JPH06281670A - Contact pin for inspection of integrated circuit - Google Patents

Abstract

PURPOSE:To improve spring properties, abrasion resistance, corrosion resistance, conductivity, contact resistance stability, etc., by forming a contact pin of a wire rod chip of Ir or an Ir alloy and by grinding the fore end of the chip to be pointed. CONSTITUTION:The fore end 2 of a wire rod chip 1 of Ir of a diameter about 0.2mm and a length 43mm, for instance, is subjected to electrolytic etching by a hydrochloric acid and ground to be pointed in the shape of a needle over a length of about 3mm, so that a contact pin 3 for IC inspection be formed. In another way, a wire rod chip 1' of Ir of a diameter about 0.2 mm and a length about 3mm and a wire rod chip 4 of W of a diameter about 0.2mm and a length about 40mm are subjected to high-frequency brazing to be joined by using a brazing material BAg-8, with flux added, then the fore end 2' of the Ir wire rod chip 1' is subjected to electrolytic etching by the hydrochloric acid and ground to be pointed over a length of about 3 mm and thereby a contact pin 5 for IC inspection is formed. The pins 3 and 5 thus obtained are superior in spring properties, abrasion resistance, corrosion resistance ance and contact characteristics and satisfactory for conductivity as well.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact pin used for electric test of an integrated circuit or its substrate.

[0002]

2. Description of the Related Art In recent years, as semiconductor integrated circuits have become highly integrated and operating at high speed, in the intermediate inspection process of wafers, contact pins have a conductive property in addition to mechanical properties such as spring property and wear resistance. And stable contact resistance is required. The contact pin mainly contacts Al or Au of the semiconductor device or a solder electrode (bonding pad), and it is necessary to keep the contact resistance low.

Conventionally, for a contact pin for an electric test of an integrated circuit, the tip of a thin wire made of W, WC, BeCu, Pd alloy or the like is ground into a needle shape, and the tip portion is formed into a desired shape. Although processed products have been used, the contact pins of W and WC have excellent spring properties and wear resistance, but poor corrosion resistance, so contact resistance increases due to long-term use.
Further, the contact pins of BeCu or Pd alloy have good contact characteristics, but there is a problem that the tip of the contact pin deviates from the contact angle due to the fatigue of the spring caused by long-term use (contact of several hundred thousand times). And with the high integration of semiconductor integrated circuits,
The conventional bonding pad size is 80 to 120 μm, the pitch is 80 to 150 μm, and the number of pins is 500 to 600, but the bonding pad size is 50 to 80 μm and the pitch is 50 to
When the number of pins is 100 μm and the number of pins is 600 to 1000, the tip diameter of the contact pin becomes thinner, so that it is necessary for the contact pin to date to have higher spring property, conductivity, and contact property.

[0004]

SUMMARY OF THE INVENTION Therefore, the present invention provides a spring test, a wear test, a corrosion test, a conductive test, a test test for an integrated circuit or its substrate even if the semiconductor integrated circuit is highly integrated.
The present invention aims to provide a contact pin that satisfies all of contact resistance stability and the like.

[0005]

One of the contact pins for inspecting an integrated circuit according to the present invention for solving the above-mentioned problems is I
It is characterized in that it is composed of a wire rod tip of r or Ir alloy, and the tip is sharply polished.

Another one of the contact pins for inspecting an integrated circuit according to the present invention is a wire rod tip made of Ir or Ir alloy and W, W.
C, piano wire, high-speed steel, or any other wire rod for springs, which is joined to one of the wire rod chips,
The tip of an Ir or Ir alloy wire rod tip is sharply polished.

[0007]

As described above, since the contact portion of the contact pin for inspecting an integrated circuit according to the present invention is made of Ir or an Ir alloy, the tensile strength and hardness in mechanical characteristics are as high as W, and Not only is it excellent in spring properties and wear resistance, but it is also excellent in corrosion resistance, stability in contact resistance, and satisfactory conductivity.

[0008]

EXAMPLE One of the contact pins for inspecting an integrated circuit according to the present invention
One embodiment will be described with reference to the drawings. As shown in FIG. 1, a tip 2 of an Ir wire rod tip 1 having a diameter of 0.2 mm and a length of 43 mm.
Was subjected to electrolytic etching with hydrochloric acid and sharply ground into a needle shape over a length of 3 mm to obtain a contact pin 3 for inspecting an integrated circuit.

