KR20130135632A - Light emitting diode having reliability improved electrode structure and method for fabricating the same - Google Patents
Light emitting diode having reliability improved electrode structure and method for fabricating the same Download PDFInfo
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- KR20130135632A KR20130135632A KR1020120059381A KR20120059381A KR20130135632A KR 20130135632 A KR20130135632 A KR 20130135632A KR 1020120059381 A KR1020120059381 A KR 1020120059381A KR 20120059381 A KR20120059381 A KR 20120059381A KR 20130135632 A KR20130135632 A KR 20130135632A
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- South Korea
- Prior art keywords
- pattern
- low resistance
- semiconductor layer
- conductive
- conductive laminate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/10—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0016—Processes relating to electrodes
Abstract
Description
The present invention relates to a semiconductor device, and more particularly, to a light emitting diode.
The light emitting diode includes an n-type semiconductor layer, a p-type semiconductor layer, and an active layer disposed between the n-type and p-type semiconductor layers, wherein when a forward electric field is applied to the n- Electrons and holes are injected into the active layer, and electrons injected into the active layer recombine with holes to emit light.
Some of the materials forming the electrodes connected to the n-type semiconductor layer and the p-type semiconductor layer may be oxidized in contact with oxygen in the air. In this case, deterioration of device reliability can be caused.
An object of the present invention is to provide a light emitting diode having an improved electrode structure and a method of manufacturing the same.
According to an aspect of the present invention, there is provided a light emitting diode. The light emitting diode has a light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer. A first electrode is electrically connected to the first conductive semiconductor layer. A second electrode is electrically connected to the second conductive semiconductor layer. The second electrode includes a conductive laminate and a low resistance pattern formed on an upper surface and sidewalls of the conductive laminate.
According to an aspect of the present invention, there is provided an LED according to another aspect of the present invention. The light emitting diode has a light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer. A first electrode is electrically connected to the first conductive semiconductor layer. A second electrode is electrically connected to the second conductive semiconductor layer. The second electrode includes a conductive laminate and a low resistance pattern, which are sequentially stacked, and the low resistance pattern has a width larger than the largest width of the conductive laminate.
According to another aspect of the present invention, there is provided a method of manufacturing a light emitting diode. The manufacturing method includes forming a light emitting structure having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer. A first electrode electrically connected to the first conductive semiconductor layer is formed. A second electrode electrically connected to the second conductive semiconductor layer is formed. Forming the second electrode includes forming a conductive laminate and forming a low resistance pattern on an upper surface and sidewalls of the conductive laminate. Forming the low resistance pattern may be performed using an electroless plating method.
According to the present invention, the low resistance pattern may be formed on the sidewalls of the conductive laminate as well as the top of the conductive laminate. In this case, at least a part of the sidewall of the conductive laminate including a material vulnerable to oxidation can be prevented from being oxidized, thereby improving device reliability. In addition, when the electroless plating method is used, the low resistance pattern can be formed only in a limited region.
1 is a layout showing a light emitting diode according to an embodiment of the present invention.
2A and 2B are cross-sectional views taken step by step along the cutting line II ′ of FIG. 1.
3A and 3B are cross-sectional views taken step by step along the cutting line II-II ′ of FIG. 1.
4 is a cross-sectional view illustrating a method of manufacturing a light emitting diode according to another embodiment of the present invention.
5 is a cross-sectional view illustrating a method of manufacturing a light emitting diode according to another embodiment of the present invention.
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein but may be embodied in other forms.
When a layer is referred to herein as being "on" another layer or substrate, it may be formed directly on another layer or substrate, or a third layer may be interposed therebetween. In the present specification, directional expressions of the upper side, the upper side, the upper side, and the like can be understood as meaning lower, lower (lower), lower, and the like. That is, the expression of the spatial direction should be understood in a relative direction, and it should not be construed as definitively as an absolute direction. In addition, in this specification, "first" or "second" should not be construed as limiting the elements, but merely as terms for distinguishing the elements.
Further, in the drawings, the thicknesses of layers and regions are exaggerated for clarity. Like reference numerals designate like elements throughout the specification.
1 is a layout showing a light emitting diode according to an embodiment of the present invention. 2A and 2B are cross-sectional views taken step by step along the cutting line II ′ of FIG. 1. 3A and 3B are cross-sectional views taken step by step along the cutting line II-II ′ of FIG. 1.
1, 2A, and 3A, a
A
The first
The
A mesa etched region (MR) may be formed in the light emitting structure to expose the first
An ohmic contact layer, a conductive reflection layer, a barrier layer, and a low resistance seed layer are formed on the first
1, 2B, and 3B, first and second
The
In addition, the
Meanwhile, the
As described above, the insulating
The insulating
Forming the
The
The
The
In some cases, the
4 is a cross-sectional view illustrating a method of manufacturing a light emitting diode according to another embodiment of the present invention. The manufacturing method according to the present embodiment is similar to the manufacturing method described with reference to FIGS. 1, 2A, 2B, 3A, and 3B except as described below.
Referring to FIG. 4, an ohmic contact layer, a conductive reflective layer, a barrier layer, and a low layer are formed on the first
The first and second conductive laminates CS1 and CS2 form a positive photoresist pattern on the first
5 is a cross-sectional view illustrating a method of manufacturing a light emitting diode according to another embodiment of the present invention. The manufacturing method according to the present embodiment is similar to the manufacturing method described with reference to FIGS. 1, 2A, 2B, 3A, and 3B except as described below.
Referring to FIG. 5, in the
As such, by forming a large portion of the
In this case, the first
In the present exemplary embodiment, the
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, This is possible.
10:
21: buffer layer 23: first conductive semiconductor layer
25: active layer 27: second conductive semiconductor layer
30: current spreading
41, 51:
45, 55:
47b, 57b: low resistance pattern MR: mesa etching region
Claims (29)
A first electrode electrically connected to the first conductive semiconductor layer; And
A second electrode electrically connected to the second conductivity type semiconductor layer,
The second electrode includes a conductive laminate and a low resistance pattern formed on an upper surface and sidewalls of the conductive laminate.
And an insulating reflective layer disposed between the second electrode and the second conductive semiconductor layer, wherein the insulating reflective layer has a width equal to or greater than the width of the second electrode.
An extension wiring extending from the second electrode onto the second conductivity type semiconductor layer;
The insulating reflective layer extends between the extension wiring and the second conductivity type semiconductor layer and has a width equal to or greater than the width of the extension wiring.
The insulating reflective layer is a light emitting diode DBR.
When the thickness of the low resistance pattern on the conductive laminate is set to 1, the thickness of the low resistance pattern on the sidewall of the conductive laminate is 0.3 to 1.2.
The conductive laminate is a light emitting diode having a low resistance seed pattern.
The low resistance seed pattern and the low resistance pattern is a light emitting diode of the same material.
The low resistance seed pattern and the low resistance pattern is a light emitting diode of Au or Au alloy layer.
The conductive laminate further comprises a reflective pattern positioned below the low resistance seed pattern.
The conductive laminate further comprises an ohmic contact pattern positioned below the reflective pattern.
The conductive laminate further comprises a barrier pattern positioned between the reflective pattern and the low resistance pattern.
The light emitting structure includes a mesa etching region exposing the first conductivity type semiconductor layer,
The first electrode is electrically connected to the first conductive semiconductor layer exposed in the mesa etching region, and has a first low resistance formed on a top surface and sidewalls of the first conductive laminate and the first conductive laminate. With a pattern,
The second electrode is electrically connected on the second conductivity type semiconductor layer, and includes a second conductive laminate and a second low resistance pattern formed on an upper surface and sidewalls of the second conductive laminate;
The first conductive laminate has a first reflective pattern and a first low resistance seed pattern stacked in sequence,
The second conductive laminate has a second reflective pattern and a second low resistance seed pattern sequentially stacked, and an upper surface of the first reflective pattern has a level equal to or higher than an upper surface of the second conductive semiconductor layer. Light emitting diode.
The light emitting structure further includes a current spreading conductive film disposed between the second conductivity type semiconductor layer and the second electrode,
The upper surface of the first reflective pattern has the same level as or higher than the upper surface of the current spreading conductive film.
The first low resistance pattern is not disposed on at least a lower sidewall of the first reflective pattern.
The conductive laminate has a light emitting diode having a larger upper surface than a lower surface thereof.
A first electrode electrically connected to the first conductive semiconductor layer; And
A second electrode electrically connected to the second conductivity type semiconductor layer,
The second electrode includes a conductive laminate and a low resistance pattern, which are sequentially stacked, and the low resistance pattern has a width larger than the largest width of the conductive laminate.
