KR102109100B1 - Lighting device - Google Patents

Abstract

The lighting device according to the embodiment is a light source for generating light, a body forming a cavity in which the light source is disposed, a power source disposed inside the body, a socket disposed to surround a region of the body, and a first disposed between the body and the socket It may include a buffer.

Description

Lighting equipment {LIGHTING DEVICE}

The embodiment relates to a lighting device.

In general, a light bulb or a fluorescent lamp is used as an indoor or outdoor lighting lamp. In the case of such a light bulb or a fluorescent lamp, there is a problem that it has to be exchanged frequently due to its short life. In addition, in the conventional fluorescent lamp, deterioration occurs as the usage time passes, so that a phenomenon in which the illuminance gradually decreases may occur excessively.

In order to solve these problems, it adopts a light emitting diode (LED) that can realize excellent controllability, fast response speed, high electro-optical conversion efficiency, long swimming, low power consumption and high luminance characteristics and emotional lighting. Various types of lighting modules are being developed.

A light emitting diode (LED) is a type of semiconductor device that converts electrical energy into light. The light emitting diode has advantages of low power consumption, semi-permanent life, fast response speed, safety, and environmental friendliness compared to conventional light sources such as fluorescent lamps and incandescent lamps. Accordingly, many studies have been conducted to replace existing light sources with light-emitting diodes, and light-emitting diodes have been increasingly used as light sources for lighting devices such as various liquid crystal display devices, electronic displays, and street lights.

The lighting apparatus according to the embodiment may include a shock absorber to mitigate the shock caused by thermal expansion of various components due to heat generated from the light source, and thus durability may be improved.

The lighting device according to an embodiment of the present invention is a light source for generating light, a body forming a cavity in which the light source is disposed, a power source disposed inside the body, a socket disposed to surround a region of the body, and between the body and the socket It may include a first buffer disposed.

The lighting device according to an embodiment may be provided with a first cushioning part that relieves impact due to thermal expansion between the body and the socket, thereby improving durability.

The lighting device according to an embodiment may include a heat sink that widens the surface area on the outside of the body to increase heat dissipation performance.

In the lighting device according to an embodiment, the second shock absorber is disposed between the heat sink and the body, thereby improving durability.

The lighting device according to an embodiment may have electrical stability by arranging a power source inside the body.

In the lighting device according to an embodiment, the heat sink can be extended to the inside of the power source to effectively transfer heat generated from the light source to the body, thereby maximizing heat dissipation performance.

The lighting device according to an embodiment may have excellent heat dissipation performance because the body is formed of a thermally conductive plastic having superior thermal conductivity than that of ordinary plastic.

In the lighting device according to an embodiment, the body is formed of plastic, and thus the weight can be drastically reduced, so the range of application can be varied and the convenience of use can be increased.

1 is a perspective view of a lighting device of one embodiment,
Figure 2 is an exploded perspective view of the lighting device of one embodiment,
3 is a cross-sectional view of the lighting device of FIG. 1 in D-D 'direction,
Figure 4 is an enlarged view of part A of Figure 3,
5 is a cross-sectional view of another embodiment of the lighting device.

Advantages and features of the present invention, and methods for achieving them will be clarified with reference to embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, and only the embodiments allow the disclosure of the present invention to be complete, and common knowledge in the art to which the present invention pertains It is provided to completely inform the person having the scope of the invention, and the present invention is only defined by the scope of the claims. The same reference numerals refer to the same components throughout the specification.

The spatially relative terms "on", "below", "beneath", "lower", "above", "upper", etc. As illustrated, it can be used to easily describe the correlation between one element or components and other elements or components. The spatially relative terms should be understood as terms including different directions of the device in use or operation in addition to the directions shown in the drawings. For example, if the device shown in the figure is turned over, a device described as "below" or "beneath" another device may be placed "above" another device. Also, devices described as "on" of other devices may also be placed "below" or "beneath" of other devices when flipped in the drawing. Accordingly, the exemplary term "below" may include both the directions above and below, and "above" may include both the directions above and below. The device can also be oriented in other directions, so that spatially relative terms can be interpreted according to the orientation.

The terminology used herein is for describing the embodiments and is not intended to limit the present invention. In the present specification, the singular form also includes the plural form unless otherwise specified in the phrase. As used herein, "comprises" and / or "comprising" refers to the components, steps, operations and / or elements mentioned above, the presence of one or more other components, steps, operations and / or elements. Or do not exclude additions.

Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used as meanings commonly understood by those skilled in the art to which the present invention pertains. In addition, terms defined in the commonly used dictionary are not ideally or excessively interpreted unless explicitly defined.

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity. In addition, the size and area of each component does not entirely reflect the actual size or area.

In addition, the angles and directions mentioned in the process of describing the structure of the light emitting device in the embodiment are based on those described in the drawings. In the description of the structure constituting the light emitting element in the specification, if the reference point and the positional relationship for the angle is not clearly mentioned, reference is made to the related drawings.

Hereinafter, embodiments will be described in more detail with reference to the drawings.

1 is a perspective view showing a lighting device of one embodiment, FIG. 2 is an exploded perspective view showing the structure of the lighting device of one embodiment, and FIG. 3 is a cross-sectional view showing a cross section in the DD ′ direction of the lighting device of FIG. 1.

Referring to FIGS. 1 to 3, the lighting apparatus 100 of one embodiment forms a light source 130 that generates light, a cavity in which the light source 130 is disposed, and heat generated by the light source 130 to the outside The body 110 to be discharged is disposed inside the body 110, and is arranged to surround a region of the power source 150, which supplies power to the light source 130, and is electrically connected to the power source 150. It may include a socket 170 to be connected and a first shock absorber 182 to alleviate the impact of thermal expansion between the body 110 and the socket 170.

The body 110 may receive heat generated from the light source 130 and radiate heat. The body 110 may be formed of a material having excellent heat dissipation efficiency.

For example, the body 110 may include at least one of aluminum (Al), nickel (Ni), silver (Ag), tin (Sn), or plastic. When the body 110 includes a metal material, electrical insulation treatment may be performed between the heat sink 120 to be described later, but is not limited thereto.

According to an embodiment, when the body 110 is formed of a plastic with low electrical conductivity, the heat sink 120 and the body 110 may be in contact, but are not limited thereto.

The body 110 may include a thermally conductive plastic having a higher thermal conductivity than a typical plastic. The heat-conducting plastic may have a structure in which heat dissipation performance is maximized by maximizing the properties of heat conduction, convection, and radiation.

The body 110 may have a cavity 112 formed thereon. The cavity 112 may be formed by recessing an area at the top of the body 110. The cavity 112 may be formed by an upper surface of the body 110 and side walls forming a slope with the upper surface. A light source 130, a heat sink 120 or a substrate 140 may be disposed on the top surface of the body 110 forming the cavity 112.

The body 110 may be provided with a heat dissipation unit 114 on the outside. The heat dissipation unit 114 may include a structure capable of dissipating heat into the air. The heat dissipation unit 114 may be a portion in which a structure of a protrusion or depression is continuously formed in an area outside the body 110 to increase the surface area in contact with the air.

The body 110 may have a space formed therein. The body 110 may include a power supply unit 150 in an interior space. The body 110 may be connected to a space in which the cavity 112 formed on the upper portion and the power source 150 are located.

The heat sink 120 may be located inside the body 110. The heat sink 120 may be located on an upper surface where one region forms the cavity 112 of the body 110. One area of the heat sink 120 may be inserted into the body 110. The heat sink 120 may be located between the upper surface of the body 110 forming the cavity 112 and the light source 130.

The heat sink 120 may be formed of a material having high thermal conductivity. For example, the heat sink 120 may be formed of metal, or aluminum (Al) according to an embodiment. The heat sink 120 may receive heat generated from the light source 130. The heat sink 120 may be inserted into the body 110 to transfer heat received from the light source 130 to the interior of the body 110.

The heat sink 120 may be formed of a material having high light reflectivity. The heat sink 120 may reflect light generated from the light source 130 to the upper portion of the body 110.

The heat sink 120 may be located between the power supply unit 150 and the body 110, which will be described later. The heat sink 120 may be inserted into the body 110 to be spaced apart from the power supply unit 150. The heat sink 120 may be electrically separated from the power supply unit 150.

The heat sink 120 may have various shapes that are inserted into the body 110. For example, the heat sink 120 may include a cylindrical shape, a pillar shape, etc., but is not limited to the shape.

