KR20130119676A - Conductive contactor for absorbing electromagnetic waves for surface mounting technology - Google Patents

Abstract

A conductive contact terminal for surface mounting on a substrate for absorbing electromagnetic waves according to the present invention comprises: an elastic core which includes soft magnetic metal powder to provide radio wave absorption; a metal layer which surrounds the outside of the elastic core; and an adhesive layer which bonds the elastic core and the metal layer to each other. The present invention provides the conductive contact terminal for surface mounting on the substrate which is capable of improving radio wave absorption while having excellent electrical conductivity, elastic stability, and heat resistance which a contact terminal capable of being soldered need to have. Thus, diseases which can occur under the influence of electromagnetic waves can be prevented, and the performance of products can be improved and the life thereof can be extended by reducing electromagnetic interference (EMI).

Description

Technical Field [0001] The present invention relates to a conductive electromagnetic wave absorbing contact terminal for mounting on a surface of a substrate,

The present invention relates to a contact terminal mounted on a surface of a substrate, and more particularly to a contact terminal mounted on a surface of a substrate, and more particularly to a contact terminal having an excellent radio wave absorbing capability which can be used between a contact region of a circuit board and an electronic component, .

Recently, as electronic devices have become more compact, lighter, and thinner, circuits become more multilayered and densified, and the possibility of generating electromagnetic waves is rapidly increasing. Electromagnetic waves generated in the internal circuits of such various electronic devices are generally discharged to the outside through the air or conducted through a power line or the like to cause noise or malfunction in peripheral parts or devices, It is known that when exposed, body temperature changes and biorhythm are broken, and it is likely to develop into a disease, which is harmful to the human body.

 Especially, high frequency is affected by electric and chemical changes in the body, such as the microwave of a microwave oven raises the temperature by oscillating the water molecule inside the food. Therefore, a very strong high frequency may cause stress, There are many studies on the harmful effects of electromagnetic waves on human body, such as causing chemical changes and causing severe brain tumors.

In addition, electromagnetic waves affect machines. Electromagnetic interference (EMI), which is generated incidentally from an electronic device, affects the operation of the device itself or other devices. As a result, electromagnetic interference (EMI) Shortening the life span. At high frequencies, it is easy to radiate electromagnetic waves, so it is likely to disturb others, and it is likely to be disturbed by radiation or induction from others.

As a result of many problems related to electromagnetic waves, not only in advanced countries but also in Korea, it is required to limit the product itself to generate electromagnetic waves and to produce products. In addition, in developed countries, electromagnetic wave immunity which does not cause malfunction even when receiving electromagnetic waves from outside EMS, electormagnetic susceptability) to be included in the specification of the product.

Surface Mount Technology (SMT) is an automation technology that places electronic components on a printed circuit board (PCB) and mounts them by applying high temperature. Through such SMT process, the quality of electrical contact between electronic components is improved, The time is shortened and the miniaturization of the product becomes more possible.

The surface mounting process involving reflow soldering proceeds at a high temperature of 180 to 270 DEG C. When a conventional conductive material is simply used, the product is deformed to lose its conductivity and can not actually serve as a conductive contact terminal. It is necessary to use a contact terminal suitable for the mounting process.

Accordingly, there has been developed a conductive contact terminal for surface mounting that does not cause material deformation even in a high-temperature reflow soldering process and does not lose its conductivity even if breakage occurs in a metal layer that imparts conductivity to the conductive contact terminal. However, this has limitations of the electromagnetic wave absorbing capability, which has a problem in reducing the harmful effects on the human body due to interference and adverse effects of electromagnetic waves, and as a countermeasure for suppressing noise and malfunction of electronic devices.

SUMMARY OF THE INVENTION The present invention has been made to overcome the above-described problems, and an object of the present invention is to provide a semiconductor device, which is free from deformation of a material even in a high-temperature reflow soldering process, minimizes adverse effects caused by electromagnetic waves, And to provide a conductive contact terminal for surface mounting for suppressing noise and malfunction.

In order to solve the above problems, the present invention,

An elastic core including a polymer that imparts elasticity to the contact terminal; A metal layer formed to surround an outer side of the elastic core; And an adhesive layer for bonding the elastic core and the metal layer to each other between the elastic core and the metal layer, wherein the elastic core provides a conductive contact terminal for surface mounting having radio wave absorption capability.

According to a preferred embodiment of the present invention, the elastic core may include an elastic rubber and a soft magnetic metal powder.

According to another preferred embodiment of the present invention, the soft magnetic metal powder may include carbonyl iron powder.

According to another preferred embodiment of the present invention, the soft magnetic metal powder may include 50 to 90 parts by weight based on 100 parts by weight of the elastic rubber.

According to another preferred embodiment of the present invention, the soft magnetic metal powder may have a particle size of 2 to 100 mu m.

According to another preferred embodiment of the present invention, the contact terminal may have a reflection loss characteristic of -1 dB or less in the frequency band of 0.5 to 18 GHz at an elastic core thickness of 5 mm or less.

According to another preferred embodiment of the present invention, the elastic rubber may be one selected from the group consisting of crosslinked synthetic rubber, crosslinked natural rubber or silicone rubber.

According to another preferred embodiment of the present invention, a center hole may be formed at the center of the elastic core.

According to another preferred embodiment of the present invention, the metal layer may include a heat-resistant film layer including a plurality of holes, and first and second metal coating layers coated on both sides of the film layer, respectively.

According to another preferred embodiment of the present invention, the diameter of the hole may be 0.2 to 10 mm.

According to another preferred embodiment of the present invention, the metal layer may be selected from the group consisting of copper, nickel, gold, silver, and tin.

According to another preferred embodiment of the present invention, the first and second metal coating layers may have a thickness of 0.5 to 20 탆.

According to another preferred embodiment of the present invention, the contact terminal may further include a metal foil adhered to the lower surface of the substrate, which is bonded to the substrate surface, with a conductive adhesive.

The contact terminal of the present invention having conductivity and electromagnetic wave absorption ability for mounting on a surface of a substrate exhibits a high electromagnetic wave absorption ability in a high frequency band and is capable of generating harmful effects such as stress, heart disease, brain tumor, (EMI), which is caused by incidental electromagnetic waves from an electronic device, affects the operation of the device itself or other devices, thereby improving the performance of the product and extending the life of the product .

 Further, since the conductive contact terminal for mounting on the surface of the substrate according to the present invention has sufficient elasticity unlike the contact terminal made of a conventional metal material, it can be inserted at various heights required at the portion where the contact element is inserted. The conductive contact terminal of the present invention exposes both end faces of the elastic core in the longitudinal direction of the elastic core, so that when the pressure acts, the elastic core easily escapes to both end faces, thereby providing reliable elasticity and restoring force.

That is, according to the present invention, it is possible to provide a surface mounting contact terminal having excellent electrical conductivity, resilient resilience, and heat resistance that can be soldered to a contact terminal, but also excellent in radio wave absorption capability.

1 is a perspective view of a conductive electromagnetic wave absorbing contact terminal for surface mounting a board according to an embodiment of the present invention.
2 is a graph showing reflection loss values measured according to the method of KS C0305 for the conductive contact terminals for surface mounting manufactured according to the methods of Examples 1 to 5 and Comparative Example 1. Fig.
3 is a graph showing reflection loss values measured according to the KS C0305 method for the conductive contact terminals for surface mounting manufactured according to the methods of Examples 6 to 10 and Comparative Example 2. Fig.
4 is a graph showing reflection loss values measured according to the KS C0305 method for the conductive contact terminals for surface mounting manufactured according to the methods of Examples 11 to 15 and Comparative Example 3. Fig.
5 is a graph showing reflection loss values measured according to the KS C0305 method for the conductive contact terminals for surface mounting manufactured according to the methods of Examples 16 to 20 and Comparative Example 4. Fig.
6 is a graph showing reflection loss values measured according to the method of KS C0305 for the conductive contact terminals for surface mounting manufactured according to the methods of Example 21 and Example 6. Fig.
7 is a graph showing reflection loss values measured according to the KS C0305 method for the conductive contact terminals for surface mounting manufactured according to the methods of Example 22 and Example 6. Fig.

