KR20130081378A - Lighting module and lighting device - Google Patents

Lighting module and lighting device Download PDF

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Publication number
KR20130081378A
KR20130081378A KR1020120002306A KR20120002306A KR20130081378A KR 20130081378 A KR20130081378 A KR 20130081378A KR 1020120002306 A KR1020120002306 A KR 1020120002306A KR 20120002306 A KR20120002306 A KR 20120002306A KR 20130081378 A KR20130081378 A KR 20130081378A
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KR
South Korea
Prior art keywords
substrate
light emitting
substrates
disposed
heat dissipation
Prior art date
Application number
KR1020120002306A
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Korean (ko)
Inventor
사다오 타카노
Original Assignee
엘지이노텍 주식회사
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Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020120002306A priority Critical patent/KR20130081378A/en
Publication of KR20130081378A publication Critical patent/KR20130081378A/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/30—Light sources with three-dimensionally disposed light-generating elements on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/40—Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

An embodiment relates to a light emitting module.
The light emitting module according to the embodiment includes a light emitting device; And a substrate having an upper surface on which the light emitting element is disposed and a side surface inclined with respect to the upper surface.

Description

Light Emitting Module and Lighting Device {LIGHTING MODULE AND LIGHTING DEVICE}

Embodiments relate to a light emitting module and a lighting device.

Light emitting diodes (LEDs) are a type of semiconductor devices that convert electrical energy into light. The light emitting diode has advantages of low power consumption, semi-permanent lifetime, fast response speed, safety, and environmental friendliness compared with conventional light sources such as fluorescent lamps and incandescent lamps. Therefore, much research has been conducted to replace conventional light sources with light emitting diodes. Light emitting diodes are increasingly used as light sources for various lamps used in indoor / outdoor, liquid crystal display devices, electric sign boards, streetlights, and the like .

LED chips are generally implemented on one plane of a substrate or submount. Here, the combination of the LED chip and the substrate may be referred to as a "light emitting module."

The light emitted from the LED chip is emitted in various directions. The emission intensity is high in the direction perpendicular to the plane, but the emission intensity is almost zero in the direction parallel to the plane. Therefore, it is disadvantageous in the case where a wide range of possible angles, i.e. a wide range of light, is required, such as indoor lighting. To compensate for this, although a concave lens may be disposed on the LED chip to produce light having a wide orientation angle, this method has a problem in that the loss of light is not small.

The embodiment provides a light emitting module that can be easily combined three-dimensional.

In addition, the embodiment provides a lighting device that can have a wide directivity characteristics.

In addition, the embodiment provides a lighting device with low light loss.

In addition, the embodiment provides a lighting device that can save space, and can improve heat dissipation efficiency.

A light emitting module according to an embodiment includes: a light emitting element; And a substrate having an upper surface on which the light emitting element is disposed and a side surface inclined with respect to the upper surface.

According to an embodiment, there is provided a light emitting module, including: a first substrate having a first surface and a first side surface inclined with respect to the first surface; A second substrate having a second side and a second side inclined with respect to the second side; And a light emitting device disposed on a first surface of the first substrate and a second surface of the second substrate, wherein the first side of the first substrate and the second side of the second substrate are in surface contact with each other. The first substrate and the second substrate are three-dimensionally bonded.

The lighting apparatus according to the embodiment, the heat radiation body having a first plane and a second plane not disposed on the same plane; A first substrate disposed on a first plane of the heat dissipation body and having a first upper surface and a first side surface inclined at the first upper surface; A second substrate disposed on a second plane of the heat dissipation body and having a second upper surface and a second side surface inclined at the second upper surface; And a plurality of light emitting devices disposed on the first upper surface of the first substrate and the second upper surface of the second substrate, wherein the first side of the first substrate and the second side of the second substrate Contact.

Using the light emitting module and the lighting apparatus according to the embodiment, there is an advantage that it is easy to form a three-dimensional structure. Therefore, there is an advantage that the coupling with the heat dissipation body having a three-dimensional structure is easy, the light loss is small, and the light directing characteristics can be widened.

In addition, since it is easy to form a three-dimensional structure, there is an advantage that the space can be saved, and the heat radiation efficiency is improved.