Next, another embodiment of the contact pin for inspecting an integrated circuit according to the present invention will be described with reference to FIG.
As shown in Fig. 2, high-frequency brazing is performed using a brazing filler metal BAg-8 while fluxing an Ir wire rod tip 1'having a diameter of 3 mm and a length of 3 mm and a W wire rod tip 4 having a diameter of 0.2 mm and a length of 40 mm. Then, the tip 2'of the Ir wire rod tip 1'is electrolytically etched with hydrochloric acid and sharply ground into a needle shape over a length of 3 mm to obtain an integrated circuit inspection contact pin 5.

Integrated circuit inspection contacts 3 and 5 of Examples 1 and 2 thus obtained and integrated circuits of Example 1 made of wire rods such as W, Pd alloy, BeCu, and Elgiloy of Conventional Examples 1 to 4 and having the same dimensions. When the performances such as tensile strength, hardness, spring property, wear resistance, corrosion resistance, conductivity, contact property, etc. were compared with the inspection contact pin, the results shown in Table 1 below were obtained.

[0011]

[Table 1]

As can be seen from Table 1 above, Examples 1, 2
The contact pin for integrated circuit inspection of No. 1 has springiness, wear resistance, and
It can be seen that it has excellent corrosion resistance, excellent contact characteristics, and satisfactory conductivity.

However, the tip ends of the integrated circuit test contact pins 3 and 5 of the first and second embodiments and the integrated circuit test contact pin of the conventional example 2 are formed by bending at a predetermined angle, and these are shown in FIGS. After contacting the Au (or Al) electrode 7 of the substrate 6 for a long time (several hundreds of thousands of contacts) as shown in FIG. As shown in FIG. 5, the tip is displaced from the contact angle θ, whereas the contact pins 3 and 5 for inspecting integrated circuits of Examples 1 and 2 have no spring settling. As shown in 3 and 4, the tip was not displaced from the contact angle θ. This is because the contact pins for inspecting integrated circuits of Examples 1 and 2 are excellent in spring property, wear resistance, corrosion resistance, conductivity, contact resistance stability and the like. In the integrated circuit inspection contact pin 5 of the second embodiment, the Ir wire rod tip 1'and the W wire rod tip 4 are joined by high-frequency brazing, but they may be joined by welding. Is.

[0014]

As described above, since the contact portion of the contact pin for inspecting an integrated circuit according to the present invention is made of Ir or an Ir alloy, the tensile strength and hardness in mechanical characteristics are higher as W is comparable to W. In addition to being excellent in spring resistance and wear resistance, it is also excellent in corrosion resistance, excellent in contact characteristics, and satisfactory in conductivity, so even if the semiconductor integrated circuit is highly integrated,
The electric test of the integrated circuit or its substrate can be accurately performed.

[Brief description of drawings]

FIG. 1 is a diagram showing one embodiment of a contact pin for inspecting an integrated circuit according to the present invention.

FIG. 2 is a diagram showing another embodiment of a contact pin for inspecting an integrated circuit according to the present invention.

FIG. 3 is a diagram showing a state in which the tip of the contact pin for inspecting integrated circuit of FIG. 1 is bent and formed at a predetermined angle and then used by contacting with an Au electrode of a substrate.

FIG. 4 is a diagram showing a state in which the tip of the contact pin for inspecting an integrated circuit of FIG. 2 is bent and formed at a predetermined angle, and is then used in contact with an Au electrode on a substrate.

FIG. 5 is a view showing a state in which a tip of a conventional contact pin for inspecting an integrated circuit is bent and formed at a predetermined angle, and is then in contact with an Au electrode of a substrate for use.

[Explanation of symbols]

 1, 1'Ir wire rod tip 2, 2'Ir wire rod tip 3,5 Integrated circuit inspection contact pin 4 W wire rod tip

Claims (2)

[Claims] 1. A contact pin for inspecting an integrated circuit, characterized in that a contact pin used for an electric test of an integrated circuit or a substrate thereof is made of a wire rod chip of Ir or an Ir alloy, and a tip thereof is sharply polished. 2. A contact pin used for electrical test of an integrated circuit or its substrate is a wire rod of Ir or Ir alloy and any one of W, WC, piano wire, high speed steel, and other wire rods for springs. A contact pin for inspecting an integrated circuit, which is formed by joining a chip and a wire rod chip of Ir or an Ir alloy, and a tip of the wire rod is sharply polished.