An insulating reflective layer disposed between the second electrode and the second conductive semiconductor layer; And
A current spreading layer disposed between the insulating reflective layer and the second electrode and extending onto the second conductive semiconductor layer,
The width of the insulating reflective layer is larger than the width of the low resistance pattern.
The conductive laminate is a light emitting diode having an ohmic contact pattern, a reflection pattern, a barrier pattern and a low resistance seed pattern stacked in sequence.
The light emitting structure includes a mesa etching region exposing the first conductivity type semiconductor layer,
The first electrode is electrically connected to the first conductive semiconductor layer exposed in the mesa etching region, and has a first low resistance formed on a top surface and sidewalls of the first conductive laminate and the first conductive laminate. With a pattern,
The second electrode is electrically connected on the second conductivity type semiconductor layer, and includes a second conductive laminate and a second low resistance pattern formed on an upper surface and sidewalls of the second conductive laminate;
The first conductive laminate has a first reflective pattern and a first low resistance seed pattern stacked in sequence,
The second conductive laminate has a second reflective pattern and a second low resistance seed pattern stacked in sequence,
The upper surface of the first reflective pattern has the same level as or higher than the upper surface of the second conductive semiconductor layer.
The first low resistance pattern is not disposed on at least a lower sidewall of the first reflective pattern.
The conductive laminate has a light emitting diode having a larger upper surface than a lower surface thereof.
Forming a first electrode electrically connected on the first conductivity type semiconductor layer; And
Forming a second electrode electrically connected to the second conductivity type semiconductor layer,
The forming of the second electrode includes forming a conductive laminate and forming a low resistance pattern on an upper surface and sidewalls of the conductive laminate.
Forming the low resistance pattern is performed using an electroless plating method.
The low resistance pattern is a light emitting diode manufacturing method of Au or Au alloy layer.
Before forming the conductive laminate, further comprising forming an insulating reflective layer on the second conductive semiconductor layer,
The insulating reflective layer is formed to have a larger width than the width of the second electrode light emitting diode manufacturing method.
The conductive laminate is a light emitting diode manufacturing method comprising an ohmic contact pattern, a reflection pattern, a barrier pattern and a low resistance seed pattern stacked in sequence.
Forming a mesa etching region exposing the first conductivity type semiconductor layer in the light emitting structure,
A first conductive laminate and a second conductive laminate are respectively formed on the first conductive semiconductor layer and the second conductive semiconductor layer exposed in the mesa etching region,
Forming a first low resistance pattern on the top surface and sidewalls of the first conductive laminate to form the first electrode, and forming a second low resistance pattern on the top surface and the sidewalls of the second conductive laminate Forming the second electrode, the first conductive laminate has a first reflective pattern and a first low resistance seed pattern stacked in sequence,
The second conductive laminate has a second reflective pattern and a second low resistance seed pattern stacked in sequence,
The upper surface of the first reflective pattern has a level equal to or higher than the upper surface of the second conductive semiconductor layer.
And forming the first low resistance pattern such that the first low resistance pattern is not positioned on at least a lower sidewall of the first reflective pattern.
The conductive laminate is a light emitting diode manufacturing method of the lower surface thereof is formed narrower than the upper surface thereof.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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KR1020120059381A KR20130135632A (en) | 2012-06-01 | 2012-06-01 | Light emitting diode having reliability improved electrode structure and method for fabricating the same |
PCT/KR2013/004082 WO2013169032A1 (en) | 2012-05-09 | 2013-05-09 | Light-emitting diodes having improved light extraction efficiency |
Applications Claiming Priority (1)
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KR1020120059381A KR20130135632A (en) | 2012-06-01 | 2012-06-01 | Light emitting diode having reliability improved electrode structure and method for fabricating the same |
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KR20130135632A true KR20130135632A (en) | 2013-12-11 |
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KR1020120059381A KR20130135632A (en) | 2012-05-09 | 2012-06-01 | Light emitting diode having reliability improved electrode structure and method for fabricating the same |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015102343A1 (en) * | 2013-12-30 | 2015-07-09 | 일진엘이디(주) | Nitride semiconductor light emitting device |
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2012
- 2012-06-01 KR KR1020120059381A patent/KR20130135632A/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015102343A1 (en) * | 2013-12-30 | 2015-07-09 | 일진엘이디(주) | Nitride semiconductor light emitting device |
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