KR20130075076A - Method for manufacturing the organic light emitting display device - Google Patents

Abstract

PURPOSE: A method for manufacturing an organic light emitting display device is provided to prevent foreign materials deposited on a mask from being transferred on a substrate by forming an inorganic layer without a deposition mask. CONSTITUTION: A substrate (200) on which an active area and an edge area are defined is prepared. An organic light emitting display panel (210) is formed in the active area. A first organic layer (230a) is formed on the organic light emitting display panel. A second organic layer (230b) is formed on a part of the edge area of the substrate. An inorganic layer (220a) is formed on the front surface of the substrate including the first organic layer and the second organic layer. [Reference numerals] (AA,CC) Outer area; (BB) Active area

Description

Method for manufacturing an organic light emitting display device {METHOD FOR MANUFACTURING THE ORGANIC LIGHT EMITTING DISPLAY DEVICE}

The present invention relates to a method of manufacturing an organic light emitting display device, and more particularly, to a method of manufacturing an organic light emitting display device in which an organic layer and an inorganic layer are alternately stacked and encapsulated.

Video display devices that implement a variety of information as screens are the core technologies of the information and telecommunications era, and are developing in a direction that is thinner, lighter, more portable, and high performance. BACKGROUND ART As a flexible display that can be bent in pursuit of space and convenience is demanded, an organic light emitting display device that controls the amount of light emitted from the organic light emitting layer as a flat panel display device has recently been in the spotlight.

The organic light emitting diode display includes a substrate and an organic light emitting panel formed on the substrate. The organic light emitting display panel includes a first electrode, an organic light emitting layer, and a second electrode, which are sequentially formed, and a protective film is further formed on the organic light emitting display panel. The organic light emitting display panel uses an electroluminescence phenomenon in which an electric field is formed at the first and second electrodes across the organic light emitting layer, and emits light by the binding energy when the electrons and holes are injected and transferred into the organic light emitting layer to be bonded to each other. In the organic light emitting layer, electrons and holes are paired with each other, and light is emitted from the excited state to the ground state.

In particular, since the first and second electrodes and the organic light emitting layer are vulnerable to moisture and oxygen, the passivation layer is to prevent external moisture and oxygen from entering the organic light emitting display panel.

Hereinafter, a general method for protecting an organic light emitting display panel will be described.

FIG. 1A is a plan view of a plurality of organic light emitting display panels formed on a substrate, and FIG. 1B is a cross-sectional view taken along line II ′ of FIG. 1A.

As shown in FIG. 1A, a plurality of organic light emitting display panels 110 are formed on the substrate 100. As shown in FIG. 1B, the organic light emitting display panel 110 includes first and second electrodes 110a and 110c and a first electrode. And an organic light emitting layer 110b formed between the second electrodes 110a and 110c. In addition, a protective film having a structure in which the organic layer 130 and the inorganic layer 120 are alternately stacked to cover the organic light emitting display panel 110 is formed. Although not shown, the first electrode 110a is connected to a transistor formed on the substrate 100.

The organic layer 130 increases the movement path of the foreign substance introduced into the organic light emitting display panel 110 to maintain the life of the organic light emitting display panel 110 even when the foreign substance flows in. The inorganic layer 120 is the foreign substance. This is to prevent the inflow of. In general, the organic layer 130 is formed by flash evaporation, and the inorganic layer 120 is formed by chemical vapor deposition (CVD) and sputtering. At this time, the sputtering method is deposited from the top down, and the CVD is deposited from the bottom up.

In particular, the inorganic layer 120 is deposited using a deposition mask for exposing the pad portion of the organic light emitting display panel 110. At this time, the deposition mask has a transmission region and a blocking region, and the inorganic layer 120 is formed only in a region corresponding to the transmission region. However, in this case, an inorganic material may be deposited on the blocking region of the deposition mask, and the deposited inorganic material may be transferred to the substrate 100 to cause a defect of the organic light emitting display panel 110. Thus, a process of cleaning the deposition mask is added, which increases the Tact Time.

FIG. 2A is an outer picture of a deposition mask for forming an inorganic film, and FIG. 2B is a picture in which a deposition mask for forming an inorganic film is modified.

As shown in FIG. 2A, a state in which foreign matter is generated in the outer portion where the contact with the substrate 100 is made is shown. When the inorganic film is formed on the large-area substrate 100 by CVD, the substrate 100 may sag downward. In this case, the deposition mask under the substrate 100 may not bear the weight of the substrate 100, and as shown in FIG. 2B, deformation due to stress may be caused. And, due to this, the inorganic material is deposited in the undesired region, or the thickness of the inorganic film deposited through the transmission region is not constant.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing an organic light emitting display device in which an inorganic film is formed on a front surface without a deposition mask and an outer region of a substrate is exposed by using a laser.

According to an aspect of the present invention, there is provided a method of manufacturing an organic light emitting display device, including: preparing a substrate in which an active region and an outer region are defined; Forming an organic light emitting display panel in the active region; Forming a first organic layer on the organic light emitting display panel and forming a second organic layer on a portion of an outer region of the substrate; Forming an inorganic film on an entire surface of the substrate including the first and second organic films; And irradiating a laser to an outer region of the substrate to remove the second organic layer formed on the outer region and the inorganic layer formed on the second organic layer to expose the outer region of the substrate.

The first and second organic layers are formed using a mesh mask having a blocking pattern.

The thickness of the second organic film is thicker than the thickness of the first organic film.

The inorganic film is formed to expose a portion of the second organic film.

Preparing a substrate in which the active region and the outer region are defined includes forming a groove in the outer region to surround the active region.

The first and second organic layers use a mesh mask having a blocking pattern, and the blocking pattern corresponds to the groove.

The second organic layer formed in the outer region of the substrate is formed in the outer region except for the groove.

The inorganic film is formed to expose a portion of the second organic film.

When the laser is irradiated to the outer region of the substrate, the second organic layer corresponding to the outer region except for the groove and the inorganic layer formed on the second organic layer are removed.

As described above, the method of manufacturing the organic light emitting display device of the present invention has the following effects.

First, an organic layer is formed using a mesh mask, an inorganic layer is formed without an additional mask, and then an organic layer of an outer region of the substrate is removed using a laser, thereby forming an organic light emitting display panel formed in an active region of the substrate. An organic film and an inorganic film may be alternately stacked so as to cover the stacked protective film.

Second, since the inorganic layer may be formed without an additional mask, foreign substances deposited on the mask may be transferred onto the substrate to prevent deterioration of reliability of the organic light emitting display device. In addition, the process of aligning the deposition mask and the substrate is eliminated to reduce the Tact Time.

1A is a plan view of a plurality of organic light emitting display panels formed on a substrate.
1B is a cross-sectional view of II ′ of FIG. 1A.
2A is an outline photograph of a deposition mask for forming an inorganic film.
2B is a photograph in which a deposition mask for forming an inorganic film is modified.
3A to 3E are cross-sectional views illustrating a method of manufacturing the OLED display of the present invention.
4A is a plan view of a mesh mask.
4B is a cross-sectional view taken along the line II ′ of FIG. 4A.
5a and 5b is a photograph of removing the organic film using a laser.
6A is a cross-sectional view of different thicknesses of the first and second organic films.
6B is a cross-sectional view of an inorganic film formed on the first and second organic films of FIG. 6A.
7A is a cross-sectional view in which first and second organic films are formed on a grooved substrate.
7B is a cross-sectional view of an inorganic film formed on the first and second organic films of FIG. 7A.

When the protective film is formed to cover the organic light emitting display panel, an organic film is formed using a mesh mask, an inorganic film is formed without an additional mask, and then the organic film is selectively removed using a laser, The present invention relates to a method of manufacturing an organic light emitting display device in which an organic film and an inorganic film are alternately formed to form a protective film.

Hereinafter, a method of manufacturing an organic light emitting display device according to the present invention will be described in detail with reference to the accompanying drawings.

3A to 3E are cross-sectional views illustrating a method of manufacturing the OLED display according to the present invention. 4A is a plan view of a mesh mask, and FIG. 4B is a sectional view taken along line II ′ of FIG. 4A.

First, as shown in FIG. 3A, an organic light emitting display panel 210 is formed on an active region of a substrate 200 having an active region and an outer region. Although not illustrated, the organic light emitting display panel 210 includes an organic light emitting layer formed between the first and second electrodes and the first and second electrodes. At this time, the first electrode is connected to the transistor formed on the substrate 200.

Then, mesh masks are formed on the substrate 200 to form first and second organic layers 230a and 230b. The first organic layer 230a is formed on the organic light emitting display panel 210 formed in the active region, and the second organic layer 230b is formed on a portion of the outer area of the substrate 200 along the edge of the substrate 200. Is formed.

In this case, as shown in FIGS. 4A and 4B, the first and second organic layers 230a and 230b may be formed on the mesh layer 500a and the mesh layer 500a where the wires of the metal material are entangled in a mesh shape. It is formed by a screen printing method using a mesh mask having the formed blocking pattern 500b. The screen printing method can be configured at low vacuum, so it is relatively inexpensive compared to the flash vacuum deposition equipment.

Specifically, the mesh mask is aligned on the substrate 200 so that the substrate 200 and the blocking pattern 500b face each other, and then an organic material is coated on the mesh layer 500a. Then, the organic material is evenly printed on the mesh layer 500a using a squeegee.

The evenly printed organic material is discharged through the mesh layer 500a to be discharged onto the substrate 200 and the organic light emitting display panel 210 except for a region corresponding to the blocking pattern 500b under the mesh layer 500a. First and second organic films 230a and 230b are formed. When the organic material penetrates the mesh layer 500a, the organic material has a liquid phase as a monomer component, is applied to the substrate 200 through the mesh layer 500a, and then polymerized through a curing process. Polymerization) to form a reaction.

Subsequently, as shown in FIG. 3B, an inorganic layer pattern 220a is formed on the first and second organic layers 230a and 230b, and the inorganic layer pattern 220a is deposited on the entire surface without a mask. In detail, the inorganic layer pattern 220a may be formed by a sputtering method or a CVD method.

Subsequently, the above-described process may be repeated to form a protective film in which the first and second organic layers 230a and 230b and the inorganic layer pattern 220a are alternately stacked as shown in FIG. 3C. As shown in FIG. 3D, the second organic layer 230b is irradiated with a laser to separate the plurality of organic light emitting display panels 210 formed on the substrate 200. Although the drawings show that the laser is irradiated from the upper portion of the substrate 200, the laser may be irradiated from the lower portion of the substrate 200.

At this time, the laser is preferably a Nd: YAG laser (Neodymium-doped Yttrium Aluminum Garnet Laser), the laser preferably has a green wavelength. Further, the laser power is several hundred mJ to several J, and the spot size of the laser is preferably several mm to several tens of mm.

5A and 5B are photographs of removing an organic layer using a laser.

As shown in FIG. 5A, when a laser having a power of 520 mJ and a spot size of 14 mm are irradiated to a mask on which an organic material is deposited on an upper surface, the organic material deposited on a mask surface is removed as shown in FIG. 5B.

That is, when the laser is irradiated to the second organic layer 230b, as shown in FIG. 3E, the second organic layer 230b in the outer region of the organic light emitting display panel 210 absorbs the heat of the laser to form a substrate or an inorganic layer pattern ( The surface of the second organic layer 230b and the substrate 200 and between the second organic layer 230b and the inorganic layer pattern 220a is spaced apart due to the difference in the coefficient of thermal expansion with respect to 220a. In general, the thickness of the inorganic film is about 1/100 to 1/5 of the thickness of the organic film, and the thickness of the inorganic film is significantly thinner than that of the organic film. When the surface between the second organic film 230b and the inorganic film pattern 220a is spaced apart, The inorganic layer pattern 220a is separated from the outer region of the substrate 200.

Therefore, after irradiating the laser, if air blowing or vacuum suction is performed, the inorganic film pattern 220a on the second organic film 230b and the second organic film 230b can be easily removed. Can be. As a result, a protective film in which the first organic layer 230a and the inorganic layer 220 are alternately stacked may be formed to cover the organic light emitting display panel 210.

In the above-described method of manufacturing the organic light emitting display device, the first organic layer 230a is formed using a mesh mask, and the inorganic layer 220 is formed without an additional mask to form the first organic layer 230a and the first organic layer 230a. The inorganic film 220 may be alternately formed to form a protective film.

In addition, when irradiating a laser to the second organic film 230b in the outer region, the inorganic film 220 is simultaneously peeled to the entire surface, or to prevent cracking of the inorganic film 220. By forming different thicknesses of the organic layers 230a and 230b or forming grooves in the substrate 200, the inorganic layer 220 may not be continuously formed in the outer region.

6A is a cross-sectional view of the first and second organic films having different thicknesses, and FIG. 6B is a cross-sectional view of the inorganic film formed on the first and second organic films of FIG. 6A.

In detail, as illustrated in FIG. 6A, the thickness of the second organic layer 330b formed in the outer region of the substrate 300 is greater than the thickness of the first organic layer 330a formed in the active region of the substrate 300. This is to form an inorganic film formed on the first and second organic films 330a and 330b to be described later to expose a part of the upper surface of the second organic film 330b.