1 is a perspective view of a state in which a plurality of light emitting modules are three-dimensionally coupled according to an embodiment.
FIG. 2 is an exploded view of the substrates forming the three-dimensional structure shown in FIG.
3 is a plan view and a side view of the first trapezoid substrate shown in FIG. 2;
4 is a view illustrating a lighting device in which the light emitting modules and the heat dissipation body illustrated in FIG. 1 are combined;
5 is a perspective view of a state in which the light emitting modules are combined three-dimensionally according to another embodiment.
FIG. 6 is an exploded view of the substrates forming the three-dimensional structure shown in FIG.
7 is a perspective view of a lighting device in which a light emitting module and a heat dissipation body are coupled according to another embodiment.
8 is a front view and a side view of the substrate shown in FIG.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. In addition, the size of each component does not necessarily reflect the actual size.

In the description of embodiments according to the present invention, it is to be understood that where an element is described as being formed "on or under" another element, On or under includes both the two elements being directly in direct contact with each other or one or more other elements being indirectly formed between the two elements. Also, when expressed as "on or under", it may include not only an upward direction but also a downward direction with respect to one element.

Hereinafter, a light emitting module according to an embodiment will be described with reference to the accompanying drawings.

1 is a perspective view of a state in which a plurality of light emitting modules according to an embodiment are three-dimensionally coupled.

Referring to FIG. 1, the light emitting modules according to the embodiment may include a plurality of substrates 110, 120, 130, 140 and 150, and a plurality of light emitting modules disposed on each of the plurality of substrates 110, 120, 130, 140 and 150. The light emitting device 300 includes.

The light emitting device 300 may be a light emitting diode chip. The light emitting diode chip may be a horizontal or vertical light emitting diode chip. In addition, the light emitting device 300 emits predetermined light. The color of the light emitted may be white, blue, green, red. Thus, the light emitting device 300 may be white, blue, green, and red light emitting diode chips.

Each of the plurality of substrates 110, 120, 130, 140, and 150 has a plate shape having a predetermined thickness. Each of the substrates 110, 120, 130, 140, and 150 has one or more flat surfaces. One or more light emitting devices 300 are disposed on one flat surface.

Each of the plurality of substrates 110, 120, 130, 140, and 150 may be any one of a plastic substrate, a ceramic substrate, a printed circuit board (PCB), a flexible PCB, and a submount. Here, the substrates 110, 120, 130, 140, and 150 include not only the substrates listed above but also any type of substrate on which the light emitting device 300 may be mounted.

The substrates 110, 120, 130, 140, and 150 are combined with each other to form a three-dimensional structure. In order to form the three-dimensional structure, each of the plurality of substrates 110, 120, 130, 140, and 150 has a predetermined structure. It will be described in detail with reference to FIG.

FIG. 2 is a development view illustrating the substrates 110, 120, 130, 140, and 150 forming the three-dimensional structure illustrated in FIG. 1.

2, the substrates 110, 120, 130, 140, and 150 may include four first to fourth trapezoidal substrates 110, 120, 130, and 140, and one rectangular substrate 150. have.

The quadrangular substrate 150 has an upper surface 150A, a lower surface (not shown), and four side surfaces 150a. The light emitting device 300 illustrated in FIG. 1 is disposed on the upper surface 150A. The four side surfaces 150a are not perpendicular to the upper surface 150A or the lower surface (not shown), and have a predetermined angle. That is, the four side surfaces 150a are inclined with respect to the upper surface 150A or the lower surface (not shown). Specifically, each of the four side surfaces 150a forms an acute angle with the upper surface 150A, and forms an obtuse angle with the lower surface (not shown). Therefore, the area of the upper surface 150A is larger than the area of the lower surface (not shown). The four side surfaces 150a are inclined with respect to the top surface 150A or the bottom surface (not shown) because the quadrangular substrate 150 is three-dimensionally coupled to the first to fourth trapezoidal substrates 110, 120, 130, and 140. For sake.

On the other hand, the square substrate 150 is a square substrate, but is not limited thereto. For example, the rectangular substrate 150 may be a rectangular substrate. In this case, it can be sufficiently expected that the shape of the two sadi- ric substrates in the first to fourth sadi- ric substrates 110, 120, 130, and 140 will be different from the shapes of the remaining two sadi- meric substrates.

Since the first to fourth trapezoidal substrates 110, 120, 130, and 140 all have the same shape, the first trapezoidal substrate 110 will be described below with reference to FIG. 3, and the second to fourth trapezoidal substrates ( 120, 130, and 140 will be omitted.

