KR20130126458A - 플라즈마 처리 장치 - Google Patents
플라즈마 처리 장치 Download PDFInfo
- Publication number
- KR20130126458A KR20130126458A KR1020130005786A KR20130005786A KR20130126458A KR 20130126458 A KR20130126458 A KR 20130126458A KR 1020130005786 A KR1020130005786 A KR 1020130005786A KR 20130005786 A KR20130005786 A KR 20130005786A KR 20130126458 A KR20130126458 A KR 20130126458A
- Authority
- KR
- South Korea
- Prior art keywords
- faraday shield
- plasma
- gas
- processing apparatus
- plasma processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
- H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Electromagnetism (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Plasma Technology (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012109063 | 2012-05-11 | ||
| JPJP-P-2012-109063 | 2012-05-11 | ||
| JP2012209582A JP2013254723A (ja) | 2012-05-11 | 2012-09-24 | プラズマ処理装置 |
| JPJP-P-2012-209582 | 2012-09-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20130126458A true KR20130126458A (ko) | 2013-11-20 |
Family
ID=49547716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020130005786A Ceased KR20130126458A (ko) | 2012-05-11 | 2013-01-18 | 플라즈마 처리 장치 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20130299091A1 (https=) |
| JP (1) | JP2013254723A (https=) |
| KR (1) | KR20130126458A (https=) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5617817B2 (ja) * | 2011-10-27 | 2014-11-05 | パナソニック株式会社 | 誘導結合型プラズマ処理装置及び誘導結合型プラズマ処理方法 |
| JP2015138602A (ja) * | 2014-01-21 | 2015-07-30 | 株式会社アルバック | プラズマ処理用整合器、プラズマ処理装置、および、プラズマ処理用整合器の駆動方法 |
| US20160118284A1 (en) * | 2014-10-22 | 2016-04-28 | Panasonic Intellectual Property Management Co., Ltd. | Plasma processing apparatus |
| JP2017045916A (ja) * | 2015-08-28 | 2017-03-02 | パナソニックIpマネジメント株式会社 | プラズマ処理装置およびプラズマ処理方法 |
| GB201603581D0 (en) * | 2016-03-01 | 2016-04-13 | Spts Technologies Ltd | Plasma processing apparatus |
| CN105931940B (zh) | 2016-06-01 | 2018-09-21 | 京东方科技集团股份有限公司 | 一种电感耦合等离子体装置 |
| TWI733021B (zh) | 2017-05-15 | 2021-07-11 | 美商應用材料股份有限公司 | 電漿源組件、處理腔室與處理基板的方法 |
| KR102456063B1 (ko) * | 2017-12-15 | 2022-10-19 | 어플라이드 머티어리얼스, 인코포레이티드 | 수직 플라즈마 소스로부터의 개선된 플라즈마 노출을 위한 성형된 전극들 |
| CN108121004B (zh) * | 2018-01-05 | 2019-05-24 | 北京航空航天大学 | 法拉第探针 |
| CN110660635B (zh) * | 2018-06-29 | 2022-08-16 | 北京北方华创微电子装备有限公司 | 工艺腔室和半导体处理设备 |
| CN110416053B (zh) * | 2019-07-30 | 2021-03-16 | 江苏鲁汶仪器有限公司 | 一种电感耦合等离子体处理系统 |
| US12519108B2 (en) * | 2021-06-17 | 2026-01-06 | Resonac Corporation | Negative electrode material for lithium ion secondary battery, negative electrode for lithium ion secondary battery, and lithium ion secondary battery |
| JP7760389B2 (ja) | 2022-01-24 | 2025-10-27 | 東京エレクトロン株式会社 | プラズマ処理装置 |
-
2012
- 2012-09-24 JP JP2012209582A patent/JP2013254723A/ja not_active Withdrawn
-
2013
- 2013-01-17 US US13/743,748 patent/US20130299091A1/en not_active Abandoned
- 2013-01-18 KR KR1020130005786A patent/KR20130126458A/ko not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013254723A (ja) | 2013-12-19 |
| US20130299091A1 (en) | 2013-11-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR20130126458A (ko) | 플라즈마 처리 장치 | |
| US7837826B2 (en) | Hybrid RF capacitively and inductively coupled plasma source using multifrequency RF powers and methods of use thereof | |
| JP2024012608A (ja) | プラズマ処理装置 | |
| TWI839420B (zh) | 電漿沉積腔室及用以在基板上沉積多層膜之方法 | |
| TWI851944B (zh) | 用於循環與選擇性材料移除與蝕刻的處理腔室 | |
| KR101387067B1 (ko) | 드라이 에칭 장치 및 드라이 에칭 방법 | |
| US9960014B2 (en) | Plasma etching method | |
| WO2014035688A1 (en) | Method and apparatus for a large area inductive plasma source | |
| KR102016408B1 (ko) | 플라스마 처리 장치 | |
| KR101496841B1 (ko) | 혼합형 플라즈마 반응기 | |
| CN112534552B (zh) | 等离子处理装置 | |
| KR101274515B1 (ko) | 플라즈마 처리장치 | |
| KR20200051505A (ko) | 배치대 및 기판 처리 장치 | |
| JP2019160714A (ja) | プラズマ処理装置 | |
| JP6595335B2 (ja) | プラズマ処理装置 | |
| KR102207755B1 (ko) | 플라스마 처리 장치 | |
| KR20220156070A (ko) | 기판 프로세싱 챔버를 위한 유전체 윈도우 | |
| KR102774860B1 (ko) | 원격 플라즈마 프로세스들을 위한 방전 모드 및 대칭 중공 캐소드 전극을 위한 방법들 및 장치 | |
| KR20070041220A (ko) | 플라즈마 처리 장치 | |
| US20150279623A1 (en) | Combined inductive and capacitive sources for semiconductor process equipment | |
| US20240222085A1 (en) | Plasma processing method and plasma processing apparatus including applying a voltage to a lower electrode in a substrate support with a gas supplied into a chamber | |
| JP2016134460A (ja) | プラズマ処理装置およびプラズマ処理方法 | |
| KR20240037737A (ko) | 기판 처리 장치 및 기판 처리 방법 | |
| JP2024033855A (ja) | プラズマ処理装置 | |
| CN120656918A (zh) | 排气网、等离子体处理装置以及等离子体处理方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| D13-X000 | Search requested |
St.27 status event code: A-1-2-D10-D13-srh-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| D14-X000 | Search report completed |
St.27 status event code: A-1-2-D10-D14-srh-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| AMND | Amendment | ||
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
St.27 status event code: N-2-6-B10-B15-exm-PE0601 |
|
| AMND | Amendment | ||
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PX0901 | Re-examination |
St.27 status event code: A-2-3-E10-E12-rex-PX0901 |
|
| PX0601 | Decision of rejection after re-examination |
St.27 status event code: N-2-6-B10-B17-rex-PX0601 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |