KR20130079831A - Apparatus for cooling silicon single crystal and silicon single crystal growth apparatus using the same - Google Patents

Abstract

PURPOSE: An apparatus for cooling a silicon crystal and an apparatus for growing the silicon crystal are provided to efficiently absorb radiant heat from a silicon crystal ingot by assembling a plurality of water cooling tubes with different cooling speeds. CONSTITUTION: A water cooling tube assembly support (200) is assembled by laminating a first water cooling tube (300) and a second water cooling tube (400). The first and second water cooling tubes are assembled by a coupling member (210) of the water cooling tube assembly support. The radiant heat absorption rate of the first water cooling tube is different from the radiant heat absorption rate of the second water cooling tube. One of the first and second water cooling tubes is coated with radiant heat absorption materials. The first and second water cooling tubes are coated with ceramics to reduce the contamination of an ingot (100).

Description

Silicon single crystal cooling device and silicon single crystal growth device using the same {APPARATUS FOR COOLING SILICON SINGLE CRYSTAL AND SILICON SINGLE CRYSTAL GROWTH APPARATUS USING THE SAME}

The present invention relates to an apparatus for cooling a silicon single crystal and a silicon single crystal growth apparatus using the same.

In general, in manufacturing a semiconductor device, a silicon wafer mainly used as a substrate is a single crystal from polycrystalline silicon, according to Czochalski crystal growth method or floating zone crystal growth method, after producing high purity polycrystalline silicon. It can be grown to produce a single crystal silicon rod, thinly cut it to produce a silicon wafer, and mirror-polished one surface of the wafer, cleaned, and then final inspection.

The silicon single crystal ingot growth apparatus may be provided with a silicon single crystal cooling apparatus for cooling the silicon single crystal ingot in order to improve the pulling speed of the ingot during the growth of the silicon single crystal ingot.

Here, the silicon single crystal cooling apparatus may have a water cooling tube including an inner tube and an outer tube. A space is formed between the inner tube and the outer tube of the water cooling tube, and the coolant may flow therein.

In addition, the inlet and outlet of the cooling water may be formed in the outer tube of the water cooling tube, respectively.

However, such a water cooling tube has a problem of absorbing only a certain amount of radiant heat emitted from a silicon single crystal ingot and a hot zone because the surface thereof is not only opaque but also polished like a mirror surface.

This resulted in many problems such as the need to change the hot zone structure inside the growth furnace after testing and testing the pulling speed of the silicon single crystal ingot for each product.

In order to solve this problem, the water cooling pipes were mounted on the inner and outer walls of the water cooling pipes with different coating colors, but the V / G value (as a factor for determining the quality) in a state where the cooling rate of the water cooling pipes is fixed V is the pulling speed of the ingot, and G is the temperature gradient at the solid-liquid interface), so a change in the hot zone will inevitably occur.

In addition, there may be a product of a defect-free area having the same concentration of vacancy and interstitial, but a V-rich product having superior vacancy or interstitial Some products may contain high concentrations of N-type dopants, predominantly interstitial.

In order to develop these products in various ways, they must be grown in consideration of the V / G value. When the cooling rate is fixed along the water cooling tube, the change of the hot zone inevitably occurs.

Therefore, research and development of a silicon single crystal cooling device capable of efficiently absorbing emissivity should be made to realize a cooling rate suitable for each product characteristic.

The present invention is to solve the above problems, by assembling a plurality of water cooling pipes having different cooling rate to implement a cooling device, a silicon single crystal cooling device and a silicon single crystal growth device using the same that can efficiently control the cooling rate To provide.

The silicon single crystal cooling apparatus according to the present invention includes a plurality of water cooling tubes and a water cooling tube assembly support for stacking and assembling a plurality of water cooling tubes, and among the plurality of water cooling tubes, some may have different absorption rates of radiant heat.

Here, some water cooling tubes may be made of a material having a different absorption rate of radiant heat, or may be coated with a radiant heat absorbing material having a different color of radiant heat absorption rate.

In addition, the plurality of water cooling tubes may include a first water cooling tube and a second water cooling tube stacked on the first water cooling tube and having a lower absorption rate of radiant heat than the first water cooling tube.

In addition, it may further include a third water cooling pipe stacked on the second water cooling pipe, the absorption rate of the radiant heat is lower than the first water cooling pipe.

Here, the absorption rate of the radiant heat of the third water cooling tube may be the same as that of the second water cooling tube, or may be different from the second water cooling tube.

At least one of the first, second, and third water cooling tubes may be made of a hydrogen storage alloy.

Here, the hydrogen storage alloy may be a Ti-Mn alloy to which hydrogen is added.

Subsequently, the first and second water cooling tubes may be made of different materials, or may be coated with radiation absorbing materials having different colors.

In addition, any one of the first and second water cooling tubes may be coated with a radiation heat absorbing material.

In addition, among the plurality of water cooling tubes, each water cooling tube includes an inner tube and an outer tube which forms a flow space of the cooling water between the inner tube and an outer tube that is formed in the outer tube and introduces and discharges the cooling water into the flow space. It may include a coolant outlet.

Subsequently, the water cooling tubes adjacent to each other, the inner tube or the outer tube is made of a different material, the flow space of the cooling water is disconnected from each other, each through a separate cooling water inlet, the cooling water can be introduced and discharged.

Next, the water cooling pipes adjacent to each other, the inner pipe or the outer pipe is made of the same material, the flow space of the coolant is disconnected from each other, each through a separate coolant inlet, the coolant is introduced and discharged, adjacent to each other Among the water cooling tubes, the radiation absorbing material may be coated only on the inner tube of any one water cooling tube.

In addition, the water cooling pipes adjacent to each other, the inner pipe or the outer pipe is made of the same material, the flow space of the cooling water is connected to each other, the same cooling water is introduced and discharged through one cooling water entrance, the water cooling adjacent to each other The inner tubes of the tubes may be coated with different radiant heat absorbing materials.

In addition, the water cooling pipes adjacent to each other, the inner pipe or the outer pipe is made of the same material, the flow space of the cooling water is connected to each other, the same cooling water flows in and out through one cooling water inlet, the water cooling adjacent to each other Among the tubes, only the inner tube of one water cooling tube may be coated with a radiant heat absorbing material.

Then, of the plurality of water cooling tubes, some may have different heights.

Next, the water cooling pipe assembly support may include a fastening member for fixing each water cooling pipe.

On the other hand, the silicon single crystal listing apparatus using the silicon single crystal cooling apparatus according to the present invention, a chamber for growing a silicon single crystal ingot, a crucible provided inside the chamber and a silicon solution is accommodated, and is provided inside the chamber to heat the crucible And a silicon single crystal cooling device for cooling the silicon single crystal ingot provided inside the chamber and grown from the silicon solution, wherein the silicon single crystal cooling device includes a plurality of water cooling pipes and a plurality of water cooling pipes stacked together. A pipe assembly support is included, and among the plurality of water cooling tubes, some may have different absorption rates of radiant heat.

According to the present invention, by assembling a plurality of water cooling tubes having different cooling rates to implement a cooling device, it is possible to efficiently absorb radiant heat generated from silicon single crystal ingots and hot zones, thereby providing excellent cooling efficiency.

In addition, since the present invention can use various material properties without using only one material property of the water cooling tube, it is possible to develop various products without changing the structure of the hot zone.

Therefore, various products can be developed through simple assembly of the water cooling tube without changing the structure of the hot zone, and thus, manufacturing cost can be greatly reduced.

1A and 1B show a silicon single crystal cooling apparatus according to a first embodiment of the present invention.
Figure 2 is another embodiment showing the water cooling tube assembly support of Figure 1b
3 is a cross-sectional view showing a silicon single crystal cooling apparatus according to a second embodiment of the present invention.
4A and 4B show a silicon single crystal cooling apparatus according to a third embodiment of the present invention.
Figure 5 is another embodiment showing the water cooling tube assembly support of Figure 4b
6 is a cross-sectional view showing a silicon single crystal cooling apparatus according to a fourth embodiment of the present invention.
FIG. 7 is a first embodiment showing the water cooling tube of FIG. 1B in detail.
8a and 8b show in detail the water cooling tube of Figure 4b
9A and 9B illustrate a second embodiment showing the water cooling tube of FIG. 1B in detail.
10 is a third embodiment showing the water cooling tube of FIG. 1B in detail.
11A and 11B illustrate a fourth embodiment showing the water cooling tube of FIG. 1B in detail.
12a to 12c show the height of the water cooling tubes
13 is a graph showing the endothermic amount of the cooling device according to the present invention
14 is a cross-sectional view showing a silicon single crystal growth apparatus using a silicon single crystal cooling apparatus according to the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features and advantages of the present invention will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG.

In the description of the embodiments, it is to be understood that each layer (film), region, pattern or structure is formed "on" or "under" a substrate, each layer The terms " on "and " under " encompass both being formed" directly "or" indirectly " In addition, the criteria for above or below each layer will be described with reference to the drawings.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. In addition, the size of each component does not necessarily reflect the actual size.

1A and 1B are views showing a silicon single crystal cooling apparatus according to a first embodiment of the present invention, in which FIG. 1A is a perspective view and FIG. 1B is a sectional view.

As shown in FIGS. 1A and 1B, the silicon single crystal cooling apparatus includes a water cooling unit in which first and second water cooling tubes 300 and 400 are stacked and assembled with the first and second water cooling tubes 300 and 400. Pipe assembly support 200 may be included.

The silicon single crystal ingot 100 may move through the central cooling space 101 of the first and second water cooling tubes 300 and 400.

Here, the first and second water cooling pipes 300 and 400 may be assembled through the fastening member 210 of the water cooling pipe assembly support 200.

Fastening member 210 may use a variety of instruments, for example, but may use a fastening screw, but is not limited thereto.

In addition, any one of the first and second water cooling tubes 300 and 400 may have a different absorption rate of radiant heat.

At this time, the absorption rate of the radiant heat may be changed by the material of the water cooling tube or the color of the coating material.

Therefore, the first and second water cooling tubes 300 and 400 may be formed of materials having different absorption rates of radiant heat, or may be coated with a radiant heat absorbing material having a different color from each other.

For example, the cooling apparatus of the present invention may include first and second water cooling tubes 300 and 400, wherein the first water cooling tube 300 is disposed below the water cooling tube assembly support 200, and The second water cooling pipe 400 may be stacked on the first water cooling pipe 300, and the absorption rate of radiant heat may be lower than that of the first water cooling pipe 300.

In some cases, the second water cooling pipe 400 may have a higher absorption rate of radiant heat than the first water cooling pipe 300.

In addition, any one of the first and second water cooling tubes 300 and 400 may be formed of a hydrogen storage alloy.

Here, the hydrogen storage alloy may be a Ti-Mn alloy to which hydrogen is added.

In addition, the first and second water cooling tubes 300 and 400 may be formed of materials having different radiant heat absorption rates, or may be coated with radiant heat absorbing materials having different colors.

In some cases, any one of the first and second water cooling tubes 300 and 400 may be coated with a radiation heat absorbing material.

In addition, the first and second water cooling pipes 300 and 400 may perform ceramic coating to reduce contamination of the ingot 100.

Here, the ceramic coating agent may be cured silicon, which is surrounded by a reactive ligand using a metal alkoxide, through a sol-gel process, through a hydrolysis and poly-condensation reaction.

In addition, the coating agent used in the ceramic coating may be SiO ₂ sol-gel, which uses silicon or metal alkoxide surrounded by various reactive ligands to form a colloidal suspended state in the sol state. Among them, an alkoxide called tetrameth oxysilane (TMOS) may be used, and then may be cured at about 450 ° C. through a sol-gel process and then subjected to hydrolysis and polycondensation.

In other words, the main component of the coating agent is SiO2, which mainly has strong ionic bonds with the metal surface and has a high binding energy.

As such, two water cooling tubes may be stacked and assembled, but two or more water cooling tubes may be stacked.

Here, since each water cooling tube has a different absorption rate of radiant heat, it is possible to realize a cooling rate suitable for the characteristics of the product.

Therefore, the cooling apparatus of this invention can absorb an emissivity efficiently according to a product.

For example, a product to secure an extremely low defect area or a product that needs to grow rapidly (related to production) may be equipped with a water cooling tube made of a material having excellent radiation absorption or coated with a material having excellent color absorption. Can be fitted.

The silicon single crystal cooling apparatus equipped with such water cooling tubes may improve the cooling efficiency by efficiently absorbing radiant heat generated while the silicon single crystal ingot passes through the water cooling tube.

In addition, since the heat exchange between the silicon single crystal ingot and the water cooling tube is performed quickly, the growth rate of the silicon single crystal ingot can be increased, and thus the production yield of the ingot per unit time can be improved.

For example, the water cooling tubes may be made of graphite, or the like, and may be coated with a black material to absorb radiation from the ingot IG.

In addition, as a material of the water cooling tube, an alloy superior in radiant heat to stainless steel may be used.

For example, the alloy may be a hydrogen storage alloy, but may be a Ti-Mn alloy added with hydrogen, but is not limited thereto.

As such, the use of hydrogen storage materials, such as hydrogenated Ti-Mn alloys, which further extends the extremely low defect area, would have a positive effect on securing margins.

The water cooling tube may be manufactured in a type in which the metal is hidden in the atomic state and reacts with the heat of the ingot to penetrate. The water cooling tube made of the hydrogen storage alloy may be installed at the lower side of the water cooling tube assembly support.

In addition, in the case of the low density of the void (Void) family, it is necessary to control the cooling rate in the void generation and growth temperature range.

To this end, a water cooling tube made of a material having a small radiant heat may be used, or a water cooling tube coated with a material having a color causing reflection may be mounted.

Thus, based on the V / G theory, it is possible to produce a product in which vacancy predominates.

Here, V value means the pulling speed (pulling speed) of an ingot, and G value means the temperature gradient in a solid-liquid interface.

In other words, the G value means the temperature difference between the silicon solution (SM) in the liquid-liquid interface and the single crystal rod of the solidified solid.

V-rich, which is produced with a high V / G value, that is, a product having superior vacancy, can grow a silicon single crystal by mounting a water cooling tube made of a material having low absorption of radiant heat.

Alternatively, in some cases, the present invention may insert a heating element into the water cooling tube, remove some of the water cooling tubes, and grow the silicon single crystal to selectively control the cooling rate.

Figure 2 is another embodiment showing the water cooling pipe assembly support of Figure 1b.

As shown in FIG. 2, the water cooling pipe assembly support 200 may be assembled by stacking the first and second water cooling pipes 300 and 400. Instead of the fastening member of FIGS. 1A and 1B, the water cooling pipe assembly support may be assembled. A support protrusion 220 may be formed on the 200 to support the first and second water cooling pipes 300 and 400.

Here, the support protrusion 220 may be the same as the width of the first, second water cooling pipe (300, 400), but may have a different width in some cases.

In addition, the support protrusion 220 may be manufactured in various shapes, and may be used together with the fastening member.

3 is a cross-sectional view showing a silicon single crystal cooling apparatus according to a second embodiment of the present invention.

In the first embodiment of the present invention, the materials of the first and second water cooling tubes 300 and 400 are materials having different absorption rates of radiant heat, but in the second embodiment of the present invention, the first and second water cooling tubes 300 are different. , 400) are the same material.

The radiant heat absorbing material may be coated on the inner surfaces of the first and second water cooling tubes 300 and 400.

As illustrated in FIG. 3, a first radiation heat absorbing material 610 is coated on an inner surface of the first water cooling tube 300, and a second radiation heat absorbing material 620 is disposed on an inner surface of the second water cooling tube 400. This can be coated.

Here, the first radiation heat absorbing material 610 may have a different color from the second radiation heat absorbing material 620.

For example, the first radiant heat absorbing material 610 may be a material having a black color with a good absorption rate of radiant heat, and the second radiant heat absorbing material 620 may be different from the first radiant heat absorbing material 620. Can have

In some cases, irrespective of the color, a material having a different absorption rate of radiant heat may be coated on the inner surface of the water cooling tube.

4A and 4B are views illustrating a silicon single crystal cooling apparatus according to a third embodiment of the present invention. FIG. 4A is a perspective view and FIG. 4B is a sectional view.

As shown in FIGS. 4A and 4B, the silicon single crystal cooling apparatus includes first, second, and third water cooling tubes 300, 400, and 500, and first, second, and third water cooling tubes 300, It may include a water cooling pipe assembly support 200 for assembling the stack 400, 500.

The silicon single crystal ingot may move through the central cooling space 101 of the first, second, and third water cooling tubes 300, 400, and 500.

Here, the first, second, and third water cooling pipes 300, 400, and 500 may be assembled through the fastening member 210 of the water cooling pipe assembly support 200.

Fastening member 210 may use a variety of instruments, for example, but may use a fastening screw, but is not limited thereto.

In addition, any one of the first, second, and third water cooling tubes 300, 400, and 500 may have a different absorption rate of radiant heat.

At this time, the absorption rate of the radiant heat may be changed by the material of the water cooling tube or the color of the coating material.

Therefore, the first, second, and third water cooling tubes 300, 400, and 500 may be made of materials having different absorption rates of radiant heat, or may be coated with a radiant heat absorbing material having different colors.

For example, the cooling apparatus of the present invention may include first, second and third water cooling tubes 300, 400 and 500, wherein the first water cooling tube 300 is a lower portion of the water cooling tube assembly support 200. The second water cooling pipe 400 may be stacked on the first water cooling pipe 300, and the absorption rate of radiant heat may be lower than that of the first water cooling pipe 300.

In addition, the third water cooling tube 500 may be stacked on the second water cooling tube 400, and the absorption rate of radiant heat may be lower than that of the first water cooling tube 300.

Here, the absorption rate of the radiant heat may be the same as that of the second water cooling tube 400 in the third water cooling tube 500, and the absorption rate of the radiant heat may be different from the second water cooling tube 400 in the third water cooling tube 500. .

In some cases, the third water cooling pipe 500 may have a higher absorption rate of radiant heat than the first water cooling pipe 300.

In addition, any one of the first, second, and third water cooling pipes 300, 400, and 500 may be formed of a hydrogen storage alloy.

Here, the hydrogen storage alloy may be a Ti-Mn alloy to which hydrogen is added.

In addition, the first, second, and third water cooling tubes 300, 400, and 500 may be made of materials having different radiant heat absorption rates, or may be coated with radiant heat absorbing materials having different colors.

In some cases, any one of the first, second, and third water cooling tubes 300, 400, and 500 may be coated with a radiation heat absorbing material.

In addition, the first, second, and third water cooling pipes 300, 400, and 500 may perform ceramic coating to reduce contamination of the ingot 100.

Here, the ceramic coating agent may be SiO ₂ .

Figure 5 is another embodiment showing the water cooling pipe assembly support of Figure 4b.

As shown in FIG. 5, the water cooling pipe assembly support 200 may be assembled by stacking the first, second, and third water cooling pipes 300, 400, and 500, instead of the fastening members of FIGS. 4A and 4B. The support protrusion 220 may be formed on the water cooling pipe assembly support 200 to support the first, second, and third water cooling pipes 300, 400, and 500.

Here, the support protrusion 220 may be the same as the width of the first, second, third water cooling pipe (300, 400, 500), but may have a different width in some cases.

In addition, the support protrusion 220 may be manufactured in various shapes, and may be used together with the fastening member.

6 is a cross-sectional view showing a silicon single crystal cooling apparatus according to a fourth embodiment of the present invention.

In the third embodiment of the present invention, the materials of the first, second, and third water cooling tubes 300, 400, and 500 are materials having different absorption rates of radiant heat. The materials of the second and third water cooling tubes 300, 400, and 500 are the same.

The radiant heat absorbing material may be coated on the inner surfaces of the first, second, and third water cooling tubes 300, 400, and 500.

As illustrated in FIG. 6, a first radiation heat absorbing material 610 is coated on an inner surface of the first water cooling tube 300, and a second radiation heat absorbing material 620 is disposed on an inner surface of the second water cooling tube 400. It may be coated, and the third radiation heat absorbing material 630 may be coated on the inner surface of the third water cooling tube 500.

Here, the first radiation heat absorbing material 610 may have a different color from the second and third radiation heat absorbing materials 620 and 630.

For example, the first radiant heat absorbing material 610 may be a material having a black color with good absorption rate of radiant heat, and the second and third radiant heat absorbing materials 620 and 630 may be formed of the first radiant heat absorbing material ( It may have a different color from 620.

In addition, the second radiant heat absorbing material 620 may have a different color from the third radiant heat absorbing material 630.

In some cases, irrespective of the color, a material having a different absorption rate of radiant heat may be coated on the inner surface of the water cooling tube.

As such, the cooling apparatus according to the present invention may include a plurality of water cooling pipes and a water cooling pipe assembly support for stacking and assembling a plurality of water cooling pipes.

And, among the plurality of water cooling tubes, some may have a different absorption rate of radiant heat.

Here, some water cooling tubes may be made of a material having a different absorption rate of radiant heat, and some water cooling tubes may be coated with a radiation heat absorbing material having a different color of radiant heat absorption rate.

Therefore, the present invention implements a cooling apparatus by assembling a plurality of water cooling tubes having different cooling rates, thereby efficiently absorbing radiant heat generated from silicon single crystal ingots and hot zones, and thus having excellent cooling efficiency.

In addition, since the present invention can use various material properties without using only one material property of the water cooling tube, it is possible to develop various products without changing the structure of the hot zone.

FIG. 7 is a first embodiment showing the water cooling tube of FIG. 1B in detail.

As shown in FIG. 7, the cooling device may have a structure in which the first water cooling pipe 300 and the second water cooling pipe 400 are stacked.

Here, the first water cooling pipe 300 and the second water cooling pipe 400 may have separate cooling water inlets and outlets, and the flow spaces of the cooling water are not connected to each other and are blocked.

For example, the first water cooling tube 300 may include a first inner tube 310, a first outer tube 320, a first cooling water inlet 330a, and a first cooling water outlet 330b.

Here, the flow space of the coolant may be formed between the first outer tube 320 and the first inner tube 310, the coolant flows into the flow space through the first coolant inlet 330a, and the first coolant outlet Through 330b, it may exit to the outside.

In addition, the second water cooling pipe 400 may include a second inner pipe 410, a second outer pipe 420, a second cooling water inlet 430a, and a second cooling water outlet 430b.

Here, a flow space of the coolant may be formed between the second outer tube 420 and the second inner tube 410, and the coolant is introduced into the flow space through the second coolant inlet 430a and the second coolant outlet Through 430b, it may exit to the outside.

At this time, the first inner tube 310 and the first outer tube 320 of the first water cooling tube 300 and the second inner tube 410 and the second outer tube 420 of the second water cooling tube 400 and It may be made of different materials.

That is, the first inner tube 310 and the first outer tube 320 of the first water cooling tube 300 is made of a material that absorbs radiant heat at a first absorption rate, and the second inner side of the second water cooling tube 400. The tube 410 and the second outer tube 420 may be made of a material that absorbs radiant heat at a second absorption rate.

Here, the first absorption may be higher than the second absorption, and in some cases, the first absorption may be lower than the second absorption.

In addition, the first water cooling pipe 300 and the second water cooling pipe 400 may block the flow space of the cooling water from each other, and the cooling water may be introduced and discharged through separate cooling water inlets and outlets, respectively.

8A and 8B are detailed views illustrating the water cooling tube of FIG. 4B.

As shown in FIGS. 8A and 8B, the cooling apparatus may have a structure in which the first water cooling pipe 300, the second water cooling pipe 400, and the third water cooling pipe 500 are sequentially stacked.

Here, each of the first water cooling pipe 300, the second water cooling pipe 400, and the third water cooling pipe 500 may have a separate cooling water inlet and outlet, and the flow spaces of the cooling water are not connected to each other and are blocked.

For example, the first water cooling tube 300 may include a first inner tube 310, a first outer tube 320, a first cooling water inlet 330a, and a first cooling water outlet 330b.

Here, the flow space of the coolant may be formed between the first outer tube 320 and the first inner tube 310, the coolant flows into the flow space through the first coolant inlet 330a, and the first coolant outlet Through 330b, it may exit to the outside.

In addition, the second water cooling pipe 400 may include a second inner pipe 410, a second outer pipe 420, a second cooling water inlet 430a, and a second cooling water outlet 430b.

Here, a flow space of the coolant may be formed between the second outer tube 420 and the second inner tube 410, and the coolant is introduced into the flow space through the second coolant inlet 430a and the second coolant outlet Through 430b, it may exit to the outside.

In addition, the third water cooling pipe 500 may include a third inner pipe 510, a third outer pipe 520, a third cooling water inlet 530a, and a third cooling water outlet 530b.

Here, the flow space of the coolant may be formed between the third outer tube 520 and the third inner tube 510, the coolant flows into the flow space through the third coolant inlet 530a, and the third coolant outlet Through 530b, it may exit to the outside.

At this time, as shown in FIG. 8A, the third inner tube 510 and the third outer tube 520 of the third water cooling tube 500 may include the first inner tube 310 and the first inner tube of the first water cooling tube 300. The outer tube 320 and the second inner tube 410 and the second outer tube 420 of the second water cooling tube 400 may be made of a different material.

That is, the first inner tube 310 and the first outer tube 320 of the first water cooling tube 300 is made of a material that absorbs radiant heat at a first absorption rate, and the second inner side of the second water cooling tube 400. The tube 410 and the second outer tube 420 are made of a material that absorbs radiant heat at a second absorption rate, and the third inner tube 510 and the third outer tube 520 of the third water cooling tube 500 are It may be made of a material that absorbs radiant heat at a third absorption rate.

Here, the third absorption rate may be lower than the first absorption rate and the second absorption rate, and in some cases, may be higher than the first absorption rate and the second absorption rate.

8B, the third inner tube 510 and the third outer tube 520 of the third water cooling tube 500 may include the first inner tube 310 and the first inner tube of the first water cooling tube 300. It may be made of the same material as the outer tube 320, it may be made of a material different from the second inner tube 410 and the second outer tube 420 of the second water cooling tube (400).

Here, the third water cooling tube 500 may have an absorption rate of absorbing radiant heat the same as that of the second water cooling tube 400, and may be higher or lower than the first water cooling tube 300.

In addition, the first water cooling pipe 300, the second water cooling pipe 400 and the third water cooling pipe 500, the flow space of the cooling water is blocked from each other, each through a separate cooling water inlet, the cooling water can be introduced and discharged have.

9A and 9B are second exemplary embodiments showing the water cooling tube of FIG. 1B in detail.

As illustrated in FIGS. 9A and 9B, the cooling apparatus may have a structure in which the first water cooling pipe 300 and the second water cooling pipe 400 are stacked.

Here, the first water cooling pipe 300 and the second water cooling pipe 400 may have separate cooling water inlets and outlets, and the flow spaces of the cooling water are not connected to each other and are blocked.

For example, the first water cooling tube 300 may include a first inner tube 310, a first outer tube 320, a first cooling water inlet 330a, and a first cooling water outlet 330b.

Here, the flow space of the coolant may be formed between the first outer tube 320 and the first inner tube 310, the coolant flows into the flow space through the first coolant inlet 330a, and the first coolant outlet Through 330b, it may exit to the outside.

In addition, the second water cooling pipe 400 may include a second inner pipe 410, a second outer pipe 420, a second cooling water inlet 430a, and a second cooling water outlet 430b.

Here, a flow space of the coolant may be formed between the second outer tube 420 and the second inner tube 410, and the coolant is introduced into the flow space through the second coolant inlet 430a and the second coolant outlet Through 430b, it may exit to the outside.

At this time, the first inner tube 310 and the first outer tube 320 of the first water cooling tube 300 and the second inner tube 410 and the second outer tube 420 of the second water cooling tube 400 and It may be made of the same material as each other.

9A, the radiant heat absorbing material 610 may be coated only on the first inner tube 310 of the first water cooling tube 300, and the second inner tube 410 of the second water cooling tube 400 may be coated. The radiant heat absorbing material 610 may not be coated.

Therefore, in such a structure, since the radiant heat absorbing material 610 is coated only on the first inner tube 310 of the first water cooling tube 300, the absorption rate of the radiant heat in the first water cooling tube 300 is increased by the second water cooling tube ( Higher than 400).

In addition, as illustrated in FIG. 9B, the radiant heat absorbing material 610 may be coated only on the second inner tube 410 of the second water cooling tube 400, and the first inner tube 310 of the first water cooling tube 300 may be coated. The radiant heat absorbing material 610 may not be coated.

Therefore, in this structure, since the radiant heat absorbing material 610 is coated only on the second inner tube 410 of the second water cooling tube 400, the absorption rate of the radiant heat in the second water cooling tube 400 is increased by the first water cooling tube ( Higher than 300).

In addition, the first water cooling pipe 300 and the second water cooling pipe 400 may block the flow space of the cooling water from each other, and the cooling water may be introduced and discharged through separate cooling water inlets and outlets, respectively.

FIG. 10 is a third embodiment showing the water cooling tube of FIG. 1B in detail.

As shown in FIG. 10, the cooling apparatus may have a structure in which the first water cooling pipe 300 and the second water cooling pipe 400 are stacked.

Here, the first water cooling pipe 300 does not have a separate cooling water inlet, the second water cooling pipe 400 may have a separate cooling water inlet, the flow space of the cooling water is connected to each other.

For example, the first water cooling tube 300 may include a first inner tube 310 and a first outer tube 320.

Here, the first inner tube 310 is connected to the second inner tube 410 of the second water cooling tube 400, the first outer tube 320 is the second outer tube (2) of the second water cooling tube 400 ( 420 may be connected.

In addition, the flow space of the cooling water formed between the first outer tube 320 and the first inner tube 310 is between the second outer tube 420 and the second inner tube 410 of the second water cooling tube 400. It may be connected to the flow space of the cooling water formed in the.

In addition, the second water cooling pipe 400 may include a second inner pipe 410, a second outer pipe 420, a second cooling water inlet 430a, and a second cooling water outlet 430b.

Here, a flow space of the coolant may be formed between the second outer tube 420 and the second inner tube 410, and the coolant is introduced into the flow space through the second coolant inlet 430a and the second coolant outlet Through 430b, it may exit to the outside.

At this time, the first inner tube 310 and the first outer tube 320 of the first water cooling tube 300 and the second inner tube 410 and the second outer tube 420 of the second water cooling tube 400 and It may be made of the same material.

In addition, a first radiant heat absorbing material 610 may be coated on the first inner tube 310 of the first water cooling tube 300, and a second inner tube 410 of the second water cooling tube 400 may be coated on the second inner tube 410. Radiant heat absorbing material 620 may be coated.

Here, when the first radiant heat absorbing material 610 is a material that absorbs radiant heat at a first absorption rate, and the second radiant heat absorbing material 620 is a material that absorbs radiant heat at a second absorption rate, the first absorption rate is a second absorption rate. It may be higher, and in some cases, the first absorption may be lower than the second absorption.

As such, the first water cooling pipe 300 and the second water cooling pipe 400 may be connected to the flow space of the cooling water, and through the cooling water inlet formed in the second water cooling pipe 400, the cooling water may be introduced and discharged. have.

11A and 11B illustrate a fourth embodiment showing the water cooling tube of FIG. 1B in detail.

As illustrated in FIGS. 11A and 11B, the cooling apparatus may have a structure in which the first water cooling pipe 300 and the second water cooling pipe 400 are stacked.

Here, the first water cooling pipe 300 does not have a separate cooling water inlet, the second water cooling pipe 400 may have a separate cooling water inlet, the flow space of the cooling water is connected to each other.

For example, the first water cooling tube 300 may include a first inner tube 310 and a first outer tube 320.

Here, the first inner tube 310 is connected to the second inner tube 410 of the second water cooling tube 400, the first outer tube 320 is the second outer tube (2) of the second water cooling tube 400 ( 420 may be connected.

In addition, the flow space of the cooling water formed between the first outer tube 320 and the first inner tube 310 is between the second outer tube 420 and the second inner tube 410 of the second water cooling tube 400. It may be connected to the flow space of the cooling water formed in the.

In addition, the second water cooling pipe 400 may include a second inner pipe 410, a second outer pipe 420, a second cooling water inlet 430a, and a second cooling water outlet 430b.

Here, a flow space of the coolant may be formed between the second outer tube 420 and the second inner tube 410, and the coolant is introduced into the flow space through the second coolant inlet 430a and the second coolant outlet Through 430b, it may exit to the outside.

At this time, the first inner tube 310 and the first outer tube 320 of the first water cooling tube 300 and the second inner tube 410 and the second outer tube 420 of the second water cooling tube 400 and It may be made of the same material.

11A, a radiation heat absorbing material 610 may be coated on the first inner tube 310 of the first water cooling tube 300, and the second inner tube 410 of the second water cooling tube 400 may be coated. The radiation absorbing material may not be coated.

Therefore, in such a structure, since the radiant heat absorbing material 610 is coated only on the first inner tube 310 of the first water cooling tube 300, the absorption rate of the radiant heat in the first water cooling tube 300 is increased by the second water cooling tube ( Higher than 400).

In addition, as illustrated in FIG. 11B, the radiant heat absorbing material 610 may be coated only on the second inner tube 410 of the second water cooling tube 400, and the first inner tube 310 of the first water cooling tube 300 may be coated. The radiant heat absorbing material 610 may not be coated.

Therefore, in this structure, since the radiant heat absorbing material 610 is coated only on the second inner tube 410 of the second water cooling tube 400, the absorption rate of the radiant heat in the second water cooling tube 400 is increased by the first water cooling tube ( Higher than 300).

In addition, the first water cooling pipe 300 and the second water cooling pipe 400 may be connected to the flow space of the cooling water, and the cooling water may be introduced and discharged through the cooling water inlet formed in the second water cooling pipe 400. .

12A to 12C are views showing the height of the water cooling tubes.

As shown in FIGS. 12A to 12C, the cooling apparatus may have a structure in which the first water cooling pipe 300 and the second water cooling pipe 400 are stacked.

Here, the first water cooling pipe 300 and the second water cooling pipe 400 may have separate cooling water inlets and outlets, and the flow spaces of the cooling water are not connected to each other and are blocked.

For example, the first water cooling tube 300 may include a first inner tube 310, a first outer tube 320, a first cooling water inlet 330a, and a first cooling water outlet 330b.

Here, the flow space of the coolant may be formed between the first outer tube 320 and the first inner tube 310, the coolant flows into the flow space through the first coolant inlet 330a, and the first coolant outlet Through 330b, it may exit to the outside.

In addition, the second water cooling pipe 400 may include a second inner pipe 410, a second outer pipe 420, a second cooling water inlet 430a, and a second cooling water outlet 430b.

Here, a flow space of the coolant may be formed between the second outer tube 420 and the second inner tube 410, and the coolant is introduced into the flow space through the second coolant inlet 430a and the second coolant outlet Through 430b, it may exit to the outside.

12A, the first water cooling pipe 300 may have a first height h1, and the second water cooling pipe 400 may have a second height h2, and the first height of the first water cooling pipe 300 may be different. h1 may be the same as the second height h2 of the second water cooling pipe 400.

12B and 12C, the first height h1 of the first water cooling tube 300 and the second height h2 of the second water cooling tube 400 may be different from each other.

For example, as shown in FIG. 12B, the first height h1 of the first water cooling tube 300 may be higher than the second height h2 of the second water cooling tube 400.

And, as shown in FIG. 12C, the first height h1 of the first water cooling tube 300 may be lower than the second height h2 of the second water cooling tube 400.

As such, the reason for controlling the height of the water cooling tube of the cooling device is that by controlling the cooling rate, various silicon single crystal products can be developed, and the radiant heat of the products can be efficiently absorbed, thereby providing excellent cooling efficiency.

13 is a graph showing the endothermic amount of the cooling device according to the present invention.

As shown in FIG. 13, since a cooling apparatus having a general water cooling tube is fixed in a material of the water cooling tube, absorption of radiant heat is determined according to the material characteristics of the corresponding water cooling tube, while the present invention has a plurality of water cooling tubes. The cooling apparatus of the present invention assembles several water cooling tubes having various materials of water cooling tubes, and efficiently absorbs radiant heat to match the quality of the silicon single crystal to be manufactured, thereby providing excellent cooling efficiency.

As shown in Figure 13, it can be seen that the cooling apparatus of the present invention having an improved water cooling tube than the cooling apparatus having a general water cooling tube is excellent in cooling efficiency of about 40% or more.

As described above, the conventional cooling apparatus determines the absorption of radiant heat according to the metal characteristics of the fixed water cooling tube. However, the present invention uses a radiation absorbing material that is suitable for product quality, or a material that emits atoms to help crystal growth (Ti). By using -Mn), various products can be developed by assembling the water cooling tube.

In addition, in the present invention, since the water cooling tube is not fixed, it is possible to develop a variety of products by changing the assembly form according to the product, and use a radiant heat absorber suitable for the product without changing the hot zone, It can be seen that there is a cost saving effect.

14 is a cross-sectional view showing a silicon single crystal growth apparatus using the silicon single crystal cooling apparatus according to the present invention.

As shown in FIG. 14, the silicon single crystal growth apparatus may include a chamber 10, a crucible 20, a heater 30, and a silicon single crystal cooling apparatus.

Here, the silicon single crystal cooling apparatus may include a plurality of water cooling tubes and a water cooling tube assembly support for stacking and assembling a plurality of water cooling tubes. Some of the plurality of water cooling tubes may have different absorption rates of radiant heat. .

For example, as shown in FIG. 14, the silicon single crystal cooling apparatus may have a structure in which the first water cooling pipe 300 and the second water cooling pipe 400 are stacked.

Here, the first water cooling pipe 300 and the second water cooling pipe 400 may have separate cooling water inlets and outlets, and the flow spaces of the cooling water are not connected to each other and are blocked.

The first water cooling pipe 300 may include a first inner pipe 310, a first outer pipe 320, a first cooling water inlet 330a, and a first cooling water outlet 330b.

Here, the flow space of the coolant may be formed between the first outer tube 320 and the first inner tube 310, the coolant flows into the flow space through the first coolant inlet 330a, and the first coolant outlet Through 330b, it may exit to the outside.

In addition, the second water cooling pipe 400 may include a second inner pipe 410, a second outer pipe 420, a second cooling water inlet 430a, and a second cooling water outlet 430b.

Here, a flow space of the coolant may be formed between the second outer tube 420 and the second inner tube 410, and the coolant is introduced into the flow space through the second coolant inlet 430a and the second coolant outlet Through 430b, it may exit to the outside.

At this time, the first inner tube 310 and the first outer tube 320 of the first water cooling tube 300 and the second inner tube 410 and the second outer tube 420 of the second water cooling tube 400 and It may be made of different materials.

That is, the first inner tube 310 and the first outer tube 320 of the first water cooling tube 300 is made of a material that absorbs radiant heat at a first absorption rate, and the second inner side of the second water cooling tube 400. The tube 410 and the second outer tube 420 may be made of a material that absorbs radiant heat at a second absorption rate.

Here, the first absorption may be higher than the second absorption, and in some cases, the first absorption may be lower than the second absorption.

In addition, the first water cooling pipe 300 and the second water cooling pipe 400 may block the flow space of the cooling water from each other, and the cooling water may be introduced and discharged through separate cooling water inlets and outlets, respectively.

Next, the chamber 10 provides a space in which various processes for growing the silicon single crystal ingot IG are performed.

In addition, a radiant heat insulator 11 may be installed on an inner wall of the chamber 10 to prevent heat of the heater 30 from being discharged to the side wall of the chamber 10.

Subsequently, the crucible 20 may be provided inside the chamber 10 so as to contain the silicon solution SM, and may be made of quartz.

In addition, a crucible support 21 made of graphite may be provided outside the crucible 20 so as to support the crucible 20.

Here, the crucible support 21 is fixedly installed on the rotary shaft 23, the rotary shaft 23 is rotated by a drive means (not shown), while the solid liquid interface is the same height while rotating and lifting the crucible 20 Keep it.

Next, the heater 30 is provided inside the chamber 10 to heat the crucible 20, and the heater 30 may be formed in a cylindrical shape surrounding the crucible support 21, and may be of high purity loaded in the crucible 20. The polycrystalline silicon mass can be melted into a silicon solution (SM).

Subsequently, the pulling means 40 may be installed on the upper portion of the chamber 10 so that the cable 41 may be wound up and pulled up.

A seed crystal for growing a single crystal ingot IG while being brought into contact with the silicon solution SM in the crucible 20 may be fixed to the lower portion of the cable 41.

The pulling means 40 rotates while pulling up the cable 41 when the single crystal ingot grows. In this case, the single crystal ingot rotates about the same axis as the rotating shaft 23 of the crucible 20. Pull it up while rotating in the opposite direction.

In addition, the first and second water cooling tubes 300 and 400 are upper end portions of the chamber 10 such that the single crystal ingot IG, which is pulled up while growing in the silicon solution SM of the crucible 20, is cooled while passing through the inside thereof. It can be installed in the hot zone.

As described above, the present invention implements a cooling apparatus by assembling a plurality of water cooling tubes having different cooling speeds, thereby efficiently absorbing radiant heat generated from silicon single crystal ingots and hot zones, thereby providing excellent cooling efficiency.

In addition, since the present invention can use various material properties without using only one material property of the water cooling tube, it is possible to develop various products without changing the structure of the hot zone.

Therefore, various products can be developed through simple assembly of the water cooling tube without changing the structure of the hot zone, and thus, manufacturing cost can be greatly reduced.

Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in each embodiment may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of illustration, It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

100: single crystal ingot 200: water cooling pipe assembly support
300: first water cooling pipe 400: second water cooling pipe
500: third water cooling tube

Claims (19)

A plurality of water cooling tubes; And
And a water cooling pipe assembly support for stacking and assembling the plurality of water cooling pipes.
The silicon single crystal cooling apparatus of the plurality of water cooling tubes, some of which differ in the absorption rate of the radiant heat. The silicon single crystal cooling apparatus of claim 1, wherein the water cooling tubes are made of a material having a different absorption rate of the radiant heat. 2. The silicon single crystal cooling apparatus according to claim 1, wherein the plurality of water cooling tubes are coated with a radiation heat absorbing material having a color different in absorbance of the radiation heat. The method of claim 1, wherein the plurality of water cooling pipes,
A first water cooling tube;
And a second water cooling tube stacked on the first water cooling tube and having a lower absorption rate of the radiant heat than the first water cooling tube. 5. The silicon single crystal cooling apparatus according to claim 4, further comprising a third water cooling tube stacked on the second water cooling tube and having a lower absorption rate of the radiant heat than the first water cooling tube. 6. The silicon single crystal cooling apparatus according to claim 5, wherein the third water cooling tube has the same absorption rate as the second water cooling tube. The silicon single crystal cooling apparatus according to claim 5, wherein the third water cooling tube has a different absorption rate of the radiant heat from the second water cooling tube. 6. The silicon single crystal cooling apparatus according to claim 5, wherein at least one of the first, second, and third water cooling tubes is made of a hydrogen storage alloy. 9. The silicon single crystal cooling apparatus according to claim 8, wherein the hydrogen storage alloy is a Ti-Mn alloy added with hydrogen. 5. The silicon single crystal cooling apparatus of claim 4, wherein the first and second water cooling tubes are made of different materials or coated with a radiation heat absorbing material having different colors. 5. The silicon single crystal cooling apparatus according to claim 4, wherein any one of the first and second water cooling tubes is coated with a radiation heat absorbing material. According to claim 1, Of the plurality of water cooling pipe, Each of the water cooling pipe,
Inner tube;
An outer tube forming a flow space of cooling water between the inner tube and the inner tube; And,
And a cooling water inlet formed in the outer tube and configured to inlet and discharge the cooling water into the flow space. The method of claim 12, wherein the water cooling tube adjacent to each other,
The inner tube or outer tube is made of different materials,
The flow space of the cooling water is disconnected from each other,
Silicon single crystal cooling device through which the cooling water is introduced and discharged through the separate cooling water inlet and outlet. The method of claim 12, wherein the water cooling tube adjacent to each other,
The inner tube or outer tube is made of the same material as each other,
The flow space of the cooling water is disconnected from each other,
Through each of the separate cooling water inlet, the cooling water is introduced and discharged,
The silicon single crystal cooling apparatus in which the radiant heat absorbing material is coated only on the inner tube of any one of the adjacent water cooling tubes. The method of claim 12, wherein the water cooling tube adjacent to each other,
The inner tube or outer tube is made of the same material as each other,
The flow space of the cooling water is connected to each other,
Through the one coolant inlet, the same coolant is introduced and discharged,
Silicon single crystal cooling apparatus is coated with a different radiation heat absorbing material on the inner tube of the water cooling tube adjacent to each other. The method of claim 12, wherein the water cooling tube adjacent to each other,
The inner tube or outer tube is made of the same material as each other,
The flow space of the cooling water is connected to each other,
Through the one coolant inlet, the same coolant is introduced and discharged,
The silicon single crystal cooling apparatus in which the radiant heat absorbing material is coated only on the inner tube of any one of the adjacent water cooling tubes. 2. The silicon single crystal cooling apparatus according to claim 1, wherein some of the plurality of water cooling tubes have different heights. The silicon single crystal cooling apparatus according to claim 1, wherein the water cooling tube assembly support includes a fastening member for fixing the respective water cooling tubes. A chamber for growing a silicon single crystal ingot;
A crucible provided inside the chamber and containing a silicon solution;
A heater provided inside the chamber and heating the crucible; And,
A silicon single crystal cooling device provided inside the chamber and cooling the silicon single crystal ingot grown from the silicon solution,
The silicon single crystal cooling apparatus includes a plurality of water cooling tubes and a water cooling tube assembly support for stacking and assembling the plurality of water cooling tubes, and some of the plurality of water cooling tubes include silicon single crystal cooling having different absorption rates of radiant heat. Silicon single crystal growth apparatus using the device.

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