BRIEF DESCRIPTION OF THE DRAWINGS The invention will be described in more detail with reference to the accompanying drawings.

As described above, the conventional conductive contact terminals for surface mounting on a substrate have limitations on the ability to absorb electromagnetic waves, thereby reducing the harmful effects on the human body due to interference and adverse influences of electromagnetic waves, and measures for suppressing noise and malfunction of electronic equipment There was a problem that it was insufficient.

Accordingly, the present invention provides an elastic core comprising a polymer for imparting elasticity to a contact terminal; A metal layer formed to surround an outer side of the elastic core; And an adhesive layer for bonding the elastic core and the metal layer to each other between the elastic core and the metal layer, wherein the elastic core provides a conductive contact terminal for surface mounting having radio wave absorption capability, The problem was solved by reducing the adverse effects on the operation of other devices and preventing diseases caused by electromagnetic waves.

1 is a perspective view of a conductive electromagnetic wave absorbing contact terminal for surface mounting according to an embodiment of the present invention. The elastic core 10 for imparting elasticity to the contact terminal 1 of the present invention may be made of synthetic rubber, crosslinked natural rubber, silicone rubber or the like. Considering that the surface mounting process is performed at a high temperature of 180 to 270 DEG C, it is preferable that the elastic core 10 uses a heat resistant material so that the core is not denatured by heat. The elastic core 10 is not particularly limited as long as it has a certain level of elasticity, but a silicone elastic core is preferably used. The silicone elastic core 10 is formed by a method of extrusion.

The elastic core 10 may include an elastic rubber and a soft magnetic metal powder. The soft magnetic metal powder may be at least one selected from the group consisting of carbonyl iron, Fe-Si-Al, permalloy, Ni-Zn ferrite, Mn-Zn ferrite, , And more preferably carbonyl iron powder can be used.

6 and 7, when the soft magnetic metal powder permalloy, nickel-zinc (Ni-Zn) ferrite is included in the elastic core, it has radio wave absorption ability in the frequency band of 0.5 to 18 GHz, It can be seen that the reflection loss value is larger than Carbonyl Iron in most frequency bands, and the effect of electromagnetic wave absorption is inferior.

The soft magnetic metal powder may include 50 to 90 parts by weight based on 100 parts by weight of the elastic rubber. If the amount is less than 50 parts by weight based on 100 parts by weight of the elastic rubber, it is difficult to obtain a desired radio wave absorption ability. If the amount is more than 90 parts by weight, the content of the soft magnetic metal powder becomes too large.

The soft magnetic metal powder may have a particle size of 2 to 100 mu m. When the size of the powder is less than 2 탆, there is a problem of deteriorating the magnetic properties. When the particle size is more than 100 탆, scratching occurs on the coated surface due to the size of the particles during coating, There is a problem.

The combination of the elastic rubber and the soft magnetic metal powder is performed in a pressure kneader capable of obtaining efficient dispersion characteristics in a short time. The elastic rubber and the soft magnetic metal powder compound compounded in such a pressure kneader obtain an elastic core having an excellent radio wave absorption ability by an extrusion process.

The contact terminal may have a reflection absorption value of -1 dB or less measured according to the KS C0305 method in the frequency band of 0.5 to 18 GHz at an elastic core thickness of 5 mm or less.

The hardness of the silicone rubber for the elastic core is preferably in the range of 20 DEG to 80 DEG. When the hardness is lowered to 20 or less, the viscosity is so low that it is difficult to maintain the shape of the molded body, and when the hardness is higher than 80, the viscosity becomes too high and molding becomes difficult. The reflection loss value of the radio wave absorbing silicone elastic core manufactured by mixing in the above manner is made to be -1 dB or less in the frequency band of 0.5 to 18 GHz at a thickness of 5 mm or less. The hardness of the elastic rubber and the specific The return loss value in the frequency band can be determined by appropriately selecting the hardness and blending ratio of the silicone rubber according to the purpose.

The silicone elastic core 10 molded by the extrusion method can be cured by standing for about 0.1 to 3 minutes on a vertical loader maintained at a temperature of about 170 to 350 ° C. Can be adjusted.

