KR20130128854A - Robot arm for transferring a wafer - Google Patents

Robot arm for transferring a wafer Download PDF

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Publication number
KR20130128854A
KR20130128854A KR1020120052963A KR20120052963A KR20130128854A KR 20130128854 A KR20130128854 A KR 20130128854A KR 1020120052963 A KR1020120052963 A KR 1020120052963A KR 20120052963 A KR20120052963 A KR 20120052963A KR 20130128854 A KR20130128854 A KR 20130128854A
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KR
South Korea
Prior art keywords
wafer
transferred
robot arm
transfer
sliding actuator
Prior art date
Application number
KR1020120052963A
Other languages
Korean (ko)
Inventor
심해수
Original Assignee
심해수
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 심해수 filed Critical 심해수
Priority to KR1020120052963A priority Critical patent/KR20130128854A/en
Publication of KR20130128854A publication Critical patent/KR20130128854A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/009—Gripping heads and other end effectors with pins for accurately positioning the object on the gripping head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Abstract

The present invention relates to a robot arm for wafer transfer, which includes a wafer settling platform on which a wafer to be transferred is placed. An outer protrusion corresponding to one outer circumferential surface of the wafer to be transferred is formed on the outer side of the settling, and the transfer object wafer when the wafer to be transferred is settled to the settable on an inner side of the sett opposing the outer protrusion. A sliding actuator is provided which slides in the direction of the wafer to be conveyed by its own weight, and is configured to hold the wafer to be conveyed in different directions together with the outer protrusions. According to the present invention, the damage of the wafer due to the drop impact is prevented by absorbing the drop impact amount of the wafer placed in the resttable by the front projection of the elastic material provided in front of the sliding actuator, it is provided in front of the sliding actuator According to the operation of the front projection made of elastic material, the rear projection provided at the rear grips the outer circumferential surface of the wafer together with the outer locking jaw so that the wafer can be automatically gripped, and the wafer can be adapted even when the wafers having different diameters are placed. The advantage is that the wafer can be gripped without any additional manipulation.

Description

Robot arm for wafer transfer {ROBOT ARM FOR TRANSFERRING A WAFER}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a robot arm for wafer transfer, and more particularly, to a wafer transfer robot arm capable of being gripped and transported without damaging the wafer to be transferred.

In the manufacture of a semiconductor device, a process chamber is connected to transfer a wafer or a circuit board, for example, between connected chambers. Such transfer is via a transfer module, for example, which moves the wafer through slots or ports formed in adjacent walls of the connected chamber.

For example, transfer modules are generally used in connection with various circuit board processing modules that may include semiconductor etching systems, material deposition systems, and flat display panel etching systems. Increasing demands for cleaning and high purity treatments have increased the need to reduce human labor between treatment processes, which in part has led to the use of vacuum transfer modules as intermediate processing units.

As an example, the vacuum transfer module may be located between one or more clean room storage facilities where the circuit board is physically stored, and a composite circuit processing module where the circuit board is actually processed, such as, for example, a process where etching or deposition is performed. . In this sense, when the circuit board is needed for processing, the robot arm located in the transfer module can be used to retrieve the selected circuit board from the storage and locate it in one of the compound processing modules.

As a means for transferring such a wafer, the articulated robot is used in Korea Patent Publication No. 10-2007-0003396. As shown in FIGS. 5 and 6, the robot according to the present disclosure has an arm 10 moving in the X, Y, and Z directions connected to the robot body and an end portion of the arm 10 to provide a wafer W. As shown in FIG. It consists of a block 30 that connects the settling base 20 and the arm 10 and the settling 20. In addition, the block 30 is provided with a pressing table 31 which is provided between the arm 10 and the settable 20 to slide, the settable 20 to prevent the flow of the wafer (W) and the wafer Is provided with an inner latching jaw 21a and an outer locking jaw 21b to allow the front end to be aligned in position on the arm 10, and the inner facing jaw 21a and the outer locking jaw 21b face each other. Has the same curve as the outer circumferential surface of the wafer (W), the upper end of the pressure band 31 is formed to protrude more than the upper end of the inner locking jaw (21a).

In operation of the robot arm, the wafer W is placed on the settable 20 such that the wafer W extends over the inner locking jaw 21a side, and then moves the arm 10 in the direction of the arrow on the drawing to stop. The presser 31 slides in the block 30 and presses one side of the wafer in a state spanning the inner locking jaw 21a to move the wafer toward the outer locking jaw 21b so that the wafer is moved to the inner locking jaw 21a and the outer side. The wafers in the aligned state are mounted on the seating portions 22 formed between the locking jaws 21b and aligned with the settable 20 so as to perform subsequent processes such as movement between the chambers and the chambers or transfer to the cassette side.