Referring to FIG. 2, the heat sink 120 includes a circular plate portion through which a central portion positioned on an upper surface forming the cavity 112 of the body 110 and a cylindrical portion inserted into the body 110. , Although the two parts show a shape connected to each other, this is only an embodiment of the present invention, and is not limited to the form, and may include various embodiments.

The heat sink 120 may be inserted into the body 110 to be adjacent to the heat dissipation unit 114 formed outside the body 110. The heat sink 120 may be inserted into the body 110 to increase the area in contact with the body 110.

The light source 130 may be disposed in the cavity 112. A heat dissipation pad (not shown) for transferring heat may be positioned between the light source 130 and the top surface forming the cavity 112 of the body 110, but is not limited thereto.

Light emitting diodes (not shown) can convert electrical signals into infrared, visible, or light forms using the properties of compound semiconductors. The light emitting diode (not shown) may be electrically connected to a lead frame (not shown) of the light emitting device package (not shown).

The light source 130 may include red green, blue, or white light emitting diodes that emit red, green, blue, or white light, respectively, but the type or number is not limited. The light emitting diode may be a horizontal type (Lateral Type) or a vertical type (Vertical Type), but is not limited thereto.

The light source 130 may include a phosphor. The phosphor absorbs light and can emit light with a changed wavelength. When the light emitting diode is a blue light emitting diode, the phosphor may include at least one of yellow, red, and green phosphors. For example, the phosphor may include at least one of garnet (YAG, TAG), silicate (Silicate), nitride (Nitride), and oxynitride (Oxynitride).

The lighting device may further include a substrate 140 positioned on the upper surface forming the cavity 112 of the body 110 or on the power supply unit 150 to be described later.

The substrate 140 may be electrically connected to the light source 130. The substrate 140 may be electrically connected to the power supply unit 150. The substrate 140 may receive power from the power supply unit 150 and transmit it to the light source 130.

The substrate 140 may include a circular plate shape, but is not limited thereto, and may include various shapes. For example, the substrate 140 may have a polygonal plate shape.

The substrate 140 may be a circuit pattern printed on an insulator. For example, the substrate 140 may include a general printed circuit board (PCB), a metal core PCB, a flexible PCB, and a ceramic PCB. The substrate 140 may be a COB (Chips On Board) type formed integrally with the light source 130, but is not limited thereto.

The power supply unit 150 may be located inside the body 110. The power supply unit 150 may be inserted into a space formed inside the body 110. The power supply unit 150 may be electrically connected to the substrate 140. The power supply unit 150 may be electrically connected to the light source 130 through the substrate 140, and may operate the light source 130, but is not limited thereto.

The power supply unit 150 may include a support substrate (not shown) and a plurality of parts (not shown) mounted on the support substrate (not shown). The plurality of parts, for example, a DC converter for converting AC power provided from an external power source into DC power, a driving unit (not shown) for controlling the driving of the light source 130, and the light source 130 from electrical shock An electrostatic discharge (ESD) protection device (not shown) may be included, but the present invention is not limited thereto. The power supply unit 150 may be formed with a socket connected to an external power supply at the bottom.

The lens 160 is disposed on the light source 130 and can be engaged with the body 110. The lens 160 may allow light emitted from the light source 130 to pass through and be emitted to the outside. The lens 160 may collect or emit light generated from the light source 130. The lens 160 may have a disk shape, but is not limited to the shape, and may be fluid according to the shape of the cavity 112 of the body 110.

The lens 160 may be a plate in which some or all of them have a predetermined curvature. The lens 160 may be disposed at a predetermined distance from the light source 130. The lens 160 may extend in the depth direction of the cavity 112 corresponding to the light source 130. When the number of the light sources 130 is plural, the lens 160 may also have plural portions extending in the depth direction of the cavity 112.

The lens 160 may include a material having light transmittance. The lens 160 may be a material having excellent properties such as light resistance, heat resistance, and impact strength. For example, the lens 160 may include at least one of glass, plastic polypropylene (PP), polyethylene (PE), or light diffusion polycarbonate (PC).

According to an embodiment, the lens 160 may include a phosphor (not shown). The phosphor (not shown) is excited by light emitted from the light source 130 to emit excitation light. The phosphor may include at least one of yellow, red, and green phosphors. For example, the phosphor may include at least one of garnet (YAG, TAG), silicate (Silicate), nitride (Nitride) and oxynitride (Oxynitride).

