% by weight of copper and 1% by weight of zinc makes more conductive. It is possible to obtain a dissimilar metal bonding probe having excellent resistance and oxidation resistance. In particular, the palladium alloy is expensive, but it is used only for a small portion of dissimilar metal bonded probes,
There is no cost problem.

Further, when phosphor bronze or beryllium copper is used instead of the palladium alloy, the resistance is lower, and thus there is an advantage that the measurement can be stabilized.

[0031]

[0032]

[0033]

Furthermore, after the step of cutting and polishing the metal other than tungsten, the tungsten and the metal other than tungsten are interdiffused by heating in a vacuum to obtain a stronger dissimilar metal bonding probe. It is possible.

[Brief description of the drawings]

FIG. 1 shows a heterometallic bonding probe according to an embodiment of the present invention .
Metal-bonded probe manufactured by the method of manufacturing
It is a schematic sectional drawing of the principal part of FIG.

FIG. 2 is a schematic perspective view showing one step of a method for manufacturing a dissimilar metal bonded probe according to an embodiment of the present invention.

FIG. 3 is a schematic perspective view showing one step of a method for manufacturing a dissimilar metal bonded probe according to an embodiment of the present invention.

FIG. 4 is a schematic cross-sectional view of a bonding surface between a tungsten wire and a metal other than tungsten during one step of a method for manufacturing a dissimilar metal bonding probe according to an embodiment of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 100 dissimilar metal bonding probe 110 probe body 120 contact part 200 tungsten wire 300 palladium alloy wire

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Masatoshi Haneita 2-5-13-1 Nishi-Nagasu-cho, Amagasaki-shi, Hyogo Japan Electronic Materials Co., Ltd. (72) Inventor Toshifumi Fan 2-Nishi-Nagasu-cho, Amagasaki-shi, Hyogo No. 5-13 JEOL Co., Ltd. (56) References JP-A-10-319039 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) G01R 1/06-1/073 H01L 21/66

Claims (6)

(57) [Claims] 1. A tungsten wire serving as a probe body
Contact a metal wire other than tungsten to the tip of the material
Process, and passing a large current to the joining surface of the two wires,
Joining metal and cutting metal other than tungsten
Grinding and polishing.
Manufacturing method of combined probe. 2. A palladium alloy is used as the metal.
2. The metal-to-metal bonding system according to claim 1, wherein
The method of manufacturing the probe. 3. The palladium alloy according to claim 1, wherein said palladium alloy is palladium 3
5% by weight, platinum 10% by weight, silver 30% by weight, gold 10
% By weight, 14% by weight of copper and 1% by weight of zinc
3. The method for producing a dissimilar metal-bonded probe according to claim 2, wherein
Construction method. 4. The method according to claim 1, wherein said metal is phosphor bronze or beryllium.
The dissimilar metal according to claim 1, wherein copper is used.
A method for manufacturing a bonded probe. 5. The tungsten wire and tungsten.
A large current is applied to the joint surface between the metal wires other than
The process of joining wires is performed in a non-oxidizing atmosphere
The method for producing a dissimilar metal-bonded probe according to claim 1, 2, 3, or 4 . 6. A method for cutting and polishing metal other than tungsten.
After the polishing process, the tongue is heated by heating in a vacuum.
Interdiffusion between metal and metals other than tungsten
The method for producing a dissimilar metal-bonded probe according to claim 1, 2, 3, 4, or 5, wherein