CN115637487A - Crystal growth furnace and temperature control method - Google Patents
Crystal growth furnace and temperature control method Download PDFInfo
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- CN115637487A CN115637487A CN202211280195.0A CN202211280195A CN115637487A CN 115637487 A CN115637487 A CN 115637487A CN 202211280195 A CN202211280195 A CN 202211280195A CN 115637487 A CN115637487 A CN 115637487A
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Abstract
The invention provides a crystal growing furnace and a temperature control method, which belong to the related technical field of crystal bars and are used for drawing the crystal bars, and the method comprises the following steps: the middle of the guide cylinder is provided with an accommodating space which is communicated up and down; the water-cooling heat shield, the water-cooling heat shield includes: the first water cooling assembly is arranged in the accommodating space of the guide cylinder, and a first cooling space for accommodating the crystal bar is arranged in the middle of the first water cooling assembly; the second water cooling assembly is arranged in the accommodating space of the guide cylinder, and a second cooling space for accommodating the crystal bar is arranged in the middle of the second water cooling assembly; the second water cooling assembly is movable relative to the first water cooling assembly and can be arranged in the first cooling space; the technical effect of adjustable parameters of the water-cooling heat shield is achieved.
Description
Technical Field
The invention relates to the technical field related to crystal growing furnaces, in particular to a crystal growing furnace and a temperature control method.
Background
The research and development iteration of the crystal growth furnace needs continuous parameter adjustment and actual measurement to establish a model of the influence of each parameter on the crystal growth. The adjustable range of the parameters of the crystal growth furnace in the research and development process is expanded, which is beneficial to establishing a mathematical model with a larger range and discovering the proper parameters of the crystal growth and the structure matched with the proper parameters.
Particularly, in the research and development of the water-cooling heat shield, the cooling speed of the water-cooling heat shield and the temperature gradient of the water-cooling heat shield are designed to be adjustable, and more/more accurate measured data can be obtained.
Therefore, the technical problems of the prior art are as follows: how to make the parameters of the water-cooling heat shield adjustable.
Disclosure of Invention
The embodiment of the application provides a crystal growth furnace and a temperature control method, and solves the technical problem of how to adjust the parameters of a water-cooling heat shield in the prior art; the technical effect of adjustable parameters of the water-cooling heat shield is achieved.
The embodiment of the application provides a crystal growing furnace for drawing crystal bar, include: the guide shell is provided with an accommodating space which is communicated up and down in the middle; the water-cooling heat shield, the water-cooling heat shield includes: the first water cooling assembly is arranged in the accommodating space of the guide cylinder, and a first cooling space for accommodating the crystal bar is arranged in the middle of the first water cooling assembly; the second water cooling assembly is arranged in the accommodating space of the guide cylinder, and a second cooling space for accommodating the crystal bar is arranged in the middle of the second water cooling assembly; the second water cooling assembly is movable relative to the first water cooling assembly and can be arranged in the first cooling space; the second water cooling assembly has two states relative to the first water cooling assembly, and in the first state, the second water cooling assembly is positioned above/below the first water cooling assembly, and the second cooling space and the first cooling space respectively act on different areas of a crystal bar; and in a second state, the second water cooling assembly is partially/completely positioned in the first cooling space of the first water cooling assembly, and the second cooling space and the first cooling space are superposed and act on a crystal bar.
Preferably, the guide shell is an assembly, and comprises an outer wall part, an inner wall part and a bottom wall part; the accommodating space is located inside the inner wall portion, and a gap exists between the inner wall portion and the outer wall portion.
Preferably, the cooling height range of the second cooling space is smaller than the cooling height range of the second cooling space, and the second water cooling module may be entirely located inside the first water cooling module to change the local temperature gradient of the first water cooling module.
Preferably, the first water cooling assembly comprises first water cooling pipes, and the first water cooling pipes are arranged at a first gap; the second water cooling assembly comprises second water cooling pipes which are arranged in a second gap; wherein the first gap is greater than or equal to the second gap.
Preferably, the crystal growth furnace further comprises: the baffle, the baffle is a surround body, the baffle sets up between first water-cooling subassembly and second water-cooling subassembly, just the laminating of baffle and first water-cooling pipe of first water-cooling subassembly sets up, makes the heat transfer of crystal bar to first water-cooling subassembly on through the baffle.
Preferably, the partition plate is erected/fixed on the guide shell, and the first water cooling assembly and the guide shell are fixed into a whole through the partition plate.
Preferably, the water cooling directions in the first water cooling assembly and the second water cooling assembly are in bidirectional reciprocating circulation, and the water cooling direction of the first water cooling assembly is staggered with the water cooling direction of the second water cooling assembly.
Preferably, the water cooling directions of the first water cooling assembly and the second water cooling assembly are both one-way, and the water cooling direction of the first water cooling assembly is staggered with the water cooling direction of the second water cooling assembly.
Preferably, the crystal growth furnace is provided with a temperature sensor, and the temperature sensor detects the temperature of the water-cooling heat shield.
A temperature control method is suitable for a crystal growth furnace with a first water-cooling assembly and a second water-cooling assembly, and the second water-cooling assembly can move relative to the first water-cooling assembly; the method comprises the following steps: adjusting the flow of cooling water in the first water-cooling assembly and/or the second water-cooling assembly; and adjusting the relative position relationship between the first water-cooling assembly and the second water-cooling assembly.
One or more technical solutions in the embodiments of the present application have at least one or more of the following technical effects:
1. in the application, the second water cooling component can move relative to the first water cooling component, so that the first water cooling component and the second water cooling component can be used independently or in a superposed combination mode respectively, and water cooling parameters are adjusted comprehensively by arranging the first water cooling component and the second water cooling component; particularly, under the condition that the first water-cooling assembly and the second water-cooling assembly are staggered, the water-cooling range of the water-cooling heat shield is maximized; under the condition that the first water-cooling assembly and the second water-cooling assembly are used in a superposed mode, the local temperature gradient of the first water-cooling assembly can be effectively adjusted, and the water-cooling environment with different temperature gradients can be created; the technical problem of how to adjust the parameters of the water-cooling heat shield in the prior art is solved; the technical effect of adjustable parameters of the water-cooling heat shield is achieved.
2. In this application, inject the size of second water cooling module, inject the cooling height scope in second water cooling space in the second water cooling module specifically to the second water cooling module only influences the temperature gradient of part in the first water cooling module subassembly, so that in the model machine test, under the condition that does not shut down and tear the cold water heat shield open, test the cooling effect to the crystal bar under the different water cooling environment. And the water-cooling environment that can build in this application is various, and the data that can test are far more than the data that can obtain of changing the water-cooling heat shield.
3. In the application, the first gap arranged on the first water-cooling pipe is more than or equal to the second gap arranged on the second water-cooling pipe, so that the temperature gradient of the first water-cooling assembly can be efficiently changed by the second water-cooling assembly under the condition that the pipe diameters of the first water-cooling pipe and the second water-cooling pipe are not different greatly; in other words, the adjustment sensitivity of the second water-cooling assembly as the mechanism adjustment member is ensured. In addition, through setting up a baffle for first water cooling module, the inner face of baffle encircles outside the crystal bar to absorb the heat, the outside and the laminating of first water cooling module of baffle, with arrange more sparsely still can high-efficient heat transfer at first water-cooled tube, and maintain a follow comparatively even temperature gradient environment of downward change.
4. In the application, the water cooling directions (water flow directions) in the first water cooling assembly and the second water cooling assembly are specifically bidirectional reciprocating circulation, so that the temperature of each height layer (each temperature gradient area) in the water cooling heat shield is relatively more uniform, and a cooling environment which is more in line with the expected temperature gradient is created.
5. In the application, the water cooling directions (water flow directions) in the first water cooling assembly and the second water cooling assembly can be set to be one-way, and when the first water cooling assembly and the second water cooling assembly are used in a superposition mode, the water cooling strength of the first water cooling assembly and the water cooling strength of the second water cooling assembly are adjusted by changing the flow rates of the first water cooling assembly and the second water cooling assembly; the water cooling force and the water cooling direction of the two are combined to change the comprehensive water cooling direction of the local part of the water cooling heat shield (refer to the attached figure 8).
Drawings
FIG. 1 is a schematic sectional view of a main view of a single crystal furnace according to the present application in the presence of an ingot;
FIG. 2 is a schematic sectional view of the ingot furnace and a part of the single crystal furnace in FIG. 1 with parts omitted;
FIG. 3 is an enlarged schematic view of the interconnect of FIG. 2;
FIG. 4 is a schematic top view of a single crystal furnace according to the present application;
FIG. 5 is a schematic structural diagram of a crystal bar in a water-cooling heat shield according to the present application;
FIG. 6 is a schematic cross-sectional view of the second water cooling module after being lowered relative to the first water cooling module in the present application;
FIG. 7 is a schematic sectional view of another water-cooled heat shield according to the present application in a single crystal furnace from the front view;
FIG. 8 is a schematic view of the cooling direction in the water cooling and heating shield of the structure of FIG. 7.
Reference numerals are as follows: 100. a draft tube; 110. an outer wall portion; 120. an inner wall portion; 130. a bottom wall portion; 200. a first water cooling assembly; 210. a first joint; 220. a first water-cooled tube; 230. a second joint; 300. a partition plate; 400. a second water cooling assembly; 410. a third joint; 420. an interconnector; 421. a first channel; 422. a second channel; 430. a second water-cooled tube; 440. a fourth joint; 500. and (5) crystal bars.
Detailed Description
The numbering of the components as such, e.g., "first", "second", etc., is used herein only to distinguish the objects as described, and does not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings). In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present application and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be considered as limiting the present application.
In this application, unless expressly stated or limited otherwise, a first feature is "on" or "under" a second feature such that the first and second features are in direct contact, or the first and second features are in indirect contact via an intermediary. Also, a first feature "on," "above," and "over" a second feature may be directly on or obliquely above the second feature, or simply mean that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In order to better understand the technical solution, the technical solution will be described in detail with reference to the drawings and the specific embodiments.
A crystal growing furnace, refer to the attached fig. 1 and 6 of the specification, is used for drawing the crystal bar 500, including draft tube 100 and water-cooling heat shield; the middle of the guide shell 100 is provided with an accommodating space which is communicated up and down; the water-cooling heat shield comprises a first water-cooling assembly 200 and a second water-cooling assembly 400, the first water-cooling assembly 200 and the second water-cooling assembly 400 are combined for use, and the cooling water flow of the first water-cooling assembly 200 and the second water-cooling assembly 400 is adjusted by adjusting the position relation between the two assemblies, so that the cooling environment can be adjusted and changed greatly, group data can be tested, a function curve in a model can be refined, and practical help can be provided for research and development.
It can be understood that the crystal growing furnace is provided with a temperature sensor which detects the temperature of the water-cooling heat shield so as to record and adjust the water-cooling heat shield through the feedback information of the temperature sensor.
As can be understood with respect to the guide shell 100, the guide shell 100 is generally an assembly, and the guide shell 100 includes an outer wall portion 110, an inner wall portion 120, and a bottom wall portion 130; the accommodating space is located inside the inner wall portion 120, and a gap exists between the inner wall portion 120 and the outer wall portion 110, so that the guide shell 100 isolates a part of heat while guiding the flow.
A water cooled heat shield, as described with reference to fig. 5, for cooling the drawn ingot 500. The design of the water-cooling heat shield is two parts in the application, so that the independent adjustment and the superposition adjustment are facilitated, the cooling environments with different temperature gradients are created, or the cooling environments with different cooling ranges are created. Specifically, the second water cooling module 400 has two states with respect to the first water cooling module 200, and in the first state, the second water cooling module 400 is located above/below the first water cooling module 200, and the second cooling space and the first cooling space respectively act on different regions of an ingot 500; in the second state, the second water cooling module 400 is partially/entirely located in the first cooling space of the first water cooling module 200, and the second cooling space and the first cooling space are superposed to act on an ingot 500.
The first water cooling assembly 200, as described with reference to FIGS. 5-6, is used as the primary water cooling device to cool the ingot 500. Is disposed in the accommodating space of the draft tube 100, and a first cooling space for accommodating the ingot 500 is formed in the middle of the first water cooling assembly 200. The first water cooling module 200 includes a first water cooling pipe 220, a first joint 210, and a second joint 230, and the first joint 210 and the second joint 230 are respectively connected to both ends of the first water cooling pipe 220.
The second water cooling assembly 400, referred to in the specification with reference to fig. 2 and 5, is used as a water cooling device for adjusting the water cooling environment to cool the ingot 500. The second water cooling module 400 is arranged in the accommodating space of the draft tube 100, and a second cooling space for accommodating the crystal bar 500 is arranged in the middle of the second water cooling module 400; the second water cooling module 400 is movable with respect to the first water cooling module 200, and the second water cooling module 400 may be disposed in the first cooling space. The second water cooling module 400 includes a second water cooling tube 430, a third joint 410, and a fourth joint 440.
As for the movement of the second water cooling module 400, the movement of the second water cooling module 400 can be controlled by arranging rods on the third joint 410 and the fourth joint 440, so as to control the elevation of the second water cooling module 400 from the outside of the furnace cover of the crystal growth furnace (not shown).
Regarding the relative relationship between the two, it should be noted that the cooling height range of the second cooling space is smaller than that of the second cooling space, and the second water cooling module 400 may be located inside the first water cooling module 200 to change the local temperature gradient of the first water cooling module 200. Specifically, in order to improve the adjustment capability of the second water cooling module 400 to the first water cooling module 200, the first water cooling tubes 220 are arranged at a first gap, and the second water cooling tubes 430 are arranged at a second gap; the first gap is greater than or equal to the second gap, and the temperature gradient of the first water-cooling assembly 200 is adjusted more greatly and more flexibly through the second water-cooling assembly 400 which is arranged closely.
In order to ensure the heat exchange capability of the first water cooling module 200, referring to the attached drawing 1 of the specification, a partition 300 may be further disposed in the crystal growth furnace, the partition 300 is a surrounding body, the partition 300 is disposed between the first water cooling module 200 and the second water cooling module 400, and the partition 300 and the first water cooling tube 220 of the first water cooling module 200 are attached to each other, so that the heat of the crystal rod 500 is transferred to the first water cooling module 200 through the partition 300, the first water cooling tube 220 is sparsely arranged, and the efficient heat exchange is still possible, and a temperature gradient environment with uniform change from top to bottom is maintained. In addition, the partition 300 is erected/fixed on the draft tube 100, and the first water-cooling module 200 and the draft tube 100 are fixed into a whole through the partition 300, so as to prevent the first water-cooling module 200 from shaking and ensure the stability of the position.
It should be noted that the water cooling directions of the first water cooling module 200 and the second water cooling module 400 are also related to the cooling environment, and the specific water cooling direction determines the direction of heat removal, which affects the thermal field around the ingot 500, and the thermal field around the ingot 500 determines the quality of the newly drawn ingot 500. The form of the water-cooling heat shield can be divided into two types.
First, referring to fig. 2 of the specification, the water cooling directions in the first water cooling module 200 and the second water cooling module 400 are specifically bidirectional reciprocating cycles, and the water cooling direction of the first water cooling module 200 is staggered with the water cooling direction of the second water cooling module 400. Ensuring that the temperature of each height layer (each temperature gradient area) in the water-cooling heat shield is relatively more uniform, so as to create a cooling environment which is more consistent with the expected temperature gradient.
It should be noted that, when the water cooling direction of the second water cooling module 400 is set to be a bidirectional reciprocating circulation type, an interconnector 420 may be additionally provided, and the second cold water pipe may be set to be a multi-stage type. Referring to fig. 3-4 of the specification, an inter-connector 420 is provided between the third joint 410 and the second water cooled tube 430 for use as a comprehensive valve body between the multiple sections of the second water cooled tube 430. Specifically, the interconnector 420 includes a first passage 421 and a second passage 422 therein, and the first passage 421 enables the third joint 410 to communicate with a section of the second water-cooling pipe 430; the number of the second passages 422 is multiple, and the second passages 422 are used for connecting two sections of the second water-cooling tubes 430, and because the two sections of the second water-cooling tubes 430 are connected to the same side of the second passages 422, the water-cooling direction of the whole second water-cooling assembly 400 can realize bidirectional circulation. It is understood that the specific layout of the first channel 421 in the second channel 422 may be varied as long as the first channel 421 and the number of second channels 422 remain independent of each other. The first water cooling module 200 can be designed in a way that the first water cooling pipe 220 is bent and turned due to low requirement on arrangement clearance.
Second, referring to fig. 7-8 of the specification, the water cooling directions of the first water cooling module 200 and the second water cooling module 400 are both unidirectional, and the water cooling direction of the first water cooling module 200 is staggered with the water cooling direction of the second water cooling module 400. The water cooling strength of the first water cooling assembly 200 and the second water cooling assembly 400 is adjusted by changing the flow rate of the two water cooling assemblies; the water cooling force and the water cooling direction of the two are combined to change the local comprehensive water cooling direction of the water cooling heat shield.
A temperature control method is suitable for a crystal growth furnace with a first water-cooling assembly 200 and a second water-cooling assembly 400, and the second water-cooling assembly 400 can move relative to the first water-cooling assembly 200. When the cooling environment needs to be adjusted, the cooling environment can be singly adjusted or comprehensively adjusted in the following two ways:
in the first method, the flow rate of cooling water in the first water cooling module 200 and/or the second water cooling module 400 is adjusted; the cooling capacity of the first water cooling assembly 200 and the second water cooling assembly 400 is changed by adjusting the flow rate of the cooling water, so that the temperature of the water-cooling heat shield relative to the crystal rod 500 is regulated.