The power supply unit 150 may be electrically connected to the socket 170. The socket 170 may receive electricity from an external power source. The socket 170 may provide electricity supplied from the outside to the power supply unit 150.

The socket 170 may contact one region of the body 110. For example, the socket 170 may be disposed in an area at the bottom of the body 110. The socket 170 may be disposed at a portion adjacent to the power supply unit 150 of the body 110.

The first buffer unit 182 may be disposed between the socket 170 and the body 110. The first buffer unit 182 may separate the socket 170 and the body 110. For example, when the body 110 includes a material having electrical conductivity, the first buffer unit 182 may electrically separate the socket 170 and the body 110.

The first buffer unit 182 may include a material having electrical insulation properties. The first buffer unit 182 may mitigate the shock generated by thermal expansion of the socket 170 and the body 110. For example, the first buffer unit 182 may include a material having a coefficient of thermal expansion between the coefficient of thermal expansion of the socket 170 and the coefficient of thermal expansion of the body 110. For example, the first buffer unit 182 may include at least one of Si, AlO ₂ or TiO ₂ . For example, the first buffer unit 182 may include rubber-based silicon, but is not limited thereto.

FIG. 4 is an enlarged view of part A of FIG. 3.

Referring to FIG. 4, the lighting device of one embodiment may include a first buffer unit 182 forming a space (c) therein. The first shock absorber 182 may form a space therein to alleviate the shock generated by the thermal expansion of the socket 170 and the body 110. The first buffer part 182 may form a partially penetrated hole, but is not limited thereto. The first buffer unit 182 may form holes at regular intervals in part or in whole, but is not limited thereto.

FIG. 4 is an enlarged view of only the first buffer unit 182, but the second buffer unit, which will be described later, may also form a space therein.

Referring to FIG. 5, the lighting device of another embodiment may further include a second buffer unit 184 disposed between the heat sink 120 and the body 110. The second buffer 184 includes a material having a coefficient of thermal expansion between the coefficient of thermal expansion of the heat sink 120 and the coefficient of thermal expansion of the body 110.

The second buffer 184 may be disposed between the body 110 and the light source 130. The second buffer 184 may be disposed between the heat sink 120 and the body 110.

For example, the second buffer unit 184 may include at least one of Si, AlO ₂ or TiO ₂ . For example, the second buffer 184 may include resin-based silicone, but is not limited thereto. The second buffer 184 may form a space therein.

The embodiments have been mainly described above, but this is merely an example and does not limit the present invention, and those skilled in the art to which the present invention pertains have not been exemplified above in a range that does not depart from the essential characteristics of the present embodiment. It will be appreciated that various modifications and applications are possible. For example, each component specifically shown in the embodiment can be implemented by modification. And differences related to these modifications and applications should be construed as being included in the scope of the invention defined in the appended claims.

100: lighting equipment
110: body
120: heat sink
130: light source
140: substrate
150: power supply
160: lens
182: first buffer
184: second buffer

Claims (9)

A light source generating light;
A body forming a cavity in which the light source is disposed;
A power unit disposed inside the body;
A socket disposed to surround an area of the body; And
It includes; a first buffer portion disposed between the region of the body and the socket;
The body includes a heat dissipation part formed to protrude or recess in the outside,
The socket is electrically connected to the power supply,
The first buffer portion includes a material having a coefficient of thermal expansion between the coefficient of thermal expansion of the body and the coefficient of thermal expansion of the socket,
The first buffer unit is a lighting device that electrically separates the socket and the body. According to claim 1,
The body has a space in which the power unit is disposed, and the lighting device is formed of a metal material. The method according to claim 1 or 2,
The first buffer portion includes at least one of Si, AlO ₂ or TiO ₂ ,
The first buffer unit is an illumination device that forms at least one space therein. The method according to claim 1 or 2,
A heat sink disposed between the body and the light source; And
Further comprising a second buffer portion disposed between the heat sink and the body,
The heat sink is located between the light source and the top surface of the body where one region forms the cavity,
One region of the heat sink is inserted into the body,
The second buffer unit is a lighting device that is inserted into the body from the top surface of the body forming the cavity. According to claim 1,
Further comprising a second buffer portion disposed between the body and the light source,
The second buffer portion includes at least one of Si, AlO ₂ or TiO ₂ ,
The second buffer unit is a lighting device that is inserted into the body from the top surface of the body forming the cavity. delete delete delete delete

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