In this case, the thicknesses of the first and second organic layers 330a and 330b may be adjusted by adjusting the shape or thickness of the blocking pattern of the mesh mask or by changing the pressure by the squeegee during the printing process. Specifically, the mesh layer coated organic material is coated on the substrate 300 through the mesh layer. At this time, the squeegee is strengthened to correspond to the outer region of the substrate 300, and the active region of the substrate 300 is applied. In the case where the pressure is relatively low, a thicker second organic film 330b is formed in the outer region of the substrate 300, and a thinner than the second organic film 330b is formed in the active region of the substrate 300. One organic film 330a is formed.

Further, the inorganic film thickness is about 1/100 to 1/5 of the organic film thickness, and the inorganic film is significantly thinner than the organic film. Therefore, as shown in FIG. 6B, the inorganic layer 320 formed on the entire surface of the substrate 300 including the first and second organic layers 330a and 330b having the step may be formed of the first and second organic layers 330a and 330b. ) And the substrate 300 may not be uniformly formed.

Therefore, although not illustrated, when the above-described process is repeated, the second organic layers 330b formed in the outer region of the substrate 300 are connected to each other, and thus, when the second organic layer 330b is removed using a laser. The crack of the inorganic film 320 can be prevented, and the inorganic film 320 can be prevented from being peeled off to the entire surface at the same time.

FIG. 7A is a cross-sectional view in which first and second organic films are formed on a grooved substrate, and FIG. 7B is a cross-sectional view in which an inorganic film is formed on the first and second organic films of FIG. 7A.

As shown in FIG. 7A, a groove 400a is formed in an outer region of the substrate 400 to surround the active region of the substrate 400. The first organic layer 430a is formed on the organic light emitting display panel 410 by screen printing using a mesh mask as described above, and at the same time, the substrate 400 except for the groove 400a is formed. The outer second organic layer 430b is formed. At this time, the thicknesses of the first and second organic films 430a and 430b are preferably the same.

Subsequently, as illustrated in FIG. 7B, when the inorganic layer 420 is deposited on the first and second organic layers 430a and 430b without a mask, the inorganic layer 420 may be formed due to the groove 400a of the substrate 400. A portion of the side surface of the second organic layer 430b is exposed. Although not illustrated, when the above process is repeated, the second organic layers 430b in the outer region of the substrate 400 are connected to each other. Therefore, when the second organic film 430b is removed using a laser, the inorganic film 420 may be prevented from being cracked, and the inorganic film 420 may be prevented from peeling off to the entire surface at the same time.

In a typical method of manufacturing an organic light emitting display device, since an inorganic layer is formed using a deposition mask, foreign substances deposited on the mask may be transferred onto a substrate, thereby reducing the reliability of the organic light emitting display device, and aligning the deposition mask and the substrate. To increase the process time, the Tact Time increases. However, the method of manufacturing the organic light emitting display device of the present invention can form the inorganic layer without an additional mask, thereby preventing the above-mentioned problem.

While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. Will be apparent to those of ordinary skill in the art.

200, 300, and 400: substrates 210, 310, and 410: organic light emitting display elements
220, 320, 420: inorganic film 220a, 320a: inorganic film pattern
230a, 330a, 430a: first organic film 230b, 330b, 430b: second organic film
400a: groove 500a: mesh layer
500b: blocking pattern

Claims (9)

Preparing a substrate in which an active region and an outer region are defined;
Forming an organic light emitting display panel in the active region;
Forming a first organic layer on the organic light emitting display panel and forming a second organic layer on a portion of an outer region of the substrate;
Forming an inorganic film on an entire surface of the substrate including the first and second organic films; And
Irradiating a laser to the outer region of the substrate to remove the second organic layer formed on the outer region and the inorganic layer formed on the second organic layer to expose the outer region of the substrate. Method of manufacturing a light emitting display device. The method of claim 1,
The first and second organic layers may be formed using a mesh mask having a blocking pattern. The method of claim 1,
The thickness of the second organic layer is thicker than the thickness of the first organic layer. The method of claim 3, wherein
And wherein the inorganic layer is formed to expose a portion of the second organic layer. The method of claim 1,
And preparing a substrate in which the active area and the outer area are defined, forming a groove in the outer area to surround the active area. The method of claim 5, wherein
The first and second organic layers use a mesh mask having a blocking pattern, and the blocking pattern corresponds to the groove. The method of claim 5, wherein
The second organic layer formed on the outer region of the substrate is formed on the outer region except for the groove. The method of claim 5, wherein
And wherein the inorganic layer is formed to expose a portion of the second organic layer. The method of claim 5, wherein
And irradiating a laser to an outer region of the substrate to remove the second organic layer corresponding to the outer region except for the groove and the inorganic layer formed on the second organic layer.

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