3 is a plan view and a side view of the first trapezoidal substrate 110 shown in FIG. 2.

Referring to FIG. 3, the first trapezoidal substrate 110 has an upper surface 110A, a lower surface (not shown), and four side surfaces 110a, 110b, 110c, and 110d. Here, the light emitting devices 300 shown in FIG. 1 are disposed on the top surface 110A. The four side surfaces 110a, 110b, 110c, 110d are not perpendicular to the top surface 110A or the bottom surface (not shown), and have a predetermined angle. In detail, the four side surfaces 110a, 110b, 110c, and 110d form an acute angle with the upper surface 110A and an obtuse angle with the lower surface (not shown). Therefore, the area of the upper surface 110A is larger than the area of the lower surface (not shown).

When the first to fourth trapezoidal substrates 110, 120, 130, and 140 and the quadrangular substrate 150 have the above-described predetermined structure, the first to fourth trapezoidal substrates 110, 120, 130, and 140 are squared. It is easy to form a predetermined three-dimensional structure with the substrate 150.

One side surface 110a of the first to fourth quadrilateral substrates 110, 120, 130, and 140 is in surface contact with each of the four side surfaces 150a of the quadrangular substrate 150, and two trapezoidal substrates adjacent to each other. When the surface contacts each other, the rectangular substrate 150 and the first to fourth sacrificial substrates 110, 120, 130, and 140 may have a hexahedral structure having a lower surface than that of the upper surface. Therefore, the light emitted from the light emitting devices 300 disposed on the plurality of substrates 110, 120, 130, 140, and 150 is controlled by the three-dimensional structure of the substrates 110, 120, 130, 140, and 150. It is possible to have a wide range of directivity characteristics. In addition, since each of the substrates 110, 120, 130, 140, and 150 is a flat plate, wire bonding between the substrates 110, 120, 130, 140, and 150 and the light emitting devices 300 is performed. There is no problem in the work. In addition, a predetermined gap does not occur in the bonding portion between the substrates 110, 120, 130, 140, and 150, and the side surfaces of the substrates 110, 120, 130, 140, and 150 are not exposed.

4 is a view illustrating a lighting device in which the light emitting modules and the heat dissipation body illustrated in FIG. 1 are combined.

The first to fourth trapezoidal substrates 110, 120, 130, and 140 and the quadrangular substrate 150 illustrated in FIGS. 2 and 3 may be easily coupled to the heat dissipating body 500 having a three-dimensional structure. The heat dissipation body 500 has two or more planes that are not disposed on the same plane. Substrates 110, 120, 130, 140, 150 and light emitting devices 300 are disposed on two or more planes.

The three-dimensional structure in which the substrates 110, 120, 130, 140, and 150 are coupled corresponds to the three-dimensional structure of the heat dissipation body 500.

Meanwhile, the quadrangular substrate 150 of FIG. 2 may be a polygonal substrate. This will be described with reference to FIGS. 5 and 6.

FIG. 5 is a perspective view of three-dimensionally coupled light emitting modules according to another exemplary embodiment. FIG. 6 is a development view illustrating substrates forming the three-dimensional structure illustrated in FIG. 5.

5 to 6, the polygonal substrate 150 ′ corresponding to the rectangular substrate 150 of FIG. 2 is a hexagonal substrate. The six side surfaces of the hexagonal substrate 150 'have the same structure as the side surface 150a of the square substrate 150 shown in FIG. 2, and the six sagittal substrates coupled to the hexagonal substrate 150' are shown in FIG. It has the same structure as the first trapezoidal substrate 110 shown.

FIG. 7 is a perspective view of a lighting device in which light emitting modules and a heat dissipating body are coupled, and FIG. 8 is a front view and a side view of the substrate 710 shown in FIG. 7.

The light emitting modules illustrated in FIGS. 7 to 8 may be easily combined with a heat radiation body having a polygonal column shape to configure a lighting device.

7 to 8 include a plurality of substrates 710, 720, and 730, and a plurality of light emitting elements 300 disposed on each of the plurality of substrates 710, 720, and 730.

The plurality of substrates 710, 720, and 730 are connected to each other and disposed to surround the heat dissipation body 500 ′ of the hexagonal pillar. A plurality of substrates 710, 720, 730 are disposed on six sides of the heat dissipation body 500 ′. The six sides are not arranged on the same plane.