However, the robot arm according to the above-mentioned patent document pressurizes the wafer in the state spanning the latching jaw side by using a presser bar so as to be seated on the resttable seat, so that the wafer is seated by the stepped gap between the upper end of the latching jaw and the upper surface of the seating stand. There was a problem of falling into the damage to the impact.

In addition, in the case of the robot arm according to the above-mentioned patent document, there is a problem in that sliding operation of the pressure zone may be performed independently of the operation in which the wafer W is settled on the mounting table 20. .

In order to solve the problem of the above-mentioned patent publication, Korean Patent Publication No. 10-2011-0094259 is provided with another tilting plate to form a predetermined angle with one tilting plate, as shown in Figure 7, the transfer to one tilting plate When the target wafer is settled down while the other tilting plate is interlocked to configure the side of the wafer to be transported. However, in the invention according to this publication, there is a problem in that, if the diameter of the wafer differs from the set diameter, the other tilting plate cannot properly play its role.

Korean Unexamined Patent Publication No. 10-2007-0003396 (published Jan. 5, 2007, titled “wafer transfer device”). Korean Patent Publication No. 10-2011-0094259 (published Aug. 23, 2011, titled "Wafer Transfer Robot Arm")

SUMMARY OF THE INVENTION The present invention has been made to solve the problems of the prior art, and an object of the present invention is not only to accurately place the wafer on the robot arm without damage, but also to securely transport the robot arm that holds the placed wafer. To provide.

It is another object of the present invention to provide a robot arm for wafer transfer having a structure that can grip the outer circumferential surface of the wafer in compliance with the diameter of the wafer.

In order to achieve the above and other objects,

A robot arm for wafer transfer including a wafer settling platform on which a wafer to be transferred is placed, wherein an outer protrusion corresponding to one outer circumferential surface of the wafer to be transferred is formed on an outer side of the seat, and facing the outer protrusion. The inner side is configured to slide in the direction of the wafer to be conveyed by the weight of the wafer to be conveyed by the weight of the wafer to be conveyed in the different direction when the wafer to be conveyed is settled in the resttable. Provided is a robotic arm for wafer transfer provided with a sliding actuator.

Here, the sliding actuator, the bottom sliding portion for sliding along the inner bottom surface of the seat; It is formed integrally with the bottom sliding portion, and elastically deformed outward with respect to the bottom sliding portion includes a section adjusting section for determining the holding section of the wafer to be transferred. The front portion of the interval adjustment portion is formed in the upper front protrusion is formed generally spherical, the rear portion of the interval adjustment portion is formed in the rear projection is relatively larger than the front projection, the rest rests the front projection is located A front groove is formed in the portion, and the rear portion where the rear protrusion is positioned is formed with a long rear groove such that the rear protrusion can move forward in the center direction of the settlement. A compression spring is located at the rear of the sliding actuator so that when the wafer to be transferred is placed on the rest platform, the front protrusion is introduced into the seat by the weight of the wafer to be transferred, so that the sliding actuator slides in the direction of the wafer. This is provided.

At this time, the front groove formed in the stabilization zone is preferably formed to be inclined in the inward direction. In addition, the front protrusion is preferably formed of an elastic member.

In the present invention, a sensor capable of detecting a settled or detached state of the wafer to be transferred is mounted on an upper surface of the platform, and the wafer to be transferred is detached in response to a signal detected by the sensor. When the sliding actuator is forced to be restored to the original position is forcibly extended.

According to the present invention, the damage of the wafer due to the drop impact is prevented by absorbing the drop impact amount of the wafer placed in the resttable by the front projection of the elastic material provided in front of the sliding actuator, it is provided in front of the sliding actuator According to the operation of the front projection made of elastic material, the rear projection provided at the rear grips the outer circumferential surface of the wafer together with the outer locking jaw so that the wafer can be automatically gripped, and the wafer can be adapted even when the wafers having different diameters are placed. The advantage is that the wafer can be gripped without any additional manipulation.

1 is a perspective view schematically showing a main portion of a robot arm for wafer transfer according to one preferred embodiment of the present invention.
2 to 4 is a view showing the operating state of the robot arm for wafer transfer in accordance with one preferred embodiment of the present invention.
In particular, FIG. 2 shows a state in which a wafer is placed in a support frame of a wafer transfer robot arm, and FIG. 3 shows a state in which a wafer is placed in a support frame of a wafer transfer robot arm, and FIG. 4 shows a wafer transfer robot. It shows the state when the wafer is released from the arm rest.
5 to 7 is a view showing a robot arm for wafer transfer according to the prior art.

BRIEF DESCRIPTION OF THE DRAWINGS The invention will be described in more detail with reference to the following illustrative drawings. In describing the present invention, a description of known functions or configurations will be omitted for the sake of clarity of the present invention. In addition, like reference numerals designate like elements throughout the specification.

Outline configuration description

1 to 5 show a robot arm for wafer transfer according to one preferred embodiment of the present invention.

First, referring to FIG. 2 together with FIG. 1, the robot arm 100 for wafer transfer according to one preferred embodiment of the present invention includes a settling base 110 on which a wafer W is placed.

On the outer side of the settable 110, an outer locking jaw or protrusion 112 corresponding to one outer peripheral surface of the wafer to be transferred W is formed.

The transfer target is caused by the weight of the transfer target wafer (W) when the transfer target wafer (W) is placed on the inside stand (110) opposite the outer protrusion (112). A sliding actuator 150 is provided which slides toward the center of the wafer W and is configured to grip the transfer target wafer W together with the outer protrusion 112 in different directions.

Here, the sliding actuator 150 is integral with the bottom sliding part 152 and the bottom sliding part 152 that slide along the inner bottom surface of the platform 110 as shown in FIGS. 2 to 4. And a section adjustment unit 156 elastically deformed outward with respect to the bottom sliding part 152 to determine a holding section of the transfer target wafer W. In this case, an elastic piece 154 is provided between the bottom sliding part 152 and the section adjusting part 156 to generate elastic forces to the outside. The sliding actuator 150 may be entirely made of an elastic body such as plastic, or may be made of an elastic body such as plastic only in a section in which elastic deformation is desired.

In front of the section adjustment unit 156, as shown in Figures 2 to 4, the upper portion of the spherical front projection 157 is formed to protrude. The rear protrusion 158 that is relatively larger than the front protrusion 157 is protruded from the rear of the section adjusting unit 156.

Accordingly, a front groove 114 for accommodating the front protrusion 157 is formed at the portion of the stand 110 where the front protrusion 157 of the section adjusting unit 156 is positioned, and the rear protrusion 158 is formed. A long rear groove 116 is formed at the portion of the stand 110 where the rear protrusion 158 can move forward in the center direction of the stand 110.

At this time, the upper surface of the section adjusting unit side front projection 157 is preferably made of an elastic material capable of absorbing the drop impact amount when the transfer target wafer (W) is placed on the mounting platform (110). In addition, it is preferable that the front surface of the section adjusting unit side rear projection 158 is made of an elastic material capable of absorbing the sliding impact amount on the outer peripheral surface thereof after the transfer target wafer W is placed on the mounting table 110.

In addition, at the rear of the sliding actuator 150, when the transfer target wafer W is placed on the mounting table 110, the section adjusting unit side front protrusion 157 is formed by the weight of the transfer target wafer W. A compression spring 160 is provided at a rear side thereof so that the sliding actuator 150 slides toward the wafer W so that the sliding actuator 150 slides toward the wafer W.

At this time, the section adjusting portion side front protrusion 157 is inclined toward the inside of the stabilization 110, in particular, as shown in Figure 2 so that the front groove 114 formed in the stabilization 110 is easily 115 ) Is prepared.

In addition, a sensor 170 may be mounted on an upper surface of the mounting stand 110 to detect a settled or detached state of the wafer W to be transferred. In addition, the sliding actuator 150 is forcibly elongated to be restored to its original position when the transfer target wafer W is separated in response to a signal sensed by the sensor 170. Forced extension 180 is mounted. An extension shaft 182 that is substantially extended is provided inside the forced extension unit 180.

Hereinafter, the operating state of the robot arm for wafer transfer according to the present invention will be described.

2 to 5 illustrate the state in which the wafer is placed on the rest of the robot arm for the wafer transfer robot arm according to the present invention and the state in which the wafer is separated.

Referring to Figure 2, before the wafer (W) is placed on the mounting platform 110 of the robot arm 100 for wafer transfer according to the present invention, the sliding actuator 150 is restrained in the interior of the mounting table 110 The interval adjusting part 156 of the elastic member 110 is maintained in an upward direction with respect to the bottom sliding part 152 supported on the inner bottom surface of the arbor 110.

At this time, the front projection 157 of the section adjustment unit 156 is constrained to the front groove 114 of the arbor 110, the rear projection 158 of the section adjustment unit 156 is a long rear of the arbor 110. The rear is constrained in the groove 116. In addition, the sliding actuator 150 is directed by the compression spring 160 to the rear of the sliding actuator 150 to the right in the drawing.

In such a situation, as shown in FIG. 3, when the transfer target wafer W is placed on the platform 110, the section is restrained by the front groove 114 of the platform 110 by the weight of the wafer W. While the restraint of the front protrusion 157 of the adjusting unit 156 is released, the whole travels forward, that is, to the right in the drawing by the compression spring 160 disposed behind the sliding actuator 150.