Meanwhile, a central hole may be formed at the center of the elastic core 10 to penetrate the elastic core 10 in the longitudinal direction. At this time, the center hole thus formed can be more easily compressed when the center hole is not formed, so that the elastic force of the elastic core can be improved. In addition, the volume of the elastic core can be reduced by the volume of the center hole, thereby reducing the overall manufacturing cost. Meanwhile, the center hole may be formed in various shapes depending on the purpose. The formation of the various types of center holes depends on various die shapes used in the extrusion of the silicon core. By using such various shapes of dies, The shape and size of the center hole can be changed.

In addition, the conductive contact terminals for mounting on the surface of the substrate of the present invention may have various cross-sectional shapes according to various cross-sectional shapes of the elastic core 10. The elastic core 10 may have various shapes such as a rectangular shape, a trapezoid shape, a pipe shape, and the like, without any particular limitation.

The conductive adhesive 30 is applied on the thus-produced elastic core and the metal layer 20, which is another component of the present invention, is adhered to obtain the conductive contact terminal for surface mounting of the substrate according to the present invention. The metal layer 20 may include a heat resistant film layer 21 including a plurality of holes and first and second metal coating layers 22 coated on both sides of the film layer.

 At this time, it is preferable that the conductive adhesive 30 contains a silicon component having adhesiveness and a metal powder for maintaining electrical conductivity. This conductive adhesive 30 is very suitable for adhesion of a silicon material and can be energized by the contained metal powder. The metal powder includes silver, gold, copper, nickel, nickel-iron alloy, tin, and silver coated with silver. The conductive adhesive 30 is discharged onto the surface of the elastic core by a discharger at a constant speed, and the elastic core is coated to a predetermined thickness while passing through a mold having a large outer shape and a clearance of about 0.01 to 1 mm.

Next, the metal layer 20 formed on the elastic core 10, which is another component of the present invention, will be described in detail. The conductive metal layer 20 may be selected from the group consisting of copper, nickel, gold, silver, and tin, although there is no particular limitation on the type of the conductive metal layer 20 as long as the soldering operation is possible. The metal layer 20 in the present invention means a material containing a metal component capable of conducting electricity, and is used as a concept including a metal foil, a metal mesh, and a film coated with a metal.

The metal layer 20 includes a film 21 and a metal coating layer 22 formed by coating a metal component on the both surfaces of the film 21. As described above, the metal layer 20 of the present invention includes first and second metal coating layers 22 coated on both surfaces thereof, and the film layer 21 is formed with a plurality of holes, The coating layer 22 may be electrically connected to each other through the plurality of hole wall surfaces.

Preferably, the hole of the film layer 21 may have a diameter (PHI) of 0.2 to 10 mm. When such a hole is coated with a metal component on the heat resistant film 21 having such holes formed by using the ultrasonic method, the laser method, or the punching method, not only the metal component is coated on both surfaces of the film, The metal surface may be coated or filled with a metal component. The heat-resistant film can be energized by the metal coating layer 22 formed in the hole.

The metal coating layer 22 may be formed of a thin metal coating layer on the heat resistant film 21 by wet electrolytic plating. At this time, the first and second metal coating layers 22 may have a thickness of 0.5 to 20 탆. When the metal foil is too thin to less than 0.5 mu m, reflow soldering does not occur, and when the metal foil is thicker than 20 mu m, the formability and elasticity of the product deteriorate without particularly improving the conductivity.

Considering that the product of the present invention should undergo a reflow soldering process during the surface mounting process, it is preferable to use a film having heat resistance. As the heat resistant film suitable for the film 21, polyimide (PI), polyethylene Naphthanate (PEN), polyphenol sulfide (PPS), or the like is preferable. In particular, the polyimide film is excellent in heat resistance, can be freely bent, and can be applied in a thin shape, and thus is suitable for use in cellular phones, digital cameras, LCDs, and PDP televisions. Further, when a flame-retardant epoxy adhesive is applied on the flame-retardant film, it is more preferable from the viewpoint of heat resistance. The flame-retardant epoxy-based adhesive can be uniformly applied on a flame-retardant film in a solid phase. This flame-retardant epoxy adhesive is adhered to other materials while thinly and uniformly applied to the film, and hardens when heat is applied to provide adhesion with other materials.

In the present invention, an underlying deposition layer of a metal such as copper, nickel, gold, silver or tin or a base metal layer (or a 'lower plating layer') is further formed between the heat resistant film 21 and the metal coating layer 22 . The base metal layer not only lowers the electrical resistance of the metal coating layer, which plays a major role in electrical conduction, but also enhances the bonding strength between the metal coating layer and the heat resistant film. Such a base metal layer can be formed by a deposition method or a wet electroless plating method. There is no particular limitation on the method of forming such a base metal layer. The base metal layer formed on the heat resistant film serves to firmly fix the metal coating layer to the film by wet plating, thereby preventing the metal coating layer from being separated and thereby preventing the loss of conductivity.

The metal layer 20 including the metal coating layer 22 and the heat resistant film 21 is covered and adhered to the surface of the conductive silicone elastic core 10 coated with the conductive adhesive 30. The metal layer 20 is bonded to the metal layer 20 while being cut in accordance with the outer peripheral surface length of the silicon elastic core 10. The silicon elastic core 10 to which the metal layer 20 is adhered is bonded at a temperature of 200 to 300 占 폚 And passes through an oven having a temperature to be cured. The conductive core 10 to which the conductive metal layer 20 is bonded can be cut to a predetermined size to manufacture the conductive contact terminal 1 for surface mounting.

Further, the contact terminal may further include a metal foil adhered to the lower surface of the substrate with the conductive adhesive. The conductive contact terminal to which the metal foil is attached is increased in affinity with the metal (tin-plated copper foil) by the metal foil, thereby improving the adhesion during soldering. When the thickness of the metal foil is as low as 5 占 퐉 or less, the metal foil may have a thickness of 5 占 퐉 to 200 占 퐉. If the thickness of the metal foil is too thin, wrinkles may occur at the time of bonding, so that it is difficult to achieve uniform soldering, . Also, if the thickness of the metal foil is increased to 200 탆 or more, it is difficult to cut the metal foil at regular intervals, and the manufacturing cost is increased.

Hereinafter, the present invention will be described in more detail with reference to Examples. It is to be understood that the scope of the present invention is not limited by these examples in accordance with the gist of the present invention, and it is to be understood by those skilled in the art that the present invention is not limited thereto It will be obvious.

≪ Example 1 >

Shore A Carbonyl iron having a particle size of 5 to 10 mu m on a silicone rubber layer of 30 DEG according to the hardness method was kneaded (Dispersion Kneader) in a ratio of 90 parts by weight to 100 parts by weight of silicone rubber, and the mixture was dispersed at a speed of 2M / Extruded, and cured at 250 DEG C in a vertical flow path.

The thickness of the silicone elastic core was set to 2.0 mm, the silicone adhesive was uniformly applied to a thickness of about 0.1 mm, and then a conductive copper and tin-plated polyimide film was wrapped thereon and cut to a predetermined length, A conductive contact terminal was produced.

≪ Examples 2 to 5 >

Except that Carbonyl Iron was kneaded (Dispersion Kneader) at 80 parts by weight, 70 parts by weight, 60 parts by weight and 50 parts by weight, respectively, relative to 100 parts by weight of silicone rubber .

≪ Examples 6 to 10 >

90 parts by weight, 80 parts by weight, 70 parts by weight, 60 parts by weight, and 50 parts by weight of carbonyl iron (Carbonyl Iron) were kneaded by Dispersion Kneader Was prepared in the same manner as in Example 1.

≪ Examples 11 to 15 >

90 parts by weight, 80 parts by weight, 70 parts by weight, 60 parts by weight and 50 parts by weight of carbonyl iron (Carbonyl Iron) were kneaded by Dispersion Kneader Was prepared in the same manner as in Example 1.

≪ Examples 16 to 20 &

The thickness of the silicone elastic core was 5.0 mm, and carbonyl iron was kneaded (Dispersion Kneader) in an amount of 90 parts by weight, 80 parts by weight, 70 parts by weight, 60 parts by weight and 50 parts by weight based on 100 parts by weight of silicone rubber Was prepared in the same manner as in Example 1.

≪ Example 21 >

The procedure of Example 6 was repeated except that Permalloy was kneaded instead of Carbonyl Iron.

≪ Example 22 >

Except that nickel-zinc (Ni-Zn) ferrite instead of carbonyl iron was kneaded in the same manner as in Example 6.

≪ Comparative Examples 1 to 4 >

The procedure of Example 1 was repeated except that the silicon elastic core had a thickness of 2.0 mm, 3.0 mm, 4.0 mm, and 5.0 mm, respectively, and Ni instead of carbonyl iron was kneaded.

≪ Experimental Example 1 >

The electromagnetic wave absorption characteristics of the conductive contact terminals for surface mounting manufactured in Examples 1 to 22 and Comparative Examples 1 to 4 were measured using an N5230 analyzer (Agilent) according to the KS C0305 method in the frequency band of 0.5 to 18 GHz loss was measured and evaluated.

Figs. 2 to 5 show reflection loss values for Examples 1 to 20 including carbonyl iron. Compared with Ni (Comparative Examples 1 to 4) which are not soft magnetic metal powders, The contact terminals 1 to 20 exhibit a lower reflection loss than those of the comparative examples 1 to 4 in all the frequency bands of 0.5 to 18 GHz, indicating that the radio wave absorbing ability is excellent.

6 shows the reflection loss value for Example 21 including permalloy, which is higher than that of Comparative Example 2 (90 parts by weight of Ni, 3.0 mm) (see FIG. 3) over the entire frequency band of 0.5 to 18 GHz It can be seen that the reflection loss is low and the radio wave absorbing ability is improved. However, when compared with the carbonyl iron, it shows a large reflection loss value in the entire frequency band of 0.5 to 18 GHz compared with the carbonyl iron when it is kneaded, It is found that the absorption ability is poor.

7 shows reflection loss values for Example 22 including nickel-zinc (Ni-Zn) ferrite. As in FIG. 6, Comparative Example 2 (90 parts by weight Ni, 3.0 mm) , The radio wave absorbing ability was improved, but it was found that the radio wave absorbing ability was not excellent in most of the frequency bands of 0.5 to 18 GHz, rather than when carbonyl iron was kneaded.

Claims (13)

An elastic core comprising a polymer;
A metal layer formed to surround an outer side of the elastic core; And
And an adhesive layer bonding the elastic core and the metal layer to each other between the elastic core and the metal layer.
The elastic core has a surface absorption conductive contact terminal, characterized in that it has a radio wave absorption capability.
The method of claim 1,
The elastic core is a conductive contact terminal for surface mounting, characterized in that it comprises an elastic rubber and soft magnetic metal powder.
3. The method of claim 2,
Characterized in that the soft magnetic metal powder comprises carbonyl iron powder.
3. The method of claim 2,
The soft magnetic metal powder may include 50 to 90 parts by weight with respect to 100 parts by weight of the elastic rubber.
3. The method of claim 2,
Wherein the soft magnetic metal powder has an average particle size of 2 to 100 占 퐉.
3. The method of claim 2,
Wherein the elastic rubber is one selected from the group consisting of a crosslinked synthetic rubber, a crosslinked natural rubber, and a silicone rubber.
The method of claim 1,
The contact terminal is a surface-mount conductive contact terminal, characterized in that the return loss in the 0.5 to 18 GHz frequency band less than 5 mm thickness of the elastic core.
The method of claim 1,
And a center hole is formed at a central portion of the elastic core.
The method of claim 1,
The metal layer
A heat-resistant film layer including a plurality of holes; And
And first and second metal coating layers coated on both sides of the film layer, respectively.
10. The method of claim 9,
And a diameter (?) Of the hole is 0.2 to 10 mm.
10. The method of claim 9,
Wherein the metal layer is selected from the group consisting of copper, nickel, gold, silver and tin.
10. The method of claim 9,
Wherein the first and second metal coating layers have a thickness of 0.5 to 20 占 퐉.
The method of claim 1,
Further comprising a metal foil adhered to the lower surface of the contact terminal with the substrate surface with a conductive adhesive.

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