Each of the plurality of substrates 710, 720, and 730 has a predetermined structure for coupling with neighboring substrates. Specifically, the first substrate 710 of the plurality of substrates 710, 720, and 730 has an upper surface 710A, a lower surface (not shown), and four side surfaces 710a and 710b. Since the second substrate 720 and the third substrate 730 are the same as the first substrate 710, detailed description thereof will be omitted.

The first side 710a of the four side surfaces 710a and 710b contacting the second substrate 720 is at an angle with the top surface 710A or the bottom surface (not shown). That is, the first side surface 710a is inclined with respect to the top surface 710A or the bottom surface (not shown). Specifically, the first side surface 710a forms an acute angle with the top surface 710A, and forms an obtuse angle with the bottom surface (not shown). Therefore, the area of the upper surface 710A is larger than the area of the lower surface (not shown). The reason why the first side surface 710a is inclined is to allow the first substrate 710 to be three-dimensionally coupled to the second substrate 720.

The second side 710b of the four side surfaces 710a and 720b that contacts the third substrate 730 is substantially perpendicular to the top surface 710A or the bottom surface (not shown). The second side 710b is vertically different from the first side 710A because the first substrate 710 and the third substrate 730 are coplanar, that is, on one side of the heat dissipating body 500 '. Because it is placed.

As such, each of the plurality of substrates 710, 720, and 730 has sides that are perpendicular to the inclined sides, such that the plurality of substrates 710, 720, and 730 may form the heat dissipating body 500 ′ of the polygonal pillar. It may be arranged to surround. Therefore, the light emitted from the plurality of substrates 710, 720, and 730 may have a wide directivity due to the three-dimensional structure of the substrates 710, 720, and 730. In addition, since the substrates 710, 720, and 730 are flat plates, wire bonding between the substrates 710, 720, and 730 and the light emitting devices 300 may be performed. In addition, a predetermined gap does not occur in the coupling portion between the substrates 710, 720, and 730, and the side surfaces of the substrates 710, 720, and 730 are not exposed.

Although the above description has been made with reference to the embodiments, these are only examples and are not intended to limit the present invention, and those of ordinary skill in the art to which the present invention pertains should not be exemplified above without departing from the essential characteristics of the present embodiments. It will be appreciated that many variations and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

110, 120, 130, 140, 150, 150 ', 710, 720, 730: substrate
300: light emitting element
500, 500 ': heat resistant body

Claims (8)

A light emitting element; And
A substrate having an upper surface on which the light emitting element is disposed and a side surface inclined with respect to the upper surface;
Light emitting module comprising a. The method of claim 1,
The side surface of the substrate is an acute angle with the upper surface. A first substrate having a first side and a first side inclined with respect to the first side;
A second substrate having a second side and a second side inclined with respect to the second side; And
And a light emitting device disposed on the first surface of the first substrate and the second surface of the second substrate.
The light emitting module of claim 1, wherein the first side surface of the first substrate and the second side surface of the second substrate are in surface contact with each other so that the first substrate and the second substrate are three-dimensionally coupled. The method of claim 3, wherein
The first side surface of the first substrate is an acute angle with the first surface, the second side surface of the second substrate is an acute angle with the second surface. A heat dissipation body having a first plane and a second plane not disposed on the same plane;
A first substrate disposed on a first plane of the heat dissipation body and having a first upper surface and a first side surface inclined at the first upper surface;
A second substrate disposed on a second plane of the heat dissipation body and having a second upper surface and a second side surface inclined at the second upper surface; And
And a plurality of light emitting devices disposed on the first upper surface of the first substrate and the second upper surface of the second substrate.
And a first side surface of the first substrate and a second side surface of the second substrate. The method of claim 5, wherein
The first side surface of the first substrate is an acute angle with the first upper surface, the second side surface of the second substrate is an acute angle with the second upper surface. The method according to claim 5 or 6,
The radiating body is a hexahedron lighting device. The method according to claim 5 or 6,
The heat dissipation body is a polygonal pillar lighting device.
KR1020120002306A 2012-01-09 2012-01-09 Lighting module and lighting device KR20130081378A (en)

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KR1020120002306A KR20130081378A (en) 2012-01-09 2012-01-09 Lighting module and lighting device

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190098476A (en) * 2018-02-14 2019-08-22 주식회사 아모센스 A lighting apparatus for a car

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190098476A (en) * 2018-02-14 2019-08-22 주식회사 아모센스 A lighting apparatus for a car

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