At this time, the front projection 157 of the section adjustment unit 156 is made of an elastic member to absorb the drop impact amount of the wafer to be transferred to the rest set. In addition, the front groove 114 of the rest restraint 110, which restrains the front projection 157 of the section adjusting section 156 is formed to be inclined inward to the front of the section adjusting section 156 from the front groove of the rest rest 110. The restrained state of the projection 157 is easily released. At the same time, the front projection 157 formed in the section adjusting unit 156 is moved in frictional contact with the inner upper surface of the settlement, so that the moving speed of the sliding actuator 150 by the compression spring 160 is increased by the compression spring. It is to fall below the expansion force by 160 to proceed in a reduced state.

Thereafter, the rear protrusion 158 provided in the section adjusting unit 156 of the sliding actuator 150 is transported together with the outer protrusion 112 provided at the end of the arthroscopy 110 while contacting the outer peripheral surface of one side of the wafer W. By holding the target wafer, the transfer target wafer W is constrained in the holding state unless there is an external force.

When the transfer target wafer W is detached from the support stand 110 of the robot arm 100 for wafer transfer according to the present invention as necessary, the detachment of the wafer W is detected by the sensor 170 as shown in FIG. 4. One end of the forced extension part 180 provided below the sensor 170 forcibly retracts the bottom sliding part 152 of the sliding actuator 150 based on the detected motion. That is, the sliding actuator 150 is forcibly restored to its original position by the forced extension unit 180 described above.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. It can be understood that it is possible.

100: robot arm 110 for wafer transfer
112: outer protrusion 114: front groove
116: rear groove 120: block
150: sliding actuator 152: floor sliding portion
154: elastic piece 156: section adjustment unit
157: front projection 158: rear projection
160: compression spring 170: sensor
180: forced extension 182: extension axis
W: Wafer

Claims (5)

A robot arm for wafer transfer, comprising a wafer settling platform on which a wafer to be transferred is placed,
An outer protrusion corresponding to one outer circumferential surface of the wafer to be transferred is formed on the outer side of the settling base, and the wafer to be transferred when the wafer to be transferred is settled to the settable on the inner side of the settable facing the outer protrusion. And a sliding actuator which is slid in the direction of the wafer to be conveyed by its own weight, and configured to grip the wafer to be conveyed in different directions together with the outer protrusions. The method according to claim 1,
The sliding actuator,
A bottom sliding part sliding along the inner bottom surface of the settlement;
It is formed integrally with the bottom sliding portion, and elastically deformed outward with respect to the bottom sliding portion includes a section adjusting unit for determining the holding section of the wafer to be transferred,
An upper portion of the front portion of the interval adjustment portion is formed in the form of a large spherical front projection, the rear portion of the interval adjustment portion relatively larger than the front projection is formed,
The front groove is formed in the rest area where the anterior projection is positioned, and the rear part is long enough to allow the rear projection to move forward in the center direction of the stabilization zone. Grooves are formed,
At the rear of the sliding actuator, when the wafer to be transferred is placed in the rest platform, the front protrusion is introduced into the interior of the seat by the weight of the wafer to be transferred so that the sliding actuator slides in the direction of the wafer. Robot arm for wafer transfer, characterized in that a compression spring is provided. The method according to claim 2,
The robot arm for wafer transfer, wherein the front groove formed in the stabilization zone is formed to be inclined inward. The robotic arm of claim 2, wherein the front protrusion is formed of an elastic member. The method according to any one of claims 1 to 4,
On the upper surface of the mounting table is mounted a sensor that can detect the settled or detached state of the wafer to be transferred,
The robot arm for wafer transfer, characterized in that the inside of the mounting platform is forcibly elongated to extend the sliding actuator to be restored to the original position when the transfer target wafer is released in accordance with the signal detected by the sensor.
KR1020120052963A 2012-05-18 2012-05-18 Robot arm for transferring a wafer KR20130128854A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020120052963A KR20130128854A (en) 2012-05-18 2012-05-18 Robot arm for transferring a wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120052963A KR20130128854A (en) 2012-05-18 2012-05-18 Robot arm for transferring a wafer

Publications (1)

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KR20130128854A true KR20130128854A (en) 2013-11-27

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KR1020120052963A KR20130128854A (en) 2012-05-18 2012-05-18 Robot arm for transferring a wafer

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107039307A (en) * 2015-10-22 2017-08-11 朗姆研究公司 Consumable part is changed automatically with the end effector of connection plasma process system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107039307A (en) * 2015-10-22 2017-08-11 朗姆研究公司 Consumable part is changed automatically with the end effector of connection plasma process system
CN107039307B (en) * 2015-10-22 2020-12-08 朗姆研究公司 Automatic replacement of consumable components with an end effector coupled to a plasma processing system

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