When the first water cooling assembly 200 and the second water cooling assembly 400 move in a single direction, the cooling capacity of the first water cooling assembly 200 and the cooling capacity of the second water cooling assembly 400 can be adjusted and controlled to be changed in a superposition state, fine adjustment can be achieved based on fine control of flow, accordingly, the data collection capacity of the device in the testing stage is improved, and the time for adjusting parameters of the device is saved.
Adjusting the relative position relationship between the first water cooling assembly 200 and the second water cooling assembly 400; firstly, the maximum cooling range of the device is enlarged, and secondly, when the second water-cooling component 400 acts on the part of the first water-cooling component 200, the first water-cooling component 200 with the original fixed temperature gradient can be adjusted according to the requirement.
The technical effects are as follows:
1. in the present application, the second water cooling module 400 can move relative to the first water cooling module 200, so that the two modules can be used independently or in a superimposed combination, and the water cooling parameters can be adjusted comprehensively by arranging the first water cooling module 200 and the second water cooling module 400; specifically, under the condition that the first water cooling assembly 200 and the second water cooling assembly 400 are staggered, the water cooling range of the water cooling heat shield is maximized; under the condition that the first water-cooling assembly 200 and the second water-cooling assembly 400 are used in a superposed mode, the local temperature gradient of the first water-cooling assembly 200 can be effectively adjusted, and the creation of water-cooling environments with different temperature gradients is facilitated; the technical problem of how to adjust the parameters of the water-cooling heat shield in the prior art is solved; the technical effect of adjustable parameters of the water-cooling heat shield is achieved.
2. In the application, the size of the second water cooling module 400 is limited, specifically, the cooling height range of the second water cooling space in the second water cooling module 400 is limited, so that the second water cooling module 400 only affects the temperature gradient of the part in the first water cooling module 200, and the cooling effect on the crystal bar 500 in different water cooling environments can be tested under the condition that the cold water heat shield is not changed without stopping in the prototype test. And the water-cooling environment that can build in this application is various, and the data that can test are far more than the data that can obtain of changing the water-cooling heat shield.
3. In the present application, the first gap of the first water-cooling pipe 220 is greater than or equal to the second gap of the second water-cooling pipe 430, so that the second water-cooling module 400 can efficiently change the temperature gradient of the first water-cooling module 200 under the condition that the pipe diameters of the two are not different greatly; in other words, the adjustment sensitivity of the second water-cooling module 400 as the mechanism adjustment member is ensured. In addition, through setting up a baffle 300 for first water cooling module 200, the inner face of baffle 300 encircles outside crystal bar 500 to absorb the heat, the laminating of the outside and the first water cooling module 200 of baffle 300 to arrange sparsely at first water-cooled tube 220 and still can high-efficient heat transfer, and maintain a more even temperature gradient environment of change from top to bottom.
4. In the present application, the water cooling directions (water flow directions) in the first water cooling assembly 200 and the second water cooling assembly 400 are specifically bidirectional reciprocating cycles, so that the temperatures at all positions of each height layer (each temperature gradient area) in the water-cooled heat shield are relatively more uniform, and a cooling environment more conforming to the expected temperature gradient is created.
5. In the application, the water cooling directions (water flow directions) in the first water cooling assembly 200 and the second water cooling assembly 400 can also be set to be one-way, and when the first water cooling assembly 200 and the second water cooling assembly 400 are used in a superposed manner, the water cooling strength of the first water cooling assembly 200 and the second water cooling assembly 400 can be adjusted by changing the flow rates of the first water cooling assembly 200 and the second water cooling assembly 400; the water cooling force and the water cooling direction of the two are combined to change the comprehensive water cooling direction of the local part of the water cooling heat shield (refer to the attached figure 8).
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A crystal growing furnace for drawing an ingot, comprising:
the middle of the guide cylinder is provided with an accommodating space which is communicated up and down;
the water-cooling heat shield, the water-cooling heat shield includes:
the first water cooling assembly is arranged in the accommodating space of the guide cylinder, and a first cooling space for accommodating the crystal bar is arranged in the middle of the first water cooling assembly;
the second water cooling assembly is arranged in the accommodating space of the guide cylinder, and a second cooling space for accommodating the crystal bar is arranged in the middle of the second water cooling assembly; the second water cooling assembly is movable relative to the first water cooling assembly and can be arranged in the first cooling space;
the second water cooling assembly has two states relative to the first water cooling assembly, and in the first state, the second water cooling assembly is positioned above/below the first water cooling assembly, and the second cooling space and the first cooling space respectively act on different areas of a crystal bar; and in a second state, the second water cooling assembly is partially/completely positioned in the first cooling space of the first water cooling assembly, and the second cooling space and the first cooling space are superposed and act on a crystal bar.
2. The crystal growth furnace of claim 1, wherein the guide shell is an assembly comprising an outer wall portion, an inner wall portion, and a bottom wall portion; the accommodating space is located inside the inner wall portion, and a gap exists between the inner wall portion and the outer wall portion.
3. A crystal growth furnace as claimed in claim 1, wherein the cooling height range of the second cooling space is smaller than that of the second cooling space, and the second water cooling module can be located inside the first water cooling module completely to change the local temperature gradient of the first water cooling module.
4. A crystal growth furnace as claimed in claim 1, wherein the first water cooling module comprises first water cooling tubes arranged with a first gap; the second water cooling assembly comprises second water cooling pipes which are arranged in a second gap; wherein the first gap is greater than or equal to the second gap.
5. The crystal growth furnace of claim 4, further comprising:
the baffle, the baffle is a surround body, the baffle sets up between first water-cooling subassembly and second water-cooling subassembly, just the laminating of baffle and first water-cooling pipe of first water-cooling subassembly sets up, makes the heat transfer of crystal bar to first water-cooling subassembly on through the baffle.
6. A crystal growth furnace as claimed in claim 5, wherein the partition is mounted on the guide shell, and the first water-cooling unit and the guide shell are integrally fixed by the partition.
7. A crystal growth furnace as claimed in claim 1, wherein the water cooling direction in the first water cooling module and the second water cooling module is a bidirectional reciprocating cycle, and the water cooling direction of the first water cooling module is staggered with the water cooling direction of the second water cooling module.
8. A crystal growth furnace as claimed in claim 1, wherein the water cooling direction in the first water cooling module and the water cooling direction in the second water cooling module are both unidirectional, and the water cooling direction of the first water cooling module is staggered with the water cooling direction of the second water cooling module.
9. A crystal growth furnace as claimed in claim 1, wherein the crystal growth furnace has a temperature sensor therein, the temperature sensor sensing the temperature of the water-cooled heat shield.
10. A temperature control method is characterized in that the method is suitable for a crystal growth furnace with a first water cooling assembly and a second water cooling assembly, and the second water cooling assembly can move relative to the first water cooling assembly; the method comprises the following steps:
adjusting the flow of cooling water in the first water-cooling assembly and/or the second water-cooling assembly;
and adjusting the relative position relationship between the first water-cooling assembly and the second water-cooling assembly.
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| KR101774040B1 (en) * | 2016-04-22 | 2017-09-01 | (주)에스테크 | Cooling structure for ingot growing apparatus |
| CN107012501A (en) * | 2017-03-29 | 2017-08-04 | 上海汉虹精密机械有限公司 | A kind of monocrystalline silicon growing furnace water cooling covering device |
| CN210151240U (en) * | 2019-06-20 | 2020-03-17 | 宁夏旭樱新能源科技有限公司 | Water-cooling heat shield for monocrystalline silicon preparation and monocrystalline furnace |
| CN212713835U (en) * | 2020-07-21 | 2021-03-16 | 宁夏协鑫晶体科技发展有限公司 | High-pulling-speed water-cooling screen for single crystal production |
| TW202227679A (en) * | 2021-01-08 | 2022-07-16 | 大陸商上海新昇半導體科技有限公司 | Crystal growth furnace |
| CN216663293U (en) * | 2021-11-26 | 2022-06-03 | 浙江晶盛机电股份有限公司 | Water-cooling heat shield and hard shaft furnace |
| CN114381794A (en) * | 2021-12-10 | 2022-04-22 | 四川晶科能源有限公司 | Cooling screen and single crystal furnace |
| CN114737247A (en) * | 2022-05-18 | 2022-07-12 | 西安奕斯伟材料科技有限公司 | Water-cooling jacket device and single crystal furnace |
| CN114963656A (en) * | 2022-06-28 | 2022-08-30 | 四川晶科能源有限公司 | Water